JP2022113928A - Cleaning mechanism, resin molding device, and method for manufacturing resin molded article - Google Patents

Abstract

To provide a technique for extending a service life of a brush.SOLUTION: This cleaning mechanism 3 of the invention is provided with a brush 31 which can clean a mold 6 by moving in contact with the mold, and is configured to be able to change a movement speed of the brush 31 according to a surface shape of the mold 6.SELECTED DRAWING: Figure 3

Description

The present invention relates to a cleaning mechanism, a resin molding apparatus, and a method of manufacturing a resin molded product.

Japanese Patent Laid-Open No. 2002-100001 discloses a technique for preventing resin burrs from scattering due to the rotation of a roll brush by changing the rotation speed of a roll brush in a mold cleaning device.

JP-A-2002-313829

The patent document 1 only discloses scattering resin burrs by rotating the brush, and does not mention anything about extending the service life of the brush.

In order to solve the above problems, the cleaning mechanism of the present invention includes a brush that can be cleaned by moving in contact with the mold, and the moving speed of the brush can be changed according to the surface shape of the mold. is configured to

A resin molding apparatus of the present invention obtains data about a surface shape of the molding die, a cleaning mechanism including a brush that can be cleaned by moving in contact with the molding die, and the molding die. A data acquisition unit and a control unit that controls the moving speed of the brush based on the data on the surface shape acquired by the data acquisition unit.

A method of manufacturing a resin molded product according to the present invention includes a resin molding step of resin-molding the resin molded product with the mold, and a cleaning step of cleaning the mold.

ADVANTAGE OF THE INVENTION According to this invention, the technique which lengthens the life of a brush can be provided.

1 is a plan view schematically showing the configuration of a resin molding apparatus of this embodiment; FIG. FIG. 2 is a plan view schematically showing the cleaning mechanism of this embodiment; FIG. 3 is a side view schematically showing the cleaning mechanism of this embodiment; FIG. 2 is a side view schematically showing the resin molded portion of the embodiment; It is a top view which shows the shaping|molding die of this embodiment typically. FIG. 4 is a side view showing how the conveying mechanism and the cleaning mechanism of the present embodiment operate;

<One embodiment of the present invention>
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

<Overall Configuration of Resin Molding Apparatus 100>
As shown in FIG. 1, a resin molding apparatus 100 of this embodiment is a resin molding apparatus using a transfer molding method. This resin molding apparatus molds, for example, a substrate to which an electronic element such as a semiconductor chip is connected. ) is used. In this example, the substrate corresponds to the object to be molded before resin molding.

The “substrate” includes general substrates such as semiconductor substrates such as silicon wafers, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, and lead frames. Further, the substrate may be a carrier used for FOWLP (Fan Out Wafer Level Packaging) and FOPLP (Fan Out Panel Level Packaging). Furthermore, it may be one with wiring already applied or one without wiring.

Specifically, as shown in FIG. 1, the resin molding apparatus 100 includes a supply module A that supplies substrates W and resin tablets T before resin sealing, a resin molding module B that corresponds to a resin molding unit and performs resin molding, A transport module C for transporting the sealed substrate P (resin molded product) and a control unit COM are provided as constituent elements. The supply module A, the resin molding module B, and the transfer module C, which are components, can be attached to and detached from other components and can be replaced. Further, each module can be increased or decreased, such as by increasing the number of resin-molded modules B to two or three. In this example, the sealed substrate P corresponds to a molded object after resin molding, and also corresponds to a resin molded product.

The resin molding apparatus 100 also includes a transport mechanism 1 (hereinafter referred to as a "loader 1") for collectively transporting the substrate W and the resin tablet T supplied from the supply module A to the resin molding module B, and the resin molding module. A transfer mechanism 2 (hereinafter referred to as “unloader 2”) for transferring the sealed substrate P resin-molded by B to the transfer module C is provided.

The unloader 2, as shown in FIGS. 2 and 3, includes a substrate holding section 21 for holding the sealed substrate P, and a cleaning mechanism 3 as described later. The substrate holding portion 21 includes an adsorption portion 211 that adsorbs the sealed substrate P and claws 212 that grip the sealed substrate P. As shown in FIG. Note that the substrate holding part 21 may be provided with only the claws 212 without the adsorption part 211 .

The supply module A of this embodiment includes a substrate supply mechanism 4 and a resin supply mechanism 5, as shown in FIG.

