TWI765726B - Polishing system and dressing device thereof - Google Patents

Abstract

Provided is a dressing device for a carrier. The dressing device comprises a dresser, a swing arm, a base and at least one damper. A first end and a second end of the swing arm are coupled to the dresser and the base, respectively, and the at least one damper is disposed inside the swing arm. Any axial vibration of the dresser or the swing arm during dressing for the carrier can be compensated or attenuate by the damper in an active manner properly, so as to make the surface of the carrier more flat and uniform, which not only improves a removal rate of material and a polishing result of the surface in the subsequent chemical mechanical planarization process, but also extend the service life of the carrier. The present disclosure further relates to a polishing system for dressing the carrier by using the said dressing device.

Description

Polishing system and its dressing device

The present disclosure relates to the application of chemical-mechanical planarization/polishing (CMP) process, especially to the trimming device of the carrier.

The CMP process is a common process used in the semiconductor industry to manufacture silicon wafers with smooth and flat surfaces. The most important performance indicators are the uniformity of the polished wafer, the smoothness of the IC circuit, the material removal rate, and the CMP process. factors such as the life of consumables.

The CMP process can be used for a comprehensive planarization process, in which a carrier (eg, a polishing head) rotates and presses a wafer or substrate onto the surface of a carrier (eg, a polishing pad) that is rotated by a rotating platform, and Provide a polishing liquid with chemical properties on the surface of the carrier to generate a passivation layer with soft structural properties on the surface of the wafer or substrate, and cooperate with the abrasive (abrasive) carried on the surface of the carrier to mechanically move the passivation layer. removal to obtain a flat wafer or substrate. A long CMP process will cause debris and abrasive particles of the wafer or substrate to block the holes of the carrier or passivate the surface of the carrier, resulting in a decrease in the material removal rate of the wafer or substrate. Improve its performance to maintain the quality of the wafer or substrate.

However, the vibration of the CMP process tool itself, the reciprocating sweep of the dresser when dressing the surface of the carrier, the rotation of the carrier, the rotation of the dresser body, and the non-uniformity of the carrier itself may cause the dresser (eg, diamond The trimmer) shakes and vibrates during the trimming process of the carrier, but the known CMP process machines do not effectively compensate or weaken the vibration of the trimmer during the trimming process, which will affect the trimmed carrier. The flatness of the surface and the characteristics of the surface microstructure even lead to poor material removal rate and surface polishing results of the wafer in the subsequent CMP process. Especially in today's advanced semiconductor manufacturing process, the above-mentioned problems will become more serious and cannot be ignored.

Therefore, how to propose an effective solution to the above problems, improve the dressing performance of the dresser and prolong the service life of the carrier, is an important issue to be solved urgently in the field.

In order to solve the above problems, the present disclosure provides a trimming device, comprising: a trimmer, which is used for trimming the surface of a carrier; a rocker arm, which has a first end and a second end opposite to the first end, wherein, The first end is coupled to the trimmer; a base is coupled to the second end, and the base is configured to sweep the rocker arm and the trimmer back and forth on the surface of the carrier; and at least one damper disposed inside the rocker arm to adjust the vibration of the trimmer or the rocker arm during the reciprocating sweep.

In some embodiments of the present disclosure, the at least one damper is disposed near the first end.

In some embodiments of the present disclosure, the at least one damper includes a longitudinal axis damper, a transverse axis damper, or a combination of the two, wherein the longitudinal axis damper is used to adjust the trimmer or the rocker. The oscillation of the arm perpendicular to the surface of the carrier during the reciprocating sweep, and the transverse axial damper is used to adjust the trimmer or the rocker arm parallel to the surface of the carrier during the reciprocating sweep The shock. In some embodiments of the present disclosure, the at least one damper includes the transverse axis damper and the longitudinal axis damper.

In some embodiments of the present disclosure, the at least one damper includes a tuned mass damper. In some embodiments of the present disclosure, the tuned mass damper is an active tuned mass damper. In some embodiments of the present disclosure, the active tuned mass damper includes: a sensor for sensing a real-time motion signal corresponding to the oscillation of the trimmer or the arm during the reciprocating sweeping motion ; a control unit configured to calculate the oscillating load according to the real-time motion signal, and to generate a control signal according to the load; and an actuator configured to adjust the damping coefficient of the active tuned mass damper according to the control signal, Then, the active tuned mass damper outputs an active control force for suppressing the load of the oscillation.

