TW202301304A - Display device and manufacturing method thereof - Google Patents

Abstract

A display device includes a holding substrate and a plurality of display assemblies. The display assemblies are disposed on the holding substrate. Each of the display assemblies includes a control substrate, a supporting substrate, a plurality of conductive materials, a wiring structure layer and a plurality of light emitting components. The control substrate is disposed on the holding substrate. The supporting substrate has a plurality of through holes and is disposed on the control substrate. The conductive materials are located in the through holes respectively and electrically connected to the control substrate, while the wiring structure layer is electrically connected to the conductive materials. The light emitting components are disposed on the wiring structure layer and electrically connected to the wiring structure layer.

Description

Display device and manufacturing method thereof

The present invention relates to a display device and a manufacturing method thereof, and in particular to a tiled display device and a manufacturing method thereof.

The existing spliced display device is assembled by a plurality of display components, wherein these display components can display sub-images, and the image displayed by the spliced display device is formed by splicing these sub-images. Generally speaking, there is inevitably a gap between two adjacent display components, and most of the spliced display devices are usually affected by the above gap, so that the images displayed by the existing spliced display devices can be clearly presented A seam formed by gaps that degrades image quality.

At least one embodiment of the present invention provides a display device, which includes a plurality of display components, wherein each display component can generate a sub-frame, so that the display device can display images.

At least one embodiment of the present invention provides a method for manufacturing a display device to manufacture the above-mentioned display device.

The method for manufacturing a display device provided by at least one embodiment of the present invention includes forming a plurality of through holes on a support substrate, wherein the support substrate has a first surface and a second surface opposite to the first surface, and the through holes are formed from the first surface extends to the second surface. A plurality of conductive materials are respectively formed in the through holes. Afterwards, a circuit structure layer is formed on the first surface, wherein the circuit structure layer is electrically connected to these conductive materials. Afterwards, a plurality of light-emitting elements are disposed on the circuit structure layer, wherein the light-emitting elements are electrically connected to the circuit structure layer. After the light emitting elements are disposed on the circuit structure layer, the supporting substrate is disposed on the control substrate to form a display assembly, wherein the conductive materials are electrically connected to the control substrate so that the control substrate is electrically connected to the light emitting elements. Afterwards, a plurality of display components are arranged on the carrier substrate.

In at least one embodiment of the present invention, the step of forming the through holes on the supporting substrate includes irradiating a laser beam on the supporting substrate. After the laser beam is irradiated on the support substrate, the support substrate is etched to remove a portion of the support substrate irradiated by the laser beam.

In at least one embodiment of the present invention, the method of forming the conductive materials in the through holes includes electroplating or printing filling holes.

In at least one embodiment of the present invention, before the circuit structure layer is formed on the first surface, a plurality of support substrates are integrated into a support link. After the wiring structure layer is formed on the first surface, the supporting bracket is cut to separate the supporting substrates.

In at least one embodiment of the invention, the step of arranging the display components on a carrier substrate includes providing a plurality of fixed substrates. At least one display component is arranged on one of the fixed substrates. These fixed substrates are placed on the carrier substrate.

A display device provided by at least one embodiment of the present invention includes a carrier substrate and a plurality of display components. These display components are arranged on the carrier substrate and arranged regularly on the carrier substrate. Each display component includes a control substrate, a supporting substrate, a plurality of conductive materials, a circuit structure layer and a plurality of light emitting elements. The control substrate is arranged on the carrier substrate. The support substrate has a first surface, a second surface opposite to the first surface, and a plurality of through holes, wherein the through holes extend from the first surface to the second surface. The support substrate is provided on the control substrate. The conductive materials are respectively located in the through holes and are electrically connected to the control substrate. The circuit structure layer is arranged on the first surface and is electrically connected to these conductive materials, wherein the supporting substrate is located between the circuit structure layer and the control substrate. These light-emitting elements are arranged on the circuit structure layer and electrically connected to the circuit structure layer.

In at least one embodiment of the present invention, the size of the support substrate is larger than the size of the control substrate.

In at least one embodiment of the present invention, the control substrate includes an active device array substrate and a circuit substrate. The active element array substrate has an upper surface, a lower surface and a side surface between the upper surface and the lower surface, wherein the support substrate is arranged on the upper surface and completely covers the upper surface, and the support substrate protrudes from the side surface. The circuit substrate is electrically connected to the active device array substrate.

In at least one embodiment of the present invention, the circuit substrate is disposed on a side surface of the active device array substrate.

In at least one embodiment of the present invention, the circuit substrate is disposed on the lower surface of the active device array substrate.

In at least one embodiment of the present invention, at least one through hole has a first opening on the first surface and a second opening on the second surface. The first opening has a first aperture, and the second opening has a second aperture, wherein the through hole has a third aperture between the first opening and the second opening, and either the first aperture or the second aperture is larger than the third aperture .

In at least one embodiment of the present invention, the through hole further has a central section, and the third aperture is located in the central section. At least one of the first aperture and the second aperture is the maximum aperture of the through hole, and the third aperture is the minimum aperture of the through hole, wherein the ratio between the third aperture and the maximum aperture is between 0.6 and 0.9.

In at least one embodiment of the present invention, the distance between two adjacent supporting substrates is within 400 micrometers (μm).

