TWI612167B - Method for measuring a deposition rate,deposition rate control system and evaporation source and deposition apparatus using the same - Google Patents

Abstract

A method (100) for measuring the deposition rate of one of the evaporated materials is illustrated. The method includes measuring a (110) deposition rate for a time period ΔT between a first measurement M1 and a second measurement M2, and adjusting (120) the time segment ΔT based on the measured deposition rate. Furthermore, a deposition rate control system (200) is illustrated. The deposition rate control system includes a deposition rate measuring component (210) for measuring a deposition rate of the evaporated material, and a controller (220) coupled to the deposition rate measuring component (210) and coupled to an evaporation source (300) Wherein the controller is assembled to provide a control signal to the deposition rate measuring component (210).

Description

Method for measuring a deposition rate, deposition control system, and evaporation source using the same And deposition equipment

The present disclosure relates to a method for controlling the deposition rate of one of the evaporated materials, a deposition rate control system, and an evaporation source for evaporation of the material. The present disclosure is particularly directed to a method and control system for controlling the deposition rate of evaporated organic materials.

The organic vaporizer is a tool for manufacturing organic light-emitting diodes (OLEDs). OLEDs are a special form of light-emitting diodes in which the light-emitting layer comprises a film of a specific organic compound. OLEDs are used to create television screens, computer screens, mobile phones, other handheld devices, etc. for displaying information. OLEDs can also be used as general space lighting. The range of possible colors, brightness, and viewing angles of OLED displays is greater than such characteristics of conventional liquid crystal displays (LCDs) because OLED pixels are directly illuminated and do not include a backlight. Therefore, the energy loss of an OLED display is considerably less than that of a conventional liquid crystal display. Furthermore, it can be manufactured OLEDs on flexible substrates produce other applications.

The function of the OLED depends on the coating thickness of the organic material. This thickness must be in the predetermined range. In the manufacture of OLEDs, the deposition rate of the affected coating with organic material is thus controlled to fall within predetermined tolerances. That is to say, the deposition rate of the organic vaporizer must be sufficiently controlled in the process.

Therefore, for OLED applications and for other evaporation processes, a high accuracy deposition rate is required for a relatively long period of time. There are several possible measurement systems available to measure the deposition rate of the evaporator. However, such measurement systems face insufficient accuracy and/or insufficient stability in the required time interval.

Accordingly, there is a continuing need to provide improved deposition rate measurement methods, deposition rate control systems, evaporators, and deposition equipment.

In view of the above, a method for measuring a deposition rate of a vaporized material, a deposition rate control system, an evaporation source, and a deposition apparatus are provided according to the scope of the independent patent application. Other advantages, features, aspects and details will become apparent from the scope of the patent application, the description and the drawings.

According to one aspect of the present disclosure, a method for measuring a deposition rate of a vaporized material is provided. The method includes measuring a deposition rate for a time period between a first measurement and a second measurement, and adjusting the time segment based on the measured deposition rate.

According to another aspect of the present disclosure, a deposition rate control system is provided. The deposition rate control system includes a deposition rate measuring component for measuring the evaporated material The deposition rate of the material, and a controller, coupled to the deposition rate measuring component and to an evaporation source, wherein the controller is assembled to provide a control signal to the deposition rate measuring component. In particular, the controller is assembled to execute a code, wherein based on the execution of the code, a method for measuring the deposition rate of one of the evaporated materials is performed in accordance with one embodiment described herein.

According to other aspects of the present disclosure, an evaporation source for evaporating a material is provided. The evaporation source comprises an evaporation crucible, wherein the evaporation crucible is assembled to evaporate the material; a distribution tube having one or more outlets disposed along the length of the distribution tube for providing the evaporated material to a substrate at a deposition rate Where the distribution conduit is in fluid communication with the evaporation crucible; and the deposition control system is deposited in accordance with one of the embodiments described herein.

According to still another aspect of the present disclosure, a deposition apparatus is provided for supplying material to a substrate at a deposition rate in a vacuum chamber. The deposition apparatus includes at least one evaporation source in accordance with embodiments described herein.

The disclosure also relates to a device for performing the disclosed method, the device component for performing the method. This method can be performed by a hardware component, a computer programmed with a suitable software, any combination of the two, or any other means. Furthermore, the present disclosure also relates to the method of operation of the apparatus described. It includes a method for performing various functions of the device. In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

