SG10202005542RA - Heater, temperature control system, processing apparatus, and method of manufacturing semiconductor device - Google Patents

Heater, temperature control system, processing apparatus, and method of manufacturing semiconductor device

Info

Publication number
SG10202005542RA
SG10202005542RA SG10202005542RA SG10202005542RA SG10202005542RA SG 10202005542R A SG10202005542R A SG 10202005542RA SG 10202005542R A SG10202005542R A SG 10202005542RA SG 10202005542R A SG10202005542R A SG 10202005542RA SG 10202005542R A SG10202005542R A SG 10202005542RA
Authority
SG
Singapore
Prior art keywords
heater
semiconductor device
control system
processing apparatus
temperature control
Prior art date
Application number
SG10202005542RA
Other languages
English (en)
Inventor
Tetsuya Kosugi
Masaaki Ueno
Shinobu Sugiura
Masashi Sugishita
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Publication of SG10202005542RA publication Critical patent/SG10202005542RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Control Of Resistance Heating (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
SG10202005542RA 2019-06-12 2020-06-11 Heater, temperature control system, processing apparatus, and method of manufacturing semiconductor device SG10202005542RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019109838 2019-06-12
JP2020073076A JP7101718B2 (ja) 2019-06-12 2020-04-15 加熱部、温度制御システム、処理装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
SG10202005542RA true SG10202005542RA (en) 2021-01-28

Family

ID=73838045

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202005542RA SG10202005542RA (en) 2019-06-12 2020-06-11 Heater, temperature control system, processing apparatus, and method of manufacturing semiconductor device

Country Status (4)

Country Link
JP (1) JP7101718B2 (ko)
KR (1) KR102472671B1 (ko)
SG (1) SG10202005542RA (ko)
TW (1) TWI783234B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102584448B1 (ko) 2020-10-29 2023-10-04 주식회사 케이디파인켐 열안정성이 향상된 열전달 유체 조성물

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55159584A (en) * 1979-05-31 1980-12-11 Canon Kk Heater controller
JP2000339039A (ja) * 1999-05-25 2000-12-08 Tokyo Electron Ltd 加熱手段の温度制御方法、その装置及び熱処理装置
JP2004288775A (ja) * 2003-03-20 2004-10-14 Hitachi Kokusai Electric Inc 半導体製造装置
KR100849012B1 (ko) * 2005-02-17 2008-07-30 도쿄엘렉트론가부시키가이샤 열처리 장치 및 열처리 방법
US20070039938A1 (en) * 2005-08-19 2007-02-22 Peck Kevin B Fault tolerant element and combination with fault tolerant circuit
JP5098806B2 (ja) * 2008-05-21 2012-12-12 東京エレクトロン株式会社 電力使用系の断線予測装置及び熱処理装置
JP2013062361A (ja) * 2011-09-13 2013-04-04 Tokyo Electron Ltd 熱処理装置、温度制御システム、熱処理方法、温度制御方法及びその熱処理方法又はその温度制御方法を実行させるためのプログラムを記録した記録媒体
EP3361794B1 (en) 2016-01-25 2021-07-07 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Method and device for controlling detachment of mobile terminal
JP6611666B2 (ja) * 2016-05-16 2019-11-27 東京エレクトロン株式会社 載置台システム、基板処理装置及び温度制御方法
JP2018125439A (ja) * 2017-02-01 2018-08-09 株式会社国際電気セミコンダクターサービス 半導体装置の製造方法、基板冷却方法および基板処理装置
KR20180100826A (ko) 2017-03-02 2018-09-12 정상준 그래파이트 기반 발열체를 이용한 발열 시스템

Also Published As

Publication number Publication date
TWI783234B (zh) 2022-11-11
KR20200142462A (ko) 2020-12-22
TW202105644A (zh) 2021-02-01
JP2020205406A (ja) 2020-12-24
KR102472671B1 (ko) 2022-12-01
JP7101718B2 (ja) 2022-07-15

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