TWI768011B - 研磨方法及研磨裝置 - Google Patents

研磨方法及研磨裝置 Download PDF

Info

Publication number
TWI768011B
TWI768011B TW107109584A TW107109584A TWI768011B TW I768011 B TWI768011 B TW I768011B TW 107109584 A TW107109584 A TW 107109584A TW 107109584 A TW107109584 A TW 107109584A TW I768011 B TWI768011 B TW I768011B
Authority
TW
Taiwan
Prior art keywords
substrate
pressing
inclination
substrate holding
polishing
Prior art date
Application number
TW107109584A
Other languages
English (en)
Chinese (zh)
Other versions
TW201838017A (zh
Inventor
杜峯杰
柏木誠
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201838017A publication Critical patent/TW201838017A/zh
Application granted granted Critical
Publication of TWI768011B publication Critical patent/TWI768011B/zh

Links

Images

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Disintegrating Or Milling (AREA)
TW107109584A 2017-03-30 2018-03-21 研磨方法及研磨裝置 TWI768011B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-068444 2017-03-30
JP2017068444 2017-03-30
JP2018-009755 2018-01-24
JP2018009755A JP7107688B2 (ja) 2017-03-30 2018-01-24 研磨方法および研磨装置

Publications (2)

Publication Number Publication Date
TW201838017A TW201838017A (zh) 2018-10-16
TWI768011B true TWI768011B (zh) 2022-06-21

Family

ID=64108095

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107109584A TWI768011B (zh) 2017-03-30 2018-03-21 研磨方法及研磨裝置

Country Status (2)

Country Link
JP (1) JP7107688B2 (enrdf_load_stackoverflow)
TW (1) TWI768011B (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7235587B2 (ja) * 2019-05-14 2023-03-08 株式会社ディスコ 荷重センサの電圧調整方法
JP7278153B2 (ja) * 2019-06-04 2023-05-19 東京エレクトロン株式会社 基板加工装置、および基板加工方法
CN111922880A (zh) * 2020-09-09 2020-11-13 昆山欣建群精密工业有限公司 一种零件加工用抛光装置
CN112720246A (zh) * 2020-12-29 2021-04-30 安徽省旌德旌峰机械制造有限公司 一种基于气动控制机械加工用研磨设备
CN113488428A (zh) * 2021-06-04 2021-10-08 拓荆科技股份有限公司 一种晶圆载台垂直和水平位置的调节装置及其调节方法
JP2023127044A (ja) * 2022-03-01 2023-09-13 株式会社荏原製作所 研磨ヘッドおよび研磨装置
CN115502854A (zh) * 2022-09-14 2022-12-23 舟山中远海运重工有限公司 一种高压弥雾船舶除锈设备
CN120303085A (zh) * 2022-12-02 2025-07-11 株式会社荏原制作所 基板处理方法、处理头及基板处理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0985619A (ja) * 1995-05-26 1997-03-31 Tokyo Seimitsu Co Ltd 表面研削方法及びその装置
JP2005022059A (ja) * 2003-07-02 2005-01-27 Ebara Corp 研削盤及び研削方法
US20090124174A1 (en) * 2007-11-12 2009-05-14 Dai Fukushima Substrate treating method and substrate treating apparatus
US20140370794A1 (en) * 2012-05-31 2014-12-18 Ebara Corporation Polishing apparatus
TW201624555A (zh) * 2014-08-21 2016-07-01 荏原製作所股份有限公司 研磨方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5268599B2 (ja) 2008-12-03 2013-08-21 株式会社ディスコ 研削装置および研削方法
JP6344950B2 (ja) 2014-03-31 2018-06-20 株式会社荏原製作所 研磨装置及び研磨方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0985619A (ja) * 1995-05-26 1997-03-31 Tokyo Seimitsu Co Ltd 表面研削方法及びその装置
JP2005022059A (ja) * 2003-07-02 2005-01-27 Ebara Corp 研削盤及び研削方法
US20090124174A1 (en) * 2007-11-12 2009-05-14 Dai Fukushima Substrate treating method and substrate treating apparatus
US20140370794A1 (en) * 2012-05-31 2014-12-18 Ebara Corporation Polishing apparatus
TW201624555A (zh) * 2014-08-21 2016-07-01 荏原製作所股份有限公司 研磨方法

Also Published As

Publication number Publication date
TW201838017A (zh) 2018-10-16
JP7107688B2 (ja) 2022-07-27
JP2018171698A (ja) 2018-11-08

Similar Documents

Publication Publication Date Title
TWI768011B (zh) 研磨方法及研磨裝置
US9108292B2 (en) Method of obtaining a sliding distance distribution of a dresser on a polishing member, method of obtaining a sliding vector distribution of a dresser on a polishing member, and polishing apparatus
US8965555B2 (en) Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus
US6551179B1 (en) Hard polishing pad for chemical mechanical planarization
KR20180097136A (ko) 기판의 연마 장치 및 연마 방법
TWI645936B (zh) Polishing pad for grinding a workpiece, chemical mechanical polishing device and method for polishing the same using the chemical mechanical polishing device
JP6887846B2 (ja) 研削装置
KR20040041042A (ko) 피봇기구를 구비한 수직방향으로 조정가능한 화학적기계적 폴리싱 헤드 및 그 사용방법
JP6348856B2 (ja) 研削加工装置
KR20200096152A (ko) 측정 지그
JP2013004726A (ja) 板状物の加工方法
KR20210100014A (ko) 기판 처리 장치 및 기판 처리 방법
JPH0899265A (ja) 研磨装置
JP2005022059A (ja) 研削盤及び研削方法
TWI835947B (zh) 虛擬盤、修整盤以及使用虛擬盤的表面高度測定方法
JP2015023113A (ja) 半導体基板の平坦化研削加工方法
WO2018180170A1 (ja) 研磨方法および研磨装置
JP2021058952A (ja) 研削装置
CN110193774A (zh) 加工装置
JP2016020017A (ja) 研削ユニット及び研削処理装置
CN116475934B (zh) 静压垫、研磨设备及硅片
JP7431048B2 (ja) 加工装置、及び加工装置に用いる支持部
JP7735084B2 (ja) 基板処理装置および基板処理方法
JP2000288908A (ja) 研磨装置及び研磨方法
JPH10180613A (ja) ポリッシング装置