100‧‧‧ method

110, 120, 130, 140‧‧‧ process steps

121‧‧‧Second control signal

122‧‧‧Measurement opening

125‧‧‧First control signal

190‧‧‧target deposition rate

191‧‧‧Capacity limit

192‧‧‧ Lower limit of deposition rate

199‧‧‧ actual deposition rate

200‧‧‧Deposition rate control system

210‧‧‧Deposition rate measurement component

211‧‧‧Deposition rate measuring device

212‧‧‧Oscillation crystal

213‧‧‧ ‧

214‧‧‧ heating element

216‧‧‧ Thermal protective coverings

217‧‧‧temperature sensor

220‧‧‧ Controller

224A‧‧‧ Back side

224C‧‧‧Top wall

230‧‧‧Measurement exit

231‧‧‧ arrow

232‧‧‧ heat exchanger

233‧‧‧Sensor Controller

250‧‧‧ holding parts

300‧‧‧ evaporation source

302‧‧‧Support

310‧‧‧Evaporation crucible

320‧‧‧Distribution tube

322‧‧‧Export

325‧‧‧heating unit

332‧‧‧ steam conduit

400‧‧‧Deposition equipment

405‧‧‧first valve

407‧‧‧Second valve

410‧‧‧vacuum chamber

411‧‧‧Maintenance vacuum chamber

412‧‧‧Alignment unit

420‧‧‧Linear Guides

426‧‧‧Substrate support

431‧‧‧mask frame

432‧‧‧ mask

444‧‧‧Substrate

M1‧‧‧ first measurement

M2‧‧‧ second measurement

M3‧‧‧ third measurement

M4‧‧‧ fourth measurement

M5‧‧‧ fifth measurement

△T‧‧‧ time section

△T1‧‧‧First time section

△T2‧‧‧Second time section

△T3‧‧‧ third time section

△T4‧‧‧fourth time section

△T5‧‧‧ fifth time section

Dm/dt‧‧‧deposition rate

t‧‧‧Time

In order to make the above features of the present disclosure described herein in detail For a more detailed description of the solution, reference may be made to the embodiment. The accompanying drawings are directed to the embodiments of the present disclosure and are described below: FIG. 1 is a block diagram showing a method for measuring the deposition rate of evaporated materials according to embodiments described herein; A schematic diagram of a deposition rate control system in accordance with embodiments described herein; a third diagram showing a deposition rate control system in accordance with embodiments described herein; and a fourth diagram showing an embodiment in accordance with the embodiments herein Schematic diagram of a deposition rate control system; FIG. 5 is a schematic diagram showing measurement of deposition rate by a method for measuring deposition rate as described herein according to several embodiments; FIGS. 6A and 6B are each shown for measurement as herein A block diagram of an embodiment of a method of depositing a vaporized material; FIG. 7A is a schematic view showing a measurement assembly according to embodiments described herein in a first state; FIG. 7B is a diagram Side view of the measurement assembly of the embodiment in the second state; FIGS. 8A and 8B are side views of the evaporation source according to embodiments described herein; and FIG. 9 is a view of the embodiment according to the embodiments herein Deposition of the material supplied to the substrate in the vacuum chamber Prepared by the view.

The detailed reference will be achieved by several embodiments of the disclosure. One or more examples of several embodiments are shown in the drawings. In the description of the following figures, the same reference numerals are intended to refer to the same elements. In the following, only the differences between the individual embodiments will be explained. The examples are provided by way of illustration of the disclosure and are not intended to be limiting. Furthermore, the features illustrated or described as part of one embodiment can be used in other embodiments or in combination with other embodiments to achieve further embodiments. This means that the description includes such adjustments and changes.

In the present disclosure, the phrase "oscillating crystal for measuring deposition rate" can be understood as a measure of the change in mass of a deposited material on an oscillating crystal per unit area by measuring a change in frequency of an oscillating crystal resonator. Oscillating the crystal. In particular, in the present disclosure, an oscillating crystal can be understood as a quartz crystal resonator. More specifically, "the oscillating crystal used to measure the deposition rate" can be understood as a quartz crystal microbalance (QCM).

In the present disclosure, the phrase "accuracy of deposition rate" is related to the error between the actual deposition rate and the pre-selected target deposition rate, and the actual deposition rate is exemplified by the measured deposition rate. For example, the smaller the error between the measured actual deposition rate and the preselected target deposition rate, the higher the accuracy of the deposition rate.

Illustratively with reference to Figure 1, a method 100 for measuring the deposition rate of evaporated material according to embodiments described herein includes a time segment ΔT between the first measurement and the second measurement (e.g., as in the fourth The graph shows the 110 deposition rate and adjusts the 120 time period based on the measured deposition rate. In particular, the measured deposition rate based on which can be a function of the deposition rate. For example, the first measurement and/or the second measurement can be performed for 5 minutes or less, in particular 3 minutes or less, More especially 1 minute or less. According to several embodiments, which can be combined with other embodiments described herein, the time period ΔT between the first measurement and the second measurement can be adjusted to a time of 50 minutes or less, in particular 35 minutes or more. Less time, more especially 20 minutes or less. Therefore, by adjusting the time period between the two measurements as a function of the deposition rate, the measurement accuracy of the deposition rate can be increased. In particular, the life of the deposition measuring device can be extended by adjusting the time period between the two measurements as a function of the deposition rate. In particular, the exposure of the measuring device to the evaporated material to measure the deposition rate of the evaporated material can be minimized, which can be beneficial to the overall life of the measuring device.

According to several embodiments, which can be combined with other embodiments described herein, the preselected target is compared to the time segment ΔT between the first measurement and the second measurement when the preselected target deposition rate has been achieved. The time period ΔT between the first measurement and the second measurement during the initial adjustment of the deposition rate may be shorter. For example, during an initial adjustment of the preselected target deposition rate, the time period ΔT between the first measurement and the second measurement may be 10 minutes or less, in particular 5 minutes or less, More especially 3 minutes or less. When the preselected target deposition rate has been reached, the time zone ΔT between the first measurement and the second measurement may be selected from a range that is below the lower limit of 10 minutes, in particular the lower limit of 20 minutes, and more particularly the lower limit. 30 minutes, and the upper limit is 35 minutes, especially the upper limit of 45 minutes, and more particularly the upper limit of 50 minutes. In particular, when the preselected target deposition rate has been achieved, the time period ΔT between the first measurement and the second measurement may be 40 minutes.

