CN203773225U - Temperature control device - Google Patents
Temperature control device Download PDFInfo
- Publication number
- CN203773225U CN203773225U CN201420134086.2U CN201420134086U CN203773225U CN 203773225 U CN203773225 U CN 203773225U CN 201420134086 U CN201420134086 U CN 201420134086U CN 203773225 U CN203773225 U CN 203773225U
- Authority
- CN
- China
- Prior art keywords
- temperature control
- temperature
- control platform
- silicon wafer
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 29
- 239000010703 silicon Substances 0.000 claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 238000001259 photo etching Methods 0.000 claims abstract description 8
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 230000003028 elevating effect Effects 0.000 claims description 3
- 238000001459 lithography Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Control Of Temperature (AREA)
Abstract
The utility model provides a temperature control device which comprises a temperature control platform, a lifting mechanism and a temperature controller, wherein the temperature control platform is used for holding a silicon wafer; a water inlet is formed in one side of the temperature control platform; a water outlet is formed in the other side of the temperature control platform; the lifting mechanism is used for lifting the silicon wafer on the temperature control platform; the temperature controller is used for sensing the temperature of the temperature control platform. The temperature of the temperature control platform is monitored by the temperature controller in real time, the flow of temperature control water is controlled to adjust the temperature of the temperature control platform, and after the temperature of the silicon wafer and the internal ambient temperature inside an photoetching machine are balanced, the lifting mechanism lifts up to carry away the silicon wafer, thus different expansion deformation of the silicon wafer caused by temperature difference is reduced, and the alignment precision of the photoetching machine is improved.
Description
Technical Field
The utility model relates to the field of semiconductor technology, in particular to temperature control device.
Background
The photolithography process plays a significant role in the current process of manufacturing very large scale integrated circuits. For the photolithography technique, the photolithography apparatus, the photolithography process and the mask technique are particularly critical.
In the prior art, almost most lithography machines do not have a device for controlling the temperature of a silicon wafer, and the temperature difference between the silicon wafer and the internal environment of the lithography machine easily causes the expansion and deformation of the silicon wafer, so that the alignment precision of the lithography machine is reduced. In the face of the above situations, some lithography machines add a cold plate at the pre-alignment mechanism for temperature control, but the temperature control effect of the silicon wafer is not good by using this method.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature control device to solve prior art and to the not good problem of temperature control effect of silicon chip.
In order to solve the technical problem, the utility model provides a temperature control device is applied to lithography machine silicon chip and conveys the kneck, include:
the temperature control platform is used for placing a silicon wafer, one side of the temperature control platform is provided with a water inlet, and the other side of the temperature control platform is provided with a water outlet;
the lifting mechanism is used for lifting the silicon wafer on the temperature control platform;
and the temperature controller is used for sensing the temperature of the temperature control platform.
Further, in the temperature control device, the elevating mechanism includes:
a drive motor mechanism;
the lifting coupling is connected with the driving motor mechanism;
and the pin structure platform is connected with the lifting coupling.
Further, in the temperature control device, the pin structure platform includes three pins.
Furthermore, in the temperature control device, the temperature control device further comprises a water inlet pipe connected with the water inlet; and the water outlet pipe is connected with the water outlet.
Further, in the temperature control device, the temperature control device further comprises a flow control valve disposed on the water inlet pipe.
Further, in the temperature control device, the temperature control device further comprises a timer connected with the lifting mechanism.
Further, in the temperature control device, the temperature controller is a mechanical temperature controller or an electronic temperature controller.
The utility model provides a temperature control device has following beneficial effect: the temperature controller monitors the temperature of the temperature control platform in real time, and the flow of temperature control water is controlled to adjust the temperature of the temperature control platform, so that after the temperature of the silicon wafer and the internal environment temperature of the photoetching machine reach balance, the lifting mechanism is lifted to convey away the silicon wafer, different expansion deformation of the silicon wafer caused by temperature difference is reduced, and the alignment precision of the photoetching machine is improved.
Drawings
Fig. 1 is a schematic view of a temperature control device according to a preferred embodiment of the present invention.
Detailed Description
The temperature control device according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more fully apparent from the following description and appended claims. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention.
Please refer to fig. 1, which is a schematic diagram of a temperature control device according to a preferred embodiment of the present invention. As shown in FIG. 1, the utility model provides a temperature control device is applied to lithography machine silicon chip and conveys the kneck, temperature control device includes: the temperature control device comprises a temperature control platform 1, a lifting mechanism and a temperature controller 2; wherein,
the temperature control platform 1 is used for placing a silicon wafer, one side of the temperature control platform 1 is provided with a water inlet, and the other side of the temperature control platform 1 is provided with a water outlet;
the lifting mechanism is arranged below the temperature control platform 1 and used for lifting the silicon wafer on the temperature control platform 1;
specifically, the lifting mechanism includes:
a drive motor mechanism 3;
a lifting coupling 4 connected with the driving motor mechanism 3;
the pin structure platform 5 is connected to the lifting coupling 4, preferably, in this embodiment, the pin structure platform 5 adopts a three-pin structure, and the distance between the three pins needs to satisfy the transportation of a robot arm.
The temperature controller 2 is used for sensing the temperature of the temperature control platform 1; preferably, in this embodiment, the temperature controller is a mechanical temperature controller or an electronic temperature controller.
