CN113539933A - Chip ejection structure - Google Patents
Chip ejection structure Download PDFInfo
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- CN113539933A CN113539933A CN202010372950.2A CN202010372950A CN113539933A CN 113539933 A CN113539933 A CN 113539933A CN 202010372950 A CN202010372950 A CN 202010372950A CN 113539933 A CN113539933 A CN 113539933A
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- 230000006835 compression Effects 0.000 claims description 53
- 238000007906 compression Methods 0.000 claims description 53
- 238000006073 displacement reaction Methods 0.000 claims description 32
- 230000008878 coupling Effects 0.000 claims description 13
- 238000010168 coupling process Methods 0.000 claims description 13
- 238000005859 coupling reaction Methods 0.000 claims description 13
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Apparatuses For Bulk Treatment Of Fruits And Vegetables And Apparatuses For Preparing Feeds (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses a chip ejection structure which is used for ejecting at least one chip of a wafer attached to a carrier plate so as to be beneficial to carrying out subsequent processing.
Description
Technical Field
The present invention relates to a chip ejection structure, and more particularly, to a chip ejection structure for controlling the displacement of a wafer being ejected.
Background
Please refer to the patent application No. 101147959 of taiwan patent application, which discloses that a third abutting module 140 and a spacing member 160 are movably disposed in the accommodating groove a, when the third transmission member 142 of the third abutting module 140 moves upward, the third transmission member 142 pushes the second elastic member 170, and the second elastic member 170 simultaneously pushes the spacing member 160, so that the displacement of the third abutting module 140 is not easy to control.
When the displacement of the third abutting module 140 is insufficient, the chip 310 of the wafer 300 cannot be separated from the wafer 300, or the chip 310 separated from the wafer 300 is still attached to the adhesive layer 400 in a large area, which is not favorable for the vacuum nozzle 500 to suck the chip 310.
Alternatively, when the displacement of the third abutting module 140 is too large, the area of the chip 310 separated from the wafer 300 and attached to the adhesive layer 400 is too small, so that the problem that the chip 310 is separated from the adhesive layer 400 and falls off before the vacuum suction nozzle 500 sucks the chip 310 may occur.
Disclosure of Invention
The invention mainly aims to control the displacement of a chip of a wafer jacked up by a jacking piece of a jacking module through a displacement limiting module so as to break the chip from the wafer, thereby being beneficial to a vacuum suction nozzle to absorb the chip.
The invention relates to a chip ejection structure, which comprises a barrel, an ejection module, a displacement limiting module and a reset piece, wherein the barrel is provided with a barrel wall, an accommodating space, an opening and a positioning carrying platform, the accommodating space is communicated with the opening, the positioning carrying platform is positioned in the accommodating space, the positioning carrying platform is fixed on the barrel wall, the accommodating space is divided into a first accommodating space and a second accommodating space by the positioning carrying platform, the ejection module is arranged in the first accommodating space, the ejection module is provided with a push rod and an ejection piece, the ejection piece is combined at the first end part of the push rod, the ejection piece is used for ejecting a chip, the displacement limiting module is movably arranged in the second accommodating space, the displacement limiting module is provided with a pushed carrying platform and a combining piece, the tail end part of the combining piece is combined at the second end part of the push rod, and the displacement limiting module can be ejected to the direction of the positioning carrying platform by a driving piece, the reset piece is arranged between the positioning carrier and the pushed carrier, and is used for pushing the displacement limiting module to enable the positioning carrier and the pushed carrier to have a variable moving distance.
Furthermore, the positioning carrier has a first action hole, and the push rod or the combining part movably penetrates through the first action hole.
Further, the reset piece comprises a first compression spring, one end of the first compression spring props against the positioning carrier, the other end of the first compression spring props against the pushed carrier, and the first compression spring surrounds the combining piece.
Further, the displacement limiting module further comprises a received push plate, the reset piece comprises a second compression spring, the received push plate is combined with the combining piece, the received push plate is limited between the positioning carrying platform and the pushed carrying platform, one end of the second compression spring abuts against the positioning carrying platform, the other end of the second compression spring abuts against the received push plate, and the second compression spring surrounds the combining piece.
Further, the pushed carrier has a first through hole, the aperture of the first through hole is larger than the outer diameter of the head of the combining member, and the head of the combining member is located in the first through hole.
