TWI762526B - Mask holder with controlled adjustment - Google Patents

Mask holder with controlled adjustment Download PDF

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Publication number
TWI762526B
TWI762526B TW106138460A TW106138460A TWI762526B TW I762526 B TWI762526 B TW I762526B TW 106138460 A TW106138460 A TW 106138460A TW 106138460 A TW106138460 A TW 106138460A TW I762526 B TWI762526 B TW I762526B
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Taiwan
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mask
frame
substrate
section
elements
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TW106138460A
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Chinese (zh)
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TW201823870A (en
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馬庫斯 葛斯多夫
馬庫斯 賈科柏
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德商愛思強歐洲公司
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04Coating on selected surface areas, e.g. using masks
    • C23C16/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Abstract

本發明係有關於一種用於遮罩(1)之支架,遮罩在實施塗佈方法時位於基板(2)之待塗佈表面上,以便將層之沉積限制在表面由遮罩(1)之形狀及位置所預先規定的表面區段上,其中,支架之框架(3)的區段(4、4'、4"、4'''、16)以能夠使遮罩(1)變形的可變拉力作用於遮罩(1)之邊緣(1')。本發明提出以下創新點:感測器(5),用於測定遮罩(1)相對於基板(2)之實際位置;作動元件(6、7、8),用於改變框架(3)之至少一個第一區段(4)相對於框架(3)之至少一個第二區段(4')的位置;以及具有控制器(9)之控制迴路,以便藉由改變拉力(Z、Z'、Z"、Z''')來使遮罩(1)之實際位置朝遮罩(1)之規定位置的方向改變。 The invention relates to a support for a mask (1) which, when carrying out the coating method, is positioned on the surface to be coated of a substrate (2) in order to limit the deposition of layers to the surface covered by the mask (1) The shape and position of the pre-determined surface sections, wherein the sections (4, 4', 4", 4", 16) of the frame (3) of the support are in such a way that the cover (1) can be deformed The variable tension acts on the edge (1') of the mask (1). The present invention proposes the following innovations: a sensor (5) for measuring the actual position of the mask (1) relative to the substrate (2); elements (6, 7, 8) for changing the position of at least one first section (4) of the frame (3) relative to the at least one second section (4') of the frame (3); and having a controller The control loop of (9) is to change the actual position of the mask (1) in the direction of the prescribed position of the mask (1) by changing the tension (Z, Z', Z", Z''').

此外,本發明係有關於一種調整遮罩位置之方法,其中,使用控制迴路。 Furthermore, the present invention relates to a method of adjusting the position of the mask, wherein a control loop is used.

Description

具有受控調整裝置之遮罩支架 Mask Stand with Controlled Adjustment

本發明係有關於一種用於遮罩之支架,該遮罩在實施塗佈方法時位於基板之待塗佈表面上,以便將層之沉積限制在該表面由該遮罩之形狀及位置所預先規定的表面區段上,其中,該支架之框架的區段以能夠使該遮罩變形的可變拉力作用於該遮罩之邊緣。 The present invention relates to a support for a mask which, when carrying out a coating method, is placed on the surface to be coated of a substrate in order to limit the deposition of layers to that surface which is predetermined by the shape and position of the mask on a defined surface section, wherein the section of the frame of the bracket acts on the edge of the mask with a variable tension force capable of deforming the mask.

此外,本發明係有關於一種調整遮罩之位置的方法,該遮罩在實施塗佈方法時位於基板之待塗佈表面上,以便將層之沉積限制在該表面由該遮罩之形狀及位置所預先規定的表面區段上,其中,藉由該支架之框架的區段向該遮罩之邊緣施加能使該遮罩變形的拉力。 Furthermore, the present invention relates to a method of adjusting the position of a mask which, when carrying out the coating method, is on the surface to be coated of a substrate in order to limit the deposition of layers to the surface by the shape of the mask and the on a surface section predetermined by a position, wherein a tensile force capable of deforming the mask is applied to the edge of the mask by the segment of the frame of the support.

在基板上沉積橫向結構化層時會應用到本發明之裝置及本發明之方法,其中,將形成層的材料以氣體形式、特別是呈蒸汽狀態的有機分子之形式導入反應器(例如CVD或PVD反應器)之製程室。氣態起始材料在基板表面冷凝或發生反應,且在此過程中形成層。本發明特別是有關於一種可應用於LCD顯示器或OLED顯示器之製造過程的裝置。其所使用之遮罩具有被條帶隔開的窗口,該等窗口使得基板表面之相互分離的表面區段保持空著的狀態。在此等表面區段上沉積受到電激勵時將以不同顏色發光之不同 起始材料。遮罩由橫向結構化的薄壁金屬片構成,並且在遮罩邊緣被施加定向拉力時沿遮罩延伸方向伸展,使得窗口位於預設位置上。US 2014/0158044 A1描述一種遮罩框架,矩形遮罩之邊緣固定於該遮罩框架上,且該遮罩框架具有用於在不同位置上分別向遮罩施加定向拉力之拉力元件。 The device according to the invention and the method according to the invention find application in the deposition of a laterally structured layer on a substrate, in which the layer-forming material is introduced into a reactor in gaseous form, in particular in the form of organic molecules in the vapour state (eg CVD or PVD reactor) process chamber. The gaseous starting materials condense or react on the surface of the substrate, and layers are formed in the process. In particular, the present invention relates to an apparatus applicable to the manufacturing process of LCD displays or OLED displays. It uses a mask with windows separated by strips which keep separate surface sections of the substrate surface free. On these surface segments are deposited different starting materials that will emit light in different colors when electrically actuated. The mask is made of a thin-walled metal sheet that is laterally structured and stretched along the extending direction of the mask when a directional pulling force is applied to the edge of the mask, so that the window is located at a predetermined position. US 2014/0158044 A1 describes a mask frame on which the edges of a rectangular mask are fixed, and the mask frame has tension elements for applying directional tension to the mask at different positions, respectively.

