TWI789987B - Cleaning mechanism, resin molding device, and manufacturing method of resin molded product - Google Patents

Abstract

The present invention provides a technique for extending the life of a brush. The cleaning mechanism 3 of the present invention includes a brush 31 capable of cleaning by moving in contact with the forming die 6 , and is configured to change the moving speed of the brush 31 according to the surface shape of the forming die 6 .

Description

Cleaning mechanism, resin molding device, and manufacturing method of resin molded product

The present invention relates to a cleaning mechanism, a resin molding device and a manufacturing method of a resin molding.

Patent Document 1 discloses a technique for preventing resin burrs from spreading due to the rotation of the brush by changing the rotation speed of the roller brush in a mold cleaning device. [Prior Art Documents] [Patent Documents]

[Patent Document 1] Japanese Patent Laid-Open No. 2002-313829

[Problem to be Solved by the Invention]

In the above-mentioned Patent Document 1, it is only disclosed that resin burrs are scattered by the rotation of the brush, and it is desired to increase the life of the brush, but there is no description about it. [Means to solve the problem]

In order to solve the above-mentioned problems, the cleaning mechanism of the present invention includes a brush capable of cleaning by moving in contact with the forming die, and is configured to be able to change the moving speed of the brush according to the surface shape of the forming die.

The resin molding device of the present invention includes: a molding die for resin molding an object to be molded; a cleaning mechanism including a brush capable of cleaning by moving in contact with the molding die; shape-related data; and a control section that controls the moving speed of the brush based on the data related to the surface shape acquired by the data acquisition section.

The method of manufacturing a resin molded article of the present invention includes: a resin molding step of resin molding the resin molded article using the molding die; and a cleaning step of cleaning the molding die. [Effect of the invention]

According to the present invention, a technique for extending the life of a brush can be provided.

<An embodiment of the present invention> Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or corresponding part in a figure, and the description is not repeated.

<The overall structure of the resin molding apparatus 100> As shown in FIG. 1, the resin molding apparatus 100 of this embodiment is a resin molding apparatus using the transfer molding method. This resin molding apparatus performs resin molding on, for example, a substrate to which electronic components such as a semiconductor chip are connected, and uses a cylindrical pellet-shaped thermosetting resin (hereinafter referred to as “resin pellet”) as a resin material. In this example, the substrate corresponds to a molding object before resin molding.

The "substrate" includes general substrates such as semiconductor substrates such as silicon wafers, printed wiring boards, metal substrates, resin substrates, glass substrates, and ceramic substrates, and lead frames. In addition, the substrate can also be a carrier for Fan Out Wafer Level Packaging (FOWLP) and Fan Out Panel Level Packaging (FOPLP). Furthermore, it may be a substrate on which wiring has already been applied, or may be a substrate without wiring.

Specifically, as shown in FIG. 1 , the resin molding apparatus 100 includes the following members as constituent elements: a supply module A for supplying a substrate W before resin sealing and a resin chip T; The molding module B, the transfer module C for transferring the sealed substrate P (resin molded product), and the control unit COM. In addition, the supply module A, the resin molding module B, and the transfer module C which are constituent elements are mutually detachable and replaceable with respect to other constituent elements, respectively. In addition, the number of resin molding die sets B may be increased to two or three, and each die set may be increased or decreased. In this example, the sealed substrate P corresponds to a molded object after resin molding, and also corresponds to a resin molded product.

In addition, the resin molding apparatus 100 includes: a transfer mechanism 1 (hereinafter referred to as "loader 1") that collectively transfers the substrate W and the resin small pieces T supplied from the supply module A to the resin molding module B; B The sealed substrate P subjected to resin molding is transferred to the transfer mechanism 2 of the transfer module C (hereinafter referred to as "unloader 2").

As shown in FIGS. 2 and 3 , the unloader 2 includes a substrate holding unit 21 that holds the sealed substrate P, and a cleaning mechanism 3 that will be described later. The substrate holding portion 21 includes an adsorption portion 211 for adsorbing the sealed substrate P, and claws 212 for gripping the sealed substrate P. As shown in FIG. Furthermore, the substrate holding part 21 may not include the adsorption part 211 but only include the claws 212 .

