TWI767211B - Chip detachment apparatus - Google Patents

Chip detachment apparatus Download PDF

Info

Publication number
TWI767211B
TWI767211B TW109112709A TW109112709A TWI767211B TW I767211 B TWI767211 B TW I767211B TW 109112709 A TW109112709 A TW 109112709A TW 109112709 A TW109112709 A TW 109112709A TW I767211 B TWI767211 B TW I767211B
Authority
TW
Taiwan
Prior art keywords
hole
accommodating space
pushed
stage
push
Prior art date
Application number
TW109112709A
Other languages
Chinese (zh)
Other versions
TW202143356A (en
Inventor
李威達
李辰達
Original Assignee
竑昇國際科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 竑昇國際科技有限公司 filed Critical 竑昇國際科技有限公司
Priority to TW109112709A priority Critical patent/TWI767211B/en
Priority to CN202010372950.2A priority patent/CN113539933A/en
Priority to CN202020722246.0U priority patent/CN212161785U/en
Publication of TW202143356A publication Critical patent/TW202143356A/en
Application granted granted Critical
Publication of TWI767211B publication Critical patent/TWI767211B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Apparatuses For Bulk Treatment Of Fruits And Vegetables And Apparatuses For Preparing Feeds (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A chip detachment apparatus provided to detach a chip from a wafer attached on a carrier includes a sleeve, a pushing mechanism, a movement limitation mechanism and a return mechanism. A positioning carrier is fixed in the sleeve and the movement limitation mechanism is movably mounted in the sleeve. A push member of the pushing mechanism is able to push the chip up through the movement limitation mechanism and the return mechanism so as to detach the chip from the wafer.

Description

晶片頂出構造Wafer ejection structure

本發明是關於一種晶片頂出構造，尤其是一種用以控制一晶元被頂起位移量的晶片頂出構造。The present invention relates to a wafer ejection structure, in particular to a wafer ejection structure for controlling the displacement amount of a wafer being ejected.

請參查台灣發明專利申請第101147959號「晶片分離裝置」，其揭露一第三頂抵模組140及一間隔件160活動地設置於一容置槽A中，當該第三頂抵模組140的一第三傳動件142向上移動時，該第三傳動件142會頂推一第二彈性件170，該第二彈性件170同時會頂推該間隔件160，因此造成該第三頂抵模組140的位移量不易控制。Please refer to Taiwan Invention Patent Application No. 101147959 "Chip Separation Device", which discloses that a third abutting module 140 and a spacer 160 are movably disposed in an accommodating slot A, when the third abutting module When a third transmission member 142 of the 140 moves upward, the third transmission member 142 pushes a second elastic member 170, and the second elastic member 170 pushes the spacer 160 at the same time, thus causing the third push-up member The displacement of the module 140 is not easy to control.

當該第三頂抵模組140的位移量不足時，會造成一晶圓300的一晶片310無法斷離該晶圓300，或者造成斷離該晶圓300的該晶片310仍大面積地貼附於一黏膠層400等問題，而這將不利一真空吸嘴500吸取該晶片310。When the displacement of the third abutting module 140 is insufficient, a chip 310 of a wafer 300 cannot be separated from the wafer 300, or the chip 310 separated from the wafer 300 is still stuck to a large area Adhering to an adhesive layer 400 and the like, and this will not help a vacuum nozzle 500 to pick up the wafer 310 .

或者，當該第三頂抵模組140的位移量太多時，會造成斷離該晶圓300的該晶片310貼附於該黏膠層400的面積過小，因此會發生該真空吸嘴500未吸取該晶片310前，該晶片310已脫離該黏膠層400而掉落的問題。Or, when the displacement of the third abutting module 140 is too large, the area where the chip 310 separated from the wafer 300 is attached to the adhesive layer 400 is too small, so the vacuum suction nozzle 500 may occur. Before picking up the chip 310, the chip 310 has been separated from the adhesive layer 400 and dropped.

本發明的主要目的是藉由一位移限位模組控制一頂推模組的一頂推件頂起一晶圓的一晶片的位移量，以使該晶片斷離該晶圓，以利一真空吸嘴吸取該晶片。The main purpose of the present invention is to control the displacement of a push piece of a push module to push up a chip of a wafer by a displacement limit module, so that the chip is separated from the wafer, so as to facilitate a A vacuum nozzle picks up the wafer.

本發明之一種晶片頂出構造包含一筒體、一頂推模組、一位移限位模組及一復位件，該筒體具有一筒壁、一容置空間、一開口及一定位載台，該容置空間連通該開口，該定位載台位於該容置空間中，且該定位載台固定於該筒壁，該定位載台將該容置空間區隔成一第一容置空間及一第二容置空間，該頂推模組設置於該第一容置空間，該頂推模組具有一推桿及一頂推件，該頂推件結合於該推桿的一第一端部，該頂推件用以頂推一晶片，該位移限位模組，活動地設置於該第二容置空間，該位移限位模組具有一受推載台及一結合件，該結合件的一末端部結合於該推桿的一第二端部，該位移限位模組能被一驅動件頂推往該定位載台方向移動，以使該結合件推動該推桿，並使該頂推件頂推該晶片，該復位件，設置於該定位載台及該受推載台之間，該復位件用以頂推該位移限位模組使該定位載台與該受推載台之間具有一可變動間距。A wafer ejection structure of the present invention includes a cylinder, a push module, a displacement limiting module and a reset member, and the cylinder has a cylinder wall, an accommodating space, an opening and a positioning stage , the accommodating space communicates with the opening, the positioning stage is located in the accommodating space, and the positioning stage is fixed to the cylinder wall, and the positioning stage divides the accommodating space into a first accommodating space and a The second accommodating space, the pushing module is arranged in the first accommodating space, the pushing module has a pushing rod and a pushing piece, and the pushing piece is combined with a first end of the pushing rod , the push piece is used to push a chip, the displacement limit module is movably arranged in the second accommodating space, the displacement limit module has a pushed stage and a joint piece, the joint piece One end portion of the push rod is combined with a second end portion of the push rod, and the displacement limiting module can be pushed by a driving member to move in the direction of the positioning stage, so that the coupling member pushes the push rod and makes the The pushing piece pushes the chip, the reset piece is arranged between the positioning stage and the pushed stage, and the reset piece is used for pushing the displacement limiting module to make the positioning stage and the pushed loading stage There is a variable spacing between the stages.

