JP2020047649A - Molding apparatus, molding method, and article manufacturing method, for molding composition on substrate using mold - Google Patents

Abstract

To provide a molding apparatus advantageous for mold release.SOLUTION: The molding apparatus for molding a composition on a substrate using a mold, includes: a plurality of mold holding units for holding the mold; a plurality of driving units for respectively driving the plurality of mold holding units; and a control unit for controlling the plurality of driving units. The control unit controls the plurality of driving units so that mold release that separates the mold from the composition proceeds along the outer periphery of the substrate.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a molding apparatus for molding a composition on a substrate using a mold, a molding method, and an article manufacturing method.

  As the demand for miniaturization of semiconductor devices advances, in addition to the conventional photolithography technology, the uncured imprint material on the substrate is molded and cured using a mold to form a pattern of the imprint material on the substrate. Attention is being paid to microfabrication technology. Such a technique is called an imprint technique, and can form a fine pattern on the order of several nanometers on a substrate.

  One of the imprint techniques is, for example, a photo-curing method. An imprint apparatus that employs a photo-curing method molds a photo-curable imprint material supplied on a substrate (shot area) with a mold, irradiates light to cure the imprint material, and cures the imprint material. The pattern is formed on the substrate by separating the mold from the material.

  In recent years, a technique for flattening a substrate using an imprint apparatus has been proposed (see Patent Document 1). Regarding the substrate flattening technology, there is generally known a technology of flattening a step of a substrate by forming a coating film on the substrate using an existing coating device (spin coater). Is not enough to flatten the step at the nanoscale. On the other hand, the technique disclosed in Patent Literature 1 is to drop an imprint material on the basis of a step of a substrate, and to cure the imprint material in a state in which a template is brought into contact with the dropped imprint material to thereby improve the accuracy of flattening. It is intended to improve.

  In such a technique, at the time of a releasing operation of peeling off the template and the imprint material, a large force acts on the template, the imprint material and the substrate to attract each other. Therefore, the release force required to separate the template and the imprint material is increased. If the release force is large, the mold cannot be separated from the cured imprint material, and a problem may occur in which the template and the substrate cannot be held (released) by the respective holding portions (chucks).

  Also, the imprint material may be peeled off from the substrate side and remain attached to the template side. In Patent Document 2, a first holding unit that holds a substrate end on the back surface of the substrate and a second holding unit that holds other portions of the back surface of the substrate are provided, and the first holding unit and the second holding unit are connected to each other. A method of reducing the release force by performing relative release to release the mold is described.

JP 2011-529626 A JP 2010-269580 A

However, in this method, although the releasing force can be reduced at the end of the substrate, the releasing force may be increased when the releasing is performed from the end of the substrate toward the center. For this reason, it has been difficult to effectively improve the detachment of the template or the substrate from the holding portion and the residual imprint material on the template.

  An object of the present invention is, for example, to provide a molding apparatus advantageous for mold release.

  In order to solve the above problems, the present invention is a molding apparatus for molding a composition on a substrate using a mold, and a plurality of mold holding units for holding the mold, and each of the plurality of mold holding units is driven. A plurality of driving units, and a control unit that controls the plurality of driving units, and the control unit controls the plurality of driving units such that the mold release that separates the mold from the composition proceeds along the outer periphery of the substrate. .

  According to the present invention, for example, a molding apparatus advantageous for mold release can be provided.

1 is a schematic diagram illustrating a configuration of a flattening device according to one aspect of the present invention. FIG. 9 is a diagram for describing an outline of a flattening process. It is a figure showing a type holding part concerning a 1st embodiment. FIG. 5 is a diagram illustrating a release operation of the flattening process according to the first embodiment. It is a figure showing the type holding part concerning a 2nd embodiment. It is a figure which shows the manufacturing method of an article.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In each of the drawings, the same members are denoted by the same reference numerals, and redundant description will be omitted.
<First embodiment>

FIG. 1 is a schematic diagram showing a configuration of a flattening apparatus 100 according to one aspect of the present invention. The flattening apparatus 100 is embodied as a forming apparatus (so-called imprint apparatus) that forms an imprint material (composition) on a substrate using a mold (mold, template). Flatten the imprint material. The flattening apparatus 100 forms the flat surface of the imprint material on the substrate by curing the imprint material in a state where the imprint material on the substrate and the mold are in contact with each other and separating the mold from the cured imprint material. I do.