According to several embodiments that can be combined with other embodiments described herein, The function of the measured deposition rate is selected from the Boolean decision from the slope of the deposition rate, the deposition rate in the predetermined range, and the polynomial of the measured deposition rate to the nominal/set value of the predetermined deposition rate. A group of functions, and an oscillation function of the measured deposition rate. Therefore, the accuracy of the deposition rate can be increased by adjusting the time zone ΔT between the two measurements as a function of the deposition rate. Furthermore, the exposure of the measuring device to the evaporated material to measure the deposition rate of the evaporated material can be minimized, which can be beneficial to the overall life of the measuring device.

According to several embodiments, which can be combined with other embodiments described herein, the time period between the first measurement and the second measurement can be based on an error between the measured slope of the deposition rate and the preselected slope of the deposition rate. Adjustment. In particular, the error between the measured slope of the deposition rate and the preselected slope is less than 5%, in particular less than 3%, more particularly less than 1.5%, for example 1% or less is detected At the time of measurement, the time period between the first measurement and the second measurement may increase. Therefore, the error between the measured slope of the deposition rate and the preselected slope is more than 5%, in particular more than 3%, more particularly more than 1%, for example 1.5% is detected when The time period between the first measurement and the second measurement can be reduced.

According to several embodiments, which can be combined with other embodiments described herein, the time period between the first measurement and the second measurement can be adjusted based on the Boolean decision. For example, in the case where the error between the measured deposition rate and the preselected target deposition rate is higher than the upper limit of the preselected deposition rate or lower than the preselected lower deposition rate, the time between the first measurement and the second measurement The section can be reduced. For example, the pre-selected upper limit of the deposition rate may be +3% or less of the target deposition rate 190, particularly +2% or less, more particularly +1% or less. In particular, the upper limit of the pre-selected deposition rate may be +1.5% of the target deposition rate of 190. The pre-selected lower deposition rate may be -3% or less of the target deposition rate 190 (for example -2.5%), especially -2% or less (for example -1.5%), more particularly -1% or less (for example -0.75%). In particular, the pre-selected lower deposition rate may be -1.5% of the target deposition rate 190.

According to several embodiments, which may be combined with other embodiments described herein, the time period between the first measurement and the second measurement may be based on the nominal/set value of the pre-selected deposition rate based on the measured deposition rate. Differential polynomial function adjustment. For example, the error in the polynomial function for the measured deposition rate and the preselected target deposition rate is less than 5%, in particular less than 3% (for example 1.5% or less), more particularly less than 1 When the % condition is detected, the time period between the first measurement and the second measurement may increase. Therefore, the error in the polynomial function for the measured deposition rate and the preselected target deposition rate is more than 5%, in particular more than 3%, more particularly more than 1% (for example 1.5% or more) When the situation is detected, the time period between the first measurement and the second measurement can be reduced.

According to several embodiments, which can be combined with other embodiments described herein, the time period between the first measurement and the second measurement can be adjusted based on the vibration function of the measured deposition rate. For example, the error in the vibration function for the measured deposition rate and the preselected target deposition rate is less than 5%, in particular less than 3% (for example 1.5% or less), more particularly less than When 1% of the cases are detected, the time period between the first measurement and the second measurement may increase. Therefore, the error in the vibration function for the measured deposition rate and the preselected target deposition rate is more than 5%, especially more than A situation where 3%, more particularly more than 1% (for example 1.5% or more) is detected, the time period between the first measurement and the second measurement may be reduced.

2 is a schematic diagram of a deposition rate control system 200 in accordance with embodiments described herein. The deposition rate control system 200 includes a deposition rate measurement component 210 for measuring the deposition rate of the evaporated material, and a controller 220 coupled to the deposition rate measurement component 210 and the evaporation source 300. Controller 220 may be configured to provide control signals to deposition rate measurement component 210 in accordance with several embodiments described herein. In particular, controller 220 can be configured to execute code, wherein based on the execution of the code, the method for measuring the deposition rate in accordance with the embodiments described herein is performed.

For example, the control signal provided by controller 220 to deposition rate measurement component 210 can be used to adjust the time period between the first measurement and the second measurement of the deposition rate. In particular, based on the measured deposition rate, the time period between the first measurement and the second measurement may increase or decrease. For example, in the case where the measured deposition rate is determined to satisfy the preselected criteria, the time period between the first measurement and the second measurement may be increased, and the preselected criterion is exemplified by the stability criterion. Therefore, in the case where the measured deposition rate is determined to be incapable of satisfying the preselected criteria, the time period between the first measurement and the second measurement may be reduced, and the preselected criterion is exemplified by the stability criterion.

By way of example with reference to FIG. 2, deposition rate measurement component 210 can measure actual deposition rate 199 according to several embodiments that can be combined with other embodiments described herein. The measured actual deposition rate 199 is transmitted from the deposition rate measurement component 210 to Controller 220. Based on the measured actual deposition rate 199, the controller 220 can provide a first control signal 125 for controlling the evaporation source 300 to adjust the deposition rate. The first control signal 125 is exemplified by a signal for heating the heating element disposed at the deposition source. And/or a signal for cooling the cooling element disposed at the deposition source. According to several embodiments, which can be combined with other embodiments described herein, the controller 220 can include closed loop control including at least one proportional-integral-derivative (PID) controller for controlling deposition rate. Furthermore, based on the measured actual deposition rate 199, the controller 220 can provide the second control signal 121 to the deposition rate measuring component 210 for adjusting the time zone ΔT between the two measurements, for example, the deposition rate. A time segment ΔT between M1 and second measurement M2 is measured, as exemplarily shown in FIG. Thus, by providing a deposition rate control system including a controller, and the controller is assembled to provide a control signal to a deposition rate measurement assembly, the exposure of the measurement device to the evaporated material to measure the evaporation material can be minimized. This can be beneficial to the overall life of the measuring device.

