JP2022176046A - Imprinting method and related imprint system for improving die release stability - Google Patents

Abstract

To provide an imprinting method that does not cause defects in a transfer object.SOLUTION: An imprinting method includes: a process of adding a soluble material into a die; a process of curing the soluble material to form a soluble die core; a process of forming an adhesive 12 on one side of the die core against the die; a process of attaching the adhesive to a die-making device comprising a frame arrangement 51 and a supporting back panel 53 mounted on the frame arrangement and in contact with the adhesive; a process of separating the die-making device from the die; a process of placing the soluble die core 4 in a polymer material layer 61; a process of applying high temperature and pressure to the soluble die core to cure the polymer material layer with a transfer configuration corresponding to an uneven configuration; and a process of obtaining a transfer object 6 having the transfer configuration by providing a solvent to dissolve the soluble die core and separating the polymer material layer after curing and the supporting back panel.SELECTED DRAWING: Figure 3A

Description

The present invention relates to imprinting methods and, more particularly, to imprinting methods and related imprinting systems that use solvents to remove die cores.

So-called "imprinting" uses a mold to form a pattern of imprint material on a substrate. In the thermal imprinting method, a mold is pressed down on a polymer resin heated to above the glass transition temperature and then cooled to below the glass transition temperature, after which the mold is released and the microstructure is transferred to the resin on the substrate. Phys. Lett. 67, 3114 (1995) by S. Chou et al., Thermal imprinting method using a thermoplastic resin as a material to be processed, J. Haisma et al., J. Vac. Sci. Technol. B 14 (6), 4124 (1996) and the like, which provide a curable composition.

U.S. Patent No. 6,849,558B2 U.S. Patent Application Publication No. 2006/0249886A1

S. Y. Chou, P. R. Krauss, and P. J. Renstrom, Appl. Phys. Lett. 67, 3114 (1995) J.Haisma et al, J.Vac.Sci.Technol., B14, 4124 (1996) M. W. Lin et al., J. Micro/Nanolith. MEMS MOEMS 7(3), 033005 (2008) L. Jiang: Journal of Vacuum Science & Technology. B, 21, (2003)

The process of removing the mold from the object to be transferred is called "mold release." Imprinting involves a mold release step, so mold releasability is an important factor affecting mold maintenance and perfection of the transferred structure. According to M. W. Lin et al., J. Micro/Nanolith. MEMS MOEMS 7(3), 033005 (2008), the curable composition contains a fluorine-containing monomer molecule or a non-reactive fluorine-containing compound, Improved releasability. In conventional patent documents, for example, the following patent document 1 and patent document 2 disclose molds that can be dissolved by a solvent. Such soluble molds are obtained by injecting a soluble material into the mold, curing it, and then using a preform to remove the mold from the mold. According to Journal of Vacuum Science & Technology B 21, 2961 (2003), the preform and the soluble material are the same material, and the soluble material is attached to the soluble material before it is fully cured. However, in general, both the concentration and thickness of the soluble material affect cure time, so how far the preform must be cured with the soluble material before it can be applied depends on the expertise and experience of the operator. I relied on my experience.

The so-called "molecular transfer photolithography" involves exposing and developing a photoresist layer to draw a geometric structure, and then transferring the pattern on the photomask to the substrate through an etching process to determine the shape and size of the pattern to be formed. It is an important process in the semiconductor field to precisely control the According to Nanotechnology 24 (2013) 085302 (6pp), the mold is likewise soluble, except that the roller method places the mold uniformly on the object, so that the pitch of the subsequently acquired microstructure is It could expand and transform.

Therefore, the inventor of the present invention thought that the above-mentioned drawbacks could be improved, and as a result of earnest studies, the present inventors came up with the proposal of the present invention that effectively solves the above-mentioned problems with a rational design.

The present invention has been accomplished through extensive research by the inventors in view of the above problems. To provide an imprint method for preventing defects from occurring in an object to be transferred.

In order to solve the above problems, an imprint method according to one aspect of the present invention comprises:
adding a soluble material into the mold;
curing the fusible material to form a fusible die core, the die core having a relief configuration;
forming an adhesive on one side of the mold to the die core;
A step of attaching a molding device to the adhesive, the molding device comprising:
frame structure and
a tape mounted on the frame arrangement;
a support back panel attached to the tape, the molding device contacting the adhesive through the support back panel;
separating the molding device from the mold, wherein the soluble die core is separated from the mold according to the molding device;
placing the fusible die core on a layer of polymeric material;
applying a first elevated temperature and pressure to the fusible die core so that the polymeric material layer has a transfer configuration corresponding to the relief configuration and the support back panel separates from the tape;
applying a second elevated temperature to the fusible die core to cure the polymeric material layer, wherein the first elevated temperature and the second elevated temperature are different;
providing a solvent to dissolve the soluble die core and separating the polymer material layer and the support back panel after curing to obtain a transfer object having the transfer configuration.

Preferably, the first high temperature is higher than the second high temperature, the time for applying the first high temperature is longer than the time for applying the second high temperature, and the time for applying the first high temperature is higher than the second high temperature. equal to the time of application, or the time of applying said first elevated temperature is less than the time of applying said second elevated temperature, or said first elevated temperature is lower than said second elevated temperature and the time of applying said first elevated temperature is longer than the time to apply the second elevated temperature, and the time to apply the first elevated temperature is equal to the time to apply the second elevated temperature, or the time to apply the first elevated temperature is the time to apply the second elevated temperature shorter.

Preferably, the temperature of said first elevated temperature ranges between 60 and 150° C. and the time of applying said first elevated temperature and pressure ranges between 0.5 and 30 minutes.

Preferably, the temperature of said second elevated temperature ranges between 60 and 180° C. and the time for applying said second elevated temperature ranges between 1 and 600 minutes.

