TWI772549B - 兩面曝光裝置及兩面曝光方法 - Google Patents

兩面曝光裝置及兩面曝光方法 Download PDF

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Publication number
TWI772549B
TWI772549B TW107138121A TW107138121A TWI772549B TW I772549 B TWI772549 B TW I772549B TW 107138121 A TW107138121 A TW 107138121A TW 107138121 A TW107138121 A TW 107138121A TW I772549 B TWI772549 B TW I772549B
Authority
TW
Taiwan
Prior art keywords
mask
calibration
substrate
mark
exposure
Prior art date
Application number
TW107138121A
Other languages
English (en)
Chinese (zh)
Other versions
TW201933432A (zh
Inventor
名古屋淳
Original Assignee
日商亞多特克工程股份有限公司
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Filing date
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Application filed by 日商亞多特克工程股份有限公司 filed Critical 日商亞多特克工程股份有限公司
Publication of TW201933432A publication Critical patent/TW201933432A/zh
Application granted granted Critical
Publication of TWI772549B publication Critical patent/TWI772549B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2032—Simultaneous exposure of the front side and the backside
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Indication In Cameras, And Counting Of Exposures (AREA)
  • Separation By Low-Temperature Treatments (AREA)
TW107138121A 2017-10-31 2018-10-29 兩面曝光裝置及兩面曝光方法 TWI772549B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-210654 2017-10-31
JP2017210654A JP6994806B2 (ja) 2017-10-31 2017-10-31 両面露光装置及び両面露光方法

Publications (2)

Publication Number Publication Date
TW201933432A TW201933432A (zh) 2019-08-16
TWI772549B true TWI772549B (zh) 2022-08-01

Family

ID=66295507

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107138121A TWI772549B (zh) 2017-10-31 2018-10-29 兩面曝光裝置及兩面曝光方法

Country Status (4)

Country Link
JP (1) JP6994806B2 (ko)
KR (2) KR102622294B1 (ko)
CN (2) CN117806134A (ko)
TW (1) TWI772549B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7458950B2 (ja) * 2020-09-23 2024-04-01 株式会社Ｓｃｒｅｅｎホールディングス 描画システム
CN114518695B (zh) * 2020-11-20 2024-09-17 源卓微纳科技(苏州)股份有限公司 一种双面曝光系统的校正方法和曝光方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000099158A (ja) * 1998-09-18 2000-04-07 Orc Mfg Co Ltd ワークとマスクの整合機構および整合方法
TW200720855A (en) * 2005-10-25 2007-06-01 San Ei Giken Inc Exposure method and exposure apparatus
TW201107903A (en) * 2009-08-28 2011-03-01 Ushio Electric Inc Two-side exposure device
TW201411296A (zh) * 2012-09-13 2014-03-16 Nippon Mektron Kk 光掩模、光掩模組、曝光裝置以及曝光方法
TW201617736A (zh) * 2014-11-11 2016-05-16 Beac Co Ltd 曝光裝置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2600027B2 (ja) * 1991-05-16 1997-04-16 日立テクノエンジニアリング株式会社 画像位置合わせ方法およびその装置
JPH08160542A (ja) * 1994-12-02 1996-06-21 Nippon Seiko Kk 露光装置
JP2000155430A (ja) 1998-11-24 2000-06-06 Nsk Ltd 両面露光装置における自動アライメント方法
JP2005121959A (ja) * 2003-10-17 2005-05-12 Pentax Corp 両面露光装置
JP2006278648A (ja) 2005-03-29 2006-10-12 Nsk Ltd 両面露光方法
JP2012089723A (ja) * 2010-10-21 2012-05-10 Ushio Inc コンタクト露光方法および装置
JP5997409B1 (ja) 2016-05-26 2016-09-28 株式会社 ベアック 両面露光装置及び両面露光装置におけるマスクとワークとの位置合わせ方法
JP7378910B2 (ja) 2017-10-31 2023-11-14 株式会社アドテックエンジニアリング 両面露光装置及び両面露光方法
JP7412872B2 (ja) 2017-10-31 2024-01-15 株式会社アドテックエンジニアリング 両面露光装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000099158A (ja) * 1998-09-18 2000-04-07 Orc Mfg Co Ltd ワークとマスクの整合機構および整合方法
TW200720855A (en) * 2005-10-25 2007-06-01 San Ei Giken Inc Exposure method and exposure apparatus
TW201107903A (en) * 2009-08-28 2011-03-01 Ushio Electric Inc Two-side exposure device
TW201411296A (zh) * 2012-09-13 2014-03-16 Nippon Mektron Kk 光掩模、光掩模組、曝光裝置以及曝光方法
TW201617736A (zh) * 2014-11-11 2016-05-16 Beac Co Ltd 曝光裝置

Also Published As

Publication number Publication date
CN109725502B (zh) 2024-02-06
CN109725502A (zh) 2019-05-07
JP6994806B2 (ja) 2022-01-14
KR20240005244A (ko) 2024-01-11
KR20190049563A (ko) 2019-05-09
CN117806134A (zh) 2024-04-02
TW201933432A (zh) 2019-08-16
KR102622294B1 (ko) 2024-01-08
JP2019082612A (ja) 2019-05-30

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