In some embodiments of the present disclosure, the active tuned mass damper includes: a piezoelectric sensor for sensing a real-time corresponding to the oscillation of the trimmer or the arm during the reciprocating sweep. acceleration signal; a control circuit configured to calculate the oscillating load according to the real-time acceleration signal, and to generate a control signal according to the load; and a piezoelectric actuator configured to adjust the active tuning mass damper according to the control signal damping coefficient, so that the active tuned mass damper outputs an active control force for suppressing the load of the oscillation. In some embodiments of the present disclosure, the piezoelectric actuator is configured to output the active control force at a damping frequency that suppresses the oscillation.

In some embodiments of the present disclosure, the base includes a rotating shaft, which is controlled by an actuator to pivot to drive the rocker arm and the trimmer to reciprocate over the surface of the carrier.

The present disclosure further provides a polishing system, comprising: a rotating platform; a carrier, which is disposed on the upper surface of the rotating platform to carry a wafer or a substrate; a carrier, which is disposed above the bearing to carry the wafer or the substrate It is fixed on the surface of the carrier and polished; the trimming device of the present disclosure is arranged above the carrier to trim the surface of the carrier.

In some embodiments of the present disclosure, it further includes: a nozzle disposed above the carrier to provide polishing liquid containing abrasive to the surface of the carrier.

To sum up, the polishing system and its dressing device of the present disclosure are mainly provided with at least one damper inside the rocker arm of the dressing device, so as to properly compensate or weaken any axial stress on the dresser or rocker arm during the dressing of the carrier. Oscillation can make the surface of the trimmed carrier reach the expected roughness, flatness, uniformity and microstructure, which can not only improve the material removal rate and surface polishing results in the subsequent chemical mechanical planarization process, but also prolong the life of the carrier. service life.

The embodiments of the present disclosure are described below by specific examples, and those skilled in the art to which the present disclosure pertains can easily understand the advantages and effects of the present disclosure from the content disclosed herein. However, the specific embodiments set forth herein are not intended to limit the present disclosure, and the present disclosure can also be implemented or applied by other different embodiments, and the details set forth herein can also be based on different viewpoints and applications. Various changes or modifications are conferred without departing from the scope of the present disclosure.

The structures, proportions, sizes, etc. shown in the drawings herein are only used to cooperate with the contents disclosed herein, so as to be read and understood by those with ordinary knowledge in the technical field to which the present disclosure pertains, and are not intended to limit the scope of the present disclosure. Therefore, any modification of the structure, change of the proportional relationship, or adjustment of the size shall belong to the technical content disclosed in the present disclosure without affecting the effect and the purpose achieved by the present disclosure. scope of coverage.

When "comprising", "comprising" or "having" a specific element described herein, unless otherwise specified, other elements, components, structures, regions, parts, devices, systems, steps, connection relationships and other elements may be included, rather than excluding such other elements.

Sequential terms such as "first" or "second" described herein are only for convenience in describing or distinguishing elements, components, structures, regions, parts, devices, systems, etc., and are not used to limit the scope of the present disclosure. The scope of implementation is not intended to limit the spatial order of these elements. In addition, the singular forms "a" and "the" described herein also include the plural forms, and "or" is used interchangeably with "and/or" unless the context clearly dictates otherwise.

The spatially relative terms such as "on", "above", "parallel" and "perpendicular" described herein are only for the convenience of clarifying the difference between one element or feature and other elements or features in the specific embodiments of the present disclosure. The relative position and relationship of this disclosure are not used to limit the scope of implementation of this disclosure. The adjustment, exchange and change of the relative positions and relationships shall be deemed to be implementable in this disclosure, provided that the technical content of this disclosure is not substantially changed. range. In addition, "parallel" as used herein means substantially parallel, which includes the situation where the angle between two elements, two axes or two planes is between -10 degrees and +10 degrees of an angle of 0 degrees, eg -5 degrees degrees to 5 degrees; "perpendicular" as used herein means substantially vertical, which includes the situation where the angle between two elements, two axes or two planes is between -10 degrees and +10 degrees of a 90 degree angle, For example 85 degrees to 95 degrees.

