TW202245986A - Polishing system and dressing device thereof - Google Patents

Abstract

Provided is a dressing device for a carrier. The dressing device comprises a dresser, a swing arm, a base and at least one damper. A first end and a second end of the swing arm are coupled to the dresser and the base, respectively, and the at least one damper is disposed inside the swing arm. Any axial vibration of the dresser or the swing arm during dressing for the carrier can be compensated or attenuate by the damper in an active manner properly, so as to make the surface of the carrier more flat and uniform, which not only improves a removal rate of material and a polishing result of the surface in the subsequent chemical mechanical planarization process, but also extend the service life of the carrier. The present disclosure further relates to a polishing system for dressing the carrier by using the said dressing device.

Description

Polishing system and its dressing device

The present disclosure relates to the application of Chemical-Mechanical Planarization/Polishing (CMP) process, especially to the trimming device of the carrier.

The CMP process is a common process used in the semiconductor industry to manufacture silicon wafers with smooth and flat surfaces. The most important performance indicators are the uniformity of the polished wafer, the smoothness of the IC circuit, the material removal rate, and the efficiency of CMP. Factors such as the life of consumables.

The CMP process can be used for a comprehensive planarization process, which uses a carrier (such as a grinding head) to rotate and press a wafer or substrate onto the surface of a carrier (such as a polishing pad) that is driven by a rotating platform and rotates, and Provide a chemical polishing liquid on the surface of the carrier to produce a passivation layer with a soft structure on the surface of the wafer or substrate, and cooperate with the abrasive (abrasive) carried on the surface of the carrier to mechanically move the passivation layer In addition, a flat wafer or substrate is obtained. The long-time CMP process will cause the debris and abrasive particles of the wafer or substrate to block the holes of the carrier or passivate the surface of the carrier, so that the material removal rate of the wafer or substrate will be reduced. Therefore, it is necessary to repair the carrier to re- Improve its working performance to maintain the quality of wafer or substrate.

However, the vibration of the CMP process machine itself, the reciprocating sweep of the dresser when trimming the surface of the carrier, the rotation of the carrier, the rotation of the dresser body, and the unevenness of the carrier itself may cause the dresser (for example, diamond trimmer) shakes and vibrates during the trimming process of the carrier, but the currently known CMP process machines have not effectively compensated or weakened the vibration of the trimmer during the trimming process, which will affect the trimmed carrier. The flatness of the surface and the characteristics of the surface microstructure even lead to poor material removal rate and surface polishing results of the wafer in the subsequent CMP process. Especially in today's advanced semiconductor manufacturing process, the above problems will become more and more serious and cannot be ignored.

Therefore, how to propose an effective solution to the above-mentioned problems, and how to improve the trimming performance of the trimmer and prolong the service life of the carrier is an important issue to be solved urgently in this field.

In order to solve the above problems, the present disclosure provides a trimming device, including: a trimmer, which is used to trim the surface of the carrier; a rocker, which has a first end and a second end opposite to the first end, wherein, the first end is coupled to the trimmer; a base is coupled to the second end, and the base is configured to reciprocally sweep the swing arm and the trimmer on the surface of the carrier; And at least one damper, which is arranged inside the rocker arm to adjust the vibration of the trimmer or the rocker arm during the reciprocating sweeping.

In some embodiments of the present disclosure, the at least one damper is disposed near the first end.

In some embodiments of the present disclosure, the at least one damper includes a longitudinal damper, a transverse damper, or a combination of both, wherein the longitudinal damper is used to adjust the trimmer or the swing The oscillation of the arm perpendicular to the surface of the carrier during the reciprocating sweep, and the transverse axial damper is used to adjust the vibration of the trimmer or the rocker arm parallel to the surface of the carrier during the reciprocating sweep The shock. In some embodiments of the present disclosure, the at least one damper includes the transverse axial damper and the longitudinal axial damper.

In some embodiments of the present disclosure, the at least one damper includes a tuned mass damper. In some embodiments of the present disclosure, the tuned mass damper is an active tuned mass damper. In some embodiments of the present disclosure, the active tuned mass damper includes: a sensor for sensing an instantaneous motion signal corresponding to the oscillation of the trimmer or the arm during the reciprocating sweep a control unit configured to calculate a load of the oscillation based on the instant motion signal and generate a control signal based on the load; and an actuator configured to adjust the damping coefficient of the active tuned mass damper based on the control signal, Furthermore, the active tuned mass damper outputs an active control force for suppressing the vibration of the load.