In at least one embodiment of the present invention, the display device further includes a plurality of fixed substrates. The fixed substrates are arranged on the carrier substrate, wherein the display components are respectively arranged on the fixed substrates, and the fixed substrates are located between the display components and the carrier substrate.

Based on the above, each display component can utilize these light-emitting elements to generate sprites. In this way, the display device can display images.

In the following text, in order to clearly present the technical features of this application, the dimensions (such as length, width, thickness, and depth) of elements (such as layers, films, substrates, and regions) in the drawings will be enlarged in a non-proportional manner . Therefore, the description and explanation of the following embodiments are not limited to the size and shape of the elements in the drawings, but should cover the deviations in size, shape and both caused by actual manufacturing process and/or tolerances. For example, a planar surface shown in the drawings may have rough and/or non-linear features, while acute angles shown in the drawings may be rounded. Therefore, the components shown in the drawings of this case are mainly for illustration, and are not intended to accurately depict the actual shape of the components, nor are they used to limit the scope of the patent application of this case.

Secondly, words such as "about", "approximately" or "substantially" appearing in the content of this case not only cover the clearly stated values and numerical ranges, but also cover The allowable deviation range, wherein the deviation range can be determined by the error generated during the measurement, and the error is caused by the limitation of the measurement system or process conditions, for example. For example, two objects (such as a plane or trace of a substrate) are "substantially parallel" or "substantially perpendicular", where "substantially parallel" and "substantially perpendicular" represent the parallel and perpendicular between the two objects, respectively. May include non-parallel and non-perpendicular due to tolerance range.

Additionally, "about" can mean within one or more standard deviations of the above numerical values, eg, within ±30%, ±20%, ±10%, or ±5%. Words such as "about", "approximately" or "substantially" appearing in this text can choose the acceptable deviation range or standard deviation according to optical properties, etching properties, mechanical properties or other properties, not a single The standard deviation is used to apply all properties such as the above optical properties, etching properties, mechanical properties and other properties.

FIG. 1A is a schematic cross-sectional view of a display device according to at least one embodiment of the present invention. Referring to FIG. 1A , the display device 100 includes a carrier substrate 110 and a plurality of display components 120 , wherein the display components 120 are disposed and regularly arranged on the carrier substrate 110 . For example, these display components 120 may be arranged in a matrix. The carrier substrate 110 can be a rigid substrate, such as a metal plate, a glass plate or a ceramic plate, and can carry the display components 120 .

In this embodiment, the display components 120 can be disposed on the carrier substrate 110 by using an adhesive material 130 , so that the display components 120 can be fixed on the carrier substrate 110 . In addition, in addition to the adhesive material 130 , the display component 120 can also be disposed on the carrier substrate 110 by other means. Therefore, the display component 120 is not limited to be disposed on the carrier substrate 110 only by the adhesive material 130 .

Each display assembly 120 includes a support substrate 121 and a control substrate 122 , wherein the support substrate 121 is disposed on the control substrate 122 , and the control substrate 122 is disposed on the carrier substrate 110 . Therefore, the control substrate 122 is located between the carrying substrate 110 and the supporting substrate 121 . The support substrate 121 has a first surface 121a, a second surface 121b opposite to the first surface 121a, and a plurality of through holes 121h, wherein the through holes 121h extend from the first surface 121a to the second surface 121b.

The support substrate 121 may be a rigid substrate or a flexible substrate. Specifically, when the supporting substrate 121 is a rigid substrate, the supporting substrate 121 may be a glass plate or a ceramic plate. When the supporting substrate 121 is a flexible substrate, the supporting substrate 121 may be a polymer substrate, such as polyimide (PI) or polyethylene terephthalate (PET).

Each display component 120 further includes a plurality of conductive materials 123 , wherein the conductive materials 123 are located in the through holes 121 h and connected to the control substrate 122 . The conductive material 123 can be a metal material, such as copper or silver glue, and can fill the through hole 121h. Each display component 120 also includes a circuit structure layer 124 disposed on the first surface 121 a, so the support substrate 121 is located between the circuit structure layer 124 and the control substrate 122 , wherein the circuit structure layer 124 is electrically connected to the conductive materials 123 . In addition, the line structure layer 124 can be used to transmit the drain power supply voltage (Vdd) and the source power supply voltage (Vss), and includes a plurality of pads 124y.

The circuit structure layer 124 may include multiple film layers. Taking FIG. 1A as an example, the circuit structure layer 124 may include a multilayer circuit layer 124w, an insulating layer 124d and a planar layer 124x, wherein the circuit layer 124w, the insulating layer 124d and the planar layer 124x are stacked on each other, and the insulating layer 124d and the planar layer 124x are located Between the two circuit layers 124w, these circuit layers 124w can be separated from the planar layer 124x by the insulating layer 124d.

The circuit structure layer 124 can also include a plurality of conductive pillars 124p, wherein these conductive pillars 124p are located in the insulating layer 124d and the planar layer 124x, and connect these circuit layers 124w, so that these circuit layers 124w can be electrically connected to each other through the conductive pillars 124p. connect. One of the wiring layers 124w, such as the lower wiring layer 124w in FIG. 1A , is electrically connected to the conductive materials 123 so that the wiring structure layer 124 is electrically connected to the conductive materials 123 .

