TWI763441B - Display device and method of manufacturing the same - Google Patents

Abstract

A display device includes a supporting substrate, a wiring pattern, a plurality of display modules, and an optical filler. The wiring pattern and the display modules are disposed on the supporting substrate. Each of the display modules includes a control substrate, a plurality of light emitting components, and an optical filler. The control substrate includes a layer body and a plurality of conductive parts. The conductvie parts are located in the layer body and electrically connected to the wiring pattern. The light emitting components are disposed on the control substrate. The optical filler completely covers the display modules and fills a gap between at least two adjacent display modules.

Description

Display device and method of manufacturing the same

The present invention relates to a display device and a manufacturing method thereof, and more particularly, to a tiled display device and a manufacturing method thereof.

The existing splicing type display device is usually assembled by a plurality of display modules, and there is inevitably a gap between two adjacent display modules. Most of the tiled display devices are usually affected by the above-mentioned gaps, so that the images displayed by the existing tiled-type display devices will clearly show a plurality of seams formed by the above-mentioned gaps, such as bright lights. Wire. Therefore, the current splicing type display devices are generally affected by the above-mentioned splicing seams and have the disadvantage of poor image quality.

At least one embodiment of the present invention provides a method for manufacturing a display device to eliminate seams or reduce the adverse effects of seams on image quality.

Another embodiment of the present invention provides a display device manufactured by the above-mentioned manufacturing method.

The display device provided by at least one embodiment of the present invention includes a support plate, a circuit pattern, a plurality of display modules and an optical filling material. The support plate has a support surface, and the circuit pattern is arranged on the support surface. The display modules are arranged on the support surface, wherein each display module includes a control substrate, a plurality of light-emitting elements and optical filling materials. The control substrate includes a layer body and a plurality of conductive parts, wherein the layer body has a first surface and a second surface opposite to the first surface. The conductive members are located in the layer body and extend from the second surface toward the first surface, wherein the conductive members are electrically connected to the circuit patterns. The light-emitting elements are arranged on the first surface and are electrically connected to the control substrate. The optical filling material comprehensively covers the display modules, and is filled in the gap between at least two adjacent display modules, wherein the display modules are located between the support plate and the optical filling material.

In at least one embodiment of the present invention, the distance between two adjacent display modules is less than 50 microns.

In at least one embodiment of the present invention, the circuit pattern includes a plurality of bonding pads and a plurality of contact pads. The wirings connect the bonding pads and the contact pads, wherein the display modules cover the wirings and the contact pads, but do not cover the bonding pads, and the conductive members are respectively electrically connected to the contact pads.

In at least one embodiment of the present invention, the above-mentioned display device further includes an optical film layer, wherein the optical film layer is disposed on the optical filling material.

In at least one embodiment of the present invention, each control substrate further includes a pixel array and a plurality of contact windows. Both the pixel array and these contact windows are arranged in the layer body. The contact windows are arranged in the layer body and connect the pixel array and the conductive members.

In at least one embodiment of the present invention, each display module further includes a sealing material, wherein the sealing material is disposed on the control substrate and covers the light-emitting elements.

A method for manufacturing a display device provided by at least one embodiment of the present invention includes forming a control substrate group on a carrier substrate, wherein the control substrate group includes a plurality of control substrates connected to each other. Afterwards, a plurality of light emitting elements are arranged on the control substrate group. After disposing the light-emitting elements on the control substrate group, the carrier substrate is removed. After removing the carrier substrate, the control substrate group is cut to separate the control substrates. Afterwards, these control substrates are arranged on a composite substrate, wherein the composite substrate includes a mounting layer, a circuit pattern and a rigid substrate. The mounting layer is provided on the rigid substrate, and the circuit pattern is provided on the mounting layer. The control substrates are arranged on the installation layer and are electrically connected to the circuit patterns. Then, an optical filling material is formed on the control substrates, wherein the optical filling material comprehensively covers the control substrates and the light-emitting elements, and fills the gaps between at least two adjacent control substrates. After forming the optical fill material, the rigid substrate is removed. After removal of the rigid substrate, a mounting layer is placed on the substrate.

In at least one embodiment of the present invention, the above-mentioned manufacturing method further includes forming at least one sealing material on the control substrate group and the light-emitting elements before cutting the control substrate group. In the process of cutting the control substrate group, the sealing material is cut.

In at least one embodiment of the present invention, the above-mentioned manufacturing method further includes forming an optical film layer on the optical filling material, wherein the rigid substrate is removed after the formation of the optical film layer.

In at least one embodiment of the present invention, the above-mentioned manufacturing method further includes forming a first protective film on the light-emitting elements after disposing the light-emitting elements on the control substrate group. After removing the carrier substrate and before cutting the control substrate group, a second protective film is formed on the control substrate group, wherein the control substrate group is located between the first protective film and the second protective film.

