TW202335824A - Method for large scale imprinting - Google Patents

Method for large scale imprinting Download PDF

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TW202335824A
TW202335824A TW111108882A TW111108882A TW202335824A TW 202335824 A TW202335824 A TW 202335824A TW 111108882 A TW111108882 A TW 111108882A TW 111108882 A TW111108882 A TW 111108882A TW 202335824 A TW202335824 A TW 202335824A
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mold core
material layer
soluble
polymer material
dissolvable
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TW111108882A
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TWI837607B (en
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蔡嵩玟
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永嘉光電股份有限公司
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Priority claimed from TW111108882A external-priority patent/TWI837607B/en
Priority to CN202310190745.8A priority patent/CN116736630A/en
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Abstract

The present invention relates to a method for large scale imprinting comprising: an adding step at which a soluble material is added to a master mold to form a soluble mold, wherein the soluble mold has a concave-convex pattern; a forming step at which an adhesive layer is formed on a side of the soluble mold opposite to the master mold; a picking step at which a picking device contacts with the adhesive layer, wherein the picking device comprises a frame and a support plate positioned on the frame, and the support plate is contacted with the adhesive layer; a separating step at which the taking device is removed along with the soluble mold from the master mold; a contacting step at which the soluble mold contacts with a polymer layer; an imprinting step at which a high temperature and a pressure are applied to the soluble mold so as to create an imprint pattern corresponding the concave-convex pattern on the polymer layer and to solidify the polymer layer; a dissolving step at which a solvent is provided to dissolve the soluble mold so as to obtain the imprint pattern.

Description

大規模壓印之方法Method of large-scale imprinting

本發明關於一種壓印方法,特別係指一種可連續進行壓印,並於壓印完成後利用溶劑去除模仁的壓印方法。The present invention relates to an imprinting method, in particular to an imprinting method that can continuously perform imprinting and use a solvent to remove the mold core after the imprinting is completed.

以模具在基板上形成印刷圖案之方法係為「壓印」,其中壓印之方法可依照其加工之方式分為「熱壓印法」、與「光壓印法」,具體而言,熱壓印法包含:將膜具壓印於溫度達到玻璃轉移溫度以上之高分子樹脂上;以及於高分子樹脂冷卻至玻璃轉移溫度下之後,將模具相對於高分子樹脂分離,使高分子樹脂上形成有與模具上之微結構相對應之轉印結構。具體而言,熱壓印法可參照S. Chou et al., Appl. Phys. Lett. 67, 3114 (1995)中所述之內容,其係使用熱塑性樹脂作為加工材料;以及光壓印法可參照J. Haisma et al., J. Vac. Sci. Technol. B 14(6), 4124 (1996) 中所述之內容,其係使用硬化組成物作為加工物件。The method of using a mold to form a printed pattern on a substrate is "imprinting". The method of imprinting can be divided into "hot embossing method" and "photo embossing method" according to its processing method. Specifically, thermal embossing method The imprinting method includes: imprinting the film on a polymer resin whose temperature reaches above the glass transition temperature; and after the polymer resin is cooled to the glass transition temperature, separating the mold from the polymer resin to allow the polymer resin to A transfer structure corresponding to the microstructure on the mold is formed. Specifically, the hot embossing method can refer to the content described in S. Chou et al., Appl. Phys. Lett. 67, 3114 (1995), which uses thermoplastic resin as the processing material; and the light embossing method can Referring to the content described in J. Haisma et al., J. Vac. Sci. Technol. B 14(6), 4124 (1996), a hardened composition is used as the processed object.

所謂「脫模(mold release)」係將模具與轉印物件分離之過程。其中於壓印之過程中,會將膜具與高分子材料間進行分離,因此模具之脫模性能對於脫膜過程、與壓印品質之影響重大,對於後續模具之維護、或轉印結構之完整度有著重大影響。具體而言,美國專利公告號US6,849,558B2與美國專利公開號US2006/0249886A1均提出一種可被一溶劑溶解之模具。此種可溶解性模具為透過灌注可溶解性材料至樣模內固化取得,之後利用預製件(preform)自樣模取出模具。依Journal of Vacuum Science & Technology B 21, 2961 (2003)所述,預製件與可溶解性材料為相同材料,並於可溶解性材料完全固化前附著至可溶解性材料。一般而言,可溶解性材料的濃度與厚度均會影響固化時間,因此預製件於可溶解性材料固化至何種程度下始能附著考驗著操作人員的專業與經驗。依M. W. Lin et al., J. Micro/Nanolith. MEMS MOEMS 7(3), 033005 (2008)所述,其使硬化性組成物中含有含氟單體分子或非反應性的含氟化合物,以改良其脫模性。The so-called "mold release" is the process of separating the mold from the transferred object. During the embossing process, the film tool and the polymer material will be separated. Therefore, the release performance of the mold has a significant impact on the release process and the embossing quality. It also affects the subsequent maintenance of the mold or the transfer structure. Completeness has a significant impact. Specifically, US Patent Publication No. US6,849,558B2 and US Patent Publication No. US2006/0249886A1 both propose a mold that can be dissolved by a solvent. This type of soluble mold is obtained by injecting soluble materials into a sample mold for solidification, and then using a preform to remove the mold from the sample mold. According to Journal of Vacuum Science & Technology B 21, 2961 (2003), the preform and the soluble material are the same material and are attached to the soluble material before the soluble material is completely cured. Generally speaking, the concentration and thickness of the soluble material will affect the curing time. Therefore, the degree to which the preform must be cured before the soluble material can be adhered tests the expertise and experience of the operator. According to M. W. Lin et al., J. Micro/Nanolith. MEMS MOEMS 7(3), 033005 (2008), the curable composition contains fluorine-containing monomer molecules or non-reactive fluorine-containing compounds. Improve its release properties.

所謂「分子轉移光刻」係利用曝光和顯影在光阻層上刻畫幾何圖形結構,然後通過蝕刻製程將光罩上的圖形轉移到所在基板上,其可以精確地控制形成圖形的形狀、大小,為半導體領域中之重要製程。依Nanotechnology 24 (2013) 085302 (6pp)所述,模具雖同樣為可溶解性模具,但由於採用滾輪方式使模具均勻地置於物件上,因而造成後續所得之微細結構間距擴張而變形。The so-called "molecular transfer lithography" uses exposure and development to carve a geometric structure on the photoresist layer, and then transfers the pattern on the photomask to the substrate through an etching process. It can accurately control the shape and size of the formed pattern. It is an important process in the semiconductor field. According to Nanotechnology 24 (2013) 085302 (6pp), although the mold is also a dissolvable mold, the roller method is used to place the mold evenly on the object, which causes the spacing of the subsequent fine structures to expand and deform.

本發明所欲解決之問題在於:提供一種壓印方法,可以一模仁連續進行壓印,以取得大規模之轉印物件。The problem to be solved by the present invention is to provide an imprinting method that can continuously imprint one mold to obtain large-scale transfer objects.

為解決上述之問題,本發明提供一種大規模壓印之方法,係包括:一添加步驟,係添加一可溶解性材料於一第一樣模以及一第二樣模內,並固化該可溶解性材料,以於該第一樣模中形成一第一可溶解性模仁,其中該第一可溶解性模仁具有一第一凹凸結構;以及於該第二樣模中形成一第二可溶解性模仁,其中該第二可溶解性模仁具有一第二凹凸結構;一形成步驟,於該第一可溶解性模仁相對於該第一樣模之一側形成一第一黏著層;以及於該第二可溶解性模仁相對於該第二樣模之一側形成一第二黏著層;一取模步驟,係包含:附著一第一取模裝置於該第一黏著層相對於該第一樣模之一側,其中該第一取模裝置包含:一第一架體結構;一第一膠帶,其係設置於該第一架體結構;以及一第一支撐背板,其係設置於該第一膠帶,其中該第一取模裝置係以該第一支撐背板與該第一黏著層接觸;以及附著一第二取模裝置於該第二黏著層相對於該第二樣模之一側,其中該第二取模裝置包含:一第二架體結構;一第二膠帶,其係設置於該第二架體結構;以及一第二支撐背板,其係設置於該第二膠帶,其中該第二取模裝置係以該第二支撐背板與該第二黏著層接觸;一分離步驟,係包含:將該第一取模裝置相對於該第一樣模分離,其中該第一可溶解性模仁係隨著該第一取模裝置相對於該第一樣模分離;以及將該第二取模裝置相對於該第二樣模分離,其中該第二可溶解性模仁係隨著該第二取模裝置相對於該第二樣模分離;一接觸步驟,係包含:將該第一可溶解性模仁與該第二可溶解性模仁相互間隔地與一高分子材料層接觸;一壓印步驟,係包含:施予一第一高溫至該高分子材料層;以及施予一壓力至該第一可溶解性模仁、與該第二可溶解性模仁,使該高分子材料層具有一對應該第一凹凸結構的第一轉印結構;以及一對應該第二凹凸結構的第二轉印結構;以及將該第一支撐背板與該第一膠帶分離;以及將該第二支撐背板與該第二膠帶分離,並施予一第二高溫至該高分子材料層,使該高分子材料層固化,其中該第一高溫與該第二高溫不同;以及一溶解步驟,係提供一溶劑溶解該第一可溶解性模仁、與該第二可溶解性模仁,使該固化後之高分子材料層與該第一支撐背板分離、以及該第二支撐背板分離,以取得一轉印物件。In order to solve the above problems, the present invention provides a large-scale imprinting method, which includes: an adding step of adding a soluble material into a first sample mold and a second sample mold, and solidifying the soluble material. soluble material to form a first soluble mold core in the first mold, wherein the first soluble mold core has a first concave and convex structure; and form a second soluble mold core in the second mold A soluble mold core, wherein the second soluble mold core has a second concave-convex structure; a forming step to form a first adhesive layer on a side of the first soluble mold core opposite to the first sample mold ; And forming a second adhesive layer on one side of the second dissolvable mold core relative to the second sample mold; a mold taking step includes: attaching a first mold taking device opposite to the first adhesive layer On one side of the first sample, the first mold-taking device includes: a first frame structure; a first tape, which is provided on the first frame structure; and a first supporting back plate, It is arranged on the first adhesive tape, wherein the first mold-taking device is in contact with the first adhesive layer with the first supporting back plate; and a second mold-taking device is attached to the second adhesive layer relative to the third adhesive layer. One side of the two molds, wherein the second mold-taking device includes: a second frame structure; a second tape, which is arranged on the second frame structure; and a second supporting back plate, which is arranged In the second tape, the second mold-taking device is in contact with the second adhesive layer using the second support backing plate; a separation step includes: positioning the first mold-taking device relative to the first sample Separating, wherein the first dissolvable mold core is separated with the first mold-taking device relative to the first sample; and separating the second mold-taking device with respect to the second sample, wherein the second mold The dissolvable mold core is separated with the second mold taking device relative to the second mold; a contacting step includes: spacing the first dissolvable mold core and the second dissolvable mold core from each other in contact with a polymer material layer; an imprinting step includes: applying a first high temperature to the polymer material layer; and applying a pressure to the first soluble mold core and the second soluble mold core. The soluble mold core makes the polymer material layer have a first transfer structure corresponding to the first concave and convex structure; and a second transfer structure corresponding to the second concave and convex structure; and connecting the first supporting back plate and The first tape is separated; and the second support back plate is separated from the second tape, and a second high temperature is applied to the polymer material layer to solidify the polymer material layer, wherein the first high temperature and the The second high temperature is different; and a dissolving step is to provide a solvent to dissolve the first soluble mold core and the second soluble mold core, so that the cured polymer material layer and the first supporting back plate Separate, and separate the second supporting back plate to obtain a transfer object.

本發明另提供一種大規模壓印之方法,係包括:一添加步驟,係添加一可溶解性材料於一第一樣模以及一第二樣模內,並固化該可溶解性材料,以於該第一樣模中形成一第一可溶解性模仁,其中該第一可溶解性模仁具有一第一凹凸結構;以及於該第二樣模中形成一第二可溶解性模仁,其中該第二可溶解性模仁具有一第二凹凸結構;一形成步驟,於該第一可溶解性模仁相對於該第一樣模之一側形成一第一黏著層;以及於該第二可溶解性模仁相對於該第二樣模之一側形成一第二黏著層;一取模步驟,係包含:附著一第一取模裝置於該第一黏著層相對於該第一樣模之一側,其中該第一取模裝置包含:一第一架體結構;一第一膠帶,其係設置於該第一架體結構;以及一第一支撐背板,其係設置於該第一膠帶,其中該第一取模裝置係以該第一支撐背板與該第一黏著層接觸;以及附著一第二取模裝置於該第二黏著層相對於該第二樣模之一側,其中該第二取模裝置包含:一第二架體結構;一第二膠帶,其係設置於該第二架體結構;以及一第二支撐背板,其係設置於該第二膠帶,其中該第二取模裝置係以該第二支撐背板與該第二黏著層接觸;一分離步驟,係包含:將該第一取模裝置相對於該第一樣模分離,其中該第一可溶解性模仁係隨著該第一取模裝置相對於該第一樣模分離;以及將該第二取模裝置相對於該第二樣模分離,其中該第二可溶解性模仁係隨著該第二取模裝置相對於該第二樣模分離;一接觸步驟,係包含:將該第一可溶解性模仁與該第二可溶解性模仁相互間隔地與一高分子材料層接觸;一壓印步驟,係包含:施予一第一高溫至該高分子材料層;以及施予一壓力至該第一可溶解性模仁、與該第二可溶解性模仁,使該高分子材料層具有一對應該第一凹凸結構的第一轉印結構;以及一對應該第二凹凸結構的第二轉印結構;以及將該第一支撐背板與該第一黏著層分離;以及將該第二支撐背板與該第二黏著層分離,並施予一第二高溫至該高分子材料層,使該高分子材料層固化,其中該第一高溫與該第二高溫不同;以及一溶解步驟,係提供一溶劑溶解該第一可溶解性模仁、與該第二可溶解性模仁,使該固化後之高分子材料層與該第一黏著層、以及該第二黏著層分離,以取得一轉印物件。The present invention also provides a large-scale imprinting method, which includes: an adding step of adding a soluble material in a first sample mold and a second sample mold, and solidifying the soluble material, so as to A first dissolvable mold core is formed in the first sample mold, wherein the first dissolvable mold core has a first concave and convex structure; and a second dissolvable mold core is formed in the second sample mold, The second dissolvable mold core has a second concave and convex structure; a forming step is to form a first adhesive layer on a side of the first dissolvable mold core relative to the first mold; and in the third Two dissolvable mold cores form a second adhesive layer relative to one side of the second mold; a mold taking step includes: attaching a first mold taking device to the first adhesive layer relative to the first mold One side of the mold, wherein the first mold-taking device includes: a first frame structure; a first tape, which is arranged on the first frame structure; and a first supporting back plate, which is arranged on the first frame structure A first tape, wherein the first mold-taking device is in contact with the first adhesive layer using the first supporting backing plate; and a second mold-taking device is attached to the second adhesive layer relative to one of the second molds side, wherein the second mold taking device includes: a second frame structure; a second adhesive tape, which is arranged on the second frame structure; and a second supporting back plate, which is arranged on the second adhesive tape , wherein the second mold-taking device is in contact with the second adhesive layer using the second support backing plate; a separation step includes: separating the first mold-taking device relative to the first sample, wherein the third A dissolvable mold core is separated with the first mold taking device relative to the first sample; and the second mold taking device is separated relative to the second sample, wherein the second dissolvable mold core As the second mold-taking device is separated relative to the second mold; a contacting step includes: placing the first soluble mold core and the second soluble mold core with a polymer at intervals. The material layer is in contact; an imprinting step includes: applying a first high temperature to the polymer material layer; and applying a pressure to the first soluble mold core and the second soluble mold core, The polymer material layer has a first transfer structure corresponding to the first concave and convex structure; and a second transfer structure corresponding to the second concave and convex structure; and connecting the first support back plate and the first adhesive layer Separate; and separate the second support backing plate from the second adhesive layer, and apply a second high temperature to the polymer material layer to solidify the polymer material layer, wherein the first high temperature and the second high temperature Different; and a dissolving step is to provide a solvent to dissolve the first soluble mold core and the second soluble mold core, so that the cured polymer material layer and the first adhesive layer, and the third The two adhesive layers are separated to obtain a transfer object.

本發明另提供一種大規模壓印之方法,係包括:一添加步驟,係添加一可溶解性材料於一第一樣模以及一第二樣模內,並固化該可溶解性材料,以於該第一樣模中形成一第一可溶解性模仁,其中該第一可溶解性模仁具有一第一凹凸結構;以及於該第二樣模中形成一第二可溶解性模仁,其中該第二可溶解性模仁具有一第二凹凸結構;一形成步驟,於該第一可溶解性模仁相對於該第一樣模之一側形成一第一黏著層;以及於該第二可溶解性模仁相對於該第二樣模之一側形成一第二黏著層;一取模步驟,係包含:附著一第一取模裝置於該第一黏著層相對於該第一樣模之一側,其中該第一取模裝置包含:一第一架體結構;一第一膠帶,其係設置於該第一架體結構;以及一第一支撐背板,其係設置於該第一膠帶,其中該第一取模裝置係以該第一膠帶相對於該第一支撐背板之一側與該第一黏著層接觸;以及附著一第二取模裝置於該第二黏著層相對於該第二樣模之一側,其中該第二取模裝置包含:一第二架體結構;一第二膠帶,其係設置於該第二架體結構;以及一第二支撐背板,其係設置於該第二膠帶,其中該第二取模裝置係以該第二膠帶相對於該第二支撐背板之一側與該第二黏著層接觸;一分離步驟,係包含:將該第一取模裝置相對於該第一樣模分離,其中該第一可溶解性模仁係隨著該第一取模裝置相對於該第一樣模分離;以及將該第二取模裝置相對於該第二樣模分離,其中該第二可溶解性模仁係隨著該第二取模裝置相對於該第二樣模分離;一接觸步驟,係包含:將該第一可溶解性模仁與該第二可溶解性模仁相互間隔地與一高分子材料層接觸;一壓印步驟,係包含:施予一第一高溫至該高分子材料層;以及施予一壓力至該第一可溶解性模仁、與該第二可溶解性模仁,使該高分子材料層具有一對應該第一凹凸結構的第一轉印結構;以及一對應該第二凹凸結構的第二轉印結構;以及將該第一膠帶與該第一黏著層分離;以及將該第二膠帶與該第二黏著層分離,並施予一第二高溫至該高分子材料層,使該高分子材料層固化,其中該第一高溫與該第二高溫不同;以及一溶解步驟,係提供一溶劑溶解該第一可溶解性模仁、與該第二可溶解性模仁,使該固化後之高分子材料層與該第一黏著層、以及該第二黏著層分離,以取得一轉印物件。The present invention also provides a large-scale imprinting method, which includes: an adding step of adding a soluble material in a first sample mold and a second sample mold, and solidifying the soluble material, so as to A first dissolvable mold core is formed in the first sample mold, wherein the first dissolvable mold core has a first concave and convex structure; and a second dissolvable mold core is formed in the second sample mold, The second dissolvable mold core has a second concave and convex structure; a forming step is to form a first adhesive layer on a side of the first dissolvable mold core relative to the first mold; and in the third Two dissolvable mold cores form a second adhesive layer relative to one side of the second mold; a mold taking step includes: attaching a first mold taking device to the first adhesive layer relative to the first mold One side of the mold, wherein the first mold-taking device includes: a first frame structure; a first tape, which is arranged on the first frame structure; and a first supporting back plate, which is arranged on the first frame structure A first tape, wherein the first mold-taking device is in contact with the first adhesive layer on one side of the first tape relative to the first support backing plate; and a second mold-taking device is attached to the second adhesive layer Relative to one side of the second sample mold, the second mold taking device includes: a second frame structure; a second tape disposed on the second frame structure; and a second supporting back plate , which is disposed on the second tape, wherein the second mold-taking device contacts the second adhesive layer with one side of the second tape relative to the second support backing plate; a separation step includes: The first mold-taking device is separated relative to the first sample, wherein the first dissolvable mold core is separated with the first mold-taking device relative to the first sample; and the second mold-taking device is separated Separating from the second sample mold, wherein the second dissolvable mold core is separated from the second sample mold along with the second mold-taking device; a contacting step includes: separating the first dissolvable mold core The mold core and the second soluble mold core are in contact with a polymer material layer at intervals; an imprinting step includes: applying a first high temperature to the polymer material layer; and applying a pressure to the polymer material layer. The first soluble mold core and the second soluble mold core enable the polymer material layer to have a first transfer structure corresponding to the first concave and convex structure; and a second transfer structure corresponding to the second concave and convex structure. Transfer the structure; and separate the first adhesive tape from the first adhesive layer; and separate the second adhesive tape from the second adhesive layer, and apply a second high temperature to the polymer material layer to cause the polymer The material layer is cured, wherein the first high temperature is different from the second high temperature; and a dissolving step is to provide a solvent to dissolve the first soluble mold core and the second soluble mold core, so that the cured The polymer material layer is separated from the first adhesive layer and the second adhesive layer to obtain a transfer object.

更佳者,其中更包含:一剝離步驟,係於該壓印步驟後、與該溶解步驟前,將該第一黏著層自該第一可溶解性模仁之表層剝離;以及將該第二黏著層自該第二可溶解性模仁之表層剝離。More preferably, it further includes: a peeling step, which is to peel the first adhesive layer from the surface layer of the first dissolvable mold core after the imprinting step and before the dissolving step; and peeling the second adhesive layer The layer is peeled off from the surface layer of the second dissolvable mold core.

本發明另提供一種大規模壓印之方法,係包括:一添加步驟,係添加一可溶解性材料於一第一樣模以及一第二樣模內,並固化該可溶解性材料,以於該第一樣模中形成一第一可溶解性模仁,其中該第一可溶解性模仁具有一第一凹凸結構;以及於該第二樣模中形成一第二可溶解性模仁,其中該第二可溶解性模仁具有一第二凹凸結構;一形成步驟,於該第一可溶解性模仁相對於該第一樣模之一側形成一第一黏著層;以及於該第二可溶解性模仁相對於該第二樣模之一側形成一第二黏著層;一取模步驟,係包含:附著一第一取模裝置於該第一黏著層相對於該第一樣模之一側,其中該第一取模裝置包含:一第一架體結構;一第一膠帶,其係設置於該第一架體結構;以及一第一支撐背板,其係設置於該第一膠帶,其中該第一取模裝置係以該第一支撐背板與該第一黏著層接觸;以及附著一第二取模裝置於該第二黏著層相對於該第二樣模之一側,其中該第二取模裝置包含:一第二架體結構;一第二膠帶,其係設置於該第二架體結構;以及一第二支撐背板,其係設置於該第二膠帶,其中該第二取模裝置係以該第二支撐背板與該第二黏著層接觸;一分離步驟,係包含:將該第一取模裝置相對於該第一樣模分離,其中該第一可溶解性模仁係隨著該第一取模裝置相對於該第一樣模分離;以及將該第二取模裝置相對於該第二樣模分離,其中該第二可溶解性模仁係隨著該第二取模裝置相對於該第二樣模分離;一接觸步驟,係包含:將該第一可溶解性模仁與該第二可溶解性模仁相互間隔地與一高分子材料層接觸;一壓印步驟,係包含:施予一壓力至該第一可溶解性模仁,使該高分子材料層具有一對應該第一凹凸結構的第一轉印結構;以及該第二可溶解性模仁,使該高分子材料層具有一對應該第二凹凸結構的第二轉印結構;以及以一UV光照射該高分子材料層,使該高分料層固化,並使該第一支撐背板與該第一膠帶分離;以及使該第二支撐背板與該第二膠帶分離;以及一溶解步驟,係提供一溶劑溶解該第一可溶解性模仁、與該第二可溶解性模仁,使該固化後之高分子材料層與該第一支撐背板分離、以及該第二支撐背板分離,以取得一轉印物件。The present invention also provides a large-scale imprinting method, which includes: an adding step of adding a soluble material in a first sample mold and a second sample mold, and solidifying the soluble material, so as to A first dissolvable mold core is formed in the first sample mold, wherein the first dissolvable mold core has a first concave and convex structure; and a second dissolvable mold core is formed in the second sample mold, The second dissolvable mold core has a second concave and convex structure; a forming step is to form a first adhesive layer on a side of the first dissolvable mold core relative to the first mold; and in the third Two dissolvable mold cores form a second adhesive layer relative to one side of the second mold; a mold taking step includes: attaching a first mold taking device to the first adhesive layer relative to the first mold One side of the mold, wherein the first mold-taking device includes: a first frame structure; a first tape, which is arranged on the first frame structure; and a first supporting back plate, which is arranged on the first frame structure A first tape, wherein the first mold-taking device is in contact with the first adhesive layer using the first supporting backing plate; and a second mold-taking device is attached to the second adhesive layer relative to one of the second molds side, wherein the second mold taking device includes: a second frame structure; a second adhesive tape, which is arranged on the second frame structure; and a second supporting back plate, which is arranged on the second adhesive tape , wherein the second mold-taking device is in contact with the second adhesive layer using the second support backing plate; a separation step includes: separating the first mold-taking device relative to the first sample, wherein the third A dissolvable mold core is separated with the first mold taking device relative to the first sample; and the second mold taking device is separated relative to the second sample, wherein the second dissolvable mold core As the second mold-taking device is separated relative to the second mold; a contacting step includes: placing the first soluble mold core and the second soluble mold core with a polymer at intervals. The material layer is in contact; an imprinting step includes: applying a pressure to the first soluble mold core so that the polymer material layer has a first transfer structure corresponding to the first concave and convex structure; and the third Two soluble mold cores make the polymer material layer have a second transfer structure corresponding to the second concave and convex structure; and irradiate the polymer material layer with a UV light to solidify the polymer material layer and make the polymer material layer solidify. The first supporting backing plate is separated from the first adhesive tape; and the second supporting backing plate is separated from the second adhesive tape; and a dissolving step is to provide a solvent to dissolve the first soluble mold core and the third adhesive tape. Two dissolvable mold cores are used to separate the cured polymer material layer from the first supporting back plate and the second supporting back plate to obtain a transfer object.

更佳者,其中該高分子材料層係形成於一基材層上,並且該接觸步驟係包含:首先:係將該第一可溶解性模仁加熱至一溫度T,其中0<T<Tg,並使該第一可溶解性模仁與該高分子材料層接觸;再來:將該第二可溶解性模仁加熱至該溫度T,並使該第二可溶解性模仁與該高分子材料層接觸;該接觸步驟或包含:首先:係將該基材層加熱至一溫度T,其中0<T<Tg,並使該第一可溶解性模仁與該高分子材料層接觸;再來:將該第二可溶解性模仁與該高分子材料層接觸;以及該接觸步驟或包含:首先:係將該基材層與該第一可溶解性模仁相對應之部分加熱至一溫度T,其中0<T<Tg,並使該第一可溶解性模仁與該高分子材料層接觸;再來:將該基材層與該第二可溶解性模仁相對應之部分加熱至該溫度T,並使該第二可溶解性模仁與該高分子材料層接觸。More preferably, the polymer material layer is formed on a substrate layer, and the contacting step includes: firstly: heating the first soluble mold core to a temperature T, where 0<T<Tg and bring the first soluble mold core into contact with the polymer material layer; and then: heat the second soluble mold core to the temperature T, and make the second soluble mold core contact the high molecular material layer. The molecular material layer is in contact; the contact step may include: firstly: heating the base material layer to a temperature T, where 0<T<Tg, and bringing the first soluble mold core into contact with the polymer material layer; Next: contact the second soluble mold core with the polymer material layer; and the contact step may include: first: heating the portion of the base material layer corresponding to the first soluble mold core to A temperature T, where 0<T<Tg, and the first soluble mold core is brought into contact with the polymer material layer; then: the corresponding part of the base material layer and the second soluble mold core is Heating to the temperature T, and bringing the second soluble mold core into contact with the polymer material layer.

