TWI837607B - Method for large scale imprinting - Google Patents

Abstract

The present invention relates to a method for large scale imprinting comprising: an adding step at which a soluble material is added to a master mold to form a soluble mold, wherein the soluble mold has a concave-convex pattern; a forming step at which an adhesive layer is formed on a side of the soluble mold opposite to the master mold; a picking step at which a picking device contacts with the adhesive layer, wherein the picking device comprises a frame and a support plate positioned on the frame, and the support plate is contacted with the adhesive layer; a separating step at which the taking device is removed along with the soluble mold from the master mold; a contacting step at which the soluble mold contacts with a polymer layer; an imprinting step at which a high temperature and a pressure are applied to the soluble mold so as to create an imprint pattern corresponding the concave-convex pattern on the polymer layer and to solidify the polymer layer; a dissolving step at which a solvent is provided to dissolve the soluble mold so as to obtain the imprint pattern.

Description

Methods for large-scale embossing

The present invention relates to an embossing method, in particular to an embossing method that can perform embossing continuously and use a solvent to remove the mold after the embossing is completed.

The method of forming a printed pattern on a substrate using a mold is called "embossing", and the embossing method can be divided into "hot embossing" and "photoembossing" according to the processing method. Specifically, the hot embossing method includes: embossing a film on a polymer resin whose temperature reaches above the glass transition temperature; and after the polymer resin is cooled to the glass transition temperature, separating the mold from the polymer resin, so that a transfer structure corresponding to the microstructure on the mold is formed on the polymer resin. Specifically, the hot embossing method can refer to the content described in S.Chou et al., Appl.Phys.Lett.67,3114(1995), which uses a thermoplastic resin as a processing material; and the photoembossing method can refer to the content described in J.Haisma et al., J.Vac.Sci.Technol.B 14(6),4124(1996), which uses a hardened composition as a processing object.

The so-called "mold release" is the process of separating the mold from the transfer object. During the embossing process, the mold and the polymer material will be separated. Therefore, the mold release performance has a significant impact on the mold release process and the embossing quality, and has a significant impact on the subsequent mold maintenance or the integrity of the transfer structure. Specifically, U.S. Patent Publication No. US6,849,558B2 and U.S. Patent Publication No. US2006/0249886A1 both propose a mold that can be dissolved by a solvent. This soluble mold is obtained by pouring a soluble material into the sample mold and solidifying it, and then using a preform to remove the mold from the sample mold. According to Journal of Vacuum Science & Technology B 21,2961(2003), the preform and the soluble material are made of the same material and are attached to the soluble material before the soluble material is completely cured. Generally speaking, the concentration and thickness of the soluble material will affect the curing time, so the degree to which the preform can be attached after the soluble material is cured tests the expertise and experience of the operator. According to M.W.Lin et al.,J.Micro/Nanolith.MEMS MOEMS 7(3),033005(2008), the curing composition contains fluorine-containing monomer molecules or non-reactive fluorine-containing compounds to improve its demolding properties.

The so-called "molecular transfer lithography" is to use exposure and development to depict geometric structures on the photoresist layer, and then transfer the pattern on the mask to the substrate through the etching process. It can accurately control the shape and size of the formed pattern and is an important process in the semiconductor field. According to Nanotechnology 24 (2013) 085302 (6pp), although the mold is also a soluble mold, the mold is evenly placed on the object by using a roller method, which causes the subsequent microstructure spacing to expand and deform.

The problem that this invention aims to solve is to provide a stamping method that can perform stamping continuously with one mold to obtain large-scale transfer objects.

To solve the above-mentioned problem, the present invention provides a method for large-scale stamping, which includes: an adding step, adding a soluble material into a first sample mold and a second sample mold, and curing the soluble material to form a first soluble mold core in the first sample mold, wherein the first soluble mold core has a first concave-convex structure; and forming a second soluble mold core in the second sample mold, wherein the second soluble mold core has a second concave-convex structure; a forming step, forming a first adhesive layer on one side of the first soluble mold core relative to the first sample mold; and forming a second adhesive layer on one side of the second soluble mold core relative to the second sample mold; The molding step comprises: attaching a first molding device to a side of the first adhesive layer opposite to the first sample mold, wherein the first molding device comprises: a first frame structure; a first adhesive tape, which is arranged on the first frame structure; and a first supporting back plate, which is arranged on the first adhesive tape, wherein the first molding device is in contact with the first adhesive layer with the first supporting back plate; and attaching a second molding device to a side of the second adhesive layer opposite to the second sample mold, wherein the second molding device comprises: a second frame structure; a second adhesive tape, which is arranged on the second frame structure; and a second supporting back plate, which is arranged on the second adhesive tape, wherein the second molding device The second supporting back plate is in contact with the second adhesive layer; a separation step includes: separating the first mold device relative to the first sample mold, wherein the first soluble mold core is separated from the first sample mold along with the first mold device; and separating the second mold device relative to the second sample mold, wherein the second soluble mold core is separated from the second sample mold along with the second mold device; a contact step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; an embossing step includes: applying a first high temperature to the polymer material layer; and applying a pressure to the first soluble mold core. , and the second soluble mold, so that the polymer material layer has a first transfer structure corresponding to the first concave-convex structure; and a second transfer structure corresponding to the second concave-convex structure; and the first supporting back plate is separated from the first tape; and the second supporting back plate is separated from the second tape, and a second high temperature is applied to the polymer material layer to solidify the polymer material layer, wherein the first high temperature is different from the second high temperature; and a dissolving step is provided, which is to provide a solvent to dissolve the first soluble mold and the second soluble mold, so that the solidified polymer material layer is separated from the first supporting back plate and the second supporting back plate to obtain a transfer object.

The present invention also provides a method for large-scale stamping, which includes: an adding step, adding a soluble material into a first sample mold and a second sample mold, and curing the soluble material to form a first soluble mold core in the first sample mold, wherein the first soluble mold core has a first concave-convex structure; and forming a second soluble mold core in the second sample mold, wherein the second soluble mold core has a second concave-convex structure; a forming step, forming a first adhesive layer on a side of the first soluble mold core relative to the first sample mold; and forming a second adhesive layer on a side of the second soluble mold core relative to the second sample mold; a demolding step, The invention comprises: attaching a first molding device to a side of the first adhesive layer opposite to the first sample mold, wherein the first molding device comprises: a first frame structure; a first adhesive tape, which is arranged on the first frame structure; and a first supporting back plate, which is arranged on the first adhesive tape, wherein the first molding device is in contact with the first adhesive layer with the first supporting back plate; and attaching a second molding device to a side of the second adhesive layer opposite to the second sample mold, wherein the second molding device comprises: a second frame structure; a second adhesive tape, which is arranged on the second frame structure; and a second supporting back plate, which is arranged on the second adhesive tape, wherein the second molding device is in contact with the first adhesive layer with the first supporting back plate. The second supporting back plate is in contact with the second adhesive layer; a separation step includes: separating the first mold taking device from the first sample mold, wherein the first soluble mold core is separated from the first sample mold along with the first mold taking device; and separating the second mold taking device from the second sample mold, wherein the second soluble mold core is separated from the second sample mold along with the second mold taking device; a contact step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; an embossing step includes: applying a first high temperature to the polymer material layer; and applying a pressure to the first soluble mold core, and the second soluble mold, so that the polymer material layer has a first transfer structure corresponding to the first concavo-convex structure; and a second transfer structure corresponding to the second concavo-convex structure; and the first supporting back plate is separated from the first adhesive layer; and the second supporting back plate is separated from the second adhesive layer, and a second high temperature is applied to the polymer material layer to solidify the polymer material layer, wherein the first high temperature is different from the second high temperature; and a dissolving step is provided, which is to provide a solvent to dissolve the first soluble mold and the second soluble mold, so that the solidified polymer material layer is separated from the first adhesive layer and the second adhesive layer to obtain a transfer object.

The present invention further provides a method for large-scale stamping, which includes: an adding step, which is to add a soluble material into a first sample mold and a second sample mold, and solidify the soluble material to form a first soluble mold core in the first sample mold, wherein the first soluble mold core has a first concave-convex structure; and to form a second soluble mold core in the second sample mold, wherein the second soluble mold core has a second concave-convex structure; a forming step, which is to form a first adhesive layer on one side of the first soluble mold core relative to the first sample mold; and a second adhesive layer on one side of the second soluble mold core relative to the second sample mold; a mold removal step, which includes: attaching A first molding device is attached to a side of the first adhesive layer opposite to the first sample mold, wherein the first molding device includes: a first frame structure; a first tape, which is arranged on the first frame structure; and a first supporting back plate, which is arranged on the first tape, wherein the first molding device is in contact with the first adhesive layer with a side of the first tape opposite to the first supporting back plate; and a second molding device is attached to a side of the second adhesive layer opposite to the second sample mold, wherein the second molding device includes: a second frame structure; a second tape, which is arranged on the second frame structure; and a second supporting back plate, which is arranged on the second tape, wherein the second molding device is The second adhesive layer is contacted with one side of the second adhesive tape relative to the second supporting back plate; a separation step includes: separating the first mold device relative to the first sample mold, wherein the first soluble mold core is separated from the first sample mold along with the first mold device; and separating the second mold device relative to the second sample mold, wherein the second soluble mold core is separated from the second sample mold along with the second mold device; a contact step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; an embossing step includes: applying a first high temperature to the polymer material layer; and applying a pressure to the first high temperature layer. A soluble mold and a second soluble mold are provided to make the polymer material layer have a first transfer structure corresponding to the first concave-convex structure; and a second transfer structure corresponding to the second concave-convex structure; and the first tape is separated from the first adhesive layer; and the second tape is separated from the second adhesive layer, and a second high temperature is applied to the polymer material layer to solidify the polymer material layer, wherein the first high temperature is different from the second high temperature; and a dissolving step is provided to dissolve the first soluble mold and the second soluble mold, so that the solidified polymer material layer is separated from the first adhesive layer and the second adhesive layer to obtain a transfer object.

More preferably, it further comprises: a peeling step, which is to peel the first adhesive layer from the surface of the first soluble mold after the embossing step and before the dissolving step; and peel the second adhesive layer from the surface of the second soluble mold.

The present invention further provides a method for large-scale stamping, which includes: an adding step, adding a soluble material into a first sample mold and a second sample mold, and curing the soluble material to form a first soluble mold core in the first sample mold, wherein the first soluble mold core has a first concave-convex structure; and forming a second soluble mold core in the second sample mold, wherein the second soluble mold core has a second concave-convex structure; a forming step, forming a first adhesive layer on one side of the first soluble mold core relative to the first sample mold; and forming a second adhesive layer on one side of the second soluble mold core relative to the second sample mold; The molding step includes: attaching a first molding device to a side of the first adhesive layer opposite to the first sample mold, wherein the first molding device includes: a first frame structure; a first adhesive tape, which is arranged on the first frame structure; and a first supporting back plate, which is arranged on the first adhesive tape, wherein the first molding device is in contact with the first adhesive layer with the first supporting back plate; and attaching a second molding device to a side of the second adhesive layer opposite to the second sample mold, wherein the second molding device includes: a second frame structure; a second adhesive tape, which is arranged on the second frame structure; and a second supporting back plate, which is arranged on the second adhesive tape. The second mold taking device is in contact with the second adhesive layer with the second supporting back plate; a separation step includes: separating the first mold taking device from the first sample mold, wherein the first soluble mold core is separated from the first sample mold along with the first mold taking device; and separating the second mold taking device from the second sample mold, wherein the second soluble mold core is separated from the second sample mold along with the second mold taking device; a contact step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; an embossing step includes: applying a pressure to the first soluble mold core, The polymer material layer is provided with a first transfer structure corresponding to the first concavo-convex structure; and the second soluble mold is provided with a second transfer structure corresponding to the second concavo-convex structure; and the polymer material layer is irradiated with UV light to solidify the polymer material layer, and the first supporting back plate is separated from the first adhesive tape; and the second supporting back plate is separated from the second adhesive tape; and a dissolving step is provided, which is to provide a solvent to dissolve the first soluble mold and the second soluble mold, so that the cured polymer material layer is separated from the first supporting back plate and the second supporting back plate to obtain a transfer object.

More preferably, the polymer material layer is formed on a substrate layer, and the contacting step comprises: firstly, heating the first soluble mold core to a temperature T, wherein 0<T<Tg, and bringing the first soluble mold core into contact with the polymer material layer; secondly, heating the second soluble mold core to the temperature T, and bringing the second soluble mold core into contact with the polymer material layer; the contacting step may comprise: firstly, heating the substrate layer to a temperature T, wherein 0<T<Tg, and bringing the first soluble mold core into contact with the polymer material layer; The soluble mold core contacts the polymer material layer; then: the second soluble mold core contacts the polymer material layer; and the contacting step may include: first: heating the portion of the substrate layer corresponding to the first soluble mold core to a temperature T, where 0<T<Tg, and contacting the first soluble mold core to the polymer material layer; then: heating the portion of the substrate layer corresponding to the second soluble mold core to the temperature T, and contacting the second soluble mold core to the polymer material layer.