In some embodiments of the present disclosure, the active tuned mass damper includes: a piezoelectric sensor for sensing the real-time corresponding to the oscillation of the trimmer or the arm during the reciprocating sweep. an acceleration signal; a control circuit configured to calculate a load of the oscillation based on the instantaneous acceleration signal and generate a control signal based on the load; and a piezoelectric actuator configured to adjust the active tuned mass damper based on the control signal damping coefficient, so that the active tuned mass damper outputs an active control force of the load that suppresses the oscillation. In some embodiments of the present disclosure, the piezoelectric actuator is configured to output the active control force at a damped frequency that suppresses the oscillation.

In some embodiments of the present disclosure, the base includes a rotating shaft, and the rotating shaft is controlled by an actuator to pivot, so as to drive the swing arm and the trimmer to reciprocally sweep above the surface of the carrier.

The disclosure further provides a polishing system, including: a rotating platform; a carrier, which is arranged on the upper surface of the rotating platform to carry a wafer or a substrate; a carrier, which is arranged on the carrier to carry the wafer or the substrate fixed on the surface of the carrier and polished; the trimming device of the present disclosure is arranged above the carrier to trim the surface of the carrier.

In some embodiments of the present disclosure, it further includes: a nozzle disposed above the carrier to provide polishing liquid containing abrasives to the surface of the carrier.

To sum up, the polishing system and its dressing device of the present disclosure are mainly provided with at least one damper inside the rocker arm of the dressing device to properly compensate or weaken any axial force on the dresser or the rocker arm during the trimming of the carrier. Oscillation, so that the surface of the trimmed carrier reaches the expected roughness, flatness, uniformity and microstructure, which can not only improve the material removal rate and surface polishing results in the subsequent chemical mechanical planarization process, but also prolong the lifetime of the carrier. service life.

The implementation of the present disclosure is described below through specific examples. Those skilled in the art to which the present disclosure belongs can easily understand the advantages and effects of the present disclosure from the contents disclosed herein. However, the specific embodiments described herein are not intended to limit the present disclosure, and the present disclosure may also be implemented or applied through other different implementation modes, and the details contained herein may also be based on different viewpoints and applications, without prejudice to Various changes or modifications are conferred within the scope of the present disclosure.

The structures, proportions, sizes, etc. shown in the drawings attached to this document are only used to match the content disclosed herein, so that those with ordinary knowledge in the technical field of this disclosure can read and understand, and are not used to limit the scope of this disclosure. Therefore, any modification of structure, change of proportional relationship, or adjustment of size shall belong to the technical content disclosed in this disclosure without affecting the effect and purpose of this disclosure. range covered.

When "comprising", "comprising" or "having" specific elements mentioned herein, unless otherwise specified, other elements, components, structures, regions, parts, devices, systems, steps, connection relations and other elements may be included in addition, These other requirements are not to be excluded.

Sequential terms such as "first" or "second" mentioned herein are only used to describe or distinguish elements, components, structures, regions, parts, devices, systems, etc. The scope of implementation is not intended to limit the spatial order of these elements. In addition, the singular forms of "a" and "the" mentioned herein also include plural forms, and "or" mentioned herein can be used interchangeably with "and/or" unless otherwise specified herein.

The spatially relative terms such as "on", "above", "parallel" and "perpendicularly" mentioned herein are only for the purpose of clarifying the relationship between one element or feature and other elements or features in specific embodiments of the present disclosure. The relative position and relationship of this disclosure are not used to limit the scope of implementation of this disclosure. The adjustment, exchange and change of its relative position and relationship should be regarded as the implementation of this disclosure without substantially changing the technical content of this disclosure. range. In addition, "parallel" mentioned herein means substantially parallel, which includes the situation that the angle between two elements, two axes or two planes is between -10 degrees and +10 degrees of 0 degrees, such as -5 degrees to 5 degrees; as used herein, "perpendicular" means substantially perpendicular, which includes the situation where the angle between two elements, two axes or two planes is between -10 degrees and +10 degrees of 90 degrees, For example 85 degrees to 95 degrees.