Preferably, the soluble die core has a first alignment mark, and the step of placing the die core on the layer of polymeric material includes placing an object to be transferred on the platform, wherein the object to be transferred is aligned with the layer of polymeric material. a substrate layer between the operating platform, the substrate layer being disposed on a side of the mold forming apparatus opposite the fusible die core; Check if the first and second alignment marks are aligned by a camera element or a camera element installed on one side of the console opposite the object to be transferred. until the fusible die core and the polymeric material layer are in contact, if aligned, and align the first countermark and the second countermark, if misaligned. and adjusting the X-axis and Y-axis of the fusible die core and the θ angle at which the fusible die core is in the X-Y plane, with the operation platform being the X-Y plane, wherein the die core is placed on the polymer material layer. Alternatively, the step of placing an object to be transferred on an operating platform, the object to be transferred has a substrate layer between the polymer material layer and the operating platform, the substrate layer having a second countermark. contacting the fusible die core with the polymeric material layer; and the camera element or the console mounted on one side of the mold machine opposite the fusible die core. A camera device installed on one side opposite to the object to be transferred confirms whether the first alignment mark and the second alignment mark are aligned, and not aligned. In this case, the X-axis and Y-axis of the soluble die core and the soluble die core are on the XY plane with the operation platform as the XY plane until the positions of the first and second alignment marks are aligned. and adjusting the θ angle, wherein the step of placing the die core on the polymer material layer or placing an object to be transferred on an operation table, wherein the object to be transferred is the polymer material layer and the having a substrate layer between the operating platform, the substrate layer having a second counterpoint mark; and moving a camera element between the soluble die core and the object to be transferred, verifying whether the first and second alignment marks are aligned; if so, realigning the camera element and repositioning the soluble die core and the polymer material layer; connected to If the positions are not aligned, the X axis and Y axis of the soluble die core and the adjusting the θ angle at which the fusible die core lies in the XY plane.

Preferably, the soluble die core has a first alignment mark, and the step of placing the die core on the layer of polymeric material includes placing an object to be transferred on the platform, wherein the object to be transferred is aligned with the layer of polymeric material. a substrate layer between the operating platform, the operating platform being mounted on a side of the molding apparatus opposite to the fusible die core and the step having a third counterpoint mark; Check if the first and third alignment marks are aligned by a camera element or a camera element installed on one side of the console opposite the object to be transferred. and contacting the fusible die core and the polymeric material layer if aligned and aligning the first countermark and the third countermark if misaligned. and adjusting the X-axis and Y-axis of the fusible die core and the θ angle at which the fusible die core is in the X-Y plane, with the operating platform as the X-Y plane, until the die core is placed on the polymer material layer. Alternatively, the step includes placing an object to be transferred on an operating platform, the object to be transferred has a substrate layer between the polymer material layer and the operating platform, and the operating platform comprises a third countermark contacting the fusible die core with the polymeric material layer; A camera device installed on one side opposite to the object to be transferred confirms whether the first and third alignment marks are aligned, and confirms whether the alignment marks are aligned. If not, move the X-axis and Y-axis of the soluble die core as well as the soluble die core in the XY plane with the operation platform as the XY plane until the positions of the first and third alignment marks are aligned. and adjusting the θ angle, wherein the step of placing the die core on the polymer material layer or placing an object to be transferred on an operation table, wherein the object to be transferred is the polymer material layer and the having a substrate layer between an operating platform, the operating platform having a third counterpoint mark; and moving a camera element between the soluble die core and the object to be transferred, verifying whether the first and third alignment marks are aligned; if so, realigning the camera element and repositioning the soluble die core and the polymer material layer; of If contact is made and the positions are not aligned, the X and Y axes of the fusible die core and the adjusting the θ angle at which the fusible die core lies in the XY plane.

Preferably, the soluble die core has a first alignment mark, and the step of placing the die core on the layer of polymeric material includes placing an object to be transferred on the platform, wherein the object to be transferred is aligned with the layer of polymeric material. a substrate layer between the manipulator and the polymeric material layer having a fourth counterpoint mark; whether the first alignment mark and the fourth alignment mark are aligned by a camera element located on the control platform or a camera element installed on one side of the console opposite the object to be transferred; and contacting the fusible die core and the layer of polymeric material when aligned, and locating the first countermark and the fourth countermark when misaligned. positioning the die core on the polymer material layer until aligned, with the manipulator as the X-Y plane and adjusting the X and Y axes of the fusible die core and the θ angle at which the fusible die core lies in the X-Y plane. Alternatively, the step of placing an object to be transferred on an operating platform, the object to be transferred has a substrate layer between the polymer material layer and the operating platform, and the polymer material layer comprises a fourth pair of contacting the fusible die core with the polymeric material layer; and a camera element or the operation located on a side of the molding apparatus opposite the fusible die core. A camera element installed on one side of the stage opposite to the object to be transferred confirms whether the first alignment mark and the fourth alignment mark are aligned, and the alignment is performed. If not, the X-axis and Y-axis of the fusible die core and the fusible die core are aligned with the X-Y plane with the operation table as the X-Y plane until the positions of the first and fourth alignment marks are aligned. and adjusting the θ angle lying in the plane, wherein the step of placing the die core on the polymer material layer, or placing an object to be transferred on an operation table, wherein the object to be transferred is the polymer material having a substrate layer between the layer and the platform, the polymeric material layer having a fourth counterpoint mark; and moving a camera element between the soluble die core and the object to be transferred. verifying whether the first and fourth alignment marks are aligned by doing; if so, realigning the camera element; and the polymeric material layers are brought into contact and, if misaligned, move the fusible die core in the X-Y plane with the operating platform in the X-Y plane until the first and fourth alignment marks are aligned. adjusting the axis and Y axis and the θ angle at which the fusible die core lies in the X-Y plane.

Preferably, another aspect of the invention is an imprint system. This imprint system
A platform used to position an object to be transferred, a soluble die core, and a molding device, said object to be transferred having a substrate layer and a layer of polymeric material disposed on said substrate layer. , the die core is disposed on the polymer material layer of the object to be transferred and has a relief configuration and a first alignment mark, the molding device is adhered to the die core, and the substrate layer is a second alignment mark; a console having a mark, the console having a third counterpoint mark, or the polymeric material layer having a fourth counterpoint mark;
whether said first and second counterpoint marks are aligned, whether said first and third countermeasure marks are aligned, or said first counterpoint marks a camera element used to ascertain whether the mark and the fourth counterpoint mark are aligned.