更佳者,其中該高分子材料層係形成於一基材層上,並且該壓印步驟係包含:施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;於形成該第一轉印結構後,施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;於形成該第二轉印結構後,將該第一支撐背板與該第一膠帶分離;以及將該第二支撐背板與該第二膠帶分離;以及施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化;該壓印步驟或包含:施予該第一高溫至該基材層;施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;於形成完該第一轉印結構後,施予該壓力至將該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;將該第一支撐背板與該第一膠帶分離;以及將該第二支撐背板與該第二膠帶分離;以及施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化;該壓印步驟或包含:施予該第一高溫至該基材層與該第一可溶解性模仁相對應之位置;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;於形成完該第一轉印結構後,施予該第一高溫至該基材層與該第二可溶解性模仁相對應之位置;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;將該第一支撐背板與該第一膠帶分離;以及將該第二支撐背板與該第二膠帶分離;以及施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化;該壓印步驟或包含:施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一膠帶分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二膠帶分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;該壓印步驟或包含:首先:施予該第一高溫至該基材層與該第一可溶解性模仁相對應之部分;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一膠帶分離;再來:施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及首先:施予該第一高溫至該基材層與該第二可溶解性模仁相對應之部分;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二膠帶分離;再來:施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;以及該壓印步驟或包含:施予該第一高溫至該基材層;施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一膠帶分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及施予該第一高溫至該基材層;施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二膠帶分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化。More preferably, the polymer material layer is formed on a substrate layer, and the imprinting step includes: applying the first high temperature and the pressure to the first soluble mold core, so that the polymer The material layer has the first transfer structure; after forming the first transfer structure, the first high temperature and the pressure are applied to the second soluble mold core, so that the polymer material layer has the second transfer structure. printing structure; after forming the second transfer structure, separating the first support back plate from the first tape; and separating the second support back plate from the second tape; and applying the second high temperature to the first dissolvable mold core and the second dissolvable mold core; to the position corresponding to the base material layer and the first dissolvable mold core, and the base material layer and the second dissolvable mold core corresponding position; or to the base material layer to solidify the polymer material layer; the imprinting step may include: applying the first high temperature to the base material layer; applying the pressure to the first possible The soluble mold core makes the polymer material layer have the first transfer structure; after the first transfer structure is formed, the pressure is applied to the second soluble mold core so that the polymer material The layer has the second transfer structure; the first support backing plate is separated from the first adhesive tape; and the second support backing plate is separated from the second adhesive tape; and the second high temperature is applied to the first capable the soluble mold core and the second soluble mold core; to the position where the base material layer corresponds to the first soluble mold core, and where the base material layer corresponds to the second soluble mold core position; or to the base material layer to solidify the polymer material layer; the imprinting step may include: applying the first high temperature to the position of the base material layer corresponding to the first dissolvable mold core; and the pressure is applied to the first soluble mold core so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, the first high temperature is applied to the base material layer and The corresponding position of the second soluble mold core; and the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure; connecting the first support back plate and the third Separating a tape; and separating the second support backing plate from the second tape; and applying the second high temperature to the first soluble mold core and the second soluble mold core; to the base material layer The position corresponding to the first dissolvable mold core, and the position corresponding to the base material layer and the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; The imprinting step may include: applying the first high temperature and the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and the first support back plate and the third Separating a tape; and applying the second high temperature to the first soluble mold core; to the position corresponding to the base material layer and the first soluble mold core; or to the base material layer, so that the The portion of the polymer material layer corresponding to the first soluble mold core is solidified; and the first high temperature and the pressure are applied to the second soluble mold core, so that the polymer material layer has the second transformation Print the structure and separate the second support backing plate from the second adhesive tape; and apply the second high temperature to the second dissolvable mold core; until the base material layer is in contact with the second dissolvable mold core. corresponding position; or to the base material layer to solidify the portion of the polymer material layer corresponding to the second dissolvable mold core; the imprinting step may include: firstly: applying the first high temperature to the The part of the base material layer corresponding to the first dissolvable mold core; and the pressure is applied to the first dissolvable mold core so that the polymer material layer has the first transfer structure and the first support The backing plate is separated from the first adhesive tape; then: apply the second high temperature to the first dissolvable mold core; to the position corresponding to the base material layer and the first dissolvable mold core; or to the position corresponding to the first dissolvable mold core; The base material layer is used to solidify the portion of the polymer material layer corresponding to the first soluble mold core; and first: applying the first high temperature to the phase between the base material layer and the second soluble mold core. The corresponding part; and the pressure to the second dissolvable mold core, so that the polymer material layer has the second transfer structure, and the second support backing plate is separated from the second tape; and then: apply Apply the second high temperature to the second soluble mold core; to the position corresponding to the base material layer and the second soluble mold core; or to the base material layer, so that the polymer material layer and the The corresponding part of the second dissolvable mold core is cured; and the imprinting step may include: applying the first high temperature to the base material layer; applying the pressure to the first dissolvable mold core, so that the high temperature The molecular material layer has the first transfer structure and separates the first support backing plate from the first adhesive tape; and applies the second high temperature to the first dissolvable mold core; to the base material layer and the first tape the position corresponding to the first soluble mold core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the first soluble mold core; and applying the first high temperature to the Base material layer; apply the pressure to the second dissolvable mold core, so that the polymer material layer has the second transfer structure, and separate the second support backing plate from the second tape; and apply The second high temperature goes to the second soluble mold core; to the position corresponding to the base material layer and the second soluble mold core; or to the base material layer, so that the polymer material layer and the third The corresponding parts of the two soluble mold cores are solidified.

更佳者,其中該高分子材料層係形成於一基材層上,並且該壓印步驟係包含:施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;於形成該第一轉印結構後,施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;於形成該第二轉印結構後,將該第一支撐背板與該第一黏著層分離;以及將該第二支撐背板與該第二黏著層分離;以及施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化;該壓印步驟或包含:施予該第一高溫至該基材層;施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;於形成完該第一轉印結構後,施予該壓力至將該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;將該第一支撐背板與該第一黏著層分離;以及將該第二支撐背板與該第二黏著層分離;以及施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化;該壓印步驟或包含:施予該第一高溫至該基材層與該第一可溶解性模仁相對應之位置;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;於形成完該第一轉印結構後,施予該第一高溫至該基材層與該第二可溶解性模仁相對應之位置;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;將該第一支撐背板與該第一黏著層分離;以及將該第二支撐背板與該第二黏著層分離;以及施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化;該壓印步驟或包含:施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一黏著層分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二黏著層分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;該壓印步驟或包含:首先:施予該第一高溫至該基材層與該第一可溶解性模仁相對應之部分;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一黏著層分離;再來:施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及首先:施予該第一高溫至該基材層與該第二可溶解性模仁相對應之部分;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二黏著層分離;再來:施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;以及該壓印步驟或包含:施予該第一高溫至該基材層;施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一黏著層分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及施予該第一高溫至該基材層;施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二黏著層分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化。More preferably, the polymer material layer is formed on a substrate layer, and the imprinting step includes: applying the first high temperature and the pressure to the first soluble mold core, so that the polymer The material layer has the first transfer structure; after forming the first transfer structure, the first high temperature and the pressure are applied to the second soluble mold core, so that the polymer material layer has the second transfer structure. printing structure; after forming the second transfer structure, separating the first supporting back plate from the first adhesive layer; and separating the second supporting back plate from the second adhesive layer; and applying the second High temperature to the first soluble mold core and the second soluble mold core; to the position corresponding to the base material layer and the first soluble mold core, and to the base material layer and the second soluble mold core The corresponding position of the mold core; or to the base material layer to solidify the polymer material layer; the imprinting step may include: applying the first high temperature to the base material layer; applying the pressure to the third A soluble mold core allows the polymer material layer to have the first transfer structure; after the first transfer structure is formed, the pressure is applied to the second soluble mold core so that the high The molecular material layer has the second transfer structure; the first support backing plate is separated from the first adhesive layer; and the second support backing plate is separated from the second adhesive layer; and the second high temperature is applied to the first dissolvable mold core and the second dissolvable mold core; to the position corresponding to the base material layer and the first dissolvable mold core, and the base material layer and the second dissolvable mold core The position corresponding to the core; or to the base material layer to solidify the polymer material layer; the imprinting step may include: applying the first high temperature to the base material layer and the first dissolvable mold core The corresponding position; and the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure; after the first transfer structure is formed, the first high temperature is applied to the The position of the base material layer corresponding to the second dissolvable mold core; and the pressure to the second dissolvable mold core so that the polymer material layer has the second transfer structure; placing the first support back Separating the board from the first adhesive layer; and separating the second support back plate from the second adhesive layer; and applying the second high temperature to the first soluble mold core and the second soluble mold core ; to the position corresponding to the base material layer and the first dissolvable mold core, and to the position corresponding to the base material layer and the second dissolvable mold core; or to the base material layer, so that the high The molecular material layer is solidified; the imprinting step may include: applying the first high temperature and the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and the first supporting the backing plate to be separated from the first adhesive layer; and applying the second high temperature to the first dissolvable mold core; to the position corresponding to the base material layer and the first dissolvable mold core; or to the position corresponding to the first dissolvable mold core; The base material layer is used to solidify the portion of the polymer material layer corresponding to the first soluble mold core; and applying the first high temperature and the pressure to the second soluble mold core to cause the polymer The material layer has the second transfer structure and separates the second support backing plate from the second adhesive layer; and applies the second high temperature to the second dissolvable mold core; to the base material layer and the second adhesive layer The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the second dissolvable mold core; the imprinting step may include: first: Applying the first high temperature to the portion of the base material layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and separate the first support back plate from the first adhesive layer; then: apply the second high temperature to the first soluble mold core; to the base material layer and the first soluble mold core The position corresponding to the core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the first dissolvable mold core; and first: applying the first high temperature to the base material layer and the first dissolvable mold core The corresponding part of the second dissolvable mold core; and the pressure to the second dissolvable mold core, so that the polymer material layer has the second transfer structure, and the second support backing plate and the The second adhesive layer is separated; then: apply the second high temperature to the second soluble mold core; to the position corresponding to the base material layer and the second soluble mold core; or to the base material layer , to solidify the portion of the polymer material layer corresponding to the second dissolvable mold core; and the imprinting step may include: applying the first high temperature to the base material layer; applying the pressure to the third A dissolvable mold allows the polymer material layer to have the first transfer structure and separates the first support backing plate from the first adhesive layer; and applying the second high temperature to the first dissolvable to the base material layer corresponding to the first dissolvable mold core; or to the base material layer so that the polymer material layer corresponds to the first dissolvable mold core Curing; and applying the first high temperature to the base material layer; applying the pressure to the second soluble mold core, so that the polymer material layer has the second transfer structure, and makes the second support back The plate is separated from the second adhesive layer; and the second high temperature is applied to the second dissolvable mold core; to the position corresponding to the base material layer and the second dissolvable mold core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the second dissolvable mold core.

更佳者,其中該高分子材料層係形成於一基材層上,並且該壓印步驟係包含:施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;於形成該第一轉印結構後,施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;於形成該第二轉印結構後,將該第一膠帶與該第一黏著層分離;以及將該第二膠帶與該第二黏著層分離;以及施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化;該壓印步驟或包含:施予該第一高溫至該基材層;施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;於形成完該第一轉印結構後,施予該壓力至將該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;將該第一膠帶與該第一黏著層分離;以及將該第二膠帶與該第二黏著層分離;以及施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化;該壓印步驟或包含:施予該第一高溫至該基材層與該第一可溶解性模仁相對應之位置;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;於形成完該第一轉印結構後,施予該第一高溫至該基材層與該第二可溶解性模仁相對應之位置;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;將該第一膠帶與該第一黏著層分離;以及將該第二膠帶與該第二黏著層分離;以及施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化;該壓印步驟或包含:施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一膠帶與該第一黏著層分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二膠帶與該第二黏著層分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;該壓印步驟或包含:首先:施予該第一高溫至該基材層與該第一可溶解性模仁相對應之部分;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一膠帶與該第一黏著層分離;再來:施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及首先:施予該第一高溫至該基材層與該第二可溶解性模仁相對應之部分;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二膠帶與該第二黏著層分離;再來:施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;以及該壓印步驟或包含:施予該第一高溫至該基材層;施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一膠帶與該第一黏著層分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及施予該第一高溫至該基材層;施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二膠帶與該第二黏著層分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化。More preferably, the polymer material layer is formed on a substrate layer, and the imprinting step includes: applying the first high temperature and the pressure to the first soluble mold core, so that the polymer The material layer has the first transfer structure; after forming the first transfer structure, the first high temperature and the pressure are applied to the second soluble mold core, so that the polymer material layer has the second transfer structure. printing structure; after forming the second transfer structure, separating the first adhesive tape from the first adhesive layer; and separating the second adhesive tape from the second adhesive layer; and applying the second high temperature to the first adhesive layer. A dissolvable mold core and the second dissolvable mold core; to the position where the base material layer corresponds to the first dissolvable mold core, and the base material layer and the second dissolvable mold core are in contact with each other. The corresponding position; or to the base material layer to solidify the polymer material layer; the imprinting step may include: applying the first high temperature to the base material layer; applying the pressure to the first solubility The mold core is used to make the polymer material layer have the first transfer structure; after the first transfer structure is formed, the pressure is applied to the second dissolvable mold core so that the polymer material layer has the first transfer structure. The second transfer structure; separating the first tape from the first adhesive layer; and separating the second tape from the second adhesive layer; and applying the second high temperature to the first soluble mold core to the second dissolvable mold core; to the position corresponding to the base material layer and the first dissolvable mold core, and to the position corresponding to the base material layer and the second dissolvable mold core; or to the position corresponding to the base material layer and the second dissolvable mold core; The base material layer is used to solidify the polymer material layer; the imprinting step may include: applying the first high temperature to the position corresponding to the base material layer and the first dissolvable mold core; and the pressure to The first dissolvable mold core enables the polymer material layer to have the first transfer structure; after forming the first transfer structure, the first high temperature is applied to the base material layer and the second soluble mold. The corresponding position of the soluble mold core; and the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure; separating the first tape from the first adhesive layer; and Separating the second tape from the second adhesive layer; and applying the second high temperature to the first soluble mold core and the second soluble mold core; to the base material layer and the first soluble mold core The position corresponding to the flexible mold core, and the position corresponding to the base material layer and the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; the imprinting step may include: Applying the first high temperature and the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure and separating the first adhesive tape from the first adhesive layer; and applying The second high temperature goes to the first soluble mold core; to the position of the base material layer corresponding to the first soluble mold core; or to the base material layer, so that the polymer material layer and the third A corresponding part of a soluble mold core is cured; and applying the first high temperature and the pressure to the second soluble mold core, so that the polymer material layer has the second transfer structure, and the third The two tapes are separated from the second adhesive layer; and the second high temperature is applied to the second soluble mold core; to the position corresponding to the base material layer and the second soluble mold core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the second dissolvable mold core; the imprinting step may include: firstly: applying the first high temperature to the base material layer and the first dissolvable mold core The corresponding part of the soluble mold core; and the pressure is applied to the first soluble mold core so that the polymer material layer has the first transfer structure and separates the first tape from the first adhesive layer; Next: apply the second high temperature to the first soluble mold core; to the position of the base material layer corresponding to the first soluble mold core; or to the base material layer, so that the polymer The portion of the material layer corresponding to the first dissolvable mold core is cured; and first: applying the first high temperature to the portion of the base material layer corresponding to the second dissolvable mold core; and applying the pressure to the The second dissolvable mold core allows the polymer material layer to have the second transfer structure and separates the second adhesive tape from the second adhesive layer; and then: applying the second high temperature to the second dissolvable mold core. The soluble mold core; to the position where the base material layer corresponds to the second soluble mold core; or to the base material layer so that the polymer material layer corresponds to the second soluble mold core Partial curing; and the imprinting step may include: applying the first high temperature to the base material layer; applying the pressure to the first dissolvable mold core, so that the polymer material layer has the first transfer structure and separate the first tape from the first adhesive layer; and apply the second high temperature to the first soluble mold core; to the position corresponding to the base material layer and the first soluble mold core ; Or to the base material layer to solidify the portion of the polymer material layer corresponding to the first soluble mold core; and to apply the first high temperature to the base material layer; to apply the pressure to the third Two dissolvable mold cores, allowing the polymer material layer to have the second transfer structure and separating the second adhesive tape from the second adhesive layer; and applying the second high temperature to the second dissolvable mold core; to the position corresponding to the base material layer and the second dissolvable mold core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the second dissolvable mold core.

更佳者,其中該高分子材料層係形成於一基材層上,並且該壓印步驟係包含:首先:施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;以該UV光照射該高分子材料層與該第一可溶解性模仁相對應之部分,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及使該第一支撐背板與該第一膠帶分離;以及再來:施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;以該UV光照射該高分子材料層與該第二可溶解性模仁相對應之部分,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;以及使該第二支撐背板與該第二膠帶分離;該壓印步驟或包含:施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;以該UV光照射該高分子材料層,使該高分子材料層固化;以及使該第一支撐背板與該第一膠帶分離、與使該第二支撐背板與該第二膠帶分離;以及該壓印步驟或包含:施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;以該UV光照射該高分子材料層與該第一可溶解性模仁相對應之部分,使該高分子材料層與該第一可溶解性模仁相對應之部分固化,並使該第一支撐背板與該第一膠帶分離;以及以該UV光照射該高分子材料層與該第二可溶解性模仁相對應之部分,使該高分子材料層與該第二可溶解性模仁相對應之部分固化,並使該第二支撐背板與該第二膠帶分離。More preferably, the polymer material layer is formed on a base material layer, and the imprinting step includes: firstly: applying the pressure to the first soluble mold core, so that the polymer material layer has The first transfer structure; irradiate the portion of the polymer material layer corresponding to the first soluble mold core with the UV light, so that the polymer material layer corresponds to the first soluble mold core. Partially curing; and separating the first support backing plate from the first tape; and then: applying the pressure to the second dissolvable mold core so that the polymer material layer has the second transfer structure; Irradiating the portion of the polymer material layer corresponding to the second soluble mold core with the UV light to solidify the portion of the polymer material layer corresponding to the second soluble mold core; and causing the third The two supporting backing plates are separated from the second tape; the imprinting step may include: applying the pressure to the first dissolvable mold core so that the polymer material layer has the first transfer structure; applying the pressure to the second dissolvable mold core, causing the polymer material layer to have the second transfer structure; irradiating the polymer material layer with the UV light to solidify the polymer material layer; and making the first support back The plate is separated from the first tape, and the second support back plate is separated from the second tape; and the imprinting step may include: applying the pressure to the first dissolvable mold core to cause the polymer material to The layer has the first transfer structure; applying the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure; irradiating the polymer material layer and the third transfer structure with the UV light A corresponding part of the dissolvable mold core solidifies the polymer material layer and the part corresponding to the first dissolvable mold core, and separates the first support back plate from the first tape; and with the UV light irradiates the portion of the polymer material layer corresponding to the second soluble mold core to solidify the portion of the polymer material layer corresponding to the second soluble mold core, and causes the second support back to The plate is separated from this second tape.

本發明相較於先前技術之功效在於:本發明可精準、穩定、持續地以模仁對高分子材料進行壓印,以高效取得大規模範圍之轉印物件,並且,最終所獲得之轉印物件同時兼具高良率與高品質,於實際應用面上可實現較高之穩定性、耐久性、與安全性。具體而言,於本發明中:第一支撐背板係藉由第一黏著層與第一可溶解性模仁黏接,因此,於第一可溶解性模仁與第一樣模分離時;第一可溶解性模仁與高分子材料層接觸或對位時;施予第一高溫或壓力於第一可溶解性模仁時;使第一架體結構相對於第一支撐背板分離時;第一架體結構以及設置於第一架體結構之第一膠帶相對於第一支撐背板分離時;以及溶解第一可溶解性模仁時,第一支撐背板皆可維持第一可溶解性模仁之結構,使第一可溶解性模仁不產生偏移或形變,因此可使最終壓印出的轉印物件不產生缺陷。此外,由於在進行溶解步驟前,第二支撐背板係藉由第二黏著層與第二可溶解性模仁黏接,因此,於第二可溶解性模仁與第二樣模分離時;第二可溶解性模仁與高分子材料層接觸或對位時;施予第一高溫或壓力於第二可溶解性模仁時;使第二架體結構相對於第二支撐背板分離時;第二架體結構以及設置於第二架體結構之第二膠帶相對於第二支撐背板分離時;以及溶解第二可溶解性模仁時,第二支撐背板皆可維持第二可溶解性模仁之結構,使第二可溶解性模仁不產生偏移或形變,因此可使最終壓印出的轉印物件不產生缺陷。Compared with the previous technology, the effect of the present invention is that the present invention can accurately, stably and continuously imprint polymer materials with a mold core to efficiently obtain large-scale transfer objects, and the final obtained transfer The objects have both high yield and high quality, and can achieve higher stability, durability, and safety in practical applications. Specifically, in the present invention: the first supporting back plate is bonded to the first dissolvable mold core through the first adhesive layer. Therefore, when the first dissolvable mold core is separated from the first sample; When the first soluble mold core is in contact or aligned with the polymer material layer; when applying the first high temperature or pressure to the first soluble mold core; when the first frame structure is separated from the first supporting back plate ; When the first frame structure and the first tape disposed on the first frame structure are separated from the first supporting backing plate; and when the first dissolvable mold core is dissolved, the first supporting backing plate can maintain the first dissolvable mold core. The structure of the soluble mold core prevents the first soluble mold core from deflecting or deforming, so that the final embossed transfer object does not have defects. In addition, since the second supporting back plate is bonded to the second dissolvable mold core through the second adhesive layer before the dissolving step, when the second dissolvable mold core is separated from the second sample mold; When the second dissolvable mold core is in contact or aligned with the polymer material layer; when the first high temperature or pressure is applied to the second dissolvable mold core; when the second frame structure is separated from the second supporting back plate ; When the second frame structure and the second tape provided on the second frame structure are separated from the second supporting back plate; and when the second dissolvable mold core is dissolved, the second supporting back plate can maintain the second dissolvable mold core. The structure of the dissolvable mold core prevents the second dissolvable mold core from deflecting or deforming, so that the final embossed transfer object does not have defects.

為讓本發明上述及/或其他目的、功效、特徵更明顯易懂,下文特舉較佳實施方式,作詳細說明於下:In order to make the above and/or other objects, effects, and features of the present invention more obvious and understandable, the following is a detailed description of the preferred embodiments:

如圖1A所示,本發明提供一種大規模壓印之方法,係依序包含:一添加步驟(S1)、一形成步驟(S2)、一取模步驟(S3)、一分離步驟(S4)、一接觸步驟(S5)、一壓印步驟(S6)、以及一溶解步驟(S7)。於一較佳實施例中,如圖1B所示,其中大規模壓印之方法更包含一剝離步驟(S8),係於壓印步驟(S6)完成後、以及溶解步驟(S7)進行前執行。As shown in Figure 1A, the present invention provides a large-scale imprinting method, which sequentially includes: an adding step (S1), a forming step (S2), a mold taking step (S3), and a separating step (S4) , a contacting step (S5), an imprinting step (S6), and a dissolving step (S7). In a preferred embodiment, as shown in FIG. 1B , the large-scale imprinting method further includes a peeling step (S8), which is performed after the imprinting step (S6) is completed and before the dissolving step (S7). .

以下圖2A與圖2B用以說明本發明之添加步驟(S1):「於一第一樣模上形成一第一可溶解性模仁(3);以及於一第二樣模(10)上形成一第二可溶解性模仁(11)。」The following Figures 2A and 2B are used to illustrate the adding step (S1) of the present invention: "forming a first dissolvable mold core (3) on a first sample mold; and forming a first dissolvable mold core (3) on a second sample mold (10) Forming a second soluble mold (11).”

如圖2A所示,首先:先添加一可溶解性材料(1)至一第一樣模(2)、與一第二樣模(10)內,其中該第一樣模(2)具有一第一樣模結構(201)與一第一記號結構(202);該第二樣模(10)具有一第二樣模結構(1001)與一第二記號結構(1002);接著:如圖2B所示,固化該可溶解性材料(1)以形成一第一可溶解性模仁(3),其中該第一可溶解性模仁(3)具有一對應該第一樣模結構(201)的第一凹凸結構(4)、與一對應該第一記號結構(202)的第一對位記號(21);以及固化該可溶解性材料(1)以形成一第二可溶解性模仁(11),其中該第二可溶解性模仁(11)具有一對應該第二樣模結構(1001)的第二凹凸結構(12)、與一對應該第二記號結構(1002)的第二對位記號(22)。較佳地,該可溶解性材料(1)係選自以下所組成之群組:水溶性聚丙烯醯胺(Polyacrylamide ;PAM)、聚氨酯、聚脲、聚醯胺、聚酯、聚胺甲酸酯、聚乙烯基吡咯烷酮、乙烯-乙烯醇、聚丙烯醯胺-乙二醛聚合物、聚丙烯酸、或其結合,但不以此為限。其中該可溶解性材料(1)於該第一樣模(2)的厚度為10至1,000μm,故後續所得之第一可溶解性模仁(3)除了具有可溶解特性外,更具有可撓特性;以及該可溶解性材料(1)於該第二樣模(10)的厚度為10至1,000μm,故後續所得之第二可溶解性模仁(11)除了具有可溶解特性外,更具有可撓特性。較佳地,該可溶解性材料(1)可採用溶液形式添加至該第一樣模(2)、或該第二樣模(10)內,其濃度可為溶液的5至50wt%,但不以此為限。其中可以理解地,若濃度低於此下限值,則會提高該第一凹凸結構(4)、或該第二凹凸結構(12)的不完整性,造成結構缺陷,以致影響壓印品質。此外,該可溶解性材料(1)可採用旋轉塗佈(spin coating)或狹縫塗佈(slot die coating)方式添加;於採用旋轉塗佈下,旋轉塗佈的轉速可為100至5,000rpm,但不以此為限。較佳地,該第一樣模(2)、或該第二樣模(10)之材料為矽。As shown in Figure 2A, firstly: add a soluble material (1) to a first sample (2) and a second sample (10), wherein the first sample (2) has a The first pattern structure (201) and a first mark structure (202); the second pattern (10) has a second pattern structure (1001) and a second mark structure (1002); then: as shown in the figure As shown in 2B, the soluble material (1) is cured to form a first soluble mold core (3), wherein the first soluble mold core (3) has a pair of the first mold structure (201 ), a first concave-convex structure (4), and a first alignment mark (21) corresponding to the first mark structure (202); and curing the soluble material (1) to form a second soluble mold Kernel (11), wherein the second dissolvable mold kernel (11) has a second concave and convex structure (12) corresponding to the second pattern structure (1001), and a second concave and convex structure (12) corresponding to the second mark structure (1002). The second counterpoint mark (22). Preferably, the soluble material (1) is selected from the group consisting of: water-soluble polyacrylamide (PAM), polyurethane, polyurea, polyamide, polyester, polyurethane ester, polyvinylpyrrolidone, ethylene-vinyl alcohol, polyacrylamide-glyoxal polymer, polyacrylic acid, or combinations thereof, but are not limited thereto. The thickness of the soluble material (1) in the first mold (2) is 10 to 1,000 μm, so the subsequently obtained first soluble mold core (3) not only has dissolvable properties, but also has soluble properties. Flexibility; and the thickness of the soluble material (1) in the second sample mold (10) is 10 to 1,000 μm, so the subsequently obtained second soluble mold core (11), in addition to having soluble characteristics, More flexible. Preferably, the soluble material (1) can be added to the first sample (2) or the second sample (10) in the form of a solution, and its concentration can be 5 to 50 wt% of the solution, but Not limited to this. It can be understood that if the concentration is lower than the lower limit, the incompleteness of the first concave-convex structure (4) or the second concave-convex structure (12) will be increased, causing structural defects and affecting the imprinting quality. In addition, the soluble material (1) can be added by spin coating or slot die coating; when spin coating is used, the rotation speed of spin coating can be 100 to 5,000 rpm. , but not limited to this. Preferably, the material of the first sample (2) or the second sample (10) is silicon.