In at least one embodiment of the present invention, the above-mentioned manufacturing method further includes removing the second protective film before the control substrates are disposed on the composite substrate. Before forming the optical filling material, the first protective film is removed.

Based on the above, using the above-mentioned conductive members, these control substrates can be arranged on the installation layer on the rigid substrate to control the gap between two adjacent control substrates, so as to eliminate the splicing seam formed by the gap, or reduce the splicing Detrimental effect of seams on image quality.

In the following text, the dimensions (such as length, width, thickness and depth) of elements (such as layers, films, substrates and regions, etc.) in the drawings are exaggerated in unequal proportions in order to clearly present the technical features of the present application. . Therefore, the descriptions and explanations of the following embodiments are not limited to the dimensions and shapes of the elements in the drawings, but should cover the dimensions, shapes and deviations caused by actual manufacturing processes and/or tolerances. For example, the flat surfaces shown in the figures may have rough and/or non-linear features, while the acute angles shown in the figures may be rounded. Therefore, the elements shown in the drawings in this application are mainly for illustration, and are not intended to accurately depict the actual shapes of the elements, nor are they intended to limit the scope of the patent application of this application.

Secondly, words such as "about", "approximately" or "substantially" appearing in the content of this case not only cover the clearly stated numerical value and numerical value range, but also cover the understanding of those with ordinary knowledge in the technical field to which the invention belongs. The allowable deviation range of , wherein the deviation range can be determined by the error generated during measurement, for example, the error is caused by the limitations of both the measurement system or the process conditions. For example, two objects (such as planes or traces of a substrate) are "substantially parallel" or "substantially perpendicular", where "substantially parallel" and "substantially perpendicular" represent the parallel and perpendicular relationship between the two objects, respectively It can include non-parallel and non-perpendicular caused by the tolerance range.

Further, "about" can mean within one or more standard deviations of the above-mentioned numerical value, eg, within ±30%, ±20%, ±10%, or ±5%. Words such as "about", "approximately" or "substantially" appearing in this text may be used to select acceptable ranges or standard deviations based on optical properties, etching properties, mechanical properties or other properties, not a single Standard deviation to apply all of the above optical, etch, mechanical and other properties.

1A to 1G are schematic flowcharts of a manufacturing method of a display device according to at least one embodiment of the present invention. Referring to FIGS. 1A and 1B , in the manufacturing method of this embodiment, a control substrate group 101 is formed on the carrier substrate 10 , wherein FIG. 1A is a schematic top view of the control substrate group 101 , and FIG. 1B is a line along the line in FIG. 1A . Schematic diagram of the cross-section drawn from the 1B-1B section. The control substrate group 101 includes a plurality of control substrates 110 , and the control substrates 110 may be arranged in a regular manner, such as a matrix arrangement as shown in FIG. 1A . The carrier substrate 10 has a plane 19 on which the control substrate group 101 is formed. The carrier substrate 10 can be a rigid substrate, such as a glass plate or a rigid metal plate, so that the carrier substrate 10 can support the control substrate group 101 .

In this embodiment, the control substrate group 101 may further include a cutting portion 102 , wherein the cutting portion 102 has a net shape, and at least one control substrate 110 is surrounded by the cutting portion 102 . Taking FIG. 1A as an example, each control substrate 110 shown in FIG. 1A is surrounded by the cutting portion 102 , and the control substrates 110 are connected to the cutting portion 102 , so that the control substrates 110 can be connected to each other.

The control substrate 110 and the cutting portion 102 may be integrally formed into one, so in the actual cross-sectional structure of the control substrate group 101 (as shown in FIG. 1B ), the connection between the control substrate 110 and the cutting portion 102 is There will be no seams. Therefore, in FIG. 1B , the boundary between the control substrate 110 and the cutting portion 102 is represented by a dotted line, but in reality, the boundary is invisible.

Referring to FIG. 1B , each control substrate 110 may be an active element array substrate, and includes a pixel array, wherein the pixel array includes a plurality of active elements 111 . The active element 111 may be a thin film transistor, as shown in FIG. 1B . Each active element 111 in FIG. 1B may be a top gate transistor, and has a channel layer 111 c , a gate 111 g , a drain 111 d and a source 111 s , wherein the channel layer 111 c is a semiconductor layer, and the gate is 111g, the drain electrode 111d, and the source electrode 111s are all conductive layers.

Each control substrate 110 further includes a layer L11, wherein the layer L11 has a first surface 116a and a second surface 118a opposite to the first surface 116a, and the pixel array (including the active elements 111) is disposed in the layer L11. The layer body L11 includes a plurality of insulating layers 112 and 118 stacked on each other, wherein the insulating layer 118 is formed on the plane 19 of the carrier substrate 10 and can be in close contact with the plane 19 so that the insulating layer 118 has a second surface 118a.

