TWI758185B - Imprint method for improving demolding stability and the related imprint system - Google Patents

Imprint method for improving demolding stability and the related imprint system Download PDF

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TWI758185B
TWI758185B TW110117162A TW110117162A TWI758185B TW I758185 B TWI758185 B TW I758185B TW 110117162 A TW110117162 A TW 110117162A TW 110117162 A TW110117162 A TW 110117162A TW I758185 B TWI758185 B TW I758185B
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alignment mark
material layer
mold core
polymer material
aligned
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TW110117162A
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Chinese (zh)
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TW202243858A (en
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蔡嵩玟
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永嘉光電股份有限公司
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Priority to TW110117162A priority Critical patent/TWI758185B/en
Priority to US17/537,986 priority patent/US20220088833A1/en
Priority to CN202111451664.6A priority patent/CN115340289B/en
Priority to JP2021195033A priority patent/JP7193177B2/en
Priority to KR1020210180388A priority patent/KR20220154005A/en
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/16Gearing or controlling mechanisms specially adapted for glass presses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F16/00Transfer printing apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B29C33/3878Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F23/00Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
    • B41F23/04Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/06Construction of plunger or mould

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention provides an imprint method comprises: adding a soluble material to a master mold; solidifying the soluble material to form a soluble mold, the soluble mold having a mold pattern; forming an adhesive agent on a side of the soluble mold opposite to the master mold; placing a taking device to the adhesive agent, wherein the taking device comprises: a frame and a support plate positioned on the frame, and the support plate is contacted with the adhesive agent; removing the taking device from the master mold, wherein the soluble mold is associated with the taking device as the taking device is removed; placing the soluble mold on a polymer layer; applying a high temperature and a pressure to the soluble mold to make the polymer layer have an imprint pattern corresponding to the mold patter and solidify the polymer layer; and providing a solvent to dissolve the soluble mold to separate the solidified polymer layer and the support plate to form an imprint workpiece having the imprint pattern.

Description

提升脫模穩定性之壓印方法及相關壓印系統 Imprinting method and related imprinting system for improving demolding stability

本發明關於一種壓印方法,且特別攸關一種利用溶劑去除模仁的壓印方法及相關壓印系統。 The present invention relates to an imprinting method, and particularly relates to an imprinting method and related imprinting system using a solvent to remove a mold core.

所謂「壓印」為藉由使用模具在基板上形成壓印材料的圖案,其中,熱壓印法係在經加熱至玻璃轉移溫度以上的高分子樹脂上,壓下模具後,冷卻至玻璃轉移溫度以下後將模具脫模,藉以將微細結構轉印至基板上的樹脂。依S.Chou et al.,Appl.Phys.Lett.67,3114(1995)所述,其使用熱塑性樹脂作為被加工材料之熱壓印法。依J.Haisma et al.,J.Vac.Sci.Technol.B 14(6),4124(1996)所述,提出硬化性組成物之光壓印法。 The so-called "imprinting" is to form the pattern of the imprinting material on the substrate by using the mold, wherein, the hot imprinting method is to press the mold on the polymer resin heated above the glass transition temperature, and then cool to the glass transition temperature. After the temperature is below, the mold is released from the mold, thereby transferring the fine structure to the resin on the substrate. According to S. Chou et al., Appl. Phys. Lett. 67, 3114 (1995), it is a hot embossing method using thermoplastic resin as the material to be processed. According to J. Haisma et al., J. Vac. Sci. Technol. B 14(6), 4124 (1996), a photoimprinting method of curable compositions is proposed.

自轉印物件移除模具的過程稱作「脫模(mold release)」。由於壓印法具有剝離模具之步驟,因此,脫模性係一重要考量因素,其影響模具之維護與轉印結構之完整度。依M.W.Lin et al.,J.Micro/Nanolith.MEMS MOEMS 7(3),033005(2008)所述,其使硬化性組成物中含有含氟單體分子或非反應性的含氟化合物,以改良其脫模性。美國專利公告號US6,849,558B2與美國專利公開號US2006/0249886A1均提出一種可被一溶劑溶解之模具。此種可溶解性模具為透過灌注可溶解性材料至樣模內固化取得,之後利用預製件(preform)自樣模 取出模具。依Journal of Vacuum Science & Technology B 21,2961(2003)所述,預製件與可溶解性材料為相同材料,並於可溶解性材料完全固化前附著至可溶解性材料。一般而言,可溶解性材料的濃度與厚度均會影響固化時間,因此預製件於可溶解性材料固化至何種程度下始能附著考驗著操作人員的專業與經驗。 The process of removing the mold from the transfer object is called "mold release". Since the imprint method has the step of peeling off the mold, the mold release is an important consideration, which affects the maintenance of the mold and the integrity of the transfer structure. According to M.W.Lin et al., J.Micro/Nanolith.MEMS MOEMS 7(3), 033005 (2008), the curable composition contains fluorine-containing monomer molecules or non-reactive fluorine-containing compounds to Improve its releasability. US Patent Publication No. US6,849,558B2 and US Patent Publication No. US2006/0249886A1 both propose a mold that can be dissolved by a solvent. This kind of dissolvable mold is obtained by pouring dissolvable material into the mold to solidify, and then using a preform from the mold Remove the mold. According to Journal of Vacuum Science & Technology B 21, 2961 (2003), the preform is the same material as the dissolvable material and is attached to the dissolvable material before the dissolvable material is fully cured. Generally speaking, the concentration and thickness of the soluble material will affect the curing time, so the degree to which the preform can be adhered to the soluble material is a test of the operator's expertise and experience.

所謂「分子轉移光刻」係利用曝光和顯影在光阻層上刻畫幾何圖形結構,然後通過蝕刻製程將光罩上的圖形轉移到所在基板上,其可以精確地控制形成圖形的形狀、大小,為半導體領域中之重要製程。依Nanotechnology 24(2013)085302(6pp)所述,模具雖同樣為可溶解性模具,但由於採用滾輪方式使模具均勻地置於物件上,因而造成後續所得之微細結構間距擴張而變形。 The so-called "molecular transfer lithography" is to use exposure and development to describe the geometric structure on the photoresist layer, and then transfer the pattern on the photomask to the substrate through the etching process, which can precisely control the shape and size of the formed pattern, It is an important process in the semiconductor field. According to Nanotechnology 24 (2013) 085302 (6pp), although the mold is also a dissolvable mold, the rollers are used to make the mold evenly placed on the object, resulting in the subsequent expansion of the fine structure spacing and deformation.

本發明所欲解決之問題在於:提供一種壓印方法,防止模仁因於壓印過程中,其結構產生形變、偏移或擴張,而導致依該模仁進行轉印之物件產生缺陷。 The problem to be solved by the present invention is to provide an imprinting method to prevent the mold core from deforming, shifting or expanding its structure during the imprinting process, resulting in defects in the objects that are transferred by the mold core.

為解決上述之問題,本發明提供一種壓印方法,係包括:添加一可溶解性材料至一樣模內;固化該可溶解性材料以形成一可溶解性模仁,該模仁具有一凹凸結構;於該模仁相對於該樣模之一側形成一黏著劑;附著一取模裝置於該黏著劑,其中該取模裝置包含:一架體結構;一膠帶,其係設置於該架體結構;以及一支撐背板,其係設置於該膠帶,其中該取模裝置係以該支撐背板與該黏著劑相接觸;將該取模裝置相對於該樣模分離,其中該可溶解性模仁係隨著該取模裝置相對於該樣模分離;放置該可溶解性模仁於一高分子材料層上;施予第一高溫與壓力至該可溶解性模仁,使該高分子材料層具有一對應該凹凸結構的轉印結構,並使該支撐背板與該膠帶分離,其中:該第一高溫為50 至160℃;施予第二高溫至該可溶解性模仁,其中:該第二高溫為120至180℃,並且該第二高溫大於該第一高溫,使該高分子材料層固化;以及提供一溶劑溶解該可溶解性模仁,使該固化後之高分子材料層與該支撐背板分離以取得一具該轉印結構的轉印物件。 In order to solve the above problems, the present invention provides an imprinting method, which includes: adding a dissolvable material into a mold; curing the dissolvable material to form a dissolvable mold core, the mold core having a concave-convex structure ; Form an adhesive on one side of the mold core relative to the sample mold; attach a mold-taking device to the adhesive, wherein the mold-taking device comprises: a frame structure; an adhesive tape, which is arranged on the frame structure; and a supporting backing plate, which is arranged on the tape, wherein the die-taking device is in contact with the adhesive with the supporting backing plate; the die-taking device is separated from the prototype, wherein the dissolving The mold core is separated from the sample mold with the mold taking device; the dissolvable mold core is placed on a polymer material layer; the first high temperature and pressure are applied to the dissolvable mold core to make the polymer The material layer has a pair of transfer structures corresponding to the concave-convex structure, and separates the support backboard from the adhesive tape, wherein: the first high temperature is 50 to 160° C.; applying a second high temperature to the dissolvable mold core, wherein: the second high temperature is 120 to 180° C., and the second high temperature is greater than the first high temperature, so that the polymer material layer is cured; and providing A solvent dissolves the soluble mold core, and separates the cured polymer material layer from the support backplane to obtain a transfer object with the transfer structure.

更佳者,其中該可溶解性模仁具有一第一對位記號,而該放置模仁於高分子材料層上的步驟包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該基材層具有一第二對位記號;以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第二對位記號是否對齊;以及若對齊,則該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該可溶解性模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第二對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該基材層具有一第二對位記號;該可溶解性模仁與該高分子材料層接觸;以及以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第二對位記號是否對齊;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第二對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該基材層具有一第二對位記號;移動一攝像元件至該可溶解性模仁與該待轉印物件之間以確認該第一 對位記號與該第二對位記號是否對齊;以及若對齊,則復位該攝像元件且該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第二對位記號對齊。 More preferably, wherein the dissolvable mold core has a first alignment mark, and the step of placing the mold core on the polymer material layer includes: placing an object to be transferred on a machine platform, the to-be-transferred object The printed object has a base material layer between the polymer material layer and the machine platform, and the base material layer has a second alignment mark; a base material disposed on the mold-taking device opposite to one of the dissolvable mold cores The imaging element on the side or an imaging element disposed on the side of the machine platform opposite to the object to be transferred confirms whether the first alignment mark and the second alignment mark are aligned; and if they are aligned, the dissolvable The dissolvable mold core is in contact with the polymer material layer; if it is not aligned, adjust the X-axis and Y-axis of the dissolvable mold core and the θ angle on the X-Y plane with the machine platform as the X-Y plane until the first The alignment mark is aligned with the second alignment mark; the step of placing the mold core on the polymer material layer may include: placing a to-be-transferred object on a machine platform, and the to-be-transferred object has a base material layer Between the polymer material layer and the machine platform, the base material layer has a second alignment mark; the dissolvable mold core is in contact with the polymer material layer; An imaging element on one side of the dissolvable mold core or an imaging element disposed on a side of the machine platform opposite to the object to be transferred confirms whether the first alignment mark and the second alignment mark are aligned; If it is not aligned, adjust the X-axis and Y-axis of the mold core and its θ angle on the X-Y plane with the machine platform as the X-Y plane until the first alignment mark is aligned with the second alignment mark; the placement The step of forming the mold core on the polymer material layer may include: placing a to-be-transferred object on a machine platform, the to-be-transferred object having a base material layer between the polymer material layer and the machine platform, The base material layer has a second alignment mark; move a camera element between the dissolvable mold core and the to-be-transferred object to confirm the first Whether the alignment mark and the second alignment mark are aligned; and if they are aligned, reset the camera element and the dissolvable mold core is in contact with the polymer material layer; if not, take the machine platform as the X-Y plane Adjust the X-axis and Y-axis of the mold core and the θ angle in the X-Y plane until the first alignment mark is aligned with the second alignment mark.

