TWI742701B - 剝離層形成用組成物以及剝離層 - Google Patents

剝離層形成用組成物以及剝離層 Download PDF

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Publication number
TWI742701B
TWI742701B TW109118131A TW109118131A TWI742701B TW I742701 B TWI742701 B TW I742701B TW 109118131 A TW109118131 A TW 109118131A TW 109118131 A TW109118131 A TW 109118131A TW I742701 B TWI742701 B TW I742701B
Authority
TW
Taiwan
Prior art keywords
composition
forming
release layer
substrate
diamine
Prior art date
Application number
TW109118131A
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English (en)
Chinese (zh)
Other versions
TW202037640A (zh
Inventor
進藤和也
江原和也
Original Assignee
日商日產化學工業股份有限公司
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Application filed by 日商日產化學工業股份有限公司 filed Critical 日商日產化學工業股份有限公司
Publication of TW202037640A publication Critical patent/TW202037640A/zh
Application granted granted Critical
Publication of TWI742701B publication Critical patent/TWI742701B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW109118131A 2015-03-31 2016-03-31 剝離層形成用組成物以及剝離層 TWI742701B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015072893 2015-03-31
JP2015-072893 2015-03-31

Publications (2)

Publication Number Publication Date
TW202037640A TW202037640A (zh) 2020-10-16
TWI742701B true TWI742701B (zh) 2021-10-11

Family

ID=57004661

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105110356A TWI758244B (zh) 2015-03-31 2016-03-31 可撓性電子裝置之製造方法
TW109118131A TWI742701B (zh) 2015-03-31 2016-03-31 剝離層形成用組成物以及剝離層

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW105110356A TWI758244B (zh) 2015-03-31 2016-03-31 可撓性電子裝置之製造方法

Country Status (5)

Country Link
JP (1) JP6705444B2 (ja)
KR (1) KR102534510B1 (ja)
CN (1) CN107960094B (ja)
TW (2) TWI758244B (ja)
WO (1) WO2016158988A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7092114B2 (ja) * 2017-03-30 2022-06-28 日産化学株式会社 剥離層形成用組成物及び剥離層
JP6537584B2 (ja) * 2017-12-04 2019-07-03 ユニチカ株式会社 ガラス基板への塗工用溶液
CN115960353A (zh) * 2022-12-31 2023-04-14 上海邃铸科技有限公司 制备聚酰亚胺膜的聚合物、聚酰亚胺膜及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW514607B (en) * 1999-04-19 2002-12-21 Kyodo Printing Co Ltd Method for transferring transparent conductive film
TW201335239A (zh) * 2012-02-23 2013-09-01 Hitachi Chem Dupont Microsys 樹脂組成物以及使用其的聚醯亞胺樹脂膜、顯示器基板與其製造方法
TW201431955A (zh) * 2012-11-08 2014-08-16 Asahi Kasei E Materials Corp 可撓性裝置用基板、可撓性裝置及其製造方法、積層體及其製造方法、與樹脂組合物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2811675B2 (ja) * 1988-06-23 1998-10-15 東レ株式会社 カラーフィルタ用耐熱着色ペースト
JP4619461B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜デバイスの転写方法、及びデバイスの製造方法
JP4619462B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜素子の転写方法
JP3809681B2 (ja) 1996-08-27 2006-08-16 セイコーエプソン株式会社 剥離方法
JP2001056406A (ja) * 1999-08-19 2001-02-27 Toray Ind Inc カラーフィルター
CN100384622C (zh) * 2003-04-02 2008-04-30 Tdk株式会社 剥离膜及其制造方法
GB0327093D0 (en) 2003-11-21 2003-12-24 Koninkl Philips Electronics Nv Active matrix displays and other electronic devices having plastic substrates
TWI444114B (zh) * 2011-12-26 2014-07-01 Chi Mei Corp 具有離型層的基板結構及其製造方法
KR102087647B1 (ko) * 2012-09-27 2020-03-11 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 표시 장치의 제조 방법
TWI479000B (zh) * 2013-02-07 2015-04-01 Sumika Technology Co Ltd 接著性高分子組成物及其應用
JP6185283B2 (ja) * 2013-05-10 2017-08-23 ユニチカ株式会社 フレキシブルデバイス用積層体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW514607B (en) * 1999-04-19 2002-12-21 Kyodo Printing Co Ltd Method for transferring transparent conductive film
TW201335239A (zh) * 2012-02-23 2013-09-01 Hitachi Chem Dupont Microsys 樹脂組成物以及使用其的聚醯亞胺樹脂膜、顯示器基板與其製造方法
TW201431955A (zh) * 2012-11-08 2014-08-16 Asahi Kasei E Materials Corp 可撓性裝置用基板、可撓性裝置及其製造方法、積層體及其製造方法、與樹脂組合物

Also Published As

Publication number Publication date
TW201706363A (zh) 2017-02-16
TW202037640A (zh) 2020-10-16
WO2016158988A1 (ja) 2016-10-06
KR20170132803A (ko) 2017-12-04
JP6705444B2 (ja) 2020-06-03
CN107960094A (zh) 2018-04-24
CN107960094B (zh) 2021-03-12
KR102534510B1 (ko) 2023-05-19
JPWO2016158988A1 (ja) 2018-02-15
TWI758244B (zh) 2022-03-21

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