TWI767967B - 用於半導體檢測之方法及系統 - Google Patents

用於半導體檢測之方法及系統 Download PDF

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Publication number
TWI767967B
TWI767967B TW106144699A TW106144699A TWI767967B TW I767967 B TWI767967 B TW I767967B TW 106144699 A TW106144699 A TW 106144699A TW 106144699 A TW106144699 A TW 106144699A TW I767967 B TWI767967 B TW I767967B
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Taiwan
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pattern
pattern type
instances
identify
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TW106144699A
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English (en)
Chinese (zh)
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TW201838054A (zh
Inventor
安德魯 克羅斯
艾倫 派克
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美商克萊譚克公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/266—Measurement of magnetic or electric fields in the object; Lorentzmicroscopy
    • H01J37/268—Measurement of magnetic or electric fields in the object; Lorentzmicroscopy with scanning beams
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Image Analysis (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW106144699A 2016-12-21 2017-12-20 用於半導體檢測之方法及系統 TWI767967B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201662437585P 2016-12-21 2016-12-21
US62/437,585 2016-12-21
US15/729,458 US10262831B2 (en) 2016-12-21 2017-10-10 Method and system for weak pattern quantification
US15/729,458 2017-10-10

Publications (2)

Publication Number Publication Date
TW201838054A TW201838054A (zh) 2018-10-16
TWI767967B true TWI767967B (zh) 2022-06-21

Family

ID=62561935

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TW106144699A TWI767967B (zh) 2016-12-21 2017-12-20 用於半導體檢測之方法及系統

Country Status (6)

Country Link
US (1) US10262831B2 (enExample)
JP (1) JP6934944B2 (enExample)
KR (1) KR102312239B1 (enExample)
CN (1) CN110402485B (enExample)
TW (1) TWI767967B (enExample)
WO (1) WO2018118805A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3290911A1 (en) * 2016-09-02 2018-03-07 ASML Netherlands B.V. Method and system to monitor a process apparatus
US11550309B2 (en) * 2019-01-08 2023-01-10 Kla Corporation Unsupervised defect segmentation
KR20220093915A (ko) 2020-12-28 2022-07-05 삼성전자주식회사 반도체 집적회로 레이아웃의 확률적 취약점 검출 방법 및 이를 수행하는 컴퓨터 시스템
US12235224B2 (en) 2021-12-08 2025-02-25 Kla Corporation Process window qualification modulation layouts
CN116228773B (zh) * 2023-05-09 2023-08-04 华芯程(杭州)科技有限公司 一种晶圆检测机台的量测数据校准方法、装置及设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW471016B (en) * 1999-11-12 2002-01-01 Applied Materials Inc Defect detection using gray level signatures
JP2005259830A (ja) * 2004-03-10 2005-09-22 Hitachi High-Technologies Corp 半導体デバイスのパターン形状評価方法及びその装置
TW201430338A (zh) * 2010-04-09 2014-08-01 東芝股份有限公司 用以檢驗圖案之線寬及／或位置錯誤之方法
TW201532167A (zh) * 2014-01-16 2015-08-16 Kla Tencor Corp 藉由利用交替失效模式之標稱特性之圖案失效發現
US20160284579A1 (en) * 2015-03-23 2016-09-29 Applied Materials Israel Ltd. Process window analysis

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7711514B2 (en) * 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
JP2008147679A (ja) * 2007-12-17 2008-06-26 Hitachi Ltd 電子線応用装置
JP5075646B2 (ja) 2008-01-09 2012-11-21 株式会社日立ハイテクノロジーズ 半導体欠陥検査装置ならびにその方法
KR20120066158A (ko) * 2010-12-14 2012-06-22 삼성전자주식회사 테스트 방법 및 이를 수행하기 위한 장치
JP6078234B2 (ja) * 2012-04-13 2017-02-08 株式会社日立ハイテクノロジーズ 荷電粒子線装置
JP5478681B2 (ja) * 2012-08-24 2014-04-23 株式会社日立ハイテクノロジーズ 半導体欠陥検査装置ならびにその方法
JP2015060667A (ja) 2013-09-17 2015-03-30 国能科技創新有限公司 空気電池、空気電池用負極及び空気電池ユニット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW471016B (en) * 1999-11-12 2002-01-01 Applied Materials Inc Defect detection using gray level signatures
JP2005259830A (ja) * 2004-03-10 2005-09-22 Hitachi High-Technologies Corp 半導体デバイスのパターン形状評価方法及びその装置
TW201430338A (zh) * 2010-04-09 2014-08-01 東芝股份有限公司 用以檢驗圖案之線寬及／或位置錯誤之方法
TW201532167A (zh) * 2014-01-16 2015-08-16 Kla Tencor Corp 藉由利用交替失效模式之標稱特性之圖案失效發現
US20160284579A1 (en) * 2015-03-23 2016-09-29 Applied Materials Israel Ltd. Process window analysis

Also Published As

Publication number Publication date
JP2020504443A (ja) 2020-02-06
WO2018118805A1 (en) 2018-06-28
JP6934944B2 (ja) 2021-09-15
KR20190090035A (ko) 2019-07-31
US20180174797A1 (en) 2018-06-21
CN110402485B (zh) 2020-10-27
US10262831B2 (en) 2019-04-16
TW201838054A (zh) 2018-10-16
KR102312239B1 (ko) 2021-10-12
CN110402485A (zh) 2019-11-01

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