Each display component 120 also includes a plurality of light emitting elements 125, wherein these light emitting elements 125 are disposed on the circuit structure layer 124, and can be arranged in a regular manner, such as a matrix arrangement. These light-emitting elements 125 are electrically connected to the circuit structure layer 124 and are one of the circuit layers 124w electrically connected to the circuit structure layer 124 . Taking FIG. 1A as an example, the upper circuit layer 124w may include a plurality of pads 124y, and each light emitting element 125 may be electrically connected to at least Two pads 124y.

The light emitting element 125 can be a light emitting diode (Light Emitting Diode, LED), such as a micro light emitting diode (Micro-LED), a sub-millimeter light-emitting diode (Mini-LED), or a light-emitting diode with a size larger than a sub-millimeter of light-emitting diodes. In addition, the light emitting element 125 can also be a horizontal light emitting diode (as shown in FIG. 1A ) or a vertical light emitting diode. Therefore, the electrodes (not shown, such as cathode and anode) of each light emitting element 125 can be located on the same side of the light emitting element 125 or on opposite sides respectively.

It is worth mentioning that, in the embodiment shown in FIG. 1A , the circuit structure layer 124 may include two circuit layers 124w, while in other embodiments, the circuit structure layer 124 may include more than three circuit layers 124w. Therefore, the circuit structure layer 124 may include at least two circuit layers 124w, and the number of circuit layers 124w included in the circuit structure layer 124 is not limited to two layers.

In this embodiment, these light emitting elements 125 can emit light of various colors. For example, the light emitting elements 125 may include a plurality of red light emitting diodes, a plurality of green light emitting diodes and a plurality of blue light emitting diodes, so that the light emitting elements 125 can emit red light, green light and blue light. Using the colored lights (eg, red light, green light, and blue light) emitted by the light emitting elements 125 , each display component 120 can generate sub-pictures so that the display device 100 can display images. In addition, the display component 120 may further include a protection layer 129 , wherein the protection layer 129 may be disposed on the circuit structure layer 124 and cover the light emitting elements 125 to protect the light emitting elements 125 .

It is worth mentioning that, in other embodiments, these light emitting elements 125 can also emit a single color light, such as blue light, wherein the blue light can be converted into other color light through color conversion materials, such as quantum dot materials or phosphor materials , such as red or green light. Therefore, even if the light-emitting elements 125 emit a single color light (such as blue light), multiple color lights (such as red light and green light) can be generated through the above-mentioned color conversion material, so that the display device 100 can display images.

Because these circuit layers 124w can be electrically connected to each other through the conductive pillars 124p, and the circuit structure layer 124 is electrically connected to these conductive materials 123, so these light-emitting elements 125 can be electrically connected to these in the supporting substrate 121 through the circuit structure layer 124. Conductive material 123. The conductive materials 123 are connected to the control substrate 122 so that the light emitting elements 125 can be electrically connected to the control substrate 122 through the conductive materials 123 .

The control substrate 122 may include an active device array substrate 122a and a circuit substrate 122c, wherein the circuit substrate 122c is electrically connected to the active device array substrate 122a. The active element array substrate 122a has an upper surface S11, a lower surface S12, and a side surface S13, wherein the side surface S13 is located between the upper surface S11 and the lower surface S12, and the circuit substrate 122c can be disposed on the side surface S13 (as shown in FIG. 1A ) or the lower surface S12. The circuit substrate 122c may be a printed circuit board, a flexible circuit board or a rigid-flex circuit board, and at least one chip (not shown) has been mounted thereon. When the circuit substrate 122c is a flexible circuit board or a rigid-flex circuit board, the chip can be mounted on the flexible circuit board or the rigid-flex circuit board through a chip on film (COF) package.

The supporting substrate 121 is disposed on the upper surface S11, and the conductive material 123 in the supporting substrate 121 is connected to the active device array substrate 122a. From FIG. 1A , the size of the support substrate 121 is greater than the size of the control substrate 122 , wherein the width L21 of the support substrate 121 may be greater than the width L22 of the active device array substrate 122 a. In this way, the supporting substrate 121 can completely cover the upper surface S11 of the active device array substrate 122a, and protrude from the side surface S13, as shown in FIG. 1A .

FIG. 1B is a partially enlarged schematic view of one of the display components in FIG. 1A . Referring to FIG. 1A and FIG. 1B , the active device array substrate 122a may include a substrate 22a and a plurality of control elements T22, wherein the control elements T22 are formed on the substrate 22a. The substrate 22a can be similar to the support substrate 121, and can be a rigid substrate or a flexible substrate, such as a glass plate, a ceramic plate or a polymer substrate, wherein the material of the polymer substrate is, for example, polyimide (PI) or polyethylene terephthalic acid Ethylene glycol ester (PET).

In this embodiment, the control element T22 can be a thin film transistor, and each control element T22 can include a gate G22, a source S22, a drain D22 and a channel layer C22, wherein the gate G22, the source S22 and the drain D22 All may be metal layers, and the channel layer C22 is a semiconductor layer. The channel layer C22 is formed on the substrate 22a, and the gate G22 is located above the channel layer C22 but not in contact with the channel layer C22. The source S22 and the drain D22 are formed on the channel layer C22 and are electrically connected to the channel layer C22.