The substrate supply mechanism 4 has a substrate delivery section 41 and a substrate supply section 42 . The substrate delivery section 41 delivers the substrate W to the substrate supply section 42 . The substrate supply unit 42 receives the substrates W from the substrate delivery unit 41 , aligns the received substrates W in a predetermined direction, and delivers them to the loader 1 .

The resin supply mechanism 5 has a resin delivery section 51 and a resin supply section 52 . The resin delivery section 51 delivers the resin tablet T to the resin supply section 52 . The resin supply unit 52 receives the resin tablets T from the resin delivery unit 51 , aligns the received resin tablets T in a predetermined direction, and delivers them to the loader 1 .

The resin molding module B has a molding die 6 and a mold clamping mechanism (not shown). As shown in FIG. 4, the mold 6 includes a lower mold 61 that can be raised and lowered, an upper mold 62 that is fixed facing the upper part of the lower mold 61, and a clamping mechanism for clamping the lower mold 61 and the upper mold 62. and a mold clamping mechanism. The lower mold 61 is fixed to the upper surface of the movable platen 63 , and the upper mold 62 is fixed to the lower surface of the upper stationary platen 64 . The mold clamping mechanism clamps or opens the upper mold 62 and the lower mold 61 by vertically moving the movable platen 63 .

The lower die 61 is formed with an upper surface 611 on which the substrate W transported by the loader 1 is arranged, and a plurality of pots 612 into which the resin tablets T transported by the loader 1 are supplied. 5, a cavity 611a and a resin passage 611b are formed in the upper surface 611 of the lower mold 61. As shown in FIG. The upper die 62 also has a cavity 62a.

4, a plunger 613 for injecting the resin tablet T in the pot 612 into the resin passage 611b and the cavity 611a of the lower mold 61 and the cavity 62a of the upper mold 62. is provided. Depending on the design of the resin molded product, the cavity may be formed only in either the lower mold 61 or the upper mold 62, or may be formed in both the upper mold 62 and the lower mold 61. .

As for the dimensions of the lower die 61, in FIG. 5, the length in the X-axis direction is 200 to 400 mm, and the length in the Y-axis direction is 100 to 350 mm. The dimensions of the cavity 611a of the lower mold 61 are such that the length L1 in the X-axis direction is approximately 50 to 100 mm, the length L2 in the Y-axis direction is approximately 200 to 350 mm, and the length (depth) in the Z-axis direction is approximately 50 to 100 mm. is about 0.1 to 2.0 mm. As for the dimensions of the resin passage 611b formed in the lower mold 61, the length L3 in the X-axis direction is approximately 1.0 to 3.5 mm, and the length (depth) in the Z-axis direction is 0.1 mm to 3.5 mm. There is a thing of Also, the pot 612 has a diameter L4 of about 10 to 30 mm. The dimensions of the upper mold 62 and the cavity 62a formed in the upper mold 62 are the same as the dimensions of the lower mold, and the same dimensions apply when forming the resin passage 611b in the upper mold.

In addition, a heating unit 65 such as a heater is embedded in each of the upper mold 62 and the lower mold 61 (see FIG. 4). The upper mold 62 and the lower mold 61 are normally heated to about 180° C. by this heating unit.

As shown in FIG. 1, the transfer module C has a substrate accommodation section 7 that accommodates the sealed substrate P resin-sealed by the resin molding module B. As shown in FIG.

The control unit COM is configured to control at least the cleaning mechanism 3 . The control unit COM includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), etc., and is configured to control each component according to information processing. Note that the control unit COM may be configured to control the entire resin molding apparatus.

<Resin molding operation of resin molding apparatus 100>
The basic operation of resin molding of the resin molding apparatus 100 of this embodiment will be described below.

As shown in FIG. 1, the substrate delivery section 41 delivers the substrate W in the magazine to the substrate supply section 42 . The substrate supply unit 42 aligns the received substrates W in a predetermined direction and delivers them to the loader 1 . In parallel with this, the resin delivery section 51 delivers the resin tablet T to the resin supply section 52 . The resin supply unit 52 delivers the required number (three in FIG. 1) of the received resin tablets T to the loader 1 .

Next, the loader 1 simultaneously conveys the received two substrates W and three resin tablets T to the molding die 6 . The loader 1 supplies the substrate W to the upper surface 611 of the lower mold 61 and the resin tablet T to the inside of the pot 612 formed in the lower mold 61, respectively.