Preferably, the polymer material layer is formed on a substrate layer, and the embossing step includes: applying the first high temperature and the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; after forming the first transfer structure, applying the first high temperature and the pressure to the second soluble mold so that the polymer material layer has the second transfer structure; after forming the second transfer structure, separating the first supporting back plate from the first tape; and separating the second supporting back plate from the second tape; and applying the second high temperature to the first soluble mold and the second soluble mold; to the substrate layer and the The first soluble mold core is applied to the substrate layer to cure the polymer material layer; the embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core to make the polymer material layer have the first transfer structure; after the first transfer structure is formed, applying the pressure to the second soluble mold core to make the polymer material layer have the second transfer structure; separating the first supporting back plate from the first tape; and separating the second supporting back plate from the second tape; and applying the second high temperature to the first soluble mold core; The embossing step may include: applying the first high temperature to the position of the substrate layer corresponding to the first soluble mold core and the second soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the polymer material layer is solidified; the embossing step may include: applying the first high temperature to the position of the substrate layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, applying the first high temperature to the position of the substrate layer corresponding to the second soluble mold core; and applying the pressure to the second soluble mold core, so that the high The polymer material layer has the second transfer structure; the first supporting back plate is separated from the first tape; and the second supporting back plate is separated from the second tape; and the second high temperature is applied to the first soluble mold and the second soluble mold; to the position of the substrate layer corresponding to the first soluble mold, and the position of the substrate layer corresponding to the second soluble mold; or to the substrate layer, so that the polymer material layer is cured; the embossing step may include: applying the first high temperature and the pressure to the first soluble mold so that the polymer material layer has the first transfer structure, and separating the first supporting back plate from the first tape ; and applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and applying the first high temperature and the pressure to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second tape; and applying the second high temperature to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified. The embossing step may include: first: applying the first high temperature to the portion of the substrate layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and the first supporting back plate is separated from the first tape; then: applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is cured; and first: applying the first high temperature to the portion of the substrate layer corresponding to the second soluble mold core; and applying the pressure The method comprises: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core so that the polymer material layer has the second transfer structure and the second supporting back plate is separated from the second tape; applying the second high temperature to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified; and the embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure and the first supporting back plate is separated from the first tape; and applying the second high temperature to the substrate layer; The first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and the first high temperature is applied to the substrate layer; the pressure is applied to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second adhesive tape; and the second high temperature is applied to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified.

More preferably, the polymer material layer is formed on a substrate layer, and the embossing step includes: applying the first high temperature and the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; after forming the first transfer structure, applying the first high temperature and the pressure to the second soluble mold so that the polymer material layer has the second transfer structure; after forming the second transfer structure, separating the first supporting back plate from the first adhesive layer; and separating the second supporting back plate from the second adhesive layer; and applying the second high temperature to the first soluble mold and the second soluble mold; to the substrate layer and the second transfer structure; The first soluble mold core is applied to the substrate layer to cure the polymer material layer; the embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core to make the polymer material layer have the first transfer structure; after the first transfer structure is formed, applying the pressure to the second soluble mold core to make the polymer material layer have the second transfer structure; separating the first supporting back plate from the first adhesive layer; and separating the second supporting back plate from the second adhesive layer; and applying the second high temperature to the first soluble mold core; The first soluble mold core and the second soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the polymer material layer is solidified; the embossing step may include: applying the first high temperature to the position of the substrate layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, applying the first high temperature to the position of the substrate layer corresponding to the second soluble mold core; and applying the pressure to the second soluble mold core, so that the high The polymer material layer has the second transfer structure; the first supporting back plate is separated from the first adhesive layer; and the second supporting back plate is separated from the second adhesive layer; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core, and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so as to solidify the polymer material layer; the embossing step may include: applying the first high temperature and the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure, and separating the first supporting back plate from the first adhesive layer ; and applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and applying the first high temperature and the pressure to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second adhesive layer; and applying the second high temperature to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified. Curing; the embossing step may include: first: applying the first high temperature to the portion of the substrate layer corresponding to the first soluble mold core; and the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and the first supporting back plate is separated from the first adhesive layer; then: applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is cured; and first: applying the first high temperature to the portion of the substrate layer corresponding to the second soluble mold core; and the pressure to the second soluble mold, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second adhesive layer; then: applying the second high temperature to the second soluble mold; to the position of the substrate layer corresponding to the second soluble mold; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold is solidified; and the embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold, so that the polymer material layer has the first transfer structure, and the first supporting back plate is separated from the first adhesive layer; and applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and the first high temperature is applied to the substrate layer; the pressure is applied to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second adhesive layer; and the second high temperature is applied to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified.

More preferably, the polymer material layer is formed on a substrate layer, and the embossing step includes: applying the first high temperature and the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; after forming the first transfer structure, applying the first high temperature and the pressure to the second soluble mold so that the polymer material layer has the second transfer structure; after forming the second transfer structure, separating the first tape from the first adhesive layer; and separating the second tape from the second adhesive layer; and applying the second high temperature to the first soluble mold and the second soluble mold; to the substrate layer and the second transfer structure; The method comprises: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, applying the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure; separating the first tape from the first adhesive layer; and separating the second tape from the second adhesive layer; and applying the second high temperature to the first soluble mold core. The embossing step may include: applying the first high temperature to the position of the substrate layer corresponding to the first soluble mold core and the second soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the polymer material layer is solidified; the embossing step may include: applying the first high temperature to the position of the substrate layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, applying the first high temperature to the position of the substrate layer corresponding to the second soluble mold core; and applying the pressure to the second soluble mold core, so that the polymer material layer has the first transfer structure. The polymer material layer has the second transfer structure; the first tape is separated from the first adhesive layer; and the second tape is separated from the second adhesive layer; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core, and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the polymer material layer is cured; the embossing step may include: applying the first high temperature and the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and separating the first tape from the first adhesive layer; and applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and applying the first high temperature and the pressure to the second soluble mold core, so that the polymer material layer has the second transfer structure and the second tape is separated from the second adhesive layer; and applying the second high temperature to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified. The embossing step may include: first: applying the first high temperature to the portion of the substrate layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure and the first tape is separated from the first adhesive layer; then: applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and first: applying the first high temperature to the portion of the substrate layer corresponding to the second soluble mold core; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure and the first tape is separated from the first adhesive layer; then: applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and first: applying the first high temperature to the portion of the substrate layer corresponding to the second soluble mold core; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure and the first tape is separated from the first adhesive layer; The method comprises: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core so that the polymer material layer has the second transfer structure and the second tape is separated from the second adhesive layer; applying the second high temperature to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified; and the embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure and the first tape is separated from the first adhesive layer; and applying the second high temperature to the substrate layer; The first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and the first high temperature is applied to the substrate layer; the pressure is applied to the second soluble mold core, so that the polymer material layer has the second transfer structure and the second tape is separated from the second adhesive layer; and the second high temperature is applied to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified.

More preferably, the polymer material layer is formed on a substrate layer, and the embossing step comprises: first: applying the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; irradiating the portion of the polymer material layer corresponding to the first soluble mold with the UV light so that the portion of the polymer material layer corresponding to the first soluble mold is cured; and separating the first supporting back plate from the first adhesive tape; and then: applying the pressure to the first soluble mold. The second soluble mold is applied to the polymer material layer so that the polymer material layer has the second transfer structure; the UV light is irradiated on the portion of the polymer material layer corresponding to the second soluble mold so that the portion of the polymer material layer corresponding to the second soluble mold is cured; and the second supporting back plate is separated from the second adhesive tape; the embossing step may include: applying the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; applying the pressure to the second soluble mold The soluble mold is used to make the polymer material layer have the second transfer structure; the polymer material layer is irradiated with the UV light to cure the polymer material layer; and the first supporting back plate is separated from the first tape, and the second supporting back plate is separated from the second tape; and the embossing step may include: applying the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; applying the pressure to the second soluble mold so that the polymer material layer has the second transfer structure; Second transfer structure; irradiating the portion of the polymer material layer corresponding to the first soluble mold core with the UV light to solidify the portion of the polymer material layer corresponding to the first soluble mold core, and separating the first supporting back plate from the first adhesive tape; and irradiating the portion of the polymer material layer corresponding to the second soluble mold core with the UV light to solidify the portion of the polymer material layer corresponding to the second soluble mold core, and separating the second supporting back plate from the second adhesive tape.

Compared with the prior art, the present invention is effective in that the present invention can accurately, stably and continuously emboss the polymer material with the mold core to efficiently obtain a large-scale transfer object, and the transfer object finally obtained has both high yield and high quality, and can achieve higher stability, durability and safety in practical applications. Specifically, in the present invention: the first supporting back plate is bonded to the first soluble mold core by the first adhesive layer, therefore, when the first soluble mold core is separated from the first sample mold; when the first soluble mold core is in contact with or aligned with the polymer material layer; when the first high temperature or pressure is applied to the first soluble mold core; when the first frame structure is separated from the first supporting back plate; when the first frame structure and the first tape arranged on the first frame structure are separated from the first supporting back plate; and when the first soluble mold core is dissolved, the first supporting back plate can maintain the structure of the first soluble mold core, so that the first soluble mold core does not deviate or deform, and thus the final printed transfer object can be free of defects. In addition, since the second supporting back plate is bonded to the second soluble mold core by the second adhesive layer before the dissolving step, when the second soluble mold core is separated from the second sample mold; when the second soluble mold core is in contact with or aligned with the polymer material layer; when the first high temperature or pressure is applied to the second soluble mold core; when the second frame structure is separated from the second supporting back plate; when the second frame structure and the second tape disposed on the second frame structure are separated from the second supporting back plate; and when the second soluble mold core is dissolved, the second supporting back plate can maintain the structure of the second soluble mold core, so that the second soluble mold core does not deviate or deform, and thus the final printed transfer object can be free of defects.

S1: Add step

S2: Formation step

S3: Moulding step

S4: Separation step

S5: Contact step

S6: Imprinting step

S7: Dissolution step

S8: Peeling step

1: Soluble materials

2: First sample

201: First sample structure

202: First sign structure

3: The first soluble mold core

4: The first concave-convex structure

5: First adhesive layer

6: The first frame structure

7: First tape

8: The first back support

9: First transfer structure

10: Second sample

1001: Second sample structure

1002: Second symbol structure

11: Second soluble mold core

12: Second concave-convex structure

13: Second adhesive layer

14: Second frame structure

15: Second tape

16: The second back support

17: Second transfer structure

18: Polymer material layer

19:Solvent

20: Transfer objects

21: First alignment mark

22: Second alignment mark

23: Third counterpoint mark

24: Fourth counterpoint mark

25: Fifth counterpoint mark

26: Sixth counterpoint mark

27: Seventh counterpoint mark

28: Objects to be transferred

29: Base material layer

30: Machine platform

31: First imaging element

32: First infrared emitting element

33: Second imaging element

34: Second infrared emitting element

35: Position adjustment element

36:Piercing

37: Transfer element

38: Heating element

39: Blowing element

40: UV emitter

100: First mold taking device

200: Second mold taking device

Figures 1A to 1B are a series of block diagrams for illustrating the embossing process of the present invention; Figures 2A to 2B are used to illustrate the adding step of the present invention; Figure 3 is used to illustrate the forming step of the present invention; Figures 4A to 4D are used to illustrate the mold taking step of the present invention; Figures 5A to 5B are used to illustrate the separation step of the present invention; Figures 6A to 6D are used to illustrate the contacting step of the present invention; Figures 7A to 7G are used to illustrate the alignment step of the present invention; Figures 8A to 8G are used to illustrate the Figures 9A to 9G are used to illustrate the first implementation of the embossing step of the present invention; Figures 10A to 10H are used to illustrate the third implementation of the embossing step of the present invention; Figures 11A to 11G are used to illustrate the fourth implementation of the embossing step of the present invention; Figure 12 is used to illustrate the stripping step of the present invention; Figures 13A to 13C are used to illustrate the dissolving step of the present invention; Figures 14A to 14D are used to illustrate the embossing method of the present invention.

In order to make the above and/or other purposes, effects, and features of the present invention more clearly understandable, the following is a preferred implementation method for detailed description: As shown in FIG1A, the present invention provides a method for large-scale imprinting, which sequentially includes: an adding step (S1), a forming step (S2), a mold taking step (S3), a separation step (S4), a contacting step (S5), an imprinting step (S6), and a dissolving step (S7). In a preferred embodiment, as shown in FIG1B, the method for large-scale imprinting further includes a stripping step (S8), which is performed after the imprinting step (S6) is completed and before the dissolving step (S7) is performed.

The following Figures 2A and 2B are used to illustrate the adding step (S1) of the present invention: "Forming a first soluble mold core (3) on a first sample mold; and forming a second soluble mold core (11) on a second sample mold (10)."

