TWI783234B - 加熱部、溫度控制系統、處理裝置及半導體裝置之製造方法 - Google Patents

加熱部、溫度控制系統、處理裝置及半導體裝置之製造方法 Download PDF

Info

Publication number
TWI783234B
TWI783234B TW109119397A TW109119397A TWI783234B TW I783234 B TWI783234 B TW I783234B TW 109119397 A TW109119397 A TW 109119397A TW 109119397 A TW109119397 A TW 109119397A TW I783234 B TWI783234 B TW I783234B
Authority
TW
Taiwan
Prior art keywords
output
temperature
control
mentioned
circuit
Prior art date
Application number
TW109119397A
Other languages
English (en)
Chinese (zh)
Other versions
TW202105644A (zh
Inventor
小杉哲也
上野正昭
杉浦忍
杉下雅士
Original Assignee
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TW202105644A publication Critical patent/TW202105644A/zh
Application granted granted Critical
Publication of TWI783234B publication Critical patent/TWI783234B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Control Of Resistance Heating (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
TW109119397A 2019-06-12 2020-06-10 加熱部、溫度控制系統、處理裝置及半導體裝置之製造方法 TWI783234B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019109838 2019-06-12
JP2019-109838 2019-06-12
JP2020073076A JP7101718B2 (ja) 2019-06-12 2020-04-15 加熱部、温度制御システム、処理装置および半導体装置の製造方法
JP2020-073076 2020-04-15

Publications (2)

Publication Number Publication Date
TW202105644A TW202105644A (zh) 2021-02-01
TWI783234B true TWI783234B (zh) 2022-11-11

Family

ID=73838045

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109119397A TWI783234B (zh) 2019-06-12 2020-06-10 加熱部、溫度控制系統、處理裝置及半導體裝置之製造方法

Country Status (4)

Country Link
JP (1) JP7101718B2 (ko)
KR (1) KR102472671B1 (ko)
SG (1) SG10202005542RA (ko)
TW (1) TWI783234B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102584448B1 (ko) 2020-10-29 2023-10-04 주식회사 케이디파인켐 열안정성이 향상된 열전달 유체 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000339039A (ja) * 1999-05-25 2000-12-08 Tokyo Electron Ltd 加熱手段の温度制御方法、その装置及び熱処理装置
TW200718263A (en) * 2005-08-19 2007-05-01 Mrl Ind Inc Fault tolerant element and combination with fault tolerant circuit

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55159584A (en) * 1979-05-31 1980-12-11 Canon Kk Heater controller
JP2004288775A (ja) * 2003-03-20 2004-10-14 Hitachi Kokusai Electric Inc 半導体製造装置
KR100849012B1 (ko) * 2005-02-17 2008-07-30 도쿄엘렉트론가부시키가이샤 열처리 장치 및 열처리 방법
JP5098806B2 (ja) * 2008-05-21 2012-12-12 東京エレクトロン株式会社 電力使用系の断線予測装置及び熱処理装置
JP2013062361A (ja) * 2011-09-13 2013-04-04 Tokyo Electron Ltd 熱処理装置、温度制御システム、熱処理方法、温度制御方法及びその熱処理方法又はその温度制御方法を実行させるためのプログラムを記録した記録媒体
EP3361794B1 (en) 2016-01-25 2021-07-07 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Method and device for controlling detachment of mobile terminal
JP6611666B2 (ja) * 2016-05-16 2019-11-27 東京エレクトロン株式会社 載置台システム、基板処理装置及び温度制御方法
JP2018125439A (ja) * 2017-02-01 2018-08-09 株式会社国際電気セミコンダクターサービス 半導体装置の製造方法、基板冷却方法および基板処理装置
KR20180100826A (ko) 2017-03-02 2018-09-12 정상준 그래파이트 기반 발열체를 이용한 발열 시스템

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000339039A (ja) * 1999-05-25 2000-12-08 Tokyo Electron Ltd 加熱手段の温度制御方法、その装置及び熱処理装置
TW200718263A (en) * 2005-08-19 2007-05-01 Mrl Ind Inc Fault tolerant element and combination with fault tolerant circuit

Also Published As

Publication number Publication date
KR20200142462A (ko) 2020-12-22
TW202105644A (zh) 2021-02-01
JP2020205406A (ja) 2020-12-24
KR102472671B1 (ko) 2022-12-01
SG10202005542RA (en) 2021-01-28
JP7101718B2 (ja) 2022-07-15

Similar Documents

Publication Publication Date Title
JP6170847B2 (ja) 断熱構造体、加熱装置、基板処理装置および半導体装置の製造方法
JP6752851B2 (ja) クーリングユニット、基板処理装置、および半導体装置の製造方法
JP6306151B2 (ja) 基板処理装置、断熱構造体及び半導体装置の製造方法
US20230383411A1 (en) Substrate processing apparatus and non-transitory computer-readable recording medium
TWI669411B (zh) Substrate processing apparatus, cooling unit, heat insulating structure, and method of manufacturing semiconductor device
US11043402B2 (en) Cooling unit, heat insulating structure, and substrate processing apparatus
TWI783234B (zh) 加熱部、溫度控制系統、處理裝置及半導體裝置之製造方法
TW201351078A (zh) 熱處理設備及控制該設備之方法
JP2004119804A (ja) 半導体製造装置
US20200393197A1 (en) Heater, temperature control system, and processing apparatus
JP2008166321A (ja) 基板処理装置および半導体装置の製造方法
CN112466775A (zh) 基板处理装置、半导体器件的制造方法及记录介质
US20230257883A1 (en) Substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
US20230416919A1 (en) Substrate processing apparatus and temperature regulation method
KR20050088989A (ko) 열처리 장치 및 열처리 방법