  As shown in FIG. 1, the flattening device 100 includes a chuck 2, a substrate stage 3, a base platen 4, a support 5, a top plate 6, a guide bar 8, a support 10, and a plurality of mold holding units. Parts 122 a to 122 l, a support part 13, and an alignment shelf 14. Further, a supply unit 20, an off-axis alignment (OA) scope 21, a substrate transfer unit 22, an alignment scope 23, a light source 24, a stage drive unit 31, a mold transfer unit 32, a cleaning unit 33, And a control unit 200. In the present embodiment, the chuck 2 and the substrate stage 3 constitute a substrate holding unit that holds the substrate 1. Here, the XYZ coordinate system is defined such that the horizontal plane (the surface along the substrate 1 held by the chuck 2) is the XY plane, and the vertical direction is the Z-axis direction.

  Referring to FIG. 1, a substrate 1 is loaded from outside the flattening apparatus 100 by a substrate transfer unit 22 including a transfer hand and the like, and is held by a chuck 2. The substrate stage 3 is supported by a base platen 4 and driven in the X-axis direction and the Y-axis direction to position the substrate 1 held by the chuck 2 at a predetermined position. The stage drive unit 31 includes, for example, a linear motor and an air cylinder, and drives (moves) the substrate stage 3 in at least the X-axis direction and the Y-axis direction. (Six axis directions). Further, the stage driving section 31 includes a rotating mechanism, and rotationally drives (rotates) the chuck 2 or the substrate stage 3 around an axis parallel to the Z-axis direction.

  The mold 11 is carried in from the outside of the flattening apparatus 100 by the mold conveying section 32 including a conveying hand and the like, and is held by the plurality of mold holding sections 122a to 122l. The mold 11 used in the flattening apparatus 100 has a flat portion 11a in which at least a region on the substrate which comes into contact with the imprint material has no uneven pattern. The mold 11 is, for example, a planar template that has a circular or square outer shape and includes a planar portion 11a that contacts the imprint material on the substrate and conforms to the surface shape of the substrate 1. In the present embodiment, the area of the flat portion 11 a is the same as the surface of the substrate 1 or larger than the surface of the substrate 1. The plurality of mold holding units 122a to 122l are supported by the support unit 13 and have a function of correcting the inclination of the mold 11 around the Z axis. The plurality of mold holding units 122a to 122l and the support unit 13 are collectively referred to as an imprint head 12. The imprint head 12 includes an opening (not shown) through which light (ultraviolet light) emitted from the light source 24 via the collimator lens passes. Further, a load cell for measuring a pressing force (imprinting force) of the mold 11 against the imprint material on the substrate is arranged in the plurality of mold holding units 122a to 122l or the support unit 13. The detailed configuration of the plurality of mold holding units 122a to 122l will be described later.

  On the base platen 4, a column 5 for supporting a top plate 6 is arranged. The guide bar 8 is suspended from the top plate 6, penetrates the alignment shelf 14, and is fixed to the support 13. The alignment shelf 14 is suspended from the top plate 6 via the column 10. The guide bar 8 penetrates the alignment shelf 14. Further, a height measuring system (not shown) for measuring the height (flatness) of the substrate 1 held by the chuck 2 is disposed on the alignment shelf 14 using, for example, an oblique incident image shift method. ing.

  The alignment scope 23 includes an optical system and an imaging system for observing a reference mark provided on the substrate stage 3 and an alignment mark provided on the mold 11. However, when the mold 11 is not provided with an alignment mark, the alignment scope 23 may not be provided. The alignment scope 23 is used for alignment that measures a relative position between a reference mark provided on the substrate stage 3 and an alignment mark provided on the mold 11 and corrects the positional deviation.

  The supply unit 20 (also called a dispenser) has a discharge port (nozzle) for discharging the uncured imprint material on the substrate 1, and supplies (applies) the imprint material onto the substrate. The supply unit 20 employs, for example, a piezo jet method or a micro solenoid method, and can supply an imprint material having a minute volume of about 1 pL (picoliter) onto a substrate. Further, the number of discharge ports in the supply unit 20 is not limited, and may be one (single nozzle), more than 100 (that is, a linear nozzle array, or a plurality of discharge nozzles). A linear nozzle array may be combined).