As shown in FIG. 1 , the supply module A of this embodiment includes a substrate supply mechanism 4 and a resin supply mechanism 5 .

The substrate supply mechanism 4 has a substrate delivery unit 41 and a substrate supply unit 42 . The substrate delivery unit 41 sends the substrate W to the substrate supply unit 42 . The substrate supply unit 42 receives the substrate W from the substrate delivery unit 41 , arranges the received substrate W in a predetermined direction, and delivers it to the loader 1 .

The resin supply mechanism 5 has a resin delivery unit 51 and a resin supply unit 52 . The resin sending part 51 sends out the resin small piece T to the resin supply part 52 . The resin supply unit 52 receives the resin small pieces T from the resin delivery unit 51 , arranges the received resin small pieces T in a predetermined direction, and delivers them to the loader 1 .

The resin molding die set B has a molding die 6 and a mold clamping mechanism (not shown). As shown in FIG. 4 , the molding die 6 has a lower die 61 that can be raised and lowered, an upper die 62 fixed to face above the lower die 61 , and a mold clamping mechanism for clamping the lower die 61 and the upper die 62 . The lower mold 61 is fixed to the upper surface of the movable platen 63 , and the upper mold 62 is fixed to the lower surface of the upper fixed plate 64 . The mold clamping mechanism closes or opens the upper mold 62 and the lower mold 61 by moving the movable platen 63 up and down.

In the lower die 61 , an upper surface 611 for arranging the substrate W conveyed by the loader 1 and a plurality of grooves 612 for supplying the resin chips T conveyed by the loader 1 are formed. In addition, as shown in FIG. 5 , a cavity 611 a and a resin passage 611 b are formed on the upper surface 611 of the lower mold 61 . A mold cavity 62 a is also formed in the upper mold 62 .

In addition, as shown in FIG. 4, a plunger 613 is provided on the side of the lower mold 61, and the plunger 613 is used to inject the resin chip T in the groove 612 into the resin passage 611b and the cavity 611a of the lower mold 61, and the upper mold. 62 in the cavity 62a. Furthermore, depending on the design of the resin molded product, the film cavity may be formed only in either the lower mold 61 or the upper mold 62 , or may be formed in both the upper mold 62 and the lower mold 61 .

The dimensions of the lower mold 61 in FIG. 5 include those whose length in the X-axis direction is 200 mm to 400 mm, and the length in the Y-axis direction is 100 mm to 350 mm. In addition, as the dimensions of the cavity 611a of the lower mold 61, the length L1 in the X-axis direction is approximately 50 mm to 100 mm, the length L2 in the Y-axis direction is approximately 200 mm to 350 mm, and the length (depth) in the Z-axis direction About 0.1 mm to 2.0 mm. The dimensions of the resin passage 611b formed in the lower mold 61 include a length L3 of approximately 1.0 mm to 3.5 mm in the X-axis direction and a length (depth) of 0.1 mm to 3.5 mm in the Z-axis direction. In addition, the size of the groove 612 has a diameter L4 of approximately 10 mm to 30 mm. In addition, the size of the upper mold 62 and the cavity 62a formed in the upper mold 62 is the same as the size of the lower mold, and also becomes such a size when the resin passage 611b is formed in the upper mold.

In addition, heating parts 65 such as heaters are respectively embedded in the upper mold 62 and the lower mold 61 (see FIG. 4 ). The upper mold 62 and the lower mold 61 are usually heated to about 180° C. by this heating unit.

As shown in FIG. 1 , the transfer module C has a substrate accommodating portion 7 for accommodating a sealed substrate P that has been resin-sealed by the resin molding module B. As shown in FIG.

The control unit COM is configured to control at least the cleaning mechanism 3 . The control unit COM includes a central processing unit (Central Process Unit, CPU), a random access memory (Random Access Memory, RAM), a read only memory (Read Only Memory, ROM), etc., and is configured to perform each configuration according to information processing. Component control. In addition, the control part COM may be comprised so that it may control the whole resin molding apparatus.