本發明藉由該定位載台與該受推載台之間的該可變動間距，控制該頂推模組的該頂推件頂起該晶片的位移量，以避免該頂推件頂推該晶片的位移量不足或太多所造成的問題。The present invention controls the displacement of the ejecting member of the ejecting module to lift the chip by the variable distance between the positioning stage and the stage to be pushed, so as to prevent the ejecting member from pushing the chip Problems caused by insufficient or too much displacement of the wafer.

請參閱第1、2及4圖，本發明的一實施例，一種晶片頂出構造100，其用以將貼合於一載板10的一晶圓20的至少一晶片21頂起，以利進行後續製程(如取放搬運及覆晶製程等)。Please refer to FIGS. 1 , 2 and 4 , an embodiment of the present invention is a chip ejection structure 100 for ejecting at least one chip 21 of a wafer 20 attached to a carrier 10 to facilitate Carry out subsequent processes (such as pick-and-place handling and flip chip process, etc.).

請參閱第1、3及4圖，該晶片頂出構造100包含一筒體110、一頂推模組120、一位移限位模組130及一復位件140，該筒體110具有一筒壁111、一容置空間112、一開口113及一定位載台114，該容置空間112連通該開口113，該定位載台114位於該容置空間112中，且該定位載台114固定於該筒壁111，該定位載台114將該容置空間112區隔成一第一容置空間112a及一第二容置空間112b，較佳地，該晶片頂出構造100另包含一蓋150，該蓋150罩蓋該開口113，該蓋150具有至少一第一通氣孔151，該第一通氣孔151連通該第一容置空間112a，該第一通氣孔151用以吸附貼合有該晶圓20的該載板10。Please refer to FIGS. 1 , 3 and 4 , the chip ejecting structure 100 includes a cylinder 110 , a pushing module 120 , a displacement limiting module 130 and a reset member 140 , and the cylinder 110 has a cylinder wall 111, an accommodating space 112, an opening 113 and a positioning stage 114, the accommodating space 112 communicates with the opening 113, the positioning stage 114 is located in the accommodating space 112, and the positioning stage 114 is fixed to the The cylinder wall 111, the positioning stage 114 partitions the accommodating space 112 into a first accommodating space 112a and a second accommodating space 112b, preferably, the wafer ejection structure 100 further includes a cover 150, the The cover 150 covers the opening 113, the cover 150 has at least one first ventilation hole 151, the first ventilation hole 151 communicates with the first accommodating space 112a, and the first ventilation hole 151 is used for adsorbing and attaching the wafer 20 of the carrier board 10 .

請參閱第3、4及6圖，該筒體110包含一第一筒體部110a及一第二筒體部110b，在本實施例中，該第一筒體部110a及該第二筒體部110b分別為獨立個體，或者，請參閱第7圖，在不同的實施例中，該筒體110為一體成形，該第一筒體部110a及該第二筒體部110b為該筒體110的二個部位。Please refer to FIGS. 3 , 4 and 6 , the cylindrical body 110 includes a first cylindrical body portion 110 a and a second cylindrical body portion 110 b. In this embodiment, the first cylindrical body portion 110 a and the second cylindrical body portion 110 a The parts 110b are independent, or, please refer to FIG. 7, in different embodiments, the cylinder 110 is integrally formed, and the first cylinder part 110a and the second cylinder part 110b are the cylinder 110 of the two parts.

請參閱第3、4、5及6圖，在本實施例中，以該第一筒體部110a及該第二筒體部110b分別為獨立個體說明，但不以此為限，該第二筒體110b結合於該第一筒體部110a，該第一筒體部110a環繞該第一容置空間112a，該第二筒體部110b環繞該第二容置空間112b，且該定位載台114設置該第二筒體部110b。Please refer to FIGS. 3, 4, 5 and 6. In this embodiment, the first cylindrical body portion 110a and the second cylindrical body portion 110b are respectively described as independent entities, but not limited to this. The cylindrical body 110b is combined with the first cylindrical body part 110a, the first cylindrical body part 110a surrounds the first accommodating space 112a, the second cylindrical body part 110b surrounds the second accommodating space 112b, and the positioning stage 114 is provided with the second cylindrical portion 110b.