As exemplarily shown in FIG. 3, a preselected value of deposition rate dm/dt may be defined for deposition rate control system 200, according to several embodiments that may be combined with other embodiments described herein. In particular, the target deposition rate 190, the deposition rate upper limit 191, and the deposition rate lower limit 192 can be selected. For example, as exemplarily shown in FIG. 3, in the case where the measured actual deposition rate 199 is within the upper limit of the deposition rate 191 and the lower limit of the deposition rate 192, the measured actual deposition rate 199 can be determined to satisfy the selected one. Deposition rate accuracy criteria. According to several embodiments, which can be combined with other embodiments described herein, the upper deposition limit 191 can be +3% or less of the target deposition rate 190, particularly target deposition. The rate is +2% or less of 190 (for example, +1.5% or less), more specifically +1% or less of the target deposition rate of 190. The lower deposition limit 192 may be -3% or less of the target deposition rate 190 (for example -2.5%), particularly -2% or less of the target deposition rate 190 (for example -1.5%), more particularly the target deposition rate. 190 - 1% or less (for example -0.75%).

By way of example with reference to Figure 4, the control signals provided by the controller 220 to the deposition rate measuring component 210 can be used to adjust the first measurement of the deposition rate, M1 and the first, according to several embodiments that can be combined with other embodiments described herein. Second, the time zone ΔT between M2 is measured, and the control signal is exemplified by the second control signal 121. As exemplarily shown in FIG. 4, the first measurement M1 can perform the time of the first time period. The deposition rate measurement data of the actual deposition rate 199 can be transmitted from the deposition rate measurement component 210 to the controller 220. Based on the measured actual deposition rate 199 in the first measurement M1, the time zone ΔT between the first measurement M1 and the next measurement can be determined, and the next measurement is exemplified by the second measurement M2. For example, in the case where the measured deposition rate is determined to satisfy the selected deposition rate accuracy criterion, the time zone ΔT between the first measurement M1 and the next measurement may be increased, and then the measurement is performed. For example, the second measurement M2. For example, the time between the first measurement M1 and the next measurement, compared to the preset value of the time segment between the two measurements, in particular the preset value between the two successive measurements The segment ΔT can be increased.

Thus, according to several embodiments, which can be combined with other embodiments described herein, the time period between the second measurement M2 and the next measurement can be based on the measured actual deposition rate in the second measurement M2. 199 decides that the next measurement example is the third measurement. For example, the measured deposition rate of the second measurement M2 In the case where it is determined that the measured deposition rate is more accurate than the first measurement M1, the time period between the second measurement M2 and the next measurement may be increased. Conversely, in the case where the measured deposition rate of the second measurement M2 determines that the measured deposition rate is inaccurate compared to the first measurement M1, the time segment between the second measurement M2 and the next measurement Can be reduced.

In Fig. 5, a schematic diagram of the measurement of the deposition rate using the method for measuring the deposition rate according to the embodiments described herein is shown. In particular, in Figure 5, an exemplary actual deposition rate of 199 [dm/dt] is plotted over time t. Further, FIG. 5 depicts an exemplary target deposition rate 190, an exemplary deposition rate upper limit 191, and an exemplary deposition rate lower limit 192. As exemplarily shown in FIG. 5, the exemplary actual deposition rate 199 may vary with time t. In the ideal case, the actual deposition rate 199 is constant over time and corresponds to a preselected target deposition rate 190. However, in practice, the actual deposition rate 199 may oscillate near the preselected target deposition rate 190, as exemplarily shown in FIG. Thus, the time period between the first measurement and the second measurement can be adjusted based on the measured deposition rate.

For example, the measured deposition rate can be classified based on pre-selected criteria, the pre-selected criteria are exemplified as stability criteria, and the time period between the measurement that must be evaluated for the pre-selected criteria and the next measurement can be based on an estimate The result of the measurement is adjusted. For example, in the case where the measured actual deposition rate 199 of the measurement is estimated to be more accurate than the previous measurement, the time period during which the measurement is performed may be increased. In particular, as exemplarily shown in FIG. 5, the measured deposition rate of the second measurement M2 is determined to be more accurate than the first measurement M1, so that compared to the first time zone For the segment ΔT1, the next third measurement is performed in such a manner that the second time zone ΔT2 is increased. Therefore, as exemplarily shown in FIG. 5, in the case where the measured actual deposition rate 199 is estimated to be inaccurate compared to the previous measurement, the time period in which the measurement is performed next may be reduced. . In particular, as exemplarily illustrated in FIG. 5, the measured deposition rate of the fourth measurement M4 is determined to be less accurate than the third measurement M3, so that compared to the third time zone ΔT3 It is said that the next fifth measurement M5 is performed in such a manner as to reduce the fourth time zone ΔT4.

According to an embodiment of the method 100 for measuring the deposition rate of evaporated material in combination with other embodiments described herein, the method 100 can include masking 130 the deposition rate measuring device between the first measurement and the second measurement. Affected by the evaporated material, as exemplified in the block diagram of Figure 6A. For example, the mask 130 may include a moving shutter 213 between the deposition rate measuring device 211 and the measuring outlet 230, and the measuring outlet 230 for providing the evaporated material to the deposition rate measuring device 211, as exemplified in FIGS. 7A and 7B. Sexual depiction. Therefore, the deposition rate measuring device can avoid the influence of the evaporated material between several measurements, and can contribute to the overall life of the deposition rate measuring device.