The channel layer 111 c and these insulating layers 112 are formed on the insulating layer 118 . The insulating layer 112 adjacent to the insulating layer 118 covers the channel layer 111c and is located between the channel layer 111c and the gate electrode 111g, wherein the channel layer 111c and the gate electrode 111g overlap. Therefore, the channel layer 111c, the gate electrode 111g, and a portion of the insulating layer 112 between the channel layer 111c and the gate electrode 111g can form a capacitor.

Another insulating layer 112 covers the gate electrode 111g, wherein the gate electrode 111g is located between two adjacent insulating layers 112 . Both the source electrode 111s and the drain electrode 111d are formed above the channel layer 111c. From FIG. 1B , a part of the source electrode 111s and a part of the drain electrode 111d are located above the gate electrode 111g, and the other parts of the source electrode 111s and the other parts of the drain electrode 111d pass through the lower two insulating layers 112 . Therefore, both the source electrode 111s and the drain electrode 111d are connected to the channel layer 111c. In this way, the source electrode 111s and the drain electrode 111d can be electrically connected to the channel layer 111c.

Each control substrate 110 further includes multiple conductive layers 113a, 113c and contact windows 113b, and the layer body L11 further includes multiple layers of insulating layers 114 and 116, wherein the conductive layers 113a, 113c and the contact windows 113b are all disposed in the layer body L11. The insulating layers 114 cover the insulating layers 112 and the active elements 111 , and the insulating layers 116 cover the insulating layers 114 , wherein at least part of the conductive layers 113 a , 113 c and the contact windows 113 b are located between the insulating layers 114 and 116 . The conductive layer 113 a is connected to the drain electrode 111 d through the insulating layer 114 and one of the insulating layers 112 , so that the conductive layer 113 a is electrically connected to the active element 111 .

These contact windows 113b pass through multiple insulating layers, for example, the contact windows 113b pass through the insulating layer 114 and all the insulating layers 112 . Specifically, each control substrate 110 has a plurality of contact holes W11 , wherein the contact holes W11 are formed through the insulating layer 114 and all the insulating layers 112 , and the contact windows 113 b extend from the insulating layer 114 into the contact holes W11 . The insulating layer 118 has a plurality of through holes 118h, and the control substrate 110 further includes a plurality of conductive members S11 located in the layer body L11, wherein the conductive members S11 are respectively disposed in the through holes 118h, and face the second surface 118a toward the second surface 118h. A surface 116a extends.

In addition, the insulating layers 116 and 118 are opposite to each other and are located at the most outside. The insulating layer 116 has a first surface 116a, and the insulating layer 118 has a second surface 118a, wherein the contact window 113b does not pass through the insulating layers 116 and 118. That is, the contact window 113b does not pass through the two outermost insulating layers 116 and 118 of the layer body L11.

The through holes 118h are respectively aligned with the contact holes W11 and the contact windows 113b located in the contact holes W11, so that the contact windows 113b can be connected to the conductive members S11 through the contact holes W11 and the through holes 118h, wherein the conductive members S11 are, for example, silver glue or solder. The through hole 118h is formed before the active element 111 is formed, and the through hole 118h can be formed by laser drilling, mechanical drilling or etching, wherein the through hole 118h can have a non-uniform diameter, and the diameter of the through hole 118h can be from The contact window 113b in the contact hole W11 decreases toward the second surface 118a, as shown in FIG. 1B .

Each of the control substrates 110 may further include a plurality of electrodes 115 a and 115 c , wherein part of the electrodes 115 a and part of the electrodes 115 c are both disposed on the insulating layer 116 . The electrodes 115a and 115c pass through the insulating layer 116 to electrically connect the conductive layer 113a and the conductive layer 113c, respectively. Since the conductive layer 113a is electrically connected to the drain electrode 111d of the active element 111, the drain electrode 111d can be electrically connected to the electrode 115a through the conductive layer 113a.

It is worth mentioning that the pixel array of each control substrate 110 may further include a plurality of parallel scan lines (not shown), a plurality of parallel data lines (not shown), and a plurality of parallel common lines (not shown). shown), wherein the data lines and the common lines can be juxtaposed with each other and staggered with the scan lines. The scan line is electrically connected to the gate electrode 111g, so the scan line can control the active element 111 to be turned on and off. The common line is electrically connected to the conductive layer 113c, so that the The common line can be electrically connected to the electrode 115c through the conductive layer 113c.

In addition, the data line, the common line, the source electrode 111s and the drain electrode 111d may be formed by photolithography and etching from the same conductive layer, and the scan line and gate electrode 111g may be formed by photolithography and etching from another conductive layer. formed by etching. In addition, in other cross-sectional structures other than FIG. 1B , the conductive layer 113c can pass through the insulating layer 114 and one of the insulating layers 112 to connect to the common line, so that the common line can be electrically connected to the conductive layer 113c.