更佳者,其中該可溶解性模仁具有一第一對位記號,而該放置模仁於高分子材料層上的步驟包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該機台平台具有一第三對位記號;以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第三對位記號是否對齊;以及若對齊,則該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第三對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該機台平台具有一第三對位記號;該可溶解性模仁與該高分子材料層接觸;以及以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第三對位記號是否對齊;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第三對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該機台平台具有一第三對位記號;移動一攝像元件至該可溶解性模仁與該待轉印物件之間以確認該第一對 位記號與該第三對位記號是否對齊;以及若對齊,則復位該攝像元件且該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第三對位記號對齊。 More preferably, wherein the dissolvable mold core has a first alignment mark, and the step of placing the mold core on the polymer material layer includes: placing an object to be transferred on a machine platform, the to-be-transferred object The printed object has a base material layer between the polymer material layer and the machine platform, and the machine platform has a third alignment mark; one is disposed on the mold-taking device opposite to one of the dissolvable mold cores The imaging element on the side or an imaging element disposed on the side of the machine platform opposite to the object to be transferred confirms whether the first alignment mark and the third alignment mark are aligned; and if they are aligned, the dissolvable The mold core is in contact with the polymer material layer; if it is not aligned, use the machine platform as the XY plane to adjust the X-axis and Y-axis of the mold core and the θ angle on the XY plane until the first alignment mark aligned with the third alignment mark; the step of placing the mold core on the polymer material layer may include: placing an object to be transferred on a machine platform, the object to be transferred has a substrate layer on the high Between the molecular material layer and the machine platform, the machine platform has a third alignment mark; the dissolvable mold core is in contact with the polymer material layer; An imaging element on one side of the dissolving mold core or an imaging element disposed on the side of the machine platform opposite to the object to be transferred confirms whether the first alignment mark and the third alignment mark are aligned; if not aligned , then use the machine platform as the XY plane to adjust the X-axis and Y-axis of the mold core and its θ angle on the XY plane until the first alignment mark is aligned with the third alignment mark; the mold core is placed in The step on the polymer material layer may include: placing an object to be transferred on a machine platform, the object to be transferred has a substrate layer between the polymer material layer and the machine platform, the machine platform The platform has a third alignment mark; move a camera element between the dissolvable mold core and the object to be transferred to confirm whether the first alignment mark and the third alignment mark are aligned; and if aligned, Then reset the imaging element and the dissolvable mold core is in contact with the polymer material layer; if not aligned, adjust the X-axis and Y-axis of the mold core and its θ in the XY plane with the machine platform as the XY plane angle until the first registration mark is aligned with the third registration mark.

更佳者,其中該可溶解性模仁具有一第一對位記號,而該放置模仁於高分子材料層上的步驟包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該高分子材料層具有一第四對位記號;以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第四對位記號是否對齊;以及若對齊,則該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該可溶解性模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第四對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該高分子材料層具有一第四對位記號;該可溶解性模仁與該高分子材料層接觸;以及以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第四對位記號是否對齊;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第四對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該高分子材料層具有一第四對位記號;移動一攝像元件至該可溶解性模仁與該待轉印物件 之間以確認該第一對位記號與該第四對位記號是否對齊;以及若對齊,則復位該攝像元件且該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第四對位記號對齊。 More preferably, wherein the dissolvable mold core has a first alignment mark, and the step of placing the mold core on the polymer material layer includes: placing an object to be transferred on a machine platform, the to-be-transferred object The printed object has a base material layer between the polymer material layer and the machine platform, and the polymer material layer has a fourth alignment mark; a set on the mold-taking device opposite to the dissolvable mold core An imaging element on one side or an imaging element disposed on the side of the machine platform opposite to the object to be transferred confirms whether the first alignment mark and the fourth alignment mark are aligned; and if they are aligned, the The dissolving mold core is in contact with the polymer material layer; if it is not aligned, use the machine platform as the X-Y plane to adjust the X-axis and Y-axis of the dissolving mold core and the θ angle on the X-Y plane until the first The alignment mark is aligned with the fourth alignment mark; the step of placing the mold core on the polymer material layer may include: placing a to-be-transferred object on a machine platform, the to-be-transferred object having a base material layered between the polymer material layer and the machine platform, the polymer material layer has a fourth alignment mark; the dissolvable mold core is in contact with the polymer material layer; and a A camera on a side of the device opposite to the dissolvable mold core or a camera on a side of the machine platform opposite to the object to be transferred confirms whether the first alignment mark and the fourth alignment mark are Alignment; if not aligned, adjust the X-axis and Y-axis of the mold core and its θ angle on the X-Y plane with the machine platform as the X-Y plane, until the first alignment mark is aligned with the fourth alignment mark; The step of placing the mold core on the polymer material layer may include: placing a to-be-transferred object on a machine platform, the to-be-transferred object having a substrate layer between the polymer material layer and the machine platform During the time, the polymer material layer has a fourth alignment mark; move a camera element to the dissolvable mold core and the to-be-transferred object between to confirm whether the first alignment mark and the fourth alignment mark are aligned; and if they are aligned, reset the imaging element and the dissolvable mold core is in contact with the polymer material layer; if they are not aligned, use The machine platform adjusts the X-axis and Y-axis of the mold core and its θ angle in the X-Y plane for the X-Y plane until the first alignment mark is aligned with the fourth alignment mark.

更佳者,本發明又提供一種壓印系統,係包括:一機台平台,係用以供一待轉印物件、一可溶解性模仁、與一取模裝置放置,該待轉印物件具有一基材層以及一設置於該基材層上的高分子材料層,該模仁放置於該待轉印物件的高分子材料層上且具有一凹凸結構及一第一對位記號,該取模裝置黏附於該模仁,其中該基材層具有一第二對位記號、該機台平台具有一第三對位記號、或該高分子材料層具有一第四對位記號;以及一攝像元件,係用以確認該第一對位記號與該第二對位記號是否對齊、該第一對位記號與該第三對位記號是否對齊、或該第一對位記號與該第四對位記號是否對齊。 More preferably, the present invention further provides an imprinting system, which includes: a machine platform for placing an object to be transferred, a dissolvable mold core, and a mold taking device, and the object to be transferred is placed. It has a base material layer and a polymer material layer arranged on the base material layer. The mold core is placed on the polymer material layer of the object to be transferred and has a concave-convex structure and a first alignment mark. The mold taking device is attached to the mold core, wherein the base material layer has a second alignment mark, the machine platform has a third alignment mark, or the polymer material layer has a fourth alignment mark; and a The imaging element is used to confirm whether the first alignment mark and the second alignment mark are aligned, whether the first alignment mark and the third alignment mark are aligned, or the first alignment mark and the fourth alignment mark Whether the registration mark is aligned.

更佳者,該壓印系統另包含:一紅外線發射元件,其發射一紅外線照射該第一對位記號與該第二對位記號、該第一對位記號與該第三對位記號、或該第一對位記號與該第四對位記號,以確認兩者是否對齊。 More preferably, the imprinting system further comprises: an infrared emitting element, which emits an infrared ray to irradiate the first alignment mark and the second alignment mark, the first alignment mark and the third alignment mark, or The first alignment mark and the fourth alignment mark are used to confirm whether they are aligned.

更佳者,其中該攝像元件為設置於該取模裝置相反於該可溶解性模仁的一側或設置於該機台平台相反於該待轉印物件的一側;或該攝像元件為配置以移動至該可溶解性模仁與該待轉印物件之間後復位。 More preferably, wherein the imaging element is disposed on the side of the mold-taking device opposite to the dissolvable mold core or on the side of the machine platform opposite to the object to be transferred; or the imaging element is configured After moving between the dissolvable mold core and the object to be transferred, it resets.

本發明相較於先前技術之功效在於:由於該支撐背板係藉由一黏著劑與該可溶解性模仁黏接,因此,於該可溶解性模仁與該樣模分離時;該可溶解性模仁與該高分子材料層接觸或對位時;施予一高溫或壓力於該可溶解性模仁時;架體結構相對於支撐背板分離時;架體結構以及設置於該架體結構之膠帶 相對於該支撐背板分離時;以及溶解該可溶解性模仁時,該支撐背板皆可維持該可溶解性模仁之結構,使該可溶解性模仁不產生偏移或形變,使最終壓印出的轉印物件不產生缺陷。 Compared with the prior art, the effect of the present invention is that: since the supporting back plate is bonded to the dissolvable mold core by an adhesive, when the dissolvable mold core is separated from the sample mold; the When the dissolving mold core is in contact with or aligning with the polymer material layer; when a high temperature or pressure is applied to the dissolving mold core; when the frame structure is separated from the supporting backplane; the frame structure and the setting on the frame body structure tape When separated from the supporting backing plate; and when dissolving the dissolving mold core, the supporting backing plate can maintain the structure of the dissolving mold core, so that the dissolving mold core does not produce offset or deformation, so that the final The imprinted transfer object is free of defects.

