TWI774112B - Substrate transferring device and method for treating substrate using the substrate transferring device - Google Patents

Abstract

The present invention relates to a substrate transfer apparatus and a substrate processing method using the same, and aims to minimize thermal deformation of the substrate by blocking between the substrate and a heating portion inside a chamber when loading and unloading the substrate. In order to realize the substrate transfer apparatus of the present invention, it includes: a robot body equipped with a driving part that generates power; a transfer unit that supports the substrate for transfer; The transfer unit is connected to the side, and transfers the transfer unit according to the driving of the driving part, thereby loading the substrate into a chamber for processing the substrate or unloading the substrate from the chamber; blocking unit and when the substrate is loaded or unloaded, the heat transfer is blocked between the heating part for heating the substrate inside the chamber and the substrate.

Description

Substrate transfer device and substrate processing method using the same

The present invention relates to a substrate transfer apparatus and a substrate processing method using the same, and more particularly, to a substrate transfer apparatus that can minimize thermal deformation of the substrate by blocking the space between the substrate and a heating portion inside the chamber when loading or unloading the substrate, and A substrate processing method using the same.

Generally, a reflow process, which is a subsequent process of semiconductors, is a process of supplying solder to be soldered to a semiconductor wafer or PCB, and heating the solder to electrically connect electronic parts or wirings. In order to perform the reflow process, it is necessary to perform a heat treatment of heating the solder and a heat treatment of cooling after heating, and such heat treatment apparatuses are manufactured in various structures according to manufacturers.

As a prior art related to the heat treatment apparatus as described above, there is Korean Granted Patent No. 10-1680071.

The above-mentioned Patent No. 10-1680071 discloses a heat treatment apparatus configured as follows: a heating part for heating a substrate accommodated in a chamber is provided on the upper side of the substrate support part, and a cooling part is provided on the lower side of the substrate support part A cooling part is placed on the bottom surface of the substrate of the substrate support part so that heating and cooling processes of the substrate can be performed in one chamber.

However, according to the heat treatment apparatus, during the transfer of the substrate in the process of performing the loading and unloading of the substrate, it is exposed to the heat radiated from the heating portion in a state where the cooling effect by the cooling portion is not obtained.

That is, when unloading a substrate after substrate processing, the substrate is brought out of the chamber away from the cooling unit, and when a new substrate is loaded into the chamber, the substrate is brought into the chamber and moved to a position close to the cooling unit. , the substrate may be unnecessarily heated and subject to thermal shock.

According to this, thermal deformation such as a bending phenomenon may occur to cause damage to the substrate, and there is a problem that an error occurs in the process, such as requiring an additional cooling process.

The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide a substrate transfer apparatus that can minimize thermal deformation of the substrate by blocking the space between the substrate and a heating portion inside the chamber when loading and unloading the substrate. and a substrate processing method using the same.

A substrate transfer apparatus for achieving the above-described object is configured to include: a robot body equipped with a driving portion that generates power; a transfer unit that supports the substrate for transfer; and a transfer unit robot arm configured to be fastened on one side to the The robot main body is connected with the transfer unit on the other side, and transfers the transfer unit according to the driving of the driving section, thereby loading the substrate into a chamber for processing the substrate or unloading the substrate from the chamber. The substrate; and the blocking unit, which blocks heat transfer between the heating portion for heating the substrate inside the chamber and the substrate when the substrate is loaded or unloaded.

Also, it may be configured to further include a blocking unit arm, one side is fastened to the robot body, the blocking unit is connected to the other side, and transmits the blocking according to the driving of the driving part unit, so as to block between the heating part and the substrate, the transfer unit robot arm and the blocking unit robot arm may be configured to be driven independently of each other.

In addition, the transfer unit robot arm may include an unload transfer unit robot arm to which an unload transfer unit is connected, and the unload transfer unit supports the processed substrate processed inside the chamber and removes it from the chamber. The chamber is unloaded; and a load-transfer unit robot is connected to a load-transfer unit that supports the substrates to be processed to be processed inside the chamber and loads them into the chamber.

Further, the blocking unit may be configured to be brought into the chamber before the substrate is brought into the chamber when the substrate is loaded, and may be configured to be brought into the chamber when the substrate is unloaded. The substrate is taken out of the chamber after being taken out of the chamber.