The contact window 113b connects the pixel array and the conductive elements S11, wherein the data line is electrically connected to the source electrode 111s and the contact window 113b, so that the conductive element S11 can be electrically connected to the source electrode 111s through the contact window 113b and the data line. When the active element 111 is turned on by the scan line, the current can be transferred from the conductive member S11 to the electrode 115a through the contact window 113b, the data line, and the source 111s and the drain 111d of the turned-on active element 111 .

It is worth mentioning that in the embodiment shown in FIG. 1B , the active elements 111 included in the control substrate 110 are all top-gate transistors, but in other embodiments, the active elements 111 may also be bottom gates Polar type (bottom gate) transistor. Alternatively, the active element 111 can also be replaced with a passive element, such as a diode, and the control substrate 110 can also be a passive element array substrate. Therefore, the control substrate 110 shown in FIG. 1B is for illustration only, and FIG. 1B does not limit the implementation of the control substrate 110 .

Referring to FIG. 1A and FIG. 1B , the control substrate 110 may further include a retaining wall 119 , wherein the retaining wall 119 is disposed on the insulating layer 116 and may be distributed along the cutting portion 102 . Therefore, each control substrate 110 is surrounded by the blocking wall 119 . In the embodiment shown in FIG. 1B , the retaining wall 119 may include a plurality of The wall 119a, but in other embodiments, the retaining wall 119 may also include only one wall 119a. Therefore, FIG. 1B does not limit the number of wall bodies 119 a included in the retaining wall 119 . In addition, the wall 119 a is omitted in FIG. 1A , and the retaining wall 119 shown in FIG. 1A is the overall outline of the retaining wall 119 in the top view, so as to clearly reveal the distribution of the retaining wall 119 .

Referring to FIG. 1C , next, a plurality of light-emitting elements 120 are disposed on the first surface 116 a of the control substrate group 101 , and the disposed light-emitting elements 120 are electrically connected to the control substrate 110 . The light emitting element 120 can be a light emitting diode (LED), and can be electrically connected to the control substrate 110 through conductive connectors 122a and 122c, wherein the conductive connectors 122a and 122c are, for example, silver glue, solder or anisotropic Conductive film (Anisotropic Conductive Film, ACF).

After the light-emitting elements 120 are disposed on the control substrate group 101, the light-emitting elements 120 can be electrically connected to the electrodes 115a and 115c through the conductive connectors 122a and 122c, wherein the conductive connectors 122a are electrically connected to the electrodes 115a and are electrically connected The element 122c is electrically connected to the electrode 115c. Therefore, the light emitting element 120 can be electrically connected to the drain electrode 111d of the active element 111 via the conductive connection member 122a, the electrode 115a and the conductive layer 113a, and the common line (not shown) is electrically connected to the conductive layer 113c via the conductive connection member 122c, the electrode 115c and the conductive layer 113c. shown).

When the light-emitting element 120 is a light-emitting diode, the anode of the light-emitting element 120 is electrically connected to the conductive connection member 122a, and the cathode of the light-emitting element 120 is electrically connected to the conductive connection member 122c, so that the current can flow from the conductive member S11 It is transmitted to the anode of the light-emitting element 120 through the contact window 113b, the data line, the source electrode 111s and the drain electrode 111d of the active element 111, the conductive layer 113a, the electrode 115a, and the conductive connector 122a, and from the cathode of the light-emitting device 120 through the conductive connector 122c, electrode 115c and conductive layer 113c are passed to the common line. In this way, the active elements 111 can control the light-emitting elements 120 so that the light-emitting elements 120 can emit light from the light-emitting surface 121 .

After that, at least one sealing material 130 is formed on the control substrate group 101 and the light emitting elements 120 . Taking FIG. 1C as an example, a plurality of sealing materials 130 are respectively disposed on the control substrates 110 and cover the light-emitting elements 120 to seal the light-emitting elements 120, so that it is difficult for external moisture to penetrate into the light-emitting elements 120, wherein the sealing materials 130 may be a transparent resin material. Additionally, retaining walls 119 may be located around these sealing materials 130, as shown in Figure 1C.

1C and FIG. 1D , after disposing the light-emitting elements 120 and the sealing material 130 on the control substrate group 101 , the carrier substrate 10 is removed, and a first protective film P1 is formed on the light-emitting elements 120 and the sealing material 130 . After removing the carrier substrate 10, a second protective film P2 is formed on the control substrate group 101, wherein the control substrate group 101 is located between the first protective film P1 and the second protective film P2.

The first protective film P1 and the second protective film P2 may be flexible and adhesive film layers, so that the first protective film P1 and the second protective film P2 can be respectively attached to the sealing material 130 and the control substrate group The insulating layer 118 of 101, wherein the first protective film P1 can completely cover these sealing materials 130, and the second protective film P2 can completely cover the second surface of the control substrate group 101 face 118a. In this way, the first protective film P1 can protect the sealing material 130 , and the second protective film P2 can protect the second surface 118 a of the control substrate group 101 .