Preferably, the first and second countermarks, the first and third countermarks, or the first and fourth countermarks are irradiated with infrared rays. , further comprising an infrared emitting element for ascertaining whether they are aligned.

Preferably, the camera element is mounted on a side of the molding device opposite to the fusible die core or on a side of the console opposite to the object to be transferred; It is positioned to migrate and then relocate between the soluble die core and the object to be transferred.

Thus, according to the present invention, there are the following effects.
Adhering the support back panel to the fusible die core with an adhesive causes the fusible die core to adhere to the fusible die core when the fusible die core separates from the mold and when the fusible die core and the polymeric material layer come into contact or face each other. In separating the frame construction from the support back panel upon application of high temperature or pressure, in separating the frame construction and tapes attached to the frame construction from the support back panel, and the fusible die core. When fusing, the support back panel maintains the structure of the fusible die core in all cases, preventing the fusible die core from shifting or deforming, and eliminating defects in the final imprinted transfer substrate. does not occur.

Other features of the present invention will become apparent from the description of the specification and accompanying drawings.

FIG. 4 is a diagram for explaining step 1 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 1 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 2 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 2 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 2 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 2 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 2 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 2 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 3 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 3 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 3 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 3 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 3 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 3 of the imprint method according to the present invention; FIG. 4 is a diagram for explaining step 3 of the imprint method according to the present invention; It is a figure explaining the process 4 of the imprint method based on this invention. It is a figure explaining the process 4 of the imprint method based on this invention. It is a figure explaining the process 4 of the imprint method based on this invention. It is a figure explaining the process 5 of the imprint method based on this invention. It is a figure explaining the process 5 of the imprint method based on this invention. It is a figure explaining the process 5 of the imprint method based on this invention. It is a figure explaining the process 5 of the imprint method based on this invention.

Embodiments of the present invention will be specifically described below, but the present invention is not limited thereto.

Detailed steps of the imprinting method according to the present invention will be described in detail below with reference to FIGS.

<Step 1>
1A to 1B are diagrams for explaining step 1 of the imprint method according to the present invention. That is, a mold (3) is formed with a soluble die core (4).

Referring to FIG. 1A, first a soluble material (2) is added into a mold (3), which has a mold configuration (31) and a mark configuration (32). The fusible material (2) is then cured to form a fusible die core (4), the die core (4) corresponding to the relief configuration (41) corresponding to the mold configuration (31) and the mark configuration (32). It has counterpoint marks (42). Preferably, said soluble material (2) is water-soluble polyacrylamide (PAM), polyurethane, polyurea, polyamide, polyester, urethane, polyvinylpyrrolidone, ethylene-vinyl alcohol, polyacrylamide-glyoxal polymer, polyacrylic acid, or Selected from, but not limited to, the group consisting of combinations thereof. The thickness of said soluble material (2) in the mold (3) ranges between 10 and 1,000 μm, so that the subsequently obtained die core (4) is not only soluble but also flexible. have. The soluble material (2) is added as a solution into the mold (3) and its concentration ranges between, but not limited to, 5-50 wt% of the solution. If the concentration is below this lower limit, the imperfections of the relief structure (41) will increase, resulting in structural defects and affecting the quality of the imprint. Also, the soluble material (2) is added by spin coating or slot die coating. When spin coating is employed, the rotation speed of spin coating ranges from 100 to 5,000 rpm, but is not limited thereto. Preferably, the material of mold (3) is silicon.

Referring to FIG. 1B, after curing the fusible material (2) to form a fusible die core (4), an adhesive (12) is formed on one side of the fusible die core (4) against the mold (3). do. That is, the method of forming the adhesive (12) can be, but is not limited to, spraying, spreading or tilting. Preferably, said adhesive (12) is uniformly formed on one side of said fusible die core (4) against said mold (3). Preferably, said adhesive (12) is colloidal or liquid, the type of which is a light curing adhesive, a UV curing gel, a Light-to-Heat Conversion (LTHC) gel, a thermosetting gel, or a hydrolyzable Including, but not limited to, resins. The so-called "curing" can be heat curing or light curing (such as ultraviolet curing), when adopting heat curing, the heat curing temperature ranges between room temperature and 160℃, and the heat curing time is between 5 and 60 minutes. range between, but not limited to. If the time exceeds this upper limit, the peeling difficulty of the die core (4) will increase, and defects will be formed in the concave-convex structure (41).

<Step 2>
2A to 2F are diagrams for explaining step 2 of the imprint method according to the present invention. That is, the soluble die core (4) is detached from the mold (3).

A first embodiment of the invention is shown in FIGS. 2A to 2C. Firstly, a molding device (5) is provided and the molding device (5) is attached to the adhesive (12). Said molding device (5) comprises a frame arrangement (51) and a supporting back panel (53) mounted on said frame arrangement (51). A second embodiment of the invention is shown in Figures 2D to 2F. Firstly, a molding device (5) is provided and the molding device (5) is attached to the adhesive (12). Said molding device (5) comprises a frame arrangement (51), a tape (52) placed on said frame arrangement (51) and a supporting back panel (53) placed on said tape (52). , is equipped with Preferably, said molding device (5) is attached to said adhesive (12) by said supporting back panel (53), said supporting back panel (53) and said fusible die core (4) being attached to said adhesive (12). is attached by Preferably, said frame structure (51) is an annular frame, said annular frame (51) having a support (511) and an operating part (512) connected to the support (511). Preferably, said support back panel (53) or said tape (52) is mounted on said operating part (512). Preferably, the area of said support back panel (53) is capable of completely covering the area of said adhesive (12) so that said fusible die core (4) is intimately adhered to said support back panel (53) and said To prevent deviations and errors due to vibration when the fusible die core (4) is moved relative to said mold (3). Preferably, the material of the tape (52) is thermally releasable foam gel or UV releasable foam gel, but not limited thereto. Preferably, the thermally dissociable foamed gel is polystyrene, polyurethane gel (PU) or polystyrene (PS) and its thickness ranges between 100 and 1,000 μm. Preferably, said tape (52) has a protrusion (521) and said tape (52) is mounted on said operating portion (512) of said frame arrangement (51) by said protrusion (521). Preferably, said supporting back panel (53) has a protrusion (521), and said supporting back panel (53) is mounted on said operating part (512) of said frame arrangement (51) by said protrusion (521). ing.