According to an embodiment of the method 100 for measuring the deposition rate of evaporated material in combination with other embodiments described herein, the method 100 can include cleaning 140 the deposition rate measuring device 211 between the first measurement and the second measurement The material has been deposited. In particular, cleaning 140 may include evaporating material that has been deposited on deposition rate measuring device 211. For example, evaporating the material that has been deposited on the deposition rate measuring device 211 can be performed by heating the deposition rate measuring device. Therefore, by clearing between several measurements With the deposition rate measuring device, the overall life of the deposition rate measuring device can be extended.

In Figures 7A and 7B, the measurement components of the deposition rate control system described herein are depicted. In particular, the deposition rate measuring assembly 210 for measuring the deposition rate of the evaporated material according to the embodiments described herein may include a deposition rate measuring device 211 including an oscillating crystal 212 for measuring the deposition rate. As exemplarily illustrated in FIGS. 7A and 7B , the deposition rate measuring device 211 may include a holder 250 , and the oscillation crystal 212 may be disposed in the holder 250 . The holder 250 can include a measurement opening 122 that can be assembled and configured such that evaporated material can be deposited on the oscillating crystal 212 to measure the deposition rate of the evaporated material.

According to several embodiments, which can be combined with other embodiments described herein, the deposition rate measuring assembly 210 can include a shutter 213 for blocking evaporated material, the evaporated material is provided by the measurement outlet 230, and the measurement outlet 230 is used. To provide the evaporated material to the deposition rate measuring device 211, particularly to the oscillating crystal 212. Illustratively with reference to Figures 7A and 7B, the shutter 213 can be assembled to move from the first state of the shutter to the second state of the shutter, the movable being as linearly movable, that is, the shutter can be movable The shutter. Alternatively, the shutter can be assembled to be rotatable from the first state to the second state. For example, the first state of the shutter may be an open state, and the shutter 213 does not block the measurement outlet 230 providing the evaporated material to the oscillating crystal 212 in the first state, as exemplarily illustrated in FIG. 7A. Thus, the second state of the shutter 213 can be such that the shutter 213 blocks the state of the measurement outlet 230 such that the oscillating crystal 212 avoids the effects of vaporized material provided by the measurement outlet 230, as exemplarily illustrated in FIG. 7B.

By providing a measuring component with a shutter, the measuring device between several measurements of the deposition rate can avoid the influence of the evaporated material, in particular, the oscillating crystal can avoid the influence of the evaporated material, and can be beneficial to the deposition rate measuring device. The overall life. Furthermore, by using a shutter to shield the deposition rate measuring device between the first measurement and the second measurement to avoid the influence of the evaporated material, the negative effect caused by the heat provided by the evaporated material on the measuring device can be Reduce or even eliminate. For example, by masking the deposition rate measuring device according to the embodiments described herein, the quality, accuracy, and stability of the measurement of the deposition rate can be increased.

By way of example with reference to Figure 7B, according to several embodiments that can be combined with other embodiments described herein, the shutter 213 can include a thermal shield 216 to protect the oscillating crystal 212 from the effects of vaporized material. As exemplarily illustrated in FIG. 7B, the thermal protection mask 216 may be disposed on one side of the shutter 213 facing the measurement outlet 230. In particular, the thermal shield 216 can be assembled to reflect the thermal energy provided by the evaporated material, which is provided through the measurement outlet 230. According to several embodiments, which may be combined with other embodiments described herein, the thermal shield 216 may be a sheet material, such as a metal sheet. Alternatively, the thermal shield 216 may comprise, for example, two of a plurality of sheets of sheet metal, two of which may be spaced apart from each other by, for example, a gap of 0.1 mm or more. For example, the metal plate may have a thickness of 0.1 mm to 0.3 mm. In particular, the thermal protection mask comprises an iron-containing or non-ferrous material, for example selected from the group consisting of copper (Cu), aluminum (Al), copper alloys, aluminum alloys, brass, iron, titanium (Ti), ceramics or others. At least one material of the group consisting of suitable materials.

Thus, a measurement assembly including a thermal protection mask in accordance with embodiments described herein may be advantageous for protecting an oscillating crystal and, in particular, avoiding the effects of the temperature of the evaporated material, the temperature of the evaporated material, when the shutter is closed. An example is heat. In particular, the deposition rate measuring device can be cooled down when the deposition rate measuring device between the two measurements is isolated from the evaporated material. Therefore, the overall life of the deposition rate measuring device can be extended.

According to several embodiments, which can be combined with other embodiments described herein, the deposition rate measuring assembly 210 can include at least one heating element 214 for heating the deposition rate measuring device 211 to a temperature, deposited on the deposition rate measuring device 211. The material is evaporated at this temperature, as exemplified in Figures 7A and 7B. In particular, the heating element 214 can be disposed in the holder 250, for example, adjacent to or adjacent to the oscillating crystal 212. Heating element 214 can be assembled to heat the oscillating crystal and/or holder. Therefore, between the two measurements, the deposition rate measuring device can be cleaned in situ. This can facilitate the overall life of the deposition rate measuring device and achieve the accuracy of the measurement.