As shown in FIG. 2A , first, a soluble material (1) is added to a first sample mold (2) and a second sample mold (10), wherein the first sample mold (2) has a first sample mold structure (201) and a first marking structure (202); the second sample mold (10) has a second sample mold structure (1001) and a second marking structure (1002); then, as shown in FIG. 2B , the soluble material (1) is cured to form a first soluble mold core (3), wherein the first soluble The dissolvable mold (3) has a first concave-convex structure (4) corresponding to the first sample structure (201) and a first alignment mark (21) corresponding to the first mark structure (202); and the dissolvable material (1) is cured to form a second dissolvable mold (11), wherein the second dissolvable mold (11) has a second concave-convex structure (12) corresponding to the second sample structure (1001) and a second alignment mark (22) corresponding to the second mark structure (1002). Preferably, the dissolvable material (1) is selected from the group consisting of: water-soluble polyacrylamide (PAM), polyurethane, polyurea, polyamide, polyester, polyurethane, polyvinyl pyrrolidone, ethylene-vinyl alcohol, polyacrylamide-glyoxal polymer, polyacrylic acid, or a combination thereof, but not limited thereto. The thickness of the soluble material (1) in the first mold (2) is 10 to 1,000 μm, so the first soluble mold core (3) obtained later has not only soluble properties but also flexible properties; and the thickness of the soluble material (1) in the second mold (10) is 10 to 1,000 μm, so the second soluble mold core (11) obtained later has not only soluble properties but also flexible properties. Preferably, the soluble material (1) can be added to the first mold (2) or the second mold (10) in the form of a solution, and its concentration can be 5 to 50 wt% of the solution, but not limited thereto. It can be understood that if the concentration is lower than this lower limit, the incompleteness of the first concave-convex structure (4) or the second concave-convex structure (12) will be increased, resulting in structural defects, thereby affecting the quality of embossing. In addition, the soluble material (1) can be added by spin coating or slot die coating; when spin coating is used, the rotation speed of the spin coating can be 100 to 5,000 rpm, but not limited thereto. Preferably, the material of the first sample mold (2) or the second sample mold (10) is silicon.

The following Figure 3 is used to illustrate the forming step (S2) of the present invention: "Forming a first adhesive layer (5) on the first soluble mold (3); and forming a second adhesive layer (13) on the second soluble mold (11)."

As shown in FIG3 , after the soluble material (1) is solidified and a first soluble mold core (3) is formed in the first mold (2); and a second soluble mold core (11) is formed in the second mold (10), a first adhesive layer (5) is formed on one side of the first soluble mold core (3) opposite to the first mold (2); and a second adhesive layer (13) is formed on one side of the second soluble mold core (11) opposite to the second mold (10). It can be understood that the first adhesive layer (5) or the second adhesive layer (13) can be formed by spraying, coating, laminating, or pouring, but is not limited thereto. Preferably, the first adhesive layer (5) is uniformly formed on one side of the first soluble mold core (3) opposite to the first sample mold (2); the second adhesive layer (13) is uniformly formed on one side of the second soluble mold core (11) opposite to the second sample mold (10). Preferably, the first adhesive layer (5) or the second adhesive layer (13) is a kind of glue or liquid, and its types include: light curing adhesive, ultraviolet curing glue, light-to-heat conversion (LTHC) glue, thermosetting glue or hydrolyzable resin, but not limited thereto. The so-called "curing" can be heat curing or light curing (such as ultraviolet light curing); when heat curing is adopted, the heat curing temperature can be room temperature to 160°C, and the heat curing time can be 5 to 60 minutes, but not limited thereto. If the time exceeds this upper limit, it will increase the difficulty of peeling off the first soluble mold (3) and cause the first concave-convex structure (4) to form defects; or increase the difficulty of peeling off the second soluble mold (11) and cause the second concave-convex structure (12) to form defects. Preferably, the first adhesive layer (5) or the second adhesive layer (13) can be a double-sided adhesive tape, wherein the adhesive tape can be debonded by heating or irradiating UV light, so that it can be peeled off from the surface of the first soluble mold (3) or the second soluble mold (11). Preferably, more soluble mold cores can be formed in more sample molds in the above-mentioned manner, which will not be elaborated here.

The following Figures 4A to 4D are used to illustrate the molding step (S3) of the present invention: "Attaching a first molding device (100) to the first adhesive layer (5); and attaching a second molding device (200) to the second adhesive layer (13)."

As shown in FIGS. 4A and 4B , this is a first implementation of the molding step (S3) of the present invention. First, a first molding device (100) is attached to a side of the first adhesive layer (5) opposite to the first sample mold (2), wherein the first molding device (100) comprises: a first frame structure (6); a first adhesive tape (7) disposed on the first frame structure (6); and a first supporting back plate (8) disposed on the first adhesive tape (7), wherein the first molding device (100) is formed by connecting the first supporting back plate (8) with the first adhesive tape (7). The invention relates to a method for manufacturing a mold taking device (200) for molding a mold of a second sample mold (10) and a method for manufacturing a mold taking device (200) for molding a mold of a second sample mold (10). The method comprises: a first adhesive layer (5) in contact with the first adhesive layer (13); and a second molding device (200) is attached to a side of the second adhesive layer (13) opposite to the second sample mold (10), wherein the second molding device (200) comprises: a second frame structure (14); a second adhesive tape (15) disposed on the second frame structure (14); and a second supporting back plate (16) disposed on the second adhesive tape (15), wherein the second molding device (200) is in contact with the second adhesive layer (13) by the second supporting back plate (16). Specifically, the first mold taking device (100) is attached to the first adhesive layer (5) with the first supporting back plate (8), so that the first supporting back plate (8) and the first soluble mold core (3) are bonded through the first adhesive layer (5); the second mold taking device (200) is attached to the second adhesive layer (13) with the second supporting back plate (16), so that the second supporting back plate (16) and the second soluble mold core (11) are bonded through the second adhesive layer (13). Preferably, the first frame structure (6) is an annular frame, wherein the annular frame has a first supporting portion and a first operating portion connected to the first supporting portion. Specifically, the first supporting back plate (8) or the first adhesive tape (7) is arranged on the first operating portion. Preferably, the area of the first supporting back plate (8) can completely cover the area of the first adhesive layer (5), so that the first soluble mold core (3) can be tightly bonded to the first supporting back plate (8) to prevent the first soluble mold core (3) from being offset or erroneously moved relative to the first sample mold (2) due to shaking. Preferably, the material of the first tape (7) or the second tape (15) can be a thermally degradable foam or a UV-degradable foam, but not limited thereto. Preferably, the thermally degradable foam is polystyrene, polyurethane (PU), or polystyrene (PS), and has a thickness of 100 to 1,000 μm. Preferably, when the first adhesive layer (5) or the second adhesive layer (13) is a tape, the tape may be the same as the first tape (7) or the second tape (15). Preferably, the first tape (7) has a first protrusion, wherein the first tape (7) is disposed on the first operating portion of the first frame structure (6) with the first protrusion. Preferably, the first supporting back plate (8) has a second protrusion, wherein the first supporting back plate (8) is disposed on the first operating portion of the first frame structure (6) with the second protrusion. It can be understood that the second frame structure (14) has the same structure as the first frame structure (6), so no further description is given here.

As shown in Figures 4C and 4D, this is the second implementation of the molding step (S3) of the present invention, wherein the difference between this implementation and the first implementation is that the structure of the molding device is different. In the second implementation of the molding step (S3), it includes: attaching a first molding device (100) to one side of the first adhesive layer (5) opposite to the first sample mold (2), wherein the first molding device (100) includes: a first frame structure (6); a first adhesive tape (7), which is arranged on the first frame structure (6); and a first supporting back plate (8), which is arranged on the first adhesive tape (7), wherein the first molding device (100) is connected to the first adhesive layer with one side of the first adhesive tape (7) opposite to the first supporting back plate (8). (5); and attaching a second molding device (200) to one side of the second adhesive layer (13) opposite to the second sample mold (10), wherein the second molding device (200) comprises: a second frame structure (14); a second adhesive tape (15), which is arranged on the second frame structure (14); and a second supporting back plate (16), which is arranged on the second adhesive tape (15), wherein the second molding device (200) is in contact with the second adhesive layer (13) with one side of the second adhesive tape (15) opposite to the second supporting back plate (16). Specifically, in the above two embodiments, a supporting back plate is provided on the mold removal device, the purpose of which is to smoothly and stably press the first soluble mold core (3) or the second soluble mold core (11) into the polymer material layer (18) in the subsequent embossing step (S6); and to prevent the first soluble mold core (3) or the second soluble mold core (11) from shaking or error during the embossing process, thereby affecting the yield and quality of the final product.

The following Figures 5A and 5B are used to illustrate the separation step (S4) of the present invention: "Separating the first soluble mold core (3) from the first sample mold (2); and separating the second soluble mold core (11) from the second sample mold (10)."

As shown in FIG. 5A , this is a first implementation of the separation step (S4) of the present invention: after the first supporting back plate (8) contacts the first adhesive layer (5), the first mold removal device (100) is moved so that the first soluble mold core (3) moves relative to the first sample mold (2) along with the first mold removal device (100), so that the first soluble mold core (3) is separated from the first sample mold (2); and after the second supporting back plate (16) contacts the second adhesive layer (13), the second mold removal device (200) is moved so that the second soluble mold core (11) moves relative to the second sample mold (10) along with the second mold removal device (200), so that the second soluble mold core (11) is separated from the second sample mold (10). Preferably, when the first soluble mold core (3) leaves the first sample mold (2); or when the second soluble mold core (11) leaves the second sample mold (10), the operating part of the annular frame can be operated by a forward peeling or a side peeling method.

As shown in FIG. 5B , this is a second implementation of the separation step (S4) of the present invention. The difference between the second implementation and the first implementation is that the position of the supporting back plate is different. Specifically, after the first tape (7) contacts the first adhesive layer (5), the first mold removal device (100) is moved so that the first soluble mold core (3) moves relative to the first sample mold (2) along with the first mold removal device (100). to separate the first soluble mold core (3) from the first sample mold (2); and after the second tape (15) contacts the second adhesive layer (13), the second mold removal device (200) is moved to move the second soluble mold core (11) relative to the second sample mold (10) along with the second mold removal device (200), so that the second soluble mold core (11) is separated from the second sample mold (10). It can be understood that in order to make the mold taking device used in the above steps the same, the first implementation of the mold taking step (S3) and the first implementation of the separation step (S4) are set in a matching manner; and the second implementation of the mold taking step (S3) and the second implementation of the separation step (S4) are set in a matching manner.

The following Figures 6A to 6D are used to illustrate the contacting step (S5) of the present invention: "Place the first soluble mold core (3) and the second soluble mold core (11) on a polymer material layer (18)."

As shown in Figures 6A to 6D, a polymer material layer (18) is formed on a substrate layer (29), and the contact step (S5) includes: first: heating the first soluble mold core (3) to a temperature T, where 0<T<Tg, and making the first soluble mold core (3) contact the polymer material layer (18); then: heating the second soluble mold core (11) to the temperature T, and making the second soluble mold core (11) contact the polymer material layer (18). Preferably, the contacting step (S5) comprises: firstly, heating the substrate layer (29) to a temperature T, wherein 0<T<Tg, and bringing the first soluble mold core (3) into contact with the polymer material layer (18); and secondly bringing the second soluble mold core (11) into contact with the polymer material layer (18). More preferably, the contacting step (S5) comprises: firstly, heating the portion of the substrate layer (29) corresponding to the first soluble mold core (3) to a temperature T, wherein 0<T<Tg, and bringing the first soluble mold core (3) into contact with the polymer material layer (18); and then, heating the portion of the substrate layer (29) corresponding to the second soluble mold core (11) to the temperature T, and bringing the second soluble mold core (11) into contact with the polymer material layer (18). Preferably, Tg refers to the glass transition temperature, wherein the purpose of heating the temperature to T is to make the surface of the polymer material layer (18) sticky or slightly softened, so as to facilitate the alignment or pre-pressing action in this step. Preferably, in order to avoid the first soluble mold core (3) and the second soluble mold core (11) being embossed at the same position on the polymer material, thereby affecting the result of embossing, in the contacting step (S5), the first soluble mold core (3) and the second soluble mold core (11) are contacted with the polymer material layer (18) at intervals.

Preferably, in order to improve the accuracy of the subsequent embossing step (S6) and improve the yield of the final product, the first soluble mold core (3) and the second soluble mold core (11) can be aligned with the polymer material layer (18) in this step.

As shown in Figures 7A to 7G, this is the alignment step of the present invention. Specifically, various implementations of the alignment are listed below.

7A and 7B, in one embodiment, the contacting step (S5) includes: first, placing an object to be transferred (28) on a machine platform (30), wherein the object to be transferred (28) has a substrate layer (29) between the polymer material layer (18) and the machine platform (30), and the substrate layer (29) has a third alignment mark (23) and a fourth alignment mark (24); second, using a device disposed on the first molding device (100) opposite to the first molding device (100) to contact the object (28) with a substrate layer (29) between the polymer material layer (18) and the machine platform (30); A first imaging element (31) on one side of the first soluble mold (3) or a first imaging element (31) disposed on one side of the machine platform (30) opposite to the object to be transferred (28) confirms whether the first alignment mark (21) and the third alignment mark (23) are aligned, wherein: if aligned, the first soluble mold (3) is in contact with the polymer material layer (18); if not aligned, a position adjustment element (35) is used to adjust the position of the machine platform (3 0) adjusting the X-axis and Y-axis of the first soluble mold (3) and the angle θ thereof in the X-Y plane until the first alignment mark (21) is aligned with the third alignment mark (23); and confirming the second soluble mold (11) with a second imaging element (33) disposed on a side of the second molding device (200) opposite to the second soluble mold (11) or a second imaging element (33) disposed on a side of the machine platform (30) opposite to the object to be transferred (28). Whether the second alignment mark (22) and the fourth alignment mark (24) are aligned, wherein: if aligned, the second soluble mold core (11) is in contact with the polymer material layer (18); if not aligned, a position adjustment element (35) is used to adjust the X axis and Y axis of the second soluble mold core (11) and the angle θ on the X-Y plane with the machine platform (30) as the X-Y plane until the second alignment mark (22) and the fourth alignment mark (24) are aligned.

