CN112259592A

CN112259592A - Flexible substrate, display screen and display device

Info

Publication number: CN112259592A
Application number: CN202011141731.XA
Authority: CN
Inventors: 王品凡; 冯佑雄; 陈振彰
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-01-22
Anticipated expiration: 2040-10-22
Also published as: CN112259592B

Abstract

The embodiment of the application provides a flexible substrate, a display screen and a display device. The flexible substrate is used for leading the first electrode and the second electrode of the organic light-emitting unit out to one side, far away from the organic light-emitting layer, of the flexible substrate through the leading-out structure, so that the connection with the driving circuit can be realized through the leading-out structure, a frame area of a formed display screen is not required to be provided with a fan-out line, a binding area, a film pasting area of a flexible circuit board, a bending process buffer area and the like, and the frame width can be greatly reduced; when the display screen is a spliced display screen, the difference between the width of the splicing seam and the sub-pixel interval is small due to the large reduction of the frame width, so that the splicing seam is visually eliminated, and the display effect of the spliced display screen is improved; and the extraction structure is arranged in the dark area, so that an erosion path of water and oxygen to the organic light-emitting unit is not provided, and the water and oxygen invasion performance of the flexible substrate is ensured.

Description

Flexible substrate, display screen and display device

Technical Field

The application relates to the technical field of display, in particular to a flexible substrate, a display screen and a display device.

Background

Due to the nature of materials and process limitations, oversized display screens, such as display wall products, are generally realized in a splicing manner, and the key problem of the splicing display screens is how to solve the problem that a display picture generates a strip-shaped dark area because a splicing seam cannot be displayed.

In the prior art, since the frame of a single OLED (organic light-Emitting Diode) display screen has a large width, even if the connection structure is bent to the opposite side of the light-Emitting surface, the width of the frame of the OLED display screen cannot meet the requirement of visually eliminating the splicing seam.

Disclosure of Invention

This application provides a flexible substrate, display screen and display device to the shortcoming of current mode, can reduce the frame of single OLED display screen to the concatenation seam is eliminated even in the vision to the constriction, with the display effect who promotes concatenation formula display screen.

In a first aspect, embodiments of the present application provide a flexible substrate, including: a flexible substrate comprising light emitting areas and dark areas located between adjacent light emitting areas; the first electrode layer is positioned on one side of the flexible substrate and comprises a plurality of first electrodes, and the orthographic projection of each first electrode on the flexible substrate covers one light emitting area; the pixel defining layer is positioned on one side, away from the flexible substrate, of the first electrode layer, and is provided with a plurality of openings penetrating through the pixel defining layer, and the orthographic projection of each opening on the flexible substrate is positioned in the orthographic projection of one first electrode on the flexible substrate; an organic light emitting layer including a plurality of organic light emitting cells located within the opening; the second electrode layer is positioned on one side of the organic light-emitting layer, which is far away from the first electrode layer, and comprises at least one second electrode, and each second electrode covers at least one organic light-emitting unit; the packaging layer is positioned on one side, far away from the flexible substrate, of the second electrode layer; the first through holes and the second through holes at least penetrate through the flexible substrate and are positioned in the dark area; the first lead-out structures are positioned in the first through holes and electrically connected with the first electrodes, and the second lead-out structures are positioned in the second through holes and electrically connected with the second electrodes.

Optionally, the flexible substrate further comprises: a buffer layer between the flexible substrate and the first electrode layer; the lapping electrode layer is positioned between the buffer layer and the first electrode layer and comprises a plurality of first lapping electrodes and a plurality of second lapping electrodes, each first lapping electrode is electrically connected with one first electrode, and each second lapping electrode is electrically connected with one second electrode; a planarization layer between the landing electrode layer and the first electrode layer; the second through hole and the second through hole further penetrate through the buffer layer, part of the first lapping electrode is filled in the first through hole to form a first lead-out structure, and part of the second lapping electrode is filled in the second through hole to form a second lead-out structure.