請參閱第3及4圖，該頂推模組120設置於該第一容置空間112a，該頂推模組120具有一推桿121及一頂推件122，該頂推件122結合於該推桿121的一第一端部121a，在不同的實施例中，該推桿121及該頂推件122可為一體成型，該頂推件122用以頂推貼合有該晶圓20的該載板10，使該晶圓20的該晶片21斷離該晶圓20，在本實施例中，該頂推模組120另具有一殼體123，該殼體123設置於該第一容置空間112a，該頂推模組120結合該殼體123且該推桿121及該頂推件122設置於該殼體123中。Please refer to FIGS. 3 and 4, the pushing module 120 is disposed in the first accommodating space 112a, the pushing module 120 has a pushing rod 121 and a pushing piece 122, and the pushing piece 122 is combined with the pushing piece 122. A first end 121 a of the push rod 121 , in different embodiments, the push rod 121 and the pusher 122 can be integrally formed, and the pusher 122 is used to push the wafer 20 attached thereto. The carrier board 10 separates the chip 21 of the wafer 20 from the wafer 20. In this embodiment, the push module 120 further has a casing 123, and the casing 123 is disposed in the first container The space 112a is placed, the push module 120 is combined with the casing 123 , and the push rod 121 and the push piece 122 are disposed in the casing 123 .

請參閱第3、4及5圖，該位移限位模組130活動地設置於該第二容置空間112b，該位移限位模組130具有一受推載台131及一結合件132，該結合件132的一末端部132b結合於該推桿121的一第二端部121b，在本實施例中，該定位載台114具有一第一作動孔114a，該推桿121或該結合件132活動地穿設於該第一作動孔114a，較佳地，該定位載台114具有至少一第二通氣孔114c，該第二通氣孔114c連通該第一容置空間112a及該第二容置空間112b，請參閱第1、2及4圖，該位移限位模組130能被一驅動件200頂推，並往該定位載台114方向移動，以使該結合件132推動該推桿121，並使該頂推件122頂推貼合有該晶圓20的該載板10，使該晶圓20的該晶片21斷離該晶圓20。Please refer to Figures 3, 4 and 5, the displacement limiting module 130 is movably disposed in the second accommodating space 112b, the displacement limiting module 130 has a pushed stage 131 and a joint 132, the An end portion 132b of the coupling member 132 is coupled to a second end portion 121b of the push rod 121. In this embodiment, the positioning stage 114 has a first actuating hole 114a. The push rod 121 or the coupling member 132 The positioning stage 114 preferably has at least one second ventilation hole 114c, and the second ventilation hole 114c communicates with the first accommodating space 112a and the second accommodating space 114a. For the space 112b, please refer to Figures 1, 2 and 4, the displacement limiting module 130 can be pushed by a driving member 200 and move toward the positioning stage 114, so that the coupling member 132 pushes the push rod 121 and make the pusher 122 push the carrier 10 attached to the wafer 20 , so that the chip 21 of the wafer 20 is separated from the wafer 20 .

請參閱第3及4圖，該復位件140設置於該定位載台114及該受推載台131之間，該復位件140用以頂推該位移限位模組130，使該定位載台114與該受推載台131之間具有一可變動間距，在本實施例中，該復位件140包含一第一壓縮彈簧141、一第二壓縮彈簧142及一第三壓縮彈簧143的其中之一，或者，該復位件140包含該第一壓縮彈簧141、該第二壓縮彈簧142及該第三壓縮彈簧143的組合，即該復位件140可包含該第一壓縮彈簧141及該第二壓縮彈簧142，或者，該復位件140可包含該第一壓縮彈簧141及該第三壓縮彈簧143，或者，該復位件140可包含該第二壓縮彈簧142及該第三壓縮彈簧143，或者，該復位件140可包含該第一壓縮彈簧141、該第二壓縮彈簧142及該第三壓縮彈簧143。 Please refer to FIGS. 3 and 4 , the reset member 140 is disposed between the positioning stage 114 and the pushed stage 131 , and the reset member 140 is used to push the displacement limiting module 130 to make the positioning stage There is a variable distance between 114 and the pushed stage 131. In this embodiment, the reset member 140 includes one of a first compression spring 141, a second compression spring 142 and a third compression spring 143. One, or, the reset member 140 includes a combination of the first compression spring 141 , the second compression spring 142 and the third compression spring 143 , that is, the reset member 140 may include the first compression spring 141 and the second compression spring 141 The spring 142, or the restoring member 140 may include the first compression spring 141 and the third compression spring 143, or the restoring member 140 may include the second compression spring 142 and the third compression spring 143, or the The restoring member 140 may include the first compression spring 141 , the second compression spring 142 and the third compression spring 143 .

請參閱第3及4圖，當該復位件140包含該第一壓縮彈簧141時，該第一壓縮彈簧141之一端抵觸該定位載台114，另一端抵觸該受推載台131，且該第一壓縮彈簧141環繞該結合件132。 Referring to FIGS. 3 and 4, when the reset member 140 includes the first compression spring 141, one end of the first compression spring 141 abuts against the positioning stage 114, the other end abuts against the pushed stage 131, and the first compression spring 141 A compression spring 141 surrounds the coupling member 132 .