以下圖3用以說明本發明之形成步驟(S2):「於該第一可溶解性模仁(3)上形成一第一黏著層(5);以及於該第二可溶解性模仁(11)上形成一第二黏著層(13)。」The following Figure 3 is used to illustrate the forming step (S2) of the present invention: "A first adhesive layer (5) is formed on the first dissolvable mold core (3); and a first adhesive layer (5) is formed on the second dissolvable mold core (3). A second adhesive layer (13) is formed on 11).”

如圖3所示,於該可溶解性材料(1)固化,並於該第一樣模(2)中形成一第一可溶解性模仁(3);以及於該第二樣模(10)中形成一第二可溶解性模仁(11)後,於該第一可溶解性模仁(3)相對於該第一樣模(2)之一側形成一第一黏著層(5);以及於該第二可溶解性模仁(11)相對於該第二樣模(10)之一側形成一第二黏著層(13)。其中可以理解地,該第一黏著層(5)、或該第二黏著層(13)之形成之方式可為噴霧、塗佈、貼合、或傾倒,但不以此為限。較佳地,該第一黏著層(5)係均勻地形成於該第一可溶解性模仁(3)相對於該第一樣模(2)之一側;該第二黏著層(13)係均勻地形成於該第二可溶解性模仁(11)相對於該第二樣模(10)之一側。較佳地,該第一黏著層(5)、或該第二黏著層(13)係一種膠體或液體,其種類包含:光固化接著劑、紫外線硬化膠、光熱轉換(Light-to-Heat Conversion,LTHC)膠、熱固膠或可水解型樹酯,但不以此為限。其中所謂「固化」可為熱固化或光固化(如:紫外光固化);於採用熱固化下,熱固化溫度可為室溫至160℃,熱固化時間可為5至60分鐘,但不以此為限。若時間超過此上限值,則會提高第一可溶解性模仁(3)之剝離難度而使第一凹凸結構(4)形成缺陷;或提高第二可溶解性模仁(11)之剝離難度而使第二凹凸結構(12)形成缺陷。較佳地,該第一黏著層(5)、或該第二黏著層(13)係可為具有雙面黏性之膠帶,其中該膠帶係可藉由加熱、或照射UV光線進行解離,而使其自該第一可溶解性模仁(3)、或該第二可溶解性模仁(11)之表面剝離。較佳地,可以上述之方式於更多之樣模中形成更多之可溶解性模仁,在此不多做贅述。As shown in Figure 3, the soluble material (1) is solidified and a first soluble mold core (3) is formed in the first mold (2); and in the second mold (10) After forming a second soluble mold core (11) in the mold, a first adhesive layer (5) is formed on one side of the first soluble mold core (3) relative to the first sample mold (2) ; And forming a second adhesive layer (13) on one side of the second dissolvable mold core (11) relative to the second sample mold (10). It can be understood that the first adhesive layer (5) or the second adhesive layer (13) can be formed by spraying, coating, laminating, or pouring, but is not limited thereto. Preferably, the first adhesive layer (5) is evenly formed on one side of the first dissolvable mold core (3) relative to the first sample mold (2); the second adhesive layer (13) It is uniformly formed on one side of the second dissolvable mold core (11) relative to the second sample mold (10). Preferably, the first adhesive layer (5) or the second adhesive layer (13) is a colloid or liquid, and its types include: light-curing adhesive, ultraviolet hardening glue, light-to-heat conversion (Light-to-Heat Conversion) , LTHC) glue, thermosetting glue or hydrolyzable resin, but not limited to this. The so-called "curing" can be thermal curing or light curing (such as ultraviolet curing); when thermal curing is used, the thermal curing temperature can be from room temperature to 160°C, and the thermal curing time can be from 5 to 60 minutes, but not This is the limit. If the time exceeds this upper limit, it will increase the difficulty of peeling off the first soluble mold core (3) and cause defects in the first concave and convex structure (4); or it will increase the peeling off of the second soluble mold core (11). The difficulty causes defects in the second concave-convex structure (12). Preferably, the first adhesive layer (5) or the second adhesive layer (13) can be an adhesive tape with double-sided adhesiveness, wherein the adhesive tape can be decomposed by heating or irradiating UV light, and It is peeled off from the surface of the first soluble mold core (3) or the second soluble mold core (11). Preferably, more soluble mold cores can be formed in more molds in the above manner, which will not be described in detail here.

以下圖4A至4D用以說明本發明之取模步驟(S3):「附著一第一取模裝置(100)於該第一黏著層(5);以及附著一第二取模裝置(200)於該第二黏著層(13)。」The following Figures 4A to 4D are used to illustrate the mold taking step (S3) of the present invention: "Attach a first mold taking device (100) to the first adhesive layer (5); and attach a second mold taking device (200) on the second adhesive layer (13).”

如圖4A與4B所示,為本發明取模步驟(S3)之第一實施態樣,首先:附著一第一取模裝置(100)於該第一黏著層(5)相對於該第一樣模(2)之一側,其中該第一取模裝置(100)包含:一第一架體結構(6);一第一膠帶(7),其係設置於該第一架體結構(6);以及一第一支撐背板(8),其係設置於該第一膠帶(7),其中該第一取模裝置(100)係以該第一支撐背板(8)與該第一黏著層(5)接觸;以及附著一第二取模裝置(200)於該第二黏著層(13)相對於該第二樣模(10)之一側,其中該第二取模裝置(200)包含:一第二架體結構(14);一第二膠帶(15),其係設置於該第二架體結構(14);以及一第二支撐背板(16),其係設置於該第二膠帶(15),其中該第二取模裝置(200)係以該第二支撐背板(16)與該第二黏著層(13)接觸。具體而言,該第一取模裝置(100)係以該第一支撐背板(8)附著於該第一黏著層(5),使該第一支撐背板(8)與該第一可溶解性模仁(3)透過該第一黏著層(5)黏接;該第二取模裝置(200)係以該第二支撐背板(16)附著於該第二黏著層(13),使該第二支撐背板(16)與該第二可溶解性模仁(11)透過該第二黏著層(13)黏接。較佳地,該第一架體結構(6)係一環形框,其中該環形框具有一第一支撐部及一連接該第一支撐部的第一操作部。具體而言,該第一支撐背板(8)或該第一膠帶(7)係設置於該第一操作部。較佳地,該第一支撐背板(8)之面積可以完全覆蓋該第一黏著層(5)之面積,使該第一可溶解性模仁(3)可緊密黏接於該第一支撐背板(8),防止該第一可溶解性模仁(3)於相對於該第一樣模(2)移動時因晃動而產生偏移或誤差。較佳地,該第一膠帶(7)、或該第二膠帶(15)之材料可為熱解離性發泡膠或UV解離性發泡膠,但不以此為限。較佳地,熱解離性發泡膠為聚苯乙烯膠、聚氨酯膠(polyurethane,PU)、或聚苯乙烯膠(polystyrene,PS),其厚度為100至1,000μm。較佳地,當第一黏著層(5)、或第二黏著層(13)係使用膠帶時,該膠帶可與第一膠帶(7)、或第二膠帶(15)相同。較佳地,該第一膠帶(7)具有一第一突出部,其中該第一膠帶(7)係以該第一突出部設置於該第一架體結構(6)之第一操作部。較佳地,該第一支撐背板(8)具有一第二突出部,其中該第一支撐背板(8)係以該第二突出部設置於該第一架體結構(6)之第一操作部。其中可以理解地,該第二架體結構(14)與該第一架體結構(6)之結構相同,因此在此不多做贅述。As shown in Figures 4A and 4B, which is the first implementation mode of the mold taking step (S3) of the present invention, first: attach a first mold taking device (100) to the first adhesive layer (5) relative to the first One side of the sample mold (2), wherein the first mold-taking device (100) includes: a first frame structure (6); a first adhesive tape (7), which is arranged on the first frame structure ( 6); and a first supporting back plate (8), which is provided on the first tape (7), wherein the first mold taking device (100) uses the first supporting back plate (8) and the third An adhesive layer (5) contacts; and a second mold-taking device (200) is attached to one side of the second adhesive layer (13) relative to the second sample mold (10), wherein the second mold-taking device ( 200) includes: a second frame structure (14); a second tape (15), which is provided on the second frame structure (14); and a second support back plate (16), which is provided In the second adhesive tape (15), the second mold taking device (200) is in contact with the second adhesive layer (13) through the second supporting backing plate (16). Specifically, the first mold taking device (100) is attached to the first adhesive layer (5) with the first supporting back plate (8), so that the first supporting back plate (8) and the first possible The soluble mold core (3) is adhered through the first adhesive layer (5); the second mold taking device (200) is attached to the second adhesive layer (13) with the second supporting back plate (16). The second supporting back plate (16) and the second dissolvable mold core (11) are bonded through the second adhesive layer (13). Preferably, the first frame structure (6) is an annular frame, wherein the annular frame has a first supporting part and a first operating part connected to the first supporting part. Specifically, the first supporting back plate (8) or the first adhesive tape (7) is provided on the first operating part. Preferably, the area of the first support backing plate (8) can completely cover the area of the first adhesive layer (5), so that the first dissolvable mold core (3) can be tightly adhered to the first support. The backing plate (8) prevents the first dissolvable mold core (3) from shifting or causing errors due to shaking when moving relative to the first sample mold (2). Preferably, the material of the first tape (7) or the second tape (15) can be thermally dissociable foam glue or UV dissociable foam glue, but is not limited thereto. Preferably, the thermally dissociable foam glue is polystyrene glue, polyurethane glue (polyurethane, PU), or polystyrene glue (polystyrene, PS), and its thickness is 100 to 1,000 μm. Preferably, when the first adhesive layer (5) or the second adhesive layer (13) uses an adhesive tape, the adhesive tape can be the same as the first adhesive tape (7) or the second adhesive tape (15). Preferably, the first adhesive tape (7) has a first protruding portion, wherein the first adhesive tape (7) is disposed on the first operating portion of the first frame structure (6) with the first protruding portion. Preferably, the first supporting back plate (8) has a second protruding portion, wherein the first supporting back plate (8) is provided with the second protruding portion on the first frame structure (6). 1. Operation Department. It can be understood that the structure of the second frame structure (14) is the same as that of the first frame structure (6), so no further description will be given here.

如圖4C與4D所示,為本發明取模步驟(S3)之第二實施態樣,其中,本實施態樣與第一實施態樣之差異係為:取模裝置之結構不同。於取模步驟(S3)之第二實施態樣中,係包含:附著一第一取模裝置(100)於該第一黏著層(5)相對於該第一樣模(2)之一側,其中該第一取模裝置(100)包含:一第一架體結構(6);一第一膠帶(7),其係設置於該第一架體結構(6);以及一第一支撐背板(8),其係設置於該第一膠帶(7),其中該第一取模裝置(100)係以該第一膠帶(7)相對於該第一支撐背板(8)之一側與該第一黏著層(5)接觸;以及附著一第二取模裝置(200)於該第二黏著層(13)相對於該第二樣模(10)之一側,其中該第二取模裝置(200)包含:一第二架體結構(14);一第二膠帶(15),其係設置於該第二架體結構(14);以及一第二支撐背板(16),其係設置於該第二膠帶(15),其中該第二取模裝置(200)係以該第二膠帶(15)相對於該第二支撐背板(16)之一側與該第二黏著層(13)接觸。具體而言,於上述兩實施態樣中,皆於取模裝置上設置有支撐背板,其目的係在於,可於後續之壓印步驟(S6)中平整、穩定地將該第一可溶解性模仁(3)、或該第二可溶解性模仁(11)壓入高分子材料層(18)中;以及避免第一可溶解性模仁(3)、或第二可溶解性模仁(11)於壓印過程中產生晃動、或誤差,而影響最終生產產品之良率與品質。As shown in Figures 4C and 4D, it is the second implementation aspect of the impression-taking step (S3) of the present invention. The difference between this implementation aspect and the first implementation aspect is that the structure of the impression-taking device is different. In the second implementation aspect of the impression-taking step (S3), it includes: attaching a first impression-taking device (100) to a side of the first adhesive layer (5) opposite to the first sample (2) , wherein the first impression device (100) includes: a first frame structure (6); a first adhesive tape (7), which is provided on the first frame structure (6); and a first support A back plate (8) is provided on the first adhesive tape (7), wherein the first mold taking device (100) is positioned relative to one of the first supporting back plates (8) with the first adhesive tape (7). side is in contact with the first adhesive layer (5); and a second mold-taking device (200) is attached to one side of the second adhesive layer (13) relative to the second sample mold (10), wherein the second The mold taking device (200) includes: a second frame structure (14); a second tape (15), which is provided on the second frame structure (14); and a second supporting back plate (16) , which is arranged on the second adhesive tape (15), wherein the second mold taking device (200) is arranged with one side of the second adhesive tape (15) relative to the second supporting back plate (16) and the second The adhesive layer (13) is in contact. Specifically, in the above two embodiments, a supporting back plate is provided on the mold taking device. The purpose is to flatly and stably place the first dissolvable mold in the subsequent imprinting step (S6). The first soluble mold core (3) or the second soluble mold core (11) is pressed into the polymer material layer (18); and the first soluble mold core (3) or the second soluble mold core is prevented from being (11) Shaking or errors occur during the imprinting process, which affects the yield and quality of the final product.

以下圖5A與5B用以說明本發明之分離步驟(S4):「使該第一可溶解性模仁(3)與該第一樣模(2)分離;以及使該第二可溶解性模仁(11)與該第二樣模(10)分離。」The following Figures 5A and 5B are used to illustrate the separation step (S4) of the present invention: "Separate the first dissolvable mold core (3) from the first sample mold (2); and make the second dissolvable mold core Ren (11) is separated from this second pattern (10)."

如圖5A所示,為本發明分離步驟(S4)之第一實施態樣:於該第一支撐背板(8)與該第一黏著層(5)接觸後,移動該第一取模裝置(100),使該第一可溶解性模仁(3)隨著該第一取模裝置(100)相對於該第一樣模(2)移動,以使該第一可溶解性模仁(3)與該第一樣模(2)分離;以及於該第二支撐背板(16)與該第二黏著層(13)接觸後,移動該第二取模裝置(200),使該第二可溶解性模仁(11)隨著該第二取模裝置(200)相對於該第二樣模(10)移動,以使該第二可溶解性模仁(11)與該第二樣模(10)分離。較佳地,該第一可溶解性模仁(3)自該第一樣模(2)離開時;或該第二可溶解性模仁(11)自該第二樣模(10)離開時可採用正向剝離或側向剝離方式操作環形框的操作部。As shown in Figure 5A, it is the first implementation aspect of the separation step (S4) of the present invention: after the first supporting back plate (8) contacts the first adhesive layer (5), the first mold taking device is moved (100), causing the first dissolvable mold core (3) to move relative to the first mold (2) along with the first mold taking device (100), so that the first dissolvable mold core (3) 3) Separate from the first sample (2); and after the second support backing plate (16) contacts the second adhesive layer (13), move the second mold-taking device (200) so that the second mold-taking device (200) The two dissolvable mold cores (11) move with the second mold taking device (200) relative to the second sample mold (10), so that the second dissolvable mold core (11) is in contact with the second sample mold. Module (10) separates. Preferably, when the first dissolvable mold core (3) leaves the first sample mold (2); or when the second dissolvable mold core (11) leaves the second sample mold (10) The operating part of the ring frame can be operated by forward peeling or lateral peeling.

如圖5B所示,為本發明分離步驟(S4)之第二實施態樣,其與第一實施態樣之差異僅在於支撐背板之設置位置有所不同,具體而言為:於該第一膠帶(7)與該第一黏著層(5)接觸後,移動該第一取模裝置(100),使該第一可溶解性模仁(3)隨著該第一取模裝置(100)相對於該第一樣模(2)移動,以使該第一可溶解性模仁(3)與該第一樣模(2)分離;以及於該第二膠帶(15)與該第二黏著層(13)接觸後,移動該第二取模裝置(200),使該第二可溶解性模仁(11)隨著該第二取模裝置(200)相對於該第二樣模(10)移動,以使該第二可溶解性模仁(11)與該第二樣模(10)分離。其中可以理解地,為了使上述步驟之進行過程中,所使用之取模裝置為相同,其中:取模步驟(S3)之第一實施態樣與分離步驟(S4)之第一實施態樣為相配對地設置;以及取模步驟(S3)之第二實施態樣與分離步驟(S4)之第二實施態樣為相配對地設置。As shown in Figure 5B, it is the second embodiment of the separation step (S4) of the present invention. The only difference between it and the first embodiment is that the position of the supporting back plate is different. Specifically: in the second embodiment After a tape (7) comes into contact with the first adhesive layer (5), the first mold taking device (100) is moved so that the first dissolvable mold core (3) follows the first mold taking device (100). ) moves relative to the first mold (2) to separate the first dissolvable mold core (3) from the first mold (2); and between the second adhesive tape (15) and the second After the adhesive layer (13) comes into contact, the second mold-taking device (200) is moved so that the second dissolvable mold core (11) follows the second mold-taking device (200) relative to the second sample mold ( 10) Move to separate the second dissolvable mold core (11) from the second mold (10). It can be understood that in order to perform the above steps, the impression-taking device used is the same, wherein: the first implementation aspect of the impression-taking step (S3) and the first implementation aspect of the separation step (S4) are: and the second implementation aspect of the mold taking step (S3) and the second implementation aspect of the separation step (S4) are arranged in a matching manner.

以下圖6A至6D用以說明本發明之接觸步驟(S5):「將該第一可溶解性模仁(3)與該第二可溶解性模仁(11)放置於一高分子材料層(18)上。」The following Figures 6A to 6D are used to illustrate the contact step (S5) of the present invention: "Place the first soluble mold core (3) and the second soluble mold core (11) on a polymer material layer ( 18) Go up."

如圖6A至6D所示,其中將一高分子材料層(18)形成於一基材層(29)上,並且該接觸步驟(S5)係包含: 首先:係將該第一可溶解性模仁(3)加熱至一溫度T,其中0<T<Tg,並使該第一可溶解性模仁(3)與該高分子材料層(18)接觸;再來:將該第二可溶解性模仁(11)加熱至該溫度T,並使該第二可溶解性模仁(11)與該高分子材料層(18)接觸。較佳者,該接觸步驟(S5)包含:首先:係將該基材層(29)加熱至一溫度T,其中0<T<Tg,並使該第一可溶解性模仁(3)與該高分子材料層(18)接觸;再來:將該第二可溶解性模仁(11)與該高分子材料層(18)接觸。更佳者,該接觸步驟(S5)包含: 首先:係將該基材層(29)與該第一可溶解性模仁(3)相對應之部分加熱至一溫度T,其中0<T<Tg,並使該第一可溶解性模仁(3)與該高分子材料層(18)接觸;再來:將該基材層(29)與該第二可溶解性模仁(11)相對應之部分加熱至該溫度T,並使該第二可溶解性模仁(11)與該高分子材料層(18)接觸。較佳者,Tg係指玻璃轉化之溫度,其中將溫度加熱至T的目的為:使該高分子材料層(18)之表面具有黏性、或些微軟化,以便於此步驟中進行對位或預壓合之動作。較佳者,為了避免第一可溶解性模仁(3)與第二可溶解性模仁(11)壓印於高分子材料上之相同位置,而影響壓印之結果,於接觸步驟(S5)中,第一可溶解性模仁(3)與第二可溶解性模仁(11)係相互間隔地與高分子材料層(18)進行接觸。As shown in Figures 6A to 6D, a polymer material layer (18) is formed on a base material layer (29), and the contact step (S5) includes: First: the first soluble mold is The kernel (3) is heated to a temperature T, where 0<T<Tg, and the first soluble mold kernel (3) is brought into contact with the polymer material layer (18); then: the second soluble mold kernel (3) is brought into contact with the polymer material layer (18). The flexible mold core (11) is heated to the temperature T, and the second soluble mold core (11) is brought into contact with the polymer material layer (18). Preferably, the contacting step (S5) includes: firstly, heating the base material layer (29) to a temperature T, where 0<T<Tg, and making the first soluble mold core (3) and The polymer material layer (18) is in contact; and then: the second soluble mold core (11) is in contact with the polymer material layer (18). More preferably, the contacting step (S5) includes: first: heating the portion of the base material layer (29) corresponding to the first soluble mold core (3) to a temperature T, where 0<T< Tg, and bring the first soluble mold core (3) into contact with the polymer material layer (18); and then: contact the base material layer (29) with the second soluble mold core (11) The corresponding part is heated to the temperature T, and the second soluble mold core (11) is brought into contact with the polymer material layer (18). Preferably, Tg refers to the glass transition temperature, where the purpose of heating the temperature to T is to make the surface of the polymer material layer (18) sticky or somewhat softened, so as to facilitate alignment or softening in this step. The action of pre-pressing. Preferably, in order to avoid that the first soluble mold core (3) and the second soluble mold core (11) are imprinted at the same position on the polymer material and affect the imprinting result, in the contact step (S5) ), the first soluble mold core (3) and the second soluble mold core (11) are in contact with the polymer material layer (18) at a distance from each other.

更佳者,為了提升後續壓印步驟(S6)之精準度,使最後所獲得之產物的良率提升,可以於本步驟中先將該第一可溶解性模仁(3)以及該第二可溶解性模仁(11)與該高分子材料層(18)進行對位。Better yet, in order to improve the accuracy of the subsequent imprinting step (S6) and improve the yield of the final product, the first soluble mold core (3) and the second soluble mold core can be first The soluble mold core (11) is aligned with the polymer material layer (18).

如圖7A至7G所示,為本發明之對位步驟,具體而言,有關對位之各種實施態樣列舉如下。As shown in FIGS. 7A to 7G , it is the alignment step of the present invention. Specifically, various implementation aspects of alignment are listed below.

請參照圖7A與7B,於一實施樣態中,該接觸步驟(S5)包含: 首先,放置一待轉印物件(28)於一機台平台(30)上,該待轉印物件(28)具有一基材層(29)於該高分子材料層(18)與該機台平台(30)之間,該基材層(29)具有一第三對位記號(23)、以及一第四對位記號(24);再來, 以一設置於該第一取模裝置(100)相反於該第一可溶解性模仁(3)之一側的第一攝像元件(31)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第一攝像元件(31)確認該第一對位記號(21)與該第三對位記號(23)是否對齊,其中:若對齊,則該第一可溶解性模仁(3)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第一可溶解性模仁(3)的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號(21)與該第三對位記號(23)對齊;以及 以一設置於該第二取模裝置(200)相反於該第二可溶解性模仁(11)之一側的第二攝像元件(33)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第二攝像元件(33)確認該第二對位記號(22)與該第四對位記號(24)是否對齊,其中:若對齊,則該第二可溶解性模仁(11)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第二可溶解性模仁(11)的X軸與Y軸及其於X-Y平面的θ角,直到該第二對位記號(22)與該第四對位記號(24)對齊。Please refer to Figures 7A and 7B. In one implementation, the contact step (S5) includes: first, placing an object to be transferred (28) on a machine platform (30). ) has a base material layer (29) between the polymer material layer (18) and the machine platform (30). The base material layer (29) has a third alignment mark (23), and a third alignment mark (23). Four alignment marks (24); then, a first imaging element (31) or a first imaging element (31) disposed on one side of the first mold-taking device (100) opposite to the first dissolvable mold core (3) is used. The first imaging element (31) disposed on the side of the machine platform (30) opposite to the object to be transferred (28) confirms the first alignment mark (21) and the third alignment mark (23) Whether aligned, wherein: if aligned, the first soluble mold core (3) is in contact with the polymer material layer (18); if not aligned, a position adjustment component (35) is used to adjust the machine platform (30) Adjust the X-axis and Y-axis of the first dissolvable mold core (3) and its θ angle on the X-Y plane for the X-Y plane until the first alignment mark (21) and the third alignment mark (23) Align; and use a second imaging element (33) disposed on the side of the second mold taking device (200) opposite to the second dissolvable mold core (11) or a second imaging element (33) disposed on the machine platform. The second imaging element (33) on the side of the platform (30) opposite to the object (28) to be transferred confirms whether the second alignment mark (22) and the fourth alignment mark (24) are aligned, wherein: If aligned, the second dissolvable mold core (11) is in contact with the polymer material layer (18); if not aligned, a position adjustment component (35) is used to adjust the machine platform (30) as X-Y Planarly adjust the X-axis and Y-axis of the second dissolvable mold core (11) and its θ angle on the X-Y plane until the second alignment mark (22) is aligned with the fourth alignment mark (24).