Then, when the molding device (5) is moved, the die core moves relative to the mold (3) according to the molding device (5), and the die core separates from the mold (3). Preferably, when peeling the fusible die core (4) from the mold (3), the operating part (512) of the annular frame (51) is operated so as to peel in the positive or lateral direction.

<Step 3>
3A to 3G are diagrams for explaining step 3 of the imprint method according to the present invention. That is, the soluble die core (4) is placed on the polymer material layer (61).

Referring to FIGS. 3A and 3B, in one embodiment, the substrate layer (62) of the object to be transferred (6) is first placed on the console (7), and the substrate layer (62) is placed in second counterpoint. It has a mark (621). A polymer material layer (61) is then formed on the substrate layer (62). Then the camera element (8) placed on one side of the molder (5) opposite the fusible die core (4) or opposite the object to be transferred (6) on the console (7) Whether the first alignment mark (42) of the die core (4) and the second alignment mark (621) of the substrate layer (62) are aligned with the camera element (8) installed on one side. Confirm. When aligned, the fusible die core (4) and polymeric material layer (61) are brought into contact and subsequent steps are performed. If misaligned, the X and Y axis positions of the die core (4) and the die core (4) with the console (7) in the X-Y plane using the alignment element (9) until alignment is achieved. 4) adjusts the θ angle in the XY plane. Referring to Figures 3C and 3D, in another embodiment, the substrate layer (62) of the object to be transferred (6) is first placed on the console (7), and the substrate layer (62) is placed on the second counterpoint mark. (621). A polymer material layer (61) is then formed on the substrate layer (62). Then, after contacting the fusible die core (4) and the polymer material layer (61), a camera element (8) placed on one side opposite the fusible die core (4) of the molding device (5) or A first alignment mark (42) of the die core (4) and the substrate layer (62) are captured by a camera element (8) located on one side of the console (7) opposite the object to be transferred (6). ) are aligned. If aligned, perform subsequent steps. If misaligned, the X and Y axis positions of the die core (4) and the die core (4) with the console (7) in the X-Y plane using the alignment element (9) until alignment is achieved. 4) adjusts the θ angle in the XY plane. Referring to FIG. 3E, in another embodiment, the substrate layer (62) of the object to be transferred (6) is first placed on the console (7), and the substrate layer (62) is placed on the second countermark (621). )have. Then, after forming the polymer material layer (61) on the substrate layer (62), the first pair of Check if the position mark (42) and the second counterpoint mark (621) are aligned. When aligned, the camera element (8) is replaced and the fusible die core (4) and polymer material layer (61) are brought into contact and subsequent steps are performed. If misaligned, the X and Y axis positions of the die core (4) and the die core (4) with the console (7) in the X-Y plane using the alignment element (9) until alignment is achieved. 4) adjusts the θ angle in the XY plane.

Referring to FIG. 3F, in one embodiment, first, the substrate layer (62) of the object to be transferred (6) is placed on the console (7), and the console (7) is aligned with the third counterpoint mark (71). have. Then, after forming the polymer material layer (61) on the substrate layer (62), the camera element (8) or the operating A first alignment mark (42) of the die core (4) and the operating platform (7) are captured by a camera element (8) located on one side of the platform (7) opposite the object to be transferred (6). is aligned with the third counterpoint mark (71). When aligned, the fusible die core (4) and polymeric material layer (61) are brought into contact and subsequent steps are performed. If misaligned, the X and Y axis positions of the die core (4) and the die core (4) with the console (7) in the X-Y plane using the alignment element (9) until alignment is achieved. 4) adjusts the θ angle in the XY plane. In another embodiment, first the substrate layer (62) of the object (6) to be transferred is placed on the console (7), the console (7) having a third counterpoint mark (71). Then, after forming the polymer material layer (61) on the substrate layer (62), the soluble die core (4) and the polymer material layer (61) are brought into contact. Then the camera element (8) placed on one side of the molder (5) opposite the fusible die core (4) or opposite the object to be transferred (6) on the console (7) Whether the first alignment mark (42) of the die core (4) and the third alignment mark (71) of the console (7) are aligned by the camera element (8) installed on one side. Confirm. If aligned, perform subsequent steps. If misaligned, the X and Y axis positions of the die core (4) and the die core (4) with the console (7) in the X-Y plane using the alignment element (9) until alignment is achieved. 4) adjusts the θ angle in the XY plane. In another embodiment, first the substrate layer (62) of the object (6) to be transferred is placed on the operating table (7), the operating table (7) having a third counterpoint mark (71). Then, after forming the polymer material layer (61) on the substrate layer (62), the first pair of Check if the position mark (42) and the third counterpoint mark (71) are aligned. When aligned, the camera element (8) is replaced and the fusible die core (4) and polymer material layer (61) are brought into contact and subsequent steps are performed. If misaligned, the X and Y axis positions of the die core (4) and the die core (4) with the console (7) in the X-Y plane using the alignment element (9) until alignment is achieved. 4) adjusts the θ angle in the XY plane.