請參閱第3、4及5圖，當該復位件140包含該第二壓縮彈簧142時，該位移限位模組130另包含一受推板133，該受推板133結合該結合件132，且該受推板133被限位於該定位載台114與該受推載台131之間，該第二壓縮彈簧142之一端抵觸該定位載台114，該第二壓縮彈簧142的另一端抵觸該受推板133，且該第二壓縮彈簧142環繞該結合件132，在本實施例中，該受推載台131具有一第一穿孔131a，該第一穿孔131a的一孔徑大於該結合件132的一頭部132a的一外徑，該結合件132的該頭部132a位於該第一穿孔131a中，較佳地，該受推板133抵觸該結合件132的該頭部132a，該受推板133被限位於該定位載台114與該頭部132a之間，該受推板133具有一第三穿孔133a，該結合件132活動地穿設於該第三穿孔133a，該第三穿孔133a的一孔徑小於該結合件132的該頭部132a的該外徑，且該頭部132a凸出於該受推載台131的一表面131d，該表面131d朝向該驅動件200。 Please refer to FIGS. 3 , 4 and 5 , when the reset member 140 includes the second compression spring 142 , the displacement limiting module 130 further includes a push plate 133 , and the push plate 133 is combined with the combination member 132 . And the pushed plate 133 is limited between the positioning stage 114 and the pushed stage 131 , one end of the second compression spring 142 abuts against the positioning stage 114 , and the other end of the second compression spring 142 abuts against the positioning stage 114 . The pushed plate 133 and the second compression spring 142 surround the coupling element 132 . In this embodiment, the pushed stage 131 has a first through hole 131 a , and the first through hole 131 a has a larger diameter than the coupling element 132 The outer diameter of a head 132a of the coupling piece 132 is located in the first through hole 131a, preferably, the pushed plate 133 abuts against the head 132a of the coupling piece 132, the pushed The plate 133 is limited between the positioning stage 114 and the head 132a, the pushed plate 133 has a third through hole 133a, the coupling element 132 is movably penetrated through the third through hole 133a, the third through hole 133a A hole diameter of the coupling element 132 is smaller than the outer diameter of the head 132a of the coupling element 132 , and the head 132a protrudes from a surface 131d of the stage 131 to be pushed, and the surface 131d faces the driving element 200 .

請參閱第3、4及5圖，在本實施例中，該復位件140包含該第一壓縮 彈簧141及該第二壓縮彈簧142，當該驅動件200往該定位載台114方向移動時，該驅動件200先接觸該結合件132的該頭部132a並頂推該結合件132，該結合件132並頂推該推桿121，使該頂推件122凸出該蓋150，凸出該蓋150的該頂推件122並頂推該載板10，以形成一第一次頂推作動，頂推該載板10的該頂推件122迫使該晶片21斷離該晶圓20，較佳地，該受推載台131具有至少一第三通氣孔131c，該第一通氣孔151、該第一容置空間112a、該第二通氣孔114c、該第二容置空間112b及該第三通氣孔131c構成一通氣通道，一吸氣裝置(圖未繪出)藉由該通氣通道將該載板10吸附於該蓋150，以避免該頂推件122頂推該載板10及該晶片21時，該載板10發生偏移。 Please refer to FIGS. 3, 4 and 5, in this embodiment, the reset member 140 includes the first compression The spring 141 and the second compression spring 142, when the driving member 200 moves toward the positioning stage 114, the driving member 200 first contacts the head 132a of the coupling member 132 and pushes the coupling member 132, the coupling 132 and push the push rod 121, so that the push piece 122 protrudes out of the cover 150, protrudes the push piece 122 of the cover 150 and pushes the carrier board 10 to form a first push action , the pushing member 122 that pushes the carrier board 10 forces the chip 21 to be separated from the wafer 20 , preferably, the pushed stage 131 has at least one third vent hole 131 c , the first vent hole 151 , The first accommodating space 112a, the second ventilation hole 114c, the second accommodating space 112b and the third ventilation hole 131c constitute a ventilation channel through which an air suction device (not shown) is The carrier board 10 is adsorbed on the cover 150 to prevent the carrier board 10 from being displaced when the pusher 122 pushes the carrier board 10 and the chip 21 .

請參閱第3及4圖，該推桿121的該第二端部121b設有一第一螺孔121c，該結合件132的該末端部132b具有一外螺紋，該結合件132的該末端部132b螺合於該第一螺孔121c，藉由調整該結合件132與該第一螺孔121c的結合深度，以調整該結合件132頂推該頂推模組120的該推桿121及該頂推件122頂推該晶片的位移量，以使該晶片21斷離該晶圓20，以利一真空吸嘴(圖未繪出)吸取該晶片。 Please refer to FIGS. 3 and 4 , the second end portion 121b of the push rod 121 is provided with a first screw hole 121c , the end portion 132b of the coupling member 132 has an external thread, and the end portion 132b of the coupling member 132 has an external thread. It is screwed into the first screw hole 121c, and by adjusting the combined depth of the combination member 132 and the first screw hole 121c, the combination member 132 can be adjusted to push the push rod 121 and the push rod of the push module 120. The pushing member 122 pushes the displacement amount of the chip, so that the chip 21 is separated from the wafer 20, so that a vacuum suction nozzle (not shown) can suck the chip.