The temperature control device also comprises a water inlet pipe 6 connected with the water inlet and used for feeding water for temperature regulation; and the water outlet pipe 7 is connected with the water outlet and is used for discharging the temperature-regulated water.
The temperature control device is characterized by further comprising a flow control valve 8 arranged on the water inlet pipe, the temperature controller 2 senses the temperature of the temperature control platform 1 and then controls the flow control valve 8 to change the inflow flow of the temperature-regulated water so as to adjust the temperature of the temperature control platform.
The temperature control device also comprises a timer (not shown in the figure) connected with the lifting mechanism, and the timer is used for calculating the time for controlling the temperature of the silicon wafer.
The temperature control device of the present embodiment operates as follows: and after the silicon wafer enters the photoetching machine, the silicon wafer is transmitted to the temperature control platform, the timer starts timing, the temperature controller senses the temperature of the temperature control platform, and the flow control valve is controlled and adjusted according to the real-time temperature of the temperature control platform to change the flow of inflow water of temperature-adjusting water so as to adjust the temperature of the temperature control platform. After the timer counts 5 seconds, the driving motor mechanism drives the lifting coupling, the lifting coupling drives the three-pin structure platform to ascend, and after a mechanical arm takes away a silicon wafer, the three-pin structure platform descends to the original position.
To sum up, the utility model discloses a temperature controller real-time supervision the temperature of control by temperature change platform, the flow of control by temperature change water is adjusted the temperature of control by temperature change platform for silicon chip and the inside ambient temperature of photoetching machine reach balanced back, elevating system rise will the silicon chip is sent away, thereby reduces the silicon chip because the different expansion deformation that the temperature difference arouses, improves the alignment precision of photoetching machine.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and any modification and modification made by those skilled in the art according to the above disclosure are all within the scope of the claims.
Claims (7)
1. A temperature control device is applied to a silicon wafer conveying interface of a photoetching machine, and is characterized by comprising:
the temperature control platform is used for placing a silicon wafer, one side of the temperature control platform is provided with a water inlet, and the other side of the temperature control platform is provided with a water outlet;
the lifting mechanism is used for lifting the silicon wafer on the temperature control platform;
and the temperature controller is used for sensing the temperature of the temperature control platform.
2. The temperature control apparatus of claim 1, wherein the elevating mechanism comprises:
a drive motor mechanism;
the lifting coupling is connected with the driving motor mechanism;
and the pin structure platform is connected with the lifting coupling.
3. The temperature control device of claim 2, wherein the pin structure platform comprises three pins.
4. The temperature control apparatus of claim 1, further comprising a water inlet tube coupled to the water inlet; and the water outlet pipe is connected with the water outlet.
5. The temperature control apparatus of claim 4, further comprising a flow control valve disposed on the inlet conduit.
6. The temperature control apparatus of claim 1, further comprising a timer coupled to the elevator mechanism.
7. The temperature control apparatus of claim 1, wherein the temperature controller is a mechanical temperature controller or an electronic temperature controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420134086.2U CN203773225U (en) | 2014-03-24 | 2014-03-24 | Temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420134086.2U CN203773225U (en) | 2014-03-24 | 2014-03-24 | Temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203773225U true CN203773225U (en) | 2014-08-13 |
Family
ID=51290394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420134086.2U Expired - Lifetime CN203773225U (en) | 2014-03-24 | 2014-03-24 | Temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203773225U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105183037A (en) * | 2015-09-09 | 2015-12-23 | 合肥芯碁微电子装备有限公司 | Laser direct-write lithography machine precise temperature control method |
| CN111868510A (en) * | 2018-04-03 | 2020-10-30 | 株式会社V技术 | Temperature adjustment device for stone surface plate and examination device provided with same |
| WO2023019770A1 (en) * | 2021-08-20 | 2023-02-23 | 长鑫存储技术有限公司 | Temperature control apparatus and temperature control method |
| US11874609B2 (en) | 2021-09-29 | 2024-01-16 | Changxin Memory Technologies, Inc. | Temperature control device and temperature control method |
-
2014
- 2014-03-24 CN CN201420134086.2U patent/CN203773225U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105183037A (en) * | 2015-09-09 | 2015-12-23 | 合肥芯碁微电子装备有限公司 | Laser direct-write lithography machine precise temperature control method |
| CN105183037B (en) * | 2015-09-09 | 2017-11-14 | 合肥芯碁微电子装备有限公司 | A kind of laser direct-writing formula litho machine accurate temperature control method |
| CN111868510A (en) * | 2018-04-03 | 2020-10-30 | 株式会社V技术 | Temperature adjustment device for stone surface plate and examination device provided with same |
| CN111868510B (en) * | 2018-04-03 | 2024-06-11 | 株式会社V技术 | Temperature adjustment device for stone platform and inspection device provided with same |
| WO2023019770A1 (en) * | 2021-08-20 | 2023-02-23 | 长鑫存储技术有限公司 | Temperature control apparatus and temperature control method |
| US11874609B2 (en) | 2021-09-29 | 2024-01-16 | Changxin Memory Technologies, Inc. | Temperature control device and temperature control method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140813 |
|
| CX01 | Expiry of patent term |