TWI783138B - Temperature adjustment device for stone surface board and detection device equipped with it - Google Patents

Temperature adjustment device for stone surface board and detection device equipped with it Download PDF

Info

Publication number
TWI783138B
TWI783138B TW108111451A TW108111451A TWI783138B TW I783138 B TWI783138 B TW I783138B TW 108111451 A TW108111451 A TW 108111451A TW 108111451 A TW108111451 A TW 108111451A TW I783138 B TWI783138 B TW I783138B
Authority
TW
Taiwan
Prior art keywords
temperature
panel
mentioned
stone surface
temperature adjustment
Prior art date
Application number
TW108111451A
Other languages
Chinese (zh)
Other versions
TW201945837A (en
Inventor
米澤良
Original Assignee
日商V科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商V科技股份有限公司 filed Critical 日商V科技股份有限公司
Publication of TW201945837A publication Critical patent/TW201945837A/en
Application granted granted Critical
Publication of TWI783138B publication Critical patent/TWI783138B/en

Links

Images

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Paper (AREA)

Abstract

具備:配置於設置地面上的下面調溫面板;及對下面調溫面板之溫度進行控制的溫度控制部;溫度控制部係以石材表面板之上面與下面調溫面板之表面側間之溫度差成為設定值的方式對下面調溫面板之溫度進行控制。Equipped with: the lower temperature-regulating panel arranged on the installation floor; and the temperature control part for controlling the temperature of the lower temperature-regulating panel; It becomes the set value to control the temperature of the temperature control panel below.

Description

石材表面板的溫度調整裝置及具備其之檢測裝置Temperature adjustment device for stone surface board and detection device equipped with it

本發明關於石材表面板之溫度調整裝置及具備其的檢測裝置。The present invention relates to a temperature adjustment device for stone surface panels and a detection device equipped with the same.

近年來,液晶顯示器(Liquid Crystal Display:LCD)面板、有機EL面板等之平板顯示器(Flat Panel Display:FPD)中,伴隨顯示器之大畫面化玻璃基板之大型化持續進展。大型之FPD之製造中,使用對該玻璃基板進行等倍曝光(equal exposure)的光罩。因此,光罩及在光罩形成電子電路的成為原版之母版,亦伴隨LCD面板或樣品玻璃(mother glass)之大型化而顯著大型化。In recent years, in flat panel displays (FPD) such as liquid crystal display (Liquid Crystal Display: LCD) panels and organic EL panels, the size of the glass substrate has continued to increase with the increase in the size of the display. In the manufacture of a large-scale FPD, a photomask that performs equal exposure on the glass substrate is used. Therefore, the size of the photomask and the original mother plate on which the electronic circuit is formed are also remarkably increased along with the size of the LCD panel or mother glass.

為了進行大型光罩中的圖案配置等之檢測,例如使用專利文獻1揭示的檢測裝置。該檢測裝置具備成為裝置之基礎的作為載台之石材表面板。於石材表面板之上設置有相對於行程方向可以往復移動的光罩支撐部。光罩被該光罩支撐部支撐而沿著行程方向移動。此時,光罩係以,光罩面平行於行程方向與上下方向的方式,在豎立之狀態下被支撐於光罩支撐部。亦即,光罩係以所謂縱置之狀態載置於石材表面板上。 [先前技術文獻] [專利文獻]In order to detect the pattern arrangement etc. in a large photomask, the detection apparatus disclosed by patent document 1 is used, for example. This detection device has a stone surface plate as a base as a base of the device. A photomask supporting part that can reciprocate relative to the stroke direction is arranged on the stone surface plate. A photomask is supported by this photomask support part, and moves along a stroke direction. At this time, the mask is supported by the mask support portion in an upright state so that the mask surface is parallel to the stroke direction and the vertical direction. That is, the photomask is placed on the stone surface plate in a so-called vertical state. [Prior Art Literature] [Patent Document]

[專利文獻1]特開2017-102074號公報[Patent Document 1] JP-A-2017-102074

[發明所欲解決之課題][Problem to be Solved by the Invention]

在這樣的檢測裝置中,保持石材表面板之平面精度為非常重要。如圖14所示,石材表面板200中,若在與行程方向S垂直之未圖示的水平軸之軸向發生彎曲之縱搖(pitching),伴隨著此會在光罩201產生光罩面上之彎曲。基於光罩201在光罩面上之彎曲,面板面上之圖案202亦引起位置偏移。因此,若於石材表面板200產生縱搖時,會有無法進行正確的檢測之問題。In such a detection device, it is very important to maintain the plane accuracy of the stone surface plate. As shown in FIG. 14 , in the stone surface plate 200 , if a pitching (pitching) of bending occurs in the axial direction of an unillustrated horizontal axis perpendicular to the stroke direction S, a photomask surface will be produced on the photomask 201 along with it. above the bend. Due to the bending of the mask 201 on the mask surface, the pattern 202 on the panel surface also causes a positional shift. Therefore, if the stone surface panel 200 is pitched, there will be a problem that accurate detection cannot be performed.

石材表面板之製造中,為了作出石材表面板之平面精度而進行研磨的溫度環境,未必和使用檢測裝置的溫度環境一致。亦即,檢測裝置之環境溫度依每一使用者環境而不同。例如以花崗岩(granite)製作厚度為400mm,長度為4.5m之石材表面板,石材表面板之上下面之溫度差(上面之溫度>下面之溫度)為0.1℃之情況下,產生接近0.2秒角度(1秒角度:1/3600度)的縱搖誤差。冬期進行研磨的石材表面板,在下面冷的環境下容易製作,若使用環境未將下面保持於低溫則無法再現平面精度。In the manufacture of stone surface panels, the temperature environment for grinding to obtain the plane accuracy of the stone surface panels may not be consistent with the temperature environment for using the testing device. That is, the ambient temperature of the detection device differs according to each user's environment. For example, a stone surface plate with a thickness of 400mm and a length of 4.5m is made of granite (granite). When the temperature difference between the upper and lower sides of the stone surface plate (the upper temperature > the lower temperature) is 0.1°C, an angle close to 0.2 seconds is generated. (1 second angle: 1/3600 degree) pitch error. Stone surface boards that are ground in winter are easy to make in the cold environment below. If the use environment does not keep the bottom at a low temperature, the plane accuracy cannot be reproduced.

通常,檢測裝置中,石材表面板之上面側暴露於熱處理室內,因此溫度調整進行得較多,石材表面板之下面側之溫度調整則照顧不到之情況為多數。石材表面板之下面大幅受到面對面的設置地面之溫度之影響。設置地面之溫度低於石材表面板之下面之溫度的情況下,從石材表面板之下面放出的紅外線被設置地面吸收,不會有和從石材表面板之下面放出的紅外線量相同之紅外線量返回,因此變冷。反之,設置地面之溫度高於石材表面板之下面之溫度的情況下,從石材表面板之下面放出的紅外線量以上的紅外線會返回至石材表面板之下面,因此,石材表面板之下面之溫度成為上升趨勢。Usually, in the inspection device, the upper side of the stone surface board is exposed to the heat treatment chamber, so the temperature adjustment is often carried out, and the temperature adjustment of the lower side of the stone surface board cannot be taken care of in most cases. The underside of the stone surface panel is greatly affected by the temperature of the facing installation floor. When the temperature of the installation ground is lower than the temperature of the underside of the stone surface board, the infrared rays emitted from the underside of the stone surface board are absorbed by the installation ground, and there will be no return of the same amount of infrared rays as the infrared rays emitted from the underside of the stone surface board , and thus become colder. Conversely, if the temperature of the ground is higher than the temperature under the stone surface plate, the infrared rays emitted from the underside of the stone surface plate will return to the bottom of the stone surface plate. Therefore, the temperature under the stone surface plate become an upward trend.

於此,可以考慮直接加熱或冷卻石材表面板之下面來進行溫度調節。該情況下,藉由直接的溫度調節,要求石材表面板側之快速的響應,因此,石材表面板之形狀穩定化變為困難。又,即使對石材表面板之下面直接進行加熱或冷卻,亦無法排除來自設置地面之熱的影響,因此,變為難以對石材表面板之形狀進行正確控制。Here, it can be considered to directly heat or cool the underside of the stone surface plate for temperature regulation. In this case, a quick response on the side of the stone surface plate is required by direct temperature regulation, and therefore, it becomes difficult to stabilize the shape of the stone surface plate. Also, even if the underside of the stone surface plate is directly heated or cooled, the influence of heat from the installation floor cannot be eliminated, so it becomes difficult to accurately control the shape of the stone surface plate.

因此,在具備石材表面板的檢測裝置中,要求能夠抑制因為設置地面之溫度環境引起的石材表面板之變形,而產生的光罩之圖案檢測之誤差。Therefore, in an inspection device equipped with a stone surface plate, it is required to be able to suppress errors in pattern detection of the mask caused by deformation of the stone surface plate due to the temperature environment of the installation floor.

本發明有鑑於上述課題,目的在於提供不受設置場所之影響,可以容易維持石材表面板之平面精度的石材表面板之溫度調整裝置,及具備其,且可以提升被檢測面板之檢測精度的檢測裝置。 [解決課題之手段]In view of the above problems, the present invention aims to provide a temperature adjustment device for a stone surface panel that can easily maintain the flatness of the stone surface panel without being affected by the installation location, and an inspection device that can improve the detection accuracy of the panel to be inspected. device. [Means to solve the problem]

為了解決上述課題,達成目的,本發明之態樣,係與設置地面之間隔著間隙而配置的石材表面板之溫度調整裝置,其特徵為具備:以與上述石材表面板之下面對置的方式配置於上述設置地面上的下面調溫面板;及對上述下面調溫面板之溫度進行控制的溫度控制部;上述下面調溫面板具備:配置於上述設置地面上的隔熱面板;及配置於上述隔熱面板之上,設置有溫度調整部藉由該溫度調整部進行熱供給或熱吸收的熱輻射面板;上述溫度控制部,係以上述石材表面板之上面與上述熱輻射面板之表面之間之溫度差成為設定值的方式對上述熱輻射面板之溫度進行控制。In order to solve the above-mentioned problems and achieve the purpose, an aspect of the present invention is a temperature adjustment device for a stone surface plate arranged with a gap between the installation ground, and it is characterized by having: The lower temperature-regulating panel arranged on the above-mentioned setting ground; and the temperature control part for controlling the temperature of the above-mentioned lower temperature-regulating panel; the above-mentioned lower temperature-regulating panel has: a heat insulation panel arranged on the above-mentioned setting ground; On the above-mentioned heat insulation panel, there is a heat radiation panel through which the temperature adjustment part performs heat supply or heat absorption; The temperature of the above-mentioned heat radiation panel is controlled in such a way that the temperature difference between them becomes a set value.

作為上述態樣較好是,上述下面調溫面板被配置於,將上述設置地面之供作為設置上述石材表面板的佔有區域沿著上述石材表面板之長邊方向分割為複數個區域之每一個分割區域。As the above-mentioned aspect, it is preferable that the temperature-regulating panel on the lower surface is arranged in each of the plurality of areas where the occupied area where the stone surface plate is installed on the above-mentioned installation floor is divided along the longitudinal direction of the stone surface plate. Divide the area.

作為上述態樣較好是,在上述下面調溫面板設置面板側溫度感測器,在與上述面板側溫度感測器對應的石材表面板之上面設置與該面板側溫度感測器成對的上面側溫度感測器,上述溫度控制部,係依據在上下方向對應而成對的上述面板側溫度感測器與上述上面側溫度感測器之溫度檢測值,對各自之上述下面調溫面板之上述溫度調整部之溫度進行控制。As the above-mentioned aspect, preferably, a panel-side temperature sensor is arranged on the above-mentioned lower temperature-regulating panel, and a pair of the panel-side temperature sensor is set on the stone surface plate corresponding to the above-mentioned panel-side temperature sensor. The temperature sensor on the upper side, and the temperature control unit are based on the temperature detection values of the temperature sensor on the panel side and the temperature sensor on the upper side corresponding to the pair in the vertical direction, and adjust the temperature of the respective lower panel The temperature of the above-mentioned temperature adjustment part is controlled.

作為上述態樣較好是,上述下面調溫面板與上述石材表面板之下面所挾持的間隙之周圍,係被隔室壁包圍。As the above-mentioned aspect, it is preferable that the periphery of the gap between the lower temperature-regulating panel and the lower surface of the stone surface plate is surrounded by a cell wall.