Further, the head portion protrudes from a surface of the pushed carrier, and the surface faces the driving member.
Further, the pushed plate abuts against the head of the combining member, and the pushed plate is limited between the positioning carrier and the head.
Furthermore, the pushed plate is provided with a third through hole, the combining piece movably penetrates through the third through hole, and the aperture of the third through hole is smaller than the outer diameter of the head of the combining piece.
Furthermore, the second end of the push rod is provided with a first screw hole, the end of the combining piece is provided with an external thread, and the end of the combining piece is screwed in the first screw hole.
Further, the pushing module is provided with a shell, the shell is arranged in the first accommodating space, the push rod and the pushing piece are arranged in the shell, the displacement limiting module is further provided with at least one guide pillar, the positioning carrier is provided with a second action hole, the pushed carrier is provided with a second through hole, the guide pillar movably penetrates through the second through hole and the second action hole, the joint part of the guide pillar is combined with the shell, the outer diameter of the head part of the guide pillar is not smaller than the inner diameter of the second through hole, the head part of the guide pillar is limited outside the pushed carrier, and the pushed carrier is combined with the positioning carrier by the guide pillar.
Furthermore, the housing is provided with a second screw hole, the joint part of the guide post is provided with an external thread, and the joint part is screwed in the second screw hole.
Further, the reset member includes a third compression spring surrounding the guide post, one end of the third compression spring abuts against the pushed platform, and the other end of the third compression spring abuts against the housing through the second through hole.
Further, the housing is movably disposed in the first accommodating space, and the housing is selectively close to the opening or away from the opening.
Further, the cylinder comprises a first cylinder part and a second cylinder part, the first cylinder part and the second cylinder part are independent bodies respectively, the second cylinder is combined with the first cylinder part, the first cylinder part surrounds the first accommodating space, and the second cylinder part surrounds the second accommodating space.
Further, the second cylinder portion is arranged on the positioning carrier.
Further, the chip ejection structure further includes a cover, the cover covers the opening, the cover has at least one first vent hole, the first vent hole is communicated with the first accommodating space, the positioning carrying platform has at least one second vent hole, the second vent hole is communicated with the first accommodating space and the second accommodating space, the pushed carrying platform has at least one third vent hole, and the first vent hole, the first accommodating space, the second vent hole, the second accommodating space and the third vent hole form a vent channel.
The invention controls the displacement of the pushing piece of the pushing module to jack up the chip by means of the variable movement distance between the positioning carrier and the pushed carrier, so as to avoid the problem caused by insufficient or too much displacement of the pushing piece for pushing the chip.
Drawings
In order to make the aforementioned and other objects, features, advantages and embodiments of the invention more comprehensible, the following description is given:
fig. 1 is a schematic view showing a combination of a chip ejection structure and a driving member according to an embodiment of the present invention;
FIG. 2 is an exploded view of a die ejection structure and a driving member according to an embodiment of the invention;
FIG. 3 shows an exploded view of a chip ejection configuration according to an embodiment of the invention;
FIG. 4 is a schematic cross-sectional view of a chip ejection configuration and drive member according to an embodiment of the invention;
FIG. 5 shows a schematic cross-sectional view of a chip ejection configuration of an embodiment of the present invention;
FIG. 6 shows a schematic perspective cross-sectional view of a cartridge in a chip ejection configuration according to an embodiment of the invention;
fig. 7 shows a schematic perspective cross-sectional view of a cartridge in a chip ejection configuration according to another embodiment of the present invention.
[ notation ] to show
10: carrier plate 20: wafer
21: chip 100: chip ejection structure
110: barrel 110 a: a first barrel part
110 b: second barrel portion 111: cylinder wall
112: the accommodating space 112 a: the first containing space
112 b: the second accommodating space 113: opening of the container
114: positioning stage 114 a: first action hole
114 b: second actuating hole 114 c: second vent hole
120: a pushing module 121: push rod
121 a: first end portion 121 b: second end portion
121 c: first screw hole 122: pushing piece
123: the housing 123 a: second screw hole
130: the displacement limit module 131: pushed platform
131 a: first through hole 131 b: second through hole
131 c: third vent hole 131 d: surface of
132: the engaging members 132 a: head part
132 b: end portion 133: receiving and pushing plate
133 a: third perforation 134: guide post
134 a: engaging portion 134 b: head part
140: the reset piece 141: a first compression spring
142: second compression spring 143: third compression spring
150: cover 151: the first vent hole
200: driving member
Detailed Description
Referring to fig. 1, fig. 2 and fig. 4, in an embodiment of the invention, a chip ejection structure 100 is used for ejecting at least one chip 21 of a wafer 20 attached to a carrier 10 to facilitate subsequent processes (such as pick-and-place transportation and flip chip processes).