The term "coupling" in this article refers to a plurality of components that are directly or indirectly combined mechanically, chemically, electrically, magnetically or a combination of two or more of them, and "directly coupling" refers to a plurality of Components are connected together by direct contact, and "indirect coupling" refers to the combination of a plurality of components through at least one coupling. Means for achieving "coupling" as described herein include, but are not limited to, tightly or gap-connected, pivoted, connected, sewn, joined, glued, fitted, screwed, snapped, stapled, clipped, attached, Piercing, clamping, placement, integral molding or a combination of two or more of them. The term "coupling" herein refers to an element that can achieve the above-mentioned "coupling" means.

The term "actuator" herein refers to a power device that converts various energy or power sources into mechanical kinetic energy to drive an object, device or system to move. The actuator has different implementations depending on the type of the energy or power source. In at least one embodiment of the present disclosure, the actuator includes but is not limited to a pneumatic actuator (for example, a pneumatic cylinder), Hydraulic actuators (eg, hydraulic cylinders), electrical actuators (eg, DC motors, AC motors, or stepper motors), electromechanical hybrid actuators (eg, solenoid valves). In at least one embodiment of the present disclosure, the actuator is used to drive an object, device or system to rotate. In at least one embodiment of the present disclosure, the actuator is a piezoelectric actuator.

Referring to FIG. 1 , the trimming device 22 of the present disclosure can be applied to a polishing system 2 of a polishing process (eg, a CMP process). In at least one embodiment of the present disclosure, the polishing system 2 includes a rotating platform 20, a carrier 21 (for example, a polishing pad or a lapping disc with or without abrasives, a polishing pad with or without grooves) , grinding disc or chassis, or the like), finishing device 22, carrier 23 (eg, grinding head) and spray head 24. The carrier 21 is arranged on the upper surface of the rotary platform 20 to carry the wafer 25, and rotates as the rotary platform 20 rotates; the carrier 23 is arranged above the carrier 21 to fix (for example, absorb) the wafer 25, and rotate and Press down the wafer 25 to the surface of the carrier 21 for polishing; the nozzle 24 is arranged above the carrier 21 to provide a polishing liquid containing abrasives and chemical properties to the upper surface of the carrier 21 to help the carrier 21 to the wafer 25 The surface is polished. In at least one embodiment of the present disclosure, the rotating platform 20 or the carrier 23 is configured to rotate through the control of an actuator (not shown).

In at least one embodiment of the present disclosure, the bearing member 21 is a soft and tough elastic pad, which cannot perform material removal (ie, trimming) with a fixed depth of cut, but needs to be grinded and trimmed with a controlled force. In order to make the trimming of the carrier 21 achieve the best effect without affecting (or optimizing) the material removal rate and surface polishing result of the subsequent wafer 25 or substrate, the trimming device 22 in at least one embodiment of the present disclosure is used in addition to During the polishing process, finishing operations such as conditioning, cleaning, and roughness regeneration of the carrier 21 are performed, and vibration during the finishing operation can also be adjusted.

FIG. 2 is a side view showing the implementation of the trimming device 22 on the carrier 21 in the polishing system 2 . The components other than the trimming device 22 and the carrier 21 are as described above and will not be repeated here. In at least one embodiment of the present disclosure, the trimming device 22 includes a base 221 , a swing arm 222 and a trimmer 223 . The swing arm 222 has a first end 2221 and a second end 2222 opposite to the first end 2221 , wherein the first end 2221 is coupled to the trimmer 223 , and the second end 2222 is coupled to the base 221 . In at least one embodiment of the present disclosure, the base 221 is disposed outside the rotating platform 20 . In at least one embodiment of the present disclosure, the base 221 includes a pivoting pivot column controlled by an actuator (not shown), which is used as a support point to drive the swing arm 222 to swing above the carrier 21 (for example, reciprocating sweeping), and then drives the trimmer 223 to swing (for example, reciprocating sweeping) on the surface of the carrier 21 for trimming. In at least one embodiment of the present disclosure, the dresser 223 is a diamond dresser that can be suspended above the carrier 21 and pressed down as appropriate (for example, when approaching the place to be dressed), and by its bottom surface The diamond abrasive re-textures the surface of the carrier 21 in a self-rotating frictional manner.