Thereafter, the mold clamping mechanism is used to clamp the upper mold 62 and the lower mold 61 together. Then, the resin tablet T in each pot 611 is heated and melted to generate molten resin, and the plunger 613 presses the molten resin. Thereby, the molten resin is injected into the cavities 611a and 62a through the resin passage 611b. Subsequently, the molten resin is cured to form a cured resin by heating the molten resin for the time required for curing. As a result, the semiconductor chips in the cavities 611a and 62a and the substrate around them are sealed in a cured resin (sealing resin) shaped to correspond to the shapes of the cavities 611a and 62a.

Next, after the time required for curing has passed, the upper mold 62 and the lower mold 61 are opened to release the sealed substrate P, which is a resin molded product. After that, using the unloader 2 , the sealed substrate P (resin molded product) resin-sealed by the resin molding module B is stored in the substrate storage section 7 of the transfer module C. At this time, before transporting the sealed substrate P to the transport module C, the unloader 2 cleans the surface of the mold 6 using the cleaning mechanism 3 provided in the unloader 2 while holding the sealed substrate P. be cleaned as described below.

<Configuration of Cleaning Mechanism 3>
The basic configuration of the cleaning mechanism 3 of this embodiment will be described below.

The cleaning mechanism 3 has a brush 31 and a suction mechanism 32, as shown in FIG.

The brush 31 cleans the upper surface of the mold 6 by moving in contact with the mold 6 . The brush 31 operates, for example, using a motor. Examples of the brush 31 include a rotating brush and a plate-like brush. In this embodiment, the brush 31 is configured to be rotated by a motor using a rotating brush. When a plate-like brush is used, it can be configured to linearly reciprocate in the longitudinal direction using a drive source such as a motor.

The suction mechanism 32 sucks resin dust adhering to the molding die 6 . The suction mechanism 32 sucks resin dust by connecting to a dust collector (not shown). By starting the operation of the dust collector (turning on the power), the resin dust is sucked from the suction mechanism 32, and by stopping the operation of the dust collector, the suction of the resin dust from the suction mechanism 32 is stopped. The suction mechanism 32 is arranged at a position where the movement (rotation) of the brush can suck the resin dust scattered from the molding die.

The control unit COM is configured to control the cleaning mechanism 3 . In order to change the moving speed of the brush 31, the control unit COM includes a power changer POW that can change the power supplied to the motor that rotates the brush 31 in this embodiment. Therefore, the rotation speed of the brush 31 is changed by the power changer POW. Note that examples of the power changing unit POW include a rotation control trimmer and a rotation control volume.

Further, the control unit COM is configured to change the moving speed (rotation speed) of the brush 31 based on the surface shape data of the mold 6 . The surface shape data of the mold 6 is generated based on, for example, data measured by a displacement meter, data related to drawings of the mold 6, and image data of the mold 6. FIG. The surface shape data includes, for example, the width and depth of the molding die 6, the cavity 611a and the resin passage 611b.

When generating measurement data of the mold 6 using a displacement meter, for example, the cleaning mechanism 3 is provided with a displacement meter, and the cleaning mechanism 3 moves over the mold 6 before the cleaning operation. Thereby, it is possible to measure the three-dimensional surface shape of the molding die 6 and acquire the surface shape data. An example of the displacement gauge is a laser displacement gauge. Also, the measurement of the surface shape may be performed after the cleaning operation.

When generating data related to the drawing of the mold 6, three-dimensional surface shape data can be obtained from design drawing data such as CAD drawings of the mold 6, for example.

When generating image data of the mold 6, for example, a camera is provided in the cleaning mechanism 3, and the surface shape of the mold 6 is captured by moving the cleaning mechanism 3 over the mold 6 before the cleaning operation. , surface topography data can be obtained. In addition, a stereo camera etc. are mentioned as an example of a camera. Further, it is also possible to obtain three-dimensional shape data of the molding die 6 by changing the imaging position with one camera. Also, the imaging of the surface shape may be performed after the cleaning operation.

<Operation of Cleaning Mechanism 3>
The basic operation of the cleaning mechanism 3 of this embodiment will be described below. The operation described here is controlled by the control unit COM.

The upper mold 62 and the lower mold 61 are opened to release the sealed substrate P, which is a resin molded product. After that, the unloader 2 is used to hold the resin-encapsulated substrate P, as shown in FIG.