Referring to fig. 1, 3 and 4, the chip ejection structure 100 includes a cylinder 110, a pushing module 120, a displacement limiting module 130 and a reset element 140, where the cylinder 110 has a cylinder wall 111, an accommodating space 112, an opening 113 and a positioning carrier 114, the accommodating space 112 communicates with the opening 113, the positioning carrier 114 is located in the accommodating space 112, the positioning carrier 114 is fixed to the cylinder wall 111, the positioning carrier 114 divides the accommodating space 112 into a first accommodating space 112a and a second accommodating space 112b, and preferably, the chip ejection structure 100 further includes a cover 150, the cover 150 covers the opening 113, the cover 150 has at least one first vent hole 151, the first vent hole 151 communicates with the first accommodating space 112a, and the first vent hole 151 is used for adsorbing the 10 to which the wafer 20 is attached.
Referring to fig. 3, 4 and 6, the cylinder 110 includes a first cylinder portion 110a and a second cylinder portion 110b, in this embodiment, the first cylinder portion 110a and the second cylinder portion 110b are independent bodies, or, referring to fig. 7, in a different embodiment, the cylinder 110 is integrally formed, and the first cylinder portion 110a and the second cylinder portion 110b are two portions of the cylinder 110.
Referring to fig. 3, 4, 5 and 6, in the present embodiment, the first cylinder portion 110a and the second cylinder portion 110b are respectively described as independent bodies, but not limited thereto, the second cylinder portion 110b is combined with the first cylinder portion 110a, the first cylinder portion 110a surrounds the first accommodating space 112a, the second cylinder portion 110b surrounds the second accommodating space 112b, and the positioning carrier 114 is disposed on the second cylinder portion 110 b.
Referring to fig. 3 and 4, the pushing module 120 is disposed in the first accommodating space 112a, the pushing module 120 has a pushing rod 121 and a pushing member 122, the pushing member 122 is combined with the first end 121a of the pushing rod 121, in different embodiments, the pushing rod 121 and the pushing member 122 may be integrally formed, the pushing member 122 is used to push the carrier plate 10 attached with the wafer 20, so that the chip 21 of the wafer 20 is separated from the wafer 20, in this embodiment, the pushing module 120 further has a housing 123, the housing 123 is disposed in the first accommodating space 112a, the pushing module 120 is combined with the housing 123, and the pushing rod 121 and the pushing member 122 are disposed in the housing 123.
Referring to fig. 3, 4 and 5, the displacement limiting module 130 is movably disposed in the second accommodating space 112b, the displacement limiting module 130 has a pushed platform 131 and a connector 132, a terminal portion 132b of the connector 132 is coupled to a second end portion 121b of the push rod 121, in this embodiment, the positioning platform 114 has a first actuating hole 114a, the push rod 121 or the connector 132 movably penetrates through the first actuating hole 114a, preferably, the positioning platform 114 has at least one second vent hole 114c, the second vent hole 114c communicates with the first accommodating space 112a and the second accommodating space 112b, referring to fig. 1, 2 and 4, the displacement limiting module 130 can be pushed by a driving member 200 and moves toward the positioning platform 114, so that the connector 132 pushes the push rod 121, and the pushing member 122 pushes the carrier plate 10 attached to the wafer 20, the chips 21 of the wafer 20 are broken off from the wafer 20.