In another embodiment, as shown in FIGS. 7C and 7D , the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), wherein the object to be transferred (28) has a substrate layer (29) between the polymer material layer (18) and the machine platform (30), and the substrate layer (29) has a third alignment mark (23) and a fourth alignment mark (24); aligning the first soluble mold core (3) with the polymer material layer (18); The first molding device (100) is in contact with the first soluble mold core (3), and a first imaging element (31) arranged on a side of the first molding device (100) opposite to the first soluble mold core (3) or a first imaging element (31) arranged on a side of the machine platform (30) opposite to the object to be transferred (28) is used to confirm whether the first alignment mark (21) and the third alignment mark (23) are aligned; if they are not aligned, a position adjustment element (35) is used to adjust the alignment mark with the machine platform (30) as the first imaging element. The X-axis and Y-axis of the first soluble mold (3) and the angle θ thereof in the X-Y plane are adjusted until the first alignment mark (21) is aligned with the third alignment mark (23); and the second soluble mold (11) is brought into contact with the polymer material layer (18), and a second imaging element (33) disposed on one side of the second molding device (200) opposite to the second soluble mold (11) or a second imaging element (33) disposed on the machine platform ( 30) A second imaging element (33) on one side of the object to be transferred (28) is used to confirm whether the second alignment mark (22) is aligned with the fourth alignment mark (24); if not, a position adjustment element (35) is used to adjust the X-axis and Y-axis of the second soluble mold core (11) and the angle θ thereof in the X-Y plane with the machine platform (30) as the X-Y plane until the second alignment mark (22) is aligned with the fourth alignment mark (24). Preferably, the polymer material layer (18) is heated to a temperature T before the first soluble mold core (3) or the second soluble mold core (11) is brought into contact with the polymer material layer (18) to avoid damage or scratches on the first soluble mold core (3) or the second soluble mold core (11), which would affect the final embossing result.

In another embodiment, as shown in FIG. 7E , the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), wherein the object to be transferred (28) has a substrate layer (29) between the polymer material layer (18) and the machine platform (30), and the substrate layer (29) has a third alignment mark (23) and a fourth alignment mark (24); moving a first imaging element (3 1) between the first soluble mold core (3) and the object to be transferred (28) to confirm whether the first alignment mark (21) and the third alignment mark (23) are aligned, wherein: if aligned, the first imaging element (31) is reset, and the first soluble mold core (3) is brought into contact with the polymer material layer (18); if not aligned, a position adjustment element (35) is used to adjust the position of the machine platform (30) by X- The first soluble mold (3) is adjusted along the X-axis and the Y-axis and the angle θ thereof in the X-Y plane until the first alignment mark (21) is aligned with the third alignment mark (23); and a second imaging element (33) is moved between the second soluble mold (11) and the object to be transferred (28) to confirm whether the second alignment mark (22) is aligned with the fourth alignment mark (24), wherein: if aligned, then The second imaging element (33) is reset, and the second soluble mold (11) is brought into contact with the polymer material layer (18); if they are not aligned, a position adjustment element (35) is used to adjust the X-axis and Y-axis of the second soluble mold (11) and the angle θ on the X-Y plane with the machine platform (30) as the X-Y plane until the second alignment mark (22) is aligned with the fourth alignment mark (24).

In another embodiment, as shown in FIG. 7F , the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), wherein the object to be transferred (28) has a substrate layer (29) between the polymer material layer (18) and the machine platform (30), and the machine platform (30) has a fifth alignment mark (25) and a sixth alignment mark (26); using a device disposed on the first molding device (100) opposite to the first soluble A first imaging element (31) on one side of the dissolvable mold (3) or a first imaging element (31) disposed on one side of the machine platform (30) opposite to the object to be transferred (28) confirms whether the first alignment mark (21) and the fifth alignment mark (25) are aligned, wherein: if aligned, the first dissolvable mold (3) is in contact with the polymer material layer (18); if not aligned, a position adjustment element (35) is used to adjust the alignment mark with the machine platform (30) as X. -Y plane to adjust the X-axis and Y-axis of the first soluble mold (3) and the angle θ in the X-Y plane until the first alignment mark (21) is aligned with the fifth alignment mark (25); and a second imaging element (33) arranged on a side of the second molding device (200) opposite to the second soluble mold (11) or a second imaging element (33) arranged on a side of the machine platform (30) opposite to the object to be transferred (28) is used to confirm the second Whether the alignment mark (22) and the sixth alignment mark (26) are aligned, wherein: if aligned, the second soluble mold core (11) is in contact with the polymer material layer (18); if not aligned, a position adjustment element (35) is used to adjust the X-axis and Y-axis of the second soluble mold core (11) and the angle θ on the X-Y plane with the machine platform (30) as the X-Y plane until the second alignment mark (22) and the sixth alignment mark (26) are aligned.

In another embodiment, the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), wherein the object to be transferred (28) has a substrate layer (29) between the polymer material layer (18) and the machine platform (30), and the machine platform (30) has a fifth alignment mark (25) and a sixth alignment mark (26); bringing the first soluble mold core (3) into contact with the polymer material layer (18), A first imaging element (31) disposed on a side of the first molding device (100) opposite to the first soluble mold core (3) or a first imaging element (31) disposed on a side of the machine platform (30) opposite to the object to be transferred (28) is used to confirm whether the first alignment mark (21) and the fifth alignment mark (25) are aligned; if they are not aligned, a position adjustment element (35) is used to adjust the alignment mark with the machine platform (30) as the X-Y plane. The X-axis and Y-axis of the first soluble mold core (3) and the angle θ thereof in the X-Y plane are adjusted until the first alignment mark (21) is aligned with the fifth alignment mark (25); and the second soluble mold core (11) is brought into contact with the polymer material layer (18), and a second imaging element (33) disposed on a side of the second molding device (200) opposite to the second soluble mold core (11) or a second imaging element (33) disposed on the machine platform (30) is used to capture the second soluble mold core (11). A second imaging element (33) on one side of the object to be transferred (28) confirms whether the second alignment mark (22) is aligned with the sixth alignment mark (26); if not, a position adjustment element (35) is used to adjust the X-axis and Y-axis of the second soluble mold core (11) and the angle θ on the X-Y plane with the machine platform (30) as the X-Y plane until the second alignment mark (22) is aligned with the sixth alignment mark (26). Preferably, the polymer material layer (18) is heated to a temperature T before the first soluble mold core (3) or the second soluble mold core (11) is brought into contact with the polymer material layer (18) to avoid damage or scratches on the first soluble mold core (3) or the second soluble mold core (11), which would affect the final embossing result.

In another embodiment, the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), wherein the object to be transferred (28) has a substrate layer (29) between the polymer material layer (18) and the machine platform (30), and the machine platform (30) has a fifth alignment mark (25) and a sixth alignment mark (26); moving a first imaging element (31) to the first imaging element (31); A dissolvable mold core (3) and the object to be transferred (28) are used to confirm whether the first alignment mark (21) and the fifth alignment mark (25) are aligned, wherein: if aligned, the first imaging element (31) is reset, and the first dissolvable mold core (3) is brought into contact with the polymer material layer (18); if not aligned, a position adjustment element (35) is used to adjust the position of the machine platform (30) as the X-Y plane. Adjust the X-axis and Y-axis of the first soluble mold (3) and their angle θ in the X-Y plane until the first alignment mark (21) is aligned with the fifth alignment mark (25); and move a second camera element (33) between the second soluble mold (11) and the object to be transferred (28) to confirm whether the second alignment mark (22) is aligned with the sixth alignment mark (26), wherein: if aligned, then The second imaging element (33) is reset, and the second soluble mold (11) is brought into contact with the polymer material layer (18); if they are not aligned, a position adjustment element (35) is used to adjust the X-axis and Y-axis of the second soluble mold (11) and the angle θ on the X-Y plane with the machine platform (30) as the X-Y plane until the second alignment mark (22) is aligned with the sixth alignment mark (26).

In another embodiment, as shown in FIG. 7G , the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), wherein the object to be transferred (28) has a substrate layer (29) between the polymer material layer (18) and the machine platform (30), and the polymer material layer (18) has a seventh alignment mark (27) and an eighth alignment mark; and using a first molding device (100) disposed opposite to the first soluble A first imaging element (31) on one side of the dissolvable mold (3) or a first imaging element (31) disposed on a side of the machine platform (30) opposite to the object to be transferred (28) confirms whether the first alignment mark (21) and the seventh alignment mark (27) are aligned, wherein: if aligned, the first dissolvable mold (3) is in contact with the polymer material layer (18); if not aligned, a position adjustment element (35) is used to adjust the alignment of the first alignment mark (21) and the seventh alignment mark (27) with the machine platform (30). The X-axis and Y-axis of the first soluble mold (3) and the angle θ thereof in the X-Y plane are adjusted until the first alignment mark (21) is aligned with the seventh alignment mark (27); and a second imaging element (33) disposed on a side of the second molding device (200) opposite to the second soluble mold (11) or a second imaging element (33) disposed on a side of the machine platform (30) opposite to the object to be transferred (28) is used. Confirm whether the second alignment mark (22) is aligned with the eighth alignment mark, wherein: if aligned, the second soluble mold core (11) is in contact with the polymer material layer (18); if not aligned, a position adjustment element (35) is used to adjust the X-axis and Y-axis of the second soluble mold core (11) and the θ angle on the X-Y plane with the machine platform (30) as the X-Y plane until the second alignment mark (22) is aligned with the eighth alignment mark.

In another embodiment, the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), wherein the object to be transferred (28) has a substrate layer (29) between the polymer material layer (18) and the machine platform (30), and the polymer material layer (18) has a seventh alignment mark (27) and an eighth alignment mark; the first soluble mold core (3) is in contact with the polymer material layer (18); A first imaging element (31) disposed on a side of the first molding device (100) opposite to the first soluble mold core (3) or a first imaging element (31) disposed on a side of the machine platform (30) opposite to the object to be transferred (28) is used to confirm whether the first alignment mark (21) and the seventh alignment mark (27) are aligned; if they are not aligned, a position adjustment element (35) is used to adjust the alignment mark with the machine platform (30) as X. -Y plane to adjust the X-axis and Y-axis of the first soluble mold (3) and the angle θ in the X-Y plane until the first alignment mark (21) is aligned with the seventh alignment mark (27); and the second soluble mold (11) is in contact with the polymer material layer (18), and a second camera element (33) disposed on one side of the second molding device (200) opposite to the second soluble mold (11) or a second camera element (33) disposed on the machine plane A second imaging element (33) on the platform (30) opposite to one side of the object to be transferred (28) confirms whether the second alignment mark (22) is aligned with the eighth alignment mark; if not, a position adjustment element (35) is used to adjust the X-axis and Y-axis of the second soluble mold core (11) and the angle θ on the X-Y plane with the machine platform (30) as the X-Y plane until the second alignment mark (22) is aligned with the eighth alignment mark. Preferably, the polymer material layer (18) is heated to a temperature T before the first soluble mold core (3) or the second soluble mold core (11) is brought into contact with the polymer material layer (18) to avoid damage or scratches on the first soluble mold core (3) or the second soluble mold core (11), which would affect the final embossing result.

In another embodiment, the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), the object to be transferred (28) having a substrate layer (29) between the polymer material layer (18) and the machine platform (30), the polymer material layer (18) having a seventh alignment mark (27) and an eighth alignment mark; moving a first imaging element (31) to The first soluble mold core (3) and the object to be transferred (28) are positioned to confirm whether the first alignment mark (21) and the seventh alignment mark (27) are aligned, wherein: if aligned, the first imaging element (31) is reset, and the first soluble mold core (3) is brought into contact with the polymer material layer (18); if not aligned, a position adjustment element (35) is used to adjust the position of the machine platform (30) with the machine platform (30) as the X axis. -Y plane to adjust the X-axis and Y-axis of the first soluble mold (3) and the angle θ in the X-Y plane until the first alignment mark (21) is aligned with the seventh alignment mark (27); and move a second camera element (33) between the second soluble mold (11) and the object to be transferred (28) to confirm whether the second alignment mark (22) is aligned with the eighth alignment mark, wherein: if aligned, The second imaging element (33) is reset, and the second soluble mold (11) is brought into contact with the polymer material layer (18); if they are not aligned, a position adjustment element (35) is used to adjust the X-axis and Y-axis of the second soluble mold (11) and the angle θ on the X-Y plane with the machine platform (30) as the X-Y plane until the second alignment mark (22) is aligned with the eighth alignment mark.

Preferably, the polymer material layer (18) can be obtained by forming a polymer material with a glass transition temperature lower than that of the mold core on the substrate layer (29) by a rotary coating method; or it can be first formed by a rotary coating method on the substrate layer (29) with a polymer material with a glass temperature lower than that of the mold core, and then soft baking. Preferably, the glass transition temperature (Tg) of the polymer material is 20 to 150°C, the rotary coating speed is 1,000 to 5,000 rpm, and the coating thickness is 0.05 to 1,000 μm. It should be noted that whether the polymer material is soft baked depends on the material properties; preferably, the soft baking temperature is 80 to 150°C, and the soft baking time is 3 to 5 minutes. In addition to the rotational coating method, a film element (not shown) can also be used to form a polymer material layer (18) on the substrate layer (29) by a die-stamping method. The third alignment mark (23) or the fourth alignment mark (24) can be set on a surface of the substrate layer (29) opposite to the soluble mold core; or set on a surface opposite to the machine platform (30). When the third alignment mark (23) of the substrate layer (29) is set on a surface of the substrate layer (29) opposite to the soluble mold core, the substrate layer (29) may interfere with the first camera element (31) capturing the images of the first alignment mark (21) and the third alignment mark (23). Therefore, the substrate layer (29) can be further provided with a first through hole (36) to expose the third alignment mark (23). It can be understood that in order to facilitate the alignment between the second alignment mark (22) and the fourth alignment mark (24), a second through hole (36) can be opened in the substrate layer (29) to expose the fourth alignment mark (24), which will not be elaborated here.