In addition, the chamber may be provided with a cooling unit for cooling the substrate, and the blocking unit may be blocked when the substrate reaches a cooling position adjacent to the cooling unit when the substrate is loaded. The chamber is brought out, and when the substrate is unloaded, the blocking unit is brought into the chamber before the substrate is separated from the cooling position.

In addition, the heating unit may be an upper heater provided in an upper portion of the chamber, and the blocking unit may be configured to be located on the side of the substrate in a state where at least a part of the substrate is located inside the chamber. the upper side to block the space between the substrate and the upper heater.

In addition, the blocking unit is configured such that one side is fastened to the robot body and moves together with the robot body.

For the substrate processing method using the substrate transfer apparatus, the method includes the steps of: blocking the space between the heating part and the substrate inside the chamber by the blocking unit, so that there is no space between the heating part and the substrate. performing loading of the substrate in a state where heat transfer is blocked; and blocking between the heating portion inside the chamber and the substrate by the blocking unit, so that heat transfer from the heating portion to the substrate is blocked In the disconnected state, the unloading of the substrate is performed.

In addition, the blocking unit may be provided in a substrate transfer device that supports the substrate and transferred, and may be brought into the chamber or taken out of the chamber by being driven by a drive unit of the substrate transfer device. .

Also, when the substrate is loaded, the blocking unit may be brought into the chamber before the substrate is brought into the interior of the chamber, and when the substrate is unloaded, the blocking unit may be The substrate is brought out of the chamber after being brought out of the chamber.

Furthermore, the chamber may be provided with a cooling unit for cooling the substrate, and when the substrate reaches a cooling position adjacent to the cooling unit when the substrate is loaded, the blocking unit may be blocked. The chamber is brought out, and when the substrate is unloaded, the blocking unit is brought into the chamber before the substrate is separated from the cooling position.

Further, the substrate transfer apparatus may include: a transfer unit for transferring the substrate while supporting the substrate; a transfer unit robot arm for transferring the transfer unit, and the substrate processing method is configured such that the transfer unit robot arm passes the The conveying unit is driven and conveyed to load or unload the substrate.

In addition, the transfer unit and the transfer unit robot arm may include: an unloading unit including the unloading transfer unit and the unloading transfer unit robot arm; and a loading unit including the loading transfer unit and the loading transfer unit robot. When the loading and conveying unit robot arm is driven by the driving part to transfer the loading and conveying unit to load the substrate, when the substrate is unloaded, the unloading and conveying unit robot arm is driven by the driving part The unloading conveying unit is conveyed to unload the substrate.

In addition, the substrate transfer apparatus may further include a blocking unit robot that transfers the blocking unit, and the substrate processing method may be configured such that the blocking unit robot transfers the blocking unit by driving the driving unit. unit to bring the transfer unit into or out of the chamber.

In addition, the substrate transfer apparatus may further include a robot main body that supports the blocking unit robot arm for transfer, and the substrate processing method is configured such that the robot main body transfers the blocking unit by driving the driving unit. The blocking unit is brought into the chamber by breaking the unit, or the blocking unit is brought out of the chamber.

Also, the chamber may be configured to include a cooling portion for cooling the substrate, perform a substrate processing process on the substrate loaded into the chamber, and sequentially perform heating of the substrate by the heating portion heating treatment and cooling treatment of cooling the substrate by the cooling section.

In addition, the heating unit may be an upper heater provided on an upper portion of the chamber, and the blocking unit may be located on a lower side of the upper heater, and may be configured to block the upper side of the substrate and block the heat transfer between the substrate and the chamber.

According to the present invention, it is possible to provide a blocking unit for blocking the space between the substrate and the heating section by the blocking unit when loading and unloading the substrate by providing the blocking unit that blocks the heat transfer between the heating section and the substrate, Thus, the substrate transfer apparatus and substrate transfer method can minimize thermal deformation of the substrate and prevent damage to the substrate.

The structure and function of the preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

A first embodiment of a substrate transfer apparatus 200 according to the present invention and a substrate processing method using the same will be described with reference to FIGS. 1 to 11 .

The substrate transfer apparatus 200 according to the present invention includes: a robot main body 210 equipped with a driving part (not shown) for generating power; transfer units 221, 231 for supporting the substrate W for transfer; transfer unit robotic arms 220, 230, configured as a One side is fastened to the robot body 210, and the other side is connected with the conveying units 221, 231, so that the conveying units 221, 231 are conveyed by the driving of the driving part, and the substrate W is loaded to the chamber 100 for processing substrates or to unload the substrates W from the chamber 100; Between the heating part 120 and the substrate, heat transfer is blocked.