作為上述態樣較好是,上述隔熱面板由獨立發泡構造之樹脂片構成。As the said aspect, it is preferable that the said heat insulation panel consists of the resin sheet of an independent foam structure.

作為上述態樣較好是,上述熱輻射面板由金屬板構成。As the said aspect, it is preferable that the said heat radiation panel consists of a metal plate.

作為上述態樣較好是,上述溫度調整部為流通冷媒的管子。As the above aspect, preferably, the temperature adjustment unit is a pipe through which a refrigerant flows.

作為上述態樣較好是,上述管子具有相互並行的一對冷媒流路,設定成為在上述一對冷媒流路各自使冷媒相互朝逆向流動。As the aspect described above, it is preferable that the tube has a pair of refrigerant flow paths parallel to each other, and the refrigerant flow paths are set so that the refrigerant flows in opposite directions in each of the pair of refrigerant flow paths.

作為上述態樣較好是,具備:容器,用於對上述溫度調整管子供給調整成為比起被上述下面調溫面板溫熱的上述石材表面板之溫度低的基準溫度之冷媒;及熱交換器,藉由較上述基準溫度低的溫度之冷卻水,使通過上述溫度調整管子而返回之冷媒下降至該基準溫度而進行冷卻;將被上述熱交換器冷卻過的冷媒供給至上述容器。As the above-mentioned aspect, it is preferable to include: a container for supplying the refrigerant adjusted to a reference temperature lower than the temperature of the above-mentioned stone surface plate warmed by the above-mentioned lower temperature-regulating panel to the above-mentioned temperature-adjusting pipe; and a heat exchanger. , using cooling water at a temperature lower than the reference temperature to cool the refrigerant returned through the temperature adjustment pipe to the reference temperature; supply the refrigerant cooled by the heat exchanger to the container.

本發明之其他態樣,其特徵為:具備:與設置地面之間隔著間隙被配置,用於載置被檢測面板的石材表面板;對上述被檢測面板之面板面之狀態進行攝像的檢測攝影機;及上述石材表面板之溫度調整裝置;上述溫度調整裝置係具備:以與上述石材表面板之下面對置的方式,配置於上述設置地面上的下面調溫面板;及對上述下面調溫面板之溫度進行控制的溫度控制部;上述下面調溫面板係具備:配置於上述設置地面上的隔熱面板;及配置於上述隔熱面板之上,埋設有溫度調整部,藉由該溫度調整部進行熱供給及熱吸收的熱輻射面板;上述溫度控制部,係以上述石材表面板之上面與上述熱輻射面板之表面之間之溫度差成為設定值的方式對上述熱輻射面板之溫度進行控制。 [發明效果]Another aspect of the present invention is characterized in that it includes: a stone surface plate disposed with a gap between the installation ground and used for placing the panel to be inspected; and an inspection camera for taking pictures of the state of the panel surface of the panel to be inspected ; and the temperature adjustment device of the above-mentioned stone surface board; the above-mentioned temperature adjustment device is equipped with: a lower temperature-regulating panel arranged on the above-mentioned installation ground in a manner facing the lower surface of the above-mentioned stone surface board; A temperature control part for controlling the temperature of the panel; the above-mentioned lower temperature-adjusting panel is equipped with: a heat-insulating panel arranged on the above-mentioned installation floor; A heat radiation panel for heat supply and heat absorption; the temperature control unit controls the temperature of the heat radiation panel in such a way that the temperature difference between the upper surface of the stone surface plate and the surface of the heat radiation panel becomes a set value. control. [Invention effect]

依據本發明,可以實現不受設置場所之影響,可以抑制石材表面板之變形,特別是能夠容易維持平面精度的石材表面板之溫度調整裝置,以及具備其且可以提升被檢測面板之檢測精度的檢測裝置。According to the present invention, it is possible to realize the temperature adjustment device of the stone surface panel which can suppress the deformation of the stone surface panel without being affected by the installation place, and especially can easily maintain the plane accuracy, and which can improve the detection accuracy of the panel to be tested. detection device.

以下依據圖面說明本發明實施形態之石材表面板之溫度調整裝置及檢測裝置之詳細。但是,圖面為模式表示者,需留意的是各構件之尺寸、尺寸之比率、形狀、變形之程度等和現實者會有不同。又,圖面相互間彼此之各構件之數、尺寸之關係或比率或形狀亦包含不同之部分。The details of the temperature adjustment device and detection device of the stone surface panel of the embodiment of the present invention will be described below based on the drawings. However, the drawings are schematic representations, and it should be noted that the dimensions, ratios of dimensions, shapes, and degrees of deformation of each component may be different from those in reality. In addition, the relationship between the number and size of each member, or the ratio or shape of each member between the drawings also includes a portion that is different from each other.

「第1實施形態」 圖1表示具備本發明第1實施形態之石材表面板之溫度調整裝置的檢測裝置1。本實施形態之檢測裝置1,使用在圖1所示被檢測面板亦即光罩M之圖案配置之檢測。藉由該檢測裝置1,可以檢測出光罩M之光罩面上形成的光罩圖案之位置數據,藉由對該位置數據與設計數據進行比較,可以進行光罩M之光罩圖案之缺陷之檢測或光罩圖案之修正等。"First Embodiment" Fig. 1 shows a detection device 1 provided with a temperature adjustment device for stone surface panels according to a first embodiment of the present invention. The detection apparatus 1 of this embodiment is used for detection of the pattern arrangement of the mask M which is the panel to be inspected shown in FIG. 1 . The detection device 1 can detect the position data of the mask pattern formed on the mask surface of the mask M, and by comparing the position data with the design data, defects of the mask pattern of the mask M can be detected. Inspection or correction of mask pattern, etc.

[檢測裝置之概略構成] 如圖1所示,本實施形態之檢測裝置1配置於設置地面F之上。檢測裝置1具備:作為成為裝置之基礎的載台之石材表面板2;作為面板支撐部之光罩支撐部3;支持石材表面板2的複數(如圖3所示本實施形態中6個)之除振台4、5、6、7、8、9;攝像部10;及溫度調整裝置11。[Schematic configuration of detection device] As shown in FIG. 1, the detection apparatus 1 of this embodiment is arrange|positioned on the installation floor F. As shown in FIG. The detection device 1 is equipped with: a stone surface plate 2 as a stage that becomes the basis of the device; a mask support portion 3 as a panel support portion; a plurality of supporting stone surface plates 2 (six in the present embodiment as shown in FIG. 3 ) The vibration-removing platforms 4, 5, 6, 7, 8, 9; the camera unit 10; and the temperature adjustment device 11.

(石材表面板) 石材表面板2例如由花崗岩(granite)構成。如圖1及圖2所示,石材表面板2為大略長方體形狀,具有:上面21、下面22、兩側之側面23、24、及長邊方向兩端之側面25、26。石材表面板2之大小例如寬度為1200mm左右,長度為4500mm左右,厚度為400mm左右之大略長方體形狀。又,石材表面板2之大小可以依據處理的光罩M之大小適宜變更。(Stone Surface Panel) The stone surface board 2 is made of, for example, granite (granite). As shown in Fig. 1 and Fig. 2, the stone surface plate 2 has a roughly rectangular parallelepiped shape and has: an upper surface 21, a lower surface 22, side surfaces 23, 24 on both sides, and side surfaces 25, 26 at both ends in the longitudinal direction. The size of the stone surface plate 2 is, for example, a roughly cuboid shape with a width of about 1200 mm, a length of about 4500 mm, and a thickness of about 400 mm. Also, the size of the stone surface board 2 can be appropriately changed according to the size of the mask M to be processed.

如圖2所示,於石材表面板2之上面21,在上面21之寬度方向W之中央形成有沿著長邊方向延伸的導溝2A。在石材表面板2之下面22之四隅分別形成有凹部2B。又,在石材表面板2之下面之長邊方向中央之寬度方向W之兩側分別形成有凹部2C。As shown in FIG. 2 , on the upper surface 21 of the stone surface plate 2 , a guide groove 2A extending along the longitudinal direction is formed at the center of the upper surface 21 in the width direction W. Recesses 2B are respectively formed in the four corners of the lower surface 22 of the stone surface plate 2 . Further, recessed portions 2C are formed on both sides in the width direction W of the center in the longitudinal direction of the lower surface of the stone surface plate 2 .

上述6個除振台4、5、6、7、8、9係以和配置的石材表面板2之凹部2B、2C對應的方式設置於設置地面F上。石材表面板2,係以凹部2B、2C之底面(凹部內之空間之天井面)接觸對應的除振台4、5、6、7、8、9之各別之上面4A、5A、6A、7A、8A、9A之上的方式被配置。如圖1所示,藉由除振台4、5、6、7、8、9支持石材表面板2之狀態下,在石材表面板2之下面22與設置地面F之間形成具有規定之高度尺寸的間隙C。The above-mentioned six vibration-removing platforms 4, 5, 6, 7, 8, and 9 are installed on the installation floor F in a manner corresponding to the recesses 2B, 2C of the arranged stone surface panels 2. The stone surface board 2 is to contact the respective tops 4A, 5A, 6A, 5A, 6A, Modes above 7A, 8A, and 9A are configured. As shown in Fig. 1, in the state where the stone surface plate 2 is supported by the vibration-removing platforms 4, 5, 6, 7, 8, 9, a predetermined height is formed between the lower surface 22 of the stone surface plate 2 and the installation floor F. Dimension gap C.

(光罩支撐部) 如圖1所示,在石材表面板2之導溝2A,光罩支撐部3可以在石材表面板2之行程方向S(石材表面板2之長邊方向)自由移動地被設置。光罩支撐部3具備支撐光罩M之緣部的支撐框3A。(Reticle support part) As shown in FIG. 1 , in the guide groove 2A of the stone surface plate 2 , the photomask support portion 3 is freely movable in the travel direction S of the stone surface plate 2 (the long side direction of the stone surface plate 2 ). The mask support part 3 is equipped with the support frame 3A which supports the edge part of the mask M.

(除振台) 本實施形態中,與石材表面板2之凹部2B對應的除振台4、6、7、9為主動式除振台,與石材表面板2之凹部2C對應的除振台5、8為被動式除振台。又,本發明中,除振台之構成不限定於此。(devibration table) In this embodiment, the anti-vibration tables 4, 6, 7, and 9 corresponding to the concave portion 2B of the stone surface plate 2 are active anti-vibration tables, and the anti-vibration tables 5 and 8 corresponding to the concave portion 2C of the stone surface plate 2 are passive types. Devibration table. In addition, in the present invention, the configuration of the vibration-isolating table is not limited to this.

(攝像部) 如圖1所示,攝像部10具備上下導引支柱10A,及檢測攝影機10B。檢測攝影機10B設置成為可以沿著上下導引支柱10A在上下方向移動。上下導引支柱設置於石材表面板2之上面21。檢測攝影機10B設置成為藉由未圖示的控制裝置及驅動裝置上下移動。(camera department) As shown in FIG. 1 , the imaging unit 10 includes a vertical guide column 10A and a detection camera 10B. The inspection camera 10B is provided so as to be movable in the vertical direction along the vertical guide pillar 10A. The upper and lower guide pillars are arranged on the top 21 of the stone surface board 2 . The inspection camera 10B is installed so as to move up and down by a control device and a drive device not shown.

[溫度調整裝置之構成] 如圖4所示,溫度調整裝置11具備:第1上面側溫度感測器31,第2上面側溫度感測器32,第3上面側溫度感測器33,第4上面側溫度感測器34,第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15,第1面板側溫度感測器41,第2面板側溫度感測器42,第3面板側溫度感測器43,第4面板側溫度感測器44,水溫調整加熱器17、18、19、20,作為溫度調整部之溫度調整管子37,對下面調溫面板之溫度進行控制的溫度控制部16,及作為隔室壁之幕簾50(參照圖2)。[Construction of temperature adjustment device] As shown in FIG. 4 , the temperature adjustment device 11 includes: a first upper surface temperature sensor 31, a second upper surface temperature sensor 32, a third upper surface temperature sensor 33, and a fourth upper surface temperature sensor. 34. The first lower temperature control panel 12, the second lower temperature control panel 13, the third lower temperature control panel 14, the fourth lower temperature control panel 15, the first panel side temperature sensor 41, the second panel side temperature sensor Detector 42, 3rd panel side temperature sensor 43, 4th panel side temperature sensor 44, water temperature adjustment heaters 17, 18, 19, 20, temperature adjustment pipe 37 as the temperature adjustment part, adjusted to the bottom The temperature control part 16 for controlling the temperature of the temperature panel, and the curtain 50 as the compartment wall (refer to FIG. 2 ).