於另一實施樣態中,如圖7C與7D所示,該接觸步驟(S5)包含: 放置一待轉印物件(28)於一機台平台(30)上,該待轉印物件(28)具有一基材層(29)於該高分子材料層(18)與該機台平台(30)之間,該基材層(29)具有一第三對位記號(23)、以及一第四對位記號(24); 使該第一可溶解性模仁(3)與該高分子材料層(18)接觸,並以一設置於該第一取模裝置(100)相反於該第一可溶解性模仁(3)之一側的第一攝像元件(31)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第一攝像元件(31)確認該第一對位記號(21)與該第三對位記號(23)是否對齊;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第一可溶解性模仁(3)的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號(21)與該第三對位記號(23)對齊;以及 使該第二可溶解性模仁(11)與該高分子材料層(18)接觸,並以一設置於該第二取模裝置(200)相反於該第二可溶解性模仁(11)之一側的第二攝像元件(33)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第二攝像元件(33)確認該第二對位記號(22)與該第四對位記號(24)是否對齊;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第二可溶解性模仁(11)的X軸與Y軸及其於X-Y平面的θ角,直到該第二對位記號(22)與該第四對位記號(24)對齊。較佳者,係將高分子材料層(18)加熱至溫度T後,再使第一可溶解性模仁(3)、或第二可溶解性模仁(11)與高分子材料層(18)接觸,以避免第一可溶解性模仁(3)、或第二可溶解性模仁(11)產生破損、或刮痕,而影響最終之壓印成果。In another implementation, as shown in Figures 7C and 7D, the contact step (S5) includes: placing an object to be transferred (28) on a machine platform (30), the object to be transferred (28) ) has a base material layer (29) between the polymer material layer (18) and the machine platform (30). The base material layer (29) has a third alignment mark (23), and a third alignment mark (23). Four alignment marks (24); bring the first soluble mold core (3) into contact with the polymer material layer (18), and use a tool set on the first mold-taking device (100) opposite to the first A first imaging element (31) on one side of the dissolvable mold core (3) or a first imaging element (31) disposed on a side of the machine platform (30) opposite to the object to be transferred (28) ) Confirm whether the first alignment mark (21) and the third alignment mark (23) are aligned; if they are not aligned, use a position adjustment component (35) to adjust the machine platform (30) as the X-Y plane The X-axis and Y-axis of the first dissolvable mold core (3) and their θ angle on the X-Y plane until the first alignment mark (21) is aligned with the third alignment mark (23); and The second dissolvable mold core (11) is in contact with the polymer material layer (18), and is disposed on the second mold taking device (200) opposite to the second dissolvable mold core (11). The second imaging element (33) on one side or a second imaging element (33) disposed on the side of the machine platform (30) opposite to the object to be transferred (28) confirms the second alignment mark ( 22) Whether it is aligned with the fourth alignment mark (24); if not, use a position adjustment component (35) to adjust the second dissolvable mold core (30) with the machine platform (30) as the X-Y plane 11) and the θ angle on the X-Y plane until the second alignment mark (22) is aligned with the fourth alignment mark (24). Preferably, after the polymer material layer (18) is heated to the temperature T, the first soluble mold core (3) or the second soluble mold core (11) and the polymer material layer (18) are then heated. ) contact to prevent the first dissolvable mold core (3) or the second dissolvable mold core (11) from being damaged or scratched, thereby affecting the final imprinting result.

於又一實施樣態中,如圖7E所示,該接觸步驟(S5)包含:放置一待轉印物件(28)於一機台平台(30)上,該待轉印物件(28)具有一基材層(29)於該高分子材料層(18)與該機台平台(30)之間,該基材層(29)具有一第三對位記號(23)、以及一第四對位記號(24); 移動一第一攝像元件(31)至該第一可溶解性模仁(3)與該待轉印物件(28)之間以確認該第一對位記號(21)與該第三對位記號(23)是否對齊,其中:若對齊,則復位該第一攝像元件(31),並且使該第一可溶解性模仁(3)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第一可溶解性模仁(3)的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號(21)與該第三對位記號(23)對齊;以及移動一第二攝像元件(33)至該第二可溶解性模仁(11)與該待轉印物件(28)之間以確認該第二對位記號(22)與該第四對位記號(24)是否對齊,其中:若對齊,則復位該第二攝像元件(33),並且使該第二可溶解性模仁(11)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第二可溶解性模仁(11)的X軸與Y軸及其於X-Y平面的θ角,直到該第二對位記號(22)與該第四對位記號(24)對齊。In yet another implementation, as shown in Figure 7E, the contact step (S5) includes: placing an object to be transferred (28) on a machine platform (30), the object to be transferred (28) having A base material layer (29) is between the polymer material layer (18) and the machine platform (30). The base material layer (29) has a third alignment mark (23) and a fourth pair. position mark (24); move a first imaging element (31) between the first dissolvable mold core (3) and the object to be transferred (28) to confirm that the first alignment mark (21) and Whether the third alignment mark (23) is aligned, wherein: if aligned, the first imaging element (31) is reset, and the first soluble mold core (3) and the polymer material layer (18) are contact; if not aligned, use a position adjustment component (35) to adjust the X-axis and Y-axis of the first dissolvable mold core (3) and their position on the X-Y plane with the machine platform (30) as the X-Y plane θ angle until the first alignment mark (21) is aligned with the third alignment mark (23); and move a second imaging element (33) to the second dissolvable mold core (11) and the between the object to be transferred (28) to confirm whether the second alignment mark (22) and the fourth alignment mark (24) are aligned, wherein: if aligned, the second imaging element (33) is reset, and Make the second dissolvable mold core (11) contact the polymer material layer (18); if they are not aligned, use a position adjustment component (35) to adjust the machine platform (30) as the X-Y plane. The X-axis and Y-axis of the second dissolvable mold core (11) and their θ angle on the X-Y plane are aligned until the second alignment mark (22) and the fourth alignment mark (24) are aligned.

於又一實施樣態中,如圖7F所示,該接觸步驟(S5)包含:放置一待轉印物件(28)於一機台平台(30)上,該待轉印物件(28)具有一基材層(29)於該高分子材料層(18)與該機台平台(30)之間,該機台平台(30)具有一第五對位記號(25)以及一第六對位記號(26); 以一設置於該第一取模裝置(100)相反於該第一可溶解性模仁(3)之一側的第一攝像元件(31)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第一攝像元件(31)確認該第一對位記號(21)與該第五對位記號(25)是否對齊,其中:若對齊,則該第一可溶解性模仁(3)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第一可溶解性模仁(3)的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號(21)與該第五對位記號(25)對齊;以及 以一設置於該第二取模裝置(200)相反於該第二可溶解性模仁(11)之一側的第二攝像元件(33)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第二攝像元件(33)確認該第二對位記號(22)與該第六對位記號(26)是否對齊,其中:若對齊,則該第二可溶解性模仁(11)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第二可溶解性模仁(11)的X軸與Y軸及其於X-Y平面的θ角,直到該第二對位記號(22)與該第六對位記號(26)對齊。In yet another implementation, as shown in Figure 7F, the contact step (S5) includes: placing an object to be transferred (28) on a machine platform (30), the object to be transferred (28) having A base material layer (29) is between the polymer material layer (18) and the machine platform (30). The machine platform (30) has a fifth alignment mark (25) and a sixth alignment Mark (26); with a first imaging element (31) disposed on the side of the first mold taking device (100) opposite to the first dissolvable mold core (3) or a first imaging element (31) disposed on the machine platform (30) The first imaging element (31) on the side opposite to the object (28) to be transferred confirms whether the first alignment mark (21) and the fifth alignment mark (25) are aligned, wherein: if If aligned, the first dissolvable mold core (3) is in contact with the polymer material layer (18); if not aligned, a position adjustment component (35) is used to set the machine platform (30) as the X-Y plane Adjust the X-axis and Y-axis of the first dissolvable mold core (3) and its θ angle on the X-Y plane until the first alignment mark (21) is aligned with the fifth alignment mark (25); and A second imaging element (33) is provided on the side of the second mold taking device (200) opposite to the second dissolvable mold core (11) or a second imaging element (33) is provided on the machine platform (30) opposite to the side of the second dissolvable mold core (11). The second imaging element (33) on one side of the object (28) to be transferred confirms whether the second alignment mark (22) and the sixth alignment mark (26) are aligned, wherein: if aligned, the third alignment mark (26) is aligned. The two dissolvable mold cores (11) are in contact with the polymer material layer (18); if they are not aligned, a position adjustment component (35) is used to adjust the second dissolvable mold core with the machine platform (30) as the X-Y plane. The X-axis and Y-axis of the soluble mold core (11) and their θ angle on the X-Y plane are aligned until the second alignment mark (22) is aligned with the sixth alignment mark (26).

於又一實施樣態中,該接觸步驟(S5)包含:放置一待轉印物件(28)於一機台平台(30)上,該待轉印物件(28)具有一基材層(29)於該高分子材料層(18)與該機台平台(30)之間,該機台平台(30)具有一第五對位記號(25)以及一第六對位記號(26); 使該第一可溶解性模仁(3)與該高分子材料層(18)接觸,並以一設置於該第一取模裝置(100)相反於該第一可溶解性模仁(3)之一側的第一攝像元件(31)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第一攝像元件(31)確認該第一對位記號(21)與該第五對位記號(25)是否對齊;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第一可溶解性模仁(3)的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號(21)與該第五對位記號(25)對齊;以及 使該第二可溶解性模仁(11)與該高分子材料層(18)接觸,並以一設置於該第二取模裝置(200)相反於該第二可溶解性模仁(11)之一側的第二攝像元件(33)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第二攝像元件(33)確認該第二對位記號(22)與該第六對位記號(26)是否對齊;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第二可溶解性模仁(11)的X軸與Y軸及其於X-Y平面的θ角,直到該第二對位記號(22)與該第六對位記號(26)對齊。較佳者,係將高分子材料層(18)加熱至溫度T後,再使第一可溶解性模仁(3)、或第二可溶解性模仁(11)與高分子材料層(18)接觸,以避免第一可溶解性模仁(3)、或第二可溶解性模仁(11)產生破損、或刮痕,而影響最終之壓印成果。In another embodiment, the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), the object to be transferred (28) having a base material layer (29) ) between the polymer material layer (18) and the machine platform (30), the machine platform (30) has a fifth alignment mark (25) and a sixth alignment mark (26); The first soluble mold core (3) is in contact with the polymer material layer (18), and is disposed on the first mold taking device (100) opposite to the first soluble mold core (3). The first imaging element (31) on one side or a first imaging element (31) disposed on the side of the machine platform (30) opposite to the object to be transferred (28) confirms the first alignment mark ( 21) Whether it is aligned with the fifth alignment mark (25); if not, use a position adjustment component (35) to adjust the first dissolvable mold core (30) with the machine platform (30) as the X-Y plane 3) of the 11) Contact the polymer material layer (18), and use a second imaging element (33) disposed on the side of the second mold-taking device (200) opposite to the second dissolvable mold core (11) ) or a second camera element (33) disposed on the side of the machine platform (30) opposite to the object to be transferred (28) to confirm the second alignment mark (22) and the sixth alignment mark (26) Whether it is aligned; if not, use a position adjustment component (35) to adjust the X-axis and Y-axis of the second dissolvable mold core (11) with the machine platform (30) as the X-Y plane. The angle θ on the X-Y plane is until the second alignment mark (22) is aligned with the sixth alignment mark (26). Preferably, after the polymer material layer (18) is heated to the temperature T, the first soluble mold core (3) or the second soluble mold core (11) and the polymer material layer (18) are then heated. ) contact to prevent the first dissolvable mold core (3) or the second dissolvable mold core (11) from being damaged or scratched, thereby affecting the final imprinting result.

於又一實施樣態中,該接觸步驟(S5)包含:放置一待轉印物件(28)於一機台平台(30)上,該待轉印物件(28)具有一基材層(29)於該高分子材料層(18)與該機台平台(30)之間,該機台平台(30)具有一第五對位記號(25)以及一第六對位記號(26); 移動一第一攝像元件(31)至該第一可溶解性模仁(3)與該待轉印物件(28)之間以確認該第一對位記號(21)與該第五對位記號(25)是否對齊,其中:若對齊,則復位該第一攝像元件(31),並且使該第一可溶解性模仁(3)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第一可溶解性模仁(3)的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號(21)與該第五對位記號(25)對齊;以及 移動一第二攝像元件(33)至該第二可溶解性模仁(11)與該待轉印物件(28)之間以確認該第二對位記號(22)與該第六對位記號(26)是否對齊,其中:若對齊,則復位該第二攝像元件(33),並且使該第二可溶解性模仁(11)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第二可溶解性模仁(11)的X軸與Y軸及其於X-Y平面的θ角,直到該第二對位記號(22)與該第六對位記號(26)對齊。In another embodiment, the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), the object to be transferred (28) having a base material layer (29) ) between the polymer material layer (18) and the machine platform (30). The machine platform (30) has a fifth alignment mark (25) and a sixth alignment mark (26); move A first imaging element (31) is placed between the first dissolvable mold core (3) and the object to be transferred (28) to confirm the first alignment mark (21) and the fifth alignment mark ( 25) Whether it is aligned, wherein: if aligned, reset the first imaging element (31), and make the first soluble mold core (3) contact the polymer material layer (18); if not aligned, then Utilize a position adjustment component (35) to adjust the X-axis and Y-axis of the first dissolvable mold core (3) and the θ angle in the X-Y plane with the machine platform (30) as the X-Y plane until the first A pair of alignment marks (21) are aligned with the fifth alignment mark (25); and a second camera element (33) is moved to the second dissolvable mold core (11) and the object to be transferred (28) to confirm whether the second alignment mark (22) and the sixth alignment mark (26) are aligned, wherein: if aligned, the second imaging element (33) is reset and the second dissolvable The mold core (11) is in contact with the polymer material layer (18); if it is not aligned, a position adjustment component (35) is used to adjust the second dissolvable mold core with the machine platform (30) as the X-Y plane. The X-axis and Y-axis of (11) and their θ angle on the X-Y plane until the second alignment mark (22) is aligned with the sixth alignment mark (26).

於又一實施樣態中,如圖7G所示,該接觸步驟(S5)包含:放置一待轉印物件(28)於一機台平台(30)上,該待轉印物件(28)具有一基材層(29)於該高分子材料層(18)與該機台平台(30)之間,該高分子材料層(18)具有一第七對位記號(27)以及一第八對位記號; 以一設置於該第一取模裝置(100)相反於該第一可溶解性模仁(3)之一側的第一攝像元件(31)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第一攝像元件(31)確認該第一對位記號(21)與該第七對位記號(27)是否對齊,其中:若對齊,則該第一可溶解性模仁(3)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第一可溶解性模仁(3)的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號(21)與該第七對位記號(27)對齊;以及 以一設置於該第二取模裝置(200)相反於該第二可溶解性模仁(11)之一側的第二攝像元件(33)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第二攝像元件(33)確認該第二對位記號(22)與該第八對位記號是否對齊,其中:若對齊,則該第二可溶解性模仁(11)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第二可溶解性模仁(11)的X軸與Y軸及其於X-Y平面的θ角,直到該第二對位記號(22)與該第八對位記號對齊。In yet another implementation, as shown in Figure 7G, the contact step (S5) includes: placing an object to be transferred (28) on a machine platform (30), the object to be transferred (28) having A base material layer (29) is between the polymer material layer (18) and the machine platform (30). The polymer material layer (18) has a seventh alignment mark (27) and an eighth pair. position mark; with a first imaging element (31) disposed on the side of the first mold taking device (100) opposite to the first dissolvable mold core (3) or a first imaging element (31) disposed on the machine platform (30 ) The first imaging element (31) on the side opposite to the object (28) to be transferred confirms whether the first alignment mark (21) and the seventh alignment mark (27) are aligned, wherein: if aligned, Then the first dissolvable mold core (3) is in contact with the polymer material layer (18); if they are not aligned, a position adjustment element (35) is used to adjust the machine platform (30) as the X-Y plane. The X-axis and Y-axis of the first dissolvable mold core (3) and their θ angle on the X-Y plane until the first alignment mark (21) is aligned with the seventh alignment mark (27); and with a A second imaging element (33) provided on the side of the second mold taking device (200) opposite to the second dissolvable mold core (11) or a second imaging element (33) provided on the machine platform (30) opposite to the side to be treated. The second imaging element (33) on one side of the transfer object (28) confirms whether the second alignment mark (22) and the eighth alignment mark are aligned, wherein: if aligned, the second dissolvable mold The core (11) is in contact with the polymer material layer (18); if it is not aligned, a position adjustment component (35) is used to adjust the second dissolvable mold core (30) with the machine platform (30) as the X-Y plane. 11) and the θ angle on the X-Y plane until the second alignment mark (22) is aligned with the eighth alignment mark.

於又一實施樣態中,該接觸步驟(S5)包含: 放置一待轉印物件(28)於一機台平台(30)上,該待轉印物件(28)具有一基材層(29)於該高分子材料層(18)與該機台平台(30)之間,該高分子材料層(18)具有一第七對位記號(27)以及一第八對位記號; 該第一可溶解性模仁(3)與該高分子材料層(18)接觸,並以一設置於該第一取模裝置(100)相反於該第一可溶解性模仁(3)之一側的第一攝像元件(31)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第一攝像元件(31)確認該第一對位記號(21)與該第七對位記號(27)是否對齊;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第一可溶解性模仁(3)的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號(21)與該第七對位記號(27)對齊;以及 該第二可溶解性模仁(11)與該高分子材料層(18)接觸,並以一設置於該第二取模裝置(200)相反於該第二可溶解性模仁(11)之一側的第二攝像元件(33)或一設置於該機台平台(30)相反於該待轉印物件(28)之一側的第二攝像元件(33)確認該第二對位記號(22)與該第八對位記號是否對齊;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第二可溶解性模仁(11)的X軸與Y軸及其於X-Y平面的θ角,直到該第二對位記號(22)與該第八對位記號對齊。較佳者,係將高分子材料層(18)加熱至溫度T後,再使第一可溶解性模仁(3)、或第二可溶解性模仁(11)與高分子材料層(18)接觸,以避免第一可溶解性模仁(3)、或第二可溶解性模仁(11)產生破損、或刮痕,而影響最終之壓印成果。In another embodiment, the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), the object to be transferred (28) having a base material layer (29) ) between the polymer material layer (18) and the machine platform (30), the polymer material layer (18) has a seventh alignment mark (27) and an eighth alignment mark; the first The soluble mold core (3) is in contact with the polymer material layer (18), and is disposed on one side of the first mold taking device (100) opposite to the first soluble mold core (3). The first imaging element (31) or a first imaging element (31) disposed on the side of the machine platform (30) opposite to the object to be transferred (28) confirms that the first alignment mark (21) and Is the seventh alignment mark (27) aligned? If not, use a position adjustment component (35) to adjust the first dissolvable mold core (3) with the machine platform (30) as the X-Y plane. The X-axis and the Y-axis and their θ angles on the X-Y plane until the first alignment mark (21) is aligned with the seventh alignment mark (27); and the second dissolvable mold core (11) is aligned with the seventh alignment mark (27); The polymer material layer (18) is in contact with a second imaging element (33) or a device arranged on a side of the second mold-taking device (200) opposite to the second dissolvable mold core (11). The second imaging element (33) on the side of the machine platform (30) opposite to the object to be transferred (28) confirms whether the second alignment mark (22) and the eighth alignment mark are aligned; if If not aligned, use a position adjustment component (35) to adjust the X-axis and Y-axis of the second dissolvable mold core (11) and its θ angle on the X-Y plane with the machine platform (30) as the X-Y plane. , until the second alignment mark (22) is aligned with the eighth alignment mark. Preferably, after the polymer material layer (18) is heated to the temperature T, the first soluble mold core (3) or the second soluble mold core (11) and the polymer material layer (18) are then heated. ) contact to prevent the first dissolvable mold core (3) or the second dissolvable mold core (11) from being damaged or scratched, thereby affecting the final imprinting result.

於又一實施樣態中,該接觸步驟(S5)包含: 放置一待轉印物件(28)於一機台平台(30)上,該待轉印物件(28)具有一基材層(29)於該高分子材料層(18)與該機台平台(30)之間,該高分子材料層(18)具有一第七對位記號(27)以及一第八對位記號; 移動一第一攝像元件(31)至該第一可溶解性模仁(3)與該待轉印物件(28)之間以確認該第一對位記號(21)與該第七對位記號(27)是否對齊,其中:若對齊,則復位該第一攝像元件(31),並且使該第一可溶解性模仁(3)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第一可溶解性模仁(3)的X軸與Y軸及其於X-Y平面的θ角,直到該第一對位記號(21)與該第七對位記號(27)對齊;以及 移動一第二攝像元件(33)至該第二可溶解性模仁(11)與該待轉印物件(28)之間以確認該第二對位記號(22)與該第八對位記號是否對齊,其中:若對齊,則復位該第二攝像元件(33),並且使該第二可溶解性模仁(11)與該高分子材料層(18)接觸;若未對齊,則利用一位置調整元件(35),以該機台平台(30)為X-Y平面調整該第二可溶解性模仁(11)的X軸與Y軸及其於X-Y平面的θ角,直到該第二對位記號(22)與該第八對位記號對齊。In another embodiment, the contacting step (S5) includes: placing an object to be transferred (28) on a machine platform (30), the object to be transferred (28) having a base material layer (29) ) between the polymer material layer (18) and the machine platform (30), the polymer material layer (18) has a seventh alignment mark (27) and an eighth alignment mark; move a first A camera element (31) is placed between the first dissolvable mold core (3) and the object to be transferred (28) to confirm the first alignment mark (21) and the seventh alignment mark (27) Whether aligned, wherein: if aligned, reset the first imaging element (31), and make the first soluble mold core (3) contact the polymer material layer (18); if not aligned, use a The position adjustment component (35) uses the machine platform (30) as the X-Y plane to adjust the X-axis and Y-axis of the first dissolvable mold core (3) and the θ angle on the X-Y plane until the first pair The position mark (21) is aligned with the seventh alignment mark (27); and a second camera element (33) is moved between the second dissolvable mold core (11) and the object to be transferred (28) To confirm whether the second alignment mark (22) and the eighth alignment mark are aligned, wherein: if aligned, reset the second imaging element (33) and make the second dissolvable mold core (11) Contact with the polymer material layer (18); if not aligned, use a position adjustment component (35) to adjust the X of the second dissolvable mold core (11) with the machine platform (30) as the X-Y plane. axis and the Y axis and its θ angle on the X-Y plane until the second alignment mark (22) is aligned with the eighth alignment mark.

更佳者,高分子材料層(18)可採旋轉塗佈方式形成一玻璃轉移溫度低於模仁的高分子材料於基材層(29)上取得;或者亦可先採旋轉塗佈方式形成一玻璃溫度低於模仁的高分子材料於基材層(29)上,再軟烤取得。較佳地,高分子材料的玻璃轉移溫度(Tg)為20至150℃,旋轉塗佈轉速為1,000至5,000rpm,塗佈厚度為0.05至1,000μm。須說明的是,高分子材料是否進行軟烤依材料特性決定;較佳地,軟烤溫度為80至150℃,軟烤時間為3至5分鐘。除了旋轉塗佈方式外,亦可利用一貼膜元件(圖未示)採用壓模貼片方式形成高分子材料層(18)於基材層(29)上。其中,該第三對位記號(23)、或該第四對位記號(24)可設置於基材層(29)相反於可溶解性模仁的一表面;或設置於相反於機台平台(30)的一表面。當基材層(29)的第三對位記號(23)設置於基材層(29)相反於可溶解性模仁的一表面時,基材層(29)可能會干擾第一攝像元件(31)擷取第一對位記號(21)與第三對位記號(23)的影像,故基材層(29)更可開設有一第一穿孔(36)以露出第三對位記號(23)。其中可以解地,為了便於第二對位記號(22)與第四對位記號(24)間之對位,於基材層(29)更可開設有一第二穿孔(36),以露出第四對位記號(24),在此不多做贅述。Even better, the polymer material layer (18) can be formed by spin coating to obtain a polymer material with a glass transition temperature lower than the mold core on the base material layer (29); or it can also be formed by spin coating first. A polymer material with a glass temperature lower than that of the mold core is placed on the base material layer (29) and then soft-baked to obtain it. Preferably, the glass transition temperature (Tg) of the polymer material is 20 to 150°C, the spin coating speed is 1,000 to 5,000 rpm, and the coating thickness is 0.05 to 1,000 μm. It should be noted that whether the polymer material is soft-baked depends on the characteristics of the material; preferably, the soft-baking temperature is 80 to 150°C, and the soft-baking time is 3 to 5 minutes. In addition to the spin coating method, a film-mounting component (not shown) can also be used to form the polymer material layer (18) on the base material layer (29) using a die-casting method. Wherein, the third alignment mark (23) or the fourth alignment mark (24) can be provided on a surface of the base material layer (29) opposite to the dissolvable mold core; or on a surface opposite to the machine platform A surface of (30). When the third alignment mark (23) of the base material layer (29) is disposed on a surface of the base material layer (29) opposite to the dissolvable mold core, the base material layer (29) may interfere with the first imaging element ( 31) Capture the images of the first alignment mark (21) and the third alignment mark (23), so the base material layer (29) can further open a first through hole (36) to expose the third alignment mark (23) ). Understandably, in order to facilitate the alignment between the second alignment mark (22) and the fourth alignment mark (24), a second through hole (36) can be opened in the base material layer (29) to expose the third alignment mark (24). The four counterpoint marks (24) will not be described in detail here.

再者,該第五對位記號(25)、與該第六對位記號(26)係設置於機台平台(30),為便於第一攝像元件(31)擷取第一對位記號(21)與第五對位記號(25)的影像;以及第二攝像元件(33)擷取第二對位記號(22)與第六對位記號(26)的影像,基材層(29)較佳地為一透明基材層(29)。其中,為了避免基材層(29)可能會干擾第一攝像元件(31)擷取第一對位記號(21)與第五對位記號(25)的影像,故基材層(29)更可開設有一穿孔(36)以露出第五對位記號(25);以及為了避免基材層(29)可能會干擾第二攝像元件(33)擷取第二對位記號(22)與第六對位記號(26)的影像,故基材層(29)更可開設有一穿孔(36)以露出第六對位記號(26)。Furthermore, the fifth alignment mark (25) and the sixth alignment mark (26) are provided on the machine platform (30) to facilitate the first imaging element (31) to capture the first alignment mark (31). 21) and the image of the fifth alignment mark (25); and the second camera element (33) captures the image of the second alignment mark (22) and the sixth alignment mark (26), the base material layer (29) Preferably it is a transparent base material layer (29). Among them, in order to avoid that the base material layer (29) may interfere with the first imaging element (31) capturing the images of the first alignment mark (21) and the fifth alignment mark (25), the base material layer (29) is changed A through hole (36) can be opened to expose the fifth alignment mark (25); and in order to prevent the base material layer (29) from interfering with the second imaging element (33) in capturing the second alignment mark (22) and the sixth alignment mark (25). The image of the alignment mark (26), so the base material layer (29) can further have a perforation (36) to expose the sixth alignment mark (26).

此外,為避免第一攝像元件(31)擷取第一對位記號(21)與第三對位記號(23)的影像時受光線反射雜訊造成的清晰度不足,更可利用一第一紅外線發射元件(32)照射第一對位記號(21)與第三對位記號(23);為避免第一攝像元件(31)擷取第一對位記號(21)與第五對位記號(25)的影像時受光線反射雜訊造成的清晰度不足,更可利用一第一紅外線發射元件(32)照射第一對位記號(21)與第五對位記號(25);為避免第一攝像元件(31)擷取第一對位記號(21)與第七對位記號(27)的影像時受光線反射雜訊造成的清晰度不足,更可利用一第一紅外線發射元件(32)照射第一對位記號(21)與第七對位記號(27)。而第一紅外線發射元件(32)可設置於第一取模裝置(100)相反於第一可溶解性模仁(3)的一側或設置於機台平台(30)相反於待轉印物件(28)的一側,但不以此為限。In addition, in order to avoid insufficient clarity caused by light reflection noise when the first imaging element (31) captures the images of the first alignment mark (21) and the third alignment mark (23), a first The infrared emitting element (32) irradiates the first alignment mark (21) and the third alignment mark (23); in order to prevent the first imaging element (31) from capturing the first alignment mark (21) and the fifth alignment mark When the image of (25) is not clear enough due to light reflection noise, a first infrared emitting element (32) can be used to illuminate the first alignment mark (21) and the fifth alignment mark (25); in order to avoid When the first imaging element (31) captures the images of the first alignment mark (21) and the seventh alignment mark (27), the resolution is insufficient due to light reflection noise. A first infrared emitting element ( 32) Irradiate the first alignment mark (21) and the seventh alignment mark (27). The first infrared emitting element (32) can be arranged on the side of the first mold taking device (100) opposite to the first dissolvable mold core (3) or on the machine platform (30) opposite to the object to be transferred. (28), but not limited to this.