Referring to FIG. 3G, in one embodiment, the substrate layer (62) of the object to be transferred (6) is first placed on the console (7). A polymer material layer (61) is then formed on the substrate layer (62), the polymer material layer (61) having a fourth counterpoint mark (611). Then the camera element (8) placed on one side of the molder (5) opposite the fusible die core (4) or opposite the object to be transferred (6) on the console (7) A camera element (8) installed on one side aligns the first alignment mark (42) of the die core (4) and the fourth alignment mark (611) of the polymer material layer (61). Please confirm. When aligned, the fusible die core (4) and polymeric material layer (61) are brought into contact and subsequent steps are performed. If misaligned, the X and Y axis positions of the die core (4) and the die core (4) with the console (7) in the X-Y plane using the alignment element (9) until alignment is achieved. 4) adjusts the θ angle in the XY plane. In another embodiment, the substrate layer (62) of the object (6) to be transferred is first placed on the console (7). A polymer material layer (61) is then formed on the substrate layer (62), the polymer material layer (61) having a fourth counterpoint mark (611). Then, after contacting the fusible die core (4) and the polymer material layer (61), a camera element (8) placed on one side opposite the fusible die core (4) of the molding device (5) or A camera element (8) located on one side of the console (7) opposite the object to be transferred (6) captures the first alignment mark (42) of the die core (4) and the polymer material layer ( Check if the fourth counterpoint mark (611) of 61) is aligned. If aligned, perform subsequent steps. If misaligned, the X and Y axis positions of the die core (4) and the die core (4) with the console (7) in the X-Y plane using the alignment element (9) until alignment is achieved. 4) adjusts the θ angle in the XY plane. In another embodiment, the substrate layer (62) of the object (6) to be transferred is first placed on the console (7). A polymer material layer (61) is then formed on the substrate layer (62), the polymer material layer (61) having a fourth counterpoint mark (611). Then, by moving the camera element (8) between the soluble die core (4) and the object to be transferred (6), the first counter mark (42) and the fourth counter mark (611) are positioned. Check if they are aligned. When aligned, the camera element (8) is replaced and the fusible die core (4) and polymer material layer (61) are brought into contact and subsequent steps are performed. If misaligned, the X and Y axis positions of the die core (4) and the die core (4) with the console (7) in the X-Y plane using the alignment element (9) until alignment is achieved. 4) adjusts the θ angle in the XY plane.

Preferably, the polymer material layer (61) is obtained by spin-coating a polymer material having a lower glass transition temperature than the die core (4) on the substrate layer (62). Alternatively, first, a polymer material having a glass transition temperature lower than that of the die core (4) is formed on the substrate layer (62) by spin coating, followed by soft baking. Preferably, the glass transition temperature of the polymeric material ranges between 20-150° C., the spin-coating rotation speed ranges between 1,000-5,000 rpm, and the applied thickness ranges between 0.05-1,000 μm. Range. Incidentally, whether or not a polymer material can be soft-baked depends on the properties of the material. Preferably, the softbake temperature ranges between 80-150°C and the softbake time ranges between 3-5 minutes. Other than the spin coating method, the polymer material layer (61) may be formed on the substrate layer (62) by a patch compression molding method using a film attachment member (not shown). Said second counter mark (621) is provided on the surface of the substrate layer (62) facing away from the soluble die core (4) or on the surface facing away from the console (7). The first countermark (42) and the second Since the substrate layer (62) may interfere with the camera element (8) that captures the image of the counterpoint mark (621), the substrate layer (62) has the second counterpoint mark (621) exposed. through hole (622) is further opened. Further, the substrate layer (62) is preferably a transparent substrate layer in order to capture images of the first counterpoint mark (42) and the second countermark (621) by the camera element (8). Said third counterpoint mark (71) is provided on the console (7). To avoid interference of the substrate layer (62) with the camera element (8) that captures images of the first and third countermarks (42) and the third countermark (71), the substrate layer (62) has a third A through hole (622) may also be drilled to expose the counterpoint mark (71). Also, the substrate layer (62) is preferably a transparent substrate layer for capturing images of the first counterpoint mark (42) and the third countermark (71) by the camera element (8). Said fourth counterpoint mark (611) is provided on the surface of the polymer material layer (61) opposite to the soluble die core (4), or the polymer material layer (61) is opposite to the operating platform (7) provided on the surface. When the fourth countermark (611) of the polymer material layer (61) is provided on the opposite surface of the soluble die core (4), the polymer material layer (61) is aligned with the first countermark (42) and the fourth countermark (42). It may interfere with the camera element (8) that captures the image of the counterpoint mark (611), thus the polymer material layer (61) has a through hole ( 622) may also be opened. Also, the polymer material layer (61) is preferably a transparent polymer material layer for capturing images of the first counterpoint mark (42) and the fourth countermark (611) by the camera element (8).

Also, in order to avoid lack of resolution due to reflected light noise when the camera element (8) captures images of the first counterpoint mark (42) and the second countermark (621), the infrared radiation The element (10) is further used to illuminate the first counter mark (42) and the second counter mark (621). In order to avoid lack of resolution due to noise in the reflected rays when the camera element (8) captures images of the first counterpoint mark (42) and the third countermark (71), an infrared emitting element ( 10) is also used to illuminate the first countermark (42) and the third countermark (71). In order to avoid lack of resolution due to reflected light noise when the camera element (8) captures images of the first counterpoint mark (42) and the fourth countermark (611), an infrared emitting element ( 10) is further used to illuminate the first countermark (42) and the fourth countermark (611). The infrared emitting element (10) is placed on one side of the molding device (5) opposite the fusible die core (4) or on one side of the operating platform (7) opposite the object to be transferred (6). but not limited to.

The difference between the embodiment shown in FIG. 3F and the embodiment shown in FIGS. 3A to 3E is that the position of the counterpoint mark is different, and other operational details and effects are almost the same. omitted. The difference between the embodiment shown in FIG. 3G and the embodiment shown in FIGS. 3A-3F is that the position of the counterpoint mark and the through hole (622) is different, and other operational details and effects are substantially the same. , the description of which is omitted here.

<Step 4>
4A to 4C are diagrams for explaining step 4 of the imprint method according to the present invention. That is, applying high temperature or pressure to the fusible die core (4) to cure the polymer material layer (61).