1:轉印物件 1: Transfer objects

62:基材層 62: substrate layer

11:轉印結構 11: Transfer structure

621:第二對位記號 621: Second alignment mark

12:黏著劑 12: Adhesive

622:穿孔 622: Perforation

2:可溶解性材料 2: Soluble materials

7:機台平台 7: Machine platform

3:樣模 3: Prototype

71:第三對位記號 71: Third registration mark

31:樣模結構 31: Prototype structure

8:攝像元件 8: camera element

32:記號結構 32: Token structure

9:位置調整元件 9: Position adjustment components

4:可溶解性模仁 4: Soluble mold kernel

10:紅外線發射元件 10: Infrared emitting element

41:凹凸結構 41: Concave and convex structure

20:轉印元件 20: Transfer element

42:第一對位記號 42: First alignment mark

201:升溫元件 201: Heating element

5:取模裝置 5: Die-taking device

202:吹氣元件 202: Blow element

51:架體結構 51: Frame structure

30:溶解元件 30: Dissolve Elements

511:支撐部 511: Support Department

301:溶劑 301: Solvent

512:操作部 512: Operation Department

52:膠帶 52: Tape

521:突出部 521: Protrusion

53:支撐背板 53: Support backplane

6:待轉印物件 6: Objects to be transferred

61:高分子材料層 61: polymer material layer

611:第四對位記號 611: Fourth registration mark

圖1至圖5為一系列示意圖,說明本發明的壓印方法,其中:圖1A至1B用以說明本發明之第一步驟;圖2A至2F用以說明本發明之第二步驟;圖3A至3G用以說明本發明之第三步驟;圖4A至4C用以說明本發明之第四步驟;圖5A至5D用以說明本發明之第五步驟。 1 to 5 are a series of schematic diagrams illustrating the imprinting method of the present invention, wherein: Figs. 1A to 1B are used to illustrate the first step of the present invention; Figs. 2A to 2F are used to illustrate the second step of the present invention; Fig. 3A 3G to 3G are used to illustrate the third step of the present invention; FIGS. 4A to 4C are used to illustrate the fourth step of the present invention; FIGS. 5A to 5D are used to illustrate the fifth step of the present invention.

為讓本發明上述及/或其他目的、功效、特徵更明顯易懂,下文特舉較佳實施方式,作詳細說明於下: In order to make the above-mentioned and/or other purposes, effects and features of the present invention more obvious and easy to understand, preferred embodiments are given below, and are described in detail below:

請參看圖1至5,說明本發明之壓印方法,關於本實施方式之方法的詳細步驟說明如下: Please refer to FIGS. 1 to 5 to illustrate the imprinting method of the present invention. The detailed steps of the method of this embodiment are described as follows:

以下圖1A與圖1B說明本發明之第一步驟:於一樣模(3)上形成一可溶解性模仁(4)。 1A and 1B below illustrate the first step of the present invention: forming a dissolvable mold core (4) on the same mold (3).

如圖1A所示,首先,先添加一可溶解性材料(2)至一樣模(3)內,其中樣模(3)具有一樣模結構(31)與一記號結構(32);再固化可溶解性材料(2)以形成一可溶解性模仁(4),模仁(4)具有一對應樣模結構(31)的凹凸結構(41)與一對應記號結構(32)的第一對位記號(42)。較佳地,該 可溶解性材料(2)係選自以下所組成之群組:水溶性聚丙烯醯胺(Polyacrylamide;PAM)、聚氨酯、聚脲、聚醯胺、聚酯、聚胺甲酸酯、聚乙烯基吡咯烷酮、乙烯-乙烯醇、聚丙烯醯胺-乙二醛聚合物、聚丙烯酸、或其結合,但不以此為限。其中該可溶解性材料(2)於樣模(3)的厚度為10至1,000μm,故後續所得之模仁(4)除了具有可溶解特性外,更具有可撓特性。可溶解性材料(2)可採用溶液形式添加至樣模(3)內,其濃度可為溶液的5至50wt%,但不以此為限。若濃度低於此下限值,則會提高凹凸結構(41)的不完整性造成結構缺陷,以致影響壓印品質。此外,可溶解性材料(2)可採用旋轉塗佈(spin coating)或狹縫塗佈(slot die coating)方式添加;於採用旋轉塗佈下,旋轉塗佈的轉速可為100至5,000rpm,但不以此為限。較佳地,樣模(3)材料為矽。 As shown in FIG. 1A , first, a dissolvable material (2) is added to the mold (3), wherein the mold (3) has a mold structure (31) and a mark structure (32); dissolving the material (2) to form a dissolvable mold core (4), the mold core (4) having a first pair of concave-convex structures (41) corresponding to the mold-like structure (31) and a corresponding marking structure (32) Bit notation (42). Preferably, the The soluble material (2) is selected from the group consisting of: water-soluble polyacrylamide (PAM), polyurethane, polyurea, polyamide, polyester, polyurethane, polyvinyl Pyrrolidone, ethylene-vinyl alcohol, polyacrylamide-glyoxal polymer, polyacrylic acid, or a combination thereof, but not limited thereto. The thickness of the dissolvable material (2) in the sample mold (3) is 10 to 1,000 μm, so the mold core (4) obtained subsequently has a flexible characteristic in addition to dissolving properties. The dissolvable material (2) can be added to the sample mold (3) in the form of a solution, and its concentration can be 5 to 50 wt% of the solution, but not limited thereto. If the concentration is lower than this lower limit, the imperfection of the concave-convex structure (41) will increase, resulting in structural defects, thereby affecting the imprint quality. In addition, the dissolvable material (2) may be added by spin coating or slot die coating; in the case of spin coating, the rotational speed of the spin coating may be 100 to 5,000 rpm, But not limited to this. Preferably, the material of the sample (3) is silicon.

如圖1B所示,在該可溶解性材料(2)固化,並形成一可溶解性模仁(4)後,於該可溶解性模仁(4)相對於該樣模(3)之一側形成一黏著劑(12)。可以理解地,該黏著劑(12)形成之方式可為噴霧、塗佈或傾倒,但不以此為限。較佳地,該黏著劑(12)係均勻地形成於該可溶解性模仁(4)相對於該樣模(3)之一側。較佳地,該黏著劑(12)係一種膠體或液體,其種類包含:光固化接著劑、紫外線硬化膠、光熱轉換(Light-to-Heat Conversion,LTHC)膠、熱固膠或可水解型樹酯,但不以此為限。所謂「固化」可為熱固化或光固化(如:紫外光固化);於採用熱固化下,熱固化溫度可為室溫至160℃,熱固化時間可為5至60分鐘,但不以此為限。若時間超過此上限值,則會提高模仁(4)剝離難度而使凹凸結構(41)形成缺陷。 As shown in FIG. 1B, after the dissolvable material (2) is cured and a dissolvable mold core (4) is formed, the dissolvable mold core (4) is relative to one of the sample molds (3). An adhesive (12) is formed on the side. Understandably, the adhesive (12) can be formed by spraying, coating or pouring, but not limited thereto. Preferably, the adhesive (12) is uniformly formed on one side of the dissolvable mold core (4) opposite to the sample mold (3). Preferably, the adhesive (12) is a colloid or liquid, and its types include: light-curing adhesive, UV-curable adhesive, light-to-heat conversion (LTHC) adhesive, thermosetting adhesive or hydrolyzable adhesive resin, but not limited thereto. The so-called "curing" can be thermal curing or light curing (such as: UV curing); in the case of thermal curing, the thermal curing temperature can be room temperature to 160 ℃, and the thermal curing time can be 5 to 60 minutes, but not limited. If the time exceeds this upper limit value, the difficulty of peeling off the mold core (4) will increase, and the concave-convex structure (41) will be defective.

以下圖2A至2F說明本發明之第二步驟:將可溶解性模仁(4)與樣模(3)脫離。 The following Figures 2A to 2F illustrate the second step of the present invention: disengaging the dissolvable mold core (4) from the sample mold (3).

本發明之第一實施態樣如圖2A、2B、與2C所示,首先,提供一取模裝置(5),附著該取模裝置(5)至該黏著劑(12),其中該取模裝置(5)包含:一架體結構(51);以及一支撐背板(53),係設置於該架體結構(51)。本發明之第二實施態樣如圖2D、2E、2F所示,首先,提供一取模裝置(5),附著該取模裝置(5)至該黏著劑(12),其中該取模裝置(5)包含:一架體結構(51);一膠帶(52),係設置於該架體結構(51);以及一支撐背板(53),係設置於該膠帶(52)。較佳地,該取模裝置(5)係以該支撐背板(53)附著於該黏著劑(12),使該支撐背板(53)與該可溶解性模仁(4)透過該黏著劑(12)黏接。較佳地,該架體結構(51)係一環形框,其中該環形框(51)具有一支撐部(511)及一連接支撐部(511)的操作部(512)。較佳地,該支撐背板(53)或該膠帶(52)係設置於該操作部(512)。較佳地,該支撐背板(53)之面積可以完全覆蓋該黏著劑(12)之面積,使該可溶解性模仁(4)可緊密黏接於該支撐背板(53),防止該可溶解性模仁(4)於相對於該樣模(3)移動時因晃動產生偏移或誤差。較佳地,膠帶(52)材料可為熱解離性發泡膠或UV解離性發泡膠,但不以此為限。較佳地,熱解離性發泡膠為聚苯乙烯膠、聚氨酯膠(polyurethane,PU)、或聚苯乙烯膠(polystyrene,PS),其厚度為100至1,000μm。較佳地,該膠帶(52)具有一突出部(521),其中該膠帶(52)係以該突出部(521)設置於該架體結構(51)之操作部(512)。較佳地,該支撐背板(53)具有一突出部(521),其中該支撐背板(53)係以該突出部(521)設置於該架體結構(51)之操作部(512)。 The first embodiment of the present invention is shown in FIGS. 2A, 2B, and 2C. First, a mold-taking device (5) is provided, and the mold-taking device (5) is attached to the adhesive (12), wherein the mold-taking device (5) is attached to the adhesive (12). The device (5) comprises: a frame body structure (51); and a support back plate (53), which is arranged on the frame body structure (51). The second embodiment of the present invention is shown in FIGS. 2D , 2E and 2F. First, a mold taking device (5) is provided, and the mold taking device (5) is attached to the adhesive (12), wherein the mold taking device (5) is attached to the adhesive (12). (5) comprising: a frame body structure (51); an adhesive tape (52) arranged on the frame body structure (51); and a support back plate (53) arranged on the adhesive tape (52). Preferably, the mold taking device (5) is attached to the adhesive (12) by the support back plate (53), so that the support back plate (53) and the dissolvable mold core (4) pass through the adhesion The agent (12) is bonded. Preferably, the frame structure (51) is an annular frame, wherein the annular frame (51) has a support portion (511) and an operation portion (512) connected to the support portion (511). Preferably, the support back plate (53) or the adhesive tape (52) is arranged on the operation part (512). Preferably, the area of the support back plate (53) can completely cover the area of the adhesive (12), so that the dissolvable mold core (4) can be tightly adhered to the support back plate (53), preventing the The dissolvable mold core (4) moves with respect to the sample mold (3), resulting in an offset or error due to shaking. Preferably, the material of the adhesive tape (52) can be thermally dissociable styrofoam or UV dissociable styrofoam, but not limited thereto. Preferably, the thermally dissociable foamed adhesive is polystyrene adhesive, polyurethane adhesive (PU), or polystyrene adhesive (PS), and its thickness is 100 to 1,000 μm. Preferably, the adhesive tape (52) has a protruding portion (521), wherein the adhesive tape (52) is disposed on the operating portion (512) of the frame structure (51) with the protruding portion (521). Preferably, the supporting backboard (53) has a protruding portion (521), wherein the supporting backboard (53) is disposed on the operating portion (512) of the frame structure (51) by the protruding portion (521). .