The term "coupled" as used herein means that a plurality of elements are directly or indirectly joined together, mechanically, chemically, electrically, magnetically, or a combination of both, and "directly coupled" refers to a plurality of The elements are connected together by direct contact, and "indirectly coupled" means that a plurality of elements are connected together by at least one coupling member. Means to achieve "coupling" as described herein include, but are not limited to, tightly or gapped connecting, pivoting, joining, stitching, joining, adhering, fitting, screwing, snapping, stapling, clipping, attaching, Threading, clamping, placement, integral molding, or a combination of two or more of them. The term "coupling" herein refers to an element that achieves the above-mentioned means of "coupling".

The term "actuator" as used herein refers to a powered device that converts various sources of energy or power into mechanical kinetic energy to drive movement of an object, device, or system. The actuator has different implementations according to the type of the energy or power source. In at least one embodiment of the present disclosure, the actuator includes, but is not limited to, a pneumatic actuator (for example, a pneumatic cylinder), Hydraulic actuators (eg, hydraulic cylinders), electrical actuators (eg, DC motors, AC motors, or stepper motors), electromechanical hybrid actuators (eg, solenoid valves). In at least one embodiment of the present disclosure, the actuator is used to drive the object, device or system to rotate. In at least one embodiment of the present disclosure, the actuator is a piezoelectric actuator.

Referring to FIG. 1 , the conditioning device 22 of the present disclosure can be applied to a polishing system 2 of a polishing process (eg, a CMP process). In at least one embodiment of the present disclosure, the polishing system 2 includes a rotating platform 20, a carrier 21 (eg, a polishing pad or lap disc with or without abrasive, a polishing pad with or without grooves) , grinding disc or chassis, or the like), trimming device 22 , carrier 23 (eg, grinding head) and spray head 24 . The carrier 21 is disposed on the upper surface of the rotary table 20 to carry the wafer 25, and rotates with the rotation of the rotary table 20; the carrier 23 is disposed above the carrier 21 to fix (for example, suck) the wafer 25, and rotate and The wafer 25 is pressed down to the surface of the carrier 21 for polishing; the shower head 24 is arranged above the carrier 21 to provide a polishing liquid containing abrasives and chemical properties to the upper surface of the carrier 21 to help the carrier 21 to the wafer 25 The surface is polished. In at least one embodiment of the present disclosure, the rotating platform 20 or the carrier 23 is configured to be controlled by an actuator (not shown) to rotate.

In at least one embodiment of the present disclosure, the carrier 21 is a flexible elastic pad, which itself cannot perform material removal (ie, trimming) with a fixed depth of cut, and needs to be ground and trimmed in a force-controlled manner. In order to optimize the trimming of the carrier 21 without affecting (or optimizing) the material removal rate and surface polishing results of the subsequent wafers 25 or substrates, the trimming device 22 in at least one embodiment of the present disclosure is used in addition to During the polishing process, conditioning, cleaning, and roughness regeneration of the carrier 21 are performed, and the vibration during the conditioning operation can also be adjusted.

FIG. 2 shows the implementation of the trimming device 22 in the polishing system 2 on the carrier 21 from a side view. Components other than the trimming device 22 and the carrier 21 are as described above and will not be repeated here. In at least one embodiment of the present disclosure, the trimming device 22 includes a base 221 , a rocker arm 222 and a trimmer 223 . The rocker arm 222 has a first end 2221 and a second end 2222 opposite to the first end 2221 , wherein the first end 2221 is coupled to the trimmer 223 and the second end 2222 is coupled to the base 221 . In at least one embodiment of the present disclosure, the base 221 is disposed outside the rotating platform 20 . In at least one embodiment of the present disclosure, the base 221 includes a pivot shaft controlled by an actuator (not shown), which is used as a support point to drive the rocker arm 222 to swing above the carrier 21 . (eg, reciprocating sweeping), and then drive the trimmer 223 to swing (eg, reciprocating sweeping) on the surface of the carrier 21 to perform trimming. In at least one embodiment of the present disclosure, the trimmer 223 is a diamond trimmer, which can be suspended above the carrier 21 and pressed down as appropriate (eg, when approaching the place to be trimmed), and through its bottom surface The diamond abrasive retextures the surface of the carrier 21 by means of rotational friction.