(上面側溫度感測器) 本實施形態中,如圖4所示,分別與石材表面板2之上面21在長邊方向被4分割的區域A1、A2、A3、A4對應地依序設置有第1上面側溫度感測器31、第2上面側溫度感測器32、第3上面側溫度感測器33、及第4上面側溫度感測器34。彼等第1上面側溫度感測器31、第2上面側溫度感測器32、第3上面側溫度感測器33、及第4上面側溫度感測器34,係連接於溫度控制部16,將各區域A1、A2、A3、A4之溫度檢測值輸出至溫度控制部16。(upper side temperature sensor) In this embodiment, as shown in FIG. 4 , the first upper surface side temperature sensors are sequentially provided corresponding to the areas A1, A2, A3, and A4 in which the upper surface 21 of the stone surface plate 2 is divided into four in the longitudinal direction. 31 . The second upper surface temperature sensor 32 , the third upper surface temperature sensor 33 , and the fourth upper surface temperature sensor 34 . Their first upper surface temperature sensor 31 , the second upper surface temperature sensor 32 , the third upper surface temperature sensor 33 , and the fourth upper surface temperature sensor 34 are connected to the temperature control unit 16 , and output the temperature detection values of the respective areas A1, A2, A3, A4 to the temperature control unit 16.

(下面調溫面板) 第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15依序在石材表面板2之4個區域A1、A2、A3、A4(參照圖4)在上下方向對應的方式配置於石材表面板2之下方之設置地面F上。(Temperature panel below) The temperature regulation panel 12 below the 1st, the temperature regulation panel 13 below the 2nd, the temperature regulation panel 14 below the 3rd, the temperature regulation panel 15 below the 4th in the 4 areas A1, A2, A3, A4 ( Referring to FIG. 4 ), it is arranged on the installation floor F below the stone surface plate 2 in a corresponding manner in the up and down directions.

如圖5所示,第1下面調溫面板12係將隔熱面板35與熱輻射面板36積層而構成。又,圖5僅示出第1下面調溫面板12,第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15亦為同樣之構成,由隔熱面板35與熱輻射面板36構成。As shown in FIG. 5 , the first lower temperature control panel 12 is formed by laminating a heat insulating panel 35 and a heat radiation panel 36 . Again, Fig. 5 only shows the first bottom temperature regulation panel 12, the second bottom temperature regulation panel 13, the third bottom temperature regulation panel 14, and the fourth bottom temperature regulation panel 15 are also of the same configuration. The heat radiation panel 36 constitutes.

隔熱面板35由隔熱性高的獨立發泡構造之樹脂片材構成。該隔熱面板35,如圖1所示以接觸設置地面F的方式配置。特別是,隔熱面板35為獨立發泡構造,因此,和連續發泡構造之隔熱材比較,熱遮斷效果變高。但是,本發明中亦可以適用可以抑制來自設置地面F側之熱之傳導的其他隔熱構件。The heat insulating panel 35 is formed of a resin sheet having a high heat insulating closed-cell foam structure. This heat insulation panel 35 is arrange|positioned so that it may contact the installation floor F as shown in FIG. In particular, since the heat insulating panel 35 has an independent foam structure, it has a higher heat shielding effect than a heat insulating material having a continuous foam structure. However, other heat insulating members capable of suppressing conduction of heat from the installation floor F side can also be applied to the present invention.

熱輻射面板36由熱傳導性高的金屬板構成。本實施形態中,熱輻射面板36由鋁板構成。如圖5所示,熱輻射面板36積層於隔熱面板35之上。於熱輻射面板36之表面埋設有作為溫度調整部之管子亦即溫度調整管子37。因此,熱輻射面板36係藉由溫度調整管子37進行熱供給或熱吸收進行溫度控制,將已控制的溫度之熱輻射輸出至石材表面板2之下面22。The heat radiation panel 36 is made of a metal plate with high thermal conductivity. In this embodiment, the heat radiation panel 36 is made of an aluminum plate. As shown in FIG. 5 , the heat radiation panel 36 is laminated on the heat insulation panel 35 . On the surface of the heat radiation panel 36, the temperature adjustment pipe 37 which is a pipe as a temperature adjustment part is buried. Therefore, the heat radiation panel 36 controls the temperature through the temperature adjustment pipe 37 for heat supply or heat absorption, and outputs the controlled temperature heat radiation to the lower surface 22 of the stone surface plate 2 .

(溫度調整部) 如圖2、圖3及圖5所示,溫度調整管子37係以一對冷媒流路37A、37B呈相互平行的方式一體的形成。又,本實施形態中,為了提升溫度調整管子37中的溫度均一性,因此設定成為在冷媒流路37A、37B內使同一溫度之水相互朝逆向流通。(temperature adjustment department) As shown in FIGS. 2 , 3 and 5 , the temperature adjustment pipe 37 is integrally formed so that a pair of refrigerant flow paths 37A, 37B are parallel to each other. Moreover, in this embodiment, in order to improve the temperature uniformity in the temperature adjustment pipe 37, it is set so that the water of the same temperature may flow in opposite directions in the refrigerant|coolant flow path 37A, 37B.

本實施形態中,溫度調整管子37例如由氟樹脂構成。藉由溫度調整管子23由氟樹脂構成,可以提高耐壓力性,可以提高防止漏水效果。如圖2及圖3所示,溫度調整管子37相對於第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15各自之熱輻射面板36以蛇行的方式被布局埋設。又,相對於熱輻射面板36的溫度調整管子37之配置密度成為均等為較好,再加入考量基於除振台4、5、6、7、8、9之配置狀態的熱傳導等引起的熱分布來決定配置密度亦可。In the present embodiment, the temperature adjustment tube 37 is made of, for example, a fluororesin. Since the temperature adjustment tube 23 is made of fluororesin, the pressure resistance can be improved, and the effect of preventing water leakage can be enhanced. As shown in FIG. 2 and FIG. 3 , the heat radiation of the temperature adjustment tube 37 relative to the first lower temperature regulation panel 12 , the second lower temperature regulation panel 13 , the third lower temperature regulation panel 14 , and the fourth lower temperature regulation panel 15 Panels 36 are laid out and buried in a serpentine manner. In addition, it is better to adjust the arrangement density of the tubes 37 to be equal to the temperature of the heat radiation panel 36, and to consider the heat distribution caused by heat conduction and the like based on the arrangement states of the vibration-isolating tables 4, 5, 6, 7, 8, and 9. It is also possible to determine the configuration density.

如圖4所示,在第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15分別被設置的溫度調整管子37,係依序被供給經由水溫調整加熱器17、18、19、20進行水溫調整的水。又,本實施形態中,1個溫度調整管子37具有冷媒流路37A、37B,因此設定成為從水溫調整加熱器17、18、19、20分別對2個冷媒流路37A、37B供給水溫調整的水。As shown in FIG. 4 , the temperature adjustment pipes 37 respectively arranged on the first lower temperature regulation panel 12 , the second lower temperature regulation panel 13 , the third lower temperature regulation panel 14 , and the fourth lower temperature regulation panel 15 are arranged sequentially. Water whose water temperature is adjusted via water temperature adjustment heaters 17 , 18 , 19 , and 20 is supplied. Also, in the present embodiment, one temperature adjustment pipe 37 has the refrigerant flow paths 37A, 37B, so it is set so that the water temperature is supplied from the water temperature adjustment heaters 17, 18, 19, 20 to the two refrigerant flow paths 37A, 37B, respectively. Adjusted water.

(面板側溫度感測器) 在第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15之各別之上面依序配置有第1面板側溫度感測器41、第2面板側溫度感測器42、第3面板側溫度感測器43、及第4面板側溫度感測器44。又,彼等第1面板側溫度感測器41、第2面板側溫度感測器42、第3面板側溫度感測器43、及第4面板側溫度感測器44依序相對於石材表面板2上之第1上面側溫度感測器31、第2上面側溫度感測器32、第3上面側溫度感測器33、及第4上面側溫度感測器34配置於上下方向對應的位置為較佳。(panel side temperature sensor) The first panel-side temperature sensor 41 is sequentially arranged on the upper surfaces of the first lower temperature-regulating panel 12, the second lower temperature-regulating panel 13, the third lower temperature-regulating panel 14, and the fourth lower temperature-regulating panel 15. , the second panel-side temperature sensor 42 , the third panel-side temperature sensor 43 , and the fourth panel-side temperature sensor 44 . Also, their 1st panel side temperature sensor 41, the 2nd panel side temperature sensor 42, the 3rd panel side temperature sensor 43, and the 4th panel side temperature sensor 44 are relative to the stone surface in sequence. The first upper surface temperature sensor 31 , the second upper surface temperature sensor 32 , the third upper surface temperature sensor 33 , and the fourth upper surface temperature sensor 34 on the panel 2 are arranged in corresponding vertical positions. The location is better.

彼等第1面板側溫度感測器41、第2面板側溫度感測器42、第3面板側溫度感測器43、及第4面板側溫度感測器44係連接於溫度控制部16。第1面板側溫度感測器41、第2面板側溫度感測器42、第3面板側溫度感測器43、及第4面板側溫度感測器44所檢測出的第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15之上面之溫度檢測值,係被輸出至溫度控制部16。The first panel-side temperature sensor 41 , the second panel-side temperature sensor 42 , the third panel-side temperature sensor 43 , and the fourth panel-side temperature sensor 44 are connected to the temperature control unit 16 . The first lower temperature control panel detected by the first panel-side temperature sensor 41 , the second panel-side temperature sensor 42 , the third panel-side temperature sensor 43 , and the fourth panel-side temperature sensor 44 12. The temperature detection values on the upper surfaces of the second lower temperature-regulating panel 13 , the third lower temperature-regulating panel 14 , and the fourth lower temperature-regulating panel 15 are output to the temperature control unit 16 .

(水溫調整加熱器) 如圖4所示,水溫調整加熱器17、18、19、20係進行,依據溫度控制部16之控制信號,將按基準溫度(T)供給的水升溫至規定之控制溫度(T+A)、(T+B)、(T+C)、(T+D)之作用・動作。又,於此,基準溫度(T)設定成為,在作動檢測裝置1之環境中,經常比石材表面板2之上面21之溫度低的一定之溫度。(water temperature adjustment heater) As shown in Figure 4, the water temperature adjustment heaters 17, 18, 19, 20 are carried out, and according to the control signal of the temperature control unit 16, the water supplied at the reference temperature (T) is heated to the specified control temperature (T+A ), (T+B), (T+C), (T+D) functions and actions. Also, here, the reference temperature (T) is set to a constant temperature that is always lower than the temperature of the upper surface 21 of the stone surface plate 2 in the environment of the motion detection device 1 .

(溫度控制部) 如圖4所示,溫度控制部16係連接於石材表面板2之上面21側的第1上面側溫度感測器31、第2上面側溫度感測器32、第3上面側溫度感測器33、及第4上面側溫度感測器34,以及下面調溫面板側的第1面板側溫度感測器41、第2面板側溫度感測器42、第3面板側溫度感測器43、及第4面板側溫度感測器44。溫度控制部16係連接於水溫調整加熱器17、18、19、20。(temperature control department) As shown in Figure 4, the temperature control unit 16 is connected to the first upper surface temperature sensor 31, the second upper surface temperature sensor 32, and the third upper surface temperature sensor on the upper surface 21 side of the stone surface plate 2. 33, and the 4th upper side temperature sensor 34, and the 1st panel side temperature sensor 41, the 2nd panel side temperature sensor 42, the 3rd panel side temperature sensor 43, And the fourth panel side temperature sensor 44. The temperature control unit 16 is connected to water temperature adjustment heaters 17 , 18 , 19 , and 20 .

溫度控制部16例如由具備個人電腦般的運算裝置或具有記憶部的裝置構成。溫度控制部16中,係以石材表面板2之上面側溫度與下面側溫度之差成為事先設定的溫度的方式,來決定相加於水溫調整加熱器17、18、19、20之基準溫度(T)的加熱狀況並對水溫調整加熱器17、18、19、20進行控制。又,上述上面側溫度與下面側溫度之差(上面側溫度-下面側溫度)例如可以設定成為0.2℃左右。又,上面側溫度與下面側溫度之差可以對應於各個石材表面板2之特性而決定。The temperature control unit 16 is constituted by, for example, a computing device such as a personal computer or a device having a memory unit. In the temperature control unit 16, the reference temperature to be added to the water temperature adjustment heaters 17, 18, 19, 20 is determined so that the difference between the upper side temperature and the lower side temperature of the stone surface plate 2 becomes a preset temperature. (T) and control the water temperature adjustment heaters 17,18,19,20. In addition, the difference between the temperature on the upper side and the temperature on the lower side (temperature on the upper side - temperature on the lower side) can be set to, for example, about 0.2°C. Also, the difference between the temperature on the upper side and the temperature on the lower side can be determined according to the characteristics of each stone surface board 2 .