Referring to FIG. 1A and FIG. 1D , after that, the control substrate group 101 is cut to separate the control substrates 110 . Specifically, the control substrate group 101 can be cut along the cutting portion 102 by the cutter K1, so that the control substrates 110 can be separated from each other, wherein both the cutting portion 102 and the blocking wall 119 can be removed. In the process of cutting the control substrate group 101, the sealing material 130 and the first protective film P1 are also cut, so after cutting the control substrate group 101, part of the sealing material 130 will be removed, and the first protective film P1 will be were cut into pieces as shown in Figure 1E.

Referring to FIG. 1E , then, the control substrates 110 are disposed on the composite substrate 20 , wherein the composite substrate 20 includes a circuit pattern 210 , an installation layer 220 and a rigid substrate 23 . The mounting layer 220 is disposed on the rigid substrate 23, wherein the rigid substrate 23 has a plane 23a, and the mounting layer 220 is disposed on the plane 23a and can be closely attached to the plane 23a, so that the mounting layer 220 can be evenly spread on the plane 23a. On the plane 23a, and has a flat support surface 221. The circuit patterns 210 are disposed on the supporting surface 221 of the mounting layer 220 , wherein the control substrates 110 are disposed on the supporting surface 221 of the mounting layer 220 .

For example, the composite substrate 20 may further include a bonding layer 240 , wherein the bonding layer 240 is provided on the support surface 221 of the mounting layer 220 , and the control substrates 110 are provided on the bonding layer 240 . The bonding layer 240 can be an adhesive material and has viscosity, so the control substrates 110 can be adhered to the bonding layer 240, so that the control substrates 110 can be installed and fixed on the installation layer 220 on. In addition, since the bonding layer 240 is disposed on the flat supporting surface 221, the bonding layer 240 can be evenly spread on the mounting layer 220, so that the second surfaces 118a of the control substrates 110 can be substantially parallel to the supporting surface 221, and closely adhere to the bonding layer 240, so as to avoid or reduce the inclination of each control substrate 110 relative to the plane 23a.

The control substrates 110 can be electrically connected to the circuit patterns 210 . Specifically, the control substrates 110 can be electrically connected to the circuit patterns 210 through a plurality of conductive materials S12, wherein the bonding layer 240 can have a plurality of openings (not shown), and the conductive materials S12 are respectively disposed in the openings. After the control substrates 110 are disposed on the composite substrate 20, the conductive members S11 located in the through holes 118h are respectively aligned with the conductive material S12, so that the conductive members S11 are electrically connected to the conductive material S12, and the conductive members S11 are electrically connected to the conductive material S12. The line pattern 210 is sexually connected. In addition, each conductive member S11 and each conductive material S12 may be located between the circuit pattern 210 and one of the contact windows 113b.

It can be seen from this that the control substrates 110 can be electrically connected to the circuit patterns 210 through the conductive member S11 and the conductive material S12. In addition, the conductive material S12 is, for example, silver paste or solder. It should be noted that, before the control substrates 110 are disposed on the composite substrate 20 , the second protective film P2 will be removed first, so that the conductive member S11 and the conductive material S12 can be electrically connected to each other, so that the control substrate 110 can be electrically connected to each other. The wiring pattern 210 is connected, wherein the second protective film P2 can be removed by peeling.

Referring to FIG. 1F , after that, the optical filling material 140 is formed on the control substrates 110 , wherein the optical filling material 140 comprehensively covers the control substrate 110 . control substrate 110 , light-emitting element 120 and sealing material 130 . The optical filling material 140 may be Optically Clear Adhesive (OCA). Alternatively, the optical filling material 140 may include an optical glue and a plurality of dark particles (not shown) incorporated in the optical glue, wherein the dark particles may be dyes or scattering particles. In addition, before forming the optical filling material 140 , the cut first protective film P1 can be removed first, so that the optical filling material 140 can be directly formed on the sealing material 130 .

The optical filling material 140 is filled in the gap G1 between at least two adjacent control substrates 110 , wherein the gap G1 can extend from the control substrate 110 to the sealing material 130 . During the process of disposing the control substrates 110 on the composite substrate 20 , two adjacent control substrates 110 are abutting to each other as much as possible, so that no gap G1 is formed between the two control substrates 110 . However, due to the influence of process tolerances, a gap G1 as shown in FIG. 1F is inevitably formed between at least two adjacent control substrates 110 .