WO 2007/133252 A2揭露如下:在將遮罩連接遮罩框架時為該遮罩調溫。其中,以另一溫度為框架調溫,從而在溫度變化時,由於熱膨脹係數不同而在遮罩表面中形成橫向應力。 WO 2007/133252 A2 discloses that the temperature of the mask is adjusted when the mask is attached to the mask frame. Therein, another temperature is used as a framework for temperature adjustment, so that when the temperature changes, transverse stresses are formed in the mask surface due to the different thermal expansion coefficients.

US 7,765,669 B2揭露一種製造遮罩之方法,其中,在製造過程中拉伸遮罩。 US 7,765,669 B2 discloses a method of manufacturing a mask, wherein the mask is stretched during the manufacturing process.

US 2016/0376703 A1描述一種用於相對基板表面調整遮罩之方法及裝置,其中,藉由CCD感測器偵測遮罩或基板之調整標記,並且藉由螺紋主軸形式之作動元件改變支架之對置區段的位置。 US 2016/0376703 A1 describes a method and apparatus for adjusting a mask relative to a substrate surface, wherein adjustment marks of the mask or substrate are detected by a CCD sensor, and an actuating element in the form of a threaded spindle changes the position of the holder The position of the opposing section.

US 2015/0068456 A1揭露一種用於遮罩之支架。該支架具有四個框架側邊,其相對於底板之位置可藉由螺紋主軸或壓電元件來加以改變。 US 2015/0068456 A1 discloses a bracket for a mask. The bracket has four frame sides whose position relative to the base plate can be changed by means of threaded spindles or piezoelectric elements.

為了藉由對托持遮罩邊緣的框架進行調溫來拉伸該遮罩,遮罩之材料及框架之材料可具有不同的熱膨脹係數,故溫度變化會導致遮罩變形。透過針對性的變形,可使遮罩自實際位置進入規定位置,因為經由拉力之施加,遮罩之對置邊緣區段會相互隔開。亦可設置其他作動元件,以便對遮罩邊緣施加定向拉力。對基板或遮罩所實施的調溫會導致框架或遮罩發生機械變形,而由於框架及基板係受到不同影響,特別是個別影響,故此機械變形無法以 計算方式加以測定。 In order to stretch the mask by adjusting the temperature of the frame holding the edge of the mask, the material of the mask and the material of the frame may have different thermal expansion coefficients, so the temperature change will cause the mask to deform. Through the targeted deformation, the mask can be brought from the actual position into the predetermined position, because the opposing edge sections of the mask are separated from each other by the application of the tensile force. Other actuating elements can also be provided in order to apply a directional pulling force to the edges of the mask. The temperature adjustment of the substrate or the mask can lead to mechanical deformation of the frame or the mask, and since the frame and the substrate are affected differently, especially individually, the mechanical deformation cannot be determined computationally.

本發明之目的在於對先前技術中的習知遮罩支架進行改良以利其使用,並提出一種相對先前技術能改良遮罩之位置調整的方法。 The purpose of the present invention is to improve the conventional mask holder in the prior art to facilitate its use, and to provide a method for improving the position adjustment of the mask relative to the prior art.

該目的透過申請專利範圍所給出之發明而達成。附屬項不僅為並列請求項所給出之發明的有益改良方案,亦為達成如下目的之獨立解決方案,即,對同類型支架進行改良以利其使用。 This object is achieved through the invention given in the scope of the application. The subsidiary item is not only a beneficial improvement of the invention given in the concurrent claim, but also an independent solution for the purpose of improving the same type of stent to facilitate its use.

