TWI782698B - 圖案描繪裝置、圖案描繪方法、以及元件製造方法 - Google Patents
圖案描繪裝置、圖案描繪方法、以及元件製造方法 Download PDFInfo
- Publication number
- TWI782698B TWI782698B TW110133395A TW110133395A TWI782698B TW I782698 B TWI782698 B TW I782698B TW 110133395 A TW110133395 A TW 110133395A TW 110133395 A TW110133395 A TW 110133395A TW I782698 B TWI782698 B TW I782698B
- Authority
- TW
- Taiwan
- Prior art keywords
- pattern
- light
- substrate
- light beam
- scanning
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
- G02B26/127—Adaptive control of the scanning light beam, e.g. using the feedback from one or more detectors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
- G02B26/121—Mechanical drive devices for polygonal mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/04—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
- G03G15/043—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material with means for controlling illumination or exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Semiconductor Memories (AREA)
- Electron Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP2016-067452 | 2016-03-30 | ||
JP2016067452 | 2016-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202202952A TW202202952A (zh) | 2022-01-16 |
TWI782698B true TWI782698B (zh) | 2022-11-01 |
Family
ID=59964544
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106110235A TWI740920B (zh) | 2016-03-30 | 2017-03-28 | 圖案描繪裝置、圖案描繪方法 |
TW110133395A TWI782698B (zh) | 2016-03-30 | 2017-03-28 | 圖案描繪裝置、圖案描繪方法、以及元件製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106110235A TWI740920B (zh) | 2016-03-30 | 2017-03-28 | 圖案描繪裝置、圖案描繪方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11143862B2 (de) |
EP (1) | EP3438751A4 (de) |
JP (2) | JP6743884B2 (de) |
KR (2) | KR102541913B1 (de) |
CN (2) | CN110031968B (de) |
TW (2) | TWI740920B (de) |
WO (1) | WO2017170514A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106794632B (zh) * | 2014-10-20 | 2020-06-16 | 索尼公司 | 光学成型装置及制造成型物的方法 |
CN110636944B (zh) * | 2017-05-25 | 2021-07-30 | 索尼半导体解决方案公司 | 光学头、光学头扫描装置和驱动光学头扫描装置的方法 |
CN107416799A (zh) * | 2017-07-31 | 2017-12-01 | 江苏大学 | 一种提高石墨烯制备效率的装置与方法 |
TWI628415B (zh) * | 2017-09-13 | 2018-07-01 | 國立清華大學 | 基於影像尺的定位量測系統 |
WO2019082727A1 (ja) * | 2017-10-24 | 2019-05-02 | キヤノン株式会社 | 露光装置および物品の製造方法 |
JP2019079029A (ja) | 2017-10-24 | 2019-05-23 | キヤノン株式会社 | 露光装置および物品の製造方法 |
CN108510896B (zh) * | 2018-02-10 | 2022-08-16 | 深圳市亚特联科技有限公司 | 旋转式波长转换头、像素单元、显示器及电子设备 |
TWI670533B (zh) * | 2019-01-07 | 2019-09-01 | 茂林光學股份有限公司 | 導光板之對位校正應用方法及導光板之對位校正系統 |
CN111007006B (zh) * | 2019-11-25 | 2021-11-26 | 东北大学 | 一种多光谱调制输出光源装置 |
JP7416090B2 (ja) * | 2020-01-10 | 2024-01-17 | 株式会社ニコン | 光学装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