  The OA scope 21 is supported by the alignment shelf 14. The OA scope 21 detects alignment marks provided in a plurality of shot areas of the substrate 1 without passing through the mold 11. It is possible to perform relative alignment between the mold 11 and the substrate 1 by obtaining the positional relationship between the mold 11 and the substrate stage 3 by the alignment scope 23 and obtaining the positional relationship between the substrate stage 3 and the substrate 1 by the OA scope 21. it can.

  The cleaning unit 33 cleans (cleans) the mold 11 while the mold 11 is held by the imprint head 12. In the present embodiment, the cleaning unit 33 removes the imprint material attached to the mold 11, particularly, the plane portion 11 a by separating the mold 11 from the cured imprint material on the substrate. The cleaning unit 33 may wipe off the imprint material adhered to the mold 11, for example, or may remove the imprint material adhered to the mold 11 by using UV irradiation, wet cleaning, dry plasma cleaning, or the like.

  The control unit 200 includes a CPU, a memory, and the like, and controls the entire flattening apparatus 100. The control unit 200 functions as a processing unit that controls each unit of the planarization apparatus 100 and performs a planarization process. Here, the flattening process is a process of flattening the imprint material by bringing the flat portion 11a of the mold 11 into contact with the imprint material on the substrate and causing the flat portion 11a to follow the surface shape of the substrate 1. is there. The flattening process is generally performed in lot units, that is, for each of a plurality of substrates included in the same lot.

  An outline of the flattening process will be described with reference to FIGS. First, as shown in FIG. 2A, the imprint material IM is supplied from the supply unit 20 to the substrate 1 on which the base pattern 1a is formed. FIG. 2A shows a state before the imprint material IM is supplied onto the substrate and the mold 11 is brought into contact. Next, as shown in FIG. 2B, the imprint material IM on the substrate is brought into contact with the flat portion 11a of the mold 11. FIG. 2B shows a state in which the flat portion 11 a of the mold 11 completely contacts the imprint material IM on the substrate, and the flat portion 11 a of the mold 11 follows the surface shape of the substrate 1. Then, in a state shown in FIG. 2B, the light source 24 irradiates the imprint material IM on the substrate with light via the mold 11 to cure the imprint material IM. Next, as shown in FIG. 2C, the mold 11 is separated from the cured imprint material IM on the substrate. Thereby, a layer (flattening layer) of the imprint material IM having a uniform thickness can be formed on the entire surface of the substrate 1. FIG. 2C shows a state in which a flattening layer of the imprint material IM is formed on the substrate.

  Next, the configuration of the plurality of mold holding units 122a to 122l of the present embodiment will be described. FIG. 3 is a diagram illustrating the mold holding units 122a to 122l according to the first embodiment. FIG. 3 is a view of the plurality of mold holding portions 122a to 122l viewed from the + Z direction and a side view thereof. The plurality of mold holding portions 122a to 122l hold the mold 11 at positions on the outer periphery of the mold 11. In the present embodiment, since the mold 11 having a circular outer shape is used as an example, the plurality of mold holders 122a to 122l are also arranged in a circle at positions along the outer periphery of the circle. In addition, for example, when using the mold 11 having a square outer shape, the plurality of mold holding units 122a to 122l can be arranged in a square shape.

  The plurality of mold holding units 122a to 122l include driving units 121a to 121l that can drive the plurality of mold holding units 122a to 122l in a Z direction that is a direction intersecting the surface (XY plane) of the substrate 1. In this specification, the surface of the substrate 1 is the surface of the substrate 1 to which the imprint material is supplied. The driving units 121a to 121l are fixed to the support unit 13. The driving units 121a to 121l are individually controlled by the control unit 200, and can be driven independently. Accordingly, the plurality of mold holding units 122a to 122l can be independently driven in the Z direction.