FIG. 4A illustrates a first embodiment of this process wherein the transfer element (20) applies high temperature and pressure to the fusible die core (4) such that the polymeric material layer (61) conforms to the relief features (41). It has a transfer arrangement (11) and separates said frame arrangement (51) to said supporting back panel (53) after curing of the polymer material layer (61). The supporting back panel (53) is stable to the fusible die core (4) after curing of the polymeric material layer (61) and upon separation of the frame arrangement (51) relative to the supporting back panel (53). and stably maintains the structure of the soluble die core (4). Also, the first countermark (42) does not shift and affect the shape of the polymer material layer (61). Specifically, before the mold device (5) and said polymeric material layer (61) come into contact, until the curing process of said polymeric material and separating said frame arrangement (51) relative to said supporting back panel (53). After that, the support back panel (53) is stably attached to the fusible die core (4) to maintain its structure stably. In one embodiment, the molding device (5) comprises a frame arrangement (51) and a supporting back panel (53). Preferably, said high temperature first causes the temperature of the polymer material layer (61) to reach the glass transition temperature, and after the pressure causes the material of the polymer material layer (61) to flow sufficiently into the relief structure (41), the high temperature causes the polymer material to The material of the layer (61) hardens and the transfer configuration (11) of the polymer material layer (61) corresponds perfectly to the relief configuration (41). Preferably, but not limited to, the time of application of elevated temperature and pressure ranges between 1 and 20 minutes. Preferably, the elevated temperature ranges between 50 and 160°C, but is not so limited. Incidentally, the range of time to apply high temperature and pressure and the range of temperature of high temperature are determined based on the material of the polymer material layer (61). Overall, the principle is that the upper portion of the polymer material layer (61) is non-dissolvable and does not introduce structural defects into the transfer structure (11). The application of pressure may also be applied in a positive direction to the side of the fusible die core (4) opposite the polymeric material layer (61) or adjacent to the polymeric material layer (61) of the fusible die core (4). Apply negative pressure to one side, or apply positive and negative pressure simultaneously. Preferably, but not limited to, the positive pressure ranges between +20 and +600 kPa and the negative pressure ranges between -10 and -101.3 kPa. Incidentally, by extracting the volatile solvent that receives heat and dissipates in the polymer material layer (61) due to the pressure in the negative direction, it remains in the polymer material layer (61) and causes structural defects in the transferred structure (11). I am trying to prevent this from happening. Also, as shown in Figure 4A, the transfer element (20) includes, but is not limited to, a heating element (201) for providing high temperature and a blowing element (202) for providing pressure.

4B and 4C illustrate a second embodiment of this process. As shown in FIG. 4B, a transfer element (20) applies a first elevated temperature and pressure to the fusible die core (4) such that the polymer material layer (61) is transferred to a transfer configuration (11) corresponding to the relief configuration (41). and separating the support back panel (53) and the tape (52). Specifically, the mold device (5) comprises a frame structure (51) and a tape (52), and the material of the tape (52) is a thermally dissociable foamed gel, the dissociation temperature of the tape (52) ( (preferably 80 to 150° C.) is lower than the temperature of the first high temperature, so that the tape (52) is dissociated and decomposed at the temperature of the first high temperature. Also, the first elevated temperature causes the temperature of the polymer material layer (61) to first reach the glass transition temperature, and the pressure causes the material of the polymer material layer (61) to flow sufficiently into the relief structure (41). Preferably, but not limited to, the duration of applying the first elevated temperature and pressure ranges between 0.5 and 30 minutes. Preferably, the temperature of the first elevated temperature is 60-150°C, but is not limited thereto. Incidentally, the range of time for applying the first high temperature and pressure and the range of temperature of the first high temperature are determined based on the material of the polymer material layer (61). Overall, the principle is that the top of the polymer material layer (61) is non-dissolvable so that the transfer arrangement (11) does not introduce structural defects. The application of pressure may also be applied in a positive direction to the side of the fusible die core (4) opposite the polymeric material layer (61) or adjacent to the polymeric material layer (61) of the fusible die core (4). Apply negative pressure to one side, or apply positive and negative pressure simultaneously. Preferably, but not limited to, the positive pressure ranges between +20 and +600 kPa and the negative pressure ranges between -10 and -101.3 kPa. Incidentally, by extracting the volatile solvent that receives heat and dissipates in the polymer material layer (61) due to the pressure in the negative direction, it remains in the polymer material layer (61) and the transferred structure (11) eliminates structural defects. I am trying to prevent this from happening. More preferably, the transfer element (20) comprises, but is not limited to, a heating element (201) for providing the first elevated temperature and a blowing element (202) for providing pressure.

As shown in Figure 4C, the polymer material layer (61) is cured by applying a second elevated temperature to the fusible die core (4) by the transfer element (20). Specifically, the second elevated temperature causes the temperature of the polymer material layer (61) to reach the curing temperature, cross-linking and curing the material. This reduces the elasticity of the polymer material layer (61) so that the transfer configuration (11) of the polymer material layer (61) perfectly corresponds to the uneven configuration (41). Preferably, but not limited to, the time for applying the second elevated temperature ranges between 1 and 600 minutes. Preferably, but not limited to, the temperature of the second elevated temperature ranges between 60-180°C. This step is especially performed when the material of the polymer material layer (61) is a thermosetting resin (eg, epoxy resin). Specifically, this step prevents deformation of the polymeric material layer (61) placed in a temperature environment below the second elevated temperature. More preferably, the second elevated temperature is provided by a heating element (201) of the transfer element (20). That is, the supporting back panel (53) is in all cases intimately adhered to the fusible die core (4) during the process of applying the first and second elevated temperatures, and the fusible die core (4) becomes structural during the heating process. maintains stability and does not cause deviation or deformation. That is, the polymer material layer (61) is cured by a method of low temperature and long heating time, so that the first high temperature is higher than the second high temperature. Preferably, the first high temperature is higher than the second high temperature, the time for applying the first high temperature is longer than the time for applying the second high temperature, and the time for applying the first high temperature is higher than the second high temperature. or the time of applying the first elevated temperature is less than the time of applying the second elevated temperature, or the first elevated temperature is lower than the second elevated temperature, and the time of applying the first elevated temperature is longer than the time of applying the second elevated temperature, and the time of applying the first elevated temperature is equal to the time of applying the second elevated temperature, or the time of applying the first elevated temperature is greater than the time of applying the second elevated temperature. short.

<Step 5>
5A to 5D are diagrams for explaining step 5 of the imprint method according to the present invention. That is, the solvent (301) dissolves the fusible die core and separates the polymer material layer (61) and the supporting back panel (53) after curing.