The active device array substrate 122a may further include multiple insulating layers IN1, IN2, IN3 and IN4, wherein the insulating layers IN1, IN2, IN3 and IN4 are all stacked on the substrate 22a. An insulating layer IN1 may be formed on the substrate 22a and cover the channel layer C22. The gate G22 is formed on the insulating layer IN1 and directly above the channel layer C22, so that the gate G22, the channel layer C22 and a part of the insulating layer IN1 between the gate G22 and the channel layer C22 can form a capacitor.

The insulating layer IN2 is formed on the insulating layer IN1 and covers the gate G22, wherein a part of the source S22 and a part of the drain D22 are located on the insulating layer IN2, and another part of the source S22 and another part of the drain D22 Both penetrate the insulating layers IN2 and IN1, so that both the source S22 and the drain D22 can be electrically connected to the channel layer C22. In addition, neither the source S22 nor the drain D22 is electrically connected to the gate G22, so that both the source S22 and the drain D22 are electrically insulated from the gate G22.

The insulating layer IN3 is formed on the insulating layer IN2 and covers the source S22 and the drain D22 , and the insulating layer IN4 is formed on the insulating layer IN3 , wherein the insulating layer IN4 can be a planar layer. In addition, in other embodiments, the insulating layers IN3 and IN4 can be integrally formed. For example, the insulating layer IN3 may be omitted, while the insulating layer IN4 may remain and cover the source S22 , the drain D22 and the insulating layer IN2 .

The active device array substrate 122a may further include a plurality of electrodes E22, wherein the electrodes E22 are electrically connected to the drains D22 respectively. Specifically, a part of each electrode E22 is located on the insulating layer IN4, while another part penetrates the insulating layers IN4 and IN3 and is connected to the drain D22, so that the electrode E22 can be electrically connected to the drain D22. In this way, the control elements T22 can control the electric energy input to the electrodes E22.

The electrodes E22 are respectively electrically connected to the conductive materials 123 , so the electrodes E22 can be electrically connected to the circuit structure layer 124 through the conductive materials 123 . Therefore, the electrodes E22 can be electrically connected to the light emitting elements 125 via the conductive materials 123 and the circuit structure layer 124 . In this way, the control elements T22 can be electrically connected to the light emitting elements 125 respectively to control the electric energy input to the light emitting elements 125 , and then control the brightness of each light emitting element 125 so that the display device 100 can display images. It can be known from this that the image displayed by the display device 100 is formed by the light emitted by the light emitting elements 125 .

Since the size of the support substrate 121 is greater than the size of the control substrate 122, and the support substrate 121 can completely cover the upper surface S11 and protrude from the side S13, the support substrate 121, the control substrate 122 and the carrier substrate 110 can form an available circuit substrate 122c. Accommodating space (not marked), so that these support substrates 121 are not affected by the circuit substrate 122c and can be close to or abutting each other, wherein the control between two adjacent support substrates 121 The distance D1 can be controlled within 400 microns.

Since the image displayed by the display device 100 is formed by the light emitted by these light-emitting elements 125, and in the same display assembly 120, the support substrate 121 is located between the control substrate 122 and these light-emitting elements 125, so these are adjacent to each other or The close support substrate 121 can cover these control substrates 122 and can effectively reduce or eliminate the splicing seam in the image of the display device 100 , thereby improving the image quality.

It is worth mentioning that since the supporting substrate 121 is located between the circuit structure layer 124 and the control substrate 122, the supporting substrate 121 can open the distance between the circuit structure layer 124 and the control substrate 122 to reduce or eliminate the circuit structure layer 124. The interference generated between the substrate and the control substrate 122 improves the image quality. For example, the supporting substrate 121 can help reduce the parasitic capacitance between the circuit structure layer 124 and the control substrate 122 to reduce impedance. Secondly, the supporting substrate 121 can help reduce or eliminate the mutual interference between the electric signals transmitted in the circuit structure layer 124 and the control substrate 122 , and can increase the design flexibility of the circuit structure layer 124 and the control substrate 122 .

In addition, when at least one light emitting element 125 fails, a laser beam can be used to directly irradiate the circuit structure layer 124 to repair the failed light emitting element 125 . Since the supporting substrate 121 is located between the circuit structure layer 124 and the control substrate 122 , the supporting substrate 121 can block the laser beam, so that the laser beam is difficult or impossible to enter the control substrate 122 . In this way, the supporting substrate 121 can also protect the control substrate 122 from being damaged by the laser beam during the maintenance of the faulty light emitting element 125 .

It should be noted that, in the display device 100 disclosed above in FIG. 1A and FIG. 1B , the active device array substrate 122a may further include a plurality of scanning lines S23 (only one is shown in FIG. 1B ) and a plurality of data lines, wherein these scanning lines S23 The line S23 is electrically connected to the gates G22, and the data lines are electrically connected to the sources S22. In this way, the control elements T22 can be operated by using the scan lines S23 and the data lines, so as to control the light emitting elements 125 to emit light. In addition, the control element T22 shown in this embodiment is a top-gate thin film transistor, but in other embodiments, the control element T22 can also be a bottom-gate thin film transistor , so the type of the control element T22 is not limited by the drawing.