Furthermore, the fifth alignment mark (25) and the sixth alignment mark (26) are arranged on the machine platform (30) to facilitate the first imaging element (31) to capture the images of the first alignment mark (21) and the fifth alignment mark (25); and the second imaging element (33) to capture the images of the second alignment mark (22) and the sixth alignment mark (26). The substrate layer (29) is preferably a transparent substrate layer (29). In order to prevent the substrate layer (29) from interfering with the first imaging element (31) capturing the images of the first alignment mark (21) and the fifth alignment mark (25), the substrate layer (29) may be provided with a through hole (36) to expose the fifth alignment mark (25); and in order to prevent the substrate layer (29) from interfering with the second imaging element (33) capturing the images of the second alignment mark (22) and the sixth alignment mark (26), the substrate layer (29) may be provided with a through hole (36) to expose the sixth alignment mark (26).

In addition, in order to avoid the lack of clarity caused by light reflection noise when the first imaging element (31) captures the images of the first alignment mark (21) and the third alignment mark (23), a first infrared emitting element (32) can be used to illuminate the first alignment mark (21) and the third alignment mark (23); in order to avoid the lack of clarity caused by light reflection noise when the first imaging element (31) captures the images of the first alignment mark (21) and the fifth alignment mark (25), a first infrared emitting element (32) can be used to illuminate the first alignment mark (21) and the third alignment mark (23); In order to avoid the lack of clarity caused by the light reflection noise when the first imaging element (31) captures the images of the first alignment mark (21) and the seventh alignment mark (27), a first infrared emitting element (32) can be used to illuminate the first alignment mark (21) and the seventh alignment mark (27). The first infrared emitting element (32) can be arranged on the side of the first molding device (100) opposite to the first soluble mold core (3) or on the side of the machine platform (30) opposite to the object to be transferred (28), but is not limited thereto.

In addition, in order to avoid the second imaging element (33) capturing the images of the second alignment mark (22) and the fourth alignment mark (24) from being insufficiently clear due to light reflection noise, a second infrared emitting element (34) can be used to illuminate the second alignment mark (22) and the fourth alignment mark (24); in order to avoid the second imaging element (33) capturing the images of the second alignment mark (22) and the sixth alignment mark (26) from being insufficiently clear due to light reflection noise, a second infrared emitting element (34) can be used to illuminate the second alignment mark (22) and the fourth alignment mark (24); In order to prevent the lack of clarity caused by reflection noise, a second infrared emitting element (34) can be used to illuminate the second alignment mark (22) and the sixth alignment mark (26); in order to prevent the second imaging element (33) from capturing the images of the second alignment mark (22) and the eighth alignment mark and causing the lack of clarity caused by light reflection noise, a second infrared emitting element (34) can be used to illuminate the second alignment mark (22) and the eighth alignment mark. The second infrared emitting element (34) can be disposed on the side of the second molding device (200) opposite to the second soluble mold core (11) or on the side of the machine platform (30) opposite to the object to be transferred (28), but is not limited thereto.

As shown in FIG. 7F, the alignment mark is set on the machine platform (30) for use; and as shown in FIG. 7G, the alignment mark is set on the polymer material layer (18) for use. Specifically, the difference between FIG. 7F, FIG. 7G, and FIG. 7A to 7E is that the positions of the alignment marks are different. Other than that, the other operation details and effects are roughly the same and will not be elaborated here.

The following Figures 8A to 8G are used to illustrate the embossing step (S6) of the present invention: "Apply a first high temperature to the polymer material layer (18), and a pressure to the first soluble mold core (3) and the second soluble mold core (11); separate the first mold removal device (100) from the first soluble mold core (3), and separate the second mold removal device (200) from the second soluble mold core (11); and apply a second high temperature to the polymer material layer (18) to solidify the polymer material layer (18)."

The following is used to illustrate the first implementation of the embossing step (S6).

As shown in Figures 8A to 8C, the embossing step (S6) includes: applying a first high temperature to the polymer material layer (18); applying a pressure to the first soluble mold (3) and the second soluble mold (11), so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave-convex structure (4); and a second transfer structure (17) corresponding to the second concave-convex structure (12); and separating the first supporting back plate (8) from the first tape (7); and separating the second supporting back plate (16) from the second tape (15), and applying a second high temperature to the polymer material layer (18) to cure the polymer material layer (18), wherein the first high temperature is different from the second high temperature.

More preferably, the heat sources for supplying the first high temperature and the second high temperature may be the same or different, wherein the heat source may heat the soluble mold core; heat the area of the substrate layer (29) corresponding to the soluble mold core; or heat the entire substrate layer (29) so that the temperature is transferred to the polymer material layer (18), thereby softening or curing the polymer material layer (18).

Specifically, as shown in FIGS. 8A to 8C , in the embossing step (S6), the first embodiment of the first embodiment includes: applying the first high temperature and the pressure to the first soluble mold (3) so that the polymer material layer (18) has the first transfer structure (9); after forming the first transfer structure (9), applying the first high temperature and the pressure to the second soluble mold (11) so that the polymer material layer (18) has the second transfer structure (17); after forming the second transfer structure (17), The first supporting back plate (8) is separated from the first adhesive tape (7); and the second supporting back plate (16) is separated from the second adhesive tape (15); and the second high temperature is applied to the first soluble mold core (3) and the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the first soluble mold core (3), and the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so as to solidify the polymer material layer (18).

More preferably, as shown in FIGS. 8A to 8C , in the embossing step (S6), the second embodiment of the first embodiment comprises: applying the first high temperature to the substrate layer (29); applying the pressure to the first soluble mold (3) so that the polymer material layer (18) has the first transfer structure (9); after the first transfer structure (9) is formed, applying the pressure to the second soluble mold (11) so that the polymer material layer (18) has the second transfer structure (17); The supporting back plate (8) is separated from the first adhesive tape (7); and the second supporting back plate (16) is separated from the second adhesive tape (15); and the second high temperature is applied to the first soluble mold core (3) and the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the first soluble mold core (3), and the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so as to solidify the polymer material layer (18).

More preferably, as shown in FIGS. 8A to 8C , in the embossing step (S6), the third embodiment of the first embodiment includes: applying the first high temperature to the position of the substrate layer (29) corresponding to the first soluble mold core (3); and applying the pressure to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9); after the first transfer structure (9) is formed, applying the first high temperature to the position of the substrate layer (29) corresponding to the second soluble mold core (11); and applying the pressure to the second soluble mold core (11) so that the polymer material layer (18) has the first transfer structure (9); The sub-material layer (18) has the second transfer structure (17); the first supporting back plate (8) is separated from the first adhesive tape (7); and the second supporting back plate (16) is separated from the second adhesive tape (15); and the second high temperature is applied to the first soluble mold core (3) and the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the first soluble mold core (3), and the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so as to solidify the polymer material layer (18).

More preferably, as shown in FIGS. 8D to 8G , in the embossing step (S6), the fourth embodiment of the first embodiment includes: applying the first high temperature and the pressure to the first soluble mold (3) so that the polymer material layer (18) has the first transfer structure (9) and the first supporting back plate (8) is separated from the first tape (7); and applying the second high temperature to the first soluble mold (3); to the position of the substrate layer (29) corresponding to the first soluble mold (3); or to the substrate layer (29) so that the polymer material layer (18) and the first soluble mold (3) are connected. The first high temperature and the pressure are applied to the second soluble mold (11) so that the polymer material layer (18) has the second transfer structure (17) and the second supporting back plate (16) is separated from the second adhesive tape (15); and the second high temperature is applied to the second soluble mold (11); to the position of the substrate layer (29) corresponding to the second soluble mold (11); or to the substrate layer (29) so that the polymer material layer (18) and the second soluble mold (11) The corresponding part is cured.

More preferably, as shown in FIGS. 8D to 8G , in the embossing step (S6), the fifth embodiment of the first embodiment comprises: first: applying the first high temperature to the portion of the substrate layer (29) corresponding to the first soluble mold core (3); and applying the pressure to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9) and the first supporting back plate (8) is separated from the first tape (7); then: applying the second high temperature to the first soluble mold core (3); to the position of the substrate layer (29) corresponding to the first soluble mold core (3); or to the substrate layer (29) so that the polymer material layer (18) and the first soluble mold core (3) are in contact with each other. The first step is to apply the first high temperature to the portion of the substrate layer (29) corresponding to the second soluble mold core (11); and the pressure to the second soluble mold core (11), so that the polymer material layer (18) has the second transfer structure (17), and the second supporting back plate (16) is separated from the second tape (15); and then: apply the second high temperature to the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so that the portion of the polymer material layer (18) corresponding to the second soluble mold core (11) is cured.

More preferably, as shown in FIGS. 8D to 8G , in the embossing step (S6), the sixth embodiment of the first embodiment includes: applying the first high temperature to the substrate layer (29); applying the pressure to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9) and the first supporting back plate (8) is separated from the first tape (7); and applying the second high temperature to the first soluble mold core (3); to the position of the substrate layer (29) corresponding to the first soluble mold core (3); or to the substrate layer (29) so that the polymer material layer (18) has the first transfer structure (9). ) and the portion corresponding to the first soluble mold (3) are solidified; and the pressure is applied to the second soluble mold (11) so that the polymer material layer (18) has the second transfer structure (17) and the second supporting back plate (16) is separated from the second tape (15); and the second high temperature is applied to the second soluble mold (11); to the position corresponding to the substrate layer (29) and the second soluble mold (11); or to the substrate layer (29) so that the portion corresponding to the polymer material layer (18) and the second soluble mold (11) are solidified.

The following is used to illustrate the second implementation of the embossing step (S6).

As shown in Figures 9A to 9C, the embossing step (S6) includes: applying a first high temperature to the polymer material layer (18); applying a pressure to the first soluble mold (3) and the second soluble mold (11), so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave-convex structure (4); and a second transfer structure (17) corresponding to the second concave-convex structure (12); and separating the first supporting back plate (8) from the first adhesive layer (5); and separating the second supporting back plate (16) from the second adhesive layer (13), and applying a second high temperature to the polymer material layer (18) to cure the polymer material layer (18), wherein the first high temperature is different from the second high temperature.

More preferably, the heat sources for supplying the first high temperature and the second high temperature may be the same or different, wherein the heat source may heat the soluble mold core; heat the area of the substrate layer (29) corresponding to the soluble mold core; or heat the entire substrate layer (29) so that the temperature is transferred to the polymer material layer (18), thereby softening or curing the polymer material layer (18).

More preferably, as shown in FIGS. 9A to 9C , in the embossing step (S6), the first embodiment of the second embodiment includes: applying the first high temperature and the pressure to the first soluble mold (3) so that the polymer material layer (18) has the first transfer structure (9); after forming the first transfer structure (9), applying the first high temperature and the pressure to the second soluble mold (11) so that the polymer material layer (18) has the second transfer structure (17); after forming the second transfer structure (17), The first supporting back plate (8) is separated from the first adhesive layer (5); and the second supporting back plate (16) is separated from the second adhesive layer (13); and the second high temperature is applied to the first soluble mold core (3) and the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the first soluble mold core (3), and the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so as to solidify the polymer material layer (18).

More preferably, as shown in FIGS. 9A to 9C , in the embossing step (S6), the second embodiment of the second embodiment includes: applying the first high temperature to the substrate layer (29); applying the pressure to the first soluble mold (3) so that the polymer material layer (18) has the first transfer structure (9); after the first transfer structure (9) is formed, applying the pressure to the second soluble mold (11) so that the polymer material layer (18) has the second transfer structure (17); applying the first support The back plate (8) is separated from the first adhesive layer (5); and the second supporting back plate (16) is separated from the second adhesive layer (13); and the second high temperature is applied to the first soluble mold core (3) and the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the first soluble mold core (3), and the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so as to solidify the polymer material layer (18).

More preferably, as shown in FIGS. 9A to 9C , in the embossing step (S6), the third embodiment of the second embodiment includes: applying the first high temperature to the position of the substrate layer (29) corresponding to the first soluble mold core (3); and applying the pressure to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9); after the first transfer structure (9) is formed, applying the first high temperature to the position of the substrate layer (29) corresponding to the second soluble mold core (11); and applying the pressure to the second soluble mold core (11) so that the polymer material layer (18) has the first transfer structure (9); after the first transfer structure (9) is formed, applying the first high temperature to the position of the substrate layer (29) corresponding to the second soluble mold core (11); and applying the pressure to the second soluble mold core (11) so that the polymer material layer (18) has the first transfer structure (9); The material layer (18) has the second transfer structure (17); the first supporting back plate (8) is separated from the first adhesive layer (5); and the second supporting back plate (16) is separated from the second adhesive layer (13); and the second high temperature is applied to the first soluble mold core (3) and the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the first soluble mold core (3), and the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so as to solidify the polymer material layer (18).