The driving of the chamber 100 and the substrate transfer apparatus 200 is controlled by the control unit.

The substrate W may be a silicon wafer corresponding to a semiconductor substrate. However, the present invention is not limited thereto, and the substrate W may be a transparent substrate such as glass used as a flat panel display device such as a liquid crystal display (LCD), a plasma display panel (PDP), or the like. The size of the shape of the substrate W is not limited to the drawings, and may have various shapes and sizes such as circular and quadrangular plates.

The chamber 100 may be a chamber for processing a substrate in which a thermal processing space S for thermally processing the substrate W is formed.

The chamber 100 may be configured to include: a door 111 to be opened and closed so that the transfer units 221 and 231 and the blocking unit 251 can enter and exit the chamber 100 when the substrates W are loaded or unloaded; the substrates The supporting part 150, where the substrate W is placed; the heating part 120; The lift drive unit 170.

The heating unit 120 may be an upper heater provided at an upper portion of the chamber 100 , and may be configured to supply heat to the upper surface of the substrate W through the heat treatment space S. The heating unit 120 may be configured in a lamp form that emits heating light, a plate form that incorporates a heater and radiates heat, or the like.

The cooling unit 160 is configured to cool the substrate W heated by the heating unit 120 to a temperature at which it can be unloaded. The substrate W supported by the substrate supporting portion 150 is provided. The cooling unit 160 may be configured to include a heat removal unit such as a cooling water passage (not shown) through which cooling water flows, or the like.

The substrate support portion 150 may be configured in such a manner that the substrate W is placed on the upper surface thereof, and the substrate W may be adsorbed to the substrate support portion 150 by a vacuum applied to the upper surface, thereby maintaining the substrate support portion 150. The placement state of the substrate W and the fixed position. In addition to the aforementioned vacuum suction method, the position fixation of the substrate W may also be modified and implemented by an electrostatic suction method such as an electrostatic chuck or the like.

The elevating drive unit 170 may be configured to include an elevating pin 171 and an elevating support unit 172 that are independently elevated and driven by driving of a motor, an air cylinder, or the like.

The lift pins 171 may be configured to support the substrate W from the lower side, and to be driven up and down to receive the substrate W from the conveyance units 221 and 231 and set it on the substrate support portion 150 or from the transfer unit 221 , 231 . The substrate support part 150 separates the substrate W and transfers it to the transfer units 221 and 231 .

The lift support portion 172 may be configured to support the substrate support portion 150 from below, and to be driven up and down so that the substrate support portion 150 in a state where the substrate W is placed is brought close to the heating portion 120 or brought closer to the heating portion 120 . Or contact the cooling part 160 .

The position of the substrate support portion 150 in the state where the substrate W is placed close to the heating portion 120 is referred to as the heating position a where the substrate W is heated, and the position close to or in contact with the cooling portion 160 is referred to as Cooling position b where the substrate W is cooled.

The lift pins 171 may be provided to vertically penetrate the substrate support portion 150 and the cooling portion 160 , and the lift support portion 172 may be provided to vertically penetrate the cooling portion 160 .

The robot body 210 may be configured to be rotated or moved by the driving of the driving portion, and may be configured to support the transfer units 221 and 231 , the transfer unit arms 220 and 230 and the blocking unit 251 . And the way of transfer constitutes.

The transfer unit robotic arms 220 and 230 may be configured to include at least one joint, and the at least one joint may be folded or unfolded, contracted or elongated by the driving of the driving part, and may be compatible with the robot body 210 . The fastening part of the rotary shaft rotates.

The transfer units 221 and 231 may be configured to support the substrate W from the lower side, or may be configured to be connected to the transfer unit robots 220 and 230 on one side with the substrate W as the center and the other side to the opposite side. The protruding fork shape can also be configured in various shapes and sizes such as a plate shape.

The transfer units 221 , 231 and the transfer unit arms 220 , 230 that transfer the same may be provided in a plurality of pairs, and may be configured to include unloading sections 221 , 220 configured using the unload transfer unit 221 and the unload transfer unit robot 220 and the loading parts 231 and 230 constituted by the loading and conveying unit 231 and the loading and conveying unit robot arm 230 .