Optionally, each of the second electrodes covers one of the organic light emitting units, and the number of the first extraction structures is equal to the number of the second extraction structures.

Optionally, each of the second electrodes covers a plurality of the organic light emitting units, and the number of the first extraction structures is greater than or equal to the number of the second extraction structures.

Optionally, the pixel definition layer includes a plurality of pixel definition units, each of the pixel definition units is provided with one of the openings, and an orthogonal projection of the pixel definition unit on the substrate does not intersect with an orthogonal projection of the first lead-out structure and the second lead-out structure on the substrate.

Optionally, the aperture of the first through hole is 2 μm to 20 μm, and the aperture of the second through hole is 2 μm to 20 μm; the distance between the center of the first through hole and the adjacent organic light emitting unit is 2-20 mu m.

In a second aspect, the present application provides a display screen, which includes a driving circuit board and the above-mentioned flexible substrate; the driving circuit board comprises a plurality of first bonding pads and a plurality of second bonding pads, each first bonding pad is electrically connected with one first lead-out structure, and each second bonding pad is electrically connected with one second lead-out structure.

Optionally, the number of the flexible substrates is multiple, and each of the driving circuit boards is electrically connected to one or more of the flexible substrates.

Optionally, the display screen further comprises: the connecting structure is connected between the first leading-out structure and the first bonding pad or between the second leading-out structure and the second bonding pad, the connecting structure is made of anisotropic conductive adhesive or metal material with the temperature lower than 80 ℃, and the metal material can be respectively in metal bonding with the material of the first leading-out structure and the material of the first bonding pad.

In a third aspect, the present application provides a display device, which includes the display screen described above.

The technical scheme provided by the embodiment of the application has the following beneficial technical effects:

according to the flexible substrate, the display screen and the display device, the organic light-emitting unit (comprising the first electrode, the organic light-emitting unit and the second electrode) is formed on the flexible substrate, and the first electrode and the second electrode of the organic light-emitting unit are led out to one side, far away from the organic light-emitting unit, of the flexible substrate by using the lead-out structure, so that the connection with the driving circuit can be realized by using the lead-out structure, a frame area of the formed display screen does not need to be provided with a fan-out line, a binding area, a film pasting area of the flexible circuit board, a bending process buffer area and the like, and the frame width can be greatly reduced; when the display screen is a spliced display screen, the difference between the width of the splicing seam and the sub-pixel interval is small due to the large reduction of the width of the frame, so that the splicing seam is eliminated visually, and the display effect of the spliced display screen is improved; and the extraction structure is arranged in the dark area, so that an erosion path of water and oxygen to the organic light-emitting unit is not provided, and the water and oxygen invasion performance of the flexible substrate is ensured.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic top view of a tiled display according to the prior art;

fig. 2 is a schematic top view of a flexible substrate according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view of the flexible substrate shown in FIG. 2 taken along line A-A;

FIG. 4 is another schematic cross-sectional view of the flexible substrate shown in FIG. 2 taken along line A-A;

FIG. 5 is a schematic cross-sectional view of the flexible substrate shown in FIG. 2 taken along line A-A;

fig. 6 is a schematic top view of a pixel defining layer and an extraction structure of another flexible substrate according to an embodiment of the present disclosure;

fig. 7 is a schematic flow chart illustrating a method for forming a flexible substrate according to an embodiment of the present disclosure;

fig. 8 is a schematic cross-sectional view of a display screen provided in an embodiment of the present application;

FIG. 9 is an enlarged partial view of region Q of FIG. 8;

FIG. 10 is a schematic cross-sectional view of another display provided by an embodiment of the present application;

fig. 11 is a schematic diagram of a frame structure of a display device according to an embodiment of the present application.