藉由如此般對水溫調整加熱器17、18、19、20進行控制,可以使流過在第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15上分別被設置的溫度調整管子37內的水之溫度變化。因此,各下面調溫面板之熱輻射面板36可以個別進行溫度控制。By controlling the water temperature adjustment heaters 17, 18, 19, and 20 in this way, it is possible to flow through the first bottom temperature regulation panel 12, the second bottom temperature regulation panel 13, the third bottom temperature regulation panel 14, and the third bottom temperature regulation panel. 4. Changes in the temperature of the water in the temperature adjustment pipes 37 which are set respectively on the temperature adjustment panel 15 below. Therefore, the temperature of the heat radiation panels 36 of each lower temperature-regulating panel can be individually controlled.

(隔室壁) 如圖2所示,本實施形態中,沿著第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14各別之周圍配置有作為隔室壁之幕簾50。本實施形態中,作為幕簾50例如使用靜電防止之氯乙烯片等。又,幕簾50係為了堵塞石材表面板2與設置地面F之間之隙間之目的使用。又,幕簾50係用於劃分第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14各別之上方之空間(間隙C)。因此,藉由幕簾50可以防止下面調溫面板相互間之空氣之對流。因此,幕簾50發揮防止各下面調溫面板中的來自鄰接面板的溫度之影響之功能。(compartment wall) As shown in FIG. 2 , in this embodiment, curtains 50 as compartment walls are arranged along respective peripheries of the first lower temperature-regulating panel 12 , the second lower temperature-regulating panel 13 , and the third lower temperature-regulating panel 14 . . In this embodiment, as the curtain 50, for example, a static electricity preventing vinyl chloride sheet or the like is used. Moreover, the curtain 50 is used for the purpose of closing the gap between the stone surface board 2 and the installation floor F. As shown in FIG. Furthermore, the curtain 50 is used to divide the space (gap C) above each of the first lower temperature-regulating panel 12, the second lower temperature-regulating panel 13, and the third lower temperature-regulating panel 14. Therefore, the curtain 50 can prevent air convection between the lower temperature-regulating panels. Therefore, the curtain 50 functions to prevent the influence of the temperature from the adjacent panels in each of the lower temperature-regulating panels.

(作用及動作) 本實施形態之檢測裝置1及溫度調整裝置11中,藉由檢測出石材表面板2之上面21之各區域A1、A2、A3、A4之溫度,及與彼等區域A1、A2、A3、A4對應的石材表面板2之下方之各下面調溫面板之溫度,溫度控制部16進行水溫調整加熱器17、18、19、20之溫度控制。(function and action) In the detection device 1 and the temperature adjustment device 11 of this embodiment, by detecting the temperature of each area A1, A2, A3, A4 of the upper surface 21 of the stone surface plate 2, and the temperature of the areas A1, A2, A3, A4 The temperature of each lower temperature regulation panel below the corresponding stone surface board 2, the temperature control part 16 carries out the temperature control of the water temperature adjustment heaters 17, 18, 19, 20.

因此,本實施形態中,可以將石材表面板2之各區域A1、A2、A3、A4中的上面21側之溫度與下方側之溫度之溫度差維持於設定的溫度差,因此,可以抑制石材表面板2之變形。圖6-1模式表示石材表面板2之上下方向之溫度差因設置環境而變化,在複數個部位產生縱搖的狀態。本實施形態中,藉由進行上述溫度控制,如圖6-2所示,可以抑制石材表面板2之變形。因此,如圖7所示,可以防止載置於石材表面板2的光罩M之變形,可以事先防止光罩M之光罩圖案Mp產生變形引起的檢測失誤。Therefore, in this embodiment, the temperature difference between the temperature on the upper surface 21 side and the temperature on the lower side in each area A1, A2, A3, A4 of the stone surface plate 2 can be maintained at a set temperature difference, so that the stone material can be suppressed. Deformation of the surface panel 2. Fig. 6-1 schematically shows the state in which the temperature difference in the upper and lower directions of the stone surface panel 2 changes due to the installation environment, and pitches are generated at multiple locations. In this embodiment, by carrying out the above-mentioned temperature control, as shown in FIG. 6-2, deformation of the stone surface board 2 can be suppressed. Therefore, as shown in FIG. 7 , deformation of the mask M mounted on the stone surface plate 2 can be prevented, and detection errors caused by deformation of the mask pattern Mp of the mask M can be prevented in advance.

本實施形態之溫度調整裝置11,進行上述作用及動作,因此,不受限於設置場所,可以抑制石材表面板2之變形,特別是可以容易維持上面21之平面精度。因此,在具備該溫度調整裝置11的檢測裝置1中,可以提升光罩M之檢測精度。The temperature adjusting device 11 of this embodiment performs the above functions and operations, so it is not limited to the installation place, and can suppress the deformation of the stone surface panel 2, and in particular, can easily maintain the plane accuracy of the upper surface 21. Therefore, in the detection apparatus 1 provided with this temperature adjustment apparatus 11, the detection precision of the photomask M can be improved.

作為檢測裝置1之設置環境,有進行了溫度控制的熱處理室內,或僅使潔淨空氣向下流,而未進行石材表面板2之上面21之溫度管理的潔淨室內等。藉由本實施形態之檢測裝置1及溫度調整裝置11,即使在上述任一設置環境中,均可以抑制來自設置地面F側之溫度之影響。又,本實施形態中,即使在氣溫高的夏期或氣溫之低的冬期亦可以抑制石材表面板2之變形。The installation environment of the detection device 1 includes a temperature-controlled heat treatment room, or a clean room in which only clean air flows downward without temperature control of the upper surface 21 of the stone surface plate 2 . According to the detection device 1 and the temperature adjustment device 11 of this embodiment, even in any of the above-mentioned installation environments, the influence of the temperature from the installation floor F side can be suppressed. Moreover, in this embodiment, deformation|transformation of the stone surface board 2 can be suppressed also in the summer season with high temperature, or the winter season with low temperature.

本實施形態之檢測裝置1及溫度調整裝置11中,係僅以與石材表面板2之上面之溫度具有一定差之溫度作為目的值的方式,進行石材表面板2之下面22側之溫度控制,因此,整體的控制之流程係成為開放迴路之控制,控制系統之穩定性可以簡單確保。In the detection device 1 and the temperature adjustment device 11 of the present embodiment, the temperature control on the lower side 22 side of the stone surface plate 2 is carried out only with the temperature having a certain difference from the temperature on the top surface of the stone surface plate 2 as the target value. Therefore, the overall control process is an open-loop control, and the stability of the control system can be easily ensured.

本實施形態之檢測裝置1及溫度調整裝置11中,藉由針對分割石材表面板2成為4個區域A1、A2、A3、A4之各個區域分別對應的第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15進行溫度調節,可以對石材表面板2之複雜的彎曲進行補正。In the detection device 1 and the temperature adjustment device 11 of the present embodiment, the first lower temperature control panel 12 and the second lower surface respectively correspond to each of the four areas A1, A2, A3, and A4 for the divided stone surface plate 2. The temperature adjustment panel 13 , the third lower temperature adjustment panel 14 , and the fourth lower temperature adjustment panel 15 can adjust the temperature and correct the complicated curvature of the stone surface panel 2 .

本實施形態之檢測裝置1及溫度調整裝置11中,藉由來自第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15之熱輻射面板36之熱輻射進行石材表面板2之下面22之溫度控制,因此,對石材表面板2不會賦予直接加熱伴隨的應力。In the detection device 1 and the temperature adjustment device 11 of this embodiment, the heat from the first bottom temperature regulation panel 12, the second bottom temperature regulation panel 13, the third bottom temperature regulation panel 14, and the fourth bottom temperature regulation panel 15 The heat radiation of the radiation panel 36 controls the temperature of the lower surface 22 of the stone surface plate 2 , and therefore, the stress accompanying direct heating is not given to the stone surface plate 2 .

「第2實施形態」 圖8-1及圖8-2示意地示出本發明第2實施形態之檢測裝置1及溫度調整裝置11使用的石材表面板2及下面調溫面板。本實施形態中,將石材表面板2在長邊方向分割成為3個區域A1、A2、A3並設置第1上面側溫度感測器31、第2上面側溫度感測器32、第3上面側溫度感測器33。與其對應地,作為下面調溫面板而設置第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14。本實施形態中的其他構成和上述第1實施形態之構成內容大略同樣。"Second Embodiment" Figure 8-1 and Figure 8-2 schematically show the stone surface panel 2 and the lower temperature control panel used in the detection device 1 and the temperature adjustment device 11 of the second embodiment of the present invention. In this embodiment, the stone surface plate 2 is divided into three areas A1, A2, and A3 in the longitudinal direction, and a first upper surface temperature sensor 31, a second upper surface temperature sensor 32, and a third upper surface temperature sensor 31 are provided. Temperature sensor 33. Corresponding thereto, a first lower temperature regulation panel 12 , a second lower surface temperature regulation panel 13 , and a third lower surface temperature regulation panel 14 are provided as the lower surface temperature regulation panels. The other configurations of this embodiment are roughly the same as those of the above-mentioned first embodiment.

本實施形態中,亦可以抑制如圖8-1所示之石材表面板2之複數個變形,如圖8-2所示上面可以保持平坦的形狀。In this embodiment, multiple deformations of the stone surface plate 2 as shown in FIG. 8-1 can also be suppressed, and the upper surface can maintain a flat shape as shown in FIG. 8-2.

「第3實施形態」 圖9-1及圖9-2示意地示出本發明第3實施形態之檢測裝置1及溫度調整裝置11使用的石材表面板2及下面調溫面板。本實施形態中,將石材表面板2在長邊方向分割成為2個區域A1、A2並設置第1上面側溫度感測器31與第2上面側溫度感測器32。與其對應地作為下面調溫面板而設置第1下面調溫面板12及第2下面調溫面板13。本實施形態中的其他構成和上述第1實施形態之構成內容大略同樣。"Third Embodiment" 9-1 and 9-2 schematically show the stone surface panel 2 and the lower temperature control panel used in the detection device 1 and the temperature adjustment device 11 of the third embodiment of the present invention. In this embodiment, the stone surface panel 2 is divided into two regions A1 and A2 in the longitudinal direction, and a first upper surface temperature sensor 31 and a second upper surface temperature sensor 32 are provided. Corresponding thereto, a first bottom temperature regulation panel 12 and a second bottom temperature regulation panel 13 are provided as the bottom temperature regulation panel. The other configurations of this embodiment are roughly the same as those of the above-mentioned first embodiment.

本實施形態中,亦可以抑制圖9-1所示之石材表面板2之變形,如圖9-2所示上面可以保持平坦的形狀。In this embodiment, the deformation of the stone surface plate 2 shown in FIG. 9-1 can also be suppressed, and the upper surface can maintain a flat shape as shown in FIG. 9-2.

「第4實施形態」 圖10表示本發明第4實施形態之檢測裝置1及溫度調整裝置11使用的第1下面調溫面板12A。該實施形態中,係將上述第1實施形態之第1下面調溫面板12中的熱輻射面板36表背面反轉積層於隔熱面板35之構成。因此,溫度調整管子37位於隔熱面板35與熱輻射面板36之界面附近。本實施形態之其他構成和上述第1實施形態同樣。"Fourth Embodiment" Fig. 10 shows a first bottom temperature control panel 12A used in the detection device 1 and the temperature control device 11 according to the fourth embodiment of the present invention. In this embodiment, the front and back of the heat radiation panel 36 in the first lower temperature control panel 12 of the first embodiment described above are reversely laminated on the heat insulation panel 35 . Therefore, the temperature adjustment pipe 37 is located near the interface between the heat insulation panel 35 and the heat radiation panel 36 . Other configurations of this embodiment are the same as those of the above-mentioned first embodiment.

本實施形態中,藉由在熱輻射面板36之下側配置溫度調整管子37,當從溫度調整管子37傳導的熱被傳導至熱輻射面板36之上面時,在該上面可以進一步提升溫度之均勻性。In this embodiment, by disposing the temperature adjustment pipe 37 on the lower side of the heat radiation panel 36, when the heat conducted from the temperature adjustment pipe 37 is conducted to the upper surface of the heat radiation panel 36, the uniformity of temperature can be further improved on the upper surface. sex.