The deposition rate measurement assembly 210 can include a heat exchanger 232 in accordance with several embodiments that can be combined with other embodiments described herein. In particular, the heat exchanger can be arranged in the holder, for example next to or adjacent to the oscillating crystal and/or adjacent to or adjacent to the heating element 214. The heat exchanger 232 can be configured to exchange heat with the oscillating crystal and/or the holder 250 and/or the heating element 214. For example, the heat exchanger can include a tubular member through which a cooling fluid can be supplied. The cooling fluid can be a liquid or a gas, such as water, such as air. Hot The transducer may additionally or alternatively include one or more Peltier elements. Thus, by providing a measurement assembly having a heat exchanger 232, the negative effects of high quality resulting in the quality, accuracy, and stability of the measurement of the deposition rate can be reduced or even eliminated. In particular, for example, after the measurement device has been cleaned by heating between the first measurement and the second measurement, providing a measurement component having a heat exchanger can facilitate cooling of the measurement device, and cleaning is performed by heating. The deposited material is evaporated from the deposition rate measuring device.

By way of example with reference to Figure 7B, the deposition rate measurement assembly 210 can include a temperature sensor 217 for measuring the temperature of the deposition rate measuring device 211, in particular according to several embodiments that can be combined with other embodiments described herein. The temperature of the crystal 212 and/or the holder 250 is oscillated. By providing a deposition rate measuring component 210 having a temperature sensor 217, information about the temperature of the measuring component can be obtained such that the critical temperature at which the measurement of the oscillating crystal is susceptible to inaccuracies can be detected. Therefore, in the case where the critical temperature of the deposition rate measuring device 211 is detected by the temperature sensor, an appropriate reaction can be started, for example, cooling can be started by applying a heat exchanger.

The deposition rate measurement component 210 can include a temperature control system to control the temperature of the oscillating crystal 212 and/or the temperature of the holder 250, in accordance with several embodiments that can be combined with other embodiments described herein. In particular, the temperature control system can include one or more temperature sensors 217, a heat exchanger 232, a heating element 214, and a sensor controller 233. As exemplarily illustrated in FIG. 7B, the sensor controller 233 can be coupled to the temperature sensor 217 for receiving data measured by the temperature sensor 217. Furthermore, the sensor controller 233 can be connected to the heat exchanger 232 for control The temperature of the holder 250 and/or the oscillating crystal 212. Further, the sensor controller 233 can be coupled to the heating element 214 to control the heating temperature of the holder 250 and/or the oscillating crystal 212, for example, during cleaning as described herein.

8A and 8B are side views of an evaporation source 300 in accordance with embodiments described herein. According to several embodiments, the evaporation source 300 includes an evaporation crucible 310 in which an evaporation crucible is assembled to evaporate a material, such as an organic material. Furthermore, the evaporation source 300 includes a distribution tube 320 having one or more outlets 322 disposed along the length of the distribution tube for providing evaporated material, as in Figure 8B. Exemplary illustrations. According to several embodiments, the distribution tube 320 is in fluid communication with the evaporation crucible 310, for example, via a steam conduit 332, as exemplarily illustrated in FIG. 8B. The steam conduit 332 may be disposed in the distribution tube 320 at a central portion of the distribution tube or at another location between the lower end of the distribution tube and the upper end of the distribution tube. Moreover, evaporation source 300 in accordance with embodiments described herein includes deposition rate measurement assembly 210 in accordance with the teachings herein. As exemplarily illustrated in Figures 8A and 8B, according to several embodiments that may be combined with other embodiments described herein, the evaporation source 300 may include a controller 220 coupled to the deposition rate measurement component 210 and Connected to evaporation source 300. As described herein, the controller 220 can provide a first control signal 125 (eg, as shown in FIG. 3 or FIG. 4) to the evaporation source 300 for adjusting the deposition rate. Furthermore, the controller can provide a second control signal 121 to a deposition rate measurement component 210 for adjusting the time zone ΔT between the two measurements (eg, as shown in FIG. 4). Therefore, the evaporation source 300 is provided to measure and control the deposition rate with high accuracy.

As exemplarily illustrated in FIG. 8A, the distribution tube 320 can be an elongated cube, including a heating element 315, according to several embodiments that can be combined with other embodiments described herein. The evaporation crucible 310 may be a reservoir for evaporating material with the heating unit 325, such as an organic material. For example, the heating unit 325 can be provided in the interior space of the evaporation crucible 310. Distribution tube 320 can provide a source of wiring in accordance with several embodiments that can be combined with other embodiments described herein. For example, as exemplarily illustrated in FIG. 8B, for example, a plurality of outlets 322 of the nozzles may be disposed along at least one of the wires. According to an alternative embodiment (not shown), an elongated opening extending along the at least one wire may be provided, the elongated opening being exemplified by a slit. According to some embodiments, which can be combined with other embodiments described herein, the wiring source can extend substantially perpendicularly.

According to some embodiments, which may be combined with other embodiments described herein, the length of the distribution tube 320 may correspond to the height of the substrate onto which the material is deposited in a deposition apparatus. Alternatively, the length of the distribution tube 320 can be at least 10% or even 20% longer than the height of the substrate onto which the material will be deposited. Thus, uniform deposition can be provided at the upper end of the substrate and/or at the lower end of the substrate. For example, the distribution tube 320 may have a length of 1.3 m or more, for example 2.5 m or more.

According to several embodiments, which may be combined with other embodiments described herein, the evaporation crucible 310 may be provided at the lower end of the distribution tube 320, as exemplarily shown in FIG. 8A. A material such as an organic material may be evaporated in the evaporation crucible 310. The vaporized material can enter the distribution tube 320 at the bottom of the distribution tube and can be directed substantially laterally through the outlets 322 in the distribution tube 320, for example toward an essentially vertical base. board. Illustratively with reference to FIG. 8B, a deposition rate measurement assembly 210 in accordance with embodiments described herein can be provided over the distribution tube 320, such as at the upper end of the distribution tube 320.