More preferably, as shown in FIGS. 9D to 9G , in the embossing step (S6), the fourth embodiment of the second embodiment includes: applying the first high temperature and the pressure to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9) and the first supporting back plate (8) is separated from the first adhesive layer (5); and applying the second high temperature to the first soluble mold core (3); to the position of the substrate layer (29) corresponding to the first soluble mold core (3); or to the substrate layer (29) so that the polymer material layer (18) and the first soluble mold core (3) are bonded. The first high temperature and the pressure are applied to the second soluble mold core (11) so that the polymer material layer (18) has the second transfer structure (17) and the second supporting back plate (16) is separated from the second adhesive layer (13); and the second high temperature is applied to the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29) so that the polymer material layer (18) and the second soluble mold core (11) The corresponding part is cured.

More preferably, as shown in FIGS. 9D to 9G , in the embossing step (S6), the fifth embodiment of the second embodiment comprises: first: applying the first high temperature to the portion of the substrate layer (29) corresponding to the first soluble mold core (3); and applying the pressure to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9) and the first supporting back plate (8) is separated from the first adhesive layer (5); and then: applying the second high temperature to the first soluble mold core (3); to the position of the substrate layer (29) corresponding to the first soluble mold core (3); or to the substrate layer (29) so that the polymer material layer (18) and the first soluble mold core (3) are separated. The first step is to apply the first high temperature to the portion of the substrate layer (29) corresponding to the second soluble mold core (11); and the pressure to the second soluble mold core (11), so that the polymer material layer (18) has the second transfer structure (17), and the second supporting back plate (16) is separated from the second adhesive layer (13); and then: apply the second high temperature to the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so that the portion of the polymer material layer (18) corresponding to the second soluble mold core (11) is cured.

More preferably, as shown in FIGS. 9D to 9G , in the embossing step (S6), the sixth embodiment of the second embodiment includes: applying the first high temperature to the substrate layer (29); applying the pressure to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9) and the first supporting back plate (8) is separated from the first adhesive layer (5); and applying the second high temperature to the first soluble mold core (3); to the position of the substrate layer (29) corresponding to the first soluble mold core (3); or to the substrate layer (29) so that the polymer material layer (18) has the first transfer structure (9). 8) the portion corresponding to the first soluble mold core (3) is solidified; and the pressure is applied to the second soluble mold core (11) so that the polymer material layer (18) has the second transfer structure (17) and the second supporting back plate (16) is separated from the second adhesive layer (13); and the second high temperature is applied to the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29) so that the portion corresponding to the polymer material layer (18) and the second soluble mold core (11) is solidified.

The following is used to illustrate the third implementation of the embossing step (S6).

As shown in Figures 10A to 10C, the embossing step (S6) includes: applying a first high temperature to the polymer material layer (18); and applying a pressure to the first soluble mold (3) and the second soluble mold (11), so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave-convex structure (4); and a second transfer structure (17) corresponding to the second concave-convex structure (12); and separating the first tape (7) from the first adhesive layer (5); and separating the second tape (15) from the second adhesive layer (13), and applying a second high temperature to the polymer material layer (18) to cure the polymer material layer (18), wherein the first high temperature is different from the second high temperature. Preferably, as shown in FIG. 10D , the method further comprises: a peeling step (S8) of separating the first adhesive layer (5) from the first soluble mold core (3) after the embossing step (S6) and before the dissolving step (S7); and separating the second adhesive layer (13) from the second soluble mold core (11). Specifically, the first adhesive layer (5) and the second adhesive layer (13) are a thermally detachable tape, which will be detached when subjected to the first high-temperature baking. Therefore, when the first adhesive layer (5) is separated from the first soluble mold core (3) in the peeling step (S8); or when the second adhesive layer (13) is separated from the second soluble mold core (11), the polymer material layer (18) will not be affected by the tensile force and will not shake, deform, or produce defects.

More preferably, the heat sources for supplying the first high temperature and the second high temperature may be the same or different, wherein the heat source may heat the soluble mold core; heat the area of the substrate layer (29) corresponding to the soluble mold core; or heat the entire substrate layer (29) so that the temperature is transferred to the polymer material layer (18), thereby softening or curing the polymer material layer (18).

More preferably, as shown in FIGS. 10A to 10C , in the embossing step (S6), the first embodiment of the third embodiment comprises: applying the first high temperature and the pressure to the first soluble mold (3) so that the polymer material layer (18) has the first transfer structure (9); after forming the first transfer structure (9), applying the first high temperature and the pressure to the second soluble mold (11) so that the polymer material layer (18) has the second transfer structure (17); after forming the second transfer structure (17), , separating the first tape (7) from the first adhesive layer (5); and separating the second tape (15) from the second adhesive layer (13); and applying the second high temperature to the first soluble mold core (3) and the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the first soluble mold core (3), and the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so as to solidify the polymer material layer (18).

More preferably, as shown in FIGS. 10A to 10C , in the embossing step (S6), the second embodiment of the third embodiment comprises: applying the first high temperature to the substrate layer (29); applying the pressure to the first soluble mold (3) so that the polymer material layer (18) has the first transfer structure (9); after the first transfer structure (9) is formed, applying the pressure to the second soluble mold (11) so that the polymer material layer (18) has the second transfer structure (17); A tape (7) is separated from the first adhesive layer (5); and the second tape (15) is separated from the second adhesive layer (13); and the second high temperature is applied to the first soluble mold core (3) and the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the first soluble mold core (3), and the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so as to solidify the polymer material layer (18).

More preferably, as shown in FIGS. 10A to 10C , in the embossing step (S6), the third embodiment of the third embodiment includes: applying the first high temperature to the position of the substrate layer (29) corresponding to the first soluble mold core (3); and applying the pressure to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9); after the first transfer structure (9) is formed, applying the first high temperature to the position of the substrate layer (29) corresponding to the second soluble mold core (11); and applying the pressure to the second soluble mold core (11) so that the The polymer material layer (18) has the second transfer structure (17); the first tape (7) is separated from the first adhesive layer (5); and the second tape (15) is separated from the second adhesive layer (13); and the second high temperature is applied to the first soluble mold core (3) and the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the first soluble mold core (3), and the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so as to solidify the polymer material layer (18).

More preferably, as shown in FIGS. 10E to 10H, in the embossing step (S6), the fourth embodiment of the third embodiment includes: applying the first high temperature and the pressure to the first soluble mold (3) so that the polymer material layer (18) has the first transfer structure (9) and the first tape (7) is separated from the first adhesive layer (5); and applying the second high temperature to the first soluble mold (3); to the position of the substrate layer (29) corresponding to the first soluble mold (3); or to the substrate layer (29) so that the polymer material layer (18) and the first soluble mold (3) are connected. The first high temperature and the pressure are applied to the second soluble mold (11) so that the polymer material layer (18) has the second transfer structure (17) and the second tape (15) is separated from the second adhesive layer (13); and the second high temperature is applied to the second soluble mold (11); to the position of the substrate layer (29) corresponding to the second soluble mold (11); or to the substrate layer (29) so that the polymer material layer (18) and the second soluble mold (11) The corresponding part is cured.

More preferably, as shown in FIGS. 10E to 10H, in the embossing step (S6), the fifth embodiment of the third embodiment comprises: first: applying the first high temperature to the portion of the substrate layer (29) corresponding to the first soluble mold core (3); and applying the pressure to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9) and the first tape (7) is separated from the first adhesive layer (5); and then: applying the second high temperature to the first soluble mold core (3); to the position of the substrate layer (29) corresponding to the first soluble mold core (3); or to the substrate layer (29) so that the polymer material layer (18) is in contact with the first soluble mold core (3). The first step is to apply the first high temperature to the portion of the substrate layer (29) corresponding to the second soluble mold core (11); and the pressure to the second soluble mold core (11), so that the polymer material layer (18) has the second transfer structure (17), and the second tape (15) is separated from the second adhesive layer (13); and then: apply the second high temperature to the second soluble mold core (11); to the position of the substrate layer (29) corresponding to the second soluble mold core (11); or to the substrate layer (29), so that the portion of the polymer material layer (18) corresponding to the second soluble mold core (11) is cured.

More preferably, as shown in FIGS. 10E to 10H, in the embossing step (S6), the sixth embodiment of the third embodiment includes: applying the first high temperature to the substrate layer (29); applying the pressure to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9) and the first tape (7) is separated from the first adhesive layer (5); and applying the second high temperature to the first soluble mold core (3); to the position of the substrate layer (29) corresponding to the first soluble mold core (3); or to the substrate layer (29) so that the polymer material layer ( 18) and the portion corresponding to the first soluble mold (3) are solidified; and the pressure is applied to the second soluble mold (11) so that the polymer material layer (18) has the second transfer structure (17) and the second tape (15) is separated from the second adhesive layer (13); and the second high temperature is applied to the second soluble mold (11); to the position of the substrate layer (29) corresponding to the second soluble mold (11); or to the substrate layer (29) so that the portion corresponding to the polymer material layer (18) and the second soluble mold (11) are solidified.

The following is used to illustrate the fourth implementation of the embossing step (S6).

As shown in Figures 11A to 11C, the embossing step (S6) includes: applying a pressure to the first soluble mold (3) so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave-convex structure (4); and the second soluble mold (11) so that the polymer material layer (18) has a second transfer structure (17) corresponding to the second concave-convex structure (12); and irradiating the polymer material layer (18) with a UV light to cure the polymer material layer (18) and separate the first supporting backboard (8) from the first adhesive tape (7); and separating the second supporting backboard (16) from the second adhesive tape (15). Preferably, the UV light is provided by a UV emitting source (40); and the pressure is provided by a blowing element (39).

More preferably, as shown in FIGS. 11A to 11C , in the embossing step (S6), the first embodiment of the fourth embodiment includes: applying a pressure to the first soluble mold (3) so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave-convex structure (4); applying the pressure to the second soluble mold (11) so that the polymer material layer (18) has a second transfer structure (17) corresponding to the second concave-convex structure (12); irradiating the polymer material layer (18) with a UV light so that the polymer material layer (18) is cured; and separating the first supporting back plate (8) from the first adhesive tape (7), and separating the second supporting back plate (16) from the second adhesive tape (15).

More preferably, as shown in FIGS. 11D to 11G , in the embossing step (S6), the second embodiment of the fourth embodiment includes: first: applying a pressure to the first soluble mold (3) so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave-convex structure (4); irradiating the portion of the polymer material layer (18) corresponding to the first soluble mold (3) with a UV light so that the portion of the polymer material layer (18) corresponding to the first soluble mold (3) is cured; and The back plate (8) is separated from the first adhesive tape (7); and then: a pressure is applied to the second soluble mold (11) so that the polymer material layer (18) has a second transfer structure (17) corresponding to the second concave-convex structure (12); the UV light is irradiated on the portion of the polymer material layer (18) corresponding to the second soluble mold (11) so that the portion of the polymer material layer (18) corresponding to the second soluble mold (11) is cured; and the second supporting back plate (16) is separated from the second adhesive tape (15).

More preferably, as shown in FIGS. 11D to 11G , in the embossing step (S6), the third embodiment of the fourth embodiment comprises: applying a pressure to the first soluble mold (3) so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave-convex structure (4); applying the pressure to the second soluble mold (11) so that the polymer material layer (18) has a second transfer structure (17) corresponding to the second concave-convex structure (12); irradiating the polymer material layer (18) and the second soluble mold (11) with a UV light; The first soluble mold core (3) is irradiated with a UV light to cure the portion of the polymer material layer (18) corresponding to the first soluble mold core (3), and the first supporting back plate (8) is separated from the first adhesive tape (7); and the portion of the polymer material layer (18) corresponding to the second soluble mold core (11) is irradiated with a UV light to cure the portion of the polymer material layer (18) corresponding to the second soluble mold core (11), and the second supporting back plate (16) is separated from the second adhesive tape (15).

More preferably, a transfer element (37) can be used to apply a first high temperature, a second high temperature, and a pressure to the first soluble mold (3), so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave-convex structure (4); or the second soluble mold (11) can be used to make the polymer material layer (18) have a second transfer structure (17) corresponding to the second concave-convex structure (12). Preferably, the first high temperature can make the temperature of the polymer material layer (18) reach its glass transition temperature first and the pressure can make the material of the polymer material layer (18) fully flow into the first concave-convex structure (4), and then the second high temperature can solidify the material of the polymer material layer (18) so that the first transfer structure (9) of the polymer material layer (18) completely corresponds to the first concave-convex structure (4). Preferably, the first high temperature can make the temperature of the polymer material layer (18) reach its glass transition temperature first, and the pressure can make the material of the polymer material layer (18) fully flow into the second concave-convex structure (12), and then the second high temperature can solidify the material of the polymer material layer (18) so that the second transfer structure (17) of the polymer material layer (18) completely corresponds to the second concave-convex structure (12). Preferably, the time of applying the first high temperature and pressure is 1 to 20 minutes, but not limited thereto. Preferably, the temperature of the first high temperature is 50 to 160°C, but not limited thereto. It should be noted that the time range and the temperature range of the first high temperature applied can be determined according to the material of the polymer material layer (18); generally, the principle is that the top of the polymer material layer (18) is not dissolved and the first transfer structure (9) or the second transfer structure (17) does not produce structural defects. In addition, the pressure applied can be applied by applying positive pressure to the side of the first soluble mold core (3) or the second soluble mold core (11) opposite to the polymer material layer (18); or by applying negative pressure to the side of the first soluble mold core (3) or the second soluble mold core (11) adjacent to the polymer material layer (18); or by applying positive pressure and negative pressure at the same time. Preferably, the positive pressure is +20 to +600 kPa, and the negative pressure is -10 to -101.3 kPa, but not limited thereto. It should be noted that the negative pressure can be used to extract the volatile solvent (19) that escapes from the polymer material layer (18) due to heat, so as to avoid the solvent remaining in the polymer material layer (18) and causing structural defects in the first transfer structure (9) or the second transfer structure (17). More preferably, the transfer element (37) includes a heating element (38) that provides a high temperature and a blowing element (39) that provides pressure, but not limited thereto. More preferably, when the material of the first tape (7) is a thermally decomposable foam, the first tape (7) can be decomposed and cracked at the first high temperature by making the decomposition temperature of the first tape (7) (preferably 80 to 150°C) lower than the first high temperature. More preferably, the first tape (7), the second tape (15), the first adhesive layer (5), and the second adhesive layer (13) are made of the same thermally decomposable foam, so they are all affected by the first high temperature and decomposed, and can be easily separated from the adherend or the adherend.