  Next, a release operation of the planarization processing according to the first embodiment will be described with reference to FIG. FIG. 4 is a diagram illustrating a release operation of the flattening process according to the first embodiment. In the following, when the mold holding unit 122 is simply referred to, it indicates at least one of the plurality of mold holding units 122a to 122l. In addition, when the driving unit 121 is simply referred to, it means at least one driving unit corresponding to the mold holding unit 122 among the plurality of driving units 121a to 121l. The release operation according to the present embodiment is executed under the control of each unit by the control unit 200. FIG. 4A shows a state in which the imprint material IM is cured while the imprint material IM on the substrate 1 is in contact with the mold 11. FIG. 4B is a diagram in which, out of the plurality of mold holding units 122a to 122l, the mold holding unit 122a indicated by an arrow is driven in the + Z direction by the driving unit 121a, and mold release is started from one point on the outer periphery of the imprint material IM. It is. In the figure, as an example, the starting position of the releasing operation is the position of the mold holding unit 122a, but the starting position is not limited to this.

  Subsequently, in FIG. 4C, the mold holding unit 122b adjacent to the mold holding unit 122a is driven in the + Z direction by the corresponding driving unit 121b. Subsequently, in FIG. 4D, the mold holding unit 122c adjacent to the mold holding unit 122b is driven in the + Z direction by the corresponding driving unit 121c. In this manner, by sequentially driving the adjacent die holding unit and the die holding unit 122 driven in the + Z direction by the corresponding driving unit, the release starting from the position of the die holding unit 122a is performed on the outer periphery of the substrate 1. Along the clockwise direction. By proceeding the mold release in this manner, the mold release can be proceeded by a smaller area than in the case where the entire mold 11 is simultaneously pulled up and the mold release is performed, so that the mold release force can be reduced, It is possible to reduce the detachment of the mold and the substrate from the holding portion and the residual imprint material on the mold.

  In FIG. 4E, the plurality of mold holding units 122a to 122l are sequentially driven clockwise in the + Z direction, and the driving of the mold holding unit 122l indicated by the arrow by the driving unit 121l is completed, and the mold holding units 122a to 122l are driven. This shows a state in which the drive in the + Z direction of 122l makes one round. Due to the mold release proceeding along the outer periphery of the substrate 1, the contact portion between the imprint material IM and the mold 11 has a smaller diameter than at the start of the mold release. FIG. 4F shows a diagram in which the mold holding portion 122a is further driven in the + Z direction from the position of FIG. Subsequently, similarly to the above, the mold holder adjacent to the mold holder driven in the + Z direction is sequentially driven clockwise in the + Z direction, and the mold is released along the outer periphery of the substrate 1. Complete demolding.

  In FIG. 4, the direction in which the mold is released is clockwise, but is not limited to this, and may be counterclockwise. In FIG. 4, only one of the mold holding portions 122b and 122l adjacent to the mold holding portion 122a, which is the start position of the mold release, is driven, and the mold release is performed in one direction. Although advanced, it is not limited to this. Both of the adjacent mold holding units (the mold holding unit 122b and the mold holding unit 122l) may be driven. The release operation is performed by sequentially driving the mold holding units 122b, 122c, and 122d clockwise to advance the mold release, and the die release unit 122l, 122k, and 122j are sequentially driven counterclockwise to advance the mold release. Can be combined. By performing the clockwise and counterclockwise release operations in parallel, the release along the outer periphery of the substrate 1 can be advanced at double speed, and the throughput can be improved.

  Up to this point, the case where the mold release start position is one point on the outer periphery of the imprint material IM has been described, but a plurality of mold holding units that are driven in the + Z direction at the start of mold release may be used. By increasing the number of mold holding units that are driven in the + Z direction at the start of release, a plurality of release positions can be provided. For example, in addition to the mold holding part 122a, the mold holding parts 122g located at diagonal positions are simultaneously driven in the + Z direction. In this manner, the mold release is started from two opposing points, and the mold holder adjacent to the mold holder is sequentially driven, and the mold release along the outer periphery of the substrate 1 proceeds at double speed. Therefore, the throughput can be improved. Since the release force increases as the number of release points increases, the number of release points may be determined in consideration of the release force and the release speed.