Referring to fig. 3 and 4, the restoring member 140 is disposed between the positioning stage 114 and the pushed stage 131, and the restoring member 140 is used for pushing the displacement limiting module 130, so that a variable movement distance is provided between the positioning stage 114 and the pushed stage 131, in this embodiment, the restoring member 140 includes one of a first compression spring 141, a second compression spring 142 and a third compression spring 143, or the restoring member 140 includes a combination of the first compression spring 141, the second compression spring 142 and the third compression spring 143, that is, the restoring member 140 may include the first compression spring 141 and the second compression spring 142, or the restoring member 140 may include the first compression spring 141 and the third compression spring 143, or the restoring member 140 may include the second compression spring 142 and the third compression spring 143, or the restoring member 140 may include the first compression spring 141, the second compression spring 141, the third compression spring 143, The second compression spring 142 and the third compression spring 143.
Referring to fig. 3 and 4, when the restoring element 140 includes the first compression spring 141, one end of the first compression spring 141 abuts against the positioning carrier 114, the other end abuts against the pushed carrier 131, and the first compression spring 141 surrounds the engaging element 132.
Referring to fig. 3, 4 and 5, when the restoring member 140 includes the second compression spring 142, the displacement limiting module 130 further includes a pushed plate 133, the pushed plate 133 is coupled to the coupling member 132, the pushed plate 133 is limited between the positioning stage 114 and the pushed stage 131, one end of the second compression spring 142 abuts against the positioning stage 114, the other end of the second compression spring 142 abuts against the pushed plate 133, and the second compression spring 142 surrounds the coupling member 132, in this embodiment, the pushed stage 131 has a first through hole 131a, an aperture of the first through hole 131a is larger than an outer diameter of a head 132a of the coupling member 132, the head 132a of the coupling member 132 is located in the first through hole 131a, preferably, the pushed plate 133 abuts against the head 132a of the coupling member 132, the pushed plate is limited between the positioning stage 114 and the head 132a, the pushed plate 133 has a third through hole 133a, the coupling member 132 movably penetrates through the third through hole 133a, the aperture of the third through hole 133a is smaller than the outer diameter of the head portion 132a of the coupling member 132, the head portion 132a protrudes from the surface 131d of the pushed stage 131, and the surface 131d faces the driving member 200.
Referring to fig. 3, fig. 4 and fig. 5, in the present embodiment, the positioning element 140 includes the first compression spring 141 and the second compression spring 142, when the driving element 200 moves toward the positioning stage 114, the driving element 200 contacts the head 132a of the engaging element 132 and pushes the engaging element 132, the engaging element 132 pushes the push rod 121, so that the pushing element 122 protrudes from the cover 150, protrudes from the pushing element 122 of the cover 150 and pushes the carrier plate 10, so as to form a first pushing action, the pushing element 122 pushing the carrier plate 10 forces the chip 21 to break away from the wafer 20, preferably, the pushed stage 131 has at least one third vent hole 131c, the first vent hole 151, the first accommodating space 112a, the second vent hole 114c, the second accommodating space 112b and the third vent hole 131c form a vent channel, and a suction device (not shown) sucks the cover 150 of the carrier plate 10 through the vent channel, so as to prevent the carrier 10 from shifting when the pushing member 122 pushes the carrier 10 and the chip 21.
Referring to fig. 3 and 4, the second end portion 121b of the push rod 121 is provided with a first screw hole 121c, the end portion 132b of the combining member 132 is provided with an external thread, the end portion 132b of the combining member 132 is screwed in the first screw hole 121c, and by adjusting the combining depth of the combining member 132 and the first screw hole 121c, the displacement of the combining member 132 pushing the push rod 121 of the pushing module 120 and the pushing member 122 to push the chip is adjusted, so that the chip 21 is separated from the wafer 20, and the chip is conveniently sucked by a vacuum suction nozzle (not shown).
Referring to fig. 3 and 4, the displacement limiting module 130 further has at least one guide post 134, the positioning carrier 114 has a second actuating hole 114b, the pushed carrier 131 has a second through hole 131b, the guide post 134 movably penetrates through the second through hole 131b and the second actuating hole 114b, and the engaging portion 134a of the guide post 134 is coupled to the housing 123, in this embodiment, the housing 123 has a second screw hole 123a, the engaging portion 134a of the guide post 134 has an external thread, the engaging portion 134a is screwed to the second screw hole 123a, and by adjusting a coupling depth of the guide post 134 and the second screw hole 123a, a displacement of the coupling member 132 pushing the push rod 121 and the pushing member 122 of the pushing module 120 to push the chip is adjusted.