2A to 2G are schematic cross-sectional views of the manufacturing method of the display device shown in FIG. 1A . Referring to FIG. 2A and FIG. 2B , in the manufacturing method of the display device 100 , a plurality of through holes 121 h are formed on the support substrate 121 , wherein each through hole 121 h extends from the first surface 121 a to the second surface 121 b. In addition, in this embodiment, a plurality of supporting substrates 121 can be connected to each other to form a large-sized supporting connecting plate 121u, wherein these supporting substrates 121 can be arranged in a regular arrangement, such as a matrix arrangement. In other words, the supporting link 121u can divide a plurality of supporting substrates 121 .

These through holes 121h can be formed by etching. Please refer to FIG. 2A , specifically, firstly, the laser beam LR1 may be irradiated on the supporting substrate 121 . For example, the laser beam LR1 may irradiate the first surface 121 a and the second surface 121 b of the supporting substrate 121 , wherein the supporting substrate 121 may be a glass plate. After the laser beam LR1 is irradiated on the support substrate 121 , the portion of the support substrate 121 irradiated by the laser beam LR1 will be modified, thereby forming a plurality of modified portions 121 m.

It should be noted that the laser beam LR1 used to modify the supporting substrate 121 does not penetrate the supporting substrate 121 , so these modified parts 121 m are still entities rather than through holes. Compared with general laser drilling, the laser beam LR1 has lower power, and takes less time to irradiate the first surface 121a and the second surface 121b.

Referring to FIG. 2A and FIG. 2B , after the laser beam LR1 irradiates the support substrate 121 , the support substrate 121 is etched to remove part of the support substrate 121 irradiated by the laser beam LR1 . That is, the modified portions 121m are removed by etching, wherein the etching may be wet etching. Although the modified parts 121m are only formed by irradiating the supporting substrate 121 with the laser beam LR1, the modified parts 121m and the original unmodified supporting substrate 121 are composed of substantially the same material, but their properties are different.

For example, the etching rate of the modified part 121m and the unmodified part of the supporting substrate 121 will be different, and the etching rate of the modified part 121m will be significantly higher than the etching rate of the unmodified part of the supporting substrate 121, so that the improved The mass portion 121m can be removed, thereby forming these through holes 121h. In addition, since the laser beam LR1 has relatively low power, it takes less time to irradiate the first surface 121a and the second surface 121b. Compared with general laser drilling, the method for forming the through hole 121h disclosed in FIG. 2A and FIG. 2B has the advantages of reducing laser energy, shortening the forming time of the through hole 121h, and reducing or avoiding cracks in the through hole 121h.

Please refer to FIG. 2B and FIG. 2C , wherein FIG. 2C is a partially enlarged schematic view of the through hole 121h in FIG. 2B . Each through hole 121h has a first opening H21 on the first surface 121a and a second opening H22 on the second surface 121b, wherein the first opening H21 has a first diameter R21, and the second opening H22 has a second diameter R22. In addition, each through hole 121h also has a third aperture R23 between the first opening H21 and the second opening H22.

Please refer to FIG. 2A to FIG. 2C , since the modified portion 121m is formed through the irradiation of the laser beam LR1, and the etching starts from the first surface 121a and the second surface 121b, so that the width of the modified portion 121m will be from The first surface 121 a and the second surface 121 b gradually decrease toward the middle of the supporting substrate 121 . Therefore, in at least one through hole 121h, any one of the first aperture R21 and the second aperture R22 is larger than the third aperture R23.

Taking this embodiment as an example, in each of the through holes 121h, any one of the first hole diameter R21 and the second hole diameter R22 will be larger than the third hole diameter R23, wherein at least one of the first hole diameter R21 and the second hole diameter R22 is a through hole 121h maximum aperture. In other words, the maximum diameter of the through hole 121h is located at at least one of the first opening H21 and the second opening H22.

At least one or each through hole 121h further has a central section M12, and the third aperture R23 is located in the central section M12, wherein the third aperture R23 is the smallest diameter of the through hole 121h. In other words, the minimum diameter of the through hole 121h may be located at the center of the through hole 121h, that is, the central section M12. In addition, the ratio (ie, R23/R21 or R23/R22 ) between the third aperture R23 and the maximum aperture (ie, at least one of the first aperture R21 and the second aperture R22 ) may be between 0.6 and 0.9.

Referring to FIG. 2D , after the through holes 121h are formed, the conductive materials 123 are respectively formed in the through holes 121h. There are many methods for forming these conductive materials 123 , such as physical vapor deposition (Physical Vapor Deposition, PVD) or chemical vapor deposition (Chemical Vapor Deposition, CVD). In this embodiment, these conductive materials 123 may be formed by electroplating or printing to fill holes. When the conductive materials 123 are formed by printing and filling holes, the conductive materials 123 can be silver glue or copper paste, and can be filled in the through holes 121h.

Referring to FIG. 2E , afterward, a circuit structure layer 124 is formed on the first surface 121 a, which electrically connects the conductive materials 123 . In this embodiment, the method for forming the wiring structure layer 124 may be to sequentially form a wiring layer 124w, an insulating layer 124d, a flat layer 124x, a plurality of conductive pillars 124p and another layer on the first surface 121a of the supporting substrate 121. A wiring layer 124w, wherein the two wiring layers 124w can be formed by fine lithography and etching of two non-coplanar metal layers, and the metal layer can be formed by a deposition process, such as physical vapor deposition (PVD), chemical gas phase deposition (CVD) or electroplating.