Accordingly, it is possible to configure such that the processed substrates processed in the chamber 100 are unloaded from the chamber 100 by the unloading parts 221 , 220 , and the loading parts 231 , 230 The to-be-processed substrate to be processed is loaded into the chamber 100 .

The unloading parts 221, 220 and the loading parts 231, 230 may be implemented to be driven simultaneously or sequentially, and may be configured to be driven independently of each other.

In addition, the substrate transfer apparatus 200 may further include a blocking unit robot arm 250, one side is fastened to the robot body 210, and the other side is connected with the blocking unit 251, so that the blocking unit 251 can pass through all the The blocking unit 251 is transmitted to block the space between the heating part 120 and the substrate W by the driving of the driving part.

The blocking unit robotic arm 250 may be configured to include at least one joint like the transfer unit robotic arms 220, 230, and may be capable of folding or unfolding the at least one joint, contracting the at least one joint by the driving of the driving part. Alternatively, the robot body 210 is extended and rotated around the fastening portion fastened to the robot body 210 as a rotation axis.

The blocking unit robotic arm 250 and the conveying unit robotic arms 220 and 230 may be implemented to be driven simultaneously or sequentially, and may be configured to be driven independently of each other.

The blocking unit robot 250 may be configured to be disposed on the upper side of the transfer unit robots 220 and 230, so that when the substrate W is loaded or unloaded, the blocking unit 251 is positioned on the upper side of the substrate W The space between the heating portion 120 serving as the upper heater and the substrate W is blocked.

The blocking unit 251 can be made of materials with high heat resistance, chemical resistance and corrosion resistance, so as to withstand the high temperature environment inside the chamber 100 and not react with the process fluid supplied to the chamber 100 and the like. Deterioration or corrosion occurs, which affects the substrate processing process. As an example, silicon or stainless steel (SUS) can be used.

Also, the blocking unit 251 may be equipped with a horizontal area not smaller than the substrate W to more effectively block the heat transfer between the heating portion 120 and the substrate, preferably, may be equipped with larger than the horizontal area of the substrate W.

In addition, the substrate transfer apparatus 200 of the present invention can be realized by combining the blocking unit 251 and the blocking unit robot 250 with the existing substrate transfer apparatus, so that the cost of replacing the existing substrate transfer apparatus can be saved. .

FIG. 11 is a sequence diagram showing a substrate processing method using the substrate transfer apparatus 200 , and FIGS. 1 to 10 are diagrams showing respective substrate processing steps in the substrate processing method described in FIG. 11 .

As shown in FIG. 1 , the substrate processing step S10 is a step of opening the door 111 and bringing the blocking unit 251 into the chamber 100 .

As the blocking unit robot arm 250 is extended by the driving of the driving part, the blocking unit 251 can be brought into the chamber 100 and located on the upper side of the substrate supporting part 150 .

According to this step S10, since the blocking unit 251 is brought into the chamber 100 earlier than the substrate W, the substrate W and the substrate W can be effectively blocked during the execution of the later-described step S20. heat transfer between the heating parts 120 .

In addition, this step S10 may be performed at the same time as S20, which will be described later, so that the load transfer unit 231 and the blocking unit 251 are brought into the chamber 100 at the same time. In this case, during the transfer of the substrate W , the blocking unit 251 moves together on the upper side of the substrate W, so that the heat transfer from the heating part 120 can be blocked.

As shown in FIG. 2 , the substrate processing step S20 is a step of loading the substrate W.

According to this step S20, as the loading and conveying unit robot arm 230 is extended by the driving of the driving part, the loading and conveying unit 231 conveys the substrate W to be brought into the chamber 100, and at After the substrate W is transferred in such a manner that it is placed on the upper end of the lift pins 171 , the substrate W is brought out of the chamber 100 as the loading and conveying unit robot arm 230 is retracted.

At this time, the lift pins 171 are driven upward in a state of protruding from the upper surface of the substrate support portion 150 to support the lower end of the substrate W supported by the loading and conveying unit 231, thereby receiving the substrate W, At this time, the substrate support portion 150 may be in a state of being spaced apart from the cooling portion 160 upward by a predetermined distance due to the upward driving of the lift support portion 172 .