接著移動取模裝置(5),使該模仁隨著該取模裝置(5)相對於該樣模(3)移動,以使該模仁與該樣模(3)分離。較佳地,可溶解性模仁(4)自樣模(3)離開時可採用正向剝離或側向剝離方式操作環形框(51)的操作部 (512)。 Next, move the mold-taking device (5), so that the mold core moves relative to the sample mold (3) along with the mold-taking device (5), so as to separate the mold core from the sample mold (3). Preferably, when the dissolvable mold core (4) leaves the sample mold (3), the operating portion of the ring frame (51) can be operated in a forward peeling or side peeling manner. (512).

以下圖3A至3G說明本發明之第三步驟:將一可溶解性模仁(4)放置於一高分子材料層(61)上。 3A to 3G below illustrate the third step of the present invention: placing a dissolvable mold core (4) on a polymer material layer (61).

請參照圖3A與3B,於一實施樣態中,先放置待轉印物件(6)的一基材層(62)於一機台平台(7)上,而基材層(62)具有一第二對位記號(621);接著,形成高分子材料層(61)於基材層(62)上;然後,以一設置於取模裝置(5)相反於可溶解性模仁(4)之一側的攝像元件(8)或一設置於機台平台(7)相反於待轉印物件(6)之一側的攝像元件(8)確認模仁(4)的第一對位記號(42)與基材層(62)的第二對位記號(621)是否對齊;以及若對齊,則可溶解性模仁(4)與高分子材料層(61)接觸並進行後續步驟;若未對齊,則利用一位置調整元件(9)以機台平台(7)為X-Y平面調整模仁(4)的X軸與Y軸位置及其於X-Y平面的θ角,直到對齊。請參照圖3C與3D,於另一實施樣態中,先放置待轉印物件(6)的一基材層(62)於一機台平台(7)上,而基材層(62)具有一第二對位記號(621);接著,形成高分子材料層(61)於基材層(62)上;然後,可溶解性模仁(4)與高分子材料層(61)接觸;之後,以一設置於取模裝置(5)相反於可溶解性模仁(4)之一側的攝像元件(8)或一設置於機台平台(7)相反於待轉印物件(6)之一側的攝像元件(8)確認模仁(4)的第一對位記號(42)與基材層(62)的第二對位記號(621)是否對齊;以及若對齊,則進行後續步驟;若未對齊,則利用一位置調整元件(9)以機台平台(7)為X-Y平面調整模仁(4)的X軸與Y軸位置及其於X-Y平面的θ角,直到對齊。請參照圖3E,於又一實施樣態中,先放置待轉印物件(6)的一基材層(62)於一機台平台(7)上,而基材層(62)具有一第二對位記號(621);接著,形成高 分子材料層(61)於基材層(62)上;然後,移動一攝像元件(8)至可溶解性模仁(4)與待轉印物件(6)之間以確認第一對位記號(42)與第二對位記號(621)是否對齊;以及若對齊,則復位攝像元件(8)且可溶解性模仁(4)與高分子材料層(61)接觸,並進行後續步驟;若未對齊,則利用一位置調整元件(9)以機台平台(7)為X-Y平面調整模仁(4)的X軸與Y軸位置及其於X-Y平面的θ角,直到對齊。 3A and 3B, in one embodiment, a substrate layer (62) of the object (6) to be transferred is first placed on a machine platform (7), and the substrate layer (62) has a The second alignment mark (621); then, the polymer material layer (61) is formed on the base material layer (62); An imaging element (8) on one side or an imaging element (8) arranged on the side of the machine platform (7) opposite to the object to be transferred (6) confirms the first alignment mark ( 42) Whether the second alignment mark (621) of the base material layer (62) is aligned; and if aligned, the dissolvable mold core (4) is in contact with the polymer material layer (61) and the subsequent steps are performed; if not To align, use a position adjustment element (9) to adjust the X-axis and Y-axis positions of the mold core (4) and the θ angle on the X-Y plane with the machine platform (7) as the X-Y plane until they are aligned. 3C and 3D, in another embodiment, a substrate layer (62) of the object (6) to be transferred is first placed on a machine platform (7), and the substrate layer (62) has a second alignment mark (621); then, a polymer material layer (61) is formed on the base material layer (62); then, the dissolvable mold core (4) is in contact with the polymer material layer (61); then , with a camera element (8) arranged on the side of the mold taking device (5) opposite to the dissolvable mold core (4) or a camera element (8) arranged on the machine platform (7) opposite to the object to be transferred (6) The imaging element (8) on one side confirms whether the first alignment mark (42) of the mold core (4) and the second alignment mark (621) of the base material layer (62) are aligned; and if they are aligned, proceed to the subsequent steps If it is not aligned, then use a position adjustment element (9) to adjust the X-axis and Y-axis positions of the mold core (4) and its θ angle in the X-Y plane with the machine platform (7) as the X-Y plane until it is aligned. Referring to FIG. 3E, in another embodiment, a substrate layer (62) of the object to be transferred (6) is first placed on a machine platform (7), and the substrate layer (62) has a first Two pair marks (621); then, form a high Molecular material layer (61) on the base material layer (62); then, move a camera element (8) between the dissolvable mold core (4) and the object to be transferred (6) to confirm the first alignment mark (42) whether it is aligned with the second alignment mark (621); and if aligned, reset the imaging element (8) and the dissolvable mold core (4) is in contact with the polymer material layer (61), and perform subsequent steps; If it is not aligned, use a position adjusting element (9) to adjust the X-axis and Y-axis positions of the mold core (4) and the θ angle on the X-Y plane with the machine platform (7) as the X-Y plane until they are aligned.

請參照圖3F,於一實施樣態中,先放置待轉印物件(6)的一基材層(62)於一機台平台(7)上,而機台平台(7)具有一第三對位記號(71);接著,形成高分子材料層(61)於基材層(62)上;之後,以一設置於取模裝置(5)相反於可溶解性模仁(4)之一側的攝像元件(8)或一設置於機台平台(7)相反於待轉印物件(6)之一側的攝像元件(8)確認模仁(4)的第一對位記號(42)與機台平台(7)的第三對位記號(71)是否對齊;以及若對齊,則可溶解性模仁(4)與高分子材料層(61)接觸並進行後續步驟;若未對齊,則利用一位置調整元件(9)以機台平台(7)為X-Y平面調整模仁(4)的X軸與Y軸位置及其於X-Y平面的θ角,直到對齊。於另一實施樣態中,先放置待轉印物件(6)的一基材層(62)於一機台平台(7)上,而機台平台(7)具有一第三對位記號(71);接著,形成高分子材料層(61)於基材層(62)上;然後,可溶解性模仁(4)與高分子材料層(61)接觸;之後,以一設置於取模裝置(5)相反於可溶解性模仁(4)之一側的攝像元件(8)或一設置於機台平台(7)相反於待轉印物件(6)之一側的攝像元件(8)確認模仁(4)的第一對位記號(42)與機台平台(7)的第三對位記號(71)是否對齊;以及若對齊,則進行後續步驟;若未對齊,則利用一位置調整元件(9)以機台平台(7)為X-Y平面調整模仁(4) 的X軸與Y軸位置及其於X-Y平面的θ角,直到對齊。於又一實施樣態中,先放置待轉印物件(6)的一基材層(62)於一機台平台(7)上,而機台平台(7)具有一第三對位記號(71);接著,形成高分子材料層(61)於基材層(62)上;然後,移動一攝像元件(8)至可溶解性模仁(4)與待轉印物件(6)之間以確認第一對位記號(42)與第三對位記號(71)是否對齊;以及若對齊,則復位攝像元件(8)且可溶解性模仁(4)與高分子材料層(61)接觸,並進行後續步驟;若未對齊,則利用一位置調整元件(9)以機台平台(7)為X-Y平面調整模仁(4)的X軸與Y軸位置及其於X-Y平面的θ角,直到對齊。 Referring to FIG. 3F , in one embodiment, a substrate layer (62) of the object to be transferred (6) is first placed on a machine platform (7), and the machine platform (7) has a third Alignment marks (71); then, a polymer material layer (61) is formed on the base material layer (62); after that, a set on the mold-taking device (5) opposite to one of the dissolvable mold cores (4) The imaging element (8) on the side or an imaging element (8) arranged on the side of the machine platform (7) opposite to the object to be transferred (6) confirms the first alignment mark (42) of the mold core (4). Whether it is aligned with the third alignment mark (71) of the machine platform (7); and if aligned, the dissolvable mold core (4) is in contact with the polymer material layer (61) and the subsequent steps are performed; if it is not aligned, Then use a position adjusting element (9) to adjust the X-axis and Y-axis positions of the mold core (4) and the θ angle on the X-Y plane with the machine platform (7) as the X-Y plane until they are aligned. In another embodiment, a substrate layer (62) of the object to be transferred (6) is first placed on a machine platform (7), and the machine platform (7) has a third alignment mark ( 71); then, forming a polymer material layer (61) on the base material layer (62); then, the dissolvable mold core (4) is in contact with the polymer material layer (61); The imaging element (8) of the device (5) opposite to the side of the dissolvable mold core (4) or an imaging element (8) arranged on the side of the machine platform (7) opposite to the object to be transferred (6) ) confirm whether the first alignment mark (42) of the mold core (4) is aligned with the third alignment mark (71) of the machine platform (7); and if aligned, carry out subsequent steps; if not aligned, utilize A position adjusting element (9) adjusts the mold core (4) with the machine platform (7) as the X-Y plane The X-axis and Y-axis positions and their θ angles in the X-Y plane until they are aligned. In yet another embodiment, a substrate layer (62) of the object to be transferred (6) is first placed on a machine platform (7), and the machine platform (7) has a third alignment mark ( 71); then, forming a polymer material layer (61) on the base material layer (62); then, moving an imaging element (8) between the dissolvable mold core (4) and the object to be transferred (6) To confirm whether the first alignment mark (42) and the third alignment mark (71) are aligned; and if they are aligned, reset the imaging element (8) and the dissolvable mold core (4) and the polymer material layer (61) contact, and carry out subsequent steps; if not aligned, use a position adjustment element (9) to adjust the X-axis and Y-axis positions of the mold core (4) and its θ in the X-Y plane with the machine platform (7) as the X-Y plane corners until aligned.