<Resin Molding Operation by Resin Molding Apparatus 100 > Hereinafter, the basic operation of resin molding by the resin molding apparatus 100 according to the present embodiment will be described.

As shown in FIG. 1 , the substrate delivery unit 41 delivers the substrate W in the magazine to the substrate supply unit 42 . The substrate supply unit 42 arranges the received substrates W in a predetermined direction, and delivers them to the loader 1 . In parallel with this, the resin delivery unit 51 sends out the resin small pieces T to the resin supply unit 52 . The resin supply part 52 delivers the required number (three in FIG. 1 ) of the received resin small pieces T to the loader 1 .

Next, the loader 1 simultaneously transfers the received two substrates W and the three resin chips T to the molding die 6 . The loader 1 supplies the substrate W to the upper surface 611 of the lower mold 61 , and supplies the resin chip T to the inside of the groove 612 formed in the lower mold 61 .

Thereafter, the upper mold 62 and the lower mold 61 are clamped using a mold clamping mechanism. Then, the resin chips T in each tank 612 are heated and melted to generate molten resin, and the molten resin is pressed by the plunger 613 . Thereby, the molten resin is injected into the cavity 611a and the cavity 62a through the resin passage 611b. Then, by heating the molten resin for a required time required for hardening, the molten resin is hardened to form a hardened resin. Thereby, the semiconductor wafer in the cavity 611a and the cavity 62a and the surrounding substrate are sealed in the cured resin (sealing resin) molded in accordance with the shapes of the cavity 611a and the cavity 62a.

Next, after the time required for curing has elapsed, the upper mold 62 and the lower mold 61 are opened, and the sealed substrate P that is a resin molded product is released from the mold. Thereafter, the sealed substrate P (resin molded product) that has been resin-sealed by the resin molding module B is accommodated in the substrate storage portion 7 of the transfer module C using the unloader 2 . At this time, before the unloader 2 transfers the sealed substrate P to the transfer module C, the mold 6 is cleaned by using the cleaning mechanism 3 provided in the unloader 2 as will be described later while holding the sealed substrate P. surface for cleaning.

<The structure of the cleaning mechanism 3> Hereinafter, the basic structure of the cleaning mechanism 3 which concerns on this embodiment is demonstrated.

As shown in FIG. 3 , the cleaning mechanism 3 has a brush 31 and a suction mechanism 32 .

The brush 31 cleans the upper surface of the forming die 6 by moving in contact with the forming die 6 . The brush 31 is operated, for example, using a motor. As an example of the brush 31, a rotary brush or a plate brush is mentioned. In the present embodiment, the brush 31 is configured to be rotated by a motor using a rotating brush. When using a plate-shaped brush, it can be set as the structure which linearly reciprocates in a longitudinal direction using the drive source, such as a motor.

The suction mechanism 32 suctions the resin dust adhering to the molding die 6 . The suction mechanism 32 sucks resin dust by being connected to a dust collector (not shown). By starting the operation of the dust collector (turning on the power), the suction of resin dust from the suction mechanism 32 is stopped, and by stopping the operation of the dust collector, the suction of resin dust from the suction mechanism 32 is stopped. The suction mechanism 32 is disposed at a position capable of suctioning resin dust scattered from the molding die by movement (rotation) of the brush.

The control unit COM is configured to control the cleaning mechanism 3 . In order to be able to change the moving speed of the brush 31, in this embodiment, the control part COM is provided with the electric power change part POW which can change the electric power supplied to the motor which rotates the brush 31. FIG. Therefore, the rotation speed of the brush 31 is changed by the power changing unit POW. In addition, as an example of the electric power change part POW, the trimmer for rotation control, or the potentiometer (volume) for rotation control is mentioned.

In addition, the control unit COM is configured to change the moving speed (rotational speed) of the brush 31 based on the surface shape data of the molding die 6 . The surface shape data of the forming die 6 are generated based on, for example, measurement data obtained by a displacement meter, data related to a drawing of the forming die 6 , and image data of the forming die 6 . Furthermore, the surface shape data can include, for example, the width or depth of the molding die 6, the cavity 611a, and the resin passage 611b.