In addition, the loading and conveying unit 231 may be configured to be conveyed through the lower space of the blocking unit 251 to prevent the substrate W from being heated by the heating unit 120 .

As shown in FIG. 3 , the substrate processing step S30 is a step of placing the substrate W on the substrate support portion 150 .

According to this step S30 , the lift pins 171 are driven downward to place the substrate W on the upper surface of the substrate support portion 150 , and a vacuum is applied to the upper surface of the substrate support portion 150 to adsorb the substrate W.

The lift pins 171 may further descend after the substrate W is placed on the substrate support portion 150 so that the upper ends thereof are located inside the cooling portion 160 .

As shown in FIG. 4 , the substrate processing step S40 is a step in which the substrate W is located at the cooling position b, and the blocking unit 251 is brought out of the chamber 100 .

According to this step S40 , the lifting support portion 172 is driven downward to lower the substrate support portion 150 to be positioned at the cooling position b, thereby applying the cooling effect of the cooling portion 160 to the substrate W.

The blocking unit 251 may be brought out of the chamber 100 as the blocking unit robotic arm 250 is retracted after the substrate supporting part 150 reaches the cooling position b.

That is, the blocking unit 251 is configured to block the upper side in the vertical direction of the substrate W while the substrate W is brought into the chamber 100 and reaches the cooling position b, so that the substrate W can be blocked in the vertical direction. The heating by the heating unit 120 is blocked in a state where the cooling effect by the cooling unit 160 is not applied, and the substrate W can be prevented from being damaged such as thermal deformation.

And, if the blocking unit 251 is completely taken out of the chamber 100, the door 111 will be closed.

As shown in FIG. 5 , the substrate processing step S50 is a step of performing heat processing on the substrate W. As shown in FIG.

According to this step S50 , the lift supporting portion 172 is driven to lift the substrate supporting portion 150 to be positioned at the heating position a, thereby applying the heating effect by the heating portion 120 to the substrate W .

At this time, the process gas flows in through the gas supply part 140 at the upper end of the chamber 100 to be heated by the heating part 120 , and is sprayed into the heat treatment space S through the shower head 130 , so that the processing of the substrate W is performed. heat treatment process, for example, reflow process.

As shown in FIG. 6 , the substrate processing step S60 is a step of performing cooling processing on the substrate W. As shown in FIG.

According to this step S60 , the lift supporting portion 172 is driven to descend, so that the substrate supporting portion 150 is descended and positioned at the cooling position b, so that the cooling effect by the cooling portion 160 is applied to the substrate W, according to the This cools the substrate W heated by the heat treatment process of the step S50.

As shown in FIG. 7 , the substrate processing step S70 is a step of opening the door 111 and bringing the blocking unit 251 into the chamber 100 .

As the blocking unit arm 250 is extended by being driven by the driving part, the blocking unit 251 is brought into the chamber 100 and is arranged on the substrate at the cooling position b upper side of W.

According to this step S70 , by bringing the blocking unit 251 into the chamber 100 in a state where the substrate W is located at the cooling position b, it is possible to perform more The heat transfer between the substrate W and the heating part 120 is effectively blocked.

As shown in FIG. 8 , the substrate processing step S80 is a step in which the substrate support portion 150 is separated from the cooling position b.

According to this step S80 , the lift support portion 172 is driven upward to move the substrate support portion 150 upward to separate it from the cooling position b. Accordingly, after this step, the cooling portion 160 is cooled by the cooling portion 160 . The effect will not be applied to the substrate W.

As shown in FIG. 9 , the substrate processing step S90 is a step in which the substrate W is unloaded.

According to this step S90, as the unloading conveying unit mechanical arm 220 is stretched by the driving of the driving part, the unloading conveying unit 221 is brought into the interior of the chamber 100, and the unloading conveying unit 221 is lifted from the After the pins 171 receive and support the substrate W, the substrate W is transported along with the retraction of the unloading and transporting unit robot arm 220 , and is taken out of the chamber 100 .

At this time, the vacuum applied to the upper surface of the substrate support portion 150 is released, and the lift pins 171 are driven upward so as to protrude from the upper surface of the substrate support portion 150 to move the substrate support portion 150 and the substrate support portion 150 upward. The substrate W is spaced up and down, and the unloading conveying unit 221 moves between the substrate W and the substrate support portion 150 to support the lower end of the substrate W, so that the substrate W is received.