EP3926403A1 (de) * | 2020-06-17 | 2021-12-22 | Mycronic Ab | Verfahren und vorrichtung zur ausrichtung einer maskenlosen zweiten schicht |
WO2021260827A1 (ja) * | 2020-06-24 | 2021-12-30 | 三菱電機株式会社 | 面倒れ量検出装置、制御装置およびレーザ加工装置 |
KR20230113630A (ko) * | 2020-12-09 | 2023-07-31 | 가부시키가이샤 니콘 | 패턴 노광 장치 및 패턴 노광 방법 |
CN113573488B (zh) * | 2021-07-01 | 2024-08-02 | 德中(天津)技术发展股份有限公司 | 激光和化学结合选择性活化绝缘材料制造导电图案的系统 |
US20230050743A1 (en) * | 2021-08-10 | 2023-02-16 | Innolux Corporation | Electronic device and method for manufacturing the same |
JP2023141515A (ja) * | 2022-03-24 | 2023-10-05 | 株式会社Screenホールディングス | 指示用プログラム、プログラムセットおよび描画システム |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014081452A (ja) * | 2012-10-16 | 2014-05-08 | Nikon Corp | 露光装置、およびデバイス製造方法 |
WO2015152217A1 (ja) * | 2014-04-01 | 2015-10-08 | 株式会社ニコン | 基板処理装置、デバイス製造方法及び基板処理装置の調整方法 |
TW201602636A (zh) * | 2014-04-28 | 2016-01-16 | 尼康股份有限公司 | 圖案描繪裝置、圖案描繪方法、元件製造方法、雷射光源裝置、光束掃描裝置、以及光束掃描方法 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61263222A (ja) | 1985-05-17 | 1986-11-21 | Canon Inc | 走査型描画装置 |
JPH0810123B2 (ja) * | 1986-09-12 | 1996-01-31 | 株式会社ニコン | 光学装置 |
JPS62188902A (ja) * | 1987-01-14 | 1987-08-18 | Canon Inc | 光学装置 |
JP3229001B2 (ja) | 1991-03-26 | 2001-11-12 | 株式会社東芝 | 走査光学装置 |
JPH063611A (ja) * | 1991-06-26 | 1994-01-14 | Asahi Optical Co Ltd | 走査式光学装置 |
JPH09306814A (ja) | 1996-05-15 | 1997-11-28 | Nikon Corp | 露光方法及び装置 |
CN101135864A (zh) * | 2000-12-28 | 2008-03-05 | 株式会社尼康 | 曝光方法及设备以及器件制造方法 |
JP4191923B2 (ja) * | 2001-11-02 | 2008-12-03 | 株式会社東芝 | 露光方法および露光装置 |
JP2006098727A (ja) | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 伸縮状態の検出手段を設けた長尺の可撓性記録媒体と、この可撓性記録媒体に伸縮状態を補正して画像を描画可能な描画方法及び装置 |
JP2008016825A (ja) * | 2006-06-09 | 2008-01-24 | Canon Inc | 露光装置、除去方法及びデバイス製造方法 |
TW200830057A (en) * | 2006-09-08 | 2008-07-16 | Nikon Corp | Mask, exposure apparatus and device manufacturing method |
JP4942535B2 (ja) | 2007-04-04 | 2012-05-30 | 大日本スクリーン製造株式会社 | 位置検出装置、パターン描画装置および位置検出方法 |
JP2010039362A (ja) | 2008-08-07 | 2010-02-18 | Dainippon Screen Mfg Co Ltd | パターン描画装置 |
JP5448240B2 (ja) | 2008-10-10 | 2014-03-19 | 株式会社ニコン | 表示素子の製造装置 |
JP5508734B2 (ja) * | 2009-02-09 | 2014-06-04 | 大日本スクリーン製造株式会社 | パターン描画装置およびパターン描画方法 |
JP2011059307A (ja) * | 2009-09-09 | 2011-03-24 | Toppan Printing Co Ltd | フィルム基板搬送露光方法及びフィルム基板搬送露光装置 |
JPWO2011096365A1 (ja) * | 2010-02-05 | 2013-06-10 | Nskテクノロジー株式会社 | 露光装置用光照射装置及びその点灯制御方法、並びに露光装置、露光方法及び基板 |
US20110278268A1 (en) * | 2010-05-13 | 2011-11-17 | Alon Siman-Tov | Writing an image on flexographic media |
KR101475305B1 (ko) * | 2010-05-18 | 2014-12-22 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 디바이스 제조 방법 |
KR102077439B1 (ko) | 2012-03-26 | 2020-02-13 | 가부시키가이샤 니콘 | 패턴 형성 장치 |