請參閱第3及4圖，該位移限位模組130另具有至少一導柱134，該定位載台114具有一第二作動孔114b，該受推載台131具有一第二穿孔131b，該導柱134活動地穿設於該第二穿孔131b及該第二作動孔114b，且該導柱134的一接合部134a結合於該殼體123，在本實施例中，該殼體123設有一第二螺孔123a，該導柱134的該接合部134a具有一外螺紋，該接合部134a螺合於該第二螺孔123a，藉由調整該導柱134與該第二螺孔123a的結合深度，以調整該結合件132頂推該頂推模組120的該推桿121及該頂推件122頂推該晶片的位移量。 Please refer to FIGS. 3 and 4, the displacement limiting module 130 further has at least one guide post 134, the positioning stage 114 has a second actuating hole 114b, the pushed stage 131 has a second through hole 131b, the The guide post 134 movably passes through the second through hole 131b and the second actuation hole 114b, and a joint portion 134a of the guide post 134 is coupled to the housing 123. In this embodiment, the housing 123 is provided with a In the second screw hole 123a, the engaging portion 134a of the guide post 134 has an external thread, and the engaging portion 134a is screwed into the second screw hole 123a, by adjusting the combination of the guide post 134 and the second screw hole 123a The depth is adjusted to adjust the displacement of the push rod 121 of the push module 120 and the push piece 122 to push the chip by the combination element 132 .

請參閱第3及4圖，該導柱134的一頭部134b的一外徑不小於該第二 穿孔131b的一內徑，使該導柱134的該頭部134b被限制於該受推載台131外，該受推載台131藉由該導柱134與該定位載台114結合。 Please refer to FIGS. 3 and 4, an outer diameter of a head 134b of the guide post 134 is not smaller than that of the second An inner diameter of the through hole 131b enables the head 134b of the guide post 134 to be confined outside the pushed stage 131 , and the pushed stage 131 is combined with the positioning stage 114 by the guide post 134 .

請參閱第3及4圖，當該驅動件200往該定位載台114方向移動，且該驅動件200頂推該結合件132後，若該驅動件200持續往該定位載台114方向移動，該驅動件200接著會接觸並頂推該受推載台131，使該受推載台131及該結合件132同步上升，以形成一第二次頂推作動。 Please refer to FIGS. 3 and 4 , when the driving member 200 moves towards the positioning stage 114 and the driving member 200 pushes the coupling member 132 , if the driving member 200 continues to move towards the positioning stage 114 , The driving member 200 then contacts and pushes the pushed stage 131 , so that the pushed stage 131 and the coupling member 132 rise synchronously to form a second push action.

請參閱第3及4圖，當該復位件140包含該第三壓縮彈簧143時，該第三壓縮彈簧143環繞該導柱134，且該第三壓縮彈簧143之一端抵觸該受推載台131，該第三壓縮彈簧143之另一端通過該第二作動孔114b抵觸該殼體123，在本實施例中，該殼體123活動地設置於該第一容置空間112a，且該殼體123可選擇性地靠近該開口113或遠離該開口113。 Please refer to FIGS. 3 and 4 , when the reset member 140 includes the third compression spring 143 , the third compression spring 143 surrounds the guide post 134 , and one end of the third compression spring 143 abuts against the pushed stage 131 , the other end of the third compression spring 143 abuts against the casing 123 through the second actuating hole 114b. In this embodiment, the casing 123 is movably disposed in the first accommodating space 112a, and the casing 123 It can be selectively close to the opening 113 or away from the opening 113 .

請參閱第3及4圖，當該驅動件200往該定位載台114方向移動，且該驅動件200頂推該結合件132及該受推載台131後，若該驅動件200持續往該定位載台114方向移動，該驅動件200接著會接觸並頂推該導柱134，使該受推載台131、該結合件132、該導柱134、該殼體123及該頂推模組120同步上升，以形成一第三次頂推作動。 Please refer to FIGS. 3 and 4 , when the driving member 200 moves toward the positioning stage 114 and the driving member 200 pushes the coupling member 132 and the pushed stage 131 , if the driving member 200 continues to move toward the positioning stage 114 When the positioning stage 114 moves in the direction, the driving member 200 will then contact and push the guide post 134, so that the pushed stage 131, the coupling member 132, the guide post 134, the casing 123 and the push module 120 rises in sync to form a third push.

本發明是藉由該定位載台114與該受推載台131之間的該可變動間距，控制該頂推模組120的該頂推件122頂起該晶片21的位移量，以避免該頂推件122頂推該晶片21的位移量不足或太多所造成的問題。 The present invention controls the displacement of the ejector 122 of the ejection module 120 to eject the wafer 21 by the variable distance between the positioning stage 114 and the ejected stage 131 to avoid the The problem is caused by insufficient or too much displacement of the pushing member 122 to push the wafer 21 .

本發明之保護範圍當視後附之申請專利範圍所界定者為準，任何熟知此項技藝者，在不脫離本發明之精神和範圍內所作之任何變化與修改，均屬於本發明之保護範圍。 The protection scope of the present invention shall be determined by the scope of the appended patent application. Any changes and modifications made by anyone who is familiar with the art without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention. .