In the case of generating the measurement data of the forming die 6 obtained by the displacement meter, for example, the displacement meter is installed in the cleaning mechanism 3, and the cleaning mechanism 3 moves on the forming die 6 before the cleaning operation. Thereby, the three-dimensional surface shape of the molding die 6 can be measured to obtain surface shape data. In addition, as an example of a displacement meter, a laser displacement meter is mentioned. In addition, the measurement of the surface shape can also be performed after the cleaning operation.

When generating data related to the drawing of the forming die 6 , for example, the three-dimensional surface shape data can be obtained from design drawing data such as a computer-aided design (CAD) drawing of the forming die 6 .

In the case of generating the image data of the forming mold 6, for example, a camera is installed in the cleaning mechanism 3, and before the cleaning operation, the cleaning mechanism 3 moves on the forming mold 6, so that by photographing the surface shape of the forming mold 6, it is possible to obtain Surface shape data. In addition, as an example of a camera, a stereo camera etc. are mentioned. In addition, it is also possible to obtain data on the three-dimensional shape of the molding die 6 by changing the shooting position with one camera. In addition, the imaging of the surface shape can also be carried out after the cleaning operation.

<Operation of the cleaning mechanism 3 > Below, the basic operation|movement of the cleaning mechanism 3 of this embodiment is demonstrated. The operations described here are controlled by the control unit COM.

The upper mold 62 and the lower mold 61 are opened, and the sealed substrate P which is a resin molded product is released from the mold. Thereafter, using the unloader 2 , as shown in FIG. 6 , the sealed substrate P sealed with resin is held.

Next, the brush 31 of the cleaning mechanism 3 is repeatedly rotated and moved in the Y-axis direction so as to be in contact with the molding die 6 , and the resin dust is sucked by the suction mechanism 32 . Thereby, the resin dust of the molding die 6 can be removed. Specifically, the resin dust removed by the brush 31 is sucked from the suction mechanism 32 by a dust collector (not shown), so that the resin dust can be efficiently removed.

At this time, the control part COM performs control so that the moving speed of the brush 31 may be changed based on the surface shape data of the forming die 6 . Specifically, the control unit COM changes the movement of the brush 31 between a portion where the cavity 611a and the resin passage 611b as shown in FIG. Speed (rotational speed) mode is controlled. By changing the moving speed of the brush 31 according to the surface shape of the molding die 6, the abrasion of the brush can be suppressed.

After the cleaning mechanism 3 cleans the molding die 6 , the unloader 2 transfers the sealed substrate P to the storage unit 7 of the transfer module C. Furthermore, before cleaning by the cleaning mechanism 3 , the sealed substrate P may be transported to the storage portion 7 of the transport module C by the unloader 2 .

It is preferable that the measurement operation or imaging operation of the molding die 6 for generating the surface shape data be performed at least before the first molding operation. If the surface shape data is generated before the first forming operation, the moving speed (rotational speed) of the brush 31 can be controlled from the first cleaning operation. Furthermore, the measurement operation or the imaging operation of the molding die 6 for generating the surface shape data may be performed after a certain number of times of molding or a certain period of time has elapsed if necessary.

<Other Embodiments> The idea of the above-mentioned embodiments is not limited to the embodiments described above. Hereinafter, an example of other embodiments to which the idea of the above-described embodiments can be applied will be described.

In the above-described embodiment, an example of cleaning the upper surface of the lower mold 61 has been described. However, it is also possible to arrange the cleaning mechanism 3 above the unloader 2 to clean the lower surface of the upper mold 62 in the same manner as in the above-mentioned embodiment. In addition, the cleaning mechanism 3 may be installed both above and below the unloader 2 to simultaneously clean both the upper mold 62 and the lower mold 61 .

In the above embodiment, the cleaning mechanism 3 is provided on the conveying mechanism (unloader 2 ), but the cleaning mechanism 3 may be provided on the conveying mechanism (loader 1 ) instead of the conveying mechanism (unloader 2 ). In addition, instead of providing the cleaning mechanism 3 on the conveyance mechanism (unloader 2 ), the cleaning mechanism 3 may be provided separately.