<Second embodiment>
Next, a planarizing apparatus according to a second embodiment will be described with reference to FIG. FIG. 5 is a diagram illustrating a mold holding unit according to the second embodiment. FIG. 5A is an enlarged view of the mold holding unit 222 of the second embodiment. Also in the present embodiment, when the mold holding section 222 is simply referred to, it refers to at least one of the plurality of mold holding sections 222a to 222l. This figure is a view of the mold holding section 222 as viewed from the −Z direction. The mold holding section 222 includes a plurality of holding areas 40 to 43. The holding regions 40 to 43 hold the mold 11 by being attracted by a vacuum suction force or an electrostatic force.

  The mold holding unit 222 according to the present embodiment is an example in which a holding area is divided into four. The mold holding section 222 includes a holding area 40 arranged at the center of the mold holding section 222, a holding area 41 and a holding area 42 arranged at positions facing the mold holding sections adjacent to the mold holding section 222, 1 is provided with a holding area 43 arranged at a position facing the center. Switching of the holding force of each holding area (switching of the attachment / detachment of the mold 11) is controlled by the control unit 200.

  FIG. 5B shows a diagram in which the mold holding unit 222a at the position indicated by the arrow is driven in the + Z upward direction to start mold release. When only a part of the mold 11 is driven in the + Z direction, a bending force is applied to the mold 11. Since the curved portion of the mold 11 attempts to return to the original shape, a force opposing the holding force of the mold holding portion 222a acts on the mold 11. If this force exceeds the holding force, the mold 11 may be detached from the mold holding portion 222. Further, even when the holding force on the mold 11 is sufficiently large and the mold 11 is not detached, there is a possibility that the force for bending the mold 11 may cause damage to the mold 11. Therefore, in the present embodiment, the control unit 200 controls the holding forces of the plurality of holding regions 40 to 43 in conjunction with the driving of the mold holding unit 222 at the time of release. Specifically, when the mold holding unit 222 starts driving in the + Z direction at the time of release, the holding force of some of the holding regions 41, 42, and 43 is cut off by the control unit 200 (the holding force is reduced). Make it smaller). Thus, the holding force of the mold holding unit 222 near the position where the mold release does not proceed is reduced, and the releasing operation proceeds while reducing the amount of bending of the mold 11 due to the releasing operation. In the present embodiment, the holding force of some of the holding regions 41, 42, and 43 is completely cut off, but the holding force of some of the holding regions 41, 42, and 43 may be reduced.

As a means for providing a similar effect, there is a method of arranging adjacent mold holding portions 222 at a predetermined interval so that the mold 11 has a gentle curve. Specifically, for example, an interval is provided by reducing the size of the mold holding unit 222 or reducing the number. Further, the area of the holding region may be reduced. Specifically, for example, the mold holding unit 222 includes only the holding area 40 illustrated in FIG. In these cases, since the total amount of holding force of the mold holding unit 222 is reduced, it is necessary to confirm that sufficient holding force is secured in consideration of the entire process of the flattening process.

  In addition, a plurality of mold holding units 122 may be simultaneously driven in the + direction so that the mold 11 has a gentle curve between adjacent mold holding units 122 (mold holding units 222). Specifically, when driving the mold holding unit 122a in the + Z direction, the adjacent mold holding unit 122b (mold holding unit 122l) can be driven in the + Z direction. At this time, by making the driving amount of the mold holding unit 122b smaller than the driving amount of the mold holding unit 122a, the mold 11 can be gently curved and released.

  With the above configuration, it is possible to reduce the detachment of the mold from the mold holding unit due to the mold release.

<Embodiment of Article Manufacturing Method>
The pattern of the cured product formed using the imprint apparatus is used on at least a part of various articles permanently or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include a volatile or non-volatile semiconductor memory such as a DRAM, an SRAM, a flash memory, and an MRAM, and a semiconductor element such as an LSI, a CCD, an image sensor, and an FPGA. Examples of the mold include a mold for imprint.

  The pattern of the cured product is used as it is as at least a part of the component of the article, or is temporarily used as a resist mask. After etching or ion implantation is performed in the processing step of the substrate, the resist mask is removed.

  Next, a specific method for manufacturing an article will be described. As shown in FIG. 6A, a substrate 1z such as a silicon wafer having a surface on which a workpiece 2z such as an insulator is formed is prepared, and then the substrate 1z is formed on the surface of the workpiece 2z by an inkjet method or the like. The print material 3z is provided. Here, a state is shown in which a plurality of droplet-shaped imprint materials 3z are provided on the substrate.