首先且主要提出:使用控制迴路來調整遮罩位置。本發明之控制迴路具有感測器,其用於測定遮罩相對於基板之實際位置。控制迴路進一步具有作動元件,其用於改變框架之至少一個第一區段相對於框架之至少一個第二區段的位置。此外,控制迴路更具有用來產生操縱變數的控制裝置,用操縱變數控制作動元件,使得遮罩之實際位置由於作用於遮罩邊緣之拉力的變化而朝規定位置的方向改變。控制迴路可為PID控制迴路。作動元件較佳藉由改變框架之一或數個區段的溫度來改變兩個對置區段之間距。框架可為托持矩形遮罩之矩形框架。框架形成對置的框架側邊。藉由改變其中一個框架側邊之溫度,改變其長度,進而改變框架之對置區段的間距。感測器較佳為光學感測器。感測器可為具有成像光學設備之成像感測器,藉由成像光學設備在感測器(例如CCD感測器)上產生框架表面之影像。藉由影像評估可測定遮罩之實際位置,特別是遮罩之邊緣區域的實際位置。作動元件較佳為加熱元件及/或冷卻元件。每個框架側邊皆可具有冷卻通道及/或加熱通道。可以僅設置冷卻通道或者僅設置加熱通道。本發明亦提出:在框架側邊之延伸方 向上同時並排設置冷卻通道及加熱通道。每個框架側邊皆可與任一其他框架側邊分開地被調溫。作為加熱元件及/或冷卻元件的替代,亦可設置機械構件來改變兩框架區段之間距。藉由作動元件而被相互隔開之區段乃是框架及遮罩之邊緣區,遮罩及框架在該等邊緣區內藉由拉力傳遞元件彼此相連。拉力傳遞元件可為形狀配合構件,如銷件、螺絲或類似元件。遮罩邊緣亦可以壓緊配合或材料接合之方式連接框架之區段。在本發明之改良方案中,感測器與調整標記配合作用。可設置第一調整標記,其特別是對應於遮罩之角區。第一調整標記可為開設於遮罩上之窗口狀開口。可設置對應於基板的第二調整標記。第二調整標記可直接地對應於基板或者間接地對應於基板。直接對應於基板的調整標記可例如為基板之待塗佈表面上的色區。間接對應於基板的調整標記亦可由托持基板的基板架形成。此等調整標記亦可為能以光學方式加以區分的標記。其可透過透明基板被光學感測器識別到。藉由作動元件改變施加於遮罩邊緣之拉力的方向及大小,從而使調整標記相互對準。此係藉由控制迴路之控制裝置而實現,該控制裝置獲得較佳設於角區的調整標記之位置實際值並向作動元件發出調整指令。遮罩可由因鋼構成,框架可由優質鋼構成。優質鋼之膨脹係數大於由玻璃構成之基板的膨脹係數。藉由在介於20℃與60℃之間的範圍內為遮罩框架調溫,可將用因鋼製成的遮罩機械拉伸,從而使調整標記相互對準。本發明係透過閉合控制路徑實施調整,故無需以計算方式測定影響因素。由感測器形成的測量裝置可由多達四個設於基板及框架之角部的CCD攝影機構成。在角部處,特別是藉由上述調整標記測定基板及遮罩之精確位置。在此等部位處,可藉由感測器(尤指攝影機)測定 不同的線性熱膨脹或機械線性膨脹。控制裝置根據此等值測定遮罩框架之溫度規定值。使遮罩框架達到該規定值。接著,藉由感測器測定位置變化,並且在另一控制步驟中改良規定值與實際值的接近。其中,框架之不同區段可具有不同溫度。對遮罩伸展及遮罩位置的控制在此較佳包含兩個步驟。在第一步驟中使遮罩中心與基板中心相互對準。亦可使遮罩之座標系及基板之座標系的其他原點相互對準。若在原點對準後遮罩及基板之設於角部的調整標記相互偏離,則在第二步驟中使遮罩在其彈性範圍內發生變形,直至基板及遮罩之調整標記相互對準。用於拉伸遮罩的力可以機械方式或者藉由為遮罩或遮罩框架調溫而產生。根據本發明,針對遮罩位置的上述兩級調整僅需實施一次,更換基板時,僅需達到各遮罩框架區段此前已測定之溫度。透過溫度變化而實現的框架區段之間距調整可藉由主動加熱或主動冷卻而實現。在為了以冷凝法沉積層而將基板冷卻的沉積程序中,亦可藉由減小的冷卻功率來實現調溫。 First and foremost: use a control loop to adjust the mask position. The control loop of the present invention has sensors for determining the actual position of the mask relative to the substrate. The control loop further has an actuating element for changing the position of the at least one first section of the frame relative to the at least one second section of the frame. In addition, the control loop further has a control device for generating manipulated variables, and the manipulated variables are used to actuate the actuating elements, so that the actual position of the mask changes in the direction of the specified position due to the change of the pulling force acting on the edge of the mask. The control loop may be a PID control loop. The actuating element preferably changes the distance between two opposing sections by changing the temperature of one or several sections of the frame. The frame may be a rectangular frame holding a rectangular mask. The frame forms opposed frame sides. By changing the temperature of one of the sides of the frame, changing its length, and then changing the spacing of the opposite sections of the frame. The sensor is preferably an optical sensor. The sensor may be an imaging sensor with imaging optics by which an image of the frame surface is produced on a sensor (eg, a CCD sensor). The actual position of the mask, in particular the actual position of the edge regions of the mask, can be determined by means of the image evaluation. The actuating element is preferably a heating element and/or a cooling element. Each frame side can have cooling channels and/or heating channels. Only cooling channels or only heating channels can be provided. The present invention also proposes that the cooling channel and the heating channel are simultaneously arranged side by side in the extending direction of the frame side. Each frame side can be tempered separately from any other frame side. Instead of heating elements and/or cooling elements, mechanical means can also be provided to vary the distance between the two frame sections. The sections separated from each other by the actuating elements are the edge regions of the frame and the hood, in which edge regions the hood and the frame are connected to each other by means of tension transmission elements. The tensile force transmission element may be a form-fitting member, such as a pin, screw or similar. The edges of the mask may also be connected to sections of the frame by means of a press fit or material engagement. In the improved solution of the present invention, the sensor cooperates with the adjustment mark. A first adjustment mark can be set, which corresponds in particular to the corner area of the mask. The first adjustment mark can be a window-shaped opening opened on the mask. A second adjustment mark corresponding to the substrate may be provided. The second adjustment mark may correspond directly to the substrate or indirectly to the substrate. The adjustment marks that correspond directly to the substrate can be, for example, colored areas on the surface of the substrate to be coated. The adjustment marks that indirectly correspond to the substrates may also be formed by substrate holders that hold the substrates. These adjustment marks can also be optically distinguishable marks. It can be recognized by the optical sensor through the transparent substrate. The direction and magnitude of the pulling force applied to the edge of the mask are changed by the actuating element, so that the adjustment marks are aligned with each other. This is achieved by means of the control device of the control loop, which obtains the actual value of the position of the adjustment marks, preferably located in the corner areas, and issues adjustment commands to the actuating element. The hood may be constructed of stainless steel and the frame may be constructed of high-quality steel. The expansion coefficient of high-quality steel is greater than that of the substrate made of glass. By adjusting the temperature of the mask frame in the range between 20°C and 60°C, the mask made of In steel can be mechanically stretched so that the adjustment marks are aligned with each other. The present invention implements the adjustment through a closed control path, so there is no need to calculate the influencing factors. The measuring device formed by the sensor can be formed by up to four CCD cameras provided at the corners of the substrate and the frame. At the corners, the precise position of the substrate and the mask is determined, in particular by means of the above-mentioned adjustment marks. At these locations, different linear thermal or mechanical linear expansions can be measured by means of sensors, especially cameras. Based on these values, the control device determines the temperature specification of the mask frame. Bring the mask frame to this specified value. Next, the position change is measured by the sensor, and the approximation of the predetermined value and the actual value is improved in another control step. Therein, different sections of the frame may have different temperatures. The control of mask stretch and mask position preferably includes two steps here. In the first step, the center of the mask and the center of the substrate are aligned with each other. Other origins of the coordinate system of the mask and the coordinate system of the substrate can also be aligned with each other. If the adjustment marks on the corners of the mask and the substrate deviate from each other after the origin alignment, the mask is deformed within its elastic range in the second step until the adjustment marks of the substrate and the mask are aligned with each other. The force for stretching the mask can be generated mechanically or by tempering the mask or mask frame. According to the present invention, the above-mentioned two-stage adjustment for the mask position only needs to be performed once, and when the substrate is replaced, it is only necessary to reach the previously measured temperature of each mask frame section. Adjustment of the spacing between frame sections through temperature changes can be achieved by active heating or active cooling. In deposition processes in which the substrate is cooled in order to deposit layers by condensation, temperature regulation can also be achieved by reducing the cooling power.

