TWI779204B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI779204B
TWI779204B TW108121606A TW108121606A TWI779204B TW I779204 B TWI779204 B TW I779204B TW 108121606 A TW108121606 A TW 108121606A TW 108121606 A TW108121606 A TW 108121606A TW I779204 B TWI779204 B TW I779204B
Authority
TW
Taiwan
Prior art keywords
substrate
outer peripheral
barrier plate
aforementioned
processing apparatus
Prior art date
Application number
TW108121606A
Other languages
English (en)
Chinese (zh)
Other versions
TW202006875A (zh
Inventor
安藤幸嗣
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202006875A publication Critical patent/TW202006875A/zh
Application granted granted Critical
Publication of TWI779204B publication Critical patent/TWI779204B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polarising Elements (AREA)
TW108121606A 2018-07-03 2019-06-21 基板處理裝置 TWI779204B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-126671 2018-07-03
JP2018126671A JP7149118B2 (ja) 2018-07-03 2018-07-03 基板処理装置

Publications (2)

Publication Number Publication Date
TW202006875A TW202006875A (zh) 2020-02-01
TWI779204B true TWI779204B (zh) 2022-10-01

Family

ID=69059871

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111133017A TWI817689B (zh) 2018-07-03 2019-06-21 基板處理裝置
TW108121606A TWI779204B (zh) 2018-07-03 2019-06-21 基板處理裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW111133017A TWI817689B (zh) 2018-07-03 2019-06-21 基板處理裝置

Country Status (3)

Country Link
JP (2) JP7149118B2 (ja)
TW (2) TWI817689B (ja)
WO (1) WO2020008784A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI799172B (zh) * 2021-03-19 2023-04-11 日商斯庫林集團股份有限公司 基板處理裝置、及基板處理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201539625A (zh) * 2014-03-19 2015-10-16 Screen Holdings Co Ltd 基板處理裝置及基板處理方法
TW201738004A (zh) * 2016-03-25 2017-11-01 Screen Holdings Co Ltd 基板處理方法及基板處理裝置
TW201741032A (zh) * 2016-05-18 2017-12-01 斯庫林集團股份有限公司 基板處理裝置及基板處理方法
TW201802882A (zh) * 2016-03-31 2018-01-16 斯庫林集團股份有限公司 基板處理方法及基板處理裝置
TW201803650A (zh) * 2016-05-25 2018-02-01 斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184660A (ja) * 2000-12-13 2002-06-28 Dainippon Screen Mfg Co Ltd ノズルおよびそれを用いた基板処理装置
JP4570008B2 (ja) 2002-04-16 2010-10-27 東京エレクトロン株式会社 液処理装置および液処理方法
JP6033595B2 (ja) 2012-07-18 2016-11-30 東京エレクトロン株式会社 基板処理装置及び基板処理装置における距離測定方法
JP6338275B2 (ja) * 2014-06-27 2018-06-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6934732B2 (ja) 2016-03-31 2021-09-15 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6881922B2 (ja) 2016-09-12 2021-06-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201539625A (zh) * 2014-03-19 2015-10-16 Screen Holdings Co Ltd 基板處理裝置及基板處理方法
TW201738004A (zh) * 2016-03-25 2017-11-01 Screen Holdings Co Ltd 基板處理方法及基板處理裝置
TW201802882A (zh) * 2016-03-31 2018-01-16 斯庫林集團股份有限公司 基板處理方法及基板處理裝置
TW201741032A (zh) * 2016-05-18 2017-12-01 斯庫林集團股份有限公司 基板處理裝置及基板處理方法
TW201803650A (zh) * 2016-05-25 2018-02-01 斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
TW202006875A (zh) 2020-02-01
JP7149118B2 (ja) 2022-10-06
JP2020009800A (ja) 2020-01-16
WO2020008784A1 (ja) 2020-01-09
JP2022171969A (ja) 2022-11-11
JP7378556B2 (ja) 2023-11-13
TWI817689B (zh) 2023-10-01
TW202312344A (zh) 2023-03-16

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