In at least one embodiment of the present disclosure, the dressing device 22 further includes at least one damper 30 to accommodate (eg, compensate or attenuate) the impact of the carrier 21 on the rotating platform 20 due to vibrations of the polishing system itself during dressing of the carrier 21 . Rotation on the upper side (for example, rotating around the center of the rotating platform 20 ), the rotation and depression of the trimmer 223 when the carrier 21 is trimmed, the swing of the rocker arm 222 itself (for example, reciprocating sweeping), or the carrier 21 Oscillation (for example, vibration or shaking) due to unevenness of the surface, etc. In at least one embodiment of the present disclosure, at least one damper 30 is disposed inside the rocker arm 222 , preferably, at least one damper 30 is disposed inside the rocker arm 222 near the first end 2221 . In at least one preferred embodiment of the present disclosure, at least one damper 30 is disposed at the first end 2221 inside the rocker arm 222 (ie, the rocker arm 222 is located above the trimmer 223 ), because the distance from the first end 2221 is The base 221 as the support point is the farthest, resulting in the largest longitudinal and lateral amplitudes when the rocker arm 222 reciprocates, so the damper 30 disposed at the first end 2221 can maximize its effect of suppressing vibration. In other embodiments of the present disclosure, the installation position of the at least one damper 30 can also be arranged at other positions of the rocker arm 222 or at the base 221 depending on the structure of the trimming device 22 and its actual vibration suppression requirements. In still other embodiments of the present disclosure, at least one damper 30 can be additionally mounted on the rocker arm 222 to meet the user's needs for maintenance or replacement at any time.

The term "damper" as used herein refers to an element, device or system that dampens oscillations by means of damping properties.

In at least one embodiment of the present disclosure, the trimming device 22 includes at least one axial damper; Oscillation in different axes. The term "axial damper" herein refers to a damper that provides damping in at least one axial direction and has at least one degree of freedom. 3A and 3B show the trimming device 22 according to an embodiment of the present disclosure, which includes a longitudinal-axial damper 31 and a transverse-axial damper 32 .

The longitudinal axis damper 31 shown in FIG. 3A is arranged at the first end 2221 of the rocker arm 222 in parallel with the pressing direction of the trimmer 223 (ie, perpendicular to the direction of the surface of the carrier 21 ), so as to adjust (eg, , compensation or weakening) perpendicular to the force vibration of the trimmer 223. Therefore, when the trimmer 223 is pressed down to the surface of the carrier 21 for trimming, the damper 31 in the longitudinal axis can suppress the unevenness of the surface of the carrier 21 or the pressing of the trimmer 223 (relative to the carrier 21) surface) of the longitudinal oscillation.

The transverse axial damper 32 shown in FIG. 3B is arranged at the first end 2221 of the rocker arm 222 in a direction parallel to the reciprocating sweeping direction of the rocker arm 222 (ie, parallel to the direction of the surface of the bearing member 21 ) to adjust ( For example, compensating or attenuating) the force vibrations parallel to the trimmer 223 . Therefore, when the dresser 223 performs dressing on the surface of the carrier 21, the transverse axial damper 32 can suppress the grinding caused by the rotation of the dresser 223, the rotation of the carrier 21 itself, the reciprocating sweep of the rocker arm 222, and the carrier. The lateral oscillation (relative to the surface of the carrier 21) caused by the unevenness of the surface of 21.

With the synergistic effect of the above-mentioned longitudinal and transverse dampers 31 and 32, the vibration interference of the rocker arm 222 or the trimmer 223 during the trimming operation can be effectively suppressed, so that the surface of the trimmed bearing member 21 can reach the expected surface. roughness, flatness and uniformity, and prolong the service life of the carrier 21. In other embodiments of the present disclosure, in addition to the above-mentioned longitudinal-axial dampers 31 and transverse-axial dampers 32 , the trimming device 22 further includes other axial dampers to adjust other axial vibrations. In still other embodiments of the present disclosure, the single-axis damper can also adjust the oscillation of different axial directions at the same time.

In at least one embodiment of the present disclosure, the trimming device 22 includes a passive damper, an active damper, or a combination of the two.