IN2015DN01909A (de) | 2012-08-28 | 2015-08-07 | Nikon Corp | |
JP2014199861A (ja) * | 2013-03-29 | 2014-10-23 | 大日本スクリーン製造株式会社 | パターン描画装置およびパターン描画方法 |
CN107255910B (zh) * | 2013-04-30 | 2019-04-02 | 株式会社尼康 | 圆筒光罩 |
CN103399463B (zh) * | 2013-07-19 | 2015-07-29 | 中国科学院上海光学精密机械研究所 | 投影光刻机照明装置和使用方法 |
TWI639064B (zh) | 2014-04-01 | 2018-10-21 | 日商尼康股份有限公司 | 基板處理裝置及元件製造方法 |
JP6349924B2 (ja) * | 2014-04-28 | 2018-07-04 | 株式会社ニコン | パターン描画装置 |
JP6361273B2 (ja) * | 2014-05-13 | 2018-07-25 | 株式会社ニコン | 基板処理装置及びデバイス製造方法 |
-
2017
- 2017-03-28 WO PCT/JP2017/012584 patent/WO2017170514A1/ja active Application Filing
- 2017-03-28 KR KR1020227010061A patent/KR102541913B1/ko active IP Right Grant
- 2017-03-28 KR KR1020187031358A patent/KR102380603B1/ko active IP Right Grant
- 2017-03-28 TW TW106110235A patent/TWI740920B/zh active
- 2017-03-28 CN CN201910096369.XA patent/CN110031968B/zh active Active
- 2017-03-28 TW TW110133395A patent/TWI782698B/zh active
- 2017-03-28 CN CN201780022186.2A patent/CN108885408B/zh active Active
- 2017-03-28 US US16/090,545 patent/US11143862B2/en active Active
- 2017-03-28 EP EP17775051.0A patent/EP3438751A4/de not_active Withdrawn
- 2017-03-28 JP JP2018508049A patent/JP6743884B2/ja active Active
-
2020
- 2020-07-28 JP JP2020126959A patent/JP7021689B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014081452A (ja) * | 2012-10-16 | 2014-05-08 | Nikon Corp | 露光装置、およびデバイス製造方法 |
WO2015152217A1 (ja) * | 2014-04-01 | 2015-10-08 | 株式会社ニコン | 基板処理装置、デバイス製造方法及び基板処理装置の調整方法 |
TW201602636A (zh) * | 2014-04-28 | 2016-01-16 | 尼康股份有限公司 | 圖案描繪裝置、圖案描繪方法、元件製造方法、雷射光源裝置、光束掃描裝置、以及光束掃描方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20180128044A (ko) | 2018-11-30 |
CN108885408B (zh) | 2021-02-05 |
CN110031968A (zh) | 2019-07-19 |
CN108885408A (zh) | 2018-11-23 |
TW201805726A (zh) | 2018-02-16 |
TW202202952A (zh) | 2022-01-16 |
EP3438751A1 (de) | 2019-02-06 |
JP7021689B2 (ja) | 2022-02-17 |
EP3438751A4 (de) | 2020-01-22 |
WO2017170514A1 (ja) | 2017-10-05 |
US20190113741A1 (en) | 2019-04-18 |
KR102541913B1 (ko) | 2023-06-13 |
JPWO2017170514A1 (ja) | 2019-02-07 |
KR102380603B1 (ko) | 2022-03-31 |
TWI740920B (zh) | 2021-10-01 |
JP2020177254A (ja) | 2020-10-29 |
JP6743884B2 (ja) | 2020-08-19 |
US11143862B2 (en) | 2021-10-12 |
KR20220042256A (ko) | 2022-04-04 |
CN110031968B (zh) | 2022-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI782698B (zh) | 圖案描繪裝置、圖案描繪方法、以及元件製造方法 | |
CN111638631B (zh) | 图案曝光装置、光束扫描装置、及图案描绘装置 | |
JP6547609B2 (ja) | デバイス形成装置およびパターン形成装置 | |
JP2018185549A (ja) | 基板処理装置の性能確認方法 | |
JPWO2018066159A1 (ja) | パターン描画装置、およびパターン描画方法 | |
JP6780750B2 (ja) | 基板処理装置のテスト方法 | |
TWI714745B (zh) | 光束掃描裝置及圖案描繪裝置 | |
JP6638355B2 (ja) | パターン描画装置 | |
JP2020173444A (ja) | パターン形成方法 |