Referring to fig. 3 and 4, the outer diameter of the head 134b of the guide post 134 is not smaller than the inner diameter of the second through hole 131b, so that the head 134b of the guide post 134 is limited outside the pushed stage 131, and the pushed stage 131 is combined with the positioning stage 114 by the guide post 134.
Referring to fig. 3 and fig. 4, when the driving element 200 moves toward the positioning carrier 114 and the driving element 200 pushes the engaging element 132, if the driving element 200 continues to move toward the positioning carrier 114, the driving element 200 will contact and push the pushed carrier 131, so that the pushed carrier 131 and the engaging element 132 rise synchronously to form a second pushing action.
Referring to fig. 3 and 4, when the restoring element 140 includes the third compression spring 143, the third compression spring 143 surrounds the guide post 134, one end of the third compression spring 143 abuts against the pushed stage 131, and the other end of the third compression spring 143 abuts against the housing 123 through the second through hole 114b, in this embodiment, the housing 123 is movably disposed in the first accommodating space 112a, and the housing 123 can be selectively close to the opening 113 or far from the opening 113.
Referring to fig. 3 and 4, after the driving element 200 moves toward the positioning carrier 114 and the driving element 200 pushes the combination element 132 and the pushed carrier 131, if the driving element 200 continues to move toward the positioning carrier 114, the driving element 200 will contact and push the guide pillar 134, so that the pushed carrier 131, the combination element 132, the guide pillar 134, the housing 123 and the pushing module 120 rise synchronously to form a third pushing action.
The present invention controls the displacement of the pushing member 122 of the pushing module 120 to push up the chip 21 by means of the variable moving distance between the positioning carrier 114 and the pushed carrier 131, so as to avoid the problem caused by insufficient or too much displacement of the pushing member 122 to push the chip 21.
Although the present invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention.
Claims (16)
1. A chip ejection structure, comprising:
the barrel is provided with a barrel wall, an accommodating space, an opening and a positioning carrying platform, the accommodating space is communicated with the opening, the positioning carrying platform is positioned in the accommodating space, the positioning carrying platform is fixed on the barrel wall, and the accommodating space is divided into a first accommodating space and a second accommodating space by the positioning carrying platform;
the pushing module is arranged in the first accommodating space and is provided with a push rod and a pushing piece, and the pushing piece is combined with the first end part of the push rod;
the displacement limiting module is movably arranged in the second accommodating space and is provided with a pushed platform and a combining piece, the tail end part of the combining piece is combined with the second end part of the push rod, and the displacement limiting module can be pushed by the driving piece to move towards the direction of the positioning platform, so that the combining piece pushes the push rod and the pushing piece pushes the chip; and
the reset piece is arranged between the positioning carrier and the pushed carrier and used for pushing the displacement limiting module to enable a variable moving distance to be formed between the positioning carrier and the pushed carrier.
2. The structure of claim 1, wherein the positioning stage has a first actuating hole, and the pushing rod or the engaging member movably penetrates through the first actuating hole.
3. The chip ejection structure of claim 1, wherein the reset element comprises a first compression spring, one end of the first compression spring abuts against the positioning stage, the other end abuts against the pushed stage, and the first compression spring surrounds the engaging element.
4. The structure of any one of claims 1 to 3, wherein the displacement limiting module further comprises a pushed plate, the reset member comprises a second compression spring, the pushed plate is coupled to the coupling member, the pushed plate is limited between the positioning stage and the pushed stage, one end of the second compression spring abuts against the positioning stage, the other end abuts against the pushed plate, and the second compression spring surrounds the coupling member.
5. The chip ejection structure according to claim 4, wherein the pushed stage has a first through hole, the first through hole has a diameter larger than an outer diameter of a head of the bonding member, and the head of the bonding member is located in the first through hole.
6. The chip ejection structure of claim 5, wherein the head portion protrudes from a surface of the pushed stage, the surface facing the driving member.
7. The chip ejection structure according to claim 5, wherein the pushed plate abuts against the head of the bonding member, and the pushed plate is confined between the positioning stage and the head.
8. The chip ejection structure according to claim 7, wherein the plate has a third through hole, the coupling member movably penetrates through the third through hole, and the diameter of the third through hole is smaller than the outer diameter of the head of the coupling member.