  As shown in FIG. 6B, the imprint mold 4z is opposed to the imprint material 3z on the substrate, with the side on which the uneven pattern is formed facing the imprint material 3z. As shown in FIG. 6C, the substrate 1z provided with the imprint material 3z is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z as curing energy in this state, the imprint material 3z is cured.

  As shown in FIG. 6D, when the imprint material 3z is cured and the mold 4z is separated from the substrate 1z, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. In the pattern of the cured product, the concave portions of the mold correspond to the convex portions of the cured product, and the concave portions of the mold correspond to the convex portions of the cured product. That is, the concave and convex pattern of the mold 4z is transferred to the imprint material 3z. It was done.

  As shown in FIG. 6E, when etching is performed using the pattern of the cured product as an etching resistant mask, a portion of the surface of the workpiece 2z where the cured product is not present or remains thinly is removed, and the groove 5z is removed. Become. As shown in FIG. 6 (F), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured product is removed, but it may be used as, for example, an interlayer insulating film included in a semiconductor element or the like, that is, a constituent member of an article without being removed even after processing.

  Although an example in which a mold for transferring a circuit pattern provided with a concavo-convex pattern has been described as the mold 4z, a mold having a flat portion without a concavo-convex pattern (a flat template) may be used.

  Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist. For example, the present invention is not limited to a flattening device, but can be applied to an imprint device. Here, the imprint apparatus uses a mold for transferring a circuit pattern provided with an uneven pattern as a mold. The imprint apparatus contacts the imprint material supplied on the substrate with a mold having a concavo-convex pattern, and applies energy for curing to the imprint material, whereby the pattern of the cured product on which the pattern of the mold is transferred is formed. Form.

  Further, in the above-described embodiment, an embodiment in which a plurality of mold holding units are provided has been described. However, similarly, a plurality of substrate holding units may be provided to reduce the releasing force.

40-43 Holding area 100 Flattening device 121a-l Driving unit 122a-l Type holding unit 200 Control unit

Claims (11)

A molding apparatus for molding a composition on a substrate using a mold,
A plurality of mold holding units for holding the mold,
A plurality of driving units that respectively drive the plurality of mold holding units,
A control unit that controls the plurality of driving units,
The molding device, wherein the control unit controls the plurality of driving units so that a mold release for separating the mold from the composition proceeds along an outer periphery of the substrate.   The molding apparatus according to claim 1, wherein the plurality of driving units are capable of independently driving the plurality of mold holding units in a direction crossing a surface of the substrate.   The molding apparatus according to claim 1, wherein the plurality of mold holding units are arranged along an outer periphery of the substrate, and hold the outer periphery of the mold.   4. The molding apparatus according to claim 1, wherein the control unit controls the plurality of driving units such that adjacent ones of the mold holding units are sequentially driven. 5.   The said control part starts the said mold release by controlling one of the said several drive part so that one of the said several type holding part may be driven. Item 5. The molding apparatus according to any one of Items 1 to 4. The mold holding unit includes a plurality of holding areas for holding the mold,
The molding according to any one of claims 1 to 5, wherein the control unit performs control so as to reduce a holding force of a part of the plurality of holding regions when starting the mold release. apparatus.   The molding apparatus according to any one of claims 1 to 5, wherein the plurality of mold holding units are arranged at a predetermined distance from adjacent mold holding units.   The molding device according to any one of claims 1 to 7, wherein the molding device flattens the composition by bringing a flat portion of the mold into contact with the composition.   The molding apparatus according to any one of claims 1 to 7, wherein the molding apparatus forms the pattern of the composition by bringing the pattern of the mold into contact with the composition. A molding method for molding a composition on a substrate using a mold,
Including driving each of the plurality of mold holding units holding the mold,
The method according to claim 1, wherein in the step, the plurality of mold holding units are driven such that the mold releasing the mold from the composition proceeds along the outer periphery of the substrate. Molding a composition on a substrate using the molding apparatus according to any one of claims 1 to 9,
Processing the substrate on which the composition has been formed in the step,
Manufacturing an article from the processed substrate.
A method for manufacturing an article, comprising:

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