此外,為避免第二攝像元件(33)擷取第二對位記號(22)與第四對位記號(24)的影像時受光線反射雜訊造成的清晰度不足,更可利用一第二紅外線發射元件(34)照射第二對位記號(22)與第四對位記號(24);為避免第二攝像元件(33)擷取第二對位記號(22)與第六對位記號(26)的影像時受光線反射雜訊造成的清晰度不足,更可利用一第二紅外線發射元件(34)照射第二對位記號(22)與第六對位記號(26);為避免第二攝像元件(33)擷取第二對位記號(22)與第八對位記號的影像時受光線反射雜訊造成的清晰度不足,更可利用一第二紅外線發射元件(34)照射第二對位記號(22)與第八對位記號。而第二紅外線發射元件(34)可設置於第二取模裝置(200)相反於第二可溶解性模仁(11)的一側或設置於機台平台(30)相反於待轉印物件(28)的一側,但不以此為限。In addition, in order to avoid insufficient clarity caused by light reflection noise when the second imaging element (33) captures the images of the second alignment mark (22) and the fourth alignment mark (24), a second imaging element (33) may be used. The infrared emitting element (34) irradiates the second alignment mark (22) and the fourth alignment mark (24); in order to prevent the second imaging element (33) from capturing the second alignment mark (22) and the sixth alignment mark In order to avoid insufficient clarity in the image of (26) caused by light reflection noise, a second infrared emitting element (34) can be used to illuminate the second alignment mark (22) and the sixth alignment mark (26); When the second imaging element (33) captures the images of the second alignment mark (22) and the eighth alignment mark, the clarity is insufficient due to light reflection noise. A second infrared emitting element (34) can be used to illuminate the image. The second counterpoint mark (22) and the eighth counterpoint sign. The second infrared emitting element (34) can be arranged on the side of the second mold taking device (200) opposite to the second dissolvable mold core (11) or on the machine platform (30) opposite to the object to be transferred. (28), but not limited to this.

如圖7F所示,為對位記號設置於機台平台(30)時之使用態樣;以及如7G所示,為對位記號設置於高分子材料層(18)時之使用態樣,具體而言,圖7F、圖7G、與圖7A至7E之差異僅在於:其對位記號位置不同,除此之外,其他操作細節與功效大致上相同,於此不再贅述。As shown in Figure 7F, it is the use mode when the alignment mark is set on the machine platform (30); and as shown in Figure 7G, it is the use mode when the alignment mark is set on the polymer material layer (18). Specifically, In terms of FIG. 7F, FIG. 7G, and FIG. 7A to 7E, the only difference is that the positions of the alignment marks are different. Apart from that, other operational details and functions are basically the same, and will not be described again here.

以下圖8A至8G用以說明本發明之壓印步驟(S6):「施予一第一高溫至該高分子材料層(18),以及一壓力至該第一可溶解性模仁(3)、與該第二可溶解性模仁(11);使該第一取模裝置(100)相對於該第一可溶解性模仁(3)分離、以及使該第二取模裝置(200)相對於該第二可溶解性模仁(11)分離;以及施予一第二高溫至該高分子材料層(18),使該高分子材料層(18)固化。」The following Figures 8A to 8G are used to illustrate the imprinting step (S6) of the present invention: "A first high temperature is applied to the polymer material layer (18), and a pressure is applied to the first soluble mold core (3) , and the second dissolvable mold core (11); separating the first mold taking device (100) relative to the first dissolvable mold core (3), and making the second mold taking device (200) Separate from the second dissolvable mold core (11); and apply a second high temperature to the polymer material layer (18) to solidify the polymer material layer (18)."

以下用以說明壓印步驟(S6)之第一實施態樣。The following is a description of the first implementation mode of the imprinting step (S6).

如圖8A至8C所示,其中壓印步驟(S6)包含:施予一第一高溫至該高分子材料層(18);以及施予一壓力至該第一可溶解性模仁(3)、與該第二可溶解性模仁(11),使該高分子材料層(18)具有一對應該第一凹凸結構(4)的第一轉印結構(9);以及一對應該第二凹凸結構(12)的第二轉印結構(17);以及將該第一支撐背板(8)與該第一膠帶(7)分離;以及將該第二支撐背板(16)與該第二膠帶(15)分離,並施予一第二高溫至該高分子材料層(18),使該高分子材料層(18)固化,其中該第一高溫與該第二高溫不同。As shown in Figures 8A to 8C, the imprinting step (S6) includes: applying a first high temperature to the polymer material layer (18); and applying a pressure to the first soluble mold core (3) , and the second dissolvable mold core (11), so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave and convex structure (4); and a corresponding second transfer structure (9). The second transfer structure (17) of the concave-convex structure (12); and separating the first supporting backing plate (8) from the first adhesive tape (7); and separating the second supporting backing plate (16) from the first adhesive tape (7). The two tapes (15) are separated, and a second high temperature is applied to the polymer material layer (18) to solidify the polymer material layer (18), wherein the first high temperature is different from the second high temperature.

更佳者,供給第一高溫、與第二高溫之加熱源可為相同或不同,其中加熱源係可對可溶解性模仁加熱;對基材層(29)與可溶解性模仁相對應之區域加熱;或對整體基材層(29)加熱,以使溫度傳導至高分子材料層(18),而使高分子材料層(18)軟化、或固化。More preferably, the heating sources supplying the first high temperature and the second high temperature can be the same or different, wherein the heating source can heat the soluble mold core; the base material layer (29) corresponds to the soluble mold core. regional heating; or heating the entire base material layer (29) to conduct the temperature to the polymer material layer (18) to soften or solidify the polymer material layer (18).

具體而言,如圖8A至8C所示,於壓印步驟(S6)中,第一實施態樣之第一實施例包含:施予該第一高溫與該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9);於形成該第一轉印結構(9)後,施予該第一高溫與該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17);於形成該第二轉印結構(17)後,將該第一支撐背板(8)與該第一膠帶(7)分離;以及將該第二支撐背板(16)與該第二膠帶(15)分離;以及施予該第二高溫至該第一可溶解性模仁(3)與該第二可溶解性模仁(11);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置、以及該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)固化。Specifically, as shown in FIGS. 8A to 8C , in the imprinting step (S6), the first embodiment of the first implementation aspect includes: applying the first high temperature and the pressure to the first soluble mold Kernel (3), making the polymer material layer (18) have the first transfer structure (9); after forming the first transfer structure (9), applying the first high temperature and the pressure to the third Two dissolvable mold cores (11) enable the polymer material layer (18) to have the second transfer structure (17); after forming the second transfer structure (17), the first support backing plate is (8) Separate from the first adhesive tape (7); and separate the second support backing plate (16) from the second adhesive tape (15); and apply the second high temperature to the first dissolvable mold core (3) with the second dissolvable mold core (11); to the position corresponding to the base material layer (29) and the first dissolvable mold core (3), and with the base material layer (29) and The position corresponding to the second dissolvable mold core (11); or to the base material layer (29) to solidify the polymer material layer (18).

更佳者,如圖8A至8C所示,於壓印步驟(S6)中,第一實施態樣之第二實施例包含:施予該第一高溫至該基材層(29);施予該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9);於形成完該第一轉印結構(9)後,施予該壓力至將該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17);將該第一支撐背板(8)與該第一膠帶(7)分離;以及將該第二支撐背板(16)與該第二膠帶(15)分離;以及施予該第二高溫至該第一可溶解性模仁(3)與該第二可溶解性模仁(11);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置、以及該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)固化。Better still, as shown in Figures 8A to 8C, in the imprinting step (S6), the second embodiment of the first implementation aspect includes: applying the first high temperature to the base material layer (29); applying The pressure is applied to the first soluble mold core (3), so that the polymer material layer (18) has the first transfer structure (9); after the first transfer structure (9) is formed, apply Apply pressure to the second dissolvable mold core (11) so that the polymer material layer (18) has the second transfer structure (17); connect the first support back plate (8) and the third Separating an adhesive tape (7); and separating the second support backing plate (16) and the second adhesive tape (15); and applying the second high temperature to the first dissolvable mold core (3) and the third Two dissolvable mold cores (11); to the position corresponding to the base material layer (29) and the first dissolvable mold core (3), and between the base material layer (29) and the second dissolvable mold core The position corresponding to the mold core (11); or to the base material layer (29) to solidify the polymer material layer (18).

更佳者,如圖8A至8C所示,於壓印步驟(S6)中,第一實施態樣之第三實施例包含:施予該第一高溫至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;以及該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9);於形成完該第一轉印結構(9)後,施予該第一高溫至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;以及該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17);將該第一支撐背板(8)與該第一膠帶(7)分離;以及將該第二支撐背板(16)與該第二膠帶(15)分離;以及施予該第二高溫至該第一可溶解性模仁(3)與該第二可溶解性模仁(11);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置、以及該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)固化。Better still, as shown in Figures 8A to 8C, in the imprinting step (S6), the third embodiment of the first implementation aspect includes: applying the first high temperature to the base material layer (29) and the third A position corresponding to a soluble mold core (3); and the pressure is applied to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9); After the first transfer structure (9) is formed, the first high temperature is applied to the position corresponding to the base material layer (29) and the second dissolvable mold core (11); and the pressure is applied to the position corresponding to the second dissolvable mold core (11); The second dissolvable mold core (11) enables the polymer material layer (18) to have the second transfer structure (17); the first support backing plate (8) is separated from the first adhesive tape (7) ; and separating the second supporting backing plate (16) from the second adhesive tape (15); and applying the second high temperature to the first soluble mold core (3) and the second soluble mold core (11); to the position corresponding to the base material layer (29) and the first soluble mold core (3), and to the position where the base material layer (29) and the second soluble mold core (11) are in contact with each other. The corresponding position; or to the base material layer (29) to solidify the polymer material layer (18).

更佳者,如圖8D至8G所示,於壓印步驟(S6)中,第一實施態樣之第四實施例包含:施予該第一高溫與該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9),並使該第一支撐背板(8)與該第一膠帶(7)分離;以及施予該第二高溫至該第一可溶解性模仁(3);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化;以及施予該第一高溫與該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17),並使該第二支撐背板(16)與該第二膠帶(15)分離;以及施予該第二高溫至該第二可溶解性模仁(11);至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化。Better still, as shown in Figures 8D to 8G, in the imprinting step (S6), the fourth embodiment of the first implementation aspect includes: applying the first high temperature and the pressure to the first soluble mold. kernel (3), causing the polymer material layer (18) to have the first transfer structure (9), and separating the first support backing plate (8) from the first adhesive tape (7); and applying the The second high temperature reaches the first soluble mold core (3); to the position corresponding to the base material layer (29) and the first soluble mold core (3); or to the base material layer (29) , so as to solidify the portion of the polymer material layer (18) corresponding to the first soluble mold core (3); and apply the first high temperature and the pressure to the second soluble mold core (11 ), causing the polymer material layer (18) to have the second transfer structure (17), and separating the second support backing plate (16) from the second adhesive tape (15); and applying the second high temperature to the second dissolvable mold core (11); to the position of the base material layer (29) corresponding to the second dissolvable mold core (11); or to the base material layer (29), so that The portion of the polymer material layer (18) corresponding to the second dissolvable mold core (11) is solidified.

更佳者,如圖8D至8G所示,於壓印步驟(S6)中,第一實施態樣之第五實施例包含:首先:施予該第一高溫至該基材層(29)與該第一可溶解性模仁(3)相對應之部分;以及該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9),並使該第一支撐背板(8)與該第一膠帶(7)分離;再來:施予該第二高溫至該第一可溶解性模仁(3);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化;以及首先:施予該第一高溫至該基材層(29)與該第二可溶解性模仁(11)相對應之部分;以及該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17),並使該第二支撐背板(16)與該第二膠帶(15)分離;再來:施予該第二高溫至該第二可溶解性模仁(11);至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化。Better still, as shown in Figures 8D to 8G, in the imprinting step (S6), the fifth embodiment of the first implementation aspect includes: firstly: applying the first high temperature to the base material layer (29) and The corresponding part of the first soluble mold core (3); and the pressure to the first soluble mold core (3), so that the polymer material layer (18) has the first transfer structure (9) ), and separate the first support backing plate (8) from the first tape (7); then: apply the second high temperature to the first dissolvable mold core (3); to the base material layer (29) The position corresponding to the first dissolvable mold core (3); or to the base material layer (29), so that the polymer material layer (18) and the first dissolvable mold core (3) 3) The corresponding part is cured; and firstly: applying the first high temperature to the part of the base material layer (29) corresponding to the second dissolvable mold core (11); and applying the pressure to the second dissolvable mold core (11). Dissolve the mold core (11), so that the polymer material layer (18) has the second transfer structure (17), and separate the second support backing plate (16) from the second adhesive tape (15); then To: Apply the second high temperature to the second soluble mold core (11); to the position corresponding to the base material layer (29) and the second soluble mold core (11); or to the base layer (29). material layer (29), so that the portion of the polymer material layer (18) corresponding to the second dissolvable mold core (11) is solidified.

更佳者,如圖8D至8G所示,於壓印步驟(S6)中,第一實施態樣之第六實施例包含:施予該第一高溫至該基材層(29);施予該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9),並使該第一支撐背板(8)與該第一膠帶(7)分離;以及施予該第二高溫至該第一可溶解性模仁(3);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化;以及施予該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17),並使該第二支撐背板(16)與該第二膠帶(15)分離;以及施予該第二高溫至該第二可溶解性模仁(11);至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化。Better still, as shown in Figures 8D to 8G, in the imprinting step (S6), the sixth embodiment of the first implementation aspect includes: applying the first high temperature to the base material layer (29); applying The pressure is applied to the first dissolvable mold core (3), so that the polymer material layer (18) has the first transfer structure (9), and the first support backing plate (8) and the first Separating the adhesive tape (7); and applying the second high temperature to the first soluble mold core (3); to the position corresponding to the base material layer (29) and the first soluble mold core (3) ; Or to the base material layer (29) to solidify the portion of the polymer material layer (18) corresponding to the first dissolvable mold core (3); and applying the pressure to the second dissolvable mold core The mold core (11) is used to make the polymer material layer (18) have the second transfer structure (17), and to separate the second support backing plate (16) from the second adhesive tape (15); and apply Apply the second high temperature to the second soluble mold core (11); to the position corresponding to the base material layer (29) and the second soluble mold core (11); or to the base material layer (29). 29), so as to solidify the portion of the polymer material layer (18) corresponding to the second dissolvable mold core (11).

以下用以說明壓印步驟(S6)之第二實施態樣。The following is a description of the second implementation mode of the imprinting step (S6).

如圖9A至9C所示,其中壓印步驟(S6)包含:施予一第一高溫至該高分子材料層(18);以及施予一壓力至該第一可溶解性模仁(3)、與該第二可溶解性模仁(11),使該高分子材料層(18)具有一對應該第一凹凸結構(4)的第一轉印結構(9);以及一對應該第二凹凸結構(12)的第二轉印結構(17);以及將該第一支撐背板(8)與該第一黏著層(5)分離;以及將該第二支撐背板(16)與該第二黏著層(13)分離,並施予一第二高溫至該高分子材料層(18),使該高分子材料層(18)固化,其中該第一高溫與該第二高溫不同。As shown in Figures 9A to 9C, the imprinting step (S6) includes: applying a first high temperature to the polymer material layer (18); and applying a pressure to the first soluble mold core (3) , and the second dissolvable mold core (11), so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave and convex structure (4); and a corresponding second transfer structure (9). The second transfer structure (17) of the concave-convex structure (12); and separating the first supporting back plate (8) from the first adhesive layer (5); and separating the second supporting back plate (16) from the first adhesive layer (5); The second adhesive layer (13) is separated, and a second high temperature is applied to the polymer material layer (18) to solidify the polymer material layer (18), wherein the first high temperature is different from the second high temperature.

更佳者,供給第一高溫、與第二高溫之加熱源可為相同或不同,其中加熱源係可對可溶解性模仁加熱;對基材層(29)與可溶解性模仁相對應之區域加熱;或對整體基材層(29)加熱,以使溫度傳導至高分子材料層(18),而使高分子材料層(18)軟化、或固化。More preferably, the heating sources supplying the first high temperature and the second high temperature can be the same or different, wherein the heating source can heat the soluble mold core; the base material layer (29) corresponds to the soluble mold core. regional heating; or heating the entire base material layer (29) to conduct the temperature to the polymer material layer (18) to soften or solidify the polymer material layer (18).

更佳者,如圖9A至9C所示,於壓印步驟(S6)中,第二實施態樣之第一實施例包含:施予該第一高溫與該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9); 於形成該第一轉印結構(9)後,施予該第一高溫與該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17); 於形成該第二轉印結構(17)後,將該第一支撐背板(8)與該第一黏著層(5)分離;以及將該第二支撐背板(16)與該第二黏著層(13)分離;以及 施予該第二高溫至該第一可溶解性模仁(3)與該第二可溶解性模仁(11);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置、以及該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)固化。Better still, as shown in FIGS. 9A to 9C , in the imprinting step (S6), the first embodiment of the second implementation aspect includes: applying the first high temperature and the pressure to the first soluble mold. Kernel (3), so that the polymer material layer (18) has the first transfer structure (9); after forming the first transfer structure (9), apply the first high temperature and the pressure to the third transfer structure (9). Two dissolvable mold cores (11) enable the polymer material layer (18) to have the second transfer structure (17); after forming the second transfer structure (17), the first support backing plate is (8) Separate from the first adhesive layer (5); and separate the second support backing plate (16) from the second adhesive layer (13); and apply the second high temperature to the first solubility The mold core (3) and the second dissolvable mold core (11); to the position corresponding to the base material layer (29) and the first dissolvable mold core (3), and the base material layer (29) ) corresponding to the second dissolvable mold core (11); or to the base material layer (29) to solidify the polymer material layer (18).

更佳者,如圖9A至9C所示,於壓印步驟(S6)中,第二實施態樣之第二實施例包含:施予該第一高溫至該基材層(29); 施予該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9); 於形成完該第一轉印結構(9)後,施予該壓力至將該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17); 將該第一支撐背板(8)與該第一黏著層(5)分離;以及將該第二支撐背板(16)與該第二黏著層(13)分離;以及 施予該第二高溫至該第一可溶解性模仁(3)與該第二可溶解性模仁(11);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置、以及該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)固化。Better still, as shown in Figures 9A to 9C, in the imprinting step (S6), the second embodiment of the second implementation aspect includes: applying the first high temperature to the base material layer (29); The pressure is applied to the first soluble mold core (3), so that the polymer material layer (18) has the first transfer structure (9); after the first transfer structure (9) is formed, apply Apply pressure to the second dissolvable mold core (11) so that the polymer material layer (18) has the second transfer structure (17); Separating an adhesive layer (5); and separating the second support backing plate (16) and the second adhesive layer (13); and applying the second high temperature to the first soluble mold core (3) and the second dissolvable mold core (11); to the position corresponding to the base material layer (29) and the first dissolvable mold core (3), and between the base material layer (29) and the second dissolvable mold core The position corresponding to the soluble mold core (11); or to the base material layer (29) to solidify the polymer material layer (18).

更佳者,如圖9A至9C所示,於壓印步驟(S6)中,第二實施態樣之第三實施例包含:施予該第一高溫至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;以及該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9); 於形成完該第一轉印結構(9)後,施予該第一高溫至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;以及該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17); 將該第一支撐背板(8)與該第一黏著層(5)分離;以及將該第二支撐背板(16)與該第二黏著層(13)分離;以及 施予該第二高溫至該第一可溶解性模仁(3)與該第二可溶解性模仁(11);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置、以及該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)固化。Better still, as shown in Figures 9A to 9C, in the imprinting step (S6), the third embodiment of the second implementation aspect includes: applying the first high temperature to the base material layer (29) and the third A position corresponding to a soluble mold core (3); and the pressure is applied to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9); After the first transfer structure (9) is formed, the first high temperature is applied to the position corresponding to the base material layer (29) and the second dissolvable mold core (11); and the pressure is applied to the position corresponding to the second dissolvable mold core (11); The second dissolvable mold core (11) makes the polymer material layer (18) have the second transfer structure (17); connect the first support backing plate (8) and the first adhesive layer (5) Separate; and separate the second support backing plate (16) and the second adhesive layer (13); and apply the second high temperature to the first soluble mold core (3) and the second soluble mold core (3). Mold core (11); to the position corresponding to the base material layer (29) and the first dissolvable mold core (3), and to the base material layer (29) and the second dissolvable mold core (11) ) corresponding position; or to the base material layer (29) to solidify the polymer material layer (18).

更佳者,如圖9D至9G所示,於壓印步驟(S6)中,第二實施態樣之第四實施例包含:施予該第一高溫與該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9),並使該第一支撐背板(8)與該第一黏著層(5)分離;以及施予該第二高溫至該第一可溶解性模仁(3);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化;以及 施予該第一高溫與該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17),並使該第二支撐背板(16)與該第二黏著層(13)分離;以及施予該第二高溫至該第二可溶解性模仁(11);至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化。Better still, as shown in Figures 9D to 9G, in the imprinting step (S6), the fourth embodiment of the second implementation aspect includes: applying the first high temperature and the pressure to the first soluble mold. kernel (3), causing the polymer material layer (18) to have the first transfer structure (9), and separating the first support backing plate (8) from the first adhesive layer (5); and applying The second high temperature reaches the first soluble mold core (3); to the position corresponding to the base material layer (29) and the first soluble mold core (3); or to the base material layer (29) ) to solidify the portion of the polymer material layer (18) corresponding to the first soluble mold core (3); and apply the first high temperature and the pressure to the second soluble mold core (3) 11), making the polymer material layer (18) have the second transfer structure (17), and separating the second support backing plate (16) from the second adhesive layer (13); and applying the second The second high temperature is applied to the second soluble mold core (11); to the position corresponding to the base material layer (29) and the second soluble mold core (11); or to the base material layer (29), To solidify the portion of the polymer material layer (18) corresponding to the second dissolvable mold core (11).

更佳者,如圖9D至9G所示,於壓印步驟(S6)中,第二實施態樣之第五實施例包含:首先:施予該第一高溫至該基材層(29)與該第一可溶解性模仁(3)相對應之部分;以及該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9),並使該第一支撐背板(8)與該第一黏著層(5)分離;再來:施予該第二高溫至該第一可溶解性模仁(3);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化;以及 首先:施予該第一高溫至該基材層(29)與該第二可溶解性模仁(11)相對應之部分;以及該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17),並使該第二支撐背板(16)與該第二黏著層(13)分離;再來:施予該第二高溫至該第二可溶解性模仁(11);至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化。Better still, as shown in Figures 9D to 9G, in the imprinting step (S6), the fifth embodiment of the second implementation aspect includes: firstly: applying the first high temperature to the base material layer (29) and The corresponding part of the first soluble mold core (3); and the pressure to the first soluble mold core (3), so that the polymer material layer (18) has the first transfer structure (9) ), and separate the first support backing plate (8) from the first adhesive layer (5); then: apply the second high temperature to the first dissolvable mold core (3); to the base material The position corresponding to the layer (29) and the first soluble mold core (3); or to the base material layer (29), so that the polymer material layer (18) and the first soluble mold core (3) Corresponding parts are cured; and first: apply the first high temperature to the parts of the base material layer (29) corresponding to the second dissolvable mold core (11); and apply the pressure to the second The dissolvable mold core (11) enables the polymer material layer (18) to have the second transfer structure (17) and separates the second support backing plate (16) from the second adhesive layer (13). ; Next: apply the second high temperature to the second soluble mold core (11); to the position corresponding to the base material layer (29) and the second soluble mold core (11); or to The base material layer (29) is used to solidify the portion of the polymer material layer (18) corresponding to the second dissolvable mold core (11).

更佳者,如圖9D至9G所示,於壓印步驟(S6)中,第二實施態樣之第六實施例包含: 施予該第一高溫至該基材層(29); 施予該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9),並使該第一支撐背板(8)與該第一黏著層(5)分離;以及施予該第二高溫至該第一可溶解性模仁(3);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化;以及 施予該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17),並使該第二支撐背板(16)與該第二黏著層(13)分離;以及施予該第二高溫至該第二可溶解性模仁(11);至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化。Better still, as shown in Figures 9D to 9G, in the imprinting step (S6), the sixth embodiment of the second implementation aspect includes: applying the first high temperature to the base material layer (29); The pressure is applied to the first dissolvable mold core (3), so that the polymer material layer (18) has the first transfer structure (9), and the first support backing plate (8) and the first The adhesive layer (5) is separated; and the second high temperature is applied to the first soluble mold core (3); to the base material layer (29) corresponding to the first soluble mold core (3) position; or to the base material layer (29), so that the portion of the polymer material layer (18) corresponding to the first dissolvable mold core (3) is solidified; and applying the pressure to the second dissolvable mold core The dissolving mold core (11) enables the polymer material layer (18) to have the second transfer structure (17) and separates the second support backing plate (16) from the second adhesive layer (13); and applying the second high temperature to the second soluble mold core (11); to the position of the base material layer (29) corresponding to the second soluble mold core (11); or to the base material layer (29) to solidify the portion of the polymer material layer (18) corresponding to the second dissolvable mold core (11).

以下用以說明壓印步驟(S6)之第三實施態樣。The following is a description of the third implementation mode of the imprinting step (S6).

如圖10A至10C所示,其中壓印步驟(S6)包含:施予一第一高溫至該高分子材料層(18);以及施予一壓力至該第一可溶解性模仁(3)、與該第二可溶解性模仁(11),使該高分子材料層(18)具有一對應該第一凹凸結構(4)的第一轉印結構(9);以及一對應該第二凹凸結構(12)的第二轉印結構(17);以及將該第一膠帶(7)與該第一黏著層(5)分離;以及將該第二膠帶(15)與該第二黏著層(13)分離,並施予一第二高溫至該高分子材料層(18),使該高分子材料層(18)固化,其中該第一高溫與該第二高溫不同。 較佳者,如圖10D所示,其中更包含:一剝離步驟(S8),係於該壓印步驟(S6)後、與該溶解步驟(S7)前,將該第一黏著層(5)與該第一可溶解性模仁(3)分離;以及將該第二黏著層(13)與該第二可溶解性模仁(11)分離。具體而言,該第一黏著層(5)與該第二黏著層(13)係為一熱解離膠帶,當其受第一高溫烘烤時,即會產生解離,因此當於剝離步驟(S8)中,使該第一黏著層(5)相對於第一可溶解性模仁(3)分離時;或使該第二黏著層(13)相對於第二可溶解性模仁(11)分離時,皆不會使高分子材料層(18)受拉力影響而晃動、變形、或產生缺陷。As shown in Figures 10A to 10C, the imprinting step (S6) includes: applying a first high temperature to the polymer material layer (18); and applying a pressure to the first soluble mold core (3) , and the second dissolvable mold core (11), so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave and convex structure (4); and a corresponding second transfer structure (9). The second transfer structure (17) of the concave-convex structure (12); and separating the first adhesive tape (7) from the first adhesive layer (5); and separating the second adhesive tape (15) from the second adhesive layer (13) Separate and apply a second high temperature to the polymer material layer (18) to solidify the polymer material layer (18), wherein the first high temperature is different from the second high temperature. Preferably, as shown in Figure 10D, it further includes: a peeling step (S8), which is to remove the first adhesive layer (5) after the imprinting step (S6) and before the dissolving step (S7). Separate from the first dissolvable mold core (3); and separate the second adhesive layer (13) from the second dissolvable mold core (11). Specifically, the first adhesive layer (5) and the second adhesive layer (13) are a thermal dissociation tape. When it is baked at the first high temperature, it will dissociate. Therefore, when the peeling step (S8) ), when the first adhesive layer (5) is separated from the first soluble mold core (3); or the second adhesive layer (13) is separated from the second soluble mold core (11) At this time, the polymer material layer (18) will not be affected by the tensile force and shake, deform, or produce defects.