In at least one embodiment of the present disclosure, the dressing device 22 further includes at least one damper 30 to adjust (for example, compensate or weaken) during the dressing of the carrier 21 due to the vibration of the polishing system itself, the vibration of the carrier 21 on the rotating platform 20 Upward rotation (for example, rotating around the center of the rotating platform 20 as an axis), autorotation and downward pressing of the trimmer 223 when trimming the carrier 21, swinging of the rocker arm 222 itself (for example, reciprocating sweeping), or the carrier 21 Oscillation (e.g., vibration or shaking) due to surface inhomogeneity, etc. In at least one embodiment of the present disclosure, at least one damper 30 is disposed inside the rocker arm 222 , preferably, at least one damper 30 is disposed inside the rocker arm 222 near the first end 2221 . In at least one preferred embodiment of the present disclosure, at least one damper 30 is arranged at the first end 2221 inside the rocker arm 222 (that is, the rocker arm 222 is located above the trimmer 223 ), because the distance between the first end 2221 The base 221 as the supporting point is the farthest, resulting in the largest longitudinal and lateral amplitudes when the rocker arm 222 sweeps back and forth, so the damper 30 arranged at the first end 2221 can maximize its vibration suppression effect. In some other embodiments of the present disclosure, the installation position of at least one damper 30 may also be arranged at other positions of the rocker arm 222 or at the base 221 depending on the structure of the trimming device 22 and its actual vibration damping requirements. In some other embodiments of the present disclosure, at least one damper 30 can be installed on the rocker arm 222 in an additional manner, so as to meet the needs of users for maintenance or replacement at any time.

The term "damper" herein refers to a component, device or system that suppresses oscillations by damping properties.

In at least one embodiment of the present disclosure, the trimming device 22 includes at least one axial damper; preferably, the trimming device 22 includes a plurality of axial dampers to adjust (eg, compensate or weaken) the Oscillations in different axes. The term "axial damper" herein refers to a damper that provides damping in at least one axial direction and has at least one degree of freedom. 3A and 3B show a trimming device 22 in an embodiment of the present disclosure, which includes a longitudinal damper 31 and a transverse damper 32 , and the rest of the elements are as described above, and will not be repeated here.

The longitudinal damper 31 shown in FIG. 3A is arranged on the first end 2221 of the rocker 222 in parallel to the pressing direction of the trimmer 223 (that is, the direction perpendicular to the surface of the carrier 21) to adjust (for example , Compensation or weakening) Forced vibration perpendicular to the trimmer 223. Therefore, when the trimmer 223 is pressed down to the surface of the carrier 21 for trimming, the longitudinal axial damper 31 can suppress the inhomogeneity of the surface of the carrier 21 or the pressing down of the trimmer 223 (relative to the carrier 21 surface) longitudinal oscillation.

The transverse axial damper 32 shown in FIG. 3B is arranged on the first end 2221 of the rocker 222 in parallel to the reciprocating sweeping direction of the rocker 222 (that is, the direction parallel to the surface of the carrier 21) to adjust ( For example, to compensate or weaken) the forced vibration parallel to the trimmer 223 . Therefore, when the trimmer 223 is trimming on the surface of the carrier 21, the damper 32 in the transverse direction can restrain the grinding due to the rotation of the trimmer 223, the rotation of the carrier 21 itself, the reciprocating sweep of the rocker arm 222, and the The lateral vibration (relative to the surface of the carrier 21) caused by the inhomogeneity of the surface of the 21 and the like.

Through the synergistic effect of the above-mentioned longitudinal damper 31 and transverse damper 32, the vibration interference of the rocker arm 222 or the trimmer 223 during the trimming operation can be effectively suppressed, so that the surface of the bearing member 21 after trimming can reach the desired level. roughness, flatness and uniformity, and prolong the service life of the carrier 21. In other embodiments of the present disclosure, in addition to the above-mentioned longitudinal damper 31 and transverse damper 32 , the trimming device 22 further includes other axial dampers to adjust vibrations in other axial directions. In some other embodiments of the present disclosure, the single-axis damper can also adjust the vibrations of different axes at the same time.

In at least one embodiment of the present disclosure, the trimming device 22 includes a passive damper, an active damper, or a combination of both.

The term "passive damper" herein refers to a damper 30 that cannot be actively controlled. In at least one embodiment of the present disclosure, the passive damper includes an elastic element (such as a spring or elastic material) and a damping mass m (such as a mass block), and the elastic element is connected to the damping mass m for trimming Suppresses vibrations during work.