10:載板 10: Carrier board

20:晶圓 20: Wafer

21:晶片 21: Wafer

100:晶片頂出構造 100: Wafer ejection structure

110:筒體 110: Cylinder

110a:第一筒體部 110a: the first cylinder part

110b:第二筒體部 110b: the second cylinder part

111:筒壁 111: Cylinder wall

112:容置空間 112: accommodating space

112a:第一容置空間 112a: The first accommodation space

112b:第二容置空間 112b: Second accommodating space

113；開口 113; opening

114:定位載台 114: Positioning stage

114a:第一作動孔 114a: The first actuating hole

114b:第二作動孔 114b: The second actuating hole

114c:第二通氣孔 114c: Second vent hole

120:頂推模組 120: Top push module

121:推桿 121: putter

121a:第一端部 121a: first end

121b:第二端部 121b: Second end

121c:第一螺孔 121c: The first screw hole

122:頂推件 122: Push pieces

123:殼體 123: Shell

123a:第二螺孔 123a: Second screw hole

130:位移限位模組 130: Displacement limit module

131:受推載台 131: Pushed stage

131a:第一穿孔 131a: first perforation

131b:第二穿孔 131b: Second perforation

131c:第三通氣孔 131c: Third vent hole

131d:表面 131d: Surface

132:結合件 132: Bonding pieces

132a:頭部 132a: head

132b:末端部 132b: terminal part

133:受推板 133: Pushed plate

133a:第三穿孔 133a: third perforation

134:導柱 134: Guide post

134a:接合部 134a: Joint

134b:頭部 134b: head

140:復位件 141:第一壓縮彈簧 142:第二壓縮彈簧 143:第三壓縮彈簧 150:蓋 151:第一通氣孔 200:驅動件140: reset piece 141: First compression spring 142: Second compression spring 143: Third compression spring 150: cover 151: First vent 200:Driver

第1圖：本發明的晶片頂出構造及驅動件的組合圖。 第2圖：本發明的晶片頂出構造及驅動件的分解圖。 第3圖：本發明的晶片頂出構造的分解圖。 第4圖：本發明的晶片頂出構造及驅動件的剖視圖。 第5圖：本發明的晶片頂出構造的剖視圖。 第6圖：本發明的晶片頂出構造的筒體的立體剖視圖。 第7圖：本發明的晶片頂出構造的筒體的立體剖視圖。Fig. 1 is a combined view of the wafer ejection structure and the driving member of the present invention. Fig. 2: An exploded view of the wafer ejecting structure and driving member of the present invention. Fig. 3: An exploded view of the wafer ejection structure of the present invention. Fig. 4 is a cross-sectional view of the wafer ejection structure and the driving member of the present invention. Fig. 5: A cross-sectional view of the wafer ejection structure of the present invention. Fig. 6 is a perspective cross-sectional view of the cylinder of the wafer ejection structure of the present invention. Fig. 7 is a perspective cross-sectional view of the cylindrical body of the wafer ejection structure of the present invention.

10:載板10: Carrier board

20:晶圓20: Wafer

21:晶片21: Wafer

100:晶片頂出構造100: Wafer ejection structure

110a:第一筒體部110a: the first cylinder part

110b:第二筒體部110b: the second cylinder part

111:筒壁111: Cylinder wall

112:容置空間112: accommodating space

112a:第一容置空間112a: The first accommodation space

112b:第二容置空間112b: Second accommodating space

113:開口113: Opening

114:定位載台114: Positioning stage

114a:第一作動孔114a: The first actuating hole

114b:第二作動孔114b: The second actuating hole

120:頂推模組120: Top push module

121:推桿121: putter

121a:第一端部121a: first end

121b:第二端部121b: Second end

121c:第一螺孔121c: The first screw hole

122:頂推件122: Push pieces

123:殼體123: Shell

123a:第二螺孔123a: Second screw hole

130:位移限位模組130: Displacement limit module

131:受推載台131: Pushed stage

131a:第一穿孔131a: first perforation

131b:第二穿孔131b: Second perforation

131d:表面131d: Surface

132:結合件132: Bonding pieces

132a:頭部132a: head

132b:末端部132b: terminal part

133:受推板133: Pushed plate

133a:第三穿孔133a: third perforation

134:導柱134: Guide post

134a:接合部134a: Joint

134b:頭部134b: head

141:第一壓縮彈簧141: First compression spring

142:第二壓縮彈簧142: Second compression spring

143:第三壓縮彈簧143: Third compression spring

150:蓋150: cover

151:第一通氣孔151: First vent

200:驅動件200:Driver

Claims (15)