1‧‧‧遮罩 1‧‧‧Mask

1'‧‧‧邊緣 1'‧‧‧Edge

2‧‧‧基板 2‧‧‧Substrate

3‧‧‧框架 3‧‧‧Framework

4、4'、4"、4'''‧‧‧框架側邊,區段 4, 4', 4", 4'''‧‧‧Frame side, section

5‧‧‧CCD攝影機 5‧‧‧CCD camera

6‧‧‧加熱裝置 6‧‧‧Heating device

7‧‧‧冷卻裝置 7‧‧‧Cooling device

8‧‧‧壓電元件 8‧‧‧piezoelectric element

9‧‧‧控制裝置 9‧‧‧Control device

10‧‧‧基板架 10‧‧‧Substrate holder

11‧‧‧調整標記 11‧‧‧Adjustment mark

12‧‧‧調整標記 12‧‧‧Adjustment mark

13‧‧‧窗口 13‧‧‧Window

14‧‧‧條帶 14‧‧‧Stripes

15‧‧‧進氣機構 15‧‧‧Intake mechanism

16‧‧‧角隅件 16‧‧‧Corner

17‧‧‧拉力傳遞元件 17‧‧‧Tension transmission element

Z、Z、Z"、Z'''‧‧‧拉力 Z, Z, Z", Z'''‧‧‧pull

下面對本發明之實施例進行說明。在所附圖式中:圖1為本發明之控制迴路示意圖;圖2為塗佈裝置之若干元件的示意圖;圖3為圖2中III部分之放大圖;圖4為遮罩框架3之俯視圖;圖5a至圖5d為對位於遮罩框架3上之遮罩1實施位置調整前的部分Va至Vd;圖6a至圖6d為遮罩經調整後圖4中的部分Va至Vd;及圖7為另一實施例所提供之遮罩框架3的俯視圖。 Embodiments of the present invention will be described below. In the accompanying drawings: Fig. 1 is a schematic diagram of the control circuit of the present invention; Fig. 2 is a schematic diagram of several components of the coating device; Fig. 3 is an enlarged view of part III in Fig. 2; Fig. 4 is a top view of the mask frame 3 5a to 5d are parts Va to Vd before the position adjustment of the mask 1 on the mask frame 3 is implemented; 7 is a top view of the mask frame 3 provided by another embodiment.

圖1示出本發明之控制裝置的結構示意圖。矩形基板2位於矩形基板架10上。遮罩1位於基板2之自由表面上,該遮罩具有大量被條帶隔開之窗口。遮罩1之遮罩邊緣1'突出於基板2及基板架10之側緣。 FIG. 1 shows a schematic diagram of the structure of the control device of the present invention. The rectangular substrate 2 is placed on the rectangular substrate holder 10 . On the free surface of the substrate 2 is a mask 1, which has a large number of windows separated by strips. The mask edge 1 ′ of the mask 1 protrudes from the side edges of the substrate 2 and the substrate frame 10 .

基板架10被矩形框架3包圍,該框架具有四個框架側邊4、4'、4"、4'''。遮罩1之邊緣1'如此地固定於框架3之框架側邊4上,使得沿遮罩1之橫向延伸方向定向的拉力能夠自框架側邊4、4'被傳遞到遮罩1上。 The substrate holder 10 is surrounded by a rectangular frame 3 with four frame sides 4, 4', 4", 4"'. The edge 1' of the mask 1 is fixed to the frame side 4 of the frame 3 in such a way that This enables a tensile force directed in the transverse extension direction of the cover 1 to be transmitted from the frame sides 4 , 4 ′ to the cover 1 .

在該四個框架側邊4、4'、4"、4'''中的每一者中皆設有冷卻通道7及加熱通道6。冷卻通道7可供冷卻液體通過,加熱通道6可供加熱液體通過。藉由對穿過通道6、7的冷媒及熱媒之流量進行調整,可對每個框架側邊4、4'、4"、4'''之溫度實施個別調整。遮罩1係由因鋼構成且其熱膨脹係數小於框架3及其框架側邊4、4',因此,框架側邊溫度之變化會導致遮罩1所受到的機械應力發生變化。 In each of the four frame sides 4, 4', 4", 4"' there are cooling channels 7 and heating channels 6. The cooling channels 7 are for the passage of cooling liquid and the heating channels 6 are for The heating liquid passes through. By adjusting the flow rate of the refrigerant and heating medium passing through the channels 6, 7, the temperature of each frame side 4, 4', 4", 4"' can be individually adjusted. The shield 1 is made of steel and its thermal expansion coefficient is smaller than that of the frame 3 and its frame sides 4 and 4 ′. Therefore, changes in the temperature of the frame sides will cause changes in the mechanical stress on the shield 1 .

穿過通道6、7的冷媒及熱媒之流量係由控制裝置9控制。為此可例如設置開關閥或調節閥,藉由該等閥門可將被調溫至特定溫度的冷媒之冷媒流量或者被調溫至特定溫度的熱媒之熱媒流量以受控方式送入通道6、7。 The flow of refrigerant and heating medium passing through the passages 6 and 7 is controlled by the control device 9 . For this purpose, an on-off valve or a regulating valve can be provided, for example, by means of which the refrigerant flow rate of the refrigerant tempered to a specific temperature or the heat medium flow rate of the heat medium tempered to a specific temperature can be fed into the channel in a controlled manner 6.7.

設有特別是CCD攝影機5形式之光學感測器,藉由該等感測器測定遮罩特別是在框架3之四個角部區域內的位置之實際值。該處設有圖1中未示出之調整標記11、12,將其相互對準以達到遮罩1之規定位置。第一調整標記11係由遮罩形成,第二調 整標記12係由基板形成。CCD攝影機5為控制裝置9提供實際值。 There are optical sensors, in particular in the form of CCD cameras 5 , by means of which the actual values of the position of the mask, in particular in the regions of the four corners of the frame 3 , are determined. There are adjustment marks 11 and 12 not shown in FIG. 1 , which are aligned with each other so as to achieve the predetermined position of the mask 1 . The first adjustment marks 11 are formed by a mask, and the second adjustment marks 12 are formed by a substrate. The CCD camera 5 provides the control device 9 with actual values.