The upper wiring layer 124w and the conductive pillars 124p can be formed by the same deposition process, so the upper wiring layer 124w and the conductive pillars 124p connected to it can be integrally formed. Therefore, there is no obvious boundary between the upper circuit layer 124w and the conductive pillar 124p. After the circuit structure layer 124 is formed on the first surface 121 a , the supporting board 121 u may be cut with a cutter 29 to separate the supporting substrates 121 .

Referring to FIG. 2F , next, a plurality of light emitting elements 125 are disposed on the circuit structure layer 124 , wherein the light emitting elements 125 are electrically connected to the circuit structure layer 124 . Taking FIG. 2F as an example, each light emitting element 125 has a plurality of electrodes (such as cathode and anode), wherein these electrodes are electrically connected to the upper circuit layer 124w. In addition, after these light-emitting elements 125 are arranged on the circuit structure layer 124, a protective layer 129 can be formed on the line structure layer 124 to cover and protect these light-emitting elements 125, and these light-emitting elements 125 can also be detected and screened to Maintain or improve yield.

Since the circuit layers 124w in the circuit structure layer 124 can be electrically connected to each other through the conductive pillars 124p, and the circuit structure layer 124 is electrically connected to the conductive materials 123, the electrodes of each light emitting element 125 can pass through the circuit structure layer 124 And electrically connected to the conductive material 123 . Although the electrodes (such as cathode and anode) of each light emitting element 125 are electrically connected to the upper circuit layer 124w, these electrodes are not directly electrically connected to avoid short circuit.

Please refer to FIG. 2G, after these light-emitting elements 125 are arranged on the circuit structure layer 124, the support substrate 121 is arranged on the control substrate 122 to form the display assembly 120, wherein the electrodes E22 of the active element array substrate 122a and the conductive materials 123 can be electrically connected to each other by means of low-temperature metal bonding or welding, and the aforementioned low-temperature metal bonding is, for example, low-temperature copper-to-copper bonding or conductive material bonding.

In this way, the conductive materials 123 in the support substrate 121 can be electrically connected to the control substrate 122 . In addition, since the light-emitting elements 125 can be electrically connected to the conductive materials 123 through the circuit structure layer 124, the light-emitting elements 125 can be electrically connected to the control substrate 122 through the circuit structure layer 124 and the conductive materials 123, so that the control substrate 122 can control these light emitting elements 125 to emit light.

It is worth mentioning that the support substrate 121 is disposed on the completed control substrate 122 , so the support substrate 121 and the control substrate 122 are two independent components. Therefore, both the support substrate 121 and the control substrate 122 can be manufactured in two different manufacturing locations.

Referring to FIG. 1A , after that, at least one display component 120 is disposed on the same carrier substrate 110 , wherein in FIG. 1A , multiple display components 120 are disposed on the same carrier substrate 110 . So far, the display device 100 has been substantially manufactured. In this embodiment, the display components 120 can be disposed on the carrier substrate 110 by using an adhesive material 130 .

FIG. 3 is a schematic cross-sectional view of a display device according to another embodiment of the present invention. Referring to FIG. 3 , the display device 300 of this embodiment is similar to the display device 100 of the foregoing embodiment, and the same features of the display devices 100 and 300 will not be described below in principle. The difference between the display devices 100 and 300 is that the display device 300 includes a plurality of display components 320 , wherein each display component 320 includes a control substrate 322 different from the previous embodiments.

Specifically, each control substrate 322 includes an active device array substrate 122a and a circuit substrate 322c, wherein the circuit substrate 322c is electrically connected to the active device array substrate 122a, and the circuit substrate 322c may be a flexible circuit board or a soft-hard composite circuit board. Different from the control substrate 122, in the same control substrate 322, the circuit substrate 322c can be flexed so that the circuit substrate 322c extends from the side S13 to the lower surface S12. In this way, the circuit board 322c is provided not only on the side surface S13 but also on the lower surface S12.

It is worth mentioning that, in this embodiment, the circuit substrate 322c is disposed on the side surface S13 and the lower surface S12, that is, the circuit substrate 322c covers the side surface S13 and the lower surface S12. However, in other embodiments, the circuit substrate 322c may also be only disposed on the lower surface S12, and not disposed nor covered on the side surface S13. Therefore, FIG. 3 does not limit the circuit substrate 322c to cover the side surface S13 and the lower surface S12. In addition, in this embodiment, the adhesive material 130 can contact and bond part of the circuit substrate 322c, but in other embodiments, the adhesive material 130 can only contact and bond the active device array substrate 122a, and not contact or bond the circuit substrate 322c. Therefore, FIG. 3 does not limit the manner in which the adhesive material 130 adheres to the circuit substrate 322c.

4A to 4B are schematic side views of a manufacturing method of a display device according to another embodiment of the present invention. Referring to FIG. 4A and FIG. 4B , the display device 400 of this embodiment (see FIG. 4B ) is similar to the display device 100 of the previous embodiment, and the manufacturing methods of the two are also similar. The main difference between the display devices 100 and 400 is that the display device 400 further includes a plurality of fixed substrates 440 on which the display components 120 are disposed. The following mainly describes the differences between this embodiment and the foregoing embodiments, and the same technical features of the two will not be repeated in principle.