The term "active damper" herein refers to a damper 30 capable of active control. In at least one embodiment of the present disclosure, the active damper includes a sensor (for example, a position sensor, a speed sensor, an acceleration sensor or a combination of two or more thereof), a control unit ( such as a control circuit or controller) and actuators (such as piezoelectric actuators), where the sensor is used to detect motion signals (such as position, velocity, acceleration or a combination of two or more thereof), the control unit generates a control signal according to the motion signal to drive the actuator to suppress the oscillation. In some embodiments of the present disclosure, the actuator adjusts the damping coefficient of the active damper, so that the active damper outputs an active control force that suppresses the oscillation. In other embodiments of the present disclosure, the active damper includes a damping mass m (for example, a mass), and the actuator can suppress the oscillation by changing the position or movement of the damping mass m.

In at least one embodiment of the present disclosure, the damper 30 has a converter (not shown) to convert the mechanical energy of the vibration during the trimming operation into electrical energy or thermal energy, thereby reducing the energy of the vibration and achieving the effect of suppressing the vibration Effect.

In at least one embodiment of the present disclosure, the damper 30 can be a tuned mass damper (Tuned Mass Damper, TMD). When the vibration frequency of the tuned mass damper matches the vibration frequency during the above-mentioned trimming operation, the vibration generated The energy will be transferred to the tuned mass damper to achieve the effect of suppressing the oscillation. The tuned mass damper includes a passive tuned mass damper (Passive Tuned Mass Damper, PTMD) and an active tuned mass damper (Active Tuned Mass Damper, ATMD). The vibration frequency and damping value of the passive tuned mass damper are fixed, suitable for It can suppress the vibration of fixed frequency; while the active tuned mass damper can adjust its vibration frequency and damping value according to the real-time changes of the vibration, so it can respond to various vibration situations during the trimming operation. In at least one embodiment of the present disclosure, the trimming device 22 includes a passive tuned mass damper, an active tuned mass damper, or a combination of both. In some embodiments of the present disclosure, both the longitudinal axial damper 31 and the transverse axial damper 32 are active tuned mass dampers. In some embodiments of the present disclosure, the active tuned mass damper is a phase control active tuned mass damper (Phase Control Active Tuned Mass Damper, PC-ATMD).

Fig. 4 shows a specific embodiment of at least one damper 30 (including a longitudinal axial damper 31 and a transverse axial damper 32) of the present disclosure, which is an actively tuned mass damper and includes at least one piezoelectric sensor 301, control circuit 302, piezoelectric actuator 303 and other components.

In FIG. 4 , the piezoelectric sensor 301 is used to sense the real-time acceleration signal corresponding to the vibration during the trimming operation, and the real-time acceleration signal can be used to determine the axial direction of the vibration and subsequently calculate the load of the vibration. Then, the real-time acceleration signal is sent to the control circuit 302 for calculation of the oscillating load. The oscillating load is used as the benchmark for controlling the damper 30 to produce an active control force that suppresses the oscillating force, and its calculation method is detailed with reference to FIG. 5 and its related descriptions are as follows. Finally, the control circuit 302 generates a control signal according to the calculated load of the vibration, and sends it to the piezoelectric actuator 303, so that at least one damper 30 performs corresponding adjustments for the vibration. The calculation method is detailed in FIG. 5 and Its related descriptions are as follows. Accordingly, for the oscillation of the rocker arm 222 or the trimmer 223 during the trimming operation, the piezoelectric actuator 303 adjusts the damping coefficient of the at least one damper 30, and makes the output of the damping frequency of the at least one damper 30 corresponding to the oscillation sufficient to resist Or counteract (that is, compensate or weaken) the active control force of the load of the vibration, so that the vibration situation can be controlled within a predetermined range, so as to achieve the best vibration suppression effect.

FIG. 5 further illustrates the relationship between the trimming device 22 and at least one damper 30 in terms of physical characteristics when the trimming device 22 encounters vibrations during the trimming operation, and it can be used in conjunction with the following to understand that the aforementioned control circuit 302 performs a load that the trimmer 223 may experience vibrations. Calculate and correspond to the operation flow of generating control signals.

