TWI773753B - 用於半導體處理期間之微波空腔中均勻熱分布的方法及設備 - Google Patents

用於半導體處理期間之微波空腔中均勻熱分布的方法及設備 Download PDF

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TWI773753B
TWI773753B TW107114980A TW107114980A TWI773753B TW I773753 B TWI773753 B TW I773753B TW 107114980 A TW107114980 A TW 107114980A TW 107114980 A TW107114980 A TW 107114980A TW I773753 B TWI773753 B TW I773753B
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Taiwan
Prior art keywords
microwave
cavity
phase shifter
signals
microwave signal
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TW107114980A
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English (en)
Chinese (zh)
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TW201907506A (zh
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皮瑞森 羅
丹尼斯 伊凡諾夫
安恩克斯納 朱普迪
岳生 歐
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美商應用材料股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/6402—Aspects relating to the microwave cavity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/66—Circuits
    • H05B6/664—Aspects related to the power supply of the microwave heating apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/705—Feed lines using microwave tuning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/707—Feed lines using waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/80—Apparatus for specific applications
    • H05B6/806—Apparatus for specific applications for laboratory use
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Toxicology (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW107114980A 2017-05-03 2018-05-03 用於半導體處理期間之微波空腔中均勻熱分布的方法及設備 TWI773753B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762500609P 2017-05-03 2017-05-03
US62/500,609 2017-05-03
US15/966,211 US20180323091A1 (en) 2017-05-03 2018-04-30 Method and apparatus for uniform thermal distribution in a microwave cavity during semiconductor processing
US15/966,211 2018-04-30

Publications (2)

Publication Number Publication Date
TW201907506A TW201907506A (zh) 2019-02-16
TWI773753B true TWI773753B (zh) 2022-08-11

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TW107114980A TWI773753B (zh) 2017-05-03 2018-05-03 用於半導體處理期間之微波空腔中均勻熱分布的方法及設備

Country Status (6)

Country Link
US (1) US20180323091A1 (https=)
JP (1) JP7289267B2 (https=)
KR (1) KR102540168B1 (https=)
CN (1) CN110663108B (https=)
TW (1) TWI773753B (https=)
WO (1) WO2018204576A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112235003B (zh) * 2020-10-13 2022-01-14 大连海事大学 一种用于改变场分布的双路宽带信号装置
TWI834016B (zh) 2020-12-16 2024-03-01 財團法人工業技術研究院 頻率可重組相位陣列系統及其執行的材料處理方法
TWI820537B (zh) * 2021-04-26 2023-11-01 財團法人工業技術研究院 微波加熱方法與微波加熱裝置
TWI786015B (zh) * 2022-04-22 2022-12-01 宏碩系統股份有限公司 單源微波加熱裝置
DE102022127931A1 (de) * 2022-10-21 2024-05-02 TRUMPF Hüttinger GmbH + Co. KG Werkstückbehandlungsvorrichtung zur Behandlung eines Werkstücks mit einer Mikrowelle und Verfahren zur Behandlung des Werkstücks mit der Mikrowelle
JP2024099858A (ja) * 2023-01-13 2024-07-26 株式会社Kokusai Electric 基板処理装置、基板処理方法、半導体装置の製造方法およびプログラム
US20250027202A1 (en) * 2023-07-21 2025-01-23 Applied Materials, Inc. Methods of adjusting uniformity, and related apparatus and systems, for semiconductor manufacturing

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US20130008896A1 (en) * 2010-03-19 2013-01-10 Panasonic Corporation Microwave heating apparatus
US20140042152A1 (en) * 2012-08-08 2014-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Variable frequency microwave device and method for rectifying wafer warpage
CN104620354A (zh) * 2012-06-27 2015-05-13 新意技术股份有限公司 基板加热装置及处理腔室
US20150156827A1 (en) * 2012-07-02 2015-06-04 Goji Limited Rf energy application based on electromagnetic feedback
EP3151636A1 (en) * 2014-05-28 2017-04-05 Guangdong Midea Kitchen Appliances Manufacturing Co., Ltd. Semiconductor microwave oven and semiconductor microwave source thereof

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CA1053760A (en) * 1976-12-30 1979-05-01 Thomas E. Hester Power controller for microwave magnetron
JPS5830687B2 (ja) * 1977-03-16 1983-06-30 松下電器産業株式会社 調理器
JP3957135B2 (ja) * 2000-10-13 2007-08-15 東京エレクトロン株式会社 プラズマ処理装置
JP3839395B2 (ja) * 2002-11-22 2006-11-01 株式会社エーイーティー マイクロ波プラズマ発生装置
JP5064924B2 (ja) * 2006-08-08 2012-10-31 パナソニック株式会社 マイクロ波処理装置
JP2008060016A (ja) * 2006-09-04 2008-03-13 Matsushita Electric Ind Co Ltd マイクロ波利用装置
JP5167678B2 (ja) * 2007-04-16 2013-03-21 パナソニック株式会社 マイクロ波処理装置
JP2010073383A (ja) * 2008-09-17 2010-04-02 Panasonic Corp マイクロ波加熱装置
CN103533690A (zh) * 2012-07-05 2014-01-22 Nxp股份有限公司 自动调整工作频率的微波功率源和方法
JP2014032744A (ja) * 2012-08-01 2014-02-20 Panasonic Corp マイクロ波加熱装置
CN105120549B (zh) * 2015-09-02 2018-05-01 广东美的厨房电器制造有限公司 微波加热系统及其半导体功率源和加热控制方法

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US20130008896A1 (en) * 2010-03-19 2013-01-10 Panasonic Corporation Microwave heating apparatus
CN104620354A (zh) * 2012-06-27 2015-05-13 新意技术股份有限公司 基板加热装置及处理腔室
US20150156827A1 (en) * 2012-07-02 2015-06-04 Goji Limited Rf energy application based on electromagnetic feedback
US20140042152A1 (en) * 2012-08-08 2014-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Variable frequency microwave device and method for rectifying wafer warpage
EP3151636A1 (en) * 2014-05-28 2017-04-05 Guangdong Midea Kitchen Appliances Manufacturing Co., Ltd. Semiconductor microwave oven and semiconductor microwave source thereof

Also Published As

Publication number Publication date
JP2020521275A (ja) 2020-07-16
KR20190138317A (ko) 2019-12-12
JP7289267B2 (ja) 2023-06-09
KR102540168B1 (ko) 2023-06-02
WO2018204576A1 (en) 2018-11-08
US20180323091A1 (en) 2018-11-08
CN110663108B (zh) 2024-03-12
CN110663108A (zh) 2020-01-07
TW201907506A (zh) 2019-02-16

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