TWI747029B - 檢測系統及方法 - Google Patents

檢測系統及方法 Download PDF

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Publication number
TWI747029B
TWI747029B TW108129868A TW108129868A TWI747029B TW I747029 B TWI747029 B TW I747029B TW 108129868 A TW108129868 A TW 108129868A TW 108129868 A TW108129868 A TW 108129868A TW I747029 B TWI747029 B TW I747029B
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TW
Taiwan
Prior art keywords
detection
area
measured
spot
wafer
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TW108129868A
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English (en)
Chinese (zh)
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TW202014691A (zh
Inventor
魯 陳
黃有為
崔高增
王天民
Original Assignee
大陸商深圳中科飛測科技股份有限公司
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Priority claimed from CN201810955348.4A external-priority patent/CN110849900A/zh
Priority claimed from CN201810954689.XA external-priority patent/CN110849898A/zh
Application filed by 大陸商深圳中科飛測科技股份有限公司 filed Critical 大陸商深圳中科飛測科技股份有限公司
Publication of TW202014691A publication Critical patent/TW202014691A/zh
Application granted granted Critical
Publication of TWI747029B publication Critical patent/TWI747029B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined

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  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW108129868A 2018-08-21 2019-08-21 檢測系統及方法 TWI747029B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201810955348.4A CN110849900A (zh) 2018-08-21 2018-08-21 晶圆缺陷检测系统及方法
CN201810955348.4 2018-08-21
CN201810954689.X 2018-08-21
CN201810954689.XA CN110849898A (zh) 2018-08-21 2018-08-21 晶圆缺陷检测系统及方法

Publications (2)

Publication Number Publication Date
TW202014691A TW202014691A (zh) 2020-04-16
TWI747029B true TWI747029B (zh) 2021-11-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW108129868A TWI747029B (zh) 2018-08-21 2019-08-21 檢測系統及方法

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TW (1) TWI747029B (fr)
WO (1) WO2020038359A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111323371A (zh) * 2020-04-10 2020-06-23 深圳中科飞测科技有限公司 一种光学检测系统和光学检测方法
CN113514477B (zh) * 2020-04-10 2024-06-11 深圳中科飞测科技股份有限公司 一种光学设备及其对准方法和检测方法
CN113702397A (zh) * 2020-05-20 2021-11-26 深圳中科飞测科技股份有限公司 一种光学检测系统和光学检测方法
CN114823455B (zh) * 2022-07-01 2023-05-12 西安奕斯伟材料科技有限公司 一种用于调节晶圆位置的装置和方法
CN116631908B (zh) * 2023-05-16 2024-04-26 台州勃美科技有限公司 一种晶圆自动加工方法、装置及电子设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008268140A (ja) * 2007-04-25 2008-11-06 Hitachi High-Technologies Corp 欠陥検査方法及び欠陥検査装置
JP2009283633A (ja) * 2008-05-21 2009-12-03 Hitachi High-Technologies Corp 表面検査装置及び表面検査方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6366690B1 (en) * 1998-07-07 2002-04-02 Applied Materials, Inc. Pixel based machine for patterned wafers
CN103346101B (zh) * 2013-06-27 2016-12-28 上海华力微电子有限公司 芯片缺陷的高精度检测方法和扫描方法
CN103646889A (zh) * 2013-11-29 2014-03-19 上海华力微电子有限公司 晶圆缺陷检测方法
CN207540992U (zh) * 2017-12-19 2018-06-26 昆山成功环保科技有限公司 一种晶圆表面缺陷检测装置
CN207650119U (zh) * 2017-12-22 2018-07-24 昆山成功环保科技有限公司 一种晶圆自动检测系统
CN209028014U (zh) * 2018-08-21 2019-06-25 深圳中科飞测科技有限公司 检测系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008268140A (ja) * 2007-04-25 2008-11-06 Hitachi High-Technologies Corp 欠陥検査方法及び欠陥検査装置
JP2009283633A (ja) * 2008-05-21 2009-12-03 Hitachi High-Technologies Corp 表面検査装置及び表面検査方法

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Publication number Publication date
TW202014691A (zh) 2020-04-16
TW202043747A (zh) 2020-12-01
WO2020038359A1 (fr) 2020-02-27

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