More preferably, a transfer element (37) can be used to apply a second high temperature to the first soluble mold (3) or the second soluble mold (11), wherein: the second high temperature is greater than the first high temperature, so as to solidify the polymer material layer (18). Specifically, the second high temperature can make the temperature of the polymer material layer (18) reach its solidification temperature so as to crosslink and solidify the material. In this way, the elasticity of the polymer material layer (18) can be reduced so that the first transfer structure (9) of the polymer material layer (18) completely corresponds to the first concave-convex structure (4); or the second transfer structure (17) completely corresponds to the second concave-convex structure (12). Preferably, the second high temperature is 120 to 180°C, but is not limited thereto. This step is particularly performed when the material of the polymer material layer (18) is a thermosetting resin (such as epoxy resin). In detail, this step can ensure that the polymer material layer (18) will not deform when placed in a temperature environment lower than the second highest temperature. Preferably, the second highest temperature can be provided by the heating element (38) of the transfer element (37).

The following FIG. 12 is used to illustrate the peeling step (S8) of the present invention: "Separating the first adhesive layer (5) from the first soluble mold core (3); and separating the second adhesive layer (13) from the second soluble mold core (11)." Specifically, this step is performed after the embossing step (S6) and before the dissolving step (S7). Preferably, in this step, the first adhesive layer (5) and the second adhesive layer (13) are thermally releasable tapes. When they are subjected to the first high-temperature baking, the first adhesive layer (5) is released and can be easily peeled off from the surface of the first soluble mold core (3); and the second adhesive layer (13) is released and can be easily peeled off from the surface of the second soluble mold core (11).

The following Figures 13A to 13C are used to illustrate the dissolution step (S7) of the present invention: "Use a solvent (19) to dissolve the first soluble mold (3) and the second soluble mold to obtain a transfer object (20) having a first transfer structure (9) and a second transfer structure (17)."

As shown in Figures 13A to 13C, a dissolving element can be used to provide a solvent (19) to dissolve the first soluble mold (3) and the second soluble mold (11), so that the cured polymer material layer (18) is separated from the first supporting back plate (8) and the second supporting back plate (16) to obtain a transfer object (20) having a first transfer structure (9) and a second transfer structure (17). Preferably, a dissolving element can be used to provide a solvent (19) to dissolve the first soluble mold (3) and the second soluble mold (11), so that the cured polymer material layer (18) is separated from the first adhesive layer (5) and the second adhesive layer (13) to obtain a transfer object (20) having a first transfer structure (9) and a second transfer structure (17).

It should be noted that the type of solvent (19) used may depend on the materials of the first soluble mold (3) and the second soluble mold (11). Preferably, when the materials of the first soluble mold (3) and the second soluble mold (11) are water-soluble polyacrylamide (PAM), polyurethane, polyurea, polyamide, polyester, polyurethane, polyvinyl pyrrolidone, ethylene-vinyl alcohol, polyacrylamide-glyoxal polymer, or polyacrylic acid, the solvent (19) used is water, but is not limited thereto.

More preferably, the first soluble mold core (3) and the second soluble mold core (11) can be dissolved by the solvent (19) on the machine platform (30). Preferably, before the dissolving step (S7), the first frame structure (6) can be separated from the first supporting back plate (8); and the second frame structure (14) can be separated from the second supporting back plate (16). Preferably, before the dissolving step (S7), the first adhesive tape (7) can be separated from the first supporting back plate (8); and the second adhesive tape (15) can be separated from the second supporting back plate (16). Preferably, before the dissolving step (S7), the first supporting back plate (8) can be separated from the first adhesive layer (5); and the second supporting back plate (16) can be separated from the second adhesive layer (13). Preferably, before the dissolving step (S7), the first adhesive tape (7) can be separated from the first adhesive layer (5); and the second adhesive tape (15) can be separated from the second adhesive layer (13). Preferably, when the first soluble mold core (3) and the second soluble mold core (11) are dissolved by the solvent (19), it can be carried out on the machine platform (30), but it can also be carried out in an area outside the machine platform (30). Specifically, the substrate layer (29) and the cured polymer material layer (18) disposed on the substrate layer (29), the first soluble mold (3), the second soluble mold (11), the first supporting back plate (8), and the second supporting back plate (16) are placed together in a container containing a solvent (19), and the first soluble mold (3) and the second soluble mold (11) are dissolved by the solvent to separate the cured polymer material layer (18) from the first supporting back plate (8) and the second supporting back plate (16), so as to obtain a transfer object (20) having the first transfer structure (9) and the second transfer structure (17).

More preferably, as shown in Figures 14A to 14D, a series of embossing processes of the present invention are described. Specifically, the soluble mold is continuously pressed into the polymer material layer (18) in a continuous manner until the available space on the polymer material layer (18) is completely embossed. It can be understood that the soluble mold can be arranged according to numbers, and the order of embossing is determined according to the size of the numbers, but it is not limited to this. Preferably, after the available space on the polymer material layer (18) is embossed, a dissolution step (S7) is performed to obtain a large-scale transfer object (20).

More preferably, in summary, the present invention can accurately, stably and continuously emboss the polymer material with the mold, so as to efficiently obtain a large-scale range of transfer objects (20), and the transfer objects (20) finally obtained have both high yield and high quality, and can achieve higher stability, durability and safety in practical applications. Specifically, in the present invention, the first supporting back plate (8) is bonded to the first soluble mold core (3) by means of the first adhesive layer (5). Therefore, when the first soluble mold core (3) is separated from the first sample mold (2), when the first soluble mold core (3) is in contact with or aligned with the polymer material layer (18), when the first high temperature or pressure is applied to the first soluble mold core (3), the first frame structure (6) is relatively close to the first supporting back plate. When the first frame structure (6) and the first adhesive tape (7) disposed on the first frame structure (6) are separated from the first supporting back plate (8); and when the first soluble mold core (3) is dissolved, the first supporting back plate (8) can maintain the structure of the first soluble mold core (3) so that the first soluble mold core (3) does not deviate or deform, thereby preventing the final embossed transfer object (20) from having defects. In addition, since the second supporting back plate (16) is bonded to the second soluble mold core (11) by the second adhesive layer (13) before the dissolving step (S7) is performed, when the second soluble mold core (11) and the second sample mold (10) are separated; when the second soluble mold core (11) and the polymer material layer (18) are in contact or aligned; when the first high temperature or pressure is applied to the second soluble mold core (11); when the second frame structure (14) is relatively close to the second supporting back plate (16), the second supporting back plate (16) is bonded to the second soluble mold core (11) by the second adhesive layer (13). When the supporting back plate (16) is separated; when the second frame structure (14) and the second adhesive tape (15) disposed on the second frame structure (14) are separated relative to the second supporting back plate (16); and when the second soluble mold (11) is dissolved, the second supporting back plate (16) can maintain the structure of the second soluble mold (11) so that the second soluble mold (11) does not deviate or deform, thereby preventing the final printed transfer object (20) from having defects.

However, the above is only the preferred embodiment of the present invention, and it cannot be used to limit the scope of the implementation of the present invention. That is, all simple equivalent changes and modifications made according to the scope of the patent application and the content of the invention description are still within the scope of the present invention. In addition, any embodiment or patent application scope of the present invention does not need to achieve all the purposes, advantages or features disclosed by the present invention. In addition, the abstract and title are only used to assist in searching patent documents, and are not used to limit the scope of the rights of the present invention. In addition, the first, second, etc. mentioned in the specification are only used to indicate the name of the component, and are not used to limit the upper or lower limit of the number of components.

S1: Add step

S2: Formation step

S3: Moulding step

S4: Separation step

S5: Contact step

S6: Imprinting step

S7: Dissolution step

Claims (10)