In the above-described embodiment, the displacement gauge or the camera is installed in the cleaning mechanism 3 , but it may be installed in the loader 1 or the unloader 2 . In addition, a conveying mechanism capable of conveying to a measurement position or an imaging position of the molding die 6 may be separately provided in the resin molding apparatus 100, and a displacement gauge or a camera may be attached to the conveying mechanism.

In the resin molding apparatus 100 of the above-mentioned embodiment, the conveying mechanism (loader 1) and the conveying mechanism (unloader 2) are separately provided, but the conveying mechanism may have the function of the conveying mechanism, and the conveying mechanism may perform The two actions of conveying and conveying.

In the above-mentioned embodiments, an example has been described in which the "data related to the display shape" is the display shape data itself. However, the "data related to the display shape" may not be the display shape data itself. For example, if the manufacturer of the molding die generates control data for controlling the moving speed of the brush (rotational brush rotation speed) based on the surface shape data, and provides the control data to the user, the control data Equivalent to "data related to display shape".

<Structure and effect of the embodiment> The cleaning mechanism of the above-mentioned embodiment includes a brush capable of cleaning by moving in contact with the forming die, and is configured such that the position of the brush can be changed according to the surface shape of the forming die. Moving speed. According to this cleaning mechanism, by changing the moving speed of the brush according to the surface shape of the molding die, the wear of the brush can be suppressed and the life of the brush can be extended.

In addition, as a specific configuration of the cleaning mechanism, a power changing unit that can change the power supplied to the motor that moves the brush is further included. According to this structure, the moving speed of a brush can be changed easily by changing the electric power supplied to the motor which is a drive source of a brush.

In addition, as a specific configuration of the cleaning mechanism, a control unit that controls the moving speed of the brush based on data related to the surface shape of the molding die is further included. According to this configuration, the moving speed of the brush can be changed based on the data on the surface shape of the molding die, thereby suppressing wear of the brush and prolonging the life of the brush.

In addition, as a specific configuration of the cleaning mechanism, the data related to the surface shape is generated based on at least one of measurement data obtained by a displacement meter, data related to the pattern of the forming mold, and image data. From this data, data related to the surface shape of the molding die can be easily obtained. Therefore, the moving speed of the brush can be easily changed based on the data related to the surface shape of the molding die.

In addition, as a specific configuration of the cleaning mechanism, the brush is a rotating brush, and the rotation speed of the rotating brush is changed in order to change the moving speed of the brush. According to this cleaning mechanism, by changing the rotational speed of the brush according to the surface shape of the molding die, the wear of the brush can be suppressed and the life of the brush can be extended.

The resin molding apparatus of the above embodiment includes a molding die for resin molding an object to be molded, and the cleaning mechanism. According to this resin molding device, by changing the moving speed of the brush of the cleaning mechanism according to the surface shape of the molding die, the wear of the brush can be suppressed and the life of the brush can be extended.

In addition, as a specific resin molding apparatus, the cleaning mechanism is provided in a conveyance mechanism for conveying the object to be molded. According to this configuration, the apparatus can be simplified by providing the cleaning mechanism on the same mechanism as the conveyance mechanism for conveying the object to be molded.

The resin molding device of the above embodiment includes: a molding die for resin molding an object to be molded; a cleaning mechanism including a brush capable of cleaning by moving in contact with the molding die; the data related to the surface shape; and a control part that controls the moving speed of the brush based on the data related to the surface shape acquired by the data acquisition part. According to this resin molding device, by changing the moving speed of the brush of the cleaning mechanism according to the surface shape of the molding die, the wear of the brush can be suppressed and the life of the brush can be extended.

The manufacturing method of the resin molded article of the embodiment includes: a resin molding step of resin molding the resin molded article using the molding die; and a cleaning step of cleaning the molding die. According to the manufacturing method of the resin molded article, by changing the moving speed of the brush of the cleaning mechanism according to the surface shape of the molding die, the wear of the brush can be suppressed and the life of the brush can be extended.