「第5實施形態」 圖11及圖12表示本發明第5實施形態之下面調溫面板60。如圖12所示,下面調溫面板60將隔熱面板35與熱輻射面板36積層而成的構成,係和上述第1實施形態同樣。本實施形態中,埋設於熱輻射面板36之表面的作為溫度調整部之溫度調整管子38為具有1個流路的管子。本實施形態之其他構成和上述第1實施形態同樣。"Fifth Embodiment" Fig. 11 and Fig. 12 show a lower temperature regulating panel 60 according to a fifth embodiment of the present invention. As shown in FIG. 12, the lower temperature control panel 60 has a structure in which a heat insulating panel 35 and a heat radiation panel 36 are laminated, which is the same as that of the above-mentioned first embodiment. In this embodiment, the temperature adjustment pipe 38 as a temperature adjustment part embedded in the surface of the heat radiation panel 36 is a pipe having one flow path. Other configurations of this embodiment are the same as those of the above-mentioned first embodiment.

「第6實施形態」 圖13表示本發明第6實施形態之溫度調整裝置11A之概略構成。又,本實施形態中,藉由從個別之溫度調整管子37返回之水使供給至水溫調整加熱器17、18、19、20之水下降至適當的溫度並貯存於容器71循環使用。又,本實施形態中,將第1面板側溫度感測器41、第2面板側溫度感測器42、第3面板側溫度感測器43、及第4面板側溫度感測器44配置於石材表面板2之下面。本實施形態之其他構成和上述第1實施形態之構成大略同樣,因此,適當使用與第1實施形態對應的圖面進行說明。"Sixth Embodiment" Fig. 13 shows a schematic configuration of a temperature adjustment device 11A according to a sixth embodiment of the present invention. In addition, in this embodiment, the water supplied to the water temperature adjustment heaters 17, 18, 19, 20 is lowered to an appropriate temperature by the water returned from the individual temperature adjustment pipes 37 and stored in the container 71 for recycling. Also, in this embodiment, the first panel-side temperature sensor 41, the second panel-side temperature sensor 42, the third panel-side temperature sensor 43, and the fourth panel-side temperature sensor 44 are arranged on the Below the stone surface board 2. The other configurations of this embodiment are roughly the same as those of the above-mentioned first embodiment, and therefore, the drawings corresponding to the first embodiment will be described as appropriate.

以下,使用圖1~圖4及圖13對本實施形態之溫度調整裝置11A進行說明。溫度調整裝置11A具備:第1上面側溫度感測器31、第2上面側溫度感測器32、第3上面側溫度感測器33、及第4上面側溫度感測器34、第1面板側溫度感測器41、第2面板側溫度感測器42、第3面板側溫度感測器43、及第4面板側溫度感測器44、水溫調整加熱器17、18、19、20、作為溫度調整部之溫度調整管子37、分別具備溫度調整管子37的第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14及第4下面調溫面板15,對個別之溫度調整管子37之溫度進行控制的溫度控制部16、容器71、熱交換器72、以及三方閥73。Hereinafter, 11 A of temperature adjustment apparatuses of this embodiment are demonstrated using FIGS. 1-4 and FIG. 13. FIG. The temperature adjustment device 11A includes: a first upper surface temperature sensor 31 , a second upper surface temperature sensor 32 , a third upper surface temperature sensor 33 , a fourth upper surface temperature sensor 34 , and a first panel. Side temperature sensor 41, second panel side temperature sensor 42, third panel side temperature sensor 43, and fourth panel side temperature sensor 44, water temperature adjustment heaters 17, 18, 19, 20 , the temperature adjustment pipe 37 as the temperature adjustment part, the first bottom temperature regulation panel 12, the second bottom temperature regulation panel 13, the third bottom temperature regulation panel 14 and the fourth bottom temperature regulation panel 15 respectively equipped with the temperature adjustment pipe 37, The temperature control part 16 which controls the temperature of the individual temperature adjustment pipe 37, the container 71, the heat exchanger 72, and the three-way valve 73.

溫度調整管子37係使一對冷媒流路37A、37B呈相互平行的方式一體形成(參照圖2及圖3)。溫度調整管子37中,設定成為在冷媒流路37A、37B內使同一溫度之水相互朝逆向流動。The temperature adjustment pipe 37 is integrally formed so that a pair of refrigerant flow paths 37A and 37B are parallel to each other (see FIGS. 2 and 3 ). The temperature adjustment pipe 37 is set so that water of the same temperature flows in opposite directions to each other in the refrigerant flow paths 37A and 37B.

如圖13所示,於個別之溫度調整管子37被供給有經由水溫調整加熱器17、18、19、20分別進行了水溫調整的水。又,本實施形態中,1個溫度調整管子37具有一對冷媒流路37A、37B,因此設定成為分別從水溫調整加熱器17、18、19、20對2個冷媒流路37A、37B供給進行了水溫調整的水。As shown in FIG. 13 , water whose water temperature has been adjusted through the water temperature adjustment heaters 17 , 18 , 19 , and 20 is supplied to the individual temperature adjustment pipes 37 . Also, in this embodiment, one temperature adjustment pipe 37 has a pair of refrigerant flow paths 37A, 37B, so it is set to supply the two refrigerant flow paths 37A, 37B from the water temperature adjustment heaters 17, 18, 19, 20, respectively. Water with water temperature adjustment.

具體而言,於水溫調整加熱器17之下流側連接有配管81。該配管81之下流端分歧為2個配管81A、81B。配管81A連接於設置於對應的第1下面調溫面板12的冷媒流路37A(參照圖2及圖3)。配管81B相對於冷媒流路37B,係以流路內之水之流動成為與冷媒流路37A內之水之流動逆向的方式被連接。Specifically, a pipe 81 is connected to the downstream side of the water temperature adjustment heater 17 . The downstream end of this pipe 81 is branched into two pipes 81A and 81B. The piping 81A is connected to the refrigerant flow path 37A provided on the corresponding first lower surface temperature regulation panel 12 (see FIGS. 2 and 3 ). The pipe 81B is connected to the refrigerant flow path 37B so that the flow of water in the flow path is reversed to the flow of water in the refrigerant flow path 37A.

於水溫調整加熱器18之下流側連接有配管82。該配管82之下流端分歧為2個配管82A、82B。配管82A連接於設置於對應的第2下面調溫面板13的冷媒流路37A(參照圖2及圖3)。配管82B,相對於冷媒流路37B,係以流路內之水之流動成為與冷媒流路37A內之水之流動逆向的方式被連接。A pipe 82 is connected to the downstream side of the water temperature adjustment heater 18 . The downstream end of the pipe 82 is branched into two pipes 82A and 82B. The piping 82A is connected to the refrigerant flow path 37A (see FIGS. 2 and 3 ) provided on the corresponding second lower surface temperature regulation panel 13 . The piping 82B is connected to the refrigerant flow path 37B so that the flow of water in the flow path is reversed to the flow of water in the refrigerant flow path 37A.

於水溫調整加熱器19之下流側連接有配管83。該配管83之下流端分歧為2個配管83A、83B。配管83A連接於設置於對應的第3下面調溫面板14的冷媒流路37A(參照圖2及圖3)。配管83B,相對於冷媒流路37B,係以流路內之水之流動成為與冷媒流路37A內之水之流動逆向的方式被連接。A pipe 83 is connected to the downstream side of the water temperature adjustment heater 19 . The downstream end of the pipe 83 is branched into two pipes 83A and 83B. The pipe 83A is connected to the refrigerant flow path 37A provided on the corresponding third lower surface temperature regulation panel 14 (see FIGS. 2 and 3 ). The pipe 83B is connected to the refrigerant flow path 37B so that the flow of water in the flow path is reversed to the flow of water in the refrigerant flow path 37A.

於水溫調整加熱器20之下流側連接有配管84。該配管84之下流端分歧為2個配管84A、84B。配管84A連接於設置於對應的第4下面調溫面板15的冷媒流路37A(參照圖2及圖3)。配管84B,相對於冷媒流路37B,係以流路內之水之流動成為與冷媒流路37A內之水之流動逆向的方式被連接。A pipe 84 is connected to the downstream side of the water temperature adjustment heater 20 . The downstream end of the pipe 84 is branched into two pipes 84A and 84B. The pipe 84A is connected to the refrigerant flow path 37A provided on the corresponding fourth bottom temperature regulation panel 15 (see FIGS. 2 and 3 ). The pipe 84B is connected to the refrigerant flow path 37B so that the flow of water in the flow path is reversed to the flow of water in the refrigerant flow path 37A.

圖3所示第1下面調溫面板12上設置的溫度調整管子37中的一對冷媒流路37A、37B之下流端,係如圖13所示,依序連接有配管85A、85B。彼等配管85A、85B之下流端連接於配管85且被合流。The downstream ends of the pair of refrigerant passages 37A, 37B in the temperature adjustment pipe 37 provided on the first lower temperature control panel 12 shown in FIG. 3 are sequentially connected to pipes 85A, 85B as shown in FIG. 13 . The downstream ends of these pipes 85A and 85B are connected to the pipe 85 and merged.

第2下面調溫面板13上設置的溫度調整管子37中的一對冷媒流路37A、37B之下流端,係如圖13所示,依序連接有配管86A、86B。彼等配管86A、86B之下流端連接於配管86且被合流。The downstream ends of the pair of refrigerant passages 37A, 37B in the temperature adjustment pipe 37 provided on the second lower temperature adjustment panel 13 are sequentially connected to pipes 86A, 86B as shown in FIG. 13 . The downstream ends of these pipes 86A, 86B are connected to the pipe 86 and merged.

第3下面調溫面板14上設置的溫度調整管子37中的一對冷媒流路37A、37B之下流端,係如圖13所示,依序連接於配管87A、87B。彼等配管87A、87B之下流端連接於配管87且被合流。The downstream ends of the pair of refrigerant passages 37A, 37B in the temperature adjustment pipe 37 provided on the third bottom temperature adjustment panel 14 are sequentially connected to pipes 87A, 87B as shown in FIG. 13 . The downstream ends of these pipes 87A, 87B are connected to the pipe 87 and merged.

第4下面調溫面板15上設置的溫度調整管子37中的一對冷媒流路37A、37B之下流端,係如圖13所示,依序連接於配管88A、88B。彼等配管88A、88B之下流端連接於配管89之上流端且被合流。配管89之下流端連接於熱交換器72。The downstream ends of the pair of refrigerant passages 37A, 37B in the temperature adjustment pipe 37 provided on the fourth bottom temperature adjustment panel 15 are sequentially connected to pipes 88A, 88B as shown in FIG. 13 . The downstream ends of these pipes 88A, 88B are connected to the upstream end of the pipe 89 and merged. The downstream end of the pipe 89 is connected to the heat exchanger 72 .

配管85、86、87、88連接於配管89且被合流。配管89連接於熱交換器72。從配管89被供給且通過熱交換器72進行了熱交換的水,係經由配管89A被供給至容器71。於配管89A設置有溫度感測器92。The pipes 85 , 86 , 87 , and 88 are connected to a pipe 89 and merged. The pipe 89 is connected to the heat exchanger 72 . The water supplied from the pipe 89 and heat-exchanged by the heat exchanger 72 is supplied to the container 71 via the pipe 89A. The temperature sensor 92 is installed in the piping 89A.

於容器71連接有循環水供給配管93。於循環水供給配管93設置有循環泵94及壓力計96。於容器71設置有容器位準計95。於循環水供給配管93之下流端連接有,與水溫調整加熱器17連接的配管97、與水溫調整加熱器18連接的配管98、與水溫調整加熱器19連接的配管99、及與水溫調整加熱器20連接的配管100。A circulating water supply pipe 93 is connected to the container 71 . The circulation pump 94 and the pressure gauge 96 are installed in the circulation water supply pipe 93 . A container level gauge 95 is provided in the container 71 . A pipe 97 connected to the water temperature adjustment heater 17, a pipe 98 connected to the water temperature adjustment heater 18, a pipe 99 connected to the water temperature adjustment heater 19, and a pipe 99 connected to the water temperature adjustment heater 19 are connected to the downstream end of the circulating water supply pipe 93. The piping 100 to which the water temperature adjustment heater 20 is connected.