A method for large-scale stamping includes: an adding step, adding a soluble material into a first sample mold and a second sample mold, and curing the soluble material to form a first soluble mold core in the first sample mold, wherein the first soluble mold core has a first concave-convex structure; and forming a second soluble mold core in the second sample mold, wherein the second soluble mold core has a second concave-convex structure; a forming step, forming a first adhesive layer on one side of the first soluble mold core relative to the first sample mold; and forming a second adhesive layer on one side of the second soluble mold core relative to the second sample mold; a mold removal step, including: attaching A first molding device is disposed on a side of the first adhesive layer opposite to the first sample mold, wherein the first molding device comprises: a first frame structure; a first tape, which is disposed on the first frame structure; and a first supporting back plate, which is disposed on the first tape, wherein the first molding device is in contact with the first adhesive layer with the first supporting back plate; and a second molding device is attached to a side of the second adhesive layer opposite to the second sample mold, wherein the second molding device comprises: a second frame structure; a second tape, which is disposed on the second frame structure; and a second supporting back plate, which is disposed on the second tape, wherein the second molding device is in contact with the first adhesive layer with the second supporting back plate. The back plate is in contact with the second adhesive layer; a separation step, comprising: separating the first mold taking device from the first sample mold, wherein the first soluble mold core is separated from the first sample mold along with the first mold taking device; and separating the second mold taking device from the second sample mold, wherein the second soluble mold core is separated from the second sample mold along with the second mold taking device; a contact step, comprising: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; an embossing step, comprising: applying a first high temperature to the polymer material layer; and applying a pressure to the first soluble mold core and the second soluble mold core. Two soluble molds are provided to make the polymer material layer have a first transfer structure corresponding to the first concavo-convex structure; and a second transfer structure corresponding to the second concavo-convex structure; and the first supporting back plate is separated from the first adhesive tape; and the second supporting back plate is separated from the second adhesive tape, and a second high temperature is applied to the polymer material layer to solidify the polymer material layer, wherein the first high temperature is different from the second high temperature; and a dissolving step is provided to dissolve the first soluble mold and the second soluble mold, so that the solidified polymer material layer is separated from the first supporting back plate and the second supporting back plate to obtain a transfer object. A method for large-scale stamping includes: an adding step, adding a soluble material into a first sample mold and a second sample mold, and curing the soluble material to form a first soluble mold core in the first sample mold, wherein the first soluble mold core has a first concave-convex structure; and forming a second soluble mold core in the second sample mold, wherein the second soluble mold core has a second concave-convex structure; a forming step, forming a first adhesive layer on one side of the first soluble mold core relative to the first sample mold; and forming a second adhesive layer on one side of the second soluble mold core relative to the second sample mold; A mold removal step, including: A first molding device is attached to a side of the first adhesive layer opposite to the first sample mold, wherein the first molding device includes: a first frame structure; a first tape, which is arranged on the first frame structure; and a first supporting back plate, which is arranged on the first tape, wherein the first molding device is in contact with the first adhesive layer with the first supporting back plate; and a second molding device is attached to a side of the second adhesive layer opposite to the second sample mold, wherein the second molding device includes: a second frame structure; a second tape, which is arranged on the second frame structure; and a second supporting back plate, which is arranged on the second tape, wherein the second molding device is in contact with the second adhesive layer with the second supporting back plate. The supporting back plate is in contact with the second adhesive layer; a separation step includes: separating the first mold device relative to the first sample mold, wherein the first soluble mold core is separated from the first sample mold along with the first mold device; and separating the second mold device relative to the second sample mold, wherein the second soluble mold core is separated from the second sample mold along with the second mold device; a contact step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; an embossing step includes: applying a first high temperature to the polymer material layer; and applying a pressure to the first soluble mold core and the polymer material layer. The second soluble mold core is provided to make the polymer material layer have a first transfer structure corresponding to the first concavo-convex structure; and a second transfer structure corresponding to the second concavo-convex structure; and the first supporting back plate is separated from the first adhesive layer; and the second supporting back plate is separated from the second adhesive layer, and a second high temperature is applied to the polymer material layer to solidify the polymer material layer, wherein the first high temperature is different from the second high temperature; and a dissolving step is provided to dissolve the first soluble mold core and the second soluble mold core, so that the solidified polymer material layer is separated from the first adhesive layer and the second adhesive layer to obtain a transfer object. A method for large-scale stamping includes: an adding step, adding a soluble material into a first sample mold and a second sample mold, and curing the soluble material to form a first soluble mold core in the first sample mold, wherein the first soluble mold core has a first concave-convex structure; and forming a second soluble mold core in the second sample mold, wherein the second soluble mold core has a second concave-convex structure; a forming step, forming a first adhesive layer on one side of the first soluble mold core relative to the first sample mold; and forming a second adhesive layer on one side of the second soluble mold core relative to the second sample mold; a demolding step, including: attaching a first demolding layer to the first sample mold; The mold device is arranged on a side of the first adhesive layer relative to the first sample mold, wherein the first mold device includes: a first frame structure; a first tape, which is arranged on the first frame structure; and a first supporting back plate, which is arranged on the first tape, wherein the first mold device is in contact with the first adhesive layer with a side of the first tape relative to the first supporting back plate; and a second mold device is attached to a side of the second adhesive layer relative to the second sample mold, wherein the second mold device includes: a second frame structure; a second tape, which is arranged on the second frame structure; and a second supporting back plate, which is arranged on the second tape, wherein the second mold device is in contact with the first adhesive layer with a side of the first tape relative to the first supporting back plate. The second adhesive layer is contacted with one side of the second supporting back plate relative to the second adhesive layer; a separation step includes: separating the first mold taking device relative to the first sample mold, wherein the first soluble mold core is separated from the first sample mold along with the first mold taking device; and separating the second mold taking device relative to the second sample mold, wherein the second soluble mold core is separated from the second sample mold along with the second mold taking device; a contact step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; an embossing step includes: applying a first high temperature to the polymer material layer; and applying a pressure to the first The soluble mold and the second soluble mold are used to make the polymer material layer have a first transfer structure corresponding to the first concave-convex structure; and a second transfer structure corresponding to the second concave-convex structure; and the first tape is separated from the first adhesive layer; and the second tape is separated from the second adhesive layer, and a second high temperature is applied to the polymer material layer to solidify the polymer material layer, wherein the first high temperature is different from the second high temperature; and a dissolving step is provided, which is to provide a solvent to dissolve the first soluble mold and the second soluble mold, so that the solidified polymer material layer is separated from the first adhesive layer and the second adhesive layer to obtain a transfer object. The method as described in claim 3 further comprises: a peeling step, which is to peel the first adhesive layer from the surface of the first soluble mold after the embossing step and before the dissolving step; and peel the second adhesive layer from the surface of the second soluble mold. A method for large-scale stamping includes: an adding step, adding a soluble material into a first sample mold and a second sample mold, and curing the soluble material to form a first soluble mold core in the first sample mold, wherein the first soluble mold core has a first concave-convex structure; and forming a second soluble mold core in the second sample mold, wherein the second soluble mold core has a second concave-convex structure; a forming step, forming a first adhesive layer on a side of the first soluble mold core relative to the first sample mold; and forming a second adhesive layer on a side of the second soluble mold core relative to the second sample mold; a demolding step The method comprises: attaching a first molding device to a side of the first adhesive layer opposite to the first sample mold, wherein the first molding device comprises: a first frame structure; a first adhesive tape, which is arranged on the first frame structure; and a first supporting back plate, which is arranged on the first adhesive tape, wherein the first molding device is in contact with the first adhesive layer with the first supporting back plate; and attaching a second molding device to a side of the second adhesive layer opposite to the second sample mold, wherein the second molding device comprises: a second frame structure; a second adhesive tape, which is arranged on the second frame structure; and a second supporting back plate, which is arranged on the second adhesive tape, wherein The second mold taking device is in contact with the second adhesive layer with the second supporting back plate; a separation step includes: separating the first mold taking device from the first sample mold, wherein the first soluble mold core is separated from the first sample mold along with the first mold taking device; and separating the second mold taking device from the second sample mold, wherein the second soluble mold core is separated from the second sample mold along with the second mold taking device; a contact step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; an embossing step includes: applying a pressure to the first soluble mold core to make The polymer material layer has a first transfer structure corresponding to the first concavo-convex structure; and the second soluble mold core makes the polymer material layer have a second transfer structure corresponding to the second concavo-convex structure; and the polymer material layer is irradiated with a UV light to solidify the polymer material layer, and the first supporting back plate is separated from the first adhesive tape; and the second supporting back plate is separated from the second adhesive tape; and a dissolving step is provided, which is to provide a solvent to dissolve the first soluble mold core and the second soluble mold core, so that the cured polymer material layer is separated from the first supporting back plate and the second supporting back plate to obtain a transfer object. The method as described in any one of claims 1 to 4, wherein the polymer material layer is formed on a substrate layer, and the contacting step comprises: firstly, heating the first soluble mold core to a temperature T, wherein 0<T<T _g , and bringing the first soluble mold core into contact with the polymer material layer; and then, heating the second soluble mold core to the temperature T, and bringing the second soluble mold core into contact with the polymer material layer; the contacting step may comprise: firstly, heating the substrate layer to a temperature T, wherein 0<T<T _g , and the first soluble mold core is in contact with the polymer material layer; next: the second soluble mold core is in contact with the polymer material layer; and the contacting step may include: first: the portion of the substrate layer corresponding to the first soluble mold core is heated to a temperature T, wherein 0<T<T _g , and the first soluble mold core is in contact with the polymer material layer; next: the portion of the substrate layer corresponding to the second soluble mold core is heated to the temperature T, and the second soluble mold core is in contact with the polymer material layer. The method as described in claim 1, wherein the polymer material layer is formed on a substrate layer, and the embossing step includes: applying the first high temperature and the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; after forming the first transfer structure, applying the first high temperature and the pressure to the second soluble mold so that the polymer material layer has the second transfer structure; after forming the second transfer structure, separating the first supporting back plate from the first tape; and separating the second supporting back plate from the second tape; and applying the second high temperature to the first soluble mold and the second soluble mold; The substrate layer is placed at a position corresponding to the first soluble mold core, and at a position corresponding to the second soluble mold core; or to the substrate layer, so that the polymer material layer is solidified; the embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, applying the pressure to the second soluble mold core, so that the polymer material layer has the second transfer structure; separating the first supporting back plate from the first tape; and separating the second supporting back plate from the second tape; and applying the second high temperature to The first soluble mold core and the second soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core, and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the polymer material layer is solidified; The embossing step may include: applying the first high temperature to the position of the substrate layer corresponding to the first soluble mold core; and the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, applying the first high temperature to the position of the substrate layer corresponding to the second soluble mold core; and the pressure to the second soluble mold core. The first support back plate is separated from the first adhesive tape; and the second support back plate is separated from the second adhesive tape; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core, and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the polymer material layer is cured; the embossing step may include: applying the first high temperature and the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and the first support back plate is separated from the first ... and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; The second high temperature is applied to the first soluble mold core, to the position of the substrate layer corresponding to the first soluble mold core, or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and the first high temperature and the pressure are applied to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second adhesive tape; and the second high temperature is applied to the second soluble mold core, to the position of the substrate layer corresponding to the second soluble mold core, or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified. Partially solidified; the embossing step may include: first: applying the first high temperature to the portion of the substrate layer corresponding to the first soluble mold core; and the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure and the first supporting back plate is separated from the first tape; then: applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and first: applying the first high temperature to the portion of the substrate layer corresponding to the second soluble mold core; and The pressure is applied to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second tape; then: the second high temperature is applied to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified; and the embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and the first supporting back plate is separated from the first tape; and applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and the first high temperature is applied to the substrate layer; the pressure is applied to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second adhesive tape; and the second high temperature is applied to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified. The method as described in claim 2, wherein the polymer material layer is formed on a substrate layer, and the embossing step comprises: applying the first high temperature and the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; after forming the first transfer structure, applying the first high temperature and the pressure to the second soluble mold so that the polymer material layer has the second transfer structure; after forming the second transfer structure, separating the first supporting back plate from the first adhesive layer; and separating the second supporting back plate from the second adhesive layer; and applying the second high temperature to the first soluble mold and the second soluble mold; to the position of the substrate layer corresponding to the first soluble mold core and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the polymer material layer is cured; the embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, applying the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure; separating the first supporting back plate from the first adhesive layer; and separating the second supporting back plate from the second adhesive layer; and applying the second high temperature to the first soluble mold core and the second soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer to solidify the polymer material layer; the embossing step may include: applying the first high temperature to the position of the substrate layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, applying the first high temperature to the position of the substrate layer corresponding to the second soluble mold core; and applying the pressure to the second soluble mold core. The first support back plate is separated from the first adhesive layer; and the second support back plate is separated from the second adhesive layer; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the polymer material layer is cured; the embossing step may include: applying the first high temperature and the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and the first support back plate is separated from the first ... and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the The second high temperature is applied to the first soluble mold core, to the position of the substrate layer corresponding to the first soluble mold core, or to the substrate layer, so that the polymer material layer and the first soluble mold core The corresponding portion is solidified; and the first high temperature and the pressure are applied to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second adhesive layer; and the second high temperature is applied to the second soluble mold core, to the position of the substrate layer corresponding to the second soluble mold core, or to the substrate layer, so that the polymer material layer and the second soluble mold core The corresponding portion is solidified. The embossing step may include: first: applying the first high temperature to the portion of the substrate layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure and the first supporting back plate is separated from the first adhesive layer; then: applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is cured; and first: applying the first high temperature to the portion of the substrate layer corresponding to the second soluble mold core; and The pressure is applied to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second adhesive layer; then: the second high temperature is applied to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified; and the embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and the first supporting back plate is separated from the first adhesive layer; and applying the second high temperature Applying the first high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and applying the first high temperature to the substrate layer; applying the pressure to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second supporting back plate is separated from the second adhesive layer; and applying the second high temperature to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified. The method as described in claim 3 or 4, wherein the polymer material layer is formed on a substrate layer, and the embossing step comprises: applying the first high temperature and the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; after forming the first transfer structure, applying the first high temperature and the pressure to the second soluble mold so that the polymer material layer has the second transfer structure; after forming the second transfer structure, separating the first tape from the first adhesive layer; and separating the second tape from the second adhesive layer; and applying the second high temperature to the first soluble mold and the second soluble mold. The embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, applying the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure; separating the first tape from the first adhesive layer; and separating the second tape from the second adhesive layer; and applying the second high temperature to the substrate layer; The first soluble mold core and the second soluble mold core are heated to the first high temperature; the substrate layer corresponds to the first soluble mold core, and the substrate layer corresponds to the second soluble mold core; or the substrate layer is heated to the substrate layer to solidify the polymer material layer; the embossing step may include: applying the first high temperature to the substrate layer and the first soluble mold core corresponding position; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, applying the first high temperature to the substrate layer and the second soluble mold core corresponding position; and applying the pressure to the second soluble mold core. The first adhesive tape is separated from the first adhesive layer; and the second adhesive tape is separated from the second adhesive layer; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core and the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer to solidify the polymer material layer; the embossing step may include: applying the first high temperature and the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure, and the first ... and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble mold core and the second soluble mold core; and the second high temperature is applied to the first soluble The second high temperature is applied to the first soluble mold core, to the position of the substrate layer corresponding to the first soluble mold core, or to the substrate layer, so that the polymer material layer and the first soluble mold core The corresponding portion is solidified; and the first high temperature and the pressure are applied to the second soluble mold core so that the polymer material layer has the second transfer structure and the second tape is separated from the second adhesive layer; and the second high temperature is applied to the second soluble mold core, to the position of the substrate layer corresponding to the second soluble mold core, or to the substrate layer so that the polymer material layer and the second soluble mold core The corresponding portion is solidified. The embossing step may include: first: applying the first high temperature to the portion of the substrate layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure and the first tape is separated from the first adhesive layer; then: applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is cured; and first: applying the first high temperature to the portion of the substrate layer corresponding to the second soluble mold core; and and the pressure to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the second tape is separated from the second adhesive layer; then: applying the second high temperature to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the polymer material layer and the second soluble mold core The corresponding portion is solidified; and the embossing step may include: applying the first high temperature to the substrate layer; applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and the first tape is separated from the first adhesive layer; and applying the second high temperature to the first soluble mold core; to the position of the substrate layer corresponding to the first soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the first soluble mold core is solidified; and the first high temperature is applied to the substrate layer; the pressure is applied to the second soluble mold core, so that the polymer material layer has the second transfer structure and the second tape is separated from the second adhesive layer; and the second high temperature is applied to the second soluble mold core; to the position of the substrate layer corresponding to the second soluble mold core; or to the substrate layer, so that the portion of the polymer material layer corresponding to the second soluble mold core is solidified. The method as described in claim 5, wherein the polymer material layer is formed on a substrate layer, and the embossing step comprises: first: applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; irradiating the portion of the polymer material layer corresponding to the first soluble mold core with the UV light so that the portion of the polymer material layer corresponding to the first soluble mold core is cured; and separating the first supporting back plate from the first adhesive tape; and then: Applying the pressure to the second soluble mold so that the polymer material layer has the second transfer structure; irradiating the portion of the polymer material layer corresponding to the second soluble mold with the UV light so that the portion of the polymer material layer corresponding to the second soluble mold is cured; and separating the second supporting back plate from the second adhesive tape; the embossing step may include: applying the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; applying the pressure to the The second soluble mold is used to make the polymer material layer have the second transfer structure; the polymer material layer is irradiated with the UV light to cure the polymer material layer; and the first supporting back plate is separated from the first tape, and the second supporting back plate is separated from the second tape; and the embossing step may include: applying the pressure to the first soluble mold so that the polymer material layer has the first transfer structure; applying the pressure to the second soluble mold so that the polymer material layer has the The second transfer structure; irradiating the portion of the polymer material layer corresponding to the first soluble mold core with the UV light to solidify the portion of the polymer material layer corresponding to the first soluble mold core, and separating the first supporting back plate from the first adhesive tape; and irradiating the portion of the polymer material layer corresponding to the second soluble mold core with the UV light to solidify the portion of the polymer material layer corresponding to the second soluble mold core, and separating the second supporting back plate from the second adhesive tape.

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