一種晶片頂出構造，包含：一筒體，具有一筒壁、一容置空間、一開口及一定位載台，該容置空間連通該開口，該定位載台位於該容置空間中，且該定位載台固定於該筒壁，該定位載台將該容置空間區隔成一第一容置空間及一第二容置空間；一頂推模組，設置於該第一容置空間，該頂推模組具有一推桿及一頂推件，該頂推件結合於該推桿的一第一端部；一位移限位模組，活動地設置於該第二容置空間，該位移限位模組具有一受推載台、一結合件及一受推板，該結合件的一末端部結合於該推桿的一第二端部，該受推板結合該結合件，該位移限位模組能被一驅動件頂推往該定位載台方向移動，以使該結合件推動該推桿，並使該頂推件頂推該晶片；以及一復位件，設置於該定位載台及該受推載台之間，該復位件用以頂推該位移限位模組使該定位載台與該受推載台之間具有一可變動間距，該復位件包含一第二壓縮彈簧，該第二壓縮彈簧環繞該結合件，該第二壓縮彈簧之一端抵觸該定位載台，另一端抵觸該受推板，使該受推板被限位於該定位載台與該受推載台之間。 A wafer ejection structure, comprising: a cylindrical body with a cylindrical wall, an accommodating space, an opening and a positioning stage, the accommodating space communicates with the opening, the positioning stage is located in the accommodating space, and The positioning stage is fixed on the cylinder wall, and the positioning stage divides the accommodating space into a first accommodating space and a second accommodating space; a pushing module is arranged in the first accommodating space, The push module has a push rod and a push piece, the push piece is combined with a first end of the push rod; a displacement limit module is movably arranged in the second accommodating space, the push piece is The displacement limiting module has a pushed stage, a combination piece and a pushed plate, an end of the combination piece is combined with a second end of the push rod, the push plate is combined with the combination piece, and the push plate is combined with the combination piece. The displacement limiting module can be pushed by a driving member to move toward the positioning stage, so that the coupling member pushes the push rod and the pushing member pushes the wafer; and a reset member is arranged on the positioning member Between the carrier and the pushed carrier, the reset piece is used to push the displacement limiting module to have a variable distance between the positioning carrier and the pushed carrier, and the reset piece includes a second a compression spring, the second compression spring surrounds the coupling part, one end of the second compression spring abuts against the positioning stage, and the other end abuts against the push plate, so that the push plate is restricted between the positioning stage and the push plate between the platforms. 如請求項1之晶片頂出構造，其中該定位載台具有一第一作動孔，該推桿或該結合件活動地穿設於該第一作動孔。 The wafer ejection structure of claim 1, wherein the positioning stage has a first actuating hole, and the push rod or the coupling member movably passes through the first actuating hole. 如請求項1之晶片頂出構造，其中該復位件包含一第一壓縮彈簧，該第一壓縮彈簧之一端抵觸該定位載台，另一端抵觸該受推載台，且該第一壓縮彈簧環繞該結合件。 The wafer ejection structure of claim 1, wherein the reset member comprises a first compression spring, one end of the first compression spring abuts the positioning stage, the other end abuts the pushed stage, and the first compression spring surrounds the joint. 如請求項1之晶片頂出構造，其中該受推載台具有一第一穿孔，該第一穿孔的一孔徑大於該結合件的一頭部的一外徑，該結合件的該頭部位於該第一穿孔中。 The wafer ejection structure of claim 1, wherein the pushed stage has a first through hole, and a hole diameter of the first through hole is larger than an outer diameter of a head of the coupling element, and the head of the coupling element is located at in the first perforation. 如請求項4之晶片頂出構造，其中該頭部凸出於該受推載台的一表面，該表面朝向該驅動件。 The wafer ejection structure of claim 4, wherein the head protrudes from a surface of the pushed stage, and the surface faces the driving member. 如請求項4之晶片頂出構造，其中該受推板抵觸該結合件的該頭部，該受推板被限位於該定位載台與該頭部之間。 The wafer ejection structure of claim 4, wherein the pushed plate abuts against the head of the coupling element, and the pushed plate is limited between the positioning stage and the head. 如請求項6之晶片頂出構造，其中該受推板具有一第三穿孔，該結合件活動地穿設於該第三穿孔，該第三穿孔的一孔徑小於該結合件的該頭部的該外徑。 The wafer ejection structure of claim 6, wherein the push plate has a third through hole, the coupling element is movably penetrated through the third through hole, and a hole diameter of the third through hole is smaller than that of the head of the coupling element the outer diameter. 如請求項1之晶片頂出構造，其中該推桿的該第二端部設有一第一螺孔，該結合件的該末端部具有一外螺紋，該結合件的該末端部螺合於該第一螺孔。 The chip ejection structure of claim 1, wherein the second end of the push rod is provided with a first screw hole, the end portion of the coupling member has an external thread, and the end portion of the coupling member is screwed to the first screw hole. 如請求項1之晶片頂出構造，其中該頂推模組具有一殼體，該殼體設置於該第一容置空間，該推桿及該頂推件設置於該殼體中，該位移限位模組另具有至少一導柱，該定位載台具有一第二作動孔，該受推載台具有一第二穿孔，該導柱活動地穿設於該第二穿孔及該第二作動孔，且該導柱的一接合部結合於該殼體，該導柱的一頭部的一外徑不小於該第二穿孔的一內徑，使該導柱的該頭部被限制於該受推載台外，該受推載台藉由該導柱與該定位載台結合。 The chip ejection structure of claim 1, wherein the ejection module has a casing, the casing is disposed in the first accommodating space, the push rod and the ejector are disposed in the casing, and the displacement The limiting module further has at least one guide post, the positioning stage has a second actuation hole, the pushed stage has a second through hole, and the guide post movably penetrates through the second through hole and the second actuation hole a hole, and a joint part of the guide post is combined with the housing, an outer diameter of a head of the guide post is not less than an inner diameter of the second through hole, so that the head of the guide post is limited to the Outside the pushed stage, the pushed stage is combined with the positioning stage through the guide post. 如請求項9之晶片頂出構造，其中該殼體設有一第二螺孔，該導柱的該接合部具有一外螺紋，該接合部螺合於該第二螺孔。 The chip ejection structure of claim 9, wherein the housing is provided with a second screw hole, the joint portion of the guide post has an external thread, and the joint portion is screwed into the second screw hole. 如請求項9或10之晶片頂出構造，其中該復位件包含一第三壓縮 彈簧，該第三壓縮彈簧環繞該導柱，且該第三壓縮彈簧之一端抵觸該受推載台，該第三壓縮彈簧之另一端通過該第二作動孔抵觸該殼體。 The wafer ejection structure of claim 9 or 10, wherein the reset member includes a third compression a spring, the third compression spring surrounds the guide post, one end of the third compression spring abuts against the pushed stage, and the other end of the third compression spring abuts against the housing through the second actuating hole. 如請求項11之晶片頂出構造，其中該殼體活動地設置於該第一容置空間，且該殼體可選擇性地靠近該開口或遠離該開口。 The wafer ejection structure according to claim 11, wherein the casing is movably disposed in the first accommodating space, and the casing can be selectively close to the opening or away from the opening. 如請求項1之晶片頂出構造，其中該筒體包含一第一筒體部及一第二筒體部，該第一筒體部及該第二筒體部分別為獨立個體，該第二筒體部結合於該第一筒體部，該第一筒體部環繞該第一容置空間，該第二筒體部環繞該第二容置空間。 The wafer ejection structure of claim 1, wherein the barrel includes a first barrel portion and a second barrel portion, the first barrel portion and the second barrel portion are independent bodies, respectively, the second barrel portion The cylindrical portion is combined with the first cylindrical portion, the first cylindrical portion surrounds the first accommodating space, and the second cylindrical portion surrounds the second accommodating space. 如請求項13之晶片頂出構造，其中該定位載台設置該第二筒體部。 The wafer ejection structure of claim 13, wherein the positioning stage is provided with the second cylindrical portion. 如請求項1之晶片頂出構造，其另包含一蓋，該蓋罩蓋該開口，該蓋具有至少一第一通氣孔，該第一通氣孔連通該第一容置空間，該定位載台具有至少一第二通氣孔，該第二通氣孔連通該第一容置空間及該第二容置空間，該受推載台具有至少一第三通氣孔，該第一通氣孔、該第一容置空間、該第二通氣孔、該第二容置空間及該第三通氣孔構成一通氣通道。 The wafer ejection structure of claim 1 further comprises a cover, the cover covers the opening, the cover has at least one first vent hole, the first vent hole communicates with the first accommodating space, and the positioning stage There is at least one second ventilation hole, the second ventilation hole communicates with the first accommodating space and the second accommodating space, the pushed stage has at least a third ventilation hole, the first ventilation hole, the first ventilation hole The accommodating space, the second ventilation hole, the second accommodating space and the third ventilation hole constitute a ventilation channel.
TW109112709A 2020-04-15 2020-04-15 Chip detachment apparatus TWI767211B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW109112709A TWI767211B (en) 2020-04-15 2020-04-15 Chip detachment apparatus
CN202010372950.2A CN113539933A (en) 2020-04-15 2020-05-06 Chip ejection structure
CN202020722246.0U CN212161785U (en) 2020-04-15 2020-05-06 Chip ejection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109112709A TWI767211B (en) 2020-04-15 2020-04-15 Chip detachment apparatus

