TWI735643B - 扇出（ｆａｎ ｏｕｔ）型之晶圓等級封裝用翹曲矯正材 - Google Patents

扇出（ｆａｎ ｏｕｔ）型之晶圓等級封裝用翹曲矯正材 Download PDF

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Publication number
TWI735643B
TWI735643B TW106130221A TW106130221A TWI735643B TW I735643 B TWI735643 B TW I735643B TW 106130221 A TW106130221 A TW 106130221A TW 106130221 A TW106130221 A TW 106130221A TW I735643 B TWI735643 B TW I735643B
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Taiwan
Prior art keywords
warpage
wafer
wlp
volume
heating
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TW106130221A
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English (en)
Chinese (zh)
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TW201824463A (zh
Inventor
舟越千弘
志村優之
吉川里奈
佐藤和也
伊藤信人
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日商太陽油墨製造股份有限公司
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TW106130221A 2016-09-06 2017-09-05 扇出（ｆａｎ ｏｕｔ）型之晶圓等級封裝用翹曲矯正材 TWI735643B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016173998A JP6779719B2 (ja) 2016-09-06 2016-09-06 ファンアウト型のウエハレベルパッケージ用反り矯正材
JP2016-173998 2016-09-06

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TW201824463A TW201824463A (zh) 2018-07-01
TWI735643B true TWI735643B (zh) 2021-08-11

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TW106130221A TWI735643B (zh) 2016-09-06 2017-09-05 扇出（ｆａｎ ｏｕｔ）型之晶圓等級封裝用翹曲矯正材

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JP (1) JP6779719B2 (ja)
TW (1) TWI735643B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020070790A1 (ja) * 2018-10-02 2020-04-09 リンテック株式会社 積層体及び硬化封止体の製造方法
CN116874991B (zh) * 2023-09-08 2023-12-15 武汉市三选科技有限公司 一种晶圆翘曲调控环氧功能膜、其制备方法及应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005057651A1 (en) * 2003-11-27 2005-06-23 3M Innovative Properties Company Production method of semiconductor chip
US20140151733A1 (en) * 2011-06-23 2014-06-05 Asahi Kasei Kabushiki Kaisha Layered product for fine pattern formation and method of manufacturing layered product for fine pattern formation

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61181821A (ja) * 1985-02-07 1986-08-14 Mitsubishi Electric Corp 紫外線硬化性付与液状樹脂およびそれを用いた電気回路部品の封止方法
JP2938808B2 (ja) * 1995-09-14 1999-08-25 株式会社日本触媒 ポリマー微粒子分散型ラジカル重合性樹脂組成物
JP5266461B2 (ja) * 2005-04-28 2013-08-21 サンノプコ株式会社 電子基板充填用樹脂
US9054111B2 (en) * 2009-04-07 2015-06-09 Freescale Semiconductor, Inc. Electronic device and method of packaging an electronic device
JP2011253879A (ja) * 2010-06-01 2011-12-15 Nec Corp 半導体素子及び半導体内蔵基板
KR101478928B1 (ko) * 2010-08-13 2014-12-31 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 실리콘 수지 조성물
US9978700B2 (en) * 2014-06-16 2018-05-22 STATS ChipPAC Pte. Ltd. Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005057651A1 (en) * 2003-11-27 2005-06-23 3M Innovative Properties Company Production method of semiconductor chip
US20140151733A1 (en) * 2011-06-23 2014-06-05 Asahi Kasei Kabushiki Kaisha Layered product for fine pattern formation and method of manufacturing layered product for fine pattern formation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP昭61-181821; *

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Publication number Publication date
JP2018041808A (ja) 2018-03-15
JP6779719B2 (ja) 2020-11-04
TW201824463A (zh) 2018-07-01

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