更佳者,供給第一高溫、與第二高溫之加熱源可為相同或不同,其中加熱源係可對可溶解性模仁加熱;對基材層(29)與可溶解性模仁相對應之區域加熱;或對整體基材層(29)加熱,以使溫度傳導至高分子材料層(18),而使高分子材料層(18)軟化、或固化。More preferably, the heating sources supplying the first high temperature and the second high temperature can be the same or different, wherein the heating source can heat the soluble mold core; the base material layer (29) corresponds to the soluble mold core. regional heating; or heating the entire base material layer (29) to conduct the temperature to the polymer material layer (18) to soften or solidify the polymer material layer (18).

更佳者,如圖10A至10C所示,於壓印步驟(S6)中,第三實施態樣之第一實施例包含:施予該第一高溫與該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9); 於形成該第一轉印結構(9)後,施予該第一高溫與該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17); 於形成該第二轉印結構(17)後,將該第一膠帶(7)與該第一黏著層(5)分離;以及將該第二膠帶(15)與該第二黏著層(13)分離;以及 施予該第二高溫至該第一可溶解性模仁(3)與該第二可溶解性模仁(11);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置、以及該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)固化。Better still, as shown in FIGS. 10A to 10C , in the imprinting step (S6), the first embodiment of the third implementation aspect includes: applying the first high temperature and the pressure to the first soluble mold. Kernel (3), so that the polymer material layer (18) has the first transfer structure (9); after forming the first transfer structure (9), apply the first high temperature and the pressure to the third transfer structure (9). Two dissolvable mold cores (11) allow the polymer material layer (18) to have the second transfer structure (17); after forming the second transfer structure (17), the first tape (7) ) is separated from the first adhesive layer (5); and the second adhesive tape (15) is separated from the second adhesive layer (13); and the second high temperature is applied to the first dissolvable mold core (3) ) and the second dissolvable mold core (11); to the position corresponding to the base material layer (29) and the first dissolvable mold core (3), and between the base material layer (29) and the third The corresponding positions of the two dissolvable mold cores (11); or to the base material layer (29) to solidify the polymer material layer (18).

更佳者,如圖10A至10C所示,於壓印步驟(S6)中,第三實施態樣之第二實施例包含: 施予該第一高溫至該基材層(29); 施予該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9); 於形成完該第一轉印結構(9)後,施予該壓力至將該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17); 將該第一膠帶(7)與該第一黏著層(5)分離;以及將該第二膠帶(15)與該第二黏著層(13)分離;以及 施予該第二高溫至該第一可溶解性模仁(3)與該第二可溶解性模仁(11);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置、以及該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)固化。Better still, as shown in Figures 10A to 10C, in the imprinting step (S6), the second embodiment of the third implementation aspect includes: applying the first high temperature to the base material layer (29); The pressure is applied to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9); after the first transfer structure (9) is formed, apply Apply pressure to the second dissolvable mold core (11) so that the polymer material layer (18) has the second transfer structure (17); adhere the first adhesive tape (7) to the first Separating the layer (5); and separating the second adhesive tape (15) from the second adhesive layer (13); and applying the second high temperature to the first soluble mold core (3) and the second soluble mold core (3). Dissolvable mold core (11); to the position corresponding to the base material layer (29) and the first soluble mold core (3), and to the base material layer (29) and the second soluble mold core (11) The corresponding position; or to the base material layer (29) to solidify the polymer material layer (18).

更佳者,如圖10A至10C所示,於壓印步驟(S6)中,第三實施態樣之第三實施例包含:施予該第一高溫至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;以及該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9); 於形成完該第一轉印結構(9)後,施予該第一高溫至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;以及該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17); 將該第一膠帶(7)與該第一黏著層(5)分離;以及將該第二膠帶(15)與該第二黏著層(13)分離;以及 施予該第二高溫至該第一可溶解性模仁(3)與該第二可溶解性模仁(11);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置、以及該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)固化。Better still, as shown in Figures 10A to 10C, in the imprinting step (S6), the third embodiment of the third implementation aspect includes: applying the first high temperature to the base material layer (29) and the third A position corresponding to a soluble mold core (3); and the pressure is applied to the first soluble mold core (3) so that the polymer material layer (18) has the first transfer structure (9); After the first transfer structure (9) is formed, the first high temperature is applied to the position corresponding to the base material layer (29) and the second dissolvable mold core (11); and the pressure is applied to the position corresponding to the second dissolvable mold core (11); The second dissolvable mold core (11) enables the polymer material layer (18) to have the second transfer structure (17); separating the first adhesive tape (7) from the first adhesive layer (5); and separating the second adhesive tape (15) from the second adhesive layer (13); and applying the second high temperature to the first soluble mold core (3) and the second soluble mold core (11) ); to the position corresponding to the base material layer (29) and the first dissolvable mold core (3), and to the position corresponding to the base material layer (29) and the second dissolvable mold core (11) position; or to the base material layer (29) to solidify the polymer material layer (18).

更佳者,如圖10E至10H所示,於壓印步驟(S6)中,第三實施態樣之第四實施例包含:施予該第一高溫與該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9),並使該第一膠帶(7)與該第一黏著層(5)分離;以及施予該第二高溫至該第一可溶解性模仁(3);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化;以及 施予該第一高溫與該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17),並使該第二膠帶(15)與該第二黏著層(13)分離;以及施予該第二高溫至該第二可溶解性模仁(11);至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化。Better still, as shown in Figures 10E to 10H, in the imprinting step (S6), the fourth embodiment of the third implementation aspect includes: applying the first high temperature and the pressure to the first soluble mold. Kernel (3), causing the polymer material layer (18) to have the first transfer structure (9), and separating the first adhesive tape (7) from the first adhesive layer (5); and applying the first transfer structure (9) to the polymer material layer (18). 2. high temperature to the first soluble mold core (3); to the position of the base material layer (29) corresponding to the first soluble mold core (3); or to the base material layer (29), To solidify the portion of the polymer material layer (18) corresponding to the first soluble mold core (3); and to apply the first high temperature and the pressure to the second soluble mold core (11) , causing the polymer material layer (18) to have the second transfer structure (17), and separating the second adhesive tape (15) from the second adhesive layer (13); and applying the second high temperature to the The second dissolvable mold core (11); to the position corresponding to the base material layer (29) and the second dissolvable mold core (11); or to the base material layer (29), so that the high The portion of the molecular material layer (18) corresponding to the second dissolvable mold core (11) is solidified.

更佳者,如圖10E至10H所示,於壓印步驟(S6)中,第三實施態樣之第五實施例包含:首先:施予該第一高溫至該基材層(29)與該第一可溶解性模仁(3)相對應之部分;以及該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9),並使該第一膠帶(7)與該第一黏著層(5)分離;再來:施予該第二高溫至該第一可溶解性模仁(3);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化;以及 首先:施予該第一高溫至該基材層(29)與該第二可溶解性模仁(11)相對應之部分;以及該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17),並使該第二膠帶(15)與該第二黏著層(13)分離;再來:施予該第二高溫至該第二可溶解性模仁(11);至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化。Better still, as shown in Figures 10E to 10H, in the imprinting step (S6), the fifth embodiment of the third implementation aspect includes: firstly: applying the first high temperature to the base material layer (29) and The corresponding part of the first soluble mold core (3); and the pressure to the first soluble mold core (3), so that the polymer material layer (18) has the first transfer structure (9) ), and separate the first adhesive tape (7) from the first adhesive layer (5); then: apply the second high temperature to the first dissolvable mold core (3); to the base material layer ( 29) The position corresponding to the first dissolvable mold core (3); or to the base material layer (29), so that the polymer material layer (18) and the first dissolvable mold core (3) ) to solidify the corresponding part; and firstly: apply the first high temperature to the part of the base material layer (29) corresponding to the second dissolvable mold core (11); and apply the pressure to the second dissolvable mold core (11) The mold core (11) is used to make the polymer material layer (18) have the second transfer structure (17), and to separate the second adhesive tape (15) from the second adhesive layer (13); and then: Apply the second high temperature to the second soluble mold core (11); to the position of the base material layer (29) corresponding to the second soluble mold core (11); or to the base material layer (29), so that the portion of the polymer material layer (18) corresponding to the second dissolvable mold core (11) is solidified.

更佳者,如圖10E至10H所示,於壓印步驟(S6)中,第三實施態樣之第六實施例包含:施予該第一高溫至該基材層(29); 施予該壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有該第一轉印結構(9),並使該第一膠帶(7)與該第一黏著層(5)分離;以及施予該第二高溫至該第一可溶解性模仁(3);至該基材層(29)與該第一可溶解性模仁(3)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化;以及 施予該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有該第二轉印結構(17),並使該第二膠帶(15)與該第二黏著層(13)分離;以及施予該第二高溫至該第二可溶解性模仁(11);至該基材層(29)與該第二可溶解性模仁(11)相對應之位置;或至該基材層(29),以使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化。Better still, as shown in Figures 10E to 10H, in the imprinting step (S6), the sixth embodiment of the third implementation aspect includes: applying the first high temperature to the base material layer (29); applying The pressure is applied to the first dissolvable mold core (3), so that the polymer material layer (18) has the first transfer structure (9), and the first adhesive tape (7) and the first adhesive layer (5) Separate; and apply the second high temperature to the first soluble mold core (3); to the position corresponding to the base material layer (29) and the first soluble mold core (3); Or to the base material layer (29) to solidify the portion of the polymer material layer (18) corresponding to the first soluble mold core (3); and apply the pressure to the second soluble mold core The mold core (11) makes the polymer material layer (18) have the second transfer structure (17), and separates the second adhesive tape (15) from the second adhesive layer (13); and applies the The second high temperature reaches the second soluble mold core (11); to the position corresponding to the base material layer (29) and the second soluble mold core (11); or to the base material layer (29) , so that the portion of the polymer material layer (18) corresponding to the second dissolvable mold core (11) is solidified.

以下用以說明壓印步驟(S6)之第四實施態樣。The following is a description of the fourth implementation mode of the imprinting step (S6).

如圖11A至11C所示,其中壓印步驟(S6)包含: 施予一壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有一對應該第一凹凸結構(4)的第一轉印結構(9);以及該第二可溶解性模仁(11),使該高分子材料層(18)具有一對應該第二凹凸結構(12)的第二轉印結構(17);以及以一UV光照射該高分子材料層(18),使該高分料層固化,並使該第一支撐背板(8)與該第一膠帶(7)分離;以及使該第二支撐背板(16)與該第二膠帶(15)分離。較佳者,該UV光係由一UV發射源(40)所提供;以及該壓力係由一吹氣元件(39)所提供。As shown in Figures 11A to 11C, the imprinting step (S6) includes: applying a pressure to the first soluble mold core (3) so that the polymer material layer (18) has a corresponding first concave and convex The first transfer structure (9) of the structure (4); and the second soluble mold core (11), so that the polymer material layer (18) has a second pattern corresponding to the second concave and convex structure (12). Transfer structure (17); and irradiate the polymer material layer (18) with a UV light to solidify the polymer material layer and separate the first support back plate (8) from the first adhesive tape (7) ; And separate the second support backing plate (16) from the second adhesive tape (15). Preferably, the UV light is provided by a UV emission source (40); and the pressure is provided by a blowing element (39).

更佳者,如圖11A至11C所示,於壓印步驟(S6)中,第四實施態樣之第一實施例包含:施予一壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有一對應該第一凹凸結構(4)的第一轉印結構(9);施予該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有一對應該第二凹凸結構(12)的第二轉印結構(17);以一UV光照射該高分子材料層(18),使該高分子材料層(18)固化;以及使該第一支撐背板(8)與該第一膠帶(7)分離、和使該第二支撐背板(16)與該第二膠帶(15)分離。Better still, as shown in Figures 11A to 11C, in the imprinting step (S6), the first embodiment of the fourth implementation aspect includes: applying a pressure to the first dissolvable mold core (3), The polymer material layer (18) is provided with a first transfer structure (9) corresponding to the first concave and convex structure (4); the pressure is applied to the second dissolvable mold core (11), so that the high The molecular material layer (18) has a second transfer structure (17) corresponding to the second concave and convex structure (12); the polymer material layer (18) is irradiated with a UV light, so that the polymer material layer (18) Curing; and separating the first supporting backing plate (8) from the first adhesive tape (7), and separating the second supporting backing plate (16) from the second adhesive tape (15).

更佳者,如圖11D至11G所示,於壓印步驟(S6)中,第四實施態樣之第二實施例包含:首先:施予一壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有一對應該第一凹凸結構(4)的第一轉印結構(9);以一UV光照射該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分,以使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化;以及使該第一支撐背板(8)與該第一膠帶(7)分離;以及再來:施予一壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有一對應該第二凹凸結構(12)的第二轉印結構(17);以該UV光照射該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分,以使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化;以及使該第二支撐背板(16)與該第二膠帶(15)分離。Better still, as shown in Figures 11D to 11G, in the imprinting step (S6), the second embodiment of the fourth implementation aspect includes: firstly: applying a pressure to the first dissolvable mold core (3 ), so that the polymer material layer (18) has a first transfer structure (9) corresponding to the first concave and convex structure (4); irradiating the polymer material layer (18) and the first removable structure with a UV light The corresponding part of the dissolvable mold core (3), so that the polymer material layer (18) and the corresponding part of the first dissolvable mold core (3) are solidified; and the first supporting back plate (8 ) is separated from the first adhesive tape (7); and then: applying a pressure to the second dissolvable mold core (11) so that the polymer material layer (18) has a corresponding second concave and convex structure ( The second transfer structure (17) of 12); irradiate the portion of the polymer material layer (18) corresponding to the second dissolvable mold core (11) with the UV light, so that the polymer material layer (18) 18) The part corresponding to the second dissolvable mold core (11) is cured; and the second supporting backing plate (16) is separated from the second adhesive tape (15).

更佳者,如圖11D至11G所示,於壓印步驟(S6)中,第四實施態樣之第三實施例包含:施予一壓力至該第一可溶解性模仁(3),使該高分子材料層(18)具有一對應該第一凹凸結構(4)的第一轉印結構(9);施予該壓力至該第二可溶解性模仁(11),使該高分子材料層(18)具有一對應該第二凹凸結構(12)的第二轉印結構(17);以一UV光照射該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分,使該高分子材料層(18)與該第一可溶解性模仁(3)相對應之部分固化,並使該第一支撐背板(8)與該第一膠帶(7)分離;以及以一UV光照射該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分,使該高分子材料層(18)與該第二可溶解性模仁(11)相對應之部分固化,並使該第二支撐背板(16)與該第二膠帶(15)分離。Better still, as shown in Figures 11D to 11G, in the imprinting step (S6), the third embodiment of the fourth implementation aspect includes: applying a pressure to the first dissolvable mold core (3), The polymer material layer (18) is provided with a first transfer structure (9) corresponding to the first concave and convex structure (4); the pressure is applied to the second dissolvable mold core (11), so that the high The molecular material layer (18) has a second transfer structure (17) corresponding to the second concave and convex structure (12); a UV light is used to irradiate the polymer material layer (18) and the first soluble mold core ( 3) Corresponding parts, solidify the corresponding parts of the polymer material layer (18) and the first dissolvable mold core (3), and make the first support back plate (8) and the first adhesive tape (7) Separation; and irradiating the portion of the polymer material layer (18) corresponding to the second soluble mold core (11) with a UV light, so that the polymer material layer (18) and the second soluble mold core (11) are separated. The corresponding part of the soluble mold core (11) is solidified, and the second supporting backing plate (16) is separated from the second adhesive tape (15).

更佳者,其中可利用一轉印元件(37)施予第一高溫、第二高溫、與壓力至第一可溶解性模仁(3),使高分子材料層(18)具有一對應第一凹凸結構(4)的第一轉印結構(9);或第二可溶解性模仁(11),使高分子材料層(18)具有一對應第二凹凸結構(12)的第二轉印結構(17)。較佳地,該第一高溫能使高分子材料層(18)的溫度先達到其玻璃轉移溫度而壓力能使高分子材料層(18)的材料充分地流動至第一凹凸結構(4)內,之後第二高溫再使高分子材料層(18)的材料固化以讓高分子材料層(18)的第一轉印結構(9)完整地對應第一凹凸結構(4)。較佳地,該第一高溫能使高分子材料層(18)的溫度先達到其玻璃轉移溫度而壓力能使高分子材料層(18)的材料充分地流動至第二凹凸結構(12)內,之後第二高溫再使高分子材料層(18)的材料固化以讓高分子材料層(18)的第二轉印結構(17)完整地對應第二凹凸結構(12)。較佳地,施予第一高溫與壓力的時間為1至20分鐘,但不以此為限。較佳地,第一高溫之溫度為50至160℃,但不以此為限。須說明的是,施予第一高溫與壓力的時間範圍以及第一高溫溫度範圍可依高分子材料層(18)的材料決定;整體上,以高分子材料層(18)頂部不溶解而不使第一轉印結構(9)、或第二轉印結構(17)產生結構缺陷為原則。另外,施予壓力可對第一可溶解性模仁(3)、或第二可溶解性模仁(11)相反於高分子材料層(18)的一側施予正向壓力;或對第一可溶解性模仁(3)、或第二可溶解性模仁(11)鄰近於高分子材料層(18)的一側施予負向壓力;或可同時施予正向壓力與負向壓力。較佳地,正向壓力為+20至+600kPa,負向壓力為-10至-101.3kPa,但不以此為限。須說明的是,透過負向壓力可使高分子材料層(18)中受熱逸散的揮發性溶劑(19)抽離以避免殘留於高分子材料層(18)而造成第一轉印結構(9)、或第二轉印結構(17)產生結構缺陷。更佳者,轉印元件(37)包含一提供高溫的升溫元件(38)以及一提供壓力的吹氣元件(39),但不以此為限。更佳者,當第一膠帶(7)之材料為熱解離性發泡膠的條件下,透過第一膠帶(7)的解離溫度(較佳地為80至150℃)低於第一高溫溫度可使第一膠帶(7)於第一高溫溫度下解離裂解。更佳者,第一膠帶(7)、第二膠帶(15)、第一黏著層(5)、與第二黏著層(13)為相同之熱解離性發泡膠,因此皆會受第一高溫影響而產生解離裂解,而可輕鬆地與黏附物、或被黏附物分離。Even better, a transfer element (37) can be used to apply the first high temperature, the second high temperature, and the pressure to the first soluble mold core (3), so that the polymer material layer (18) has a corresponding first A first transfer structure (9) of a concave-convex structure (4); or a second dissolvable mold core (11), so that the polymer material layer (18) has a second transfer structure (12) corresponding to the second concave-convex structure (12). Print structure (17). Preferably, the first high temperature can make the temperature of the polymer material layer (18) reach its glass transition temperature first, and the pressure can make the material of the polymer material layer (18) fully flow into the first concave-convex structure (4). , and then the second high temperature solidifies the material of the polymer material layer (18) so that the first transfer structure (9) of the polymer material layer (18) completely corresponds to the first concave-convex structure (4). Preferably, the first high temperature can make the temperature of the polymer material layer (18) reach its glass transition temperature first, and the pressure can make the material of the polymer material layer (18) fully flow into the second concave-convex structure (12). , and then the second high temperature solidifies the material of the polymer material layer (18) so that the second transfer structure (17) of the polymer material layer (18) completely corresponds to the second concave-convex structure (12). Preferably, the time for applying the first high temperature and pressure is 1 to 20 minutes, but is not limited thereto. Preferably, the temperature of the first high temperature is 50 to 160°C, but is not limited thereto. It should be noted that the time range for applying the first high temperature and pressure and the first high temperature temperature range can be determined according to the material of the polymer material layer (18); overall, the top of the polymer material layer (18) does not dissolve and does not dissolve. The principle is to cause structural defects in the first transfer structure (9) or the second transfer structure (17). In addition, applying pressure can apply positive pressure to the side of the first soluble mold core (3) or the second soluble mold core (11) opposite to the polymer material layer (18); Negative pressure is applied to the side of one soluble mold core (3) or the second soluble mold core (11) adjacent to the polymer material layer (18); or positive pressure and negative pressure can be applied at the same time. pressure. Preferably, the positive pressure is +20 to +600kPa, and the negative pressure is -10 to -101.3kPa, but is not limited to this. It should be noted that the volatile solvent (19) that escapes due to heat in the polymer material layer (18) can be extracted through negative pressure to avoid remaining in the polymer material layer (18) and causing the first transfer structure ( 9), or the second transfer structure (17) produces structural defects. More preferably, the transfer element (37) includes a heating element (38) that provides high temperature and a blowing element (39) that provides pressure, but is not limited to this. Even better, when the material of the first tape (7) is thermally dissociable foam rubber, the dissociation temperature through the first tape (7) (preferably 80 to 150°C) is lower than the first high temperature temperature The first adhesive tape (7) can be dissociated and cracked at the first high temperature. Even better, the first tape (7), the second tape (15), the first adhesive layer (5), and the second adhesive layer (13) are the same thermally dissociable foam glue, so they will all be affected by the first adhesive layer. It will dissociate and crack under the influence of high temperature, and can be easily separated from adherents or adherends.

更佳者,可利用轉印元件(37)施予第二高溫至第一可溶解性模仁(3)、或該第二可溶解性模仁(11),其中:第二高溫大於第一高溫,以使高分子材料層(18)固化。具體而言,第二高溫能使高分子材料層(18)的溫度達到其固化溫度進而使其材料交聯固化。如此一來,可降低高分子材料層(18)的彈性以讓高分子材料層(18)的第一轉印結構(9)完整地對應第一凹凸結構(4);或第二轉印結構(17)完整地對應第二凹凸結構(12)。較佳地,第二高溫溫度為120至180℃,但不以此為限。此步驟特別於高分子材料層(18)的材料為熱固性樹脂(如:環氧樹脂(epoxy resin))下進行。詳言之,此步驟可確保置於低於第二高溫的溫度環境下時高分子材料層(18)不會變形。更佳者,第二高溫可由轉印元件(37)的升溫元件(38)提供。Better yet, the transfer element (37) can be used to apply a second high temperature to the first soluble mold core (3) or the second soluble mold core (11), wherein: the second high temperature is greater than the first High temperature to solidify the polymer material layer (18). Specifically, the second high temperature can make the temperature of the polymer material layer (18) reach its curing temperature and thereby cross-link and solidify its material. In this way, the elasticity of the polymer material layer (18) can be reduced so that the first transfer structure (9) of the polymer material layer (18) can completely correspond to the first concave-convex structure (4); or the second transfer structure (17) completely corresponds to the second concave and convex structure (12). Preferably, the second high temperature is 120 to 180°C, but is not limited thereto. This step is especially performed when the material of the polymer material layer (18) is thermosetting resin (such as epoxy resin). Specifically, this step ensures that the polymer material layer (18) will not deform when placed in a temperature environment lower than the second high temperature. Better still, the second high temperature can be provided by the heating element (38) of the transfer element (37).

以下圖12用以說明本發明之剝離步驟(S8):「將該第一黏著層(5)與該第一可溶解性模仁(3)分離;以及將該第二黏著層(13)與該第二可溶解性模仁(11)分離。」,具體而言,本步驟係於該壓印步驟(S6)後、以及該溶解步驟(S7)前進行。較佳者,於本步驟中,該第一黏著層(5)、與該第二黏著層(13)係為熱解離膠帶,當其受第一高溫烘烤時,會使該第一黏著層(5)解離,而可輕易地自第一可溶解性模仁(3)之表面剝離;以及使該第二黏著層(13)解離,而可輕易地自該第二可溶解性模仁(11)之表面剝離。Figure 12 below is used to illustrate the peeling step (S8) of the present invention: "Separate the first adhesive layer (5) from the first dissolvable mold core (3); and separate the second adhesive layer (13) from The second dissolvable mold core (11) is separated." Specifically, this step is performed after the imprinting step (S6) and before the dissolving step (S7). Preferably, in this step, the first adhesive layer (5) and the second adhesive layer (13) are thermal dissociation tapes. When they are baked at the first high temperature, the first adhesive layer will (5) Dissociate so that it can be easily peeled off from the surface of the first dissolvable mold core (3); and dissociate the second adhesive layer (13) so that it can be easily peeled off from the surface of the second dissolvable mold core (3). 11) Surface peeling.

以下圖13A至13C用以說明本發明之溶解步驟(S7):「以一溶劑(19)溶解該第一可溶解性模仁(3)、與該第二可從解性模仁,以取得一具第一轉印結構(9)、與第二轉印結構(17)的轉印物件(20)。」The following Figures 13A to 13C are used to illustrate the dissolving step (S7) of the present invention: "Dissolve the first dissolvable mold core (3) and the second dissolvable mold core with a solvent (19) to obtain a mold core. The first transfer structure (9) and the transfer object (20) of the second transfer structure (17)."

如圖13A至13C所示,可利用一溶解元件提供一溶劑(19)溶解該第一可溶解性模仁(3)與該第二可溶解性模仁(11),使該固化後之高分子材料層(18)與該第一支撐背板(8)、以及該第二支撐背板(16)分離,以取得一具有第一轉印結構(9)、以及第二轉印結構(17)的轉印物件(20)。較佳者,可利用一溶解元件提供一溶劑(19)溶解該第一可溶解性模仁(3)與該第二可溶解性模仁(11),使該固化後之高分子材料層(18)與該第一黏著層(5)、以及該第二黏著層(13)分離,以取得一具有第一轉印結構(9)、以及第二轉印結構(17)的轉印物件(20)。As shown in Figures 13A to 13C, a dissolving element can be used to provide a solvent (19) to dissolve the first soluble mold core (3) and the second soluble mold core (11), so that the cured high The molecular material layer (18) is separated from the first supporting back plate (8) and the second supporting back plate (16) to obtain a first transfer structure (9) and a second transfer structure (17). ) of the transfer object (20). Preferably, a dissolving element can be used to provide a solvent (19) to dissolve the first soluble mold core (3) and the second soluble mold core (11), so that the cured polymer material layer ( 18) Separate from the first adhesive layer (5) and the second adhesive layer (13) to obtain a transfer object (17) with a first transfer structure (9) and a second transfer structure (17) 20).