Reference numerals:

1-a flexible substrate; 11-a flexible substrate; t1 — first extraction structure; t2 — second extraction structure; 12-a first electrode layer; 121-a first electrode; 13-a pixel definition layer; 131-an opening; 132-a pixel definition unit; 14-an organic light-emitting layer; 141-an organic light-emitting unit; 15-a second electrode layer; 151-second electrode; 16-an encapsulation layer; 17-a buffer layer; 18-lap electrode layer; 181-first strap electrode; 182-a second strap electrode; 19-a planarization layer;

2-a driving circuit board; 21-a first pad; 22-a second pad;

3-a linking structure;

10-a light emitting zone; 20-dark area.

Detailed Description

Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

The most critical problem of the spliced display screen is how to solve the problem that the display picture generates a bar-shaped dark space due to the fact that the spliced seam cannot be displayed. As shown in fig. 1, a first display panel P1 and a second display panel P2 with the same sub-pixel m pitch are spliced, taking the first display panel P1 as an example, the distance between two adjacent sub-pixels m in the direction perpendicular to the splicing seam is D1, for convenience of description, D1 is referred to as sub-pixel pitch in the following description of the present application; the distance between the sub-pixel m closest to the edge and the edge is D3, and for convenience of description, D3 is referred to as a bezel width in the subsequent description of the present application; the distance between the sub-pixel m closest to the second display screen P2 in the first display screen P1 and the sub-pixel m closest to the first display screen P1 in the second display screen P2 is D2, and for convenience of description, D2 is referred to as a splice width in the following description of the present application.

If the splice seam width D2 and the sub-pixel spacing D1 do not differ much, i.e., the bezel width D3 is approximately equal to half the sub-pixel spacing D1, then visual elimination of the splice seam can be achieved.

For the OLED display screen, even if the scheme that the flexible circuit board bound with the driving chip is bent to the opposite side of the light emitting surface is adopted to narrow the frame, the frame width of the OLED display screen is also more than 1mm due to the fan-out area, the binding area with the flexible circuit board, the sticking film and bending process buffer area of the flexible circuit board, the bending radius of the flexible circuit board, the thickness of the touch flexible circuit board and the like. Taking a 4K huge display screen (tiled type) with 146 inches to be manufactured as an example, the sub-pixel distance D1 is about 0.84mm, and the frame distance D3 of the OLED obviously cannot meet the requirement of visually eliminating the tiled seam.

The application provides a flexible substrate, display screen and display device aims at solving prior art technical problem as above.

The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.

An embodiment of the present application provides a flexible substrate, and as shown in fig. 2 and fig. 3, the flexible substrate 1 provided by the present embodiment includes:

a flexible substrate 11 comprising light emitting areas 10 and dark regions 20 located between adjacent light emitting areas 10;

a first electrode layer 12 located on one side of the flexible substrate 11 and including a plurality of first electrodes 121, wherein an orthographic projection of each first electrode 121 on the flexible substrate 11 covers one light emitting area 10;

the pixel defining layer 13 is positioned on one side of the first electrode layer 12, which is far away from the flexible substrate 11, and is provided with a plurality of openings 131 penetrating through the pixel defining layer 13, and the orthographic projection of each opening 131 on the flexible substrate 11 is positioned in the orthographic projection of one first electrode 121 on the flexible substrate 11;

an organic light emitting layer 14 including a plurality of organic light emitting cells 141 positioned within the opening 131;

a second electrode layer 15, located on a side of the organic light emitting layer 14 away from the first electrode layer 12, including at least one second electrode 151, each second electrode 151 covering at least one organic light emitting unit 141;

an encapsulation layer 16 located on a side of the second electrode layer 15 away from the flexible substrate 11;

a plurality of first vias (not shown) and a plurality of second vias (not shown) extending through at least the flexible substrate 11 and located in the dark area 20;

a plurality of first lead-out structures T1 and a plurality of second lead-out structures T2, each first lead-out structure T1 being located in one of the first through holes and electrically connected to one of the first electrodes 121, and the second lead-out structure T2 being located in one of the second through holes and electrically connected to one of the second electrodes 151.

