TWI761445B - 電磁波屏蔽膜、屏蔽印刷配線板及電子機器 - Google Patents

電磁波屏蔽膜、屏蔽印刷配線板及電子機器 Download PDF

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Publication number
TWI761445B
TWI761445B TW107104522A TW107104522A TWI761445B TW I761445 B TWI761445 B TW I761445B TW 107104522 A TW107104522 A TW 107104522A TW 107104522 A TW107104522 A TW 107104522A TW I761445 B TWI761445 B TW I761445B
Authority
TW
Taiwan
Prior art keywords
electromagnetic wave
wave shielding
shielding film
layer
printed wiring
Prior art date
Application number
TW107104522A
Other languages
English (en)
Chinese (zh)
Other versions
TW201841564A (zh
Inventor
上農憲治
山內志朗
白髮潤
村川昭
Original Assignee
日商拓自達電線股份有限公司
日商迪愛生股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商拓自達電線股份有限公司, 日商迪愛生股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW201841564A publication Critical patent/TW201841564A/zh
Application granted granted Critical
Publication of TWI761445B publication Critical patent/TWI761445B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
TW107104522A 2017-02-08 2018-02-08 電磁波屏蔽膜、屏蔽印刷配線板及電子機器 TWI761445B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017021649 2017-02-08
JP2017-021649 2017-02-08

Publications (2)

Publication Number Publication Date
TW201841564A TW201841564A (zh) 2018-11-16
TWI761445B true TWI761445B (zh) 2022-04-21

Family

ID=63108320

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107104522A TWI761445B (zh) 2017-02-08 2018-02-08 電磁波屏蔽膜、屏蔽印刷配線板及電子機器

Country Status (5)

Country Link
JP (1) JP6404533B1 (ko)
KR (1) KR102231053B1 (ko)
CN (1) CN110199584B (ko)
TW (1) TWI761445B (ko)
WO (1) WO2018147299A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113545180A (zh) * 2019-03-22 2021-10-22 拓自达电线株式会社 电磁波屏蔽膜
JP6690773B1 (ja) * 2019-12-18 2020-04-28 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196285A (ja) * 1998-12-25 2000-07-14 Sumitomo Rubber Ind Ltd 透光性電磁波シ―ルド部材およびその製造方法
JP2004273577A (ja) * 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
JP2010189688A (ja) * 2009-02-17 2010-09-02 Fujifilm Corp 微細構造体の製造方法および微細構造体
TW201325425A (zh) * 2011-12-08 2013-06-16 Ind Tech Res Inst 電磁波屏蔽複合膜及具有該複合膜之軟性印刷電路板
US20140141232A1 (en) * 2012-11-21 2014-05-22 Industrial Technology Research Institute Electromagnetic wave shielding structure and method for fabricating the same
US20160120077A1 (en) * 2013-05-29 2016-04-28 Tatsuta Electric Wire & Cable Co., Ltd. Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4201548B2 (ja) 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP4647924B2 (ja) * 2004-03-23 2011-03-09 タツタ電線株式会社 プリント配線板用シールドフィルム及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196285A (ja) * 1998-12-25 2000-07-14 Sumitomo Rubber Ind Ltd 透光性電磁波シ―ルド部材およびその製造方法
JP2004273577A (ja) * 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
JP2010189688A (ja) * 2009-02-17 2010-09-02 Fujifilm Corp 微細構造体の製造方法および微細構造体
TW201325425A (zh) * 2011-12-08 2013-06-16 Ind Tech Res Inst 電磁波屏蔽複合膜及具有該複合膜之軟性印刷電路板
US20140141232A1 (en) * 2012-11-21 2014-05-22 Industrial Technology Research Institute Electromagnetic wave shielding structure and method for fabricating the same
US20160120077A1 (en) * 2013-05-29 2016-04-28 Tatsuta Electric Wire & Cable Co., Ltd. Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil

Also Published As

Publication number Publication date
KR20190116971A (ko) 2019-10-15
JP6404533B1 (ja) 2018-10-10
JPWO2018147299A1 (ja) 2019-02-14
KR102231053B1 (ko) 2021-03-22
TW201841564A (zh) 2018-11-16
CN110199584A (zh) 2019-09-03
WO2018147299A1 (ja) 2018-08-16
CN110199584B (zh) 2021-03-16

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