TWI778323B - 發光裝置之製造方法 - Google Patents

發光裝置之製造方法 Download PDF

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Publication number
TWI778323B
TWI778323B TW109102655A TW109102655A TWI778323B TW I778323 B TWI778323 B TW I778323B TW 109102655 A TW109102655 A TW 109102655A TW 109102655 A TW109102655 A TW 109102655A TW I778323 B TWI778323 B TW I778323B
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TW
Taiwan
Prior art keywords
light
pair
electrodes
paste layer
metal paste
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TW109102655A
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English (en)
Chinese (zh)
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TW202034416A (zh
Inventor
里芳樹
勝又雅昭
大黒真一
松田義和
丸目隆真
湊永子
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日商日亞化學工業股份有限公司
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Publication of TW202034416A publication Critical patent/TW202034416A/zh
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Publication of TWI778323B publication Critical patent/TWI778323B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto

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  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Devices (AREA)
TW109102655A 2019-01-29 2020-01-22 發光裝置之製造方法 TWI778323B (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2019-013385 2019-01-29
JP2019013385 2019-01-29
JP2019-039687 2019-03-05
JP2019039687 2019-03-05
JP2019059486 2019-03-26
JP2019-059486 2019-03-26
JP2019238083A JP6959552B2 (ja) 2019-01-29 2019-12-27 発光装置の製造方法
JP2019-238083 2019-12-27

Publications (2)

Publication Number Publication Date
TW202034416A TW202034416A (zh) 2020-09-16
TWI778323B true TWI778323B (zh) 2022-09-21

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TW109102655A TWI778323B (zh) 2019-01-29 2020-01-22 發光裝置之製造方法

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JP (1) JP6959552B2 (ja)
TW (1) TWI778323B (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201515022A (zh) * 2012-07-20 2015-04-16 Toyo Boseki 雷射蝕刻加工用導電性糊劑、電路、及觸控面板
TWI563613B (en) * 2014-07-30 2016-12-21 Advanced Semiconductor Eng Method of manufacturing electronic package module and electronic package module manufactured by the same
US20170179344A1 (en) * 2015-12-21 2017-06-22 Nichia Corporation Method of manufacturing light emitting device
US20180123001A1 (en) * 2014-05-14 2018-05-03 Genesis Photonics Inc. Light emitting device and manufacturing method thereof
US20180239193A1 (en) * 2017-02-17 2018-08-23 Nichia Corporation Method of manufacturing light emitting module and light emitting module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5351479B2 (ja) * 2008-01-28 2013-11-27 東京エレクトロン株式会社 加熱源の冷却構造
JP2016082002A (ja) * 2014-10-14 2016-05-16 大日本印刷株式会社 配線基板および実装基板
JP2018056397A (ja) * 2016-09-29 2018-04-05 日亜化学工業株式会社 メタルベース基板の製造方法、半導体装置の製造方法、メタルベース基板、及び、半導体装置
JP6766795B2 (ja) * 2017-06-30 2020-10-14 日亜化学工業株式会社 発光モジュールの製造方法及び発光モジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201515022A (zh) * 2012-07-20 2015-04-16 Toyo Boseki 雷射蝕刻加工用導電性糊劑、電路、及觸控面板
US20180123001A1 (en) * 2014-05-14 2018-05-03 Genesis Photonics Inc. Light emitting device and manufacturing method thereof
TWI563613B (en) * 2014-07-30 2016-12-21 Advanced Semiconductor Eng Method of manufacturing electronic package module and electronic package module manufactured by the same
US20170179344A1 (en) * 2015-12-21 2017-06-22 Nichia Corporation Method of manufacturing light emitting device
US20180239193A1 (en) * 2017-02-17 2018-08-23 Nichia Corporation Method of manufacturing light emitting module and light emitting module

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Publication number Publication date
TW202034416A (zh) 2020-09-16
JP6959552B2 (ja) 2021-11-02
JP2020167378A (ja) 2020-10-08

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