In the flexible substrate 1 provided by this embodiment, the organic light emitting unit (including the first electrode 121, the organic light emitting unit 141, and the second electrode 151) is formed on the flexible substrate 1, and the first electrode 121 and the second electrode 151 of the organic light emitting unit are led out to one side of the flexible substrate 11 away from the organic light emitting unit by using the lead-out structure, so that the lead-out structure can be used to realize electrical connection with the driving circuit manufactured on another substrate, so that the frame area of the formed display screen does not need to be provided with a fan-out line, a binding area, a film pasting and bending process buffer area of the flexible circuit board, and the frame width can be greatly reduced; when the display screen is a spliced display screen, the difference between the width of the splicing seam and the sub-pixel interval is small due to the large reduction of the width of the frame, so that the splicing seam is eliminated visually, and the display effect of the spliced display screen is improved; and the extraction structure is arranged in the dark area 20, so that the corrosion path of water and oxygen to the organic light-emitting unit is not provided, and the water and oxygen invasion performance of the flexible substrate 1 is ensured.

Further, as shown in fig. 3, the present embodiment provides the flexible substrate 1 in which the organic light emitting unit 141 includes a red organic light emitting unit, a green organic light emitting unit, and a blue organic light emitting unit for emitting red, green, and blue light, respectively.

Optionally, as shown in fig. 3, in the flexible substrate 1 provided in this embodiment, the aperture of the first through hole is 2 μm to 20 μm, and the aperture of the second through hole is 2 μm to 20 μm; the center of the first via hole is spaced apart from the adjacent organic light emitting unit 141 by 2 to 20 μm. Specifically, the distance between the center of the first through hole and the adjacent organic light emitting unit 141 refers to the distance between the edge of the organic light emitting unit 141 closest to the first through hole and the center of the first through hole. This size can satisfy the 4K display demand of huge screen, the subpixel interval is about 0.84mm promptly, under this condition, owing to utilize the extraction structure to realize being connected with the drive circuit's of preparation on another base plate electricity, make the frame district of the display screen that forms need not to set up the fan-out line, bind the district, the pad pasting and the bending process buffer zone of flexible circuit board etc. can make the frame width of flexible base plate fall to below 0.5mm, be equal to half of subpixel interval approximately, can make splice seam width and subpixel interval differ a little, thereby eliminate the splice seam in the vision, promote the display effect of concatenation formula display screen.

Alternatively, as shown in fig. 3, the present embodiment provides the flexible substrate 1 in which each of the second electrodes 151 covers the plurality of organic light emitting units 141, and the number of the first lead-out structures T1 is greater than or equal to the number of the second lead-out structures T2.

Taking the flexible substrate 1 shown in fig. 3 as an example, the second electrode 151 covers 2 organic light emitting cells 141, and the number of the first lead-out structures T1 is 2 times the number of the second lead-out structures T2, i.e., the number of the first lead-out structures T1 is greater than the number of the second lead-out structures T2. In order to improve the transmission performance of the driving signal to the second electrode 151, the number of the second extraction structures T2 may be increased, for example, the number of the first extraction structures T1 is equal to the number of the second extraction structures T2.

Alternatively, as shown in fig. 4, the present embodiment provides the flexible substrate 1 in which each of the second electrodes 151 covers one organic light emitting unit 141, and the number of the first lead-out structures T1 is equal to the number of the second lead-out structures T2. In this way, it can be ensured that the transmission capacities of the first lead-out structure T1 and the second lead-out structure T2 for the driving signals are substantially the same.

Further, as shown in fig. 5 and 6, the present embodiment provides the flexible substrate 1, wherein the pixel defining layer 13 includes a plurality of pixel defining units 132, each pixel defining unit 132 is provided with one opening 131, and an orthogonal projection of the pixel defining unit 132 on the substrate is not intersected with an orthogonal projection of the first lead-out structure T1 and the second lead-out structure T2 on the substrate.

The arrow shown in fig. 6 indicates that the first lead structure T1 (or the second lead structure T2) is electrically connected to the first electrode 121 (or the second electrode 151) corresponding to the opening 131 indicated by the arrow.