須說明的是,所使用之溶劑(19)種類可依該第一可溶解性模仁(3)、與該第二可溶解性模仁(11)的材料而定。較佳地,於該第一可溶解性模仁(3)、與該第二可溶解性模仁(11)之材料為水溶性聚丙烯醯胺(Polyacrylamide ;PAM)、聚氨酯、聚脲、聚醯胺、聚酯、聚胺甲酸酯、聚乙烯基吡咯烷酮、乙烯-乙烯醇、聚丙烯醯胺-乙二醛聚合物、或聚丙烯酸之情況下,所使用之該溶劑(19)為水,但不以此為限。It should be noted that the type of solvent (19) used may depend on the materials of the first soluble mold core (3) and the second soluble mold core (11). Preferably, the materials of the first soluble mold core (3) and the second soluble mold core (11) are water-soluble polyacrylamide (PAM), polyurethane, polyurea, polyurethane, etc. In the case of amide, polyester, polyurethane, polyvinylpyrrolidone, ethylene-vinyl alcohol, polyacrylamide-glyoxal polymer, or polyacrylic acid, the solvent (19) used is water. , but not limited to this.

更佳者,可於機台平台(30)上以該溶劑(19)溶解該第一可溶解性模仁(3)、與該第二可溶解性模仁(11)。較佳地,可於該溶解步驟(S7)前,將該第一架體結構(6)相對於該第一支撐背板(8)分離;以及將該第二架體結構(14)相對於該第二支撐背板(16)分離。較佳地,可於該溶解步驟(S7)前,將該第一膠帶(7)相對於該第一支撐背板(8)分離;以及將該第二膠帶(15)相對於該第二支撐背板(16)分離。較佳地,可於該溶解步驟(S7)前,將該第一支撐背板(8)相對於該第一黏著層(5)分離;以及將該第二支撐背板(16)相對於該第二黏著層(13)分離。較佳地,可於該溶解步驟(S7)前,將該第一膠帶(7)相對於該第一黏著層(5)分離;以及將該第二膠帶(15)相對於該第二黏著層(13)分離。較佳地,以該溶劑(19)溶解該第一可溶解性模仁(3)、與該第二可溶解性模仁(11)時,可於機台平台(30)進行,但亦可於機台平台(30)以外的區域進行。具體而言,可將基材層(29)以及設置於該基材層(29)上之固化後之高分子材料層(18)、第一可溶解性模仁(3)、第二可溶解性模仁(11)、第一支撐背板(8)、與第二支撐背板(16)一同放入一盛裝有溶劑(19)之容器中,以溶劑溶解該第一可溶解性模仁(3)、與該第二可溶解性模仁(11),使固化後之高分子材料層(18)與第一支撐背板(8)、與第二支撐背板(16)分離,以取得一具該第一轉印結構(9)、與第二轉印結構(17)的轉印物件(20)。Better yet, the solvent (19) can be used to dissolve the first soluble mold core (3) and the second soluble mold core (11) on the machine platform (30). Preferably, before the dissolving step (S7), the first frame structure (6) can be separated relative to the first supporting back plate (8); and the second frame structure (14) can be separated relative to The second supporting back plate (16) is separated. Preferably, before the dissolving step (S7), the first tape (7) can be separated relative to the first support backing plate (8); and the second tape (15) can be separated relative to the second support. The back plate (16) separates. Preferably, before the dissolving step (S7), the first supporting backing plate (8) can be separated from the first adhesive layer (5); and the second supporting backing plate (16) can be separated from the first adhesive layer (5); The second adhesive layer (13) separates. Preferably, before the dissolving step (S7), the first adhesive tape (7) can be separated from the first adhesive layer (5); and the second adhesive tape (15) can be separated from the second adhesive layer (13)Separation. Preferably, when dissolving the first soluble mold core (3) and the second soluble mold core (11) with the solvent (19), it can be done on the machine platform (30), but it can also be done Carry out in the area outside the machine platform (30). Specifically, the base material layer (29) and the cured polymer material layer (18) disposed on the base material layer (29), the first soluble mold core (3), and the second soluble mold core can be The mold core (11), the first supporting back plate (8), and the second supporting back plate (16) are put into a container containing a solvent (19), and the first soluble mold core is dissolved with the solvent. (3) Separate the cured polymer material layer (18) from the first supporting back plate (8) and the second supporting back plate (16) with the second dissolvable mold core (11), so as to Obtain a transfer object (20) having the first transfer structure (9) and the second transfer structure (17).

更佳者,如圖14A至14D所示,為本發明一系列之壓印流程,具體而言,係以接續之方式連續將可溶解性模仁壓入高分子材料層(18)中,直到高分子材料層(18)上可用之空間被壓印完畢為止。其中可以理解地,可溶解性模仁可依照數字進行編排,並依照數字之大小來決定壓印之順序,但不以此為限。較佳者,當把高分子材料層(18)上之可用空間壓印完畢後,再進行溶解步驟(S7)即可獲得大規模之轉印物件(20)。More preferably, as shown in Figures 14A to 14D, it is a series of imprinting processes of the present invention. Specifically, the soluble mold core is pressed into the polymer material layer (18) in a continuous manner until Until the available space on the polymer material layer (18) is imprinted. It is understandable that the dissolvable mold cores can be arranged according to numbers, and the order of imprinting is determined according to the size of the numbers, but it is not limited to this. Preferably, after the available space on the polymer material layer (18) is imprinted, the dissolving step (S7) is performed to obtain a large-scale transfer object (20).

更佳者, 綜上所述,本發明可精準、穩定、持續地以模仁對高分子材料進行壓印,以高效取得大規模範圍之轉印物件(20),並且,最終所獲得之轉印物件(20)同時兼具高良率與高品質,於實際應用面上可實現較高之穩定性、耐久性、與安全性。具體而言,於本發明中:第一支撐背板(8)係藉由第一黏著層(5)與第一可溶解性模仁(3)黏接,因此,於第一可溶解性模仁(3)與第一樣模(2)分離時;第一可溶解性模仁(3)與高分子材料層(18)接觸或對位時;施予第一高溫或壓力於第一可溶解性模仁(3)時;使第一架體結構(6)相對於第一支撐背板(8)分離時;第一架體結構(6)以及設置於第一架體結構(6)之第一膠帶(7)相對於第一支撐背板(8)分離時;以及溶解第一可溶解性模仁(3)時,第一支撐背板(8)皆可維持第一可溶解性模仁(3)之結構,使第一可溶解性模仁(3)不產生偏移或形變,因此可使最終壓印出的轉印物件(20)不產生缺陷。此外,由於在進行溶解步驟(S7)前,第二支撐背板(16)係藉由第二黏著層(13)與第二可溶解性模仁(11)黏接,因此,於第二可溶解性模仁(11)與第二樣模(10)分離時;第二可溶解性模仁(11)與高分子材料層(18)接觸或對位時;施予第一高溫或壓力於第二可溶解性模仁(11)時;使第二架體結構(14)相對於第二支撐背板(16)分離時;第二架體結構(14)以及設置於第二架體結構(14)之第二膠帶(15)相對於第二支撐背板(16)分離時;以及溶解第二可溶解性模仁(11)時,第二支撐背板(16)皆可維持第二可溶解性模仁(11)之結構,使第二可溶解性模仁(11)不產生偏移或形變,因此可使最終壓印出的轉印物件(20)不產生缺陷。Even better, to sum up, the present invention can accurately, stably and continuously imprint polymer materials with mold cores to efficiently obtain large-scale transfer objects (20), and the final obtained transfer objects The printed object (20) has both high yield and high quality, and can achieve higher stability, durability, and safety in practical applications. Specifically, in the present invention: the first supporting back plate (8) is bonded to the first dissolvable mold core (3) through the first adhesive layer (5). Therefore, in the first dissolvable mold When the core (3) is separated from the first mold (2); when the first soluble mold core (3) is in contact or aligned with the polymer material layer (18); when the first high temperature or pressure is applied to the first soluble mold core (3). When dissolving the mold core (3); when the first frame structure (6) is separated from the first supporting back plate (8); the first frame structure (6) and the first frame structure (6) When the first tape (7) is separated from the first supporting backing plate (8); and when the first dissolvable mold core (3) is dissolved, the first supporting backing plate (8) can maintain the first solubility. The structure of the mold core (3) prevents the first dissolvable mold core (3) from deflecting or deforming, so that the final embossed transfer object (20) does not have defects. In addition, since the second supporting back plate (16) is bonded to the second dissolvable mold core (11) through the second adhesive layer (13) before the dissolving step (S7), When the soluble mold core (11) is separated from the second sample mold (10); when the second soluble mold core (11) is in contact or aligned with the polymer material layer (18); applying first high temperature or pressure to When the second dissolvable mold core (11) is used; when the second frame structure (14) is separated from the second supporting back plate (16); the second frame structure (14) and is provided on the second frame structure When the second tape (15) of (14) is separated from the second supporting backing plate (16); and when the second dissolvable mold core (11) is dissolved, the second supporting backing plate (16) can maintain the second The structure of the dissolvable mold core (11) prevents the second dissolvable mold core (11) from deflecting or deforming, so that the final embossed transfer object (20) does not have defects.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。另外本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本發明之權利範圍。另外,說明書中提及的第一、第二等用語,僅用以表示元件的名稱,並非用來限制組件數量上的上限或下限。However, the above are only preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. That is, simple equivalent changes and modifications may be made based on the patent scope of the present invention and the description of the invention. All are still within the scope of the patent of this invention. In addition, any embodiment or patentable scope of the present invention does not need to achieve all the purposes, advantages or features disclosed in the present invention. In addition, the abstract section and title are only used to assist in searching patent documents and are not intended to limit the scope of the invention. In addition, terms such as first and second mentioned in the specification are only used to indicate the names of components and are not used to limit the upper or lower limit on the number of components.

S1:添加步驟 S2:形成步驟 S3:取模步驟 S4:分離步驟 S5:接觸步驟 S6:壓印步驟 S7:溶解步驟 S8:剝離步驟 1:可溶解性材料 2:第一樣模 201:第一樣模結構 202:第一記號結構 3:第一可溶解性模仁 4:第一凹凸結構 5:第一黏著層 6:第一架體結構 7:第一膠帶 8:第一支撐背板 9:第一轉印結構 10:第二樣模 1001:第二樣模結構 1002:第二記號結構 11:第二可溶解性模仁 12:第二凹凸結構 13:第二黏著層 14:第二架體結構 15:第二膠帶 16:第二支撐背板 17:第二轉印結構 18:高分子材料層 19:溶劑 20:轉印物件 21:第一對位記號 22:第二對位記號 23:第三對位記號 24:第四對位記號 25:第五對位記號 26:第六對位記號 27:第七對位記號 28:待轉印物件 29:基材層 30:機台平台 31:第一攝像元件 32:第一紅外線發射元件 33:第二攝像元件 34:第二紅外線發射元件 35:位置調整元件 36:穿孔 37:轉印元件 38:升溫元件 39:吹氣元件 40:UV發射源 100:第一取模裝置 200:第二取模裝置 S1: Add steps S2: Formation steps S3: Mold taking step S4: Separation step S5: Contact step S6: Imprinting step S7: Dissolution step S8: Peeling step 1:Soluble materials 2: The first sample 201: First sample structure 202: First token structure 3: The first soluble mold core 4: First concave and convex structure 5: First adhesive layer 6: The first frame structure 7:First tape 8: First support back plate 9: First transfer structure 10: The second model 1001: Second sample structure 1002: Second token structure 11: Second soluble mold core 12: Second concave and convex structure 13:Second adhesive layer 14:Second frame structure 15:Second tape 16: Second support back plate 17: Second transfer structure 18:Polymer material layer 19:Solvent 20: Transfer object 21: First counterpoint mark 22: Second counterpoint mark 23: The third counterpoint mark 24: The fourth counterpoint mark 25: Fifth counterpoint mark 26: The sixth counterpoint mark 27:Seventh counterpoint mark 28:Object to be transferred 29:Substrate layer 30:Machine platform 31: First camera element 32: The first infrared emitting element 33: Second camera element 34: The second infrared emitting element 35: Position adjustment component 36:Perforation 37: Transfer element 38:Heating element 39: Blowing element 40:UV emission source 100: The first impression device 200: Second impression device

圖1A至1B用為一系列之方塊圖,用以說明本發明之壓印流程; 圖2A至2B用以說明本發明之添加步驟; 圖3A用以說明本發明之形成步驟; 圖4A至4D用以說明本發明之取模步驟; 圖5A至5B用以說明本發明之分離步驟; 圖6A至6D用以說明本發明之接觸步驟; 圖7A至7G用以說明本發明之對位步驟; 圖8A至8G用以說明本發明壓印步驟之第一實施態樣; 圖9A至9G用以說明本發明壓印步驟之第二實施態樣; 圖10A至10H用以說明本發明壓印步驟之第三實施態樣; 圖11A至11G用以說明本發明壓印步驟之第四實施態樣; 圖12用以說明本發明之剝離步驟; 圖13A至13C用以說明本發明之溶解步驟; 圖14A至14D用以說明本發明之壓印方式。 Figures 1A to 1B are a series of block diagrams to illustrate the imprinting process of the present invention; Figures 2A to 2B are used to illustrate the adding steps of the present invention; Figure 3A is used to illustrate the formation steps of the present invention; Figures 4A to 4D are used to illustrate the mold taking steps of the present invention; Figures 5A to 5B are used to illustrate the separation steps of the present invention; Figures 6A to 6D are used to illustrate the contacting steps of the present invention; Figures 7A to 7G are used to illustrate the alignment steps of the present invention; Figures 8A to 8G are used to illustrate the first implementation of the imprinting step of the present invention; Figures 9A to 9G are used to illustrate the second embodiment of the imprinting step of the present invention; Figures 10A to 10H are used to illustrate the third implementation of the imprinting step of the present invention; Figures 11A to 11G are used to illustrate the fourth implementation aspect of the imprinting step of the present invention; Figure 12 is used to illustrate the peeling step of the present invention; Figures 13A to 13C are used to illustrate the dissolution step of the present invention; Figures 14A to 14D are used to illustrate the imprinting method of the present invention.

S1:添加步驟 S1: Add steps

S2:形成步驟 S2: Formation steps

S3:取模步驟 S3: Mold taking step

S4:分離步驟 S4: Separation step

S5:接觸步驟 S5: Contact step

S6:壓印步驟 S6: Imprinting step

S7:溶解步驟 S7: Dissolution step

Claims (10)