請參照圖3G,於一實施樣態中,先放置待轉印物件(6)的一基材層(62)於一機台平台(7)上;接著,形成高分子材料層(61)於基材層(62)上,而高分子材料層(61)具有一第四對位記號(611);然後,以一設置於取模裝置(5)相反於可溶解性模仁(4)之一側的攝像元件(8)或一設置於機台平台(7)相反於待轉印物件(6)之一側的攝像元件(8)確認模仁(4)的第一對位記號(42)與高分子材料層(61)的第四對位記號(611)是否對齊;以及若對齊,則可溶解性模仁(4)與高分子材料層(61)接觸並進行後續步驟;若未對齊,則利用一位置調整元件(9)以機台平台(7)為X-Y平面調整模仁(4)的X軸與Y軸位置及其於X-Y平面的θ角,直到對齊。於另一實施樣態中,先放置待轉印物件(6)的一基材層(62)於一機台平台(7)上;接著,形成高分子材料層(61)於基材層(62)上,而高分子材料層(61)具有一第四對位記號(611);然後,可溶解性模仁(4)與高分子材料層(61)接觸;之後,以一設置於取模裝置(5)相反於可溶解性模仁(4)之一側的攝像元件(8)或一設置於機台平台(7)相反於待轉印物件(6)之一側的攝像元件(8)確認模仁(4)的第一對 位記號(42)與高分子材料層(61)的第四對位記號(611)是否對齊;以及若對齊,則進行後續步驟;若未對齊,則利用一位置調整元件(9)以機台平台(7)為X-Y平面調整模仁(4)的X軸與Y軸位置及其於X-Y平面的θ角,直到對齊。於又一實施樣態中,先放置待轉印物件(6)的一基材層(62)於一機台平台(7)上;接著,形成高分子材料層(61)於基材層(62)上,而高分子材料層(61)具有一第四對位記號(611);然後,移動一攝像元件(8)至可溶解性模仁(4)與待轉印物件(6)之間以確認第一對位記號(42)與第四對位記號(611)是否對齊;以及若對齊,則復位攝像元件(8)且可溶解性模仁(4)與高分子材料層(61)接觸,並進行後續步驟;若未對齊,則利用一位置調整元件(9)以機台平台(7)為X-Y平面調整模仁(4)的X軸與Y軸位置及其於X-Y平面的θ角,直到對齊。 Referring to FIG. 3G, in one embodiment, a substrate layer (62) of the object (6) to be transferred is first placed on a machine platform (7); then, a polymer material layer (61) is formed on on the base material layer (62), and the polymer material layer (61) has a fourth alignment mark (611); An imaging element (8) on one side or an imaging element (8) arranged on the side of the machine platform (7) opposite to the object to be transferred (6) confirms the first alignment mark (42) of the mold core (4). ) is aligned with the fourth alignment mark (611) of the polymer material layer (61); and if aligned, the dissolvable mold core (4) is in contact with the polymer material layer (61) and the subsequent steps are performed; if not To align, use a position adjustment element (9) to adjust the X-axis and Y-axis positions of the mold core (4) and the θ angle on the X-Y plane with the machine platform (7) as the X-Y plane until they are aligned. In another embodiment, a substrate layer (62) of the object to be transferred (6) is first placed on a machine platform (7); then, a polymer material layer (61) is formed on the substrate layer ( 62), and the polymer material layer (61) has a fourth alignment mark (611); then, the dissolvable mold core (4) is in contact with the polymer material layer (61); An imaging element (8) on the side of the mold device (5) opposite to the dissolvable mold core (4) or an imaging element ( 8) Confirm the first pair of mold kernels (4) Whether the positioning mark (42) and the fourth positioning mark (611) of the polymer material layer (61) are aligned; and if they are aligned, perform subsequent steps; The platform (7) adjusts the X-axis and Y-axis positions of the mold core (4) and the θ angle to the X-Y plane for the X-Y plane until they are aligned. In yet another embodiment, a substrate layer (62) of the object to be transferred (6) is first placed on a machine platform (7); then, a polymer material layer (61) is formed on the substrate layer (7). 62), and the polymer material layer (61) has a fourth alignment mark (611); then, move a camera element (8) to the dissolvable mold core (4) and the object to be transferred (6) time to confirm whether the first alignment mark (42) and the fourth alignment mark (611) are aligned; and if they are aligned, reset the imaging element (8) and the dissolvable mold core (4) and the polymer material layer (61) ) contact, and carry out subsequent steps; if not aligned, then use a position adjustment element (9) to adjust the X-axis and Y-axis positions of the mold core (4) and its position on the X-Y plane with the machine platform (7) as the X-Y plane θ angle until aligned.

更佳者,高分子材料層(61)可採旋轉塗佈方式形成一玻璃轉移溫度低於模仁(4)的高分子材料於基材層(62)上取得;或者亦可先採旋轉塗佈方式形成一玻璃溫度低於模仁(4)的高分子材料於基材層(62)上,再軟烤取得。較佳地,高分子材料的玻璃轉移溫度為20至150℃,旋轉塗佈轉速為1,000至5,000rpm,塗佈厚度為0.05至1,000μm。須說明的是,高分子材料是否進行軟烤依材料特性決定;較佳地,軟烤溫度為80至150℃,軟烤時間為3至5分鐘。除了旋轉塗佈方式外,亦可利用一貼膜元件(圖未示)採用壓模貼片方式形成高分子材料層(61)於基材層(62)上。其中,該第二對位記號(621)可設置於基材層(62)相反於可溶解性模仁(4)的一表面;或設置於相反於機台平台(7)的一表面。基材層(62)的第二對位記號(621)設置於基材層(62)相反於可溶解性模仁(4)的一表面時,基材層(62)可能會干擾攝像元件(8)擷取第一對 位記號(42)與第二對位記號(621)的影像,故基材層(62)更可開設有一穿孔(622)以露出第二對位記號(621)。再者,為便於攝像元件(8)擷取第一對位記號(42)與第二對位記號(621)的影像,基材層(62)較佳地為一透明基材層。其中,該第三對位記號(71)係設置於機台平台(7)。為了避免基材層(62)可能會干擾攝像元件(8)擷取第一對位記號(42)與第三對位記號(71)的影像,故基材層(62)更可開設有一穿孔(622)以露出第三對位記號(71)。再者,為便於攝像元件(8)擷取第一對位記號(42)與第三對位記號(71)的影像,基材層(62)較佳地為一透明基材層。其中,該第四對位記號(611)可設置於高分子材料層(61)相反於可溶解性模仁(4)的一表面;或設置於相反於機台平台(7)的一表面。高分子材料層(61)的第四對位記號(611)設置於基材層(62)相反於可溶解性模仁(4)的一表面時,高分子材料層(61)可能會干擾攝像元件(8)擷取第一對位記號(42)與第四對位記號(611)的影像,故高分子材料層(61)更可開設有一穿孔(622)以露出第四對位記號(611)。再者,為便於攝像元件(8)擷取第一對位記號(42)與第四對位記號(611)的影像,高分子材料層(61)較佳地為一透明高分子材料層。 More preferably, the polymer material layer (61) can be obtained by spin coating to form a polymer material with a glass transition temperature lower than that of the mold core (4) on the base material layer (62); or spin coating can also be used first. A polymer material with a glass temperature lower than that of the mold core (4) is formed on the base material layer (62) by means of cloth, and then soft-baked to obtain it. Preferably, the glass transition temperature of the polymer material is 20 to 150° C., the rotational speed of the spin coating is 1,000 to 5,000 rpm, and the coating thickness is 0.05 to 1,000 μm. It should be noted that whether the polymer material is to be soft-baked depends on the properties of the material; preferably, the soft-bake temperature is 80 to 150° C., and the soft-bake time is 3 to 5 minutes. In addition to the spin coating method, a film sticking element (not shown) can also be used to form the polymer material layer (61) on the base material layer (62) by means of a stamping method. Wherein, the second alignment mark (621) can be arranged on a surface of the base material layer (62) opposite to the dissolvable mold core (4); or arranged on a surface opposite to the machine platform (7). When the second alignment mark (621) of the base material layer (62) is provided on a surface of the base material layer (62) opposite to the dissolvable mold core (4), the base material layer (62) may interfere with the imaging element ( 8) Fetch the first pair The image of the alignment mark (42) and the second alignment mark (621), so the base material layer (62) can be further opened with a through hole (622) to expose the second alignment mark (621). Furthermore, in order to facilitate the camera element (8) to capture the images of the first alignment mark (42) and the second alignment mark (621), the base material layer (62) is preferably a transparent base material layer. Wherein, the third alignment mark (71) is arranged on the machine platform (7). In order to prevent the substrate layer (62) from possibly interfering with the image capture of the first alignment mark (42) and the third alignment mark (71) by the camera element (8), the substrate layer (62) may further have a through hole formed therein (622) to expose the third alignment mark (71). Furthermore, in order to facilitate the imaging element (8) to capture the images of the first alignment mark (42) and the third alignment mark (71), the base material layer (62) is preferably a transparent base material layer. Wherein, the fourth alignment mark (611) can be arranged on a surface of the polymer material layer (61) opposite to the dissolvable mold core (4); or arranged on a surface opposite to the machine platform (7). When the fourth alignment mark (611) of the polymer material layer (61) is disposed on a surface of the base material layer (62) opposite to the dissolvable mold core (4), the polymer material layer (61) may interfere with imaging The element (8) captures the images of the first alignment mark (42) and the fourth alignment mark (611), so the polymer material layer (61) can further open a hole (622) to expose the fourth alignment mark ( 611). Furthermore, in order to facilitate the imaging element (8) to capture the images of the first alignment mark (42) and the fourth alignment mark (611), the polymer material layer (61) is preferably a transparent polymer material layer.

此外,為避免攝像元件(8)擷取第一對位記號(42)與第二對位記號(621)的影像時受光線反射雜訊造成的清晰度不足,更可利用一紅外線發射元件(10)照射第一對位記號(42)與第二對位記號(621);為避免攝像元件(8)擷取第一對位記號(42)與第三對位記號(71)的影像時受光線反射雜訊造成的清晰度不足,更可利用一紅外線發射元件(10)照射第一對位記號(42)與第三對位記號(71);為避免攝像元件(8)擷取第一對位記號(42)與第四對位記號(611)的影像時受光線反射雜訊造成的清晰度不足,更可利用一紅外線發射 元件(10)照射第一對位記號(42)與第四對位記號(611)。而紅外線發射元件(10)可設置於取模裝置(5)相反於可溶解性模仁(4)的一側或設置於機台平台(7)相反於待轉印物件(6)的一側,但不以此為限。 In addition, in order to avoid insufficient clarity caused by light reflection noise when the imaging element (8) captures the images of the first alignment mark (42) and the second alignment mark (621), an infrared emitting element ( 10) Irradiate the first alignment mark (42) and the second alignment mark (621); in order to prevent the camera element (8) from capturing the images of the first alignment mark (42) and the third alignment mark (71) Insufficient clarity caused by light reflection noise, an infrared emitting element (10) can be used to irradiate the first alignment mark (42) and the third alignment mark (71); When the images of the alignment mark (42) and the fourth alignment mark (611) are insufficiently sharp due to light reflection noise, an infrared ray can be used to emit The element (10) is irradiated with the first alignment mark (42) and the fourth alignment mark (611). The infrared emitting element (10) can be arranged on the side of the mold-taking device (5) opposite to the dissolvable mold core (4) or on the side of the machine platform (7) opposite to the object to be transferred (6). , but not limited to this.

