TWI745312B - 具有保護元件的光學組件以及具有此光學組件的光學配置 - Google Patents
具有保護元件的光學組件以及具有此光學組件的光學配置 Download PDFInfo
- Publication number
- TWI745312B TWI745312B TW105134737A TW105134737A TWI745312B TW I745312 B TWI745312 B TW I745312B TW 105134737 A TW105134737 A TW 105134737A TW 105134737 A TW105134737 A TW 105134737A TW I745312 B TWI745312 B TW I745312B
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- Prior art keywords
- optical
- optical element
- elements
- faceted
- film
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Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 164
- 230000001681 protective effect Effects 0.000 title claims abstract description 28
- 239000012528 membrane Substances 0.000 claims abstract description 20
- 239000010408 film Substances 0.000 claims description 122
- 239000003344 environmental pollutant Substances 0.000 claims description 41
- 231100000719 pollutant Toxicity 0.000 claims description 41
- 238000005286 illumination Methods 0.000 claims description 28
- 238000000576 coating method Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 24
- 238000004140 cleaning Methods 0.000 claims description 20
- 239000000356 contaminant Substances 0.000 claims description 20
- 239000010409 thin film Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- 238000011010 flushing procedure Methods 0.000 claims description 16
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 6
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 3
- 229910000428 cobalt oxide Inorganic materials 0.000 claims description 3
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 claims description 3
- 150000001247 metal acetylides Chemical class 0.000 claims description 3
- 229910000476 molybdenum oxide Inorganic materials 0.000 claims description 3
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 3
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 3
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 3
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 abstract description 38
- 230000005855 radiation Effects 0.000 abstract description 36
- 239000000126 substance Substances 0.000 abstract description 5
- 239000007789 gas Substances 0.000 description 30
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 26
- 239000002245 particle Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 210000001747 pupil Anatomy 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 238000010926 purge Methods 0.000 description 7
- 239000002344 surface layer Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000001459 lithography Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000011109 contamination Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- KXCAEQNNTZANTK-UHFFFAOYSA-N stannane Chemical compound [SnH4] KXCAEQNNTZANTK-UHFFFAOYSA-N 0.000 description 2
- 229910000083 tin tetrahydride Inorganic materials 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910001935 vanadium oxide Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- -1 helium) can be used Chemical compound 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000000671 immersion lithography Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70175—Lamphouse reflector arrangements or collector mirrors, i.e. collecting light from solid angle upstream of the light source
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/18—Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0891—Ultraviolet [UV] mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Epidemiology (AREA)
- Atmospheric Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Public Health (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Optical Elements Other Than Lenses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015221209.2 | 2015-10-29 | ||
| DE102015221209.2A DE102015221209A1 (de) | 2015-10-29 | 2015-10-29 | Optische Baugruppe mit einem Schutzelement und optische Anordnung damit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201727277A TW201727277A (zh) | 2017-08-01 |
| TWI745312B true TWI745312B (zh) | 2021-11-11 |
Family
ID=57209463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105134737A TWI745312B (zh) | 2015-10-29 | 2016-10-27 | 具有保護元件的光學組件以及具有此光學組件的光學配置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11022893B2 (enExample) |
| EP (1) | EP3368948B1 (enExample) |
| JP (1) | JP6805248B2 (enExample) |
| DE (1) | DE102015221209A1 (enExample) |
| TW (1) | TWI745312B (enExample) |
| WO (1) | WO2017072195A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11272606B2 (en) | 2017-06-27 | 2022-03-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV light source and apparatus for lithography |
| DE102017211443A1 (de) * | 2017-07-05 | 2019-01-10 | Carl Zeiss Smt Gmbh | Metrologiesystem mit einer EUV-Optik |