However, since the second surfaces 118a of the control substrates 110 can be substantially parallel to the support surface 221 and closely abut against the bonding layer 240 to avoid or reduce the inclination of the control substrates 110 relative to the plane 23a, the control substrates 110 The second surface 118a can be substantially coplanar to help control the width GW1 of the gap G1 can be limited to a relatively small range. For example, the width GW1 can be controlled within a range of less than or equal to 50 microns, so as to reduce the adverse effects caused by the width GW1.

After the optical filling material 140 is formed, an optical film layer 150 may be formed on the optical filling material 140 , wherein the optical film layer 150 may comprehensively cover the sealing materials 130 on the control substrates 110 . due to optical filling The filling material 140 can be optical glue, or includes optical glue and a plurality of dark particles, so the optical filling material 140 can be sticky and can adhere to the optical film layer 150, so that the optical film layer 150 can be disposed and fixed on the optical film. on the filler material 140 . In addition, the optical film layer 150 is, for example, a circular polarizer, an anti-reflection layer, or a micro-lens film.

Referring to FIGS. 1F and 1G , after the optical filling material 140 is formed, the rigid substrate 23 is removed, wherein the rigid substrate 23 can be removed after the optical film layer 150 is formed, and the rigid substrate 23 can be removed by peeling. After the rigid substrate 23 is removed, the mounting layer 220 is disposed on the substrate 230 , wherein the mounting layer 220 can be adhered to the substrate 230 by using an adhesive. So far, a display device 100 has basically been manufactured.

The substrate 230 can be a rigid substrate or a flexible substrate, so that the display device 100 can be made into a rigid display that cannot be flexed or a flexible display that can be rolled or stretched, wherein the rigid substrate 230 can be a glass plate or metal The flexible substrate 230 may be a polymer material substrate, which may be made of polyimide (PI) or polyethylene terephthalate (PET).

FIG. 2A is a schematic top view of the display device in FIG. 1G after removing the optical filling material and the optical film layer. Please refer to FIGS. 1G and 2A , the display device 100 includes a circuit pattern 210 , a support plate 250 and a plurality of display modules 109 , wherein the support plate 250 includes an installation layer 220 and a substrate 230 , so the support plate 250 can be a multi-layer board, and There is a support surface 221 , and the display modules 109 are located between the support plate 250 and the optical filling material 140 .

Each display module 109 includes a control substrate 110, a plurality of light-emitting The element 120 and the optical filling material 140 , wherein the optical filling material 140 completely covers the display modules 109 and fills in the gap (not marked) between at least two adjacent display modules 109 . The above-mentioned gap is equivalent to the gap G1 shown in FIG. 1F , so the distance between two adjacent display modules 109 is equal to the width GW1 of the gap G1 , which may be less than 50 μm.

Therefore, in the image displayed by the display device 100, with the optical filling material 140 filled in the above-mentioned gap (also equivalent to the gap G1), the seam formed by the gap is difficult to be perceived by the human eye. In addition, when the optical filling material 140 includes the optical glue and a plurality of dark particles (not shown) incorporated in the optical glue, the optical filling material 140 in the gap will exhibit a dark color, such as dark gray or black. In this way, when the display device 100 displays a dark image, the optical filling material 140 can effectively eliminate or reduce the adverse effect caused by the gap, thereby improving the image quality of the display device 100 .

The light emitting elements 120 can emit light of various colors, such as red light, green light and blue light, and the light emitting elements 120 can be arranged in a matrix along the first direction D1 and the second direction D2. In this embodiment, the light-emitting elements 120 arranged in a row along the first direction D1 can emit light of the same color, while the light-emitting elements 120 arranged in two adjacent rows along the first direction D1 can emit two different light rays color light.

The support plate 250 may protrude from the side E11 on the same side of the control substrates 110 . That is to say, these control substrates 110 do not completely cover the supporting surface 221 of the supporting plate 250 , as shown in FIG. 2A . The circuit pattern 210 may include a plurality of bonding pads 211 , wherein the bonding pads 211 are disposed on the supporting surface 221 of the supporting board 250 and will not be covered by the control substrate 110 cover. In addition, the bonding pads 211 can be arranged in a row along the second direction D2, and can be used for installation and electrical connection of a driving element (not shown), wherein the driving element can include at least one source driver and at least one gate driver .

2B is a schematic top view of the display module shown in FIG. 2A after removing the display module, and FIG. 2C is a top schematic view of the circuit pattern in FIG. 2B . Please refer to FIG. 2A and FIG. 2B , the circuit pattern 210 further includes a plurality of contact pads 213 , 215 and 217 and a plurality of wirings 212 , 214 and 216 , wherein the display modules 109 cover the wirings 212 , 214 and 216 and these Contact pads 213 , 215 and 217 . The bond pads 211 connect the traces 212, 214 and 216, and the traces 212, 214 and 216 connect the contact pads 213, 215 and 217, wherein the trace 212 is connected to the contact pad 213, and the trace 214 is connected to the contact pad 215, The traces 216 are connected to the contact pads 217 .