圖3F所呈現之實施樣與圖3A至3E所呈現之實施樣,其差異在於:其對位記號位置不同,除此之外,其他操作細節與功效大致上相同,於此不再贅述。圖3G所呈現之實施樣與圖3A至3F所呈現之實施樣,其差異在於:其對位記號與穿孔(622)位置不同,除此之外,其他操作細節與功效大致上相同,於此不再贅述。 The difference between the embodiment shown in FIG. 3F and the embodiment shown in FIGS. 3A to 3E is that the position of the alignment mark is different. Apart from this, other operation details and functions are basically the same, and will not be repeated here. The difference between the embodiment shown in FIG. 3G and the embodiment shown in FIGS. 3A to 3F is that the alignment mark and the position of the perforation ( 622 ) are different. Apart from that, other operation details and functions are basically the same, here No longer.

以下圖4A至4C說明本發明之第四步驟:施予一高溫或壓力於該可溶解性模仁(4),使該高分子材料層(61)固化。 The following FIGS. 4A to 4C illustrate the fourth step of the present invention: applying a high temperature or pressure to the dissolvable mold core (4) to cure the polymer material layer (61).

如圖4A所示,為本步驟之第一實施態樣,利用一轉印元件(20)施予高溫與壓力至可溶解性模仁(4),使高分子材料層(61)具有一對應凹凸結構(41)的轉印結構(11),並於高分子材料層(61)固化後使該架體結構(51)相對於該支撐背板(53)分離。其中,該支撐背板(53)於該高分子材料層(61)固化後;以及該架體結構(51)相對於該支撐背板(53)分離時仍能穩定附著於該可溶解性模仁(4),使該可溶解性模仁(4)維持結構穩定;以及不使第一對位記號(42)偏移而影響高分子材料層(61)之形狀。具體而言,從取模裝置(5)與該高分子材料層(61)接觸前;到該高分子材料之固化過程中;以及該架體結構(51)相對於該支撐背板(53)分離後,該支撐背板(53)係穩定附著於該可溶解性模仁(4),維持其結構穩定。於一實施樣態中,於取模裝置(5)包含架體結構(51)與支撐背板(53)。較佳地,該高溫能使高分子材料層(61)的溫度先達到其玻璃轉移溫度而壓力能使高分子材料層(61)的材料充分地流動至凹凸結構(41)內,之後高溫再使高分 子材料層(61)的材料固化以讓高分子材料層(61)的轉印結構(11)完整地對應凹凸結構(41)。較佳地,施予高溫與壓力的時間為1至20分鐘,但不以此為限。較佳地,高溫溫度為50至160℃,但不以此為限。須說明的是,施予高溫與壓力的時間範圍以及高溫溫度範圍可依高分子材料層(61)的材料決定;整體上,以高分子材料層(61)頂部不溶解而不使轉印結構(11)產生結構缺陷為原則。另外,施予壓力可對可溶解性模仁(4)相反於高分子材料層(61)的一側施予正向壓力;或對可溶解性模仁(4)鄰近於高分子材料層(61)的一側施予負向壓力;或可同時施予正向壓力與負向壓力。較佳地,正向壓力為+20至+600kPa,負向壓力為-10至-101.3kPa,但不以此為限。須說明的是,透過負向壓力可使高分子材料層(61)中受熱逸散的揮發性溶劑(301)抽離以避免殘留於高分子材料層(61)而造成轉印結構(11)產生結構缺陷。又如圖4A所示,轉印元件(20)包含一提供高溫的升溫元件(201)以及一提供壓力的吹氣元件(202),但不以此為限。 As shown in FIG. 4A, in the first embodiment of this step, a transfer element (20) is used to apply high temperature and pressure to the dissolvable mold core (4), so that the polymer material layer (61) has a corresponding The transfer structure (11) of the concave-convex structure (41), and after the polymer material layer (61) is cured, the frame structure (51) is separated from the supporting backplane (53). Wherein, the support backplane (53) is solidified after the polymer material layer (61); and the frame structure (51) can still be stably attached to the dissolvable mold when separated from the support backplane (53). The core (4) is to keep the structure of the dissolvable mold core (4) stable; and the first alignment mark (42) is not displaced to affect the shape of the polymer material layer (61). Specifically, from before the mold-taking device (5) is in contact with the polymer material layer (61); during the curing process of the polymer material; and the frame structure (51) is relative to the support backplane (53) After separation, the support back plate (53) is stably attached to the dissolvable mold core (4) to maintain its structural stability. In one embodiment, the mold taking device (5) includes a frame structure (51) and a supporting backplane (53). Preferably, the high temperature enables the temperature of the polymer material layer (61) to reach its glass transition temperature first, and the pressure enables the material of the polymer material layer (61) to sufficiently flow into the concave-convex structure (41), and then the high temperature can increase the temperature of the polymer material layer (61). make a high score The material of the sub-material layer (61) is cured so that the transfer structure (11) of the polymer material layer (61) completely corresponds to the concave-convex structure (41). Preferably, the time for applying high temperature and pressure is 1 to 20 minutes, but not limited thereto. Preferably, the high temperature is 50 to 160°C, but not limited thereto. It should be noted that the time range for applying high temperature and pressure and the high temperature temperature range can be determined according to the material of the polymer material layer (61); on the whole, the top of the polymer material layer (61) does not dissolve without causing the transfer structure (11) The principle of producing structural defects. In addition, applying pressure may apply a positive pressure to the side of the dissolvable mold core (4) opposite to the polymer material layer (61); or apply a positive pressure to the dissolvable mold core (4) adjacent to the polymer material layer (61). 61) to apply negative pressure; or to apply positive pressure and negative pressure at the same time. Preferably, the positive pressure is +20 to +600 kPa, and the negative pressure is -10 to -101.3 kPa, but not limited thereto. It should be noted that the volatile solvent ( 301 ) in the polymer material layer ( 61 ) that is thermally dissipated by the negative pressure can be extracted to avoid remaining in the polymer material layer ( 61 ) and causing the transfer structure ( 11 ) produce structural defects. Also as shown in FIG. 4A , the transfer element (20) includes a heating element (201) for providing high temperature and a blowing element (202) for providing pressure, but not limited thereto.

如圖4B與4C所示,為本步驟之第二實施態樣。如圖4B所示,利用一轉印元件(20)施予第一高溫與壓力至可溶解性模仁(4),使高分子材料層(61)具有一對應凹凸結構(41)的轉印結構(11)且使支撐背板(53)與膠帶(52)分離。具體而言,於取模裝置(5)包含架體結構(51)與膠帶(52)且膠帶(52)材料為熱解離性發泡膠的條件下,透過膠帶(52)的解離溫度(較佳地為80至150℃)低於第一高溫溫度可使膠帶(52)於第一高溫溫度下解離裂解。此外,第一高溫能使高分子材料層(61)的溫度先達到其玻璃轉移溫度而壓力能使高分子材料層(61)的材料充分地流動至凹凸結構(41)內。較佳地,施予第一高溫與壓力的時間為1至20分鐘,但不以此為限。較佳地,高溫溫度為50至160℃,但 不以此為限。須說明的是,施予第一高溫與壓力的時間範圍以及第一高溫溫度範圍可依高分子材料層(61)的材料決定;整體上,以高分子材料層(61)頂部不溶解不致使轉印結構(11)產生結構缺陷為原則。另外,施予壓力可對可溶解性模仁(4)相反於高分子材料層(61)的一側施予正向壓力;或對可溶解性模仁(4)鄰近於高分子材料層(61)的一側施予負向壓力;或可同時施予正向壓力與負向壓力。較佳地,正向壓力為+20至+600kPa,負向壓力為-10至-101.3kPa,但不以此為限。須說明的是,透過負向壓力可使高分子材料層(61)中受熱逸散的揮發性溶劑(301)抽離以避免殘留於高分子材料層(61)而造成轉印結構(11)產生結構缺陷。更佳者,轉印元件(20)包含一提供第一高溫的升溫元件(201)以及一提供壓力的吹氣元件(202),但不以此為限。 As shown in FIGS. 4B and 4C , the second embodiment of this step is shown. As shown in FIG. 4B, a transfer element (20) is used to apply a first high temperature and pressure to the dissolvable mold core (4), so that the polymer material layer (61) has a corresponding concave-convex structure (41) for transfer printing structure (11) and separate the support backing plate (53) from the tape (52). Specifically, under the condition that the mold-taking device (5) comprises a frame structure (51) and an adhesive tape (52) and the material of the adhesive tape (52) is a thermally dissociable foam adhesive, the dissociation temperature (relatively higher) of the adhesive tape (52) is passed through. It is preferably 80 to 150° C.) lower than the first high temperature temperature, so that the adhesive tape (52) can be dissociated and cracked at the first high temperature temperature. In addition, the first high temperature enables the temperature of the polymer material layer (61) to reach its glass transition temperature first, and the pressure enables the material of the polymer material layer (61) to sufficiently flow into the concave-convex structure (41). Preferably, the time for applying the first high temperature and pressure is 1 to 20 minutes, but not limited thereto. Preferably, the high temperature is 50 to 160°C, but Not limited to this. It should be noted that the time range for applying the first high temperature and pressure and the first high temperature temperature range can be determined according to the material of the polymer material layer (61). The transfer structure (11) produces structural defects as a principle. In addition, applying pressure may apply a positive pressure to the side of the dissolvable mold core (4) opposite to the polymer material layer (61); or apply a positive pressure to the dissolvable mold core (4) adjacent to the polymer material layer (61). 61) to apply negative pressure; or to apply positive pressure and negative pressure at the same time. Preferably, the positive pressure is +20 to +600 kPa, and the negative pressure is -10 to -101.3 kPa, but not limited thereto. It should be noted that the volatile solvent ( 301 ) in the polymer material layer ( 61 ) that is thermally dissipated by the negative pressure can be extracted to avoid remaining in the polymer material layer ( 61 ) and causing the transfer structure ( 11 ) produce structural defects. More preferably, the transfer element (20) includes a heating element (201) for providing a first high temperature and a blowing element (202) for providing pressure, but not limited thereto.