在前述調溫裝置7、6中,經調溫之液體穿過冷卻通道7或加熱通道6,而作為替代,亦可設置其他調溫構件,例如電阻加熱器或珀耳帖冷卻元件。 In the aforementioned temperature regulating devices 7, 6, the temperature-regulated liquid passes through the cooling channel 7 or the heating channel 6, and alternatively, other temperature regulating components, such as resistance heaters or Peltier cooling elements, may also be provided.

圖2示出塗佈系統之截面,其中,氣態起始材料自蓮蓬頭式進氣機構15之排氣孔流入製程室。進氣機構15被調溫至經提高的溫度,在此溫度下,製程氣體中所包含的有機蒸汽不會冷凝。 FIG. 2 shows a cross-section of the coating system in which the gaseous starting material flows from the exhaust port of the showerhead air intake mechanism 15 into the process chamber. The air intake mechanism 15 is tempered to an elevated temperature at which the organic vapors contained in the process gas do not condense.

基板架10具有圖中未示出之冷卻元件,藉由該等冷卻元件將可設於進氣機構15下方或上方的基板架10調溫至一溫度,在此溫度下,有機蒸汽在基板2之表面上冷凝,該基板位於基板架10指向製程室之寬面上。 The substrate rack 10 has cooling elements that are not shown in the figure, and the substrate rack 10 , which can be located below or above the air intake mechanism 15 , is adjusted to a temperature by these cooling elements, at which temperature, the organic vapors are trapped in the substrate 2 . Condensed on the surface of the substrate, the substrate is located on the wide side of the substrate rack 10 directed toward the process chamber.

基板2被遮罩1覆蓋,該遮罩具有窗口13及限定窗口13之條帶14。此遮罩係為以表面接觸方式貼靠於基板2之待塗佈寬面上的蔭罩。 The substrate 2 is covered by a mask 1 having a window 13 and a strip 14 defining the window 13 . The mask is a shadow mask attached to the broad surface of the substrate 2 to be coated in a surface-contact manner.

圖3示出托持遮罩1的矩形框架3之四個邊緣區域中之一者。遮罩1之邊緣1'藉由拉力傳遞元件17連接框架3之框架側邊4。該拉力傳遞元件可為形狀配合元件,或者亦可為焊縫。 FIG. 3 shows one of the four edge regions of the rectangular frame 3 holding the mask 1 . The edge 1 ′ of the cover 1 is connected to the frame side 4 of the frame 3 by means of a tension transmission element 17 . The tensile force transmission element can be a form-fit element or also a weld seam.

遮罩1在角區內具有被建構為窗口之第一調整標記11。基板2具有第二調整標記12,該調整標記可以光學方式與其周圍環境相區分,因此,藉由較佳為CCD攝影機之光學感測器5可測定兩調整標記11、12之位置。 The mask 1 has a first adjustment mark 11 in the corner area which is constructed as a window. The substrate 2 has a second adjustment mark 12, which can be optically distinguished from its surroundings, so that the positions of the two adjustment marks 11, 12 can be determined by the optical sensor 5, preferably a CCD camera.

圖4示出遮罩1以及在邊緣1'處托持遮罩1的框架3及其四個相互成直角佈置之框架側邊4、4'、4"、4'''的俯視示意圖。圖5a至圖5d分別以放大圖示出在第一步驟中以中心對準方式被放 置於基板2上之遮罩1的角區。遮罩1之調整標記11、11'、11"、11'''的位置偏離基板2之調整標記12、12'、12"、12'''的位置。 Figure 4 shows a schematic top view of the mask 1 and the frame 3 holding the mask 1 at the edge 1' and its four frame sides 4, 4', 4", 4"' arranged at right angles to each other. Figure 4 5a to 5d respectively show, in enlarged views, the corner regions of the mask 1 placed in the first step in a center-aligned manner on the substrate 2. Adjustment marks 11, 11', 11", 11' of the mask 1 The position of '' is deviated from the position of the adjustment marks 12, 12', 12", 12"' of the substrate 2.

特別是藉由以不同溫度為框架側邊4、4'、4"、4'''調溫,使框架3之區段、特別是框架側邊4、4'、4"、4'''發生相離的相對位移,藉此可向遮罩1之角區施加個別方向及個別強度之拉力Z、Z'、Z"、Z''',從而將調整標記11、11'、11"、11'''對準其所對應的調整標記12、12'、12"、12''',參見圖6a至圖6d所示。 In particular, the sections of the frame 3, in particular the frame sides 4, 4', 4", 4''' are tempered at different temperatures There is a relative displacement away from each other, whereby pulling forces Z, Z', Z", Z''' of individual directions and individual strengths can be applied to the corners of the mask 1, so that the adjustment marks 11, 11', 11", 11''' is aligned with its corresponding adjustment marks 12, 12', 12", 12''', as shown in Figs. 6a to 6d.

然而,亦可藉由為框架側邊4、4'、4"、4'''調溫來向遮罩1之相關緣邊中的一者分別施加拉力Z、Z'、Z"、Z''',使得遮罩之整個邊緣在一個方向上被均勻地施加拉力。在此情況下,實施控制所用之調整標記亦可設於遮罩1及基板2之邊緣上。藉由控制裝置將調整標記相互對準。 However, it is also possible to apply tension Z, Z', Z", Z" respectively to one of the relevant edges of the mask 1 by tempering the frame sides 4, 4', 4", 4"" ' so that the entire edge of the mask is pulled evenly in one direction. In this case, adjustment marks for implementing control can also be provided on the edges of the mask 1 and the substrate 2 . The adjustment marks are aligned with each other by the control device.