The term "passive damper" as used herein refers to damper 30 that cannot be actively controlled. In at least one embodiment of the present disclosure, the passive damper includes an elastic element (eg, a spring or an elastic material) and a damping mass m (eg, a mass), and the elastic element is connected with the damping mass m for trimming Vibration is suppressed during operation.

The term "active damper" as used herein refers to damper 30 that can be actively controlled. In at least one embodiment of the present disclosure, the active damper includes a sensor (eg, a position sensor, a speed sensor, an acceleration sensor, or a combination of two or more), a control unit ( For example, control circuits or controllers) and actuators (eg, piezoelectric actuators), wherein the sensor is used to detect motion signals (eg, position, velocity, acceleration) corresponding to vibrations during the trimming operation or a combination of two or more), the control unit generates a control signal according to the motion signal to drive the actuator to suppress the oscillation. In some embodiments of the present disclosure, the actuator adjusts the damping coefficient of the active damper, so that the active damper outputs an active control force for suppressing the oscillation. In other embodiments of the present disclosure, the active damper includes a damping mass m (eg, a mass), and the actuator can suppress the oscillation by changing the position or movement of the damping mass m.

In at least one embodiment of the present disclosure, the damper 30 has a converter (not shown) to convert the oscillating mechanical energy during the trimming operation into electrical energy or thermal energy, so as to reduce the energy of the oscillation and achieve the purpose of suppressing the oscillation. Effect.

In at least one embodiment of the present disclosure, the damper 30 may be a tuned mass damper (TMD), and when the vibration frequency of the tuned mass damper matches the vibration frequency during the above-mentioned trimming operation, the vibration is generated. The energy will be transferred to the tuned mass damper to dampen the oscillation. The tuned mass damper includes passive tuned mass damper (Passive Tuned Mass Damper, PTMD) and active tuned mass damper (Active Tuned Mass Damper, ATMD). The vibration frequency and damping value of the passive tuned mass damper are fixed. In order to suppress the vibration of a fixed frequency; and the active tuning mass damper can adjust its vibration frequency and damping value according to the real-time change of the vibration, so it can respond to various vibration situations during the trimming operation. In at least one embodiment of the present disclosure, the trimming device 22 includes a passive tuned mass damper, an active tuned mass damper, or a combination of the two. In some embodiments of the present disclosure, both the longitudinal axis damper 31 and the transverse axis damper 32 are active tuned mass dampers. In some embodiments of the present disclosure, the active tuned mass damper is a phase control active tuned mass damper (PC-ATMD).

FIG. 4 shows a specific embodiment of at least one damper 30 (including a longitudinal-axial damper 31 and a transverse-axial damper 32 ) of the present disclosure, which is an active tuned mass damper and includes at least one piezoelectric sensor 301, control circuit 302, piezoelectric actuator 303 and other components.

In FIG. 4 , the piezoelectric sensor 301 is used to sense the real-time acceleration signal corresponding to the vibration during the above-mentioned trimming operation, and the real-time acceleration signal can be used to determine the axis of the vibration and subsequently calculate the load of the vibration. Then, the real-time acceleration signal is sent to the control circuit 302 to calculate the load of the oscillation. The oscillating load is used as a reference for controlling the damper 30 to generate an active control force for suppressing the oscillating vibration. The calculation method is detailed with reference to FIG. 5 and its related descriptions as follows. Finally, the control circuit 302 generates a control signal according to the calculated load of the oscillation, and transmits it to the piezoelectric actuator 303, so that the at least one damper 30 performs corresponding adjustment for the oscillation. The calculation method is detailed in FIG. 5 and Its related description is as follows. Accordingly, in response to the oscillation of the rocker arm 222 or the trimmer 223 during the trimming operation, the piezoelectric actuator 303 adjusts the damping coefficient of the at least one damper 30 and makes the at least one damper 30 output at a damping frequency corresponding to oscillation sufficient to resist Or offset (ie, compensate or weaken) the active control force of the load of the shock, so that the shock can be controlled within a predetermined range, so as to achieve the best shock suppression effect.

FIG. 5 further illustrates the physical properties of the trimming device 22 and at least one damper 30 when the trimming device 22 encounters vibration during the trimming operation. The control circuit 302 can be used in conjunction with the following to understand the load on the trimmer 223 that may be subjected to vibration. Calculate and correspond to the operation process of generating the control signal.