如圖4C所示,利用轉印元件(20)施予第二高溫至可溶解性模仁(4),第二高溫大於第一高溫,使高分子材料層(61)固化。具體而言,第二高溫能使高分子材料層(61)的溫度達到其固化溫度進而使其材料交聯固化。如此一來,可降低高分子材料層(61)的彈性以讓高分子材料層(61)的轉印結構(11)完整地對應凹凸結構(41)。較佳地,第二高溫溫度為120至180℃,但不以此為限。此步驟特別於高分子材料層(61)的材料為熱固性樹脂(如:環氧樹脂(epoxy resin))下進行。詳言之,此步驟可確保置於低於第二高溫的溫度環境下時高分子材料層(61)不會變形。更佳者,第二高溫可由轉印元件(20)的升溫元件(201)提供。其中可以理解地,該支撐背板(53)於施予第一高溫與第二高溫之過程中,皆緊密與該可溶解性模仁(4)黏接,使該可溶解性模仁(4)於加溫過程中維持結構穩定,不產生偏移或形變。 As shown in FIG. 4C , the transfer element (20) is used to apply a second high temperature to the dissolvable mold core (4), and the second high temperature is greater than the first high temperature, so that the polymer material layer (61) is cured. Specifically, the second high temperature can enable the temperature of the polymer material layer (61) to reach its curing temperature so as to cross-link and cure the material. In this way, the elasticity of the polymer material layer (61) can be reduced so that the transfer structure (11) of the polymer material layer (61) can completely correspond to the concave-convex structure (41). Preferably, the second high temperature is 120 to 180° C., but not limited thereto. This step is performed especially when the material of the polymer material layer (61) is a thermosetting resin (eg, epoxy resin). Specifically, this step can ensure that the polymer material layer (61) will not deform when placed in a temperature environment lower than the second high temperature. More preferably, the second high temperature can be provided by the heating element (201) of the transfer element (20). It can be understood that in the process of applying the first high temperature and the second high temperature, the supporting back plate (53) is tightly bonded to the dissolvable mold core (4), so that the dissolvable mold core (4) ) during the heating process to maintain structural stability without offset or deformation.

以下圖5A至5D說明本發明之第五步驟:以一溶劑(301)溶解該 可溶解性模仁,使該固化後之高分子材料層(61)與該支撐背板(53)分離。 The following Figures 5A to 5D illustrate the fifth step of the present invention: dissolving the The dissolvable mold core separates the cured polymer material layer (61) from the support backplane (53).

如圖5A至5D所示,利用一溶解元件(30)提供一溶劑(301)溶解可溶解性模仁(4),使該固化後之高分子材料層(61)與支撐背板(53)分離,以取得具有轉印結構(11)的轉印物件(1)。須說明的是,溶劑(301)種類可依可溶解性模仁(4)的材料而定。較佳地,於可溶解性模仁(4)材料為水溶性聚丙烯醯胺(Polyacrylamide;PAM)、聚氨酯、聚脲、聚醯胺、聚酯、聚胺甲酸酯、聚乙烯基吡咯烷酮、乙烯-乙烯醇、聚丙烯醯胺-乙二醛聚合物、或聚丙烯酸之情況下,溶劑(301)為水,但不以此為限。 As shown in Figs. 5A to 5D, a solvent (301) is provided by a dissolving element (30) to dissolve the dissolvable mold core (4), so that the cured polymer material layer (61) and the supporting back plate (53) are formed. Separation to obtain a transfer object (1) having a transfer structure (11). It should be noted that the type of the solvent ( 301 ) can be determined according to the material of the dissolvable mold core ( 4 ). Preferably, the material of the dissolvable mold core (4) is water-soluble polyacrylamide (PAM), polyurethane, polyurea, polyamide, polyester, polyurethane, polyvinylpyrrolidone, In the case of ethylene-vinyl alcohol, polyacrylamide-glyoxal polymer, or polyacrylic acid, the solvent (301) is water, but not limited thereto.

其中,可於機台平台(7)上以溶劑(301)溶解該可溶解性模仁(4),使該固化後之高分子材料層(61)與支撐背板(53)分離。較佳地,於該高分子材料層(61)之固化步驟後、以及該可溶解性模仁(4)之溶解步驟前,將該架體結構(51)相對於該支撐背板(53)分離。較佳地,於該高分子材料層(61)之固化步驟後、以及該可溶解性模仁(4)之溶解步驟前,將該架體結構(51)以及設置於該架體結構(51)之膠帶(52)相對於該支撐背板(53)分離。較佳地,以該溶劑(301)溶解該可溶解性模仁(4)時,可於機台平台(7)進行,但亦可於機台平台(7)以外的區域進行。具體而言,可將基材層(62)以及設置於該基材層(62)上之固化後之高分子材料層(61)、可溶解性模仁(4)、與支撐背板(53)一同放入一盛裝有溶劑(301)之容器中,以溶劑(301)溶解可溶解性模仁(4),使固化後之高分子材料層(61)與支撐背板(53)分離,以取得一具該轉印結構(11)的轉印物件(1)。 Wherein, the dissolvable mold core (4) can be dissolved with a solvent (301) on the machine platform (7) to separate the cured polymer material layer (61) from the support backplane (53). Preferably, after the curing step of the polymer material layer (61) and before the dissolving step of the dissolvable mold core (4), the frame structure (51) is relative to the support backplane (53) separation. Preferably, after the curing step of the polymer material layer (61) and before the dissolving step of the dissolvable mold core (4), the frame structure (51) is arranged on the frame structure (51) ) of the tape (52) is separated with respect to the support back plate (53). Preferably, when the dissolvable mold core (4) is dissolved with the solvent (301), it can be performed on the machine platform (7), but it can also be performed in an area other than the machine platform (7). Specifically, the base material layer (62), the cured polymer material layer (61), the dissolvable mold core (4), and the supporting back plate (53) disposed on the base material layer (62) ) together into a container containing a solvent (301), dissolve the soluble mold core (4) with the solvent (301), and separate the cured polymer material layer (61) from the support backplane (53), In order to obtain a transfer object (1) with the transfer structure (11).

由於該支撐背板(53)係藉由一黏著劑(12)與該可溶解性模仁(4)黏接,因此,於該可溶解性模仁(4)與該樣模(3)分離時;該可溶解性模仁(4)與該高分子材料層(61)接觸或對位時;施予一高溫或壓力於該可溶解性模仁(4)時; 架體結構(51)相對於支撐背板(53)分離時;架體結構(51)以及設置於該架體結構(51)之膠帶(52)相對於該支撐背板(53)分離時;以及溶解該可溶解性模仁(4)時,該支撐背板(53)皆可維持該可溶解性模仁(4)之結構,使該可溶解性模仁(4)不產生偏移或形變,使最終壓印出的轉印物件(1)不產生缺陷。 Since the support back plate (53) is bonded with the dissolvable mold core (4) by an adhesive (12), the dissolvable mold core (4) is separated from the sample mold (3) when the dissolvable mold core (4) is in contact with or aligned with the polymer material layer (61); when a high temperature or pressure is applied to the dissolvable mold core (4); When the frame body structure (51) is separated from the support backplane (53); when the frame body structure (51) and the adhesive tape (52) arranged on the frame body structure (51) are separated from the support backboard (53); And when dissolving the dissolvable mold core (4), the support back plate (53) can maintain the structure of the dissolvable mold core (4), so that the dissolvable mold core (4) does not produce offset or Deformation, so that the final imprinted transfer object (1) does not produce defects.

惟以上所述者,僅為本發明之較佳實施例,但不能以此限定本發明實施之範圍;故,凡依本發明申請專利範圍及發明說明書內容所作之簡單的等效改變與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above are only preferred embodiments of the present invention, but cannot limit the scope of implementation of the present invention; therefore, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the description of the invention, All still fall within the scope of the patent of the present invention.

4:可溶解性模仁 4: Soluble mold kernel

42:第一對位記號 42: First alignment mark

6:待轉印物件 6: Objects to be transferred

61:高分子材料層 61: polymer material layer

62:基材層 62: substrate layer

621:第二對位記號 621: Second alignment mark

622:穿孔 622: Perforation

7:機台平台 7: Machine platform

8:攝像元件 8: camera element

9:位置調整元件 9: Position adjustment components

10:紅外線發射元件 10: Infrared emitting element

12:黏著劑 12: Adhesive

51:架體結構 51: Frame structure

53:支撐背板 53: Support backplane

Claims (7)