Next, the brush 31 of the cleaning mechanism 3 is repeatedly rotated in the Y-axis direction so as to come into contact with the molding die 6, and the suction mechanism 32 sucks resin dust. As a result, resin dust on the mold 6 can be removed. Specifically, resin dust removed by the brush 31 is sucked from the suction mechanism 32 by a dust collector (not shown), so that the resin dust can be efficiently removed.

At this time, the control unit COM controls to change the moving speed of the brush 31 based on the surface shape data of the mold 6 . Specifically, the control unit COM controls a portion having unevenness such as the cavity 611a and the resin passage 611b as shown in FIG. and control to change the moving speed (rotation speed) of the brush 31 . By changing the movement speed of the brush 31 according to the surface shape of the molding die 6, wear of the brush can be suppressed.

After cleaning the mold 6 by the cleaning mechanism 3 , the unloader 2 transports the sealed substrate P to the storage section 7 of the transport module C. As shown in FIG. The sealed substrate P may be transported to the storage section 7 of the transport module C by the unloader 2 before being cleaned by the cleaning mechanism 3 .

It is preferable that the measuring or imaging operation on the mold 6 for generating the surface shape data is performed at least before the first molding operation. By generating the surface shape data before the first molding operation, the moving speed (rotational speed) of the brush 31 can be controlled from the first cleaning operation. Furthermore, the measurement operation or the imaging operation for the mold 6 for generating the surface shape data may be performed after a certain number of molding times or a certain period of time has passed, if necessary.

<Other embodiments>
The idea of the above embodiments is not limited to the embodiments described above. An example of another embodiment to which the idea of the above embodiment can be applied will be described below.

In the above embodiment, an example of cleaning the upper surface of the lower mold 61 has been described. However, the cleaning mechanism 3 may be provided above the unloader 2 to clean the lower surface of the upper mold 62 as in the above embodiment. Alternatively, the cleaning mechanism 3 may be provided both above and below the unloader 2 to clean both the upper mold 62 and the lower mold 62 at the same time.

In the above embodiment, the cleaning mechanism 3 is provided in the transport mechanism (unloader 2), but the cleaning mechanism 3 may be provided in the transport mechanism (loader 1) instead of in the transport mechanism (unloader 2). Alternatively, the cleaning mechanism 3 may be provided separately instead of being provided in the transport mechanism (unloader 2).

In the above embodiment, the displacement meter and the camera are provided in the cleaning mechanism 3, but they may be attached to the loader 1 or the unloader 2 as well. Alternatively, a transport mechanism capable of transporting the molding die 6 to the measuring position or the imaging position may be separately provided in the resin molding apparatus 100, and a displacement meter and a camera may be attached to this transport mechanism.

In the resin molding apparatus 100 of the above-described embodiment, the transport mechanism (loader 1) and the transport mechanism (unloader 2) are provided separately. It may be configured to perform both operations.

In the above embodiment, an example has been described in which the "data relating to display shape" is the display shape data itself. However, the 'data relating to the display shape' may not be the display shape data itself. For example, if the mold manufacturer generates control data for controlling the moving speed of the brush (the number of rotations of the rotating brush) based on the surface shape data, and provides the control data to the user. , the control data corresponds to "data relating to the display shape".

<Configuration of Embodiment and Its Effect>
The cleaning mechanism of the above embodiment includes a brush capable of cleaning by moving in contact with the molding die, and is configured to be able to change the moving speed of the brush according to the surface shape of the molding die. According to this cleaning mechanism, by changing the movement speed of the brush according to the surface shape of the molding die, the wear of the brush can be suppressed and the life of the brush can be extended.

Further, as a specific configuration of the cleaning mechanism, a power changing unit capable of changing the power supplied to the motor for moving the brush is further provided. With this configuration, it is possible to easily change the movement speed of the brush by changing the electric power supplied to the motor, which is the driving source of the brush.

Further, as a specific configuration of the cleaning mechanism, a control section for controlling the moving speed of the brush based on data regarding the surface shape of the mold is further provided. With this configuration, the moving speed of the brush can be changed based on the data on the surface shape of the molding die, the abrasion of the brush can be suppressed, and the life of the brush can be extended.