如圖13所示,於熱交換器72連接有供給冷卻水的配管90。從配管90被供給且通過熱交換器72進行了熱交換的水,係經由配管90A被導引至冷卻水出口。於配管90配置有三方閥73。於三方閥73連接有與配管90A連接的旁通配管91。As shown in FIG. 13 , a pipe 90 for supplying cooling water is connected to the heat exchanger 72 . The water supplied from the piping 90 and heat-exchanged by the heat exchanger 72 is guided to the cooling water outlet via the piping 90A. The three-way valve 73 is disposed on the piping 90 . The bypass pipe 91 connected to the pipe 90A is connected to the three-way valve 73 .

本實施形態中,從配管90供給溫度低的(例如10℃前後之溫度之)水道水等之冷卻水,於熱交換器72內,進行使從配管89供給的循環水下降至基準溫度(T)的控制。In this embodiment, cooling water such as channel water with a low temperature (for example, a temperature around 10° C.) is supplied from the pipe 90, and the circulating water supplied from the pipe 89 is lowered to the reference temperature (T )control.

如圖13所示,溫度控制部16連接於石材表面板2之上面21側的第1上面側溫度感測器31、第2上面側溫度感測器32、第3上面側溫度感測器33、及第4上面側溫度感測器34、以及下面22側的第1面板側溫度感測器41、第2面板側溫度感測器42、第3面板側溫度感測器43、及第4面板側溫度感測器44。另外,溫度控制部16連接於水溫調整加熱器17、18、19、20、三方閥73、及溫度感測器92。As shown in Figure 13, the temperature control unit 16 is connected to the first upper surface temperature sensor 31, the second upper surface temperature sensor 32, and the third upper surface temperature sensor 33 on the upper surface 21 side of the stone surface plate 2. , and the 4th upper side temperature sensor 34, and the 1st panel side temperature sensor 41, the 2nd panel side temperature sensor 42, the 3rd panel side temperature sensor 43, and the 4th panel side temperature sensor 41 on the bottom 22 side. Panel side temperature sensor 44 . In addition, the temperature control unit 16 is connected to the water temperature adjustment heaters 17 , 18 , 19 , and 20 , the tripartite valve 73 , and the temperature sensor 92 .

溫度控制部16中,以使石材表面板2之上面側溫度與下面側溫度之差成為事先設定的溫度的方式,來決定與水溫調整加熱器17、18、19、20之基準溫度(T)相加的加熱程度而對水溫調整加熱器17、18、19、20進行控制。又,上述上面側溫度與下面側溫度之差(上面側溫度-下面側溫度)例如可以設定為0.2℃左右。又,上面側溫度與下面側溫度之差依據各個石材表面板2之特性決定即可。又,本實施形態中,將第1面板側溫度感測器41、第2面板側溫度感測器42、第3面板側溫度感測器43、及第4面板側溫度感測器44配置於石材表面板2之下面22,但如上述第1實施形態這樣,配置於第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15之表面亦可。簡單言之,於石材表面板2之各區域中可以設定上面21側與下面22側之溫度差即可。In the temperature control unit 16, the reference temperature (T ) are added to control the water temperature adjustment heaters 17, 18, 19, 20. In addition, the difference between the temperature on the upper side and the temperature on the lower side (temperature on the upper side - temperature on the lower side) can be set to, for example, about 0.2°C. Also, the difference between the upper side temperature and the lower side temperature may be determined according to the characteristics of each stone surface board 2 . Also, in this embodiment, the first panel-side temperature sensor 41, the second panel-side temperature sensor 42, the third panel-side temperature sensor 43, and the fourth panel-side temperature sensor 44 are arranged on the The lower surface 22 of the stone surface plate 2 is arranged on the first lower temperature regulation panel 12, the second lower temperature regulation panel 13, the third lower temperature regulation panel 14, and the fourth lower temperature regulation panel 15 as in the above-mentioned first embodiment. The surface can also be. In short, the temperature difference between the upper 21 side and the lower 22 side can be set in each area of the stone surface plate 2 .

藉由如此般對水溫調整加熱器17、18、19、20進行控制,可以使流通於分別設置於第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14、第4下面調溫面板15的溫度調整管子37內的水之溫度變化。因此,各下面調溫面板之熱輻射面板36個別被進行溫度控制。By controlling the water temperature adjustment heaters 17, 18, 19, and 20 in this way, it is possible to flow through the first lower temperature control panel 12, the second lower temperature control panel 13, and the third lower temperature control panel 14, respectively. , the temperature change of the water in the temperature adjustment pipe 37 of the temperature adjustment panel 15 below the 4th. Therefore, the temperature of the heat radiation panels 36 of each lower temperature-adjusting panel is individually controlled.

如圖13所示,水溫調整加熱器17、18、19、20,係進行依據來自溫度控制部16之控制信號,使按基準溫度(T)被供給的水升溫至規定之控制溫度(T+A)、(T+B)、(T+C)、(T+D)之作用・動作。又,於此,基準溫度(T)被設定為,在裝置運轉的環境中,經常比石材表面板2之上面21之溫度低的一定之溫度。本實施形態中,基準溫度(T)例如被設定為20℃。亦即,本實施形態中,貯存於容器71的水之基準溫度(T)被設定為20℃。As shown in Figure 13, the water temperature adjustment heaters 17, 18, 19, 20 are based on the control signal from the temperature control unit 16 to raise the temperature of the water supplied at the reference temperature (T) to the specified control temperature (T Function and action of +A), (T+B), (T+C), (T+D). Also, here, the reference temperature (T) is set to a constant temperature that is always lower than the temperature of the upper surface 21 of the stone surface plate 2 in the environment in which the device operates. In the present embodiment, the reference temperature (T) is set to, for example, 20°C. That is, in the present embodiment, the reference temperature (T) of the water stored in the container 71 is set to 20°C.

本實施形態中,於配管90例如被供給11℃之冷卻水。於熱交換器72經由配管89被供給加熱至比20℃高的溫度(T+A)、(T+B)、(T+C)、(T+D)等的水。又,具體而言,經由配管89供給至熱交換器72的水之溫度例如為23℃左右。In this embodiment, the cooling water of 11 degreeC is supplied to the piping 90, for example. Water heated to a temperature (T+A), (T+B), (T+C), (T+D) or the like higher than 20° C. is supplied to the heat exchanger 72 through a pipe 89 . Moreover, specifically, the temperature of the water supplied to the heat exchanger 72 via the pipe 89 is, for example, about 23°C.

溫度控制部16依據溫度感測器92之溫度檢測值對三方閥73進行控制,或使冷卻水流入旁通配管91,或使冷卻水流入熱交換器72,對冷卻水之流量進行控制。據此,於熱交換器72內,藉由水溫11℃之冷卻水,可以使從配管89供給的水由23℃下降至20℃,可以將貯存於容器71的水之溫度設為20℃。如此般,本實施形態中,不必要使水溫低的(11℃)冷卻水加溫至20℃,因此,不會消耗大的電力。The temperature control unit 16 controls the three-way valve 73 according to the temperature detection value of the temperature sensor 92, or makes the cooling water flow into the bypass pipe 91, or makes the cooling water flow into the heat exchanger 72, and controls the flow rate of the cooling water. Accordingly, in the heat exchanger 72, the water supplied from the pipe 89 can be lowered from 23°C to 20°C by cooling water with a water temperature of 11°C, and the temperature of the water stored in the container 71 can be set to 20°C. . In this way, in this embodiment, it is not necessary to heat the cooling water having a low water temperature (11° C.) to 20° C., so that large power consumption is not consumed.

又,第1上面溫度側感測器31及第1面板側溫度感測器41,第2上面側溫度感測器32及第2面板側溫度感測器42,第3上面側溫度感測器33及第3面板側溫度感測器43,第4上面側溫度感測器34及第4面板側溫度感測器44分別成為熱電偶的方式而構成亦可。Also, the first upper surface temperature sensor 31 and the first panel side temperature sensor 41, the second upper surface temperature sensor 32 and the second panel side temperature sensor 42, and the third upper surface temperature sensor 33, the third panel-side temperature sensor 43, the fourth upper surface-side temperature sensor 34, and the fourth panel-side temperature sensor 44 may be configured as thermocouples, respectively.

本實施形態中,例如不必要使11℃左右之水道水等之冷媒升溫至20℃以上之溫度,可以大幅抑制消費電力。亦即,本實施形態中,可以縮小基準溫度(T)至控制溫度(T+A)、(T+B)、(T+C)、(T+D)間之溫度差,因此,可以大幅抑制消費電力。又,本實施形態中,藉由將基準溫度(T)設定為較第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14及第4下面調溫面板15之最低控制溫度稍低,因此亦可以大幅抑制冷卻水之使用量。In this embodiment, for example, it is not necessary to raise the temperature of the refrigerant such as water supply water at about 11°C to a temperature of 20°C or higher, and power consumption can be significantly reduced. That is, in this embodiment, the temperature difference between the reference temperature (T) and the control temperatures (T+A), (T+B), (T+C), and (T+D) can be reduced, so that the Reduce power consumption. Also, in this embodiment, by setting the reference temperature (T) to be higher than that of the first bottom temperature regulation panel 12, the second bottom temperature regulation panel 13, the third bottom temperature regulation panel 14, and the fourth bottom temperature regulation panel 15 The minimum control temperature is slightly lower, so the usage of cooling water can be greatly reduced.

本實施形態中,使用水作為在水溫調整加熱器17、18、19、20、溫度調整管子37、熱交換器72、及容器71中循環的冷媒,但不限定於此。本實施形態中,使水循環於容器71之構成,因此,即使漏水的情況下,亦不會發生容器71之容量分以上之漏水。又,本實施形態中,具有可以由容器內之水量降低檢測出漏水之優點。相對於此,不使水循環於容器,而藉由水溫調整加熱器17、18、19、20直接加熱水道水等之冷卻水(一次冷卻水)之構成(比較例)之情況下,在第1下面調溫面板12、第2下面調溫面板13、第3下面調溫面板14及第4下面調溫面板15等難以配置漏水感測器。因此,該比較例中,漏水的情況下,漏水量有可能成為大量。因此,藉由本實施形態這樣循環於容器71之構成,可以大幅抑制漏水之產生。In the present embodiment, water is used as the refrigerant circulating through the water temperature adjustment heaters 17, 18, 19, 20, temperature adjustment pipe 37, heat exchanger 72, and container 71, but the present invention is not limited thereto. In this embodiment, since water is circulated in the container 71, even in the case of water leakage, the water leakage of the capacity of the container 71 does not occur. Also, in this embodiment, there is an advantage that water leakage can be detected from a decrease in the amount of water in the container. On the other hand, in the case of the configuration (comparative example) in which cooling water (primary cooling water) such as channel water is directly heated by the water temperature adjustment heaters 17, 18, 19, 20 without circulating water in the container, the It is difficult to install a water leakage sensor on the 1st bottom temperature control panel 12, the 2nd bottom temperature control panel 13, the 3rd bottom temperature control panel 14, and the 4th bottom temperature control panel 15, etc. Therefore, in the case of water leakage in this comparative example, the amount of water leakage may become large. Therefore, the occurrence of water leakage can be significantly suppressed by the configuration of circulating in the container 71 in this embodiment.

「其他實施形態」 以上,對第1~第6實施形態進行說明,但應理解構成彼等實施形態之揭示之一部分的論述及圖面並非用來限定本發明者。業者可以由該揭示進行各種的代替實施形態、實施例及運用技術。"Other implementation forms" The first to sixth embodiments have been described above, but it should be understood that the statements and drawings constituting a part of the disclosure of these embodiments are not intended to limit the present invention. A trader can perform various alternative embodiments, examples, and operating techniques based on this disclosure.

例如上述實施形態中,作為被檢測面板而適用光罩M,但亦可以適用成為形成有電子電路的光罩之原版的母版。For example, in the above-mentioned embodiment, the mask M is applied as the panel to be inspected, but it is also possible to apply a master plate which becomes an original plate of the mask on which the electronic circuit is formed.

上述實施形態中,將隔熱面板35與熱輻射面板36積層為一體化之構成,但在隔熱面板35之上積層重疊熱輻射面板36之構成亦可。又,隔熱面板35使用遍及配置有石材表面板2之佔有區域整體之大小及形狀者,於其上將複數個熱輻射面板36沿著長邊方向連續配置之構成當然亦可。In the above embodiment, the heat insulating panel 35 and the heat radiation panel 36 are integrally laminated, but the heat radiation panel 36 may be laminated on the heat insulating panel 35 . Also, the size and shape of the heat insulating panel 35 can cover the entire occupied area where the stone surface panel 2 is arranged, and a plurality of heat radiation panels 36 can be arranged continuously along the longitudinal direction on it, of course.

