TWI774745B - 黏著薄片 - Google Patents

黏著薄片 Download PDF

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Publication number
TWI774745B
TWI774745B TW107111119A TW107111119A TWI774745B TW I774745 B TWI774745 B TW I774745B TW 107111119 A TW107111119 A TW 107111119A TW 107111119 A TW107111119 A TW 107111119A TW I774745 B TWI774745 B TW I774745B
Authority
TW
Taiwan
Prior art keywords
adhesive
heat
adhesive sheet
resin
mass
Prior art date
Application number
TW107111119A
Other languages
English (en)
Chinese (zh)
Other versions
TW201842103A (zh
Inventor
阿久津高志
加藤揮一郎
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201842103A publication Critical patent/TW201842103A/zh
Application granted granted Critical
Publication of TWI774745B publication Critical patent/TWI774745B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Materials For Medical Uses (AREA)
TW107111119A 2017-03-31 2018-03-30 黏著薄片 TWI774745B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-073244 2017-03-31
JP2017073244 2017-03-31

Publications (2)

Publication Number Publication Date
TW201842103A TW201842103A (zh) 2018-12-01
TWI774745B true TWI774745B (zh) 2022-08-21

Family

ID=63677638

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107111119A TWI774745B (zh) 2017-03-31 2018-03-30 黏著薄片

Country Status (5)

Country Link
JP (1) JP6764526B2 (ja)
KR (1) KR102511639B1 (ja)
CN (1) CN110494524B (ja)
TW (1) TWI774745B (ja)
WO (1) WO2018181770A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI841705B (zh) 2019-03-15 2024-05-11 日商琳得科股份有限公司 黏著薄片及半導體裝置之製造方法
CN113825635A (zh) * 2019-03-28 2021-12-21 琳得科株式会社 粘合片、粘合片的制造方法及半导体装置的制造方法
WO2020195519A1 (ja) * 2019-03-28 2020-10-01 三井化学東セロ株式会社 粘着性フィルムの製造方法および電子装置の製造方法
KR20210148102A (ko) * 2019-03-28 2021-12-07 린텍 가부시키가이샤 점착 시트, 점착 시트의 제조 방법 및 반도체 장치의 제조 방법
WO2021192319A1 (ja) * 2020-03-27 2021-09-30 株式会社寺岡製作所 熱剥離型粘着テープ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI291983B (en) * 2000-10-18 2008-01-01 Nitto Denko Corp Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
TW201623509A (zh) * 2014-11-13 2016-07-01 Dainippon Ink & Chemicals 雙面黏貼膠帶、物品及分離方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594853B2 (ja) 1981-02-23 1984-02-01 株式会社日立製作所 半導体装置
JP2000248240A (ja) * 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
JP4703833B2 (ja) * 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2002322359A (ja) * 2001-04-23 2002-11-08 Nitto Denko Corp ウレタン−アクリル複合フィルムとその製造法
JP2006291137A (ja) * 2005-04-14 2006-10-26 Nitto Denko Cs System Kk 粘着テープ類およびその使用方法
DE102014018986A1 (de) * 2014-12-18 2016-06-23 Häusermann GmbH Mehrlagen-Leiterplatte mit wärmeleitendem Element
WO2018181765A1 (ja) * 2017-03-31 2018-10-04 リンテック株式会社 粘着シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI291983B (en) * 2000-10-18 2008-01-01 Nitto Denko Corp Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
TW201623509A (zh) * 2014-11-13 2016-07-01 Dainippon Ink & Chemicals 雙面黏貼膠帶、物品及分離方法

Also Published As

Publication number Publication date
KR20190129053A (ko) 2019-11-19
KR102511639B1 (ko) 2023-03-20
TW201842103A (zh) 2018-12-01
CN110494524B (zh) 2022-01-18
WO2018181770A1 (ja) 2018-10-04
JP6764526B2 (ja) 2020-09-30
CN110494524A (zh) 2019-11-22
JPWO2018181770A1 (ja) 2020-02-20

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