In addition, since the unloading conveying unit 221 is conveyed through the lower space of the blocking unit 251 , the substrate W can be prevented from being heated by the heating unit 120 .

In addition, this step S90 may be performed simultaneously with S100 described later, and the unloading conveying unit 221 and the blocking unit 251 may be taken out from the chamber 100 at the same time. In this case, during the conveying of the substrate W , since the blocking unit 251 moves together on the upper side of the substrate W, the heat transfer from the heating part 120 can be blocked.

As shown in FIG. 10 , the substrate processing step S100 is a step of taking out the blocking device 51 from the chamber 100 .

The blocking unit 251 is brought out of the chamber 100 by the driving of the driving part along with the contraction of the blocking unit mechanical arm 250 .

That is, when the blocking unit 251 is configured to block the upper side in the vertical direction of the substrate W while the substrate W is separated from the cooling position b and completely taken out of the chamber 100, the substrate W can The W is blocked from passing through the heating section 120 and heated in a state where the cooling effect of the cooling section 160 cannot be obtained, and the substrate W can be prevented from being damaged such as thermal deformation.

In addition, the load transfer unit 231 and the blocking unit 251 may be brought into the chamber 100 at the same time. In this case, during the transfer of the substrate W, the blocking unit 251 may be The upper side of the substrate W moves together, thereby blocking heat transfer from the heating portion 120 .

In addition, in the case where the chamber 100 successively performs a plurality of substrate processing processes, the step S100 may not be performed after the step S90 is performed, but the steps S20 to S90 may be performed repeatedly.

At this time, the blocking unit 251 may be brought into the chamber 100 before the processed substrate is separated from the cooling position b as described in the step S70, and the steps are sequentially performed. After maintaining the position during S80 and S90 and the steps S20 and S30, as described in the step S40, when the substrate to be processed brought into the chamber 100 reaches the cooling position b will be taken out of the chamber 100 .

Also, the step S90 and the step S20 may be performed simultaneously.

A second embodiment of the substrate transfer apparatus 200 according to the present invention will be described with reference to FIG. 12 .

The substrate transfer apparatus 200 according to the second embodiment follows the configuration of the substrate transfer apparatus 200 (refer to FIGS. 1 to 10 ) according to the first embodiment described above, and is equipped with the unloading parts 221 , 220 and the loading parts 231 , 230 in place of the unloading parts 221 , 220 and the loading parts 231 , 230 . The difference is that the pair of transfer unit robot arms 240 and the transfer unit 241 perform loading and unloading of the substrate W in sequence.

According to the present second embodiment, the blocking unit 251 may be configured to be brought into the chamber 100 before the processed substrate is separated from the cooling position b, and to be removed by the transfer unit robot 240 and the transfer unit 241 before being separated from the cooling position b. The corresponding positions are maintained during the unloading of the processed substrates and the loading of the substrates to be processed in sequence, and then, if the substrates to be processed reach the cooling position b, they are taken out of the chamber 100 .

A third embodiment of the substrate transfer apparatus 200 according to the present invention will be described with reference to FIG. 13 .

The substrate transfer apparatus 200 according to the third embodiment follows the configuration of the substrate transfer apparatus 200 according to the above-described first embodiment (refer to FIGS. 1 to 10 ), but is fastened to the side configured as the blocking unit 261 . There is a difference in that the robot body 210 moves together with the robot body 210 .

According to the third embodiment, the blocking unit 261 is brought into the chamber 100 as the robot body 210 moves in the direction of the chamber 100 , and moves in the opposite direction along with the robot body 210 . Move away from the chamber so that it can be brought out of the chamber 100 .

As explained above, the present invention is not limited to the above-mentioned embodiments, and can be implemented by those having ordinary knowledge in the technical field of the present invention without departing from the technical idea of the present invention. Obviously, modifications and implementations belong to the present invention. range.