所示，其相應箭號所指示的方向係代表震盪的任一種軸向。 First, the real-time acceleration of the vibration sensed by the piezoelectric sensor 301 can be converted into a load by the control circuit 302 (eg, using a general force conversion equation), as shown in FIG. 5

As shown, the directions indicated by the corresponding arrows represent any axis of oscillation.

表示為代表動力學方程式的下列數學式： [數學式1]

其中，

係代表修整裝置22的質量；

係代表阻尼器30的質量；

係代表修整裝置22的阻尼係數；

係代表阻尼器30的阻尼係數；

係代表修整裝置22的彈性係數；

係代表阻尼器30的彈性係數；並且

、

、

係分別代表修整裝置22關於時間

的位移、速度及加速度等函數的震動響應；而

、

、

係代表阻尼器30關於時間

的位移、速度及加速度等函數的震動響應。 Next, set the load to be adjusted

Expressed as the following mathematical formula representing the kinetic equation: [Mathematical formula 1]

in,

is the quality of the dressing device 22;

is the mass of the damper 30;

is the damping coefficient of the trimming device 22;

is the damping coefficient of the damper 30;

is the elastic modulus of the dressing device 22;

is the elastic coefficient of damper 30; and

,

,

are respectively representative of the trimming device 22 with respect to time

vibration response as a function of displacement, velocity, and acceleration; and

,

,

The line represents the damper 30 with respect to time

The vibration response as a function of displacement, velocity, and acceleration.

經拉普拉斯轉換為線性非時變函數，藉以預計由壓電致動器303輸出的主動控制力

，其表達為下列數學式： [數學式2]

其中，此處數學式2的組成形式與數學式1相似，差別在於數學式2將前述代表修整裝置22之震動響應的

、

、

以集合

表示，且將前述代表阻尼器30之震動響應的

、

、

係以集合

表示，並將其他變數進行對應的整理。 Then apply the above load

Laplace transformation to a linear time-invariant function to predict the active control force output by the piezoelectric actuator 303

, which is expressed as the following equation: [Math 2]

Wherein, the composition form of the mathematical formula 2 here is similar to the mathematical formula 1, and the difference is that the mathematical formula 2 uses the aforementioned vibration response representing the trimming device 22 .

,

,

to set

represents, and will the aforementioned represent the vibration response of the damper 30

,

,

collection

represent and organize other variables accordingly.

其中，

代表修整裝置22（在無阻尼狀態下）的固有頻率；

代表修整裝置22的阻尼比；

, 代表阻尼器30對於修整裝置22的質量比；而

代表阻尼器30對於修整裝置22的基礎頻率比。 Then, the second equations of Equation 2 are added and arranged to form the following Equation: [Equation 3]

in,

represents the natural frequency of the trimming device 22 (in the undamped state);

represents the damping ratio of the trimming device 22;

, represents the mass ratio of the damper 30 to the trimming device 22; and

represents the fundamental frequency ratio of damper 30 to trim device 22 .

進行調節。 The control circuit 302 can understand the frequency characteristics of the damper 30 according to the calculation result of the above-mentioned formula 3, and then decide how to adjust the damping coefficient of the damper 30, so as to appropriately output the active control force when encountering shocks

Make adjustments.

，藉以評估阻尼器30輸出預定的主動控制力

所需的調整內容(包括輸出主動控制力

的特定阻尼頻率及所需阻尼係數的調整範圍)，其係如以下數學式所示： [數學式4]

Finally, the system transfer function of the damper 30 is calculated based on the above-mentioned Equation 3

, so as to evaluate the damper 30 to output a predetermined active control force

Adjustments required (including output active control

the specific damping frequency and the adjustment range of the required damping coefficient), which are shown in the following equation: [Math 4]

操控阻尼器30調整自身的阻尼係數並以對應震盪的阻尼頻率輸出主動控制力

，藉以對修整器223進行修整作業期間所遭遇震盪進行補償或弱化，達到預期之抑震效果。 Therefore, the control circuit 302 can generate a control signal according to the calculation results of the above-mentioned mathematical formula 3 and mathematical formula 4, and control the piezoelectric controller 303 based on the system transfer function

Control the damper 30 to adjust its own damping coefficient and output the active control force at the damping frequency corresponding to the oscillation

, so as to compensate or weaken the vibration encountered by the trimmer 223 during the trimming operation, so as to achieve the expected shock suppression effect.