In the flexible substrate 1 provided in this embodiment, each pixel defining unit 132 is provided with one opening 131, that is, each pixel defining unit 132 corresponds to one sub-pixel, and since the adjacent pixel defining units 132 are separated from each other, the formed encapsulation layer 16 can cover not only the second electrode 151 but also the sidewalls of the pixel defining units 132, so as to further improve the water and oxygen blocking capability of the flexible substrate 1.

Optionally, as shown in fig. 5, the flexible substrate 1 provided in this embodiment further includes:

a buffer layer 17 between the flexible substrate 11 and the first electrode layer 12;

a landing electrode layer 18, located between the buffer layer 17 and the first electrode layer 12, including a plurality of first landing electrodes 181 and a plurality of second landing electrodes 182, located in the dark region 20, each of the first landing electrodes 181 being electrically connected to one of the first electrodes 121, and each of the second landing electrodes 182 being electrically connected to one of the second electrodes 151;

a planarization layer 19 located between the landing electrode layer 18 and the first electrode layer 12;

the first via and the second via further penetrate through the buffer layer, a portion of the first strapping electrode 181 is filled in the first via to form a first lead-out structure T1, and a portion of the second strapping electrode 182 is filled in the second via to form a second lead-out structure T2.

The flexible substrate 1 provided by this embodiment forms the overlapping electrode by using the overlapping electrode layer 18 to electrically connect the first electrode 121 and the second electrode 151, and the overlapping electrode filled in the first through hole and the second through hole when forming the overlapping electrode layer 18 is used as a leading-out structure, so that not only a better connection effect is achieved, but also the number of the film layers between the first through hole and the first electrode layer 12 and the second through hole are increased, and the water and oxygen blocking capability of the flexible substrate 1 can be further improved.

Taking the flexible substrate 1 shown in fig. 6 as an example, the present embodiment provides a method for forming the flexible substrate 1 shown in fig. 5, please refer to fig. 5, fig. 6 and fig. 7, the method for forming the flexible substrate 1 provided in the present embodiment includes:

s1: a glass substrate is provided, a flexible substrate 11 is formed on the glass substrate, and the flexible substrate 11 comprises light emitting areas 10 and dark areas 20 located between adjacent light emitting areas 10. Specifically, each light emitting region 10 corresponds to one sub-pixel, the flexible substrate 11 may be made of Polyimide (PI) material, and in order to facilitate the subsequent separation of the flexible substrate 11 from the glass substrate, a material for facilitating peeling may be coated between the flexible substrate 11 and the glass substrate.

S2: a buffer layer 17 is formed on one side of the flexible substrate 11 away from the glass substrate and is subjected to patterning processing to form a plurality of first through holes and a plurality of second through holes penetrating through the buffer layer 17 and the flexible substrate 11, and the first through holes and the second through holes are located in the dark area 20.

S3: and forming a lap electrode layer 18 on a side of the buffer layer 17 far away from the flexible substrate 11, wherein the lap electrode layer 18 comprises a plurality of first lap electrodes 181 and a plurality of second lap electrodes 182 which are positioned in the dark region 20, a part of the first lap electrodes 181 are filled in the first through holes to form a first lead-out structure T1, and a part of the second lap electrodes 182 are filled in the second through holes to form a second lead-out structure T2.

S4: a planarization layer 19 is formed on the side of the landing electrode layer 18 remote from the substrate and patterned to form a third via hole through the planarization layer 19.

S5: a first electrode layer 12 is formed on a side of the planarization layer 19 away from the landing electrode layer 18, the first electrode layer 12 includes a plurality of first electrodes 121, and the first electrodes 121 are electrically connected to the first landing electrodes 181 through third through holes.

S6: a pixel defining layer 13 is formed on the side of the first electrode layer 12 away from the planarization layer 19, and an imaging process is performed to obtain a plurality of openings 131 penetrating the pixel defining layer 13 and fourth through holes penetrating the pixel defining layer 13 and the planarization layer 19, wherein an orthographic projection of each opening 131 on the flexible substrate 11 is located within an orthographic projection of one first electrode 121 on the flexible substrate 11.