Specifically, in the manufacturing method of the display device 400 of this embodiment, a plurality of fixed substrates 440 may be provided, wherein the size of each fixed substrate 440 is significantly smaller than that of the carrier substrate 110 , as shown in FIG. 4B . In addition, the materials of these fixing substrates 440 can be the same as that of the carrier substrate 110 . For example, the fixed substrate 440 may also be a metal plate, a glass plate or a ceramic plate.

After the supporting substrate 121 is disposed on the control substrate 122 to form a plurality of display components 120 (please refer to FIG. 2G ), at least one display component 120 may be disposed on one of the fixed substrates 440 . In this embodiment, these display components 120 are arranged on these fixed substrates 440 respectively, and a plurality of display components 120 can be arranged on one of the fixed substrates 440, wherein these display components 120 can be arranged on the same block with adhesive material 130 fixed on the substrate 440 .

It should be noted that, in other embodiments, only one display component 120 may be disposed on one of the fixed substrates 440 . Therefore, the number of display components 120 disposed on one fixed substrate 440 is not limited to a plurality. After the display assembly 120 is disposed on the fixed substrates 440 , these fixed substrates 440 are disposed on the carrier substrate 110 . So far, a display device 400 including a plurality of fixed substrates 440 has been substantially manufactured.

FIG. 4C is a schematic partial cross-sectional view of the display device shown in FIG. 4B , wherein FIG. 4C specifically presents an arrangement between the fixed substrate 440 and the carrier substrate 110 . Referring to FIG. 4B and FIG. 4C , the fixing substrates 440 are disposed on the carrier substrate 110 and located between the display components 120 and the carrier substrate 110 . These fixed substrates 440 may be detachably disposed on the carrier substrate 110 . Taking FIG. 4C as an example, these fixed substrates 440 can be fixed on the carrier substrate 110 by using a plurality of fasteners 490, wherein these fasteners 490 can include bolts and nuts (not shown), and can penetrate the fixed substrate 440 and the carrier substrate. 110.

During the process of setting these fixed substrates 440 on the carrier substrate 110, these locking members 490 can adjust the inclination angle of each fixed substrate 440 relative to the carrier substrate 110, wherein at least one A washer to help adjust the angle of inclination mentioned above. In this way, these display components 120 can be flatly arranged on the carrier substrate 110, thereby helping to reduce the distance D1 between two adjacent support substrates 121, so as to effectively reduce or eliminate the splicing seam, thereby maintaining or improving the display device. 400 image quality.

In other embodiments, the fixing substrate 440 may also be disposed on the carrier substrate 110 by means other than the locking member 490 . For example, at least one of the fixed substrate 440 and the carrier substrate 110 can be equipped with a magnet, so that the fixed substrate 440 and the carrier substrate 110 can attract each other through magnetic force, so that the fixed substrate 440 can be fixed on the carrier substrate 110 . Alternatively, these fixed substrates 440 can also be disposed on the carrier substrate 110 in a buckling manner. In addition, the fixed substrate 440 can also be disposed on the carrier substrate 110 by using an adhesive material (such as the adhesive material 130 ). Therefore, the manner in which the fixed substrate 440 is disposed on the carrier substrate 110 is not limited to that shown in FIG. 4C .

When the display assembly 120 fails, through the locking member 490, the fixed substrate 440 on which the faulty display assembly 120 is located can be disassembled from the carrier substrate 110, and the fixed substrate 440 on which a plurality of normal display assemblies 120 have been installed can be reset. on the carrier substrate 110 to replace the previously disassembled fault display assembly 120 . It can be seen that, by using these fixed substrates 440 , the failure display assembly 120 in the display device 400 can be replaced, so that the display device 400 has advantages such as convenient maintenance.

It is worth mentioning that, in the embodiment shown in FIGS. 4A to 4C , the display device 400 includes a plurality of display components 120 . However, in other embodiments, the display device 400 may also include a plurality of display components 320 , wherein the display components 120 shown in FIGS. 4A to 4C may be replaced with the display components 320 shown in FIG. 3 . In other words, these display components 320 can also be set on these fixed substrates 440 respectively, and multiple display components 320 can be set on one of the fixed substrates 440, wherein these display components 320 can also be set on the same fixed substrate 440 by using the adhesive material 130. on a fixed substrate 440 . It can be seen that the fixed substrate 440 can also be used in the aforementioned embodiments, and the display device 300 shown in FIG. 3 can also include a plurality of fixed substrates 440 .

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The protection scope of the invention shall be defined by the scope of the appended patent application.