Please refer to FIG. 1G and FIG. 2C , the conductive members S11 are electrically connected to the contact pads 213 respectively. In other words, the line pattern 210 shown in FIG. 1G is the contact pad 213 . In this way, the above-mentioned driving element can transmit current to the conductive member S11 through the bonding pad 211 , the trace 212 and the contact pad 213 , so that the current output by the driving element can be transmitted to the light-emitting element 120 . In addition, the control substrate 110 may also include a plurality of other contact windows and a plurality of conductive members, wherein the above-mentioned contact windows are the same or similar to the contact window 113b, and the above-mentioned conductive members are the same or similar to the contact window conductive member S11.

As mentioned above, through these contact windows and these conductive members, the scan line electrically connected to the gate electrode 111g can be electrically connected to the contact pad 215, and the common line electrically connected to the conductive layer 113c can be electrically connected to the contact pad 217, so that the driving Components can be connected via bond pads 211, traces 216, contact pads 215, 217, The conductive member and the contact window are electrically connected to the common line and the scan line. In this way, the driving elements can control the light-emitting elements 120 to emit light to display images.

3A and 3B are schematic flowcharts of a manufacturing method of a display device according to another embodiment of the present invention. The manufacturing method of this embodiment is similar to the previous embodiment, and FIG. 3A and FIG. 3B only show the main difference steps different from the previous embodiment, so other steps that are the same or similar to the previous embodiment are not shown here. In addition, the following content mainly describes the differences between the present embodiment and the previous embodiments with reference to FIG. 3A and FIG. 3B , and the same features of the two are not repeated in principle.

Referring to FIG. 1B , in the aforementioned implementation, the through holes 118 h are formed before the active elements 111 are formed, so after the control substrate group 101 is formed on the carrier substrate 10 , the through holes 118 h of the control substrate 110 are already formed. Referring to FIG. 3A , in this embodiment, the control substrate group 301 includes a plurality of control substrates 310 , wherein each control substrate 310 includes a layer L31 and a plurality of contact windows 113 b , and the layer L31 includes an insulating layer 318 . However, unlike the insulating layer 118 of the previous embodiment, the insulating layer 318 does not have any through holes before the carrier substrate 10 is removed. Therefore, after the control substrate group 301 is formed on the carrier substrate 10 , there will not be any through holes in the insulating layer 318 , and the through holes will not be formed until the carrier substrate 10 is removed.

Referring to FIG. 3B, after the carrier substrate 10 is removed and before the control substrates 110 are disposed on the composite substrate 20, a plurality of through holes 318h are formed in the insulating layer 318 of the layer L31, wherein the layer L31 has a first The surface 116a and the second surface 318a opposite the first surface 116a, and the through hole 318h extends from the second surface 318a toward the first surface 116a stretch. After the through holes 318h are formed, a plurality of conductive members S11 may be disposed in the through holes 318h, so that the control substrates 310 can be electrically connected to the composite substrate 20 in the subsequent process.

The through hole 318h can also be formed by laser drilling, mechanical drilling or etching, so the through hole 318h can be drilled from the second surface 318a by laser or etching, and the through hole 318h also has a non-uniform diameter. However, unlike the through hole 118h of the previous embodiment, the diameter of the through hole 318h increases from the contact window 113b toward the second surface 318a, as shown in FIG. 3B .

To sum up, by using the conductive parts (such as the conductive parts S11) of the control substrates, these control substrates can be arranged on the mounting layer on the rigid substrate, so that the width of the gap between two adjacent control substrates can be affected by control, so as to eliminate the seam formed by the above-mentioned gap, or reduce the adverse effect of the seam on the image quality.

Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the appended patent application.

10: Carrier substrate

19, 23a: plane

20: Composite substrate

23: Rigid substrate

100: Display device

101, 301: control board group

102: Cutting Department

109: Display Module

110, 310: control board

111: Active Components

111c: Channel Layer

111d: drain

111g: gate

111s: source

112, 114, 116, 118, 318: insulating layer

113a, 113c: conductive layer

113b: Contact window

115a, 115c: Electrodes

116a: First surface

118a, 318a: second surface

118h, 318h: Through hole

119: Retaining Wall

119a: Wall

120: Light-emitting element

121: light-emitting surface

122a, 122c: Conductive connectors

130: Sealing material

140: Optical Filler

150: Optical film layer

210: Line Pattern

211: Bond pads

212, 214, 216: routing

213, 215, 217: Contact pads

220: Installation Floor

221: Support surface

230: Substrate

240: Bonding Layer

250: support plate

D1: first direction

D2: Second direction

E11: Side

G1: Gap

GW1: width

K1: Knife

L11, L31: layer body

P1: The first protective film

P2: Second protective film

S11: Conductive parts

S12: Conductive Materials

W11: Contact hole

1A to 1G are schematic flowcharts of a manufacturing method of a display device according to at least one embodiment of the present invention. FIG. 2A is a schematic top view of the display device in FIG. 1G after removing the optical filling material and the optical film layer. FIG. 2B is a schematic top view of the display module shown in FIG. 2A after removing the display module. FIG. 2C is a schematic top view of the circuit pattern in FIG. 2B . 3A and 3B are schematic flowcharts of a manufacturing method of a display device according to another embodiment of the present invention.