9. The chip ejection structure according to claim 1, wherein the second end of the push rod is provided with a first screw hole, the end of the connector has an external thread, and the end of the connector is screwed into the first screw hole.
10. The chip ejecting structure according to claim 1, wherein the ejecting module has a housing, the housing is disposed in the first receiving space, the pushing rod and the ejecting member are disposed in the housing, the displacement limiting module further has at least one guide post, the positioning stage has a second actuating hole, the pushed stage has a second through hole, the guide post movably penetrates through the second through hole and the second actuating hole, and a joint portion of the guide post is coupled to the housing, an outer diameter of a head portion of the guide post is not smaller than an inner diameter of the second through hole, so that the head portion of the guide post is restricted outside the pushed stage, and the pushed stage is coupled to the positioning stage via the guide post.
11. The chip ejection structure according to claim 10, wherein the housing is provided with a second screw hole, the engaging portion of the guide post has an external thread, and the engaging portion is screwed into the second screw hole.
12. The structure of claim 10 or 11, wherein the reset element comprises a third compression spring surrounding the guide post, and one end of the third compression spring abuts against the pushed carrier, and the other end of the third compression spring abuts against the housing through the second through hole.
13. The chip ejection structure according to claim 12, wherein the housing is movably disposed in the first accommodating space, and the housing is selectively close to the opening or away from the opening.
14. The chip ejection structure according to claim 1, wherein the cylinder includes a first cylinder portion and a second cylinder portion, the first cylinder portion and the second cylinder portion are independent bodies, the second cylinder portion is combined with the first cylinder portion, the first cylinder portion surrounds the first receiving space, and the second cylinder portion surrounds the second receiving space.
15. The chip ejection structure of claim 14, wherein the positioning stage is disposed on the second barrel portion.
16. The chip ejection structure according to claim 1, further comprising a cover covering the opening, the cover having at least one first vent hole, the first vent hole communicating with the first receiving space, the positioning stage having at least one second vent hole, the second vent hole communicating with the first receiving space and the second receiving space, the pushed stage having at least one third vent hole, the first receiving space, the second vent hole, the second receiving space, and the third vent hole forming a vent channel.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109112709 | 2020-04-15 | ||
| TW109112709A TWI767211B (en) | 2020-04-15 | 2020-04-15 | Chip detachment apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113539933A true CN113539933A (en) | 2021-10-22 |
Family
ID=73721557
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010372950.2A Pending CN113539933A (en) | 2020-04-15 | 2020-05-06 | Chip ejection structure |
| CN202020722246.0U Active CN212161785U (en) | 2020-04-15 | 2020-05-06 | Chip ejection structure |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020722246.0U Active CN212161785U (en) | 2020-04-15 | 2020-05-06 | Chip ejection structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN113539933A (en) |
| TW (1) | TWI767211B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117438370A (en) * | 2023-12-21 | 2024-01-23 | 无锡星微科技有限公司杭州分公司 | Precise ejection mechanism of automatic wafer sorting machine |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4850780A (en) * | 1987-09-28 | 1989-07-25 | Kulicke And Soffa Industries Inc. | Pre-peel die ejector apparatus |
| TWI497631B (en) * | 2012-12-17 | 2015-08-21 | Hon Soon Internat Technology Co Ltd | Chip ejection device |
| TWM600474U (en) * | 2020-04-15 | 2020-08-21 | 竑昇國際科技有限公司 | Chip detachment apparatus |
-
2020
- 2020-04-15 TW TW109112709A patent/TWI767211B/en active
- 2020-05-06 CN CN202010372950.2A patent/CN113539933A/en active Pending
- 2020-05-06 CN CN202020722246.0U patent/CN212161785U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117438370A (en) * | 2023-12-21 | 2024-01-23 | 无锡星微科技有限公司杭州分公司 | Precise ejection mechanism of automatic wafer sorting machine |
| CN117438370B (en) * | 2023-12-21 | 2024-03-19 | 无锡星微科技有限公司杭州分公司 | Precise ejection mechanism of automatic wafer sorting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN212161785U (en) | 2020-12-15 |
| TW202143356A (en) | 2021-11-16 |
| TWI767211B (en) | 2022-06-11 |
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