TWI753387B - 負型感光性樹脂組合物、聚醯亞胺之製造方法及硬化浮凸圖案之製造方法 - Google Patents

負型感光性樹脂組合物、聚醯亞胺之製造方法及硬化浮凸圖案之製造方法 Download PDF

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Publication number
TWI753387B
TWI753387B TW109109998A TW109109998A TWI753387B TW I753387 B TWI753387 B TW I753387B TW 109109998 A TW109109998 A TW 109109998A TW 109109998 A TW109109998 A TW 109109998A TW I753387 B TWI753387 B TW I753387B
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TW
Taiwan
Prior art keywords
photosensitive resin
group
resin composition
general formula
negative photosensitive
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TW109109998A
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English (en)
Chinese (zh)
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TW202039638A (zh
Inventor
坂田勇男
藤岡孝亘
平田竜也
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日商旭化成股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW109109998A 2019-04-09 2020-03-25 負型感光性樹脂組合物、聚醯亞胺之製造方法及硬化浮凸圖案之製造方法 TWI753387B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-074130 2019-04-09
JP2019074130 2019-04-09

Publications (2)

Publication Number Publication Date
TW202039638A TW202039638A (zh) 2020-11-01
TWI753387B true TWI753387B (zh) 2022-01-21

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TW109109998A TWI753387B (zh) 2019-04-09 2020-03-25 負型感光性樹脂組合物、聚醯亞胺之製造方法及硬化浮凸圖案之製造方法

Country Status (3)

Country Link
JP (2) JP7592393B2 (enrdf_load_stackoverflow)
KR (1) KR102456730B1 (enrdf_load_stackoverflow)
TW (1) TWI753387B (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115536841B (zh) * 2022-10-24 2023-09-15 广东粤港澳大湾区黄埔材料研究院 负性光敏树脂及其制备方法与应用
CN116482933A (zh) * 2023-03-31 2023-07-25 深圳先进电子材料国际创新研究院 一种负型感光性聚酰亚胺前体树脂组合物
CN116909100B (zh) * 2023-04-19 2024-03-19 深圳先进电子材料国际创新研究院 一种光敏聚酰亚胺前体组合物
CN118915391B (zh) * 2024-07-19 2025-04-01 波米科技有限公司 一种含氮杂环聚硅氧烷的感光性树脂组合物及其应用

Citations (3)

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TW200821340A (en) * 2006-08-22 2008-05-16 Shinetsu Chemical Co Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition
TW201710789A (zh) * 2015-08-31 2017-03-16 Fujifilm Corp 感光性組成物、硬化膜的製造方法、液晶顯示裝置的製造方法、有機電激發光顯示裝置的製造方法以及觸控面板的製造方法
TW201740198A (zh) * 2016-03-31 2017-11-16 Asahi Chemical Ind 感光性樹脂組合物、硬化浮凸圖案之製造方法及半導體裝置

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JPH09127695A (ja) * 1995-10-31 1997-05-16 Sumitomo Bakelite Co Ltd 感光性樹脂組成物及びそのパターン形成方法
JP2000122299A (ja) * 1998-10-12 2000-04-28 Hitachi Ltd ポリイミド前駆体組成物およびそれを用いたパターン形成方法
JP2001338947A (ja) 2000-05-26 2001-12-07 Nec Corp フリップチップ型半導体装置及びその製造方法
JP2009294538A (ja) * 2008-06-06 2009-12-17 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性エレメント
JP5415861B2 (ja) * 2009-07-29 2014-02-12 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、パターン形成方法、及び半導体装置
JP2014145957A (ja) * 2013-01-30 2014-08-14 Hitachi Chemical Dupont Microsystems Ltd ネガ型感光性樹脂組成物、及びそれを用いたパターン硬化膜の製造方法及び電子部品
JP5613851B1 (ja) * 2014-02-28 2014-10-29 Jsr株式会社 表示又は照明装置
WO2017002859A1 (ja) * 2015-06-30 2017-01-05 富士フイルム株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス
WO2017131037A1 (ja) * 2016-01-29 2017-08-03 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法、および半導体デバイス
WO2017159543A1 (ja) * 2016-03-15 2017-09-21 東レ株式会社 感光性樹脂組成物、硬化膜、積層体、タッチパネル用部材及び硬化膜の製造方法
KR102373030B1 (ko) * 2016-03-28 2022-03-11 도레이 카부시키가이샤 감광성 수지 조성물
JP6764480B2 (ja) * 2016-08-25 2020-09-30 富士フイルム株式会社 膜の製造方法、積層体の製造方法および電子デバイスの製造方法
JP7062899B2 (ja) * 2017-09-15 2022-05-09 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200821340A (en) * 2006-08-22 2008-05-16 Shinetsu Chemical Co Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition
TW201710789A (zh) * 2015-08-31 2017-03-16 Fujifilm Corp 感光性組成物、硬化膜的製造方法、液晶顯示裝置的製造方法、有機電激發光顯示裝置的製造方法以及觸控面板的製造方法
TW201740198A (zh) * 2016-03-31 2017-11-16 Asahi Chemical Ind 感光性樹脂組合物、硬化浮凸圖案之製造方法及半導體裝置

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KR20200119202A (ko) 2020-10-19
TW202039638A (zh) 2020-11-01
JP7592393B2 (ja) 2024-12-02
JP2024161571A (ja) 2024-11-19
JP2020173431A (ja) 2020-10-22
KR102456730B1 (ko) 2022-10-19

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