Further, as a specific configuration of the cleaning mechanism, the data regarding the surface shape is generated based on at least one of measurement data by a displacement meter, data regarding drawings of the mold, and image data. From this data, data regarding the surface shape of the mold can be easily obtained. Therefore, it is possible to easily change the moving speed of the brush based on the data regarding the surface shape of the mold.

Further, as a specific configuration of the cleaning mechanism, the brush is a rotating brush, and the number of revolutions of the rotating brush is changed to change the moving speed of the brush. With this cleaning mechanism, by changing the number of rotations of the brush according to the surface shape of the molding die, wear of the brush can be suppressed and the service life of the brush can be extended.

The resin molding apparatus of the above embodiment includes a molding die for resin-molding an object to be molded, and the cleaning mechanism. With this resin molding apparatus, by changing the moving speed of the brush of the cleaning mechanism according to the surface shape of the molding die, the wear of the brush can be suppressed and the life of the brush can be extended.

Further, as a specific resin molding apparatus, the cleaning mechanism is provided in a conveying mechanism for conveying the molding object. With this configuration, the apparatus can be simplified by providing the cleaning mechanism and the transport mechanism for transporting the molding object in the same mechanism.

The resin molding apparatus of the above-described embodiment includes a mold for resin-molding an object to be molded, a cleaning mechanism including a brush that can be cleaned by moving in contact with the mold, and acquires data about the surface shape of the mold. and a control unit configured to control the moving speed of the brush based on the data on the surface shape obtained by the data obtaining unit. With this resin molding apparatus, by changing the moving speed of the brush of the cleaning mechanism according to the surface shape of the molding die, the wear of the brush can be suppressed and the life of the brush can be extended.

The method of manufacturing a resin molded product according to the above embodiment includes a resin molding step of resin-molding the resin molded product with the mold, and a cleaning step of cleaning the mold. With this method for manufacturing a resin molded product, by changing the movement speed of the brush of the cleaning mechanism according to the surface shape of the molding die, wear of the brush can be suppressed and the life of the brush can be extended.

The embodiments of the present invention have been exemplified above. Accordingly, the detailed description and accompanying drawings have been disclosed for purposes of illustration. Therefore, the components described in the detailed description and the attached drawings may include components that are not essential for solving the problem. Therefore, the inclusion of such non-essential elements in the detailed description and accompanying drawings should not be taken as an outright admission that those non-essential elements are essential.

Moreover, the above embodiment is merely an example of the present invention in every respect. Various improvements and modifications can be made to the above embodiment within the scope of the present invention. That is, in carrying out the present invention, a specific configuration can be appropriately adopted according to the embodiment.

100... Resin molding device 1... Conveying mechanism (loader)
2... Conveying mechanism (unloader)
3... Cleaning mechanism 31... Brush 32... Suction mechanism 6... Mold A... Supply module B... Resin molding module C... Transfer module W... Substrate (molding object object)
P: Encapsulated substrate (object to be molded)

Claims (9)

Equipped with a brush that can be cleaned by moving in contact with the mold,
A cleaning mechanism configured to be able to change the moving speed of the brush according to the surface shape of the mold. 2. The cleaning device according to claim 1, further comprising a power changer capable of changing power supplied to a motor for moving said brush. 3. The cleaning mechanism according to claim 1, further comprising a controller that controls the movement speed of said brush based on data relating to the surface shape of said mold. 4. The cleaning mechanism according to claim 3, wherein the data on the surface shape is generated based on at least one of data measured by a displacement meter, data on a drawing of the mold, and image data. The cleaning mechanism according to any one of claims 1 to 4, wherein the brush is a rotating brush, and the speed of movement of the brush is changed by changing the number of revolutions of the rotating brush. a molding die for resin-molding an object to be molded;
A resin molding apparatus comprising the cleaning mechanism according to any one of claims 1 to 5. 7. The resin molding apparatus according to claim 6, wherein said cleaning mechanism is provided in a conveying mechanism for conveying a molding object. a molding die for resin-molding an object to be molded;
a cleaning mechanism including a brush capable of cleaning by moving in contact with the mold;
a data acquisition unit that acquires data on the surface shape of the mold;
A resin molding apparatus comprising: a control section that controls a moving speed of the brush based on the data regarding the surface shape acquired by the data acquisition section. A method for manufacturing a resin molded product with the resin molding apparatus according to any one of claims 7 and 8,
A resin molding step of resin-molding the resin molded product with the molding die;
and a cleaning step of cleaning the mold.

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