22a: Substrate 29: Knife 100, 300: display device 110: carrying substrate 120, 320: display components 121: supporting substrate 121a: first surface 121b: second surface 121h: through hole 121m: Modification department 121u: support connecting plate 122, 322: control substrate 122a: active element array substrate 122c, 322c: circuit substrate 123: Conductive material 124: Line structure layer 124d, IN1, IN2, IN3, IN4: insulating layer 124p: Conductive column 124w: line layer 124x: flat layer 124y: Pad 125: Light emitting element 129: protective layer 130: Adhesive material 440: fixed substrate 490: lock C22: Channel layer D1: distance D22: drain E22: Electrode G22: Gate H21: first opening H22: second opening L21, L22: Width LR1: laser beam M12: central section R21: First aperture R22: second aperture R23: third aperture S11: Upper surface S12: Lower surface S13: side S22: source S23: Scanning line T22: Control element

FIG. 1A is a schematic cross-sectional view of a display device according to at least one embodiment of the present invention. FIG. 1B is a partially enlarged schematic view of one of the display components in FIG. 1A . 2A to 2G are schematic cross-sectional views of the manufacturing method of the display device shown in FIG. 1A . FIG. 3 is a schematic cross-sectional view of a display device according to another embodiment of the present invention. 4A to 4B are schematic side views of a manufacturing method of a display device according to another embodiment of the present invention. FIG. 4C is a schematic partial cross-sectional view of the display device in FIG. 4B .

100: display device

110: carrying substrate

120: Display components

121: supporting substrate

121a: first surface

121b: second surface

121h: through hole

122: Control substrate

122a: active element array substrate

122c: circuit substrate

123: Conductive material

124: Line structure layer

124d: insulating layer

124p: Conductive column

124w: line layer

124x: flat layer

124y: Pad

125: Light emitting element

129: protective layer

130: Adhesive material

D1: distance

L21, L22: Width

S11: Upper surface

S12: Lower surface

S13: side

Claims (14)

A method of manufacturing a display device, comprising: forming a plurality of through holes on a support substrate, wherein the support substrate has a first surface and a second surface opposite to the first surface, and the through holes extend from the first surface to the second surface; Forming a plurality of conductive materials in the through holes respectively; forming a circuit structure layer on the first surface, wherein the circuit structure layer is electrically connected to the conductive materials; A plurality of light-emitting elements are arranged on the circuit structure layer, wherein the light-emitting elements are electrically connected to the circuit structure layer; After the light-emitting elements are arranged on the circuit structure layer, the supporting substrate is arranged on a control substrate to form a display component, wherein the conductive materials are electrically connected to the control substrate to make the control substrate electrically connecting the light emitting elements; and A plurality of the display components are arranged on a carrier substrate. The method for manufacturing a display device according to claim 1, wherein the step of forming the through holes on the supporting substrate comprises: irradiating a laser beam on the support substrate; and After the laser beam is irradiated on the support substrate, the support substrate is etched to remove the part of the support substrate irradiated by the laser beam. The method for manufacturing a display device according to claim 1, wherein the method of forming the conductive materials in the through holes includes electroplating or printing hole filling. The manufacturing method of a display device as claimed in claim 1, wherein before forming the circuit structure layer on the first surface, a plurality of the supporting substrates are integrated into a supporting connecting plate; After the circuit structure layer is formed on the first surface, the supporting connecting plate is cut to separate the supporting substrates. The method for manufacturing a display device as claimed in item 1, wherein the step of arranging the display components on the carrier substrate includes: Provide multiple fixed substrates; disposing at least one of the display components on one of the fixed substrates; and The fixed substrates are arranged on the carrier substrate. A display device comprising: a carrier substrate; A plurality of display components are arranged on the carrier substrate, wherein the display components are regularly arranged on the carrier substrate, and each display component includes: a control substrate, arranged on the carrier substrate; A support substrate has a first surface, a second surface opposite to the first surface and a plurality of through holes, wherein the through holes extend from the first surface to the second surface, the support substrate is arranged on the control on the substrate; A plurality of conductive materials are respectively located in the through holes and electrically connected to the control substrate; a circuit structure layer disposed on the first surface and electrically connected to the conductive materials, wherein the supporting substrate is located between the circuit structure layer and the control substrate; and A plurality of light-emitting elements are arranged on the circuit structure layer and electrically connected to the circuit structure layer. The display device as claimed in claim 6, wherein the size of the support substrate is larger than the size of the control substrate. The display device as claimed in item 6, wherein the control substrate comprises: An active element array substrate has an upper surface, a lower surface and a side surface between the upper surface and the lower surface, wherein the supporting substrate is arranged on the upper surface and completely covers the upper surface, and the supporting substrate protrudes from that side; and A circuit substrate is electrically connected to the active element array substrate. The display device as claimed in claim 8, wherein the circuit substrate is disposed on the side surface. The display device as claimed in claim 8, wherein the circuit substrate is disposed on the lower surface. The display device according to claim 6, wherein at least one of the through holes has: a first opening on the first surface having a first aperture; and A second opening on the second surface has a second aperture, wherein the through hole has a third aperture between the first opening and the second opening, and any of the first aperture and the second aperture One is larger than the third aperture. The display device according to claim 11, wherein the through hole further has a central section, and the third aperture is located in the central section, and at least one of the first aperture and the second aperture is a maximum of the through hole. aperture, and the third aperture is a minimum aperture of the through hole, wherein the ratio between the third aperture and the maximum aperture is between 0.6 and 0.9. The display device according to claim 11, wherein the distance between two adjacent supporting substrates is within 400 microns. The display device as described in claim 6, further comprising: A plurality of fixed substrates are arranged on the carrier substrate, wherein the display components are respectively arranged on the fixed substrates, and the fixed substrates are located between the display components and the carrier substrate.

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