所示，其相應箭號所指示的方向係代表震盪的任一種軸向。 First, the instantaneous acceleration of the oscillation sensed by the piezoelectric sensor 301 can be converted into a load by the control circuit 302 (for example, using a general force conversion equation), as shown in FIG. 5

As shown, the direction indicated by the corresponding arrow represents any kind of axis of oscillation.

表示為代表動力學方程式的下列數學式： [數學式1]

其中，

係代表修整裝置22的質量；

係代表阻尼器30的質量；

係代表修整裝置22的阻尼係數；

係代表阻尼器30的阻尼係數；

係代表修整裝置22的彈性係數；

係代表阻尼器30的彈性係數；並且

、

、

係分別代表修整裝置22關於時間

的位移、速度及加速度等函數的震動響應；而

、

、

係代表阻尼器30關於時間

的位移、速度及加速度等函數的震動響應。 Next, the load to be adjusted

Expressed as the following mathematical formula representing the kinetic equation: [Mathematical formula 1]

in,

represents the quality of the finishing device 22;

represents the mass of the damper 30;

represents the damping coefficient of the finishing device 22;

represents the damping coefficient of the damper 30;

Represents the modulus of elasticity of the finishing device 22;

represents the spring constant of the damper 30; and

,

,

Respectively represent the finishing device 22 with respect to time

The vibration response of the function of displacement, velocity and acceleration; and

,

,

The line represents the damper 30 with respect to the time

The vibration response of the function of displacement, velocity and acceleration.

經拉普拉斯轉換為線性非時變函數，藉以預計由壓電致動器303輸出的主動控制力

，其表達為下列數學式： [數學式2]

其中，此處數學式2的組成形式與數學式1相似，差別在於數學式2將前述代表修整裝置22之震動響應的

、

、

以集合

表示，且將前述代表阻尼器30之震動響應的

、

、

係以集合

表示，並將其他變數進行對應的整理。 Then the above load

Transformed into a linear time-invariant function by Laplace, so as to predict the active control force output by the piezoelectric actuator 303

, which is expressed as the following mathematical formula: [Mathematical formula 2]

Wherein, the composition form of Mathematical Formula 2 is similar to Mathematical Formula 1 here, and the difference is that Mathematical Formula 2 uses the vibration response of the aforementioned representative trimming device 22

,

,

to gather

Represents, and the aforementioned vibration response of the damper 30

,

,

tie to set

, and organize other variables accordingly.

其中，

代表修整裝置22（在無阻尼狀態下）的固有頻率；

代表修整裝置22的阻尼比；

, 代表阻尼器30對於修整裝置22的質量比；而

代表阻尼器30對於修整裝置22的基礎頻率比。 Then, add up the second equation of Mathematical Formula 2 and organize it into the following Mathematical Formula: [Mathematical Formula 3]

in,

represents the natural frequency of the trimming device 22 (in the undamped state);

Represents the damping ratio of the trimming device 22;

, represents the mass ratio of the damper 30 to the trimming device 22; and

represents the fundamental frequency ratio of the damper 30 to the trim device 22 .

進行調節。 The control circuit 302 can know the frequency characteristic of the damper 30 according to the calculation result of the above mathematical formula 3, and then decide how to adjust the damping coefficient of the damper 30, so as to properly output the active control force when encountering a shock

Make adjustments.

，藉以評估阻尼器30輸出預定的主動控制力

所需的調整內容(包括輸出主動控制力

的特定阻尼頻率及所需阻尼係數的調整範圍)，其係如以下數學式所示： [數學式4]

Finally, the system transfer function of the damper 30 is calculated based on the above mathematical formula 3

, so as to evaluate the predetermined active control force output by the damper 30

Required adjustments (including output active control

The specific damping frequency and the adjustment range of the required damping coefficient), which are shown in the following mathematical formula: [Mathematical formula 4]

操控阻尼器30調整自身的阻尼係數並以對應震盪的阻尼頻率輸出主動控制力

，藉以對修整器223進行修整作業期間所遭遇震盪進行補償或弱化，達到預期之抑震效果。 Therefore, the control circuit 302 can generate a control signal according to the calculation results of the above formula 3 and formula 4, and control the piezoelectric controller 303 based on the system transfer function

Manipulate the damper 30 to adjust its own damping coefficient and output active control force at the damping frequency corresponding to the oscillation

, so as to compensate or weaken the vibration encountered during the trimming operation of the trimmer 223, so as to achieve the expected vibration suppression effect.