100: Chamber 111: Door 120: Heating Department 130: shower head 140: Gas Supply Department 150: Substrate support part 160: Cooling Department 170: Lifting drive part 171: Lifting pin 172: Lifting support part 200: Substrate transfer device 210: Robot body 220: Unloading conveyor unit robotic arm of unloading department 221: Unloading conveying unit of unloading department 230: Loading and conveying unit robotic arm of the loading department 231: Loading and conveying unit of the loading section 240:Transfer unit robotic arm 241: Transmission unit 250: Blocking unit robotic arm 251: Blocking Unit 261: Blocking Unit W: substrate S: heat treatment space a: heating position b: cooling position S10-S100: Steps

1 is an operational state diagram showing a step of bringing in a blocking unit before loading a substrate in a substrate processing method using a substrate transfer apparatus according to a first embodiment of the present invention. 2 is an operational state diagram showing a step of loading a substrate in the substrate processing method using the substrate transfer apparatus according to the first embodiment of the present invention. 3 is an operational state diagram showing a step in which a substrate is placed on a substrate support portion in the substrate processing method using the substrate transfer apparatus according to the first embodiment of the present invention. 4 is an operational state diagram showing steps in which the substrate is moved to a cooling position and the blocking unit is brought out in the substrate processing method using the substrate transfer apparatus according to the first embodiment of the present invention. 5 is an operational state diagram showing a step of performing a heating process of a substrate by moving a substrate to a heating position in the substrate processing method using the substrate transfer apparatus according to the first embodiment of the present invention. 6 is an operational state diagram showing a step in which a substrate is moved to a cooling position to perform a cooling process of the substrate in the substrate processing method using the substrate transfer apparatus according to the first embodiment of the present invention. 7 is an operational state diagram showing a step of bringing in a blocking unit before unloading the substrate in the substrate processing method using the substrate transfer apparatus according to the first embodiment of the present invention. 8 is an operational state diagram showing a step of separating the substrate from the cooling position in the substrate processing method using the substrate transfer apparatus according to the first embodiment of the present invention. 9 is an operation state diagram showing a step of unloading the substrate in the substrate processing method using the substrate transfer apparatus according to the first embodiment of the present invention. 10 is an operation state diagram showing a step of bringing out the blocking unit in the substrate processing method using the substrate transfer apparatus according to the first embodiment of the present invention. 11 is a sequence diagram illustrating a substrate processing method using the substrate transfer apparatus according to the first embodiment of the present invention. 12 is an operational state diagram showing a step of bringing in a blocking unit before loading a substrate in the substrate processing method using the substrate transfer apparatus according to the second embodiment of the present invention. 13 is an operational state diagram showing a step of bringing in a blocking unit before loading a substrate in a substrate processing method using the substrate transfer apparatus according to the second embodiment of the present invention.

100: Chamber

111: Door

120: Heating Department

130: shower head

140: Gas Supply Department

150: Substrate support part

160: Cooling Department

170: Lifting drive part

171: Lifting pin

172: Lifting support part

200: Substrate transfer device

210: Robot body

220: Unloading conveyor unit robotic arm of unloading department

221: Unloading conveying unit of unloading department

230: Loading and conveying unit robotic arm of the loading department

231: Loading and conveying unit of the loading section

250: Blocking unit robotic arm

251: Blocking Unit

S: heat treatment space

Claims (18)