在控制迴路中透過疊代接續的控制步驟實現調整標記11、11'、11"、11'''、12、12'、12"、12'''之上述「相互對準」,此等控制步驟係分別藉由CCD攝影機5測定調整標記11、11'、11"、11'''相對於調整標記12、12'、12"、12'''之實際值,接著,藉由作動元件對例如冷卻通道7或加熱通道6之冷媒流量或熱媒流量進行調整,使得實際值接近規定值。重複實施該等接續的調整步驟,直至調整標記11、11'、11"、11'''、12、12'、12"、12'''達到足夠的對準程度。將遮罩1精確配合地位於基板2上時的框架側邊溫度或進入框架側邊的冷媒流量或熱媒流量予以儲存。如此一來,遮罩調整僅需實施一次。當在依次塗佈數個基板之生產過程中繼續使用遮罩時,僅需達到框架側邊4、4'、4"、4'''之測定溫度。 The above-mentioned "mutual alignment" of the adjustment marks 11, 11', 11", 11''', 12, 12', 12", 12''' is achieved through iterative successive control steps in the control loop. These control The step is to measure the actual values of the adjustment marks 11, 11', 11", 11"' with respect to the adjustment marks 12, 12', 12", 12"' by the CCD camera 5, respectively, and then, through the actuating element pair For example, the flow rate of refrigerant or heat medium in cooling channel 7 or heating channel 6 is adjusted so that the actual value is close to the specified value. These successive adjustment steps are repeated until the adjustment marks 11, 11', 11", 11"', 12, 12', 12", 12"' are sufficiently aligned. The temperature of the side of the frame or the flow of cooling medium or the flow of heating medium entering the side of the frame when the cover 1 is precisely fitted on the base plate 2 is stored. This way, mask adjustments only need to be performed once. When the mask is continued to be used in the production process of coating several substrates in sequence, only the measured temperature of the frame sides 4, 4', 4", 4"' needs to be reached.

在圖7所示之實施例中,藉由壓電元件陣列8使設有 調整標記11、12之角區16相對於在角區16之間延伸的框架側邊4發生位移。角區係由角隅件形成,該等角隅件可具有拉力傳遞元件。 In the embodiment shown in Figure 7, the corner regions 16 provided with the adjustment marks 11, 12 are displaced relative to the frame sides 4 extending between the corner regions 16 by the array 8 of piezoelectric elements. The corner regions are formed by corner pieces, which may have tensile force transmission elements.

前述實施方案係用於說明本申請整體所包含之發明,該等發明至少透過以下特徵組合分別獨立構成相對於先前技術之改良方案:一種用於遮罩1之支架,其特徵在於:感測器5,用於測定該遮罩1相對於該基板2之實際位置;作動元件6、7、8,用於改變該框架3之至少一個第一區段4相對於該框架3之至少一個第二區段4'的位置;以及具有控制裝置9之控制迴路,以便藉由改變拉力Z、Z'、Z"、Z'''來使該遮罩1之實際位置朝該遮罩1之規定位置的方向改變。 The foregoing embodiments are intended to illustrate the inventions contained in the present application as a whole, and these inventions independently constitute improvements over the prior art through at least the following feature combinations: a bracket for a mask 1, characterized in that: a sensor 5, used to measure the actual position of the mask 1 relative to the base plate 2; actuating elements 6, 7, 8, used to change at least one first section 4 of the frame 3 relative to at least one second of the frame 3; The position of the section 4'; and a control loop with a control device 9 to make the actual position of the mask 1 towards the prescribed position of the mask 1 by changing the tension Z, Z', Z", Z"" direction changes.

一種支架,其特徵在於:該等作動元件6、7藉由改變溫度來改變矩形框架3之兩個對置框架側邊4、4'、4"、4'''的間距。 A bracket is characterized in that: the actuating elements 6, 7 change the distance between the two opposite frame sides 4, 4', 4", 4"' of the rectangular frame 3 by changing the temperature.

一種支架,其特徵在於:該等感測器5為光學感測器。 A bracket is characterized in that: the sensors 5 are optical sensors.

一種支架,其特徵在於:該等感測器5具有光學成像系統且特別是CCD攝影機。 A stand, characterized in that the sensors 5 have an optical imaging system and in particular a CCD camera.

一種支架,其特徵在於:該等作動元件具有加熱元件及/或冷卻元件6、7。 A bracket characterized in that the actuating elements have heating elements and/or cooling elements 6 , 7 .

一種支架,其特徵在於:該等加熱元件及/或冷卻元件6、7為可相互分開地供冷卻液體及/或加熱液體通過之通道。 A support is characterized in that: the heating elements and/or cooling elements 6, 7 are separate passages for cooling liquid and/or heating liquid to pass through.

一種支架,其特徵在於:該等作動元件為特別是設於該框架3之區段4、4'、4"、4'''、16之間的壓電元件8。 A bracket, characterized in that the actuating elements are piezoelectric elements 8 arranged in particular between the segments 4 , 4 ′, 4 ″, 4 ″, 16 of the frame 3 .

一種支架,其特徵在於:該遮罩1具有第一調整標記 11,該等第一調整標記可對準該基板2所具有的第二調整標記12。 A bracket is characterized in that: the mask 1 has first adjustment marks 11, and the first adjustment marks can be aligned with the second adjustment marks 12 of the base plate 2.

一種支架,其特徵在於:該等調整標記11、12設於該遮罩1及該基板2之角部。 A bracket is characterized in that the adjustment marks 11 and 12 are arranged on the corners of the cover 1 and the base plate 2 .

一種調整遮罩1之位置的方法,其特徵在於:藉由感測器5測定該遮罩1相對於該基板2之實際位置,並且控制迴路根據該遮罩1之實際位置與該遮罩1之規定位置之間的偏差產生操縱變數,以便對作動元件6、7、8進行控制,藉由該等作動元件改變該框架3之至少一個第一區段4相對於該框架3之至少一個第二區段4'的位置,使得該遮罩1之實際位置接近該遮罩1之規定位置。 A method for adjusting the position of a mask 1, which is characterized in that: the actual position of the mask 1 relative to the substrate 2 is measured by a sensor 5, and a control loop is based on the actual position of the mask 1 and the mask 1. The deviation between the specified positions generates manipulated variables for controlling the actuating elements 6, 7, 8, by means of which the actuating elements change at least one first section 4 of the frame 3 relative to at least one first section 4 of the frame 3. The positions of the two sections 4 ′ are such that the actual position of the mask 1 is close to the prescribed position of the mask 1 .

一種調整遮罩1之位置的方法,其特徵在於:該操縱變數為該框架3之區段4、4'、4"、4'''的溫度,其中,分開地為不同區段4、4'、4"、4'''調溫。 A method of adjusting the position of a mask 1, characterized in that the manipulated variable is the temperature of the sections 4, 4', 4", 4"' of the frame 3, wherein the different sections 4, 4 are separately ', 4", 4''' to adjust the temperature.