上述實施形態中,設為在石材表面板2上使光罩M朝行程方向S移動的構成,但將光罩M固定於石材表面板2上,使攝像部10側朝行程方向S移動的構成亦當然可以。In the above embodiment, the mask M is moved in the stroke direction S on the stone surface plate 2, but the mask M is fixed on the stone surface plate 2, and the imaging unit 10 side is moved in the stroke direction S. Of course you can.

上述實施形態之檢測裝置1中,設為使光罩M成為縱置狀態下進行檢測之構成,但將光罩M等之被檢測面板設為水平,亦即橫置狀態下進行檢測之構成亦可。In the detection device 1 of the above-mentioned embodiment, the configuration is configured to detect the photomask M in a vertical state, but it is also possible to make the detection panel such as the photomask M horizontal, that is, to perform detection in a horizontal state. Can.

A1、A2、A3、A4‧‧‧區域 C‧‧‧間隙 F‧‧‧設置地面 M‧‧‧光罩(被檢測面板) S‧‧‧行程方向 1‧‧‧檢測裝置 2‧‧‧石材表面板 2A‧‧‧導溝 2B‧‧‧凹部(主動式除振台用) 2C‧‧‧凹部(被動式除振台用) 4、5、6、7、8、9‧‧‧除振台 10B‧‧‧檢測攝影機 11、11A‧‧‧溫度調整裝置 12、12A‧‧‧第1下面調溫面板 13‧‧‧第2下面調溫面板 14‧‧‧第3下面調溫面板 15‧‧‧第4下面調溫面板 16‧‧‧溫度控制部 17、18、19、20‧‧‧水溫調整加熱器 21‧‧‧上面 22‧‧‧下面 23‧‧‧側面(石材表面板之寬度方向W之一端側之側面) 24‧‧‧側面(石材表面板之寬度方向W之另一端側之側面) 25‧‧‧側面(石材表面板之行程方向S之一端側之側面) 26‧‧‧側面(石材表面板之行程方向S之另一端側之側面) 31‧‧‧第1上面側溫度感測器 32‧‧‧第2上面側溫度感測器 33‧‧‧第3上面側溫度感測器 34‧‧‧第4上面側溫度感測器 35‧‧‧隔熱面板 36‧‧‧熱輻射面板 37、38‧‧‧溫度調整管子(溫度調整部) 37A、37B‧‧‧冷媒流路 41‧‧‧第1面板側溫度感測器 42‧‧‧第2面板側溫度感測器 43‧‧‧第3面板側溫度感測器 44‧‧‧第4面板側溫度感測器 50‧‧‧幕簾(隔室壁) 60‧‧‧下面調溫面板 71‧‧‧容器 72‧‧‧熱交換器 73‧‧‧三方閥A1, A2, A3, A4‧‧‧area C‧‧‧Gap F‧‧‧Set the ground M‧‧‧Reticle (Panel to be inspected) S‧‧‧travel direction 1‧‧‧Detection device 2‧‧‧Stone Surface Panel 2A‧‧‧guide 2B‧‧‧Concave (for active vibration isolation table) 2C‧‧‧Concave (for passive vibration isolation table) 4, 5, 6, 7, 8, 9‧‧‧Devibration table 10B‧‧‧Detection camera 11. 11A‧‧‧temperature adjustment device 12. 12A‧‧‧The first lower temperature control panel 13‧‧‧The second lower temperature control panel 14‧‧‧The third lower temperature control panel 15‧‧‧The fourth lower temperature control panel 16‧‧‧Temperature Control Department 17, 18, 19, 20‧‧‧Water temperature adjustment heater 21‧‧‧above 22‧‧‧below 23‧‧‧Side (the side of the end side of the width direction W of the stone surface plate) 24‧‧‧Side (the side of the other end side of the width direction W of the stone surface plate) 25‧‧‧Side (the side of the end side of the stroke direction S of the stone surface plate) 26‧‧‧Side (the side of the other end side of the stroke direction S of the stone surface plate) 31‧‧‧The first upper side temperature sensor 32‧‧‧The second upper side temperature sensor 33‧‧‧The third upper side temperature sensor 34‧‧‧4th upper side temperature sensor 35‧‧‧Heat insulation panel 36‧‧‧Heat radiation panel 37, 38‧‧‧Temperature adjustment pipe (temperature adjustment part) 37A, 37B‧‧‧refrigerant flow path 41‧‧‧The first panel side temperature sensor 42‧‧‧Temperature sensor on the second panel side 43‧‧‧The third panel side temperature sensor 44‧‧‧4th panel side temperature sensor 50‧‧‧curtain (compartment wall) 60‧‧‧The lower temperature control panel 71‧‧‧container 72‧‧‧Heat exchanger 73‧‧‧Three-way valve

[圖1]圖1表示本發明第1實施形態之檢測裝置之概略的剖面圖。 [圖2]圖2表示本發明第1實施形態之檢測裝置之重要部分分解斜視圖。 [圖3]圖3表示本發明第1實施形態之檢測裝置之除去石材表面板之狀態的平面說明圖。 [圖4]圖4表示本發明第1實施形態之檢測裝置及溫度調整裝置之概略構成圖。 [圖5]圖5表示本發明第1實施形態之溫度調整裝置使用的第1下面調溫面板之剖面圖。 [圖6-1]圖6-1表示本發明第1實施形態之檢測裝置中石材表面板產生基於溫度分布的變形之狀態之模式的說明圖。 [圖6-2]圖6-2表示本發明第1實施形態之檢測裝置中藉由溫度調整裝置進行溫度控制時之石材表面板之狀態的說明圖。 [圖7]圖7表示藉由本發明第1實施形態之檢測裝置進行石材表面板之溫度控制的狀態下之光罩之狀態的說明圖。 [圖8-1]圖8-1表示本發明第2實施形態之檢測裝置中石材表面板產生基於溫度分布的變形之狀態之模式的說明圖。 [圖8-2]圖8-2表示本發明第2實施形態之檢測裝置中藉由溫度調整裝置進行溫度控制時之石材表面板之狀態的說明圖。 [圖9-1]圖9-1表示本發明第3實施形態之檢測裝置中石材表面板產生基於溫度分布的變形之狀態之模式的說明圖。 [圖9-2]圖9-2表示本發明第3實施形態之檢測裝置中藉由溫度調整裝置進行溫度控制時之石材表面板之狀態的說明圖。 [圖10]圖10表示本發明第4實施形態之檢測裝置及溫度調整裝置使用的第1下面調溫面板之剖面圖。 [圖11]圖11表示本發明第5實施形態之檢測裝置及溫度調整裝置使用的下面調溫面板之平面說明圖。 [圖12]圖12為圖11之XII-XII剖面圖。 [圖13]圖13表示本發明第6實施形態之溫度調整裝置之概略構成圖。 [圖14]圖14表示石材表面板中在與行程方向垂直相交的水平軸之軸向產生彎曲縱搖而光罩之圖案變形之狀態的說明圖。[FIG. 1] FIG. 1 is a schematic cross-sectional view showing a detection device according to a first embodiment of the present invention. [ Fig. 2 ] Fig. 2 is an exploded perspective view showing important parts of the detection device according to the first embodiment of the present invention. [ Fig. 3 ] Fig. 3 is a plan explanatory view showing a state in which a stone surface plate is removed of the detection device according to the first embodiment of the present invention. [ Fig. 4] Fig. 4 shows a schematic configuration diagram of a detection device and a temperature adjustment device according to a first embodiment of the present invention. [ Fig. 5] Fig. 5 is a cross-sectional view showing a first bottom temperature control panel used in the temperature control device according to the first embodiment of the present invention. [FIG. 6-1] FIG. 6-1 is an explanatory diagram showing a model of a state where deformation of a stone surface plate due to temperature distribution occurs in the detection device according to the first embodiment of the present invention. [Fig. 6-2] Fig. 6-2 is an explanatory view showing the state of the stone surface plate when the temperature is controlled by the temperature adjusting device in the detecting device according to the first embodiment of the present invention. [ Fig. 7] Fig. 7 is an explanatory diagram showing a state of a photomask in a state where the temperature of a stone surface plate is controlled by the detection device according to the first embodiment of the present invention. [FIG. 8-1] FIG. 8-1 is an explanatory diagram showing a model of a state where deformation of a stone surface plate due to temperature distribution occurs in a detection device according to a second embodiment of the present invention. [Fig. 8-2] Fig. 8-2 is an explanatory view showing the state of the stone surface plate when the temperature is controlled by the temperature adjusting device in the detection device according to the second embodiment of the present invention. [FIG. 9-1] FIG. 9-1 is an explanatory diagram showing a model of a state in which deformation of a stone surface plate due to temperature distribution occurs in a detection device according to a third embodiment of the present invention. [Fig. 9-2] Fig. 9-2 is an explanatory view showing the state of the stone surface plate when the temperature is controlled by the temperature adjusting device in the detection device according to the third embodiment of the present invention. [FIG. 10] FIG. 10 is a cross-sectional view showing the first lower temperature control panel used in the detection device and the temperature control device according to the fourth embodiment of the present invention. [ Fig. 11 ] Fig. 11 is an explanatory plan view showing a lower temperature control panel used in a detection device and a temperature control device according to a fifth embodiment of the present invention. [FIG. 12] FIG. 12 is a sectional view taken along line XII-XII of FIG. 11. [FIG. 13] FIG. 13 shows a schematic configuration diagram of a temperature adjustment device according to a sixth embodiment of the present invention. [ Fig. 14] Fig. 14 is an explanatory view showing a state in which the pattern of the mask is deformed by bending and pitching in the axial direction of the horizontal axis perpendicular to the stroke direction in the stone surface plate.

A1、A2、A3、A4‧‧‧區域 A1, A2, A3, A4‧‧‧area

C‧‧‧間隙 C‧‧‧Gap

2‧‧‧石材表面板 2‧‧‧Stone Surface Panel

11‧‧‧溫度調整裝置 11‧‧‧temperature adjustment device

12‧‧‧第1下面調溫面板 12‧‧‧The first lower temperature control panel

13‧‧‧第2下面調溫面板 13‧‧‧The second lower temperature control panel

14‧‧‧第3下面調溫面板 14‧‧‧The third lower temperature control panel

15‧‧‧第4下面調溫面板 15‧‧‧The fourth lower temperature control panel

16‧‧‧溫度控制部 16‧‧‧Temperature Control Department

17、18、19、20‧‧‧水溫調整加熱器 17, 18, 19, 20‧‧‧Water temperature adjustment heater

21‧‧‧上面 21‧‧‧above

22‧‧‧下面 22‧‧‧below

31‧‧‧第1上面側溫度感測器 31‧‧‧The first upper side temperature sensor

32‧‧‧第2上面側溫度感測器 32‧‧‧The second upper side temperature sensor

33‧‧‧第3上面側溫度感測器 33‧‧‧The third upper side temperature sensor

34‧‧‧第4上面側溫度感測器 34‧‧‧4th upper side temperature sensor

35‧‧‧隔熱面板 35‧‧‧Heat insulation panel

36‧‧‧熱輻射面板 36‧‧‧Heat radiation panel

37‧‧‧溫度調整管子(溫度調整部) 37‧‧‧Temperature adjustment pipe (temperature adjustment part)

41‧‧‧第1面板側溫度感測器 41‧‧‧The first panel side temperature sensor

42‧‧‧第2面板側溫度感測器 42‧‧‧Temperature sensor on the second panel side

43‧‧‧第3面板側溫度感測器 43‧‧‧The third panel side temperature sensor

44‧‧‧第4面板側溫度感測器 44‧‧‧4th panel side temperature sensor

(T+A)、(T+B)、(T+C)、(T+D)‧‧‧規定之控制溫度 (T+A), (T+B), (T+C), (T+D)‧‧‧regulated control temperature

(T)‧‧‧基準溫度 (T)‧‧‧reference temperature

Claims (10)