S7: the organic light emitting layer 14 is formed, and the organic light emitting layer 14 includes a plurality of organic light emitting units 141 located in the openings 131.

S8: a second electrode layer 15 is formed on the organic light emitting layer 14 away from the first electrode layer 12, the second electrode layer 15 includes at least one second electrode 151, each second electrode 151 covers at least one organic light emitting unit 141 and the second electrode 151 is electrically connected to the second overlapping electrode 182 through a fourth through hole.

S9: an encapsulation layer 16 is formed on the side of the second electrode layer 15 remote from the flexible substrate 11.

It should be noted that when the flexible substrate 1 does not include some of the above-mentioned film layers, such as the buffer layer 17, the landing electrode layer 18, or the planarization layer 19, the method for forming the flexible substrate 1 may not include the step of forming the corresponding film layers.

It should be noted that, in order to facilitate the subsequent binding of the flexible substrate 1 and the driving circuit board, a fixing film is required to be firstly provided to be attached to the side of the encapsulation layer 16 away from the flexible substrate 11, and then the glass substrate is peeled off.

Based on the same inventive concept, an embodiment of the present application further provides a display screen, as shown in fig. 8, the display screen provided in this embodiment includes a driving circuit board 2 and the flexible substrate 1 provided in the above embodiment, the driving circuit board 2 includes a plurality of first pads 21 and a plurality of second pads 22, each of the first pads 21 is electrically connected to one of the first lead-out structures T1, and each of the second pads 22 is electrically connected to one of the second lead-out structures T2.

The display screen provided by the embodiment includes the flexible substrate 1 in the above embodiment, and has the beneficial effects of the flexible substrate 1 in the above embodiment, which are not described herein again.

Optionally, as shown in fig. 9, the display screen provided by the present embodiment further includes a connection structure 3, and the connection structure 3 is connected between the second lead-out structure T2 and the second pad 22. The connection structure 3 is also connected between the first lead-out structure T1 and the first pad 21, and the connection structure 3 is an anisotropic conductive paste or a metal material with a temperature lower than 80 ℃, and the metal material can be respectively in metal bonding with the material of the first lead-out structure T1 and the material of the first pad 21. Note that the first lead-out structure T1 and the second lead-out structure T2 are made of the same material, and the first pad 21 and the second pad 22 are made of the same material. Specifically, the metal material is preferably a metal material having high ductility, such as aluminum, copper, or gold.

The connection structure 3 made of the above materials can not only realize the electrical connection between the flexible substrate 1 and the driving circuit board 2 conveniently, but also avoid the damage to the flexible substrate 1 caused by the temperature problem.

Alternatively, as shown in fig. 10, in the display screen provided in this embodiment, the number of the flexible substrates 1 is multiple, and each of the driving circuit boards 2 is electrically connected to one or more of the flexible substrates 1. The display screen that this embodiment provided is the concatenation formula display screen, through the general mode of a drive circuit board 2 of a plurality of flexible base plate 1, more does benefit to the concatenation of flexible base plate 1.

It should be noted that the driving circuit board 2 included in the display panel in the present embodiment includes a gate driving circuit, a pixel driving circuit, and the like.

Based on the same inventive concept, an embodiment of the present application further provides a display device, as shown in fig. 11, the display device provided in this embodiment includes the display screen in the foregoing embodiment, and has the beneficial effects of the display screen in the foregoing embodiment, which are not described herein again.

Specifically, as shown in fig. 11, the display device provided in this embodiment further includes a driving chip, where the driving chip is configured to provide a driving signal for the display screen.