一種壓印方法,係包括:添加一可溶解性材料至一樣模內;固化該可溶解性材料以形成一可溶解性模仁,該模仁具有一凹凸結構;於該模仁相對於該樣模之一側形成一黏著劑;附著一取模裝置於該黏著劑,其中該取模裝置包含:一架體結構;一膠帶,其係設置於該架體結構;以及一支撐背板,其係設置於該膠帶,其中該取模裝置係以該支撐背板與該黏著劑相接觸;將該取模裝置相對於該樣模分離,其中該可溶解性模仁係隨著該取模裝置相對於該樣模分離;放置該可溶解性模仁於一高分子材料層上;施予第一高溫與壓力至該可溶解性模仁,使該高分子材料層具有一對應該凹凸結構的轉印結構,並使該支撐背板與該膠帶分離,其中:該第一高溫為50至160℃;施予第二高溫至該可溶解性模仁,其中:該第二高溫為120至180℃,並且該第二高溫大於該第一高溫,使該高分子材料層固化;以及提供一溶劑溶解該可溶解性模仁,使該固化後之高分子材料層與該支撐背板分離以取得一具該轉印結構的轉印物件。 An imprinting method, comprising: adding a dissolvable material into a mold; curing the dissolvable material to form a dissolvable mold core, the mold core having a concave-convex structure; An adhesive is formed on one side of the mold; a mold-taking device is attached to the adhesive, wherein the mold-taking device comprises: a frame structure; an adhesive tape, which is arranged on the frame structure; and a support back plate, which is arranged on the adhesive tape, wherein the mold-taking device is in contact with the adhesive with the support back plate; the mold-taking device is separated from the sample mold, wherein the dissolvable mold core is accompanied by the mold-taking device Separate relative to the sample mold; place the dissolvable mold core on a polymer material layer; apply a first high temperature and pressure to the dissolvable mold core, so that the polymer material layer has a corresponding concave-convex structure. transfer the structure and separate the support back plate from the adhesive tape, wherein: the first high temperature is 50 to 160°C; a second high temperature is applied to the dissolvable mold core, wherein: the second high temperature is 120 to 180°C ℃, and the second high temperature is higher than the first high temperature, so that the polymer material layer is cured; and a solvent is provided to dissolve the soluble mold core, so that the cured polymer material layer is separated from the support backplane to obtain A transfer object with the transfer structure. 如請求項1所述之壓印方法,其中該可溶解性模仁具有一第一對位 記號,而該放置模仁於高分子材料層上的步驟包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該基材層具有一第二對位記號;以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第二對位記號是否對齊;以及若對齊,則該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該可溶解性模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第二對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該基材層具有一第二對位記號;該可溶解性模仁與該高分子材料層接觸;以及以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第二對位記號是否對齊;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第二對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該基材層具有一第二對位記號;移動一攝像元件至該可溶解性模仁與該待轉印物件之間以確認該第一對位記號與該第二對位記號是否對齊;以及 若對齊,則復位該攝像元件且該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第二對位記號對齊。 The imprinting method of claim 1, wherein the dissolvable mold core has a first alignment mark, and the step of placing the mold core on the polymer material layer comprises: placing a to-be-transferred object on a machine platform, the to-be-transferred object having a substrate layer on the polymer material layer and the machine Between the platforms, the base material layer has a second alignment mark; a camera element arranged on the side of the mold-taking device opposite to the dissolvable mold core or a camera element arranged on the machine platform opposite to the to-be-turned The imaging element on one side of the printed object confirms whether the first alignment mark and the second alignment mark are aligned; and if they are aligned, the dissolvable mold core is in contact with the polymer material layer; if they are not aligned, use The machine platform adjusts the X-axis and Y-axis of the dissolvable mold core and its θ angle in the X-Y plane for the X-Y plane until the first alignment mark is aligned with the second alignment mark; the mold core is placed at The step on the polymer material layer may include: placing an object to be transferred on a machine platform, the object to be transferred has a base material layer between the polymer material layer and the machine platform, the base material The layer has a second alignment mark; the dissolving mold core is in contact with the polymer material layer; The imaging element on the side of the machine platform opposite to the object to be transferred confirms whether the first alignment mark and the second alignment mark are aligned; if not, adjust the mold core with the machine platform as the X-Y plane The X axis and the Y axis and the θ angle of the X-Y plane until the first alignment mark is aligned with the second alignment mark; the step of placing the mold core on the polymer material layer may include: placing a to-be-turned printing an object on a machine platform, the object to be transferred has a base material layer between the polymer material layer and the machine platform, the base material layer has a second alignment mark; moving a camera element to Confirm whether the first alignment mark and the second alignment mark are aligned between the dissolvable mold core and the object to be transferred; and If it is aligned, reset the camera element and the dissolvable mold core is in contact with the polymer material layer; if not, adjust the X-axis and Y-axis of the mold core and the X-Y axis of the mold core with the machine platform as the X-Y plane. Theta angle of the plane until the first registration mark is aligned with the second registration mark. 如請求項1所述之壓印方法,其中該可溶解性模仁具有一第一對位記號,而該放置模仁於高分子材料層上的步驟包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該機台平台具有一第三對位記號;以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第三對位記號是否對齊;以及若對齊,則該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第三對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該機台平台具有一第三對位記號;該可溶解性模仁與該高分子材料層接觸;以及以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第三對位記號是否對齊;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第三對位記號對齊;該放置模仁於高分子材料層上的步驟或包含: 放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該機台平台具有一第三對位記號;移動一攝像元件至該可溶解性模仁與該待轉印物件之間以確認該第一對位記號與該第三對位記號是否對齊;以及若對齊,則復位該攝像元件且該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第三對位記號對齊。 The imprinting method of claim 1, wherein the dissolvable mold core has a first alignment mark, and the step of placing the mold core on the polymer material layer comprises: placing an object to be transferred on a machine On the stage platform, the object to be transferred has a base material layer between the polymer material layer and the machine platform, and the machine platform has a third alignment mark; a set on the mold-taking device is opposite to An imaging element on one side of the dissolvable mold core or an imaging element disposed on a side of the machine platform opposite to the object to be transferred confirms whether the first alignment mark and the third alignment mark are aligned; and If it is aligned, the dissolvable mold core is in contact with the polymer material layer; if it is not aligned, the X-axis and Y-axis of the mold core and the θ angle on the X-Y plane are adjusted with the machine platform as the X-Y plane. Until the first alignment mark is aligned with the third alignment mark; the step of placing the mold core on the polymer material layer may include: placing a to-be-transferred object on a machine platform, the to-be-transferred object has A base material layer is between the polymer material layer and the machine platform, the machine platform has a third alignment mark; the dissolvable mold core is in contact with the polymer material layer; and a A camera element on the side of the mold-taking device opposite to the dissolvable mold core or a camera element disposed on the side of the machine platform opposite to the object to be transferred confirms the first alignment mark and the third alignment mark Whether the marks are aligned; if not, use the machine platform as the X-Y plane to adjust the X-axis and Y-axis of the mold core and its θ angle on the X-Y plane until the first alignment mark and the third alignment mark Alignment; the step of placing the mold core on the polymer material layer may include: placing an object to be transferred on a machine platform, the object to be transferred has a base material layer between the polymer material layer and the machine platform, the machine platform has a third alignment mark; moving An imaging element is placed between the dissolvable mold core and the object to be transferred to confirm whether the first alignment mark and the third alignment mark are aligned; and if they are aligned, reset the imaging element and the dissolvability The mold core is in contact with the polymer material layer; if it is not aligned, use the machine platform as the X-Y plane to adjust the X-axis and Y-axis of the mold core and the θ angle on the X-Y plane until the first alignment mark and The third alignment mark is aligned. 如請求項1所述之壓印方法,其中該可溶解性模仁具有一第一對位記號,而該放置模仁於高分子材料層上的步驟包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該高分子材料層具有一第四對位記號;以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第四對位記號是否對齊;以及若對齊,則該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該可溶解性模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第四對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該高分子材料層具有一第四對位記號;該可溶解性模仁與該高分子材料層接觸;以及以一設置於該取模裝置相反於該可溶解性模仁之一側的攝像元件或一設置 於該機台平台相反於該待轉印物件之一側的攝像元件確認該第一對位記號與該第四對位記號是否對齊;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第四對位記號對齊;該放置模仁於高分子材料層上的步驟或包含:放置一待轉印物件於一機台平台上,該待轉印物件具有一基材層於該高分子材料層與該機台平台之間,該高分子材料層具有一第四對位記號;移動一攝像元件至該可溶解性模仁與該待轉印物件之間以確認該第一對位記號與該第四對位記號是否對齊;以及若對齊,則復位該攝像元件且該可溶解性模仁與該高分子材料層接觸;若未對齊,則以該機台平台為X-Y平面調整該模仁的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號與該第四對位記號對齊。 The imprinting method of claim 1, wherein the dissolvable mold core has a first alignment mark, and the step of placing the mold core on the polymer material layer comprises: placing an object to be transferred on a machine On the table platform, the object to be transferred has a base material layer between the polymer material layer and the machine platform, and the polymer material layer has a fourth alignment mark; on the other hand, the object to be transferred has a fourth alignment mark. An imaging element on one side of the dissolvable mold core or an imaging element disposed on a side of the machine platform opposite to the object to be transferred confirms whether the first alignment mark and the fourth alignment mark are aligned; And if it is aligned, the dissolvable mold core is in contact with the polymer material layer; if it is not aligned, the X-axis and the Y-axis of the dissolvable mold core are adjusted with the machine platform as the X-Y plane and their alignment on the X-Y plane θ angle until the first alignment mark is aligned with the fourth alignment mark; the step of placing the mold core on the polymer material layer may include: placing a to-be-transferred object on a machine platform, the to-be-transferred object The transfer object has a base material layer between the polymer material layer and the machine platform, the polymer material layer has a fourth alignment mark; the dissolvable mold core is in contact with the polymer material layer; and With a camera element or a device disposed on the side of the mold-taking device opposite to the dissolvable mold core The imaging element on the side of the machine platform opposite to the object to be transferred confirms whether the first alignment mark and the fourth alignment mark are aligned; if they are not aligned, use the machine platform as the X-Y plane to adjust the The X axis and the Y axis of the mold core and the θ angle on the X-Y plane until the first alignment mark is aligned with the fourth alignment mark; the step of placing the mold core on the polymer material layer may include: placing a The object to be transferred is placed on a machine platform, the object to be transferred has a base material layer between the polymer material layer and the machine platform, and the polymer material layer has a fourth alignment mark; moving a The imaging element is placed between the dissolvable mold core and the object to be transferred to confirm whether the first alignment mark and the fourth alignment mark are aligned; and if they are aligned, reset the imaging element and the dissolvable mold The kernel is in contact with the polymer material layer; if it is not aligned, adjust the X-axis and Y-axis of the mold kernel and the θ angle on the X-Y plane with the machine platform as the X-Y plane, until the first alignment mark and the The fourth registration mark is aligned. 一種壓印系統,係包括:一機台平台,係用以供一待轉印物件、一可溶解性模仁、與一取模裝置放置,該待轉印物件具有一基材層以及一設置於該基材層上的高分子材料層,該模仁放置於該待轉印物件的高分子材料層上且具有一凹凸結構及一第一對位記號,該取模裝置黏附於該模仁,其中該基材層具有一第二對位記號、該機台平台具有一第三對位記號、或該高分子材料層具有一第四對位記號;以及一攝像元件,係用以確認該第一對位記號與該第二對位記號是否對齊、該第一對位記號與該第三對位記號是否對齊、或該第一對位記號與該第四對位記號是否對齊。 An imprinting system includes: a machine platform for placing an object to be transferred, a dissolvable mold core, and a mold taking device, the object to be transferred has a base material layer and a setting The polymer material layer on the base material layer, the mold core is placed on the polymer material layer of the object to be transferred and has a concave-convex structure and a first alignment mark, the mold taking device is attached to the mold core , wherein the base material layer has a second alignment mark, the machine platform has a third alignment mark, or the polymer material layer has a fourth alignment mark; and a camera element is used to confirm the Whether the first alignment mark is aligned with the second alignment mark, the first alignment mark is aligned with the third alignment mark, or the first alignment mark is aligned with the fourth alignment mark. 如請求項5所述之壓印系統,另包含:一紅外線發射元件,其發射一紅外線照射該第一對位記號與該第二對位記 號、該第一對位記號與該第三對位記號、或該第一對位記號與該第四對位記號,以確認兩者是否對齊。 The imprinting system according to claim 5, further comprising: an infrared emitting element, which emits an infrared ray to irradiate the first alignment mark and the second alignment mark mark, the first alignment mark and the third alignment mark, or the first alignment mark and the fourth alignment mark, to confirm whether the two are aligned. 如請求項5所述之壓印系統,其中該攝像元件為設置於該取模裝置相反於該可溶解性模仁的一側或設置於該機台平台相反於該待轉印物件的一側;或該攝像元件為配置以移動至該可溶解性模仁與該待轉印物件之間後復位。 The imprinting system as claimed in claim 5, wherein the imaging element is disposed on a side of the mold-taking device opposite to the dissolvable mold core or on a side of the machine platform opposite to the object to be transferred ; or the imaging element is configured to move between the dissolvable mold core and the object to be transferred and then reset.
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