一種石材表面板之溫度調整裝置,係與設置地面之間隔著間隙而配置的石材表面板之溫度調整裝置,其特徵為具備:以與上述石材表面板之下面對置的方式配置於上述設置地面上的下面調溫面板;及對上述下面調溫面板之溫度進行控制的溫度控制部;上述下面調溫面板具備:配置於上述設置地面上的隔熱面板;及配置於上述隔熱面板之上,設置有溫度調整部且藉由該溫度調整部進行熱供給或熱吸收的熱輻射面板;上述溫度控制部,係以上述石材表面板之上面與上述熱輻射面板之表面之間之溫度差成為設定值的方式對上述熱輻射面板之溫度進行控制。 A temperature adjustment device for a stone surface panel, which is a temperature adjustment device for a stone surface panel arranged with a gap between it and the installation floor, and is characterized in that it is arranged on the above-mentioned installation in such a manner that it faces the lower surface of the above-mentioned stone surface panel. a lower temperature-regulating panel on the ground; and a temperature control unit for controlling the temperature of the lower temperature-regulating panel; the lower temperature-regulating panel includes: a heat-insulating panel arranged on the above-mentioned installation ground; and a heat-insulating panel arranged on the above-mentioned heat-insulating panel On the top, a heat radiation panel is provided with a temperature adjustment part and the heat is supplied or absorbed by the temperature adjustment part; the temperature control part is based on the temperature difference between the upper surface of the stone surface board and the surface of the heat radiation The temperature of the above-mentioned heat radiation panel is controlled so as to become a set value. 如申請專利範圍第1項之石材表面板之溫度調整裝置,其中上述下面調溫面板被配置於,將上述設置地面之供作為設置上述石材表面板的佔有區域沿著上述石材表面板之長邊方向分割為複數個區域之每一個分割區域。 Such as the temperature adjustment device of the stone surface plate in the first item of the scope of the patent application, wherein the above-mentioned lower temperature-regulating panel is arranged on the long side of the above-mentioned stone surface plate along the occupied area of the above-mentioned installation ground for the installation of the above-mentioned stone surface plate The direction is divided into each divided area of a plurality of areas. 如申請專利範圍第1或2項之石材表面板之溫度調整裝置,其中 在上述下面調溫面板設置有面板側溫度感測器,在與上述面板側溫度感測器對應的石材表面板之上面設置有與該面板側溫度感測器成對的上面側溫度感測器,上述溫度控制部,係依據成對的上述面板側溫度感測器與在上下方向對應的上述上面側溫度感測器之溫度檢測值,對各自之上述下面調溫面板之上述溫度調整部之溫度進行控制。 Such as the temperature adjustment device of the stone surface panel in the first or second item of the patent scope of the application, wherein A panel-side temperature sensor is arranged on the above-mentioned lower temperature-regulating panel, and an upper-side temperature sensor paired with the panel-side temperature sensor is arranged above the stone surface plate corresponding to the above-mentioned panel-side temperature sensor. , the above-mentioned temperature control part is based on the temperature detection values of the pair of above-mentioned panel-side temperature sensors and the above-mentioned upper-side temperature sensor corresponding to the up-down direction, and control the above-mentioned temperature adjustment parts of the respective above-mentioned lower temperature-regulating panels. The temperature is controlled. 如申請專利範圍第1或2項之石材表面板之溫度調整裝置,其中上述下面調溫面板與上述石材表面板之下面所挾持的間隙之周圍,係被隔室壁包圍。 Such as the temperature adjustment device of the stone surface plate in the 1st or 2nd scope of the patent application, wherein the surrounding of the gap between the above-mentioned lower temperature-regulating panel and the underside of the above-mentioned stone surface plate is surrounded by the compartment wall. 如申請專利範圍第1或2項之石材表面板之溫度調整裝置,其中上述隔熱面板由獨立發泡構造之樹脂片構成。 Such as the temperature adjustment device of the stone surface panel in the 1st or 2nd scope of the patent application, wherein the above-mentioned heat insulation panel is composed of a resin sheet with an independent foam structure. 如申請專利範圍第1或2項之石材表面板之溫度調整裝置,其中上述熱輻射面板由金屬板構成。 Such as the temperature adjustment device for stone surface panels in claim 1 or 2 of the patent scope, wherein the above-mentioned heat radiation panel is made of a metal plate. 如申請專利範圍第1或2項之石材表面板之溫度調整裝置,其中上述溫度調整部為流通冷媒的溫度調整管子。 Such as the temperature adjustment device for stone surface panels in the first or second patent scope of the application, wherein the above-mentioned temperature adjustment part is a temperature adjustment pipe for circulating refrigerant. 如申請專利範圍第7項之石材表面板之溫度調整裝置,其中上述溫度調整管子具有相互並行的一對冷媒流路,設定成為在上述一對冷媒流路各自使冷媒相互朝逆向流動。 For example, the temperature adjustment device for stone surface panels as claimed in item 7 of the scope of the patent application, wherein the above-mentioned temperature adjustment pipe has a pair of refrigerant flow paths parallel to each other, and is set so that the refrigerant flows in opposite directions in each of the pair of refrigerant flow paths. 如申請專利範圍第7項之石材表面板之溫度調整裝置,其中具備:容器,用於對上述溫度調整管子供給調整成為比起被上述下面調溫面板溫熱的上述石材表面板之溫度低的基準溫度之冷媒;及熱交換器,藉由較上述基準溫度低的溫度之冷卻水,使通過上述溫度調整管子而返回之冷媒下降至該基準溫度而進行冷卻;將被上述熱交換器冷卻過的冷媒供給至上述容器。 Such as the temperature adjustment device of the stone surface plate in claim 7 of the scope of the patent application, which includes: a container for supplying and adjusting the temperature of the above-mentioned temperature adjustment pipe to be lower than the temperature of the above-mentioned stone surface plate warmed by the above-mentioned lower temperature-regulating panel Refrigerant at a reference temperature; and a heat exchanger, using cooling water at a temperature lower than the above-mentioned reference temperature to cool the refrigerant returned through the above-mentioned temperature adjustment pipe to the reference temperature; it will be cooled by the above-mentioned heat exchanger The refrigerant is supplied to the above container. 一種檢測裝置,具備:與上述設置地面之間隔著間隙被配置,用於載置被檢測面板的上述石材表面板;相對於上述被檢測面板進行移動,對上述被檢測面板之面板面之狀態進行攝像的檢測攝影機;及如申請專利範圍第1至9項中任一項之上述石材表面板 之溫度調整裝置。 A detection device comprising: the above-mentioned stone surface plate which is arranged with a gap between the above-mentioned installation ground and used to place a panel to be tested; moves relative to the panel to be tested, and monitors the state of the panel surface of the panel to be tested A detection camera for taking pictures; and the above-mentioned stone surface plate as described in any one of items 1 to 9 of the scope of patent application The temperature adjustment device.
TW108111451A 2018-04-03 2019-04-01 Temperature adjustment device for stone surface board and detection device equipped with it TWI783138B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-071843 2018-04-03
JP2018071843 2018-04-03
JP2018-178799 2018-09-25
JP2018178799A JP7105482B2 (en) 2018-04-03 2018-09-25 Stone surface plate temperature adjustment device and inspection device equipped with the same

Publications (2)

Publication Number Publication Date
TW201945837A TW201945837A (en) 2019-12-01
TWI783138B true TWI783138B (en) 2022-11-11

Family

ID=68340867

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108111451A TWI783138B (en) 2018-04-03 2019-04-01 Temperature adjustment device for stone surface board and detection device equipped with it

Country Status (3)

Country Link
JP (1) JP7105482B2 (en)
CN (1) CN111868510B (en)
TW (1) TWI783138B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62218837A (en) * 1986-03-20 1987-09-26 Fujitsu Ltd Precision optical measuring surface plate
JPH09126703A (en) * 1995-10-31 1997-05-16 Naruko Denki Seisakusho:Kk Precise constant temperature surface plate
WO1999048192A1 (en) * 1998-03-19 1999-09-23 Nikon Corporation Flat motor, stage, exposure apparatus and method of producing the same, and device and method for manufacturing the same
JP2008010633A (en) * 2006-06-29 2008-01-17 Tokyo Seimitsu Co Ltd Prober
TW201703189A (en) * 2015-05-28 2017-01-16 尼康股份有限公司 Object holding device, exposure apparatus, manufacturing method of flat panel display, and device manufacturing method
TW201842545A (en) * 2017-03-31 2018-12-01 日商尼康股份有限公司 Object holding apparatus, processing apparatus, manufacturing method of flat panel display, manufacturing method of device, and object holding method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10139452A (en) * 1996-11-08 1998-05-26 Nippon Electric Glass Co Ltd Molding machine for glass product
TW439094B (en) * 1998-02-16 2001-06-07 Komatsu Co Ltd Apparatus for controlling temperature of substrate
JP2006066687A (en) * 2004-08-27 2006-03-09 Nikon Corp Method of regulating temperature, stage device, exposure device and method of manufacturing device
JP4323419B2 (en) * 2004-12-16 2009-09-02 芝浦メカトロニクス株式会社 Thermocompression bonding tool and thermocompression bonding apparatus
JP5331638B2 (en) * 2008-11-04 2013-10-30 Hoya株式会社 Photomask manufacturing method and drawing apparatus for display device manufacturing
TWI417980B (en) * 2009-02-04 2013-12-01 Hoya Corp Stage cleaner, writing apparatus and substrate processing apparatus
DE102010056039B4 (en) 2010-12-16 2015-01-15 Carl Zeiss Industrielle Messtechnik Gmbh Coordinate measuring machine and method for operating a coordinate measuring machine
CN203773225U (en) * 2014-03-24 2014-08-13 上海华力微电子有限公司 Temperature control device
JP6018606B2 (en) * 2014-06-27 2016-11-02 東京エレクトロン株式会社 System including temperature-controllable stage, semiconductor manufacturing apparatus, and stage temperature control method
KR102019573B1 (en) * 2014-10-30 2019-09-06 도쿄엘렉트론가부시키가이샤 Substrate placing table
JP6669481B2 (en) * 2015-12-04 2020-03-18 株式会社ブイ・テクノロジー Inspection device
JP7148250B2 (en) 2018-03-16 2022-10-05 芝浦メカトロニクス株式会社 Substrate mounting stage and mounting device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62218837A (en) * 1986-03-20 1987-09-26 Fujitsu Ltd Precision optical measuring surface plate
JPH09126703A (en) * 1995-10-31 1997-05-16 Naruko Denki Seisakusho:Kk Precise constant temperature surface plate
WO1999048192A1 (en) * 1998-03-19 1999-09-23 Nikon Corporation Flat motor, stage, exposure apparatus and method of producing the same, and device and method for manufacturing the same
JP2008010633A (en) * 2006-06-29 2008-01-17 Tokyo Seimitsu Co Ltd Prober
TW201703189A (en) * 2015-05-28 2017-01-16 尼康股份有限公司 Object holding device, exposure apparatus, manufacturing method of flat panel display, and device manufacturing method
TW201842545A (en) * 2017-03-31 2018-12-01 日商尼康股份有限公司 Object holding apparatus, processing apparatus, manufacturing method of flat panel display, manufacturing method of device, and object holding method

Also Published As

Publication number Publication date
CN111868510B (en) 2024-06-11
JP2019184562A (en) 2019-10-24
TW201945837A (en) 2019-12-01
JP7105482B2 (en) 2022-07-25
CN111868510A (en) 2020-10-30

Similar Documents

Publication Publication Date Title
Iyengar et al. Comparison between numerical and experimental temperature distributions in a small data center test cell
US6583638B2 (en) Temperature-controlled semiconductor wafer chuck system
CN101893827A (en) Lithographic equipment and device making method
CN101472814A (en) Multiple slot load lock chamber and method of operation
TWI783138B (en) Temperature adjustment device for stone surface board and detection device equipped with it
JP2012097914A (en) Data center or computer system
CN102193565A (en) Air bath temperature control device and method
TW201725608A (en) Horizontal placement device and method of horizontally placing object
JP2009156486A (en) Test environment adjusting device of central air conditioner
WO2019194139A1 (en) Temperature adjusting device for stone surface plate, and inspection device provided with same
JP2000156277A (en) Heating device, and heating method
JP5135911B2 (en) Temperature test booth and environment generation method in the temperature test booth
Jonathan et al. An investigation of the heat absorption and transmission into a scaled building structure installed with a fluidic window
JP2010139124A (en) Air-circulation type cooling/heating system
CN109175366B (en) A kind of protection of optics heating power and cooling system for the sintering of high-temperature laser constituency
JP2001054839A (en) Thermal displacement reducing device for machine
CN201293896Y (en) Device for precuring orientation film
JP2020051080A (en) Support member set and heating/cooling system
JP3745997B2 (en) Floor radiation device for floor radiation and air conditioning air conditioner
JP4327792B2 (en) Radiant air conditioning system
JP2013181692A (en) Heat accumulation apparatus, and air conditioning system
CN110554572B (en) Suction cup
JP3910206B2 (en) Multistage heating system for large substrates
JP4902997B2 (en) Fuel cell system and building
Palmowska et al. Research on thermal conditions in ventilated large space building