一種大規模壓印之方法,係包括: 一添加步驟,係添加一可溶解性材料於一第一樣模以及一第二樣模內,並固化該可溶解性材料,以於該第一樣模中形成一第一可溶解性模仁,其中該第一可溶解性模仁具有一第一凹凸結構;以及於該第二樣模中形成一第二可溶解性模仁,其中該第二可溶解性模仁具有一第二凹凸結構; 一形成步驟,於該第一可溶解性模仁相對於該第一樣模之一側形成一第一黏著層;以及於該第二可溶解性模仁相對於該第二樣模之一側形成一第二黏著層; 一取模步驟,係包含: 附著一第一取模裝置於該第一黏著層相對於該第一樣模之一側,其中該第一取模裝置包含:一第一架體結構;一第一膠帶,其係設置於該第一架體結構;以及一第一支撐背板,其係設置於該第一膠帶,其中該第一取模裝置係以該第一支撐背板與該第一黏著層接觸;以及 附著一第二取模裝置於該第二黏著層相對於該第二樣模之一側,其中該第二取模裝置包含:一第二架體結構;一第二膠帶,其係設置於該第二架體結構;以及一第二支撐背板,其係設置於該第二膠帶,其中該第二取模裝置係以該第二支撐背板與該第二黏著層接觸; 一分離步驟,係包含: 將該第一取模裝置相對於該第一樣模分離,其中該第一可溶解性模仁係隨著該第一取模裝置相對於該第一樣模分離;以及 將該第二取模裝置相對於該第二樣模分離,其中該第二可溶解性模仁係隨著該第二取模裝置相對於該第二樣模分離; 一接觸步驟,係包含:將該第一可溶解性模仁與該第二可溶解性模仁相互間隔地與一高分子材料層接觸; 一壓印步驟,係包含: 施予一第一高溫至該高分子材料層;以及施予一壓力至該第一可溶解性模仁、與該第二可溶解性模仁,使該高分子材料層具有一對應該第一凹凸結構的第一轉印結構;以及一對應該第二凹凸結構的第二轉印結構;以及 將該第一支撐背板與該第一膠帶分離;以及將該第二支撐背板與該第二膠帶分離,並施予一第二高溫至該高分子材料層,使該高分子材料層固化,其中該第一高溫與該第二高溫不同;以及 一溶解步驟,係提供一溶劑溶解該第一可溶解性模仁、與該第二可溶解性模仁,使該固化後之高分子材料層與該第一支撐背板分離、以及該第二支撐背板分離,以取得一轉印物件。 A method of large-scale imprinting includes: An adding step is to add a soluble material in a first mold and a second mold, and solidify the soluble material to form a first soluble mold core in the first mold , wherein the first dissolvable mold core has a first concave-convex structure; and forming a second dissolvable mold core in the second mold, wherein the second dissolvable mold core has a second concave-convex structure ; a forming step of forming a first adhesive layer on a side of the first dissolvable mold core relative to the first sample mold; and forming a first adhesive layer on a side of the second dissolvable mold core relative to the second sample mold Form a second adhesive layer; A mold-taking step includes: A first mold-taking device is attached to one side of the first adhesive layer relative to the first sample, wherein the first mold-taking device includes: a first frame structure; a first tape disposed on the a first frame structure; and a first support back plate, which is provided on the first tape, wherein the first mold taking device is in contact with the first adhesive layer with the first support back plate; and A second mold-taking device is attached to one side of the second adhesive layer relative to the second sample, wherein the second mold-taking device includes: a second frame structure; a second tape disposed on the a second frame structure; and a second supporting back plate, which is provided on the second adhesive tape, wherein the second mold taking device is in contact with the second adhesive layer with the second supporting back plate; A separation step includes: Separating the first impression device relative to the first prototype, wherein the first dissolvable mold core is separated with the first impression device relative to the first prototype; and Separate the second mold-taking device relative to the second mold, wherein the second dissolvable mold core is separated with the second mold-taking device relative to the second mold; A contacting step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; One imprinting step includes: Applying a first high temperature to the polymer material layer; and applying a pressure to the first soluble mold core and the second soluble mold core, so that the polymer material layer has a shape corresponding to the first a first transfer structure of the concave-convex structure; and a second transfer structure corresponding to the second concave-convex structure; and Separating the first supporting back plate from the first adhesive tape; and separating the second supporting back plate from the second adhesive tape, and applying a second high temperature to the polymer material layer to solidify the polymer material layer , wherein the first high temperature is different from the second high temperature; and A dissolving step is to provide a solvent to dissolve the first soluble mold core and the second soluble mold core, so that the cured polymer material layer is separated from the first supporting back plate, and the second soluble mold core is separated from the first supporting back plate. The supporting back plate is separated to obtain a transfer object. 一種大規模壓印之方法,係包括: 一添加步驟,係添加一可溶解性材料於一第一樣模以及一第二樣模內,並固化該可溶解性材料,以於該第一樣模中形成一第一可溶解性模仁,其中該第一可溶解性模仁具有一第一凹凸結構;以及於該第二樣模中形成一第二可溶解性模仁,其中該第二可溶解性模仁具有一第二凹凸結構; 一形成步驟,於該第一可溶解性模仁相對於該第一樣模之一側形成一第一黏著層;以及於該第二可溶解性模仁相對於該第二樣模之一側形成一第二黏著層; 一取模步驟,係包含: 附著一第一取模裝置於該第一黏著層相對於該第一樣模之一側,其中該第一取模裝置包含:一第一架體結構;一第一膠帶,其係設置於該第一架體結構;以及一第一支撐背板,其係設置於該第一膠帶,其中該第一取模裝置係以該第一支撐背板與該第一黏著層接觸;以及 附著一第二取模裝置於該第二黏著層相對於該第二樣模之一側,其中該第二取模裝置包含:一第二架體結構;一第二膠帶,其係設置於該第二架體結構;以及一第二支撐背板,其係設置於該第二膠帶,其中該第二取模裝置係以該第二支撐背板與該第二黏著層接觸; 一分離步驟,係包含: 將該第一取模裝置相對於該第一樣模分離,其中該第一可溶解性模仁係隨著該第一取模裝置相對於該第一樣模分離;以及 將該第二取模裝置相對於該第二樣模分離,其中該第二可溶解性模仁係隨著該第二取模裝置相對於該第二樣模分離; 一接觸步驟,係包含:將該第一可溶解性模仁與該第二可溶解性模仁相互間隔地與一高分子材料層接觸; 一壓印步驟,係包含: 施予一第一高溫至該高分子材料層;以及施予一壓力至該第一可溶解性模仁、與該第二可溶解性模仁,使該高分子材料層具有一對應該第一凹凸結構的第一轉印結構;以及一對應該第二凹凸結構的第二轉印結構;以及 將該第一支撐背板與該第一黏著層分離;以及將該第二支撐背板與該第二黏著層分離,並施予一第二高溫至該高分子材料層,使該高分子材料層固化,其中該第一高溫與該第二高溫不同;以及 一溶解步驟,係提供一溶劑溶解該第一可溶解性模仁、與該第二可溶解性模仁,使該固化後之高分子材料層與該第一黏著層、以及該第二黏著層分離,以取得一轉印物件。 A method of large-scale imprinting includes: An adding step is to add a soluble material in a first mold and a second mold, and solidify the soluble material to form a first soluble mold core in the first mold , wherein the first dissolvable mold core has a first concave-convex structure; and forming a second dissolvable mold core in the second mold, wherein the second dissolvable mold core has a second concave-convex structure ; a forming step of forming a first adhesive layer on a side of the first dissolvable mold core relative to the first sample mold; and forming a first adhesive layer on a side of the second dissolvable mold core relative to the second sample mold Form a second adhesive layer; A mold-taking step includes: A first mold-taking device is attached to one side of the first adhesive layer relative to the first sample, wherein the first mold-taking device includes: a first frame structure; a first tape disposed on the a first frame structure; and a first support back plate, which is provided on the first tape, wherein the first mold taking device is in contact with the first adhesive layer with the first support back plate; and A second mold-taking device is attached to one side of the second adhesive layer relative to the second sample, wherein the second mold-taking device includes: a second frame structure; a second tape disposed on the a second frame structure; and a second supporting back plate, which is provided on the second adhesive tape, wherein the second mold taking device is in contact with the second adhesive layer with the second supporting back plate; A separation step includes: Separating the first impression device relative to the first prototype, wherein the first dissolvable mold core is separated with the first impression device relative to the first prototype; and Separate the second mold-taking device relative to the second mold, wherein the second dissolvable mold core is separated with the second mold-taking device relative to the second mold; A contacting step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; One imprinting step includes: Applying a first high temperature to the polymer material layer; and applying a pressure to the first soluble mold core and the second soluble mold core, so that the polymer material layer has a shape corresponding to the first a first transfer structure of the concave-convex structure; and a second transfer structure corresponding to the second concave-convex structure; and Separating the first supporting back plate from the first adhesive layer; and separating the second supporting back plate from the second adhesive layer, and applying a second high temperature to the polymer material layer to cause the polymer material to The layer is cured, wherein the first high temperature is different from the second high temperature; and A dissolving step is to provide a solvent to dissolve the first soluble mold core and the second soluble mold core, so that the cured polymer material layer and the first adhesive layer and the second adhesive layer Separate to obtain a transfer object. 一種大規模壓印之方法,係包括: 一添加步驟,係添加一可溶解性材料於一第一樣模以及一第二樣模內,並固化該可溶解性材料,以於該第一樣模中形成一第一可溶解性模仁,其中該第一可溶解性模仁具有一第一凹凸結構;以及於該第二樣模中形成一第二可溶解性模仁,其中該第二可溶解性模仁具有一第二凹凸結構; 一形成步驟,於該第一可溶解性模仁相對於該第一樣模之一側形成一第一黏著層;以及於該第二可溶解性模仁相對於該第二樣模之一側形成一第二黏著層; 一取模步驟,係包含: 附著一第一取模裝置於該第一黏著層相對於該第一樣模之一側,其中該第一取模裝置包含:一第一架體結構;一第一膠帶,其係設置於該第一架體結構;以及一第一支撐背板,其係設置於該第一膠帶,其中該第一取模裝置係以該第一膠帶相對於該第一支撐背板之一側與該第一黏著層接觸;以及 附著一第二取模裝置於該第二黏著層相對於該第二樣模之一側,其中該第二取模裝置包含:一第二架體結構;一第二膠帶,其係設置於該第二架體結構;以及一第二支撐背板,其係設置於該第二膠帶,其中該第二取模裝置係以該第二膠帶相對於該第二支撐背板之一側與該第二黏著層接觸; 一分離步驟,係包含: 將該第一取模裝置相對於該第一樣模分離,其中該第一可溶解性模仁係隨著該第一取模裝置相對於該第一樣模分離;以及 將該第二取模裝置相對於該第二樣模分離,其中該第二可溶解性模仁係隨著該第二取模裝置相對於該第二樣模分離; 一接觸步驟,係包含:將該第一可溶解性模仁與該第二可溶解性模仁相互間隔地與一高分子材料層接觸; 一壓印步驟,係包含: 施予一第一高溫至該高分子材料層;以及施予一壓力至該第一可溶解性模仁、與該第二可溶解性模仁,使該高分子材料層具有一對應該第一凹凸結構的第一轉印結構;以及一對應該第二凹凸結構的第二轉印結構;以及 將該第一膠帶與該第一黏著層分離;以及將該第二膠帶與該第二黏著層分離,並施予一第二高溫至該高分子材料層,使該高分子材料層固化,其中該第一高溫與該第二高溫不同;以及 一溶解步驟,係提供一溶劑溶解該第一可溶解性模仁、與該第二可溶解性模仁,使該固化後之高分子材料層與該第一黏著層、以及該第二黏著層分離,以取得一轉印物件。 A method of large-scale imprinting includes: An adding step is to add a soluble material in a first mold and a second mold, and solidify the soluble material to form a first soluble mold core in the first mold , wherein the first dissolvable mold core has a first concave-convex structure; and forming a second dissolvable mold core in the second mold, wherein the second dissolvable mold core has a second concave-convex structure ; a forming step of forming a first adhesive layer on a side of the first dissolvable mold core relative to the first sample mold; and forming a first adhesive layer on a side of the second dissolvable mold core relative to the second sample mold Form a second adhesive layer; A mold-taking step includes: A first mold-taking device is attached to one side of the first adhesive layer relative to the first sample, wherein the first mold-taking device includes: a first frame structure; a first tape disposed on the a first frame structure; and a first supporting back plate, which is provided on the first adhesive tape, wherein the first mold taking device is arranged so that one side of the first adhesive tape relative to the first supporting back plate is in contact with the third an adhesive layer in contact; and A second mold-taking device is attached to one side of the second adhesive layer relative to the second sample, wherein the second mold-taking device includes: a second frame structure; a second tape disposed on the a second frame structure; and a second support back plate, which is provided on the second adhesive tape, wherein the second mold taking device is arranged with one side of the second adhesive tape relative to the second support back plate and the third The two adhesive layers are in contact; A separation step includes: Separating the first impression device relative to the first prototype, wherein the first dissolvable mold core is separated with the first impression device relative to the first prototype; and Separate the second mold-taking device relative to the second mold, wherein the second dissolvable mold core is separated with the second mold-taking device relative to the second mold; A contacting step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; One imprinting step includes: Applying a first high temperature to the polymer material layer; and applying a pressure to the first soluble mold core and the second soluble mold core, so that the polymer material layer has a shape corresponding to the first a first transfer structure of the concave-convex structure; and a second transfer structure corresponding to the second concave-convex structure; and Separating the first adhesive tape from the first adhesive layer; and separating the second adhesive tape from the second adhesive layer, and applying a second high temperature to the polymer material layer to solidify the polymer material layer, wherein The first high temperature is different from the second high temperature; and A dissolving step is to provide a solvent to dissolve the first soluble mold core and the second soluble mold core, so that the cured polymer material layer and the first adhesive layer and the second adhesive layer Separate to obtain a transfer object. 如請求項3所述之方法,其中更包含:一剝離步驟,係於該壓印步驟後、與該溶解步驟前,將該第一黏著層自該第一可溶解性模仁之表層剝離;以及將該第二黏著層自該第二可溶解性模仁之表層剝離。The method of claim 3, further comprising: a peeling step, which is to peel the first adhesive layer from the surface layer of the first dissolvable mold core after the imprinting step and before the dissolving step; and The second adhesive layer is peeled off from the surface layer of the second dissolvable mold core. 一種大規模壓印之方法,係包括: 一添加步驟,係添加一可溶解性材料於一第一樣模以及一第二樣模內,並固化該可溶解性材料,以於該第一樣模中形成一第一可溶解性模仁,其中該第一可溶解性模仁具有一第一凹凸結構;以及於該第二樣模中形成一第二可溶解性模仁,其中該第二可溶解性模仁具有一第二凹凸結構; 一形成步驟,於該第一可溶解性模仁相對於該第一樣模之一側形成一第一黏著層;以及於該第二可溶解性模仁相對於該第二樣模之一側形成一第二黏著層; 一取模步驟,係包含: 附著一第一取模裝置於該第一黏著層相對於該第一樣模之一側,其中該第一取模裝置包含:一第一架體結構;一第一膠帶,其係設置於該第一架體結構;以及一第一支撐背板,其係設置於該第一膠帶,其中該第一取模裝置係以該第一支撐背板與該第一黏著層接觸;以及 附著一第二取模裝置於該第二黏著層相對於該第二樣模之一側,其中該第二取模裝置包含:一第二架體結構;一第二膠帶,其係設置於該第二架體結構;以及一第二支撐背板,其係設置於該第二膠帶,其中該第二取模裝置係以該第二支撐背板與該第二黏著層接觸; 一分離步驟,係包含: 將該第一取模裝置相對於該第一樣模分離,其中該第一可溶解性模仁係隨著該第一取模裝置相對於該第一樣模分離;以及 將該第二取模裝置相對於該第二樣模分離,其中該第二可溶解性模仁係隨著該第二取模裝置相對於該第二樣模分離; 一接觸步驟,係包含:將該第一可溶解性模仁與該第二可溶解性模仁相互間隔地與一高分子材料層接觸; 一壓印步驟,係包含: 施予一壓力至該第一可溶解性模仁,使該高分子材料層具有一對應該第一凹凸結構的第一轉印結構;以及該第二可溶解性模仁,使該高分子材料層具有一對應該第二凹凸結構的第二轉印結構;以及 以一UV光照射該高分子材料層,使該高分料層固化,並使該第一支撐背板與該第一膠帶分離;以及使該第二支撐背板與該第二膠帶分離;以及 一溶解步驟,係提供一溶劑溶解該第一可溶解性模仁、與該第二可溶解性模仁,使該固化後之高分子材料層與該第一支撐背板分離、以及該第二支撐背板分離,以取得一轉印物件。 A method of large-scale imprinting includes: An adding step is to add a soluble material in a first mold and a second mold, and solidify the soluble material to form a first soluble mold core in the first mold , wherein the first dissolvable mold core has a first concave-convex structure; and forming a second dissolvable mold core in the second mold, wherein the second dissolvable mold core has a second concave-convex structure ; a forming step of forming a first adhesive layer on a side of the first dissolvable mold core relative to the first sample mold; and forming a first adhesive layer on a side of the second dissolvable mold core relative to the second sample mold Form a second adhesive layer; A mold-taking step includes: A first mold-taking device is attached to one side of the first adhesive layer relative to the first sample, wherein the first mold-taking device includes: a first frame structure; a first tape disposed on the a first frame structure; and a first support back plate, which is provided on the first tape, wherein the first mold taking device is in contact with the first adhesive layer with the first support back plate; and A second mold-taking device is attached to one side of the second adhesive layer relative to the second sample, wherein the second mold-taking device includes: a second frame structure; a second tape disposed on the a second frame structure; and a second supporting back plate, which is provided on the second adhesive tape, wherein the second mold taking device is in contact with the second adhesive layer with the second supporting back plate; A separation step includes: Separating the first impression device relative to the first prototype, wherein the first dissolvable mold core is separated with the first impression device relative to the first prototype; and Separate the second mold-taking device relative to the second mold, wherein the second dissolvable mold core is separated with the second mold-taking device relative to the second mold; A contacting step includes: contacting the first soluble mold core and the second soluble mold core with a polymer material layer at intervals; One imprinting step includes: Apply a pressure to the first dissolvable mold core so that the polymer material layer has a first transfer structure corresponding to the first concave and convex structure; and the second dissolvable mold core makes the polymer material layer The layer has a second transfer structure corresponding to the second concave-convex structure; and Irradiating the polymer material layer with a UV light to solidify the polymer material layer and separate the first support backing plate from the first adhesive tape; and separate the second support backing plate from the second adhesive tape; and A dissolving step is to provide a solvent to dissolve the first soluble mold core and the second soluble mold core, so that the cured polymer material layer is separated from the first supporting back plate, and the second The supporting back plate is separated to obtain a transfer object. 如請求項1至4中任一項所述之方法,其中該高分子材料層係形成於一基材層上,並且該接觸步驟係包含: 首先:係將該第一可溶解性模仁加熱至一溫度T,其中0<T<T g,並使該第一可溶解性模仁與該高分子材料層接觸;再來:將該第二可溶解性模仁加熱至該溫度T,並使該第二可溶解性模仁與該高分子材料層接觸; 該接觸步驟或包含: 首先:係將該基材層加熱至一溫度T,其中0<T<T g,並使該第一可溶解性模仁與該高分子材料層接觸;再來:將該第二可溶解性模仁與該高分子材料層接觸;以及 該接觸步驟或包含: 首先:係將該基材層與該第一可溶解性模仁相對應之部分加熱至一溫度T,其中0<T<T g,並使該第一可溶解性模仁與該高分子材料層接觸;再來:將該基材層與該第二可溶解性模仁相對應之部分加熱至該溫度T,並使該第二可溶解性模仁與該高分子材料層接觸。 The method according to any one of claims 1 to 4, wherein the polymer material layer is formed on a substrate layer, and the contacting step includes: First: heating the first soluble mold core to a temperature T, where 0<T<T g , and bring the first soluble mold core into contact with the polymer material layer; then: heat the second soluble mold core to the temperature T, and The second soluble mold core is brought into contact with the polymer material layer; the contact step may include: first: heating the base material layer to a temperature T, where 0<T<T g , and making the first The soluble mold core is in contact with the polymer material layer; secondly: contacting the second soluble mold core with the polymer material layer; and the contact step may include: firstly: contacting the base material layer with the polymer material layer The corresponding part of the first soluble mold core is heated to a temperature T, where 0<T<T g , and the first soluble mold core is brought into contact with the polymer material layer; then: the base material The portion of the layer corresponding to the second soluble mold core is heated to the temperature T, and the second soluble mold core is brought into contact with the polymer material layer. 如請求項1所述之方法,其中該高分子材料層係形成於一基材層上,並且該壓印步驟係包含: 施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構; 於形成該第一轉印結構後,施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構; 於形成該第二轉印結構後,將該第一支撐背板與該第一膠帶分離;以及將該第二支撐背板與該第二膠帶分離;以及 施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化; 該壓印步驟或包含: 施予該第一高溫至該基材層; 施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構; 於形成完該第一轉印結構後,施予該壓力至將該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構; 將該第一支撐背板與該第一膠帶分離;以及將該第二支撐背板與該第二膠帶分離;以及 施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化; 該壓印步驟或包含: 施予該第一高溫至該基材層與該第一可溶解性模仁相對應之位置;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構; 於形成完該第一轉印結構後,施予該第一高溫至該基材層與該第二可溶解性模仁相對應之位置;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構; 將該第一支撐背板與該第一膠帶分離;以及將該第二支撐背板與該第二膠帶分離;以及 施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化; 該壓印步驟或包含: 施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一膠帶分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及 施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二膠帶分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化; 該壓印步驟或包含: 首先:施予該第一高溫至該基材層與該第一可溶解性模仁相對應之部分;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一膠帶分離;再來:施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及 首先:施予該第一高溫至該基材層與該第二可溶解性模仁相對應之部分;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二膠帶分離;再來:施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;以及 該壓印步驟或包含: 施予該第一高溫至該基材層;施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一膠帶分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及 施予該第一高溫至該基材層;施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二膠帶分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化。 The method of claim 1, wherein the polymer material layer is formed on a substrate layer, and the imprinting step includes: Applying the first high temperature and the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; After forming the first transfer structure, applying the first high temperature and the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure; After forming the second transfer structure, separating the first support back plate from the first tape; and separating the second support back plate from the second tape; and Apply the second high temperature to the first soluble mold core and the second soluble mold core; to the position corresponding to the base material layer and the first soluble mold core, and to the position between the base material layer and the first soluble mold core The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; This imprinting step may include: Apply the first high temperature to the substrate layer; applying the pressure to the first dissolvable mold core so that the polymer material layer has the first transfer structure; After forming the first transfer structure, apply the pressure to the second dissolvable mold core so that the polymer material layer has the second transfer structure; Separate the first support backing plate from the first tape; and separate the second support backing plate from the second tape; and Apply the second high temperature to the first soluble mold core and the second soluble mold core; to the position corresponding to the base material layer and the first soluble mold core, and to the position between the base material layer and the first soluble mold core The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; This imprinting step may include: Applying the first high temperature to the position of the base material layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; After the first transfer structure is formed, the first high temperature is applied to the position of the base material layer corresponding to the second soluble mold core; and the pressure is applied to the second soluble mold core, so that The polymer material layer has the second transfer structure; Separate the first support backing plate from the first tape; and separate the second support backing plate from the second tape; and Apply the second high temperature to the first soluble mold core and the second soluble mold core; to the position corresponding to the base material layer and the first soluble mold core, and to the position between the base material layer and the first soluble mold core The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; This imprinting step may include: Applying the first high temperature and the pressure to the first soluble mold core, so that the polymer material layer has the first transfer structure, and the first support backing plate is separated from the first tape; and applying Apply the second high temperature to the first soluble mold core; to the position corresponding to the base material layer and the first soluble mold core; or to the base material layer, so that the polymer material layer and the The corresponding portion of the first dissolvable mold core is cured; and Applying the first high temperature and the pressure to the second soluble mold core, causing the polymer material layer to have the second transfer structure, and separating the second support backing plate from the second tape; and applying Apply the second high temperature to the second soluble mold core; to the position corresponding to the base material layer and the second soluble mold core; or to the base material layer, so that the polymer material layer and the The corresponding part of the second dissolvable mold core is solidified; This imprinting step may include: First: apply the first high temperature to the portion of the base material layer corresponding to the first soluble mold core; and apply the pressure to the first soluble mold core, so that the polymer material layer has the first Transfer the structure and separate the first support backing plate from the first adhesive tape; then: apply the second high temperature to the first dissolvable mold core; to the base material layer and the first dissolvable mold core The position corresponding to the mold core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the first dissolvable mold core; and First: apply the first high temperature to the portion of the base material layer corresponding to the second soluble mold core; and apply the pressure to the second soluble mold core, so that the polymer material layer has the second Transfer the structure and separate the second support backing plate from the second adhesive tape; then: apply the second high temperature to the second dissolvable mold core; to the base material layer and the second dissolvable mold core The position corresponding to the mold core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the second dissolvable mold core; and This imprinting step may include: Applying the first high temperature to the base material layer; applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure, and making the first support back plate and the first soluble mold core The first tape is separated; and the second high temperature is applied to the first soluble mold core; to the position corresponding to the base material layer and the first soluble mold core; or to the base material layer, so that The portion of the polymer material layer corresponding to the first dissolvable mold core is cured; and Applying the first high temperature to the base material layer; applying the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure, and making the second support backing plate and the second soluble mold core The second tape is separated; and the second high temperature is applied to the second soluble mold core; to the position corresponding to the base material layer and the second soluble mold core; or to the base material layer, so that The portion of the polymer material layer corresponding to the second dissolvable mold core is solidified. 如請求項2所述之方法,其中該高分子材料層係形成於一基材層上,並且該壓印步驟係包含: 施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構; 於形成該第一轉印結構後,施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構; 於形成該第二轉印結構後,將該第一支撐背板與該第一黏著層分離;以及將該第二支撐背板與該第二黏著層分離;以及 施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化; 該壓印步驟或包含: 施予該第一高溫至該基材層; 施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構; 於形成完該第一轉印結構後,施予該壓力至將該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構; 將該第一支撐背板與該第一黏著層分離;以及將該第二支撐背板與該第二黏著層分離;以及 施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化; 該壓印步驟或包含: 施予該第一高溫至該基材層與該第一可溶解性模仁相對應之位置;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構; 於形成完該第一轉印結構後,施予該第一高溫至該基材層與該第二可溶解性模仁相對應之位置;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構; 將該第一支撐背板與該第一黏著層分離;以及將該第二支撐背板與該第二黏著層分離;以及 施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化; 該壓印步驟或包含: 施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一黏著層分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及 施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二黏著層分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化; 該壓印步驟或包含: 首先:施予該第一高溫至該基材層與該第一可溶解性模仁相對應之部分;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一黏著層分離;再來:施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及 首先:施予該第一高溫至該基材層與該第二可溶解性模仁相對應之部分;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二黏著層分離;再來:施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;以及 該壓印步驟或包含: 施予該第一高溫至該基材層;施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一支撐背板與該第一黏著層分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及 施予該第一高溫至該基材層;施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二支撐背板與該第二黏著層分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化。 The method of claim 2, wherein the polymer material layer is formed on a substrate layer, and the imprinting step includes: Applying the first high temperature and the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; After forming the first transfer structure, applying the first high temperature and the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure; After forming the second transfer structure, separating the first supporting back plate from the first adhesive layer; and separating the second supporting back plate from the second adhesive layer; and Apply the second high temperature to the first soluble mold core and the second soluble mold core; to the position corresponding to the base material layer and the first soluble mold core, and to the position between the base material layer and the first soluble mold core The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; This imprinting step may include: Apply the first high temperature to the substrate layer; applying the pressure to the first dissolvable mold core so that the polymer material layer has the first transfer structure; After forming the first transfer structure, apply the pressure to the second dissolvable mold core so that the polymer material layer has the second transfer structure; Separate the first support backing plate from the first adhesive layer; and separate the second support backing plate from the second adhesive layer; and Apply the second high temperature to the first soluble mold core and the second soluble mold core; to the position corresponding to the base material layer and the first soluble mold core, and to the position between the base material layer and the first soluble mold core The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; This imprinting step may include: Applying the first high temperature to the position of the base material layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; After the first transfer structure is formed, the first high temperature is applied to the position of the base material layer corresponding to the second soluble mold core; and the pressure is applied to the second soluble mold core, so that The polymer material layer has the second transfer structure; Separate the first support backing plate from the first adhesive layer; and separate the second support backing plate from the second adhesive layer; and Apply the second high temperature to the first soluble mold core and the second soluble mold core; to the position corresponding to the base material layer and the first soluble mold core, and to the position between the base material layer and the first soluble mold core The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; This imprinting step may include: Applying the first high temperature and the pressure to the first soluble mold core allows the polymer material layer to have the first transfer structure, and separates the first support backing plate from the first adhesive layer; and Apply the second high temperature to the first soluble mold core; to the position of the base material layer corresponding to the first soluble mold core; or to the base material layer, so that the polymer material layer and The corresponding part of the first dissolvable mold core is cured; and Applying the first high temperature and the pressure to the second soluble mold core allows the polymer material layer to have the second transfer structure, and separates the second support backing plate from the second adhesive layer; and Apply the second high temperature to the second soluble mold core; to the position corresponding to the base material layer and the second soluble mold core; or to the base material layer, so that the polymer material layer and The corresponding part of the second dissolvable mold core is solidified; This imprinting step may include: First: apply the first high temperature to the portion of the base material layer corresponding to the first soluble mold core; and apply the pressure to the first soluble mold core, so that the polymer material layer has the first Transfer the structure and separate the first support backing plate from the first adhesive layer; then: apply the second high temperature to the first dissolvable mold core; to the base material layer and the first dissolvable mold core The position corresponding to the first dissolvable mold core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the first dissolvable mold core; and First: apply the first high temperature to the portion of the base material layer corresponding to the second soluble mold core; and apply the pressure to the second soluble mold core, so that the polymer material layer has the second Transfer the structure and separate the second support backing plate from the second adhesive layer; then: apply the second high temperature to the second dissolvable mold core; to the base material layer and the second dissolvable mold core The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the second dissolvable mold core; and This imprinting step may include: Applying the first high temperature to the base material layer; applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure, and making the first support back plate and the first soluble mold core The first adhesive layer is separated; and the second high temperature is applied to the first soluble mold core; to the position corresponding to the base material layer and the first soluble mold core; or to the base material layer, to Curing the portion of the polymer material layer corresponding to the first dissolvable mold core; and Applying the first high temperature to the base material layer; applying the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure, and making the second support backing plate and the second soluble mold core The second adhesive layer is separated; and the second high temperature is applied to the second soluble mold core; to the position corresponding to the base material layer and the second soluble mold core; or to the base material layer, to The portion of the polymer material layer corresponding to the second dissolvable mold core is solidified. 如請求項3、或4所述之方法,其中該高分子材料層係形成於一基材層上,並且該壓印步驟係包含: 施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構; 於形成該第一轉印結構後,施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構; 於形成該第二轉印結構後,將該第一膠帶與該第一黏著層分離;以及將該第二膠帶與該第二黏著層分離;以及 施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化; 該壓印步驟或包含: 施予該第一高溫至該基材層; 施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構; 於形成完該第一轉印結構後,施予該壓力至將該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構; 將該第一膠帶與該第一黏著層分離;以及將該第二膠帶與該第二黏著層分離;以及 施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化; 該壓印步驟或包含: 施予該第一高溫至該基材層與該第一可溶解性模仁相對應之位置;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構; 於形成完該第一轉印結構後,施予該第一高溫至該基材層與該第二可溶解性模仁相對應之位置;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構; 將該第一膠帶與該第一黏著層分離;以及將該第二膠帶與該第二黏著層分離;以及 施予該第二高溫至該第一可溶解性模仁與該第二可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置、以及該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層固化; 該壓印步驟或包含: 施予該第一高溫與該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一膠帶與該第一黏著層分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及 施予該第一高溫與該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二膠帶與該第二黏著層分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化; 該壓印步驟或包含: 首先:施予該第一高溫至該基材層與該第一可溶解性模仁相對應之部分;以及該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一膠帶與該第一黏著層分離;再來:施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及 首先:施予該第一高溫至該基材層與該第二可溶解性模仁相對應之部分;以及該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二膠帶與該第二黏著層分離;再來:施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;以及 該壓印步驟或包含: 施予該第一高溫至該基材層;施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構,並使該第一膠帶與該第一黏著層分離;以及施予該第二高溫至該第一可溶解性模仁;至該基材層與該第一可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及 施予該第一高溫至該基材層;施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構,並使該第二膠帶與該第二黏著層分離;以及施予該第二高溫至該第二可溶解性模仁;至該基材層與該第二可溶解性模仁相對應之位置;或至該基材層,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化。 The method of claim 3 or 4, wherein the polymer material layer is formed on a substrate layer, and the imprinting step includes: Applying the first high temperature and the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; After forming the first transfer structure, applying the first high temperature and the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure; After forming the second transfer structure, separating the first adhesive tape from the first adhesive layer; and separating the second adhesive tape from the second adhesive layer; and Apply the second high temperature to the first soluble mold core and the second soluble mold core; to the position corresponding to the base material layer and the first soluble mold core, and to the position between the base material layer and the first soluble mold core The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; This imprinting step may include: Apply the first high temperature to the substrate layer; applying the pressure to the first dissolvable mold core so that the polymer material layer has the first transfer structure; After forming the first transfer structure, apply the pressure to the second dissolvable mold core so that the polymer material layer has the second transfer structure; Separate the first tape from the first adhesive layer; and separate the second tape from the second adhesive layer; and Apply the second high temperature to the first soluble mold core and the second soluble mold core; to the position corresponding to the base material layer and the first soluble mold core, and to the position between the base material layer and the first soluble mold core The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; This imprinting step may include: Applying the first high temperature to the position of the base material layer corresponding to the first soluble mold core; and applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; After the first transfer structure is formed, the first high temperature is applied to the position of the base material layer corresponding to the second soluble mold core; and the pressure is applied to the second soluble mold core, so that The polymer material layer has the second transfer structure; Separate the first tape from the first adhesive layer; and separate the second tape from the second adhesive layer; and Apply the second high temperature to the first soluble mold core and the second soluble mold core; to the position corresponding to the base material layer and the first soluble mold core, and to the position between the base material layer and the first soluble mold core The position corresponding to the second dissolvable mold core; or to the base material layer to solidify the polymer material layer; This imprinting step may include: Applying the first high temperature and the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure and separating the first adhesive tape from the first adhesive layer; and applying The second high temperature goes to the first soluble mold core; to the position of the base material layer corresponding to the first soluble mold core; or to the base material layer, so that the polymer material layer and the third A corresponding part of the dissolvable mold core is cured; and Applying the first high temperature and the pressure to the second soluble mold core, causing the polymer material layer to have the second transfer structure, and separating the second adhesive tape from the second adhesive layer; and applying The second high temperature goes to the second soluble mold core; to the position corresponding to the base material layer and the second soluble mold core; or to the base material layer, so that the polymer material layer and the third The corresponding parts of the two soluble mold cores are solidified; This imprinting step may include: First: apply the first high temperature to the portion of the base material layer corresponding to the first soluble mold core; and apply the pressure to the first soluble mold core, so that the polymer material layer has the first Transfer the structure and separate the first tape from the first adhesive layer; then: apply the second high temperature to the first soluble mold core; to the base material layer and the first soluble mold core. The position corresponding to the core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the first dissolvable mold core; and First: apply the first high temperature to the portion of the base material layer corresponding to the second soluble mold core; and apply the pressure to the second soluble mold core, so that the polymer material layer has the second Transfer the structure and separate the second adhesive tape from the second adhesive layer; then: apply the second high temperature to the second soluble mold core; to the base material layer and the second soluble mold core The position corresponding to the core; or to the base material layer to solidify the portion of the polymer material layer corresponding to the second dissolvable mold core; and This imprinting step may include: Applying the first high temperature to the base material layer; applying the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure, and making the first adhesive tape and the first Separating the adhesive layer; and applying the second high temperature to the first soluble mold core; to the position corresponding to the base material layer and the first soluble mold core; or to the base material layer, so that the The portion of the polymer material layer corresponding to the first dissolvable mold core is cured; and Applying the first high temperature to the base material layer; applying the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure, and making the second adhesive tape and the second Separating the adhesive layer; and applying the second high temperature to the second soluble mold core; to the position corresponding to the base material layer and the second soluble mold core; or to the base material layer, so that the The portion of the polymer material layer corresponding to the second dissolvable mold core is solidified. 如請求項5所述之方法,其中該高分子材料層係形成於一基材層上,並且該壓印步驟係包含: 首先:施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;以該UV光照射該高分子材料層與該第一可溶解性模仁相對應之部分,以使該高分子材料層與該第一可溶解性模仁相對應之部分固化;以及使該第一支撐背板與該第一膠帶分離;以及 再來:施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;以該UV光照射該高分子材料層與該第二可溶解性模仁相對應之部分,以使該高分子材料層與該第二可溶解性模仁相對應之部分固化;以及使該第二支撐背板與該第二膠帶分離; 該壓印步驟或包含: 施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;以該UV光照射該高分子材料層,使該高分子材料層固化;以及使該第一支撐背板與該第一膠帶分離、與使該第二支撐背板與該第二膠帶分離;以及 該壓印步驟或包含: 施予該壓力至該第一可溶解性模仁,使該高分子材料層具有該第一轉印結構;施予該壓力至該第二可溶解性模仁,使該高分子材料層具有該第二轉印結構;以該UV光照射該高分子材料層與該第一可溶解性模仁相對應之部分,使該高分子材料層與該第一可溶解性模仁相對應之部分固化,並使該第一支撐背板與該第一膠帶分離;以及以該UV光照射該高分子材料層與該第二可溶解性模仁相對應之部分,使該高分子材料層與該第二可溶解性模仁相對應之部分固化,並使該第二支撐背板與該第二膠帶分離。 The method of claim 5, wherein the polymer material layer is formed on a substrate layer, and the imprinting step includes: First: apply the pressure to the first soluble mold core so that the polymer material layer has the first transfer structure; irradiate the polymer material layer with the first soluble mold core with the UV light. The corresponding part to solidify the corresponding part of the polymer material layer and the first dissolvable mold core; and separate the first supporting back plate from the first tape; and Next: apply the pressure to the second soluble mold core so that the polymer material layer has the second transfer structure; irradiate the polymer material layer and the second soluble mold core with the UV light Corresponding parts to solidify the polymer material layer and the corresponding parts of the second dissolvable mold core; and separate the second support backing plate from the second adhesive tape; This imprinting step may include: The pressure is applied to the first soluble mold core so that the polymer material layer has the first transfer structure; the pressure is applied to the second soluble mold core so that the polymer material layer has the first transfer structure. the second transfer structure; irradiating the polymer material layer with the UV light to solidify the polymer material layer; and separating the first support back plate from the first tape, and making the second support back plate and the Second tape separation; and This imprinting step may include: The pressure is applied to the first soluble mold core so that the polymer material layer has the first transfer structure; the pressure is applied to the second soluble mold core so that the polymer material layer has the first transfer structure. The second transfer structure: irradiate the portion of the polymer material layer corresponding to the first soluble mold core with the UV light to solidify the portion of the polymer material layer corresponding to the first soluble mold core. and separate the first supporting back plate from the first adhesive tape; and irradiate the portion of the polymer material layer corresponding to the second dissolvable mold core with the UV light, so that the polymer material layer and the third dissolvable mold core are The corresponding parts of the two dissolvable mold cores are solidified, and the second supporting back plate is separated from the second adhesive tape.
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