To sum up, the polishing system and the dressing device of the present disclosure are mainly provided with at least one damper inside the rocker arm of the dressing device, and the damper can properly compensate or weaken the conditioner or the rocker arm on the carrier in an active manner. The vibration of any axial direction during the trimming can make the surface of the trimmed carrier reach the expected roughness, flatness, uniformity and microstructure, which can not only improve the material removal rate and surface in the subsequent chemical mechanical planarization process As a result of polishing, the service life of the carrier can also be extended.

2: Polishing System 20: Rotary Platform 21: Carrier 22: Dressing Device 221: Base 222: Rocker Arm 2221: First End 2222: Second End 223: Dresser 23: Carrier 24: Nozzle 25: Wafer 30: Damper 301 : Piezoelectric sensor 302 : Control circuit 303 : Piezoelectric actuator 31 : Longitudinal axis damper 32 : Transverse axis damper c ₁ : Trimming device damping coefficient c ₂ : Damper damping coefficient f ( t): load k ₁ : elastic coefficient of dressing device k ₂ : elastic coefficient of damper m: damping mass m ₁ : mass of dressing device m ₂ : damper mass

FIG. 1 is a schematic diagram of components of a polishing system according to at least one embodiment of the disclosure.

FIG. 2 is a side view of a trimming apparatus and a wafer according to at least one embodiment of the disclosure.

FIG. 3A is a side view of a trimming device that discloses at least one embodiment thereof.

FIG. 3B is a top view of the trimming device shown in FIG. 3A .

FIG. 4 is a schematic view of an implementation aspect of the trimming device disclosed in at least one embodiment thereof.

FIG. 5 is a schematic diagram of an implementation aspect of the trimming device disclosed in at least one embodiment thereof.

21: Carrier

221: Pedestal

222: rocker arm

2221: First End

2222: Second end

223: Dresser

30: Damper

m: damping mass

Claims (7)

A trimming device, comprising: a trimmer for trimming the surface of a carrier; a rocker arm having a first end and a second end opposite the first end, wherein the first end is connected to the trimmer coupling; a base coupled to the second end, and the base is configured to sweep the rocker arm and the trimmer back and forth on the surface of the carrier; and at least one damper disposed on the an interior of a rocker arm to adjust the trimmer or oscillation of the rocker arm during the reciprocating sweep, wherein the at least one damper comprises an active tuned mass damper, and the active tuned mass damper comprises: sensing a controller, which is used to sense the real-time motion signal corresponding to the oscillation; a control unit, which is set to calculate the load of the oscillation according to the real-time motion signal, and generate a control signal according to the load; and an actuator, which is set In order to adjust the damping coefficient of the active tuning mass damper according to the control signal, the active tuning mass damper can output an active control force for suppressing the vibration of the load. The trimming device of claim 1, wherein the at least one damper is disposed proximate the first end. The trimming device of claim 1, wherein the at least one damper comprises a longitudinal-axial damper, a transverse-axial damper, or a combination of both, wherein the longitudinal-axial damper is used to adjust perpendicular to the The oscillation of the surface of the carrier, and the transverse axial damper is used to adjust the oscillation parallel to the surface of the carrier. The trimming device of claim 1, wherein the sensor is a piezoelectric sensor, the real-time motion signal is an instantaneous acceleration, the control unit is a control circuit, the actuator is a piezoelectric actuator, and The piezoelectric actuator is configured to output the active control force at a damping frequency that suppresses the oscillation. The dressing device of claim 1, wherein the base comprises a rotating shaft, which is controlled by an actuator to pivot to drive the rocker arm and the dresser to reciprocate on the surface of the carrier Swipe. A polishing system, comprising: a rotating platform; a carrier, which is arranged on the upper surface of the rotating platform to carry a wafer or a substrate; a carrier, which is arranged above the bearing to fix the wafer or the substrate on the bearing and polishing the surface; the trimming device according to any one of claims 1 to 5, which is arranged above the carrier to trim the surface of the carrier. The polishing system of claim 6, further comprising: a nozzle disposed above the carrier to provide polishing liquid containing abrasive to the surface of the carrier.

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