To sum up, the polishing system and its dressing device of the present disclosure mainly set at least one damper inside the rocker arm of the dressing device, and the damper can properly compensate or weaken the trimmer or the rocker arm on the carrier in an active manner. Vibration in any axial direction during the trimming, so that the surface of the trimmed carrier can achieve the expected roughness, flatness, uniformity, and microstructure, which can not only improve the material removal rate and surface in the subsequent chemical mechanical planarization process As a result of polishing, the service life of the carrier can also be extended.

2: Polishing system 20: Rotary platform 21: Carrier 22: Dressing device 221: Base 222: Rocker arm 2221: First end 2222: Second end 223: Dresser 23: Carrier 24: Nozzle 25: Wafer 30: Damper 301: piezoelectric sensor 302: control circuit 303: piezoelectric actuator 31: longitudinal and axial damper 32: horizontal and axial damper c ₁ : trimming device damping coefficient c ₂ : damper damping coefficient f ( t): Load k ₁ : Elastic coefficient of dressing device k ₂ : Damper elastic coefficient m: Damping mass m ₁ : Dressing device mass m ₂ : Damper mass

FIG. 1 is a schematic diagram of components of a polishing system according to at least one embodiment of the present disclosure.

FIG. 2 is a side view of a trimming device and a wafer according to at least one embodiment of the present disclosure.

3A is a side view of a trimming device according to at least one embodiment of the present disclosure.

Fig. 3B is a top view of the trimming device shown in Fig. 3A.

FIG. 4 is a schematic diagram of an implementation of a trimming device according to at least one embodiment of the present disclosure.

FIG. 5 is a schematic diagram of an implementation of a trimming device according to at least one embodiment of the present disclosure.

21: Carrier

221: base

222: rocker arm

2221: first end

2222: second end

223: Trimmer

30: Damper

m: damping mass

Claims (10)

A trimming device, comprising: A trimmer, which is used to trim the surface of the carrier; a rocker arm having a first end and a second end opposite the first end, wherein the first end is coupled to the trimmer; a base coupled to the second end and configured to reciprocally sweep the swing arm and the dresser over the surface of the carrier; and At least one damper is arranged inside the rocker arm to adjust the vibration of the trimmer or the rocker arm during the reciprocating sweeping. The dressing device as claimed in claim 1, wherein the at least one damper is disposed near the first end. The trimming device as claimed in claim 1, wherein the at least one damper includes a longitudinal damper, a transverse damper or a combination of both, wherein the longitudinal damper is used to adjust the damper perpendicular to the The oscillation of the surface of the carrier, and the transverse axial damper is used to adjust the oscillation parallel to the surface of the carrier. The trimming device of claim 1, wherein the at least one damper comprises a tuned mass damper. The trimming device according to claim 4, wherein the tuned mass damper is an active tuned mass damper. The trimming device as described in claim 5, wherein the actively tuned mass damper comprises: A sensor, which is used to sense the real-time motion signal corresponding to the vibration; a control unit configured to calculate the shock load according to the real-time motion signal, and generate a control signal according to the load; and The actuator is configured to adjust the damping coefficient of the active tuned mass damper according to the control signal, so that the active tuned mass damper outputs an active control force for suppressing the vibration of the load. The trimming device according to claim 6, wherein the sensor is a piezoelectric sensor, the real-time motion signal is real-time acceleration, the control unit is a control circuit, the actuator is a piezoelectric actuator, and The piezoelectric actuator is configured to output the active control force at a damped frequency that suppresses the oscillation. The dressing device as claimed in claim 1, wherein the base includes a rotating shaft column, and the rotating shaft column is controlled by an actuator to pivot, so as to drive the rocker arm and the trimmer to reciprocate on the surface of the carrier Swipe. A polishing system comprising: rotating platform; a carrier, which is arranged on the upper surface of the rotating platform to carry a wafer or a substrate; a carrier, which is arranged above the carrier to fix the wafer or substrate on the surface of the carrier and polish it; The trimming device according to any one of claims 1 to 8, which is arranged above the carrier to trim the surface of the carrier. The polishing system as described in claim 9 further comprises: a nozzle disposed above the carrier to provide polishing liquid containing abrasives to the surface of the carrier.

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