100: Display device

109: Display Module

110: Control substrate

111: Active Components

111g: gate

113c: Conductive layer

120: Light-emitting element

130: Sealing material

140: Optical Filler

150: Optical film layer

210: Line Pattern

220: Installation Floor

221: Support surface

230: Substrate

240: Bonding Layer

250: support plate

G1: Gap

GW1: width

S11: Conductive parts

Claims (13)

A display device, comprising: a support plate with a support surface; a circuit pattern arranged on the support surface; a plurality of display modules arranged on the support surface, wherein each of the display modules includes: a control substrate , including: a layer body, including a plurality of insulating layers stacked on each other, wherein the outermost opposite two insulating layers respectively have a first surface and a second surface opposite the first surface, wherein the insulating layer with the second surface The layer further has a plurality of through holes; a plurality of conductive parts are respectively disposed in the through holes and extend from the second surface to the first surface, wherein the conductive parts are electrically connected to the circuit pattern; a pixel an array, arranged in the layer body; a plurality of contact windows, arranged in the layer body, and connecting the pixel array and the conductive parts, wherein the contact windows pass through the multiple layers of the insulating layer, but do not pass through the first The two insulating layers on one surface and the second surface, and the through holes are respectively aligned with the contact windows, wherein each of the conductive parts is located between the circuit pattern and one of the contact windows; a plurality of light-emitting elements are arranged On the first surface, and electrically connected to the control substrate; and an optical filling material, covering the display modules comprehensively, and filling in a gap between at least two adjacent display modules, wherein these display modes A group is located between the support plate and the optical fill material. The display device according to claim 1, wherein the distance between two adjacent display modules is less than 50 microns. The display device of claim 1, wherein the circuit pattern comprises: a plurality of bonding pads; a plurality of contact pads; and a plurality of traces connecting the bonding pads and the contact pads, wherein the display modules cover The traces and the contact pads do not cover the bonding pads, and the conductive members are electrically connected to the contact pads, respectively. The display device according to claim 1, further comprising an optical film layer, wherein the optical film layer is disposed on the optical filling material. The display device according to claim 1, wherein each of the display modules further comprises a sealing material, and the sealing material is disposed on the control substrate and covers the light-emitting elements. The display device of claim 1, wherein the diameter of each of the through holes decreases from the contact window toward the second surface. The display device according to claim 1, wherein each of the through holes The aperture increases from the contact window towards the second surface. The display device of claim 1, wherein the pixel array includes a plurality of active elements disposed in the layer body, and the active elements are electrically connected to the light-emitting elements. A method for manufacturing a display device, comprising: forming a control substrate group on a carrier substrate, wherein the control substrate group includes a plurality of control substrates connected to each other; arranging a plurality of light-emitting elements on the control substrate group; After disposing the light-emitting elements on the control substrate group, the carrier substrate is removed; after removing the carrier substrate, the control substrate group is cut to separate the control substrates; the control substrates are arranged on a On a composite substrate, wherein the composite substrate includes an installation layer, a circuit pattern and a rigid substrate, the installation layer is arranged on the rigid substrate, the circuit pattern is arranged on the installation layer, and the control substrates are arranged On the installation layer, the circuit pattern is electrically connected; an optical filling material is formed on the control substrates, wherein the optical filling material comprehensively covers the control substrates and the light-emitting elements, and is filled in at least the control substrates in a gap between two adjacent control substrates; after the optical filling material is formed, the rigid substrate is removed; and after the rigid substrate is removed, the installation layer is disposed on a substrate. The method for manufacturing a display device according to claim 9, further comprising: before cutting the control substrate group, forming at least one sealing material on the control substrate group and the light-emitting elements; and cutting the control substrate group During the grouping process, the at least one sealing material is cut. The method for manufacturing a display device according to claim 9, further comprising: forming an optical film layer on the optical filling material, wherein the rigid substrate is removed after the optical film layer is formed. The method for manufacturing a display device according to claim 9, further comprising: after arranging the light-emitting elements on the control substrate group, forming a first protective film on the light-emitting elements; and removing the carrier After the substrate, before cutting the control substrate group, a second protective film is formed on the control substrate group, wherein the control substrate group is located between the first protective film and the second protective film. The method for manufacturing a display device according to claim 12, further comprising: before the control substrates are disposed on the composite substrate, removing the second protective film; and Before forming the optical filling material, the first protective film is removed.

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