一種調整遮罩1之位置的方法,其特徵在於:將特別是設於矩形框架3及矩形基板2之角部的第一調整標記11及第二調整標記12相互對準。 A method for adjusting the position of the mask 1 is characterized by: aligning the first adjustment marks 11 and the second adjustment marks 12 especially provided at the corners of the rectangular frame 3 and the rectangular base plate 2 with each other.

所有已揭露特徵(作為單項特徵或特徵組合)皆為發明本質所在。故本申請之揭露內容亦包含相關/所附優先權檔案(在先申請副本)所揭露之全部內容,該等檔案所述特徵亦一併納入本申請之申請專利範圍。附屬項以其特徵對本發明針對先前技術之改良方案的特徵予以說明,其目的主要在於在該等請求項基礎上進行分案申請。 All disclosed features (either as a single feature or as a combination of features) are essential to the invention. Therefore, the disclosure content of this application also includes all the content disclosed in the related/attached priority files (copy of the earlier application), and the features described in these files are also included in the patent scope of this application. The subordinate items describe the features of the improvement scheme of the present invention with respect to the prior art with its features, and its purpose is mainly to file a divisional application on the basis of these claims.

1‧‧‧遮罩 1‧‧‧Mask

1'‧‧‧邊緣 1'‧‧‧Edge

2‧‧‧基板 2‧‧‧Substrate

3‧‧‧框架 3‧‧‧Framework

4‧‧‧框架側邊,區段 4‧‧‧Frame side, section

5‧‧‧CCD攝影機 5‧‧‧CCD camera

10‧‧‧基板架 10‧‧‧Substrate holder

11‧‧‧調整標記 11‧‧‧Adjustment mark

12‧‧‧調整標記 12‧‧‧Adjustment mark

13‧‧‧窗口 13‧‧‧Window

14‧‧‧條帶 14‧‧‧Stripes

17‧‧‧拉力傳遞元件 17‧‧‧Tension transmission element

Z‧‧‧拉力 Z‧‧‧pull

Claims (13)