As shown in Figures 5A-5D, a solvent (301) is provided by a dissolving element (30) to dissolve the fusible die core (4), and after curing said polymeric material layer (61) and support back panel (53). is separated to obtain a transfer object (1) having a transfer configuration (11). Incidentally, the type of solvent (301) is determined based on the material of the soluble die core (4). Preferably, the material of the soluble die core (4) is water-soluble polyacrylamide (PAM), polyurethane, polyurea, polyamide, polyester, urethane, polyvinylpyrrolidone, ethylene-vinyl alcohol, polyacrylamide-glyoxal polymer, or polyacrylic acid. In some situations, the solvent (301) is water, but is not limited to this.

Dissolving the fusible die core (4) with a solvent (301) on the console (7) and separating the cured polymeric material layer (61) and supporting back panel (53). Preferably, after the step of curing the layer of polymeric material (61) and before the step of dissolving the fusible die core (4), the frame arrangement (51) is separated from the supporting back panel (53). Preferably, after the step of curing the layer of polymeric material (61) and before the step of dissolving the fusible die core (4), said frame arrangement (51) and a tape (52) placed on said frame arrangement (51) to said supporting back panel (53). Preferably, the dissolution of the soluble die core (4) with the solvent (301) is carried out on the operation console (7), but it may be carried out in an area other than the operation console (7). Specifically, the substrate layer (62) and the cured polymeric material layer (61) applied to said substrate layer (62), the soluble die core (4), and the supporting back panel (53) are combined with a solvent ( 301), the solvent (301) dissolves the soluble die core (4), separates the cured polymer material layer (61) and the supporting back panel (53), and the transfer structure (11 ) is obtained.

Said supporting back panel (53) is adhered to said fusible die core (4) by adhesive (12) so that when said fusible die core (4) and said mold (3) are separated, said fusible die core (4) ) and said polymeric material layers (61) are brought into contact or opposed, applying high temperature or pressure to said fusible die core (4), frame arrangement (51) against supporting back panel (53). in separating the frame arrangement (51) and the tape (52) installed on said frame arrangement (51) against said support back panel (53) and dissolving said fusible die core (4); In doing so, the supporting back panel (53) maintained the structure of the fusible die core (4) in all cases, no shifting or deformation of the fusible die core (4) and finally imprinted. No defect occurs in the transfer object (1).

The invention may be embodied in many other forms without departing from its spirit or essential characteristics. Therefore, the above-described embodiments are merely examples in every respect and should not be construed in a restrictive manner. The scope of the present invention is indicated by the claims and is not restricted by the text of the specification. Furthermore, all modifications and changes within the equivalent scope of claims are within the scope of the present invention.

REFERENCE SIGNS LIST 1 Transfer object 11 Transfer structure 12 Adhesive 2 Soluble material 3 Mold 31 Mold structure 32 Mark structure 4 Soluble die core 41 Concavo-convex structure 42 First position mark 5 Mold taking device 51 Frame structure 511 Supporting part 512 Operating part 52 Tape 521 Protrusion Part 53 support back panel 6 object to be transferred 61 polymer material layer 62 substrate layer 621 second counterpoint mark 622 through hole 7 operating base 71 third counterpoint mark 8 camera element 9 alignment element 10 infrared radiation element 20 transfer element 201 Heating Element 202 Blow Element 30 Melting Element 301 Solvent 4 Soluble Die Core 42 First Counterpoint Mark 51 Frame Configuration 53 Supporting Back Panel 6 Object to be Transferred 61 Polymeric Material Layer 62 Substrate Layer 621 Second Counterpoint Mark 622 Through Hole 7 Operation Base 8 camera element 9 position adjustment element 10 infrared radiation element

Claims (9)