A substrate transfer device, comprising: a robot body equipped with a driving part that generates power; a transfer unit that supports a substrate for transfer; a transfer unit robot arm configured to be fastened to the robot body on one side and connected to the robot body on the other side a conveying unit that conveys the conveying unit according to the driving of the driving part, thereby loading the substrate into or unloading the substrate from the chamber for processing the substrate; and a blocking unit, when loading or unloading the substrate, It is brought into the interior of the chamber to block the heat transfer between the heating portion of the substrate that heats the interior of the chamber and the substrate. The substrate transfer apparatus of claim 1, further comprising: a blocking unit robot arm, one side is fastened to the robot body, the other side is connected with the blocking unit, and is transported according to the driving of the driving part The blocking unit blocks between the heating part and the substrate. The substrate transfer apparatus according to claim 2, wherein the transfer unit robot arm and the blocking unit robot arm are configured to be driven independently of each other. The substrate transfer apparatus according to claim 1, wherein the transfer unit robot arm comprises: an unload transfer unit robot arm to which an unload transfer unit is connected, and the unload transfer unit supports the processed substrates processed inside the chamber to unloading it from the chamber; and a load transfer unit robot to which a load transfer unit is connected, the load transfer unit supports the substrates to be processed to be processed inside the chamber to be loaded into the chamber. The substrate transfer apparatus of claim 1, wherein when the substrate is loaded, the blocking unit is brought into the chamber before the substrate is brought into the interior of the chamber, and when the substrate is unloaded, the blocking unit The unit is taken out of the chamber after the substrate is taken out of the chamber. The substrate transfer apparatus according to claim 5, wherein the chamber is equipped with a cooling portion that cools the substrate, and when the substrate is loaded, the blocking unit is blocked if the substrate reaches a cooling position adjacent to the cooling portion. The chamber is brought out, and when the substrate is unloaded, the blocking unit is brought into the chamber before the substrate is separated from the cooling position. The substrate transfer apparatus according to claim 1, wherein the heating unit is an upper heater provided on an upper portion of the chamber, and the blocking unit is configured to be located in the chamber in a state where at least a part of the substrate is located inside the chamber The upper side of the substrate is blocked between the substrate and the upper heater. The substrate transfer apparatus according to claim 1, wherein the blocking unit is configured such that one side is fastened to the robot body to move together with the robot body. A substrate processing method, comprising the steps of: blocking between a heating part inside the chamber and a substrate by a blocking unit brought into the chamber, so that heat transfer from the heating part to the substrate is blocked In the state, the loading of the substrate is performed; and the space between the heating portion and the substrate inside the chamber is blocked by the blocking unit brought into the chamber, thereby transferring heat from the heating portion to the substrate. In the blocked state, unloading of the substrate is performed. The substrate processing method according to claim 9, wherein the blocking unit is provided in a substrate conveying device that supports and conveys the substrate, the substrate processing method further comprising the step of: driving the substrate conveying device to drive the substrate conveying device. The blocking unit is brought into the chamber; and the blocking unit is brought out of the chamber by the driving of the driving part of the substrate transfer device. The substrate processing method of claim 9, wherein the step of bringing the blocking unit into the chamber further comprises the step of bringing the blocking unit into the chamber before the substrate is brought into the chamber , the step of taking out the blocking unit from the chamber further includes the step of taking out the blocking unit from the chamber after the substrate is taken out of the chamber. The substrate processing method according to claim 11, wherein the chamber is provided with a cooling part for cooling the substrate, the step of taking out the blocking unit from the chamber further includes if the substrate reaches a cooling part adjacent to the cooling part cooling position, the step of bringing the blocking unit out of the chamber, the step of bringing the blocking unit into the chamber further comprises bringing the blocking unit into the chamber before the substrate is separated from the cooling position Chamber steps. The substrate processing method of claim 10, wherein the substrate transfer device comprises: a transfer unit that supports the substrate for transfer; and a transfer unit robot arm that transfers the transfer unit, the steps of loading the substrate and the step of unloading the substrate, respectively It includes the step of conveying the conveying unit by the conveying unit robot arm driven by the driving part. The substrate processing method of claim 13, wherein the transfer unit and the transfer unit robot include: an unloading section including the unloading transfer unit and the unloading transfer unit robot arm; and a loading section including the loading transfer unit and the loading transfer unit machine The arm is constituted, the step of loading the substrate includes the step of the loading and conveying unit robot arm transferring the loading and conveying unit to load the substrate by the driving of the driving part, and the step of unloading the substrate includes the unloading and conveying unit robot arm passing through the driving part. The step of driving and conveying the unloading conveying unit to unload the substrate. The substrate processing method according to claim 13, wherein the substrate transfer device further comprises: a blocking unit robotic arm to transport the blocking unit, the step of bringing in the blocking unit and the step of taking out the blocking unit respectively comprise: The blocking unit robot arm transmits the blocking unit through the driving of the driving part. The substrate processing method according to claim 15, wherein the substrate transfer device further comprises: a robot body, a robot body supporting the blocking unit robotic arm for transfer, a step of bringing in the blocking unit and a step of taking out the blocking unit The steps of transmitting the blocking unit through the driving of the driving part by the robot body are respectively included. The substrate processing method according to claim 9, wherein the chamber is equipped with a cooling section for cooling the substrate, the substrate loading method sequentially performs the steps of performing a substrate processing process on the substrate loaded into the chamber and by A heating process in which the heating unit heats the substrate and a cooling process in which the cooling unit cools the substrate. The substrate processing method according to claim 10, wherein the heating part is an upper heater provided on an upper portion of the chamber, and the substrate loading method comprises the steps of: positioning the blocking unit on the lower side of the upper heater, The upper side of the substrate is blocked to block heat transfer between the substrate and the chamber.

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