By way of example with reference to Figure 8B, the measurement outlet 230 can be disposed in one of the walls of the distribution tube 320, such as a wall on the back side 224A of the distribution tube, according to several embodiments that can be combined with other embodiments described herein. in. Alternatively, the measurement outlet 230 can be disposed in the top wall 224C of the distribution tube 320. As exemplarily shown by arrow 231 in FIG. 8B, evaporated material may be provided from the inside of distribution tube 320 to deposition rate measurement assembly 210 via measurement outlet 230. According to several embodiments, which can be combined with other embodiments described herein, the measurement outlet 230 can have an opening from 0.5 mm to 4 mm. Measurement outlet 230 can include a nozzle. For example, the nozzle can include an adjustable opening to adjust the flow rate of the vaporized material provided to the deposition rate measurement assembly 210. In particular, the nozzle can be assembled to provide a measured flow rate selected from a range which is 1/70 of the total flow rate provided by the evaporation source, in particular the lower limit is the total flow rate provided by the evaporation source. 1/60, more particularly the lower limit is 1/50 of the total flow rate provided by the evaporation source and the upper limit is 1/40 of the total flow rate provided by the evaporation source, in particular the upper limit is 1/30 of the total flow rate provided by the evaporation source More particularly, the upper limit is between 1/25 of the total flow rate provided by the evaporation source. For example, the nozzle can be assembled to provide a measured flow that is 1/54 of the total flow provided by the evaporation source.

FIG. 9 is a top plan view of a deposition apparatus 400 for supplying material to a substrate 444 in a vacuum chamber 410 in accordance with embodiments described herein. According to several embodiments, which can be combined with other embodiments described herein, the evaporation source 300 can be provided to the true In the cavity 410, for example, on a track, the track is exemplified by a linear guide 420 or an annular track. Track or linear guide 420 can be assembled to evaporate the translational motion of source 300. Thus, in accordance with several embodiments that can be combined with other embodiments described herein, a driver for translational motion can be provided to the evaporation source 300 of the track and/or linear guide 420 in the vacuum chamber 410. A first valve 405, such as a gate valve, can be provided to provide a vacuum seal to an adjacent vacuum chamber (not shown in Figure 9). The first valve can be opened to transport the substrate 444 or mask 432 into or out of the vacuum chamber 410.

According to some embodiments, which may be combined with other embodiments described herein, other vacuum chambers may be disposed adjacent to the vacuum chamber 410, such as the maintenance vacuum chamber 411, as exemplified in FIG. Painted. Therefore, the vacuum chamber 410 and the maintenance vacuum chamber 411 can be connected by the second valve 407. The second valve 407 can be assembled to open and close a vacuum seal between the vacuum chamber 410 and the maintenance vacuum chamber 411. When the second valve 407 is in the open state, the evaporation source 300 can be delivered to the maintenance vacuum chamber 411. Thereafter, the second valve 407 can be closed to provide a vacuum seal between the vacuum chamber 410 and the maintenance vacuum chamber 411. If the second valve 407 is closed, the maintenance vacuum chamber 411 can be vented and opened for maintenance of the evaporation source 300 without damaging the vacuum in the vacuum chamber 410.

As exemplarily shown in FIG. 9, the two substrates can be supported on respective transport tracks in the vacuum chamber 410. Furthermore, two tracks can be provided to provide a mask thereon. Thus, during coating, the substrate 444 can be masked by a respective mask. For example, a mask may be provided in the mask frame 431 to support the mask 432 is in the predetermined location.

According to some embodiments, which may be combined with other embodiments described herein, the substrate 444 may be supported by a substrate support 426 that may be coupled to the alignment unit 412. The alignment unit 412 can adjust the position of the substrate 444 relative to the mask 432. As exemplarily illustrated in FIG. 9, the substrate support 426 can be coupled to the alignment unit 412. Thus, the substrate can be moved relative to the mask 432 to provide proper alignment between the substrate and the mask during material deposition, facilitating high quality display fabrication. The mask 432 and/or the mask frame 431 supporting the mask 432 may be selectively or additionally coupled to the alignment unit 412. Thus, the mask 432 can be positioned relative to the substrate 444 or both the mask 432 and the substrate 444 can be positioned relative to each other.

As shown in FIG. 9, linear guide 420 can provide the direction of translational motion of evaporation source 300. A mask 432 may be provided on both sides of the evaporation source 300. The mask may extend substantially parallel to the direction of the translational motion. Furthermore, the substrate on the opposite side of the evaporation source 300 can also extend substantially parallel to the direction of translational motion. As exemplarily shown in FIG. 9, the evaporation source 300 disposed in the vacuum chamber 410 of the deposition apparatus 400 can include a support 302 that can be assembled for translational movement along the linear guide 420. For example, the support member 302 can support two evaporation crucibles and two distribution tubes 320 disposed above the evaporation crucible 310. Thus, the steam generated in the evaporation crucible can move up and out of the one or more outlets of the distribution tube.

As exemplarily illustrated in Figure 9, a deposition source can be provided with two or more distribution tubes. For example, two or more distribution tubes can be designed as triangles The shape. The distribution tube 320 of the shape of a triangle may have advantages in the case where two or more distribution tubes are arranged adjacent to each other. In particular, the triangular shaped tube 320 allows the outlets of the adjacent distribution tubes for the vaporized material to be only possible close to each other. This allows for improved mixing from different materials of different distribution tubes, for example for co-evaporation of two, three or even many different materials.