The embodiments of the present invention have been illustratively described above. That is, the detailed description and accompanying drawings are disclosed by way of illustration. Therefore, the detailed description and the constituent elements described in the accompanying drawings may contain unnecessary constituent elements in order to solve the problems. Therefore, although these optional constituent elements are described in the detailed description and the accompanying drawings, it should not be directly assumed that these optional constituent elements are essential.

In addition, the said embodiment is an illustration of this invention in every point. Various improvements and changes can be made to the above-mentioned embodiment within the scope of the present invention. That is, when implementing the present invention, a specific structure can be appropriately adopted according to the embodiment.

1: Transport mechanism (loader) 2: Transfer mechanism (unloader) 3: cleaning mechanism 4: Substrate supply mechanism 5: Resin supply mechanism 6: Forming die 7: Substrate storage unit (storage unit) 21: Substrate holding part 31: brush 32:Suction mechanism 41: Substrate sending part 42: Substrate supply department 51: Resin delivery unit 52:Resin supply department 61: Lower mold 62: upper mold 62a, 611a: cavity 63: Movable disk 64: Upper fixed plate 65: heating part 100: Resin molding device 211: adsorption part 212: Claw 611: upper surface 611b: Resin access 612: Slot 613: plunger A: supply module B: Resin molding module C: Transport module COM: Control Department L1, L2, L3: Length L4: Diameter P: Sealed substrate (molding object) POW: Power Change Department T: Resin small piece W: Substrate (molding object) X, Y, Z: axes

FIG. 1 is a plan view schematically showing the structure of a resin molding apparatus according to this embodiment. FIG. 2 is a plan view schematically showing the cleaning mechanism of this embodiment. FIG. 3 is a side view schematically showing the cleaning mechanism of this embodiment. FIG. 4 is a side view schematically showing a resin molded part of the present embodiment. FIG. 5 is a plan view schematically showing a molding die according to this embodiment. Fig. 6 is a side view showing the state of operation of the transport mechanism and the cleaning mechanism of the present embodiment.

2: Transport mechanism (unloader)

3: cleaning mechanism

21: Substrate holding part

31: brush

32:Suction mechanism

211: adsorption part

212: Claw

Claims (8)

A cleaning mechanism comprising a brush capable of cleaning by moving in contact with a forming die, and configured to be able to change the moving speed of the brush according to the surface shape of the forming die, wherein the brush is a rotating brush, by The moving speed is changed by changing the rotation speed of the rotating brush, and the moving speed of the concave-convex part is different from the moving speed of the flat part. The cleaning mechanism according to claim 1 further includes a power changing unit capable of changing power supplied to a motor that moves the brush. The cleaning mechanism according to claim 1 or claim 2 further includes a control unit that controls the moving speed of the brush based on data related to the surface shape of the forming die. The cleaning mechanism according to claim 3, wherein the data related to the surface shape is generated based on at least one of measurement data obtained by a displacement meter, data related to a pattern of the forming die, and image data . A resin molding device comprising: a molding die for resin molding an object to be molded; and The cleaning mechanism according to any one of claim 1 to claim 4. The resin molding apparatus according to claim 5, wherein the cleaning mechanism is provided in a conveyance mechanism for conveying the object to be molded. A resin molding device including: a molding die for resin molding an object to be formed; a cleaning mechanism including a brush capable of cleaning by moving in contact with the molding die; and a data acquisition unit for acquiring a surface shape related to the molding die related data; and a control unit, based on the data related to the surface shape acquired by the data acquisition unit, to control the moving speed of the brush, wherein the brush is a rotating brush, by changing the The rotation speed is changed to change the moving speed, and the moving speed of the concave-convex shape part is different from the moving speed of the flat shape part. A method of manufacturing a resin molded product, which is a method of manufacturing a resin molded product using the resin molding device according to any one of claim 6 or claim 7, and the method of manufacturing a resin molded product includes: a resin molding step performing resin molding on the resin molded article using the molding die; and a cleaning step of cleaning the molding die.

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