| DE102018110251B4 (de) * | 2018-04-27 | 2021-03-25 | Friedrich-Schiller-Universität Jena | Kontaminationsabweisender Spiegel und Verfahren zu dessen Herstellung |
| DE102019117964A1 (de) | 2019-07-03 | 2020-07-23 | Asml Netherlands B.V. | Lithographieanlage mit einer Überwachungseinrichtung für ein Pellikel |
| MX2022001060A (es) * | 2019-07-26 | 2022-04-20 | Deka Products Lp | Sistema y metodo para estimacion de espacio libre. |
| DE102019214269A1 (de) * | 2019-09-19 | 2021-03-25 | Carl Zeiss Smt Gmbh | Facettenspiegel für eine Beleuchtungsoptik einer Projektionsbelichtungsanlage |
| DE102022121000B4 (de) | 2021-08-23 | 2024-03-07 | Carl Zeiss Smt Gmbh | Spiegelanordnung für eine EUV-Projektionsbelichtungsanlage mit einer Schutzvorrichtung zum Schutz der optischen Wirkfläche und EUV-Projektionsbelichtungsanlage |
| DE102021211619A1 (de) | 2021-10-14 | 2023-04-20 | Carl Zeiss Smt Gmbh | EUV- Mehrfachspiegelanordnung |
| DE102022209427A1 (de) * | 2022-09-09 | 2024-03-14 | Carl Zeiss Smt Gmbh | Mikrospiegelanordnung mit federnd gelagerten Einzelspiegelelementen |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6594073B2 (en) * | 2001-05-30 | 2003-07-15 | Micro Lithography, Inc. | Antistatic optical pellicle |
| US6701512B2 (en) * | 2001-01-24 | 2004-03-02 | Kabushiki Kaisha Toshiba | Focus monitoring method, exposure apparatus, and exposure mask |
| TWI251118B (en) * | 2003-10-06 | 2006-03-11 | Asml Netherlands Bv | Method of and apparatus for supplying a dynamic protective layer to a mirror |
| US20110309271A1 (en) * | 2010-06-16 | 2011-12-22 | Gigaphoton Inc. | Spectral purity filter and extreme ultraviolet light generation apparatus provided with the spectral purity filter |
| DE102012204295A1 (de) * | 2012-03-19 | 2013-03-28 | Carl Zeiss Smt Gmbh | Filterelement |
| US8477285B2 (en) * | 2008-06-19 | 2013-07-02 | Carl Zeiss Smt Gmbh | Particle cleaning of optical elements for microlithography |
| TW201337324A (zh) * | 2012-02-10 | 2013-09-16 | Zeiss Carl Smt Gmbh | 用於ｅｕｖ微影的投影透鏡、膜構件及製造包含膜構件的投影透鏡的方法 |
| TW201430503A (zh) * | 2012-10-05 | 2014-08-01 | Rudolph Technologies Inc | 於光刻期間保護基材邊緣之單一葉片裝置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6445844B1 (en) * | 1999-09-15 | 2002-09-03 | Xros, Inc. | Flexible, modular, compact fiber optic switch |
| US7633073B2 (en) | 2005-11-23 | 2009-12-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2008153396A (ja) * | 2006-12-15 | 2008-07-03 | Nikon Corp | 照度均一化装置、露光装置、露光方法および半導体デバイスの製造方法 |
| US20080259298A1 (en) * | 2007-04-19 | 2008-10-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7829248B2 (en) | 2007-07-24 | 2010-11-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle stress relief |
| DE102008041436A1 (de) | 2007-10-02 | 2009-04-09 | Carl Zeiss Smt Ag | Optisches Membranelement |
| CN102695988B (zh) * | 2009-12-23 | 2015-09-02 | Asml荷兰有限公司 | 光刻设备以及器件制造方法 |
| JP5886279B2 (ja) * | 2010-06-25 | 2016-03-16 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィ装置およびリソグラフィ方法 |
| JP6253641B2 (ja) * | 2012-05-21 | 2017-12-27 | エーエスエムエル ネザーランズ ビー．ブイ． | リフレクタ、ペリクル、リソグラフィマスク、膜、スペクトル純度フィルタ、および、装置 |
| JP5711703B2 (ja) | 2012-09-03 | 2015-05-07 | 信越化学工業株式会社 | Ｅｕｖ用ペリクル |
| WO2014154452A1 (en) * | 2013-03-27 | 2014-10-02 | Asml Netherlands B.V. | Lithographic apparatus |
-
2015
- 2015-10-29 DE DE102015221209.2A patent/DE102015221209A1/de not_active Ceased
-
2016
- 2016-10-26 EP EP16788086.3A patent/EP3368948B1/en active Active
- 2016-10-26 WO PCT/EP2016/075845 patent/WO2017072195A1/en not_active Ceased
- 2016-10-26 JP JP2018522015A patent/JP6805248B2/ja active Active
- 2016-10-27 TW TW105134737A patent/TWI745312B/zh active
-
2018
- 2018-04-28 US US15/965,913 patent/US11022893B2/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6701512B2 (en) * | 2001-01-24 | 2004-03-02 | Kabushiki Kaisha Toshiba | Focus monitoring method, exposure apparatus, and exposure mask |
| US6594073B2 (en) * | 2001-05-30 | 2003-07-15 | Micro Lithography, Inc. | Antistatic optical pellicle |
| TWI251118B (en) * | 2003-10-06 | 2006-03-11 | Asml Netherlands Bv | Method of and apparatus for supplying a dynamic protective layer to a mirror |
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| DE102012204295A1 (de) * | 2012-03-19 | 2013-03-28 | Carl Zeiss Smt Gmbh | Filterelement |
| TW201430503A (zh) * | 2012-10-05 | 2014-08-01 | Rudolph Technologies Inc | 於光刻期間保護基材邊緣之單一葉片裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201727277A (zh) | 2017-08-01 |
| JP2018533770A (ja) | 2018-11-15 |
| EP3368948A1 (en) | 2018-09-05 |
| US20180246413A1 (en) | 2018-08-30 |
| WO2017072195A1 (en) | 2017-05-04 |
| JP6805248B2 (ja) | 2020-12-23 |
| DE102015221209A1 (de) | 2017-05-04 |
| US11022893B2 (en) | 2021-06-01 |
| EP3368948B1 (en) | 2019-09-18 |
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