By applying the embodiment of the application, at least the following beneficial effects can be realized:

Those of skill in the art will appreciate that the various operations, methods, steps in the processes, acts, or solutions discussed in this application can be interchanged, modified, combined, or eliminated. Further, other steps, measures, or schemes in various operations, methods, or flows that have been discussed in this application can be alternated, altered, rearranged, broken down, combined, or deleted. Further, steps, measures, schemes in the prior art having various operations, methods, procedures disclosed in the present application may also be alternated, modified, rearranged, decomposed, combined, or deleted.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims

1. A flexible substrate, comprising:

a flexible substrate comprising light emitting areas and dark areas located between adjacent light emitting areas;

the first electrode layer is positioned on one side of the flexible substrate and comprises a plurality of first electrodes, and the orthographic projection of each first electrode on the flexible substrate covers one light emitting area;

the pixel defining layer is positioned on one side, away from the flexible substrate, of the first electrode layer, and is provided with a plurality of openings penetrating through the pixel defining layer, and the orthographic projection of each opening on the flexible substrate is positioned in the orthographic projection of one first electrode on the flexible substrate;

an organic light emitting layer including a plurality of organic light emitting cells located within the opening;

the second electrode layer is positioned on one side of the organic light-emitting layer, which is far away from the first electrode layer, and comprises at least one second electrode, and each second electrode covers at least one organic light-emitting unit;

the packaging layer is positioned on one side, far away from the flexible substrate, of the second electrode layer;

the first through holes and the second through holes at least penetrate through the flexible substrate and are positioned in the dark area;

the first lead-out structures are positioned in the first through holes and electrically connected with the first electrodes, and the second lead-out structures are positioned in the second through holes and electrically connected with the second electrodes.

2. The flexible substrate of claim 1, further comprising:

a buffer layer between the flexible substrate and the first electrode layer;

the lapping electrode layer is positioned between the buffer layer and the first electrode layer and comprises a plurality of first lapping electrodes and a plurality of second lapping electrodes, each first lapping electrode is electrically connected with one first electrode, and each second lapping electrode is electrically connected with one second electrode;

a planarization layer between the landing electrode layer and the first electrode layer;

the second through hole and the second through hole further penetrate through the buffer layer, part of the first lapping electrode is filled in the first through hole to form a first lead-out structure, and part of the second lapping electrode is filled in the second through hole to form a second lead-out structure.

3. The flexible substrate of claim 2, wherein each of the second electrodes covers one of the organic light emitting units, and the number of the first extraction structures is equal to the number of the second extraction structures.

4. The flexible substrate of claim 2, wherein each of the second electrodes covers a plurality of the organic light emitting units, and the number of the first extraction structures is greater than or equal to the number of the second extraction structures.

5. The flexible substrate of claim 4, wherein the pixel definition layer comprises a plurality of pixel definition units, each of the pixel definition units being provided with one of the openings, and wherein an orthogonal projection of the pixel definition unit on the substrate does not intersect an orthogonal projection of the first lead-out structure and the second lead-out structure on the substrate.

6. The flexible substrate according to any one of claims 1 to 5, wherein the first through-hole has a pore diameter of 2 μm to 20 μm, and the second through-hole has a pore diameter of 2 μm to 20 μm;

the distance between the center of the first through hole and the adjacent organic light emitting unit is 2-20 mu m.

7. A display screen, comprising:

the flexible substrate of any one of claims 1-6;

the driving circuit board comprises a plurality of first bonding pads and a plurality of second bonding pads, each first bonding pad is electrically connected with one first lead-out structure, and each second bonding pad is electrically connected with one second lead-out structure.

8. The display screen of claim 7, wherein the number of the flexible substrates is multiple, and each driving circuit board is electrically connected with one or more of the flexible substrates.

9. The display screen of claim 7, further comprising:

the connecting structure is connected between the first leading-out structure and the first bonding pad or between the second leading-out structure and the second bonding pad, the connecting structure is made of anisotropic conductive adhesive or metal material with the temperature lower than 80 ℃, and the metal material can be respectively in metal bonding with the material of the first leading-out structure and the material of the first bonding pad.

10. A display device characterized by comprising a display screen according to any one of claims 7 to 9.