Publications (2)

Publication Number Publication Date
TW202143356A TW202143356A (en) 2021-11-16
TWI767211B true TWI767211B (en) 2022-06-11

Family

ID=73721557

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109112709A TWI767211B (en) 2020-04-15 2020-04-15 Chip detachment apparatus

Country Status (2)

Country Link
CN (2) CN212161785U (en)
TW (1) TWI767211B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117438370B (en) * 2023-12-21 2024-03-19 无锡星微科技有限公司杭州分公司 Precise ejection mechanism of automatic wafer sorting machine

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4850780A (en) * 1987-09-28 1989-07-25 Kulicke And Soffa Industries Inc. Pre-peel die ejector apparatus
TW201426892A (en) * 2012-12-17 2014-07-01 Hon Soon Internat Technology Co Ltd Chip ejection device
TWM600474U (en) * 2020-04-15 2020-08-21 竑昇國際科技有限公司 Chip detachment apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4850780A (en) * 1987-09-28 1989-07-25 Kulicke And Soffa Industries Inc. Pre-peel die ejector apparatus
TW201426892A (en) * 2012-12-17 2014-07-01 Hon Soon Internat Technology Co Ltd Chip ejection device
TWM600474U (en) * 2020-04-15 2020-08-21 竑昇國際科技有限公司 Chip detachment apparatus

Also Published As

Publication number Publication date
CN212161785U (en) 2020-12-15
TW202143356A (en) 2021-11-16
CN113539933A (en) 2021-10-22

Similar Documents

Publication Publication Date Title
TWI767211B (en) Chip detachment apparatus
JPH0983193A (en) Component suction head for electronic-component mounting machine
JP2010161155A (en) Chip transfer method and chip transfer apparatus
US7480985B2 (en) CPU pickup device
JP2005127848A (en) Cover glass transfer device of sample sealing machine
TWI396241B (en) A semiconductor wafer picking device
TWM600474U (en) Chip detachment apparatus
TW201536654A (en) Nozzle structure and suction method
CN111106037B (en) Pick-up device and mounting device for electronic parts
TWI423349B (en) Pickup device for semiconductor wafers
TW201742177A (en) Die pick-up method
KR101977625B1 (en) Picker
JPH10173395A (en) Vacuum chuck head for chip-type circuit components
WO2017038808A1 (en) Nozzle head
JPH0342504B2 (en)
US20200357678A1 (en) Ejector device
TWI497631B (en) Chip ejection device
JPH05235594A (en) Attracting head for electronic component
CN220041830U (en) Die bonding thimble structure and die bonding machine
KR20180119423A (en) Apparatus for separating chip from mounting tape and method thereof
JP3592692B2 (en) How to remove thin chip components
KR101656334B1 (en) A housing for the removable of the semiconductor package for EMI shielding
KR20190090365A (en) Picker
CN2715479Y (en) Pick-up head arrangement for surface adhesion pick-up devices
WO2020110173A1 (en) Dispenser