Thus, the method for measuring the deposition rate of evaporated material, the deposition rate control system, the evaporation source, and the deposition apparatus according to embodiments described herein provide improved deposition rate measurement and/or improved deposition rate control. . This can be beneficial for high quality display manufacturing, such as high quality OLED manufacturing. In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

121‧‧‧Second control signal

125‧‧‧First control signal

190‧‧‧target deposition rate

191‧‧‧Capacity limit

192‧‧‧ Lower limit of deposition rate

199‧‧‧ actual deposition rate

200‧‧‧Deposition rate control system

210‧‧‧Deposition rate measurement component

220‧‧‧ Controller

300‧‧‧ evaporation source

M1‧‧‧ first measurement

M2‧‧‧ second measurement

△T‧‧‧ time section

Dm/dt‧‧‧deposition rate

t‧‧‧Time

Claims (20)

A measuring method (100) for measuring a deposition rate of a vaporized material, the method comprising: measuring (110) the deposition rate, having a time period between a first measurement and a second measurement; The deposition rate that has been measured adjusts (120) the time period. The measuring method (100) of claim 1, wherein the measured deposition rate is a function of the deposition rate. The measuring method (100) of claim 1 or 2, wherein the function of the measured deposition rate is selected from the slope of one of the deposition rates, and the deposition rate in a predetermined range. A Boolean decision, a polynomial function of the measured differential rate for a nominal/set value of a predetermined deposition rate, and a group of vibrational functions of the measured deposition rate. The measuring method (100) of claim 1 or 2, further comprising masking (130) a deposition rate measuring device between the first measurement and the second measurement so as not to be affected by the evaporated material. The measuring method (100) of claim 4, wherein the shielding (130) comprises moving a shutter (213) between the deposition rate measuring device (211) and a measuring outlet (230), the measuring An outlet (230) is used to provide the evaporated material to the deposition rate measuring device (211). The measuring method (100) of claim 1 or 2, further comprising clearing the deposition rate measuring device (211) between the first measurement and the second measurement. Wash (140) the deposited material. The measuring method (100) of claim 5, further comprising cleaning (140) the deposited material from the deposition rate measuring device (211) between the first measurement and the second measurement. The measuring method (100) of claim 6, wherein the cleaning (140) comprises evaporating the deposited material from the deposition rate measuring device (211). The measuring method (100) of claim 7, wherein the cleaning (140) comprises evaporating the deposited material from the deposition rate measuring device (211). The measuring method (100) of claim 8, wherein evaporating the deposited material from the deposition rate measuring device (211) is performed by heating the deposition rate measuring device. The measuring method (100) of claim 9, wherein evaporating the deposited material from the deposition rate measuring device (211) is performed by heating the deposition rate measuring device. A deposition rate control system (200) includes: a deposition rate measuring component (210) for measuring a deposition rate of a vaporized material, and a controller (220) coupled to the deposition rate measuring component (210) and Connected to an evaporation source (300), wherein the controller is assembled to provide a control signal to the deposition rate measuring component (210), wherein the controller is assembled to execute a code, wherein based on the execution of the code, The method described in any one of claims 1 to 11 is carried out. The deposition rate control system (200) of claim 12, wherein the controller (220) comprises a closed loop control comprising at least one proportional-integral-derivative (proportional-integral-derivative, PID) controller to control the deposition rate. The deposition rate control system (200) of claim 12 or 13, wherein the deposition rate measuring component (210) comprises a deposition rate measuring device (211), the deposition rate measuring device (211) comprising an oscillation A crystal (212) for measuring the deposition rate. The deposition rate control system (200) of claim 12, wherein the deposition rate measuring component (210) comprises a movable shutter (213) for shielding a deposition rate measuring device (211). The measurement outlet (230) is used to provide evaporated material to the deposition rate measuring device (211) without being affected by the evaporated material provided from a measurement outlet (230). The deposition rate control system (200) of claim 14, wherein the deposition rate measuring component (210) includes a movable shutter (213) for shielding the deposition rate measuring device (211) Without being affected by the evaporated material provided from a measurement outlet (230), the measurement outlet (230) is used to provide evaporated material to the deposition rate measuring device (211). The deposition rate control system (200) of claim 12 or 13, wherein the deposition rate measuring component (210) comprises at least one heating element (214) for heating a deposition rate measuring device (211) to At a temperature, the material deposited on the deposition rate measuring device (211) is evaporated at this temperature. The deposition rate control system (200) of claim 15, wherein the deposition rate measuring component (210) comprises at least one heating element (214) for heating the deposition rate measuring device (211) to a temperature The material deposited on the deposition rate measuring device (211) is evaporated at this temperature. An evaporation source (300) for evaporating material, the evaporation source comprising: an evaporation crucible (310), wherein the evaporation crucible is assembled to evaporate the material; a distribution tube (320) having along the distribution tube One or more outlets disposed in length for providing evaporated material to a substrate at a deposition rate, wherein the distribution tube (320) is in fluid communication with the evaporation crucible (310); and as in claim 12 The deposition control system (200) of any of the 18 items. A deposition apparatus (400) for supplying material to a substrate (444) at a deposition rate in a vacuum chamber (410), the deposition apparatus comprising at least one evaporation source as described in claim 19 ( 300).