adding a soluble material into the mold;
curing the fusible material to form a fusible die core, the die core having a relief configuration;
forming an adhesive on one side of the mold to the die core;
A step of attaching a molding device to the adhesive, the molding device comprising:
frame structure and
a tape mounted on the frame arrangement;
a support back panel attached to the tape, the molding device contacting the adhesive through the support back panel;
separating the molding device from the mold, wherein the soluble die core is separated from the mold according to the molding device;
placing the fusible die core on a layer of polymeric material;
applying a first elevated temperature and pressure to the fusible die core so that the polymeric material layer has a transfer configuration corresponding to the relief configuration and the support back panel separates from the tape;
applying a second elevated temperature to the fusible die core to cure the polymeric material layer, wherein the first elevated temperature and the second elevated temperature are different;
providing a solvent to dissolve the soluble die core and separating the cured polymeric material layer and the support back panel to obtain a transfer object having the transfer configuration. imprint method. The temperature of the first high temperature ranges between 60 and 150° C., and the time for applying the first high temperature and pressure ranges between 0.5 and 30 minutes,
The temperature of the second high temperature is in the range of 60 to 180 ° C., the time for applying the second high temperature is in the range of 1 to 600 minutes,
The first high temperature is higher than the second high temperature, the time for applying the first high temperature is longer than the time for applying the second high temperature, and the time for applying the first high temperature is the time for applying the second high temperature. or the time for applying the first elevated temperature is shorter than the time for applying the second elevated temperature. The temperature of the first high temperature ranges between 60 and 150° C., and the time for applying the first high temperature and pressure ranges between 0.5 and 30 minutes,
The temperature of the second high temperature is in the range of 60 to 180 ° C., the time for applying the second high temperature is in the range of 1 to 600 minutes,
The first high temperature is lower than the second high temperature, the time for applying the first high temperature is longer than the time for applying the second high temperature, and the time for applying the first high temperature is the time for applying the second high temperature. or the time for applying the first high temperature is shorter than the time for applying the second high temperature. The fusible die core has a first counterpoint mark, and the step of placing the die core on the layer of polymeric material comprises:
placing an object to be transferred on a console, said object to be transferred having a substrate layer between said polymer material layer and said console, said substrate layer having a second counterpoint mark; and
A camera element installed on one side of the molding device opposite to the fusible die core or a camera element installed on one side of the operation platform opposite to the object to be transferred allows the first checking whether the counterpoint mark and the second counterpoint mark are aligned;
until the fusible die core and the polymeric material layer are in contact if aligned, and until the first and second countermarks are aligned if misaligned. as an X-Y plane and adjusting the X-axis and Y-axis of the fusible die core and the θ angle at which the fusible die core is in the X-Y plane;
The step of disposing the die core on the layer of polymeric material, or
placing an object to be transferred on a console, said object to be transferred having a substrate layer between said polymeric material layer and said console, said substrate layer having a second counterpoint mark; When,
contacting the soluble die core and the polymeric material layer;
By a camera element installed on one side of the molding device opposite to the fusible die core or a camera element installed on one side of the operation platform opposite to the object to be transferred, the first Check if the one-position mark and the second position-mark are aligned, and if not, continue until the first and second position-marks are aligned. and adjusting the X-axis and Y-axis of the soluble die core and the θ angle in which the soluble die core is in the XY plane, with the operation table as the XY plane;
The step of disposing the die core on the layer of polymeric material, or
placing an object to be transferred on a console, said object to be transferred having a substrate layer between said polymeric material layer and said console, said substrate layer having a second counterpoint mark; When,
verifying that the first and second countermarks are aligned by moving a camera element between the soluble die core and the object to be transferred;
If aligned, reposition the camera element and bring the fusible die core and the polymeric material layer into contact; if misaligned, replace the first and second alignment marks. and adjusting the X-axis and Y-axis of the fusible die core and the θ angle at which the fusible die core lies on the X-Y plane with the operation platform in the X-Y plane until the positions are aligned. The imprinting method according to claim 1. The fusible die core has a first counterpoint mark, and the step of placing the die core on the layer of polymeric material comprises:
placing an object to be transferred on a console, the object to be transferred having a substrate layer between the polymer material layer and the console, the console having a third counterpoint mark; and
By a camera element installed on one side of the molding device opposite to the fusible die core or a camera element installed on one side of the operation platform opposite to the object to be transferred, the first verifying if the one-point mark and the third point-point mark are aligned;
The operation is continued until the fusible die core and the polymeric material layer are in contact, if aligned, or until the first and third countermarks are aligned, if unaligned. adjusting the X-axis and Y-axis of the fusible die core and the θ angle at which the fusible die core is in the X-Y plane, with the table set in the X-Y plane;
The step of disposing the die core on the layer of polymeric material, or
placing an object to be transferred on an operating platform, said object to be transferred having a substrate layer between said polymer material layer and said operating platform, said operating platform having a third counterpoint mark; When,
contacting the soluble die core and the polymeric material layer;
By a camera element installed on one side of the molding device opposite to the fusible die core or a camera element installed on one side of the operation platform opposite to the object to be transferred, the first Check if the one-point mark and the third point-point mark are aligned, and if not, repeat the steps until the first point-point mark and the third point-point mark are aligned. and adjusting the X-axis and Y-axis of the soluble die core and the θ angle in which the soluble die core is in the XY plane, with the operation table as the XY plane;
The step of disposing the die core on the layer of polymeric material, or
placing an object to be transferred on an operating platform, said object to be transferred having a substrate layer between said polymer material layer and said operating platform, said operating platform having a third counterpoint mark; When,
determining whether the first and third countermarks are aligned by moving a camera element between the soluble die core and the object to be transferred;
If aligned, reposition the camera element and bring the fusible die core and the polymeric material layer into contact; if not aligned, replace the first and third countermarks. and adjusting the X-axis and Y-axis of the fusible die core and the θ angle at which the fusible die core lies on the X-Y plane with the operation platform in the X-Y plane until the positions are aligned. The imprinting method according to claim 1. The fusible die core has a first counterpoint mark, and the step of placing the die core on the layer of polymeric material comprises:
An object to be transferred is placed on an operating table, the object to be transferred has a substrate layer between the polymer material layer and the operating table, and the polymer material layer has a fourth counterpoint mark. and
By a camera element installed on one side of the molding device opposite to the fusible die core or a camera element installed on one side of the operation platform opposite to the object to be transferred, the first verifying whether the one-point mark and the fourth point-point mark are aligned;
The operation is continued until the fusible die core and the polymeric material layer are in contact, if aligned, and that the first and fourth countermarks are aligned, if misaligned. adjusting the X-axis and Y-axis of the fusible die core and the θ angle at which the fusible die core is in the X-Y plane, with the table set in the X-Y plane;
The step of disposing the die core on the layer of polymeric material, or
An object to be transferred is placed on an operating table, the object to be transferred has a substrate layer between the polymer material layer and the operating table, and the polymer material layer has a fourth counterpoint mark. process and
contacting the soluble die core and the polymeric material layer;
By a camera element installed on one side of the molding device opposite to the fusible die core or a camera element installed on one side of the operation platform opposite to the object to be transferred, the first Check if the one position mark and the fourth position mark are aligned, and if not, repeat the steps until the first position mark and the fourth position mark are aligned. and adjusting the X-axis and Y-axis of the soluble die core and the θ angle in which the soluble die core is in the XY plane, with the operation table as the XY plane;
The step of disposing the die core on the layer of polymeric material, or
An object to be transferred is placed on an operating table, the object to be transferred has a substrate layer between the polymer material layer and the operating table, and the polymer material layer has a fourth counterpoint mark. process and
verifying that the first and fourth countermarks are aligned by moving a camera element between the soluble die core and the object to be transferred;
If aligned, reposition the camera element and bring the fusible die core and the polymeric material layer into contact; if not aligned, remove the first and fourth alignment marks. and adjusting the X-axis and Y-axis of the fusible die core and the θ angle at which the fusible die core lies on the X-Y plane with the operation platform in the X-Y plane until the positions are aligned. The imprinting method according to claim 1. An infrared emitting element is used to avoid lack of resolution due to reflected light noise when the camera element captures images of the first and second countermarks. 5. The imprinting method according to claim 4, further comprising the step of irradiating the one-position mark and the second one-position mark. In order to avoid lack of resolution due to noise in reflected light rays when the camera device captures images of the first and third countermarks, an infrared radiating device is used for the third countermark. 6. The imprinting method according to claim 5, further comprising the step of irradiating the one-position mark and the third one-position mark. Infrared emitting elements are used to avoid lack of resolution due to reflected light noise when the camera elements capture images of the first and fourth countermarks. 7. The imprinting method according to claim 6, further comprising the step of irradiating the one-position mark and the fourth counter-position mark.

Images