一種用於遮罩之支架,該遮罩在實施塗佈方法時位於基板(2)之待塗佈表面上,以便將層之沉積限制在該表面由該遮罩(1)之形狀及位置所預先規定的表面區段上,其中,該支架之對置區段以能夠使該遮罩(1)變形的可變拉力作用於該遮罩(1)之邊緣(1'),具有:感測器(5),用於測定該遮罩(1)相對於該基板(2)之實際位置;作動元件(6、7、8),用於改變該框架(3)之至少一個第一區段(4)相對於該框架(3)之至少一個第二區段(4')的位置;以及具有控制裝置(9)之控制迴路,以便藉由改變拉力(Z、Z'、Z"、Z''')來使該遮罩(1)之實際位置朝該遮罩(1)之規定位置的方向改變,其特徵在於:該等區段係由該支架之矩形框架(3)的框架側邊(4、4'、4"、4''')形成,並且該等作動元件(6、7)藉由改變溫度來改變該矩形框架(3)之兩個對置框架側邊(4、4'、4"、4''')的間距。 A holder for a mask which, when carrying out a coating method, is located on the surface to be coated of a substrate (2) in order to limit the deposition of layers to the surface defined by the shape and position of the mask (1) On a predetermined surface section, wherein the opposing section of the support acts on the edge (1') of the mask (1) with a variable tensile force capable of deforming the mask (1), with: sensing device (5) for determining the actual position of the mask (1) relative to the base plate (2); actuating elements (6, 7, 8) for changing at least a first section of the frame (3) (4) the position relative to the at least one second section (4') of the frame (3); and a control loop with a control device (9) for changing the tension (Z, Z', Z", Z by changing the ''') to change the actual position of the mask (1) in the direction of the prescribed position of the mask (1), characterized in that the sections are defined by the frame side of the rectangular frame (3) of the bracket Sides (4, 4', 4", 4"') are formed, and the actuating elements (6, 7) change the two opposite frame sides (4, 7) of the rectangular frame (3) by changing the temperature 4', 4", 4''') spacing. 如請求項1之支架,其中,該等感測器(5)為光學感測器。 The support of claim 1, wherein the sensors (5) are optical sensors. 如請求項1之支架,其中,該等感測器(5)具有光學成像系統且特別是CCD攝影機。 A stand as claimed in claim 1, wherein the sensors (5) have optical imaging systems and in particular CCD cameras. 一種用於遮罩之支架,該遮罩在實施塗佈方法時位於基板(2)之待塗佈表面上,以便將層之沉積限制在該表面由該遮罩(1)之形狀及位置所預先規定的表面區段上,其中,該支架之對置區段以能夠使該遮罩(1)變形的可變拉力作用於該遮罩(1)之邊緣(1'),其特徵在於:該支架具有包含對置框架側邊(4、4'、4"、4''')之框架(3),該等框架側邊之長度為可變以改變該間距,其中拉力係藉由拉力傳遞元件(17)傳遞到該遮罩(1)之邊緣(1')。 A holder for a mask which, when carrying out a coating method, is located on the surface to be coated of a substrate (2) in order to limit the deposition of layers to the surface defined by the shape and position of the mask (1) On a predetermined surface section, wherein the opposite section of the support acts on the edge (1') of the mask (1) with a variable tensile force capable of deforming the mask (1), characterized in that: The bracket has a frame (3) comprising opposing frame sides (4, 4', 4", 4"'), the length of the frame sides being variable to vary the spacing, wherein the pulling force is by means of the pulling force The transfer element (17) transfers to the edge (1') of the mask (1). 如請求項4之支架,其中,設有作動元件(6、7)以改變該間距。 The bracket of claim 4, wherein actuating elements (6, 7) are provided to change the distance. 如請求項5之支架,其中,該等作動元件具有加熱元件及/或冷卻元件(6、7)。 The stand of claim 5, wherein the actuating elements have heating elements and/or cooling elements (6, 7). 如請求項6之支架,其中,該等加熱元件及/或冷卻元件(6、7)為可相互分開地供冷卻液體及/或加熱液體通過之通道。 The stand according to claim 6, wherein the heating elements and/or cooling elements (6, 7) are separate passages through which cooling liquid and/or heating liquid can pass. 如請求項5之支架,其中,該等作動元件為壓電元件(8),該等壓電元件特別是設於該框架(3)之該等框架側邊(4、4'、4"、4''')或角隅件(16)的區段之間。 The bracket of claim 5, wherein the actuating elements are piezoelectric elements (8), and the piezoelectric elements are especially arranged on the frame sides (4, 4', 4", 4''') or sections of corner pieces (16). 如請求項1或4之支架,其中,該遮罩(1)具有第一調整標記(11),該等第一調整標記可對準該基板(2)所具有的第二調整標記(12)。 The bracket of claim 1 or 4, wherein the mask (1) has first adjustment marks (11), and the first adjustment marks can be aligned with the second adjustment marks (12) of the base plate (2) . 如請求項9之支架,其中,該等調整標記(11、12)設於該遮罩(1)及該基板(2)之角部。 The bracket of claim 9, wherein the adjustment marks (11, 12) are provided at the corners of the cover (1) and the base plate (2). 一種調整遮罩之位置的方法,該遮罩在實施塗佈方法時位於基板(2)之待塗佈表面上,以便將層之沉積限制在該表面由該遮罩(1)之形狀及位置所預先規定的表面區段上,其中,藉由框架(3)之區段向該遮罩(1)之邊緣(1')施加能使該遮罩(1)變形的拉力,藉由感測器(5)測定該遮罩(1)相對於該基板(2)之實際位置,並且控制迴路根據該遮罩(1)之實際位置與該遮罩(l)之規定位置之間的偏差產生操縱變數,以便對作動元件(6、7、8)進行控制,藉由該等作動元件改變該框架(3)之至少一個第一區段相對於該框架(3)之至少一個第二區段的位置,使得該遮罩(1)之實際位置接近該遮罩(1)之規定位置,其特徵在於:該操縱變數為該框架(3)之溫度且/或為矩形的該框架(3)之對置框 架側邊(4、4'、4"、4''')的長度。 A method of adjusting the position of a mask which, when carrying out a coating method, is located on the surface to be coated of a substrate (2) in order to limit the deposition of layers to the surface by the shape and position of the mask (1) on a predetermined surface section, wherein a tensile force is applied to the edge (1') of the mask (1) by a section of the frame (3) which can deform the mask (1), by sensing The device (5) measures the actual position of the mask (1) relative to the substrate (2), and the control loop is generated according to the deviation between the actual position of the mask (1) and the prescribed position of the mask (1). Manipulating variables to control actuating elements (6, 7, 8) by means of which actuating elements vary at least a first section of the frame (3) relative to at least a second section of the frame (3) position, so that the actual position of the mask (1) is close to the specified position of the mask (1), characterized in that: the manipulated variable is the temperature of the frame (3) and/or the frame (3) is a rectangle box Length of shelf sides (4, 4', 4", 4'''). 如請求項11之方法,其中,分開地為該等框架側邊(4、4'、4"、4''')的不同區段調溫。 The method of claim 11, wherein different sections of the frame sides (4, 4', 4", 4"') are tempered separately. 如請求項11之方法,其中,將設於矩形的該框架(3)及矩形的該基板(2)之角部的第一調整標記(11)及第二調整標記(12)相互對準。 The method of claim 11, wherein the first adjustment marks (11) and the second adjustment marks (12) provided at the corners of the rectangular frame (3) and the rectangular substrate (2) are aligned with each other.
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200017381A (en) * 2018-08-06 2020-02-18 어플라이드 머티어리얼스, 인코포레이티드 Deposition apparatus having a mask aligner, mask arrangement for masking a substrate, and method for masking a substrate
TWI682565B (en) * 2018-08-07 2020-01-11 財團法人工業技術研究院 Method for fabricating an organic electro-luminescence device
CN112882355B (en) * 2021-03-09 2023-05-23 上海大溥实业有限公司 Method for narrowing photoetching line and photoetching machine

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2401609A1 (en) * 1974-01-14 1975-07-17 Siemens Ag Masking process for integrated ccts using pulverised electrodes - thin metal foil coating is heated from outer edge
CN102412400A (en) * 2011-09-27 2012-04-11 武汉理工大学 Silver vanadium oxide / polymer three coaxial nanowire and preparation method and application thereof
US20150068456A1 (en) * 2012-04-05 2015-03-12 Sony Corporation Mask adjustment unit, mask device, and apparatus and method for producing mask

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3950424B2 (en) * 2003-02-10 2007-08-01 東京エレクトロン株式会社 Heat treatment equipment
KR100700838B1 (en) 2005-01-05 2007-03-27 삼성에스디아이 주식회사 Method for forming shadow-mask pattern
CN101547749B (en) 2006-05-10 2012-09-05 阿德文泰克全球有限公司 Tensioned aperture mask and method of mounting same
JP2010106358A (en) * 2008-09-30 2010-05-13 Canon Inc Film formation mask and film formation method using the same
KR102100446B1 (en) 2012-12-10 2020-04-14 삼성디스플레이 주식회사 Mask assembly for thin film vapor deposition and manufacturing method thereof
KR102162790B1 (en) * 2013-05-02 2020-10-08 삼성디스플레이 주식회사 Welding device for mask frame assembly
CN104498871B (en) * 2015-01-14 2017-04-12 京东方科技集团股份有限公司 Mask device and assembling method thereof
CN104894534B (en) * 2015-06-26 2017-12-29 京东方科技集团股份有限公司 Vapor deposition apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2401609A1 (en) * 1974-01-14 1975-07-17 Siemens Ag Masking process for integrated ccts using pulverised electrodes - thin metal foil coating is heated from outer edge
CN102412400A (en) * 2011-09-27 2012-04-11 武汉理工大学 Silver vanadium oxide / polymer three coaxial nanowire and preparation method and application thereof
US20150068456A1 (en) * 2012-04-05 2015-03-12 Sony Corporation Mask adjustment unit, mask device, and apparatus and method for producing mask

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