TWI734817B - 測量裝置 - Google Patents
測量裝置 Download PDFInfo
- Publication number
- TWI734817B TWI734817B TW106125669A TW106125669A TWI734817B TW I734817 B TWI734817 B TW I734817B TW 106125669 A TW106125669 A TW 106125669A TW 106125669 A TW106125669 A TW 106125669A TW I734817 B TWI734817 B TW I734817B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- optical fiber
- pulsed
- plate
- retrograde
- Prior art date
Links
- 239000013307 optical fiber Substances 0.000 claims abstract description 64
- 239000000835 fiber Substances 0.000 claims abstract description 30
- 230000003595 spectral effect Effects 0.000 claims abstract description 22
- 230000005540 biological transmission Effects 0.000 claims abstract description 17
- 238000004364 calculation method Methods 0.000 claims abstract description 8
- 230000000149 penetrating effect Effects 0.000 claims abstract description 6
- 230000003287 optical effect Effects 0.000 claims description 46
- 235000012431 wafers Nutrition 0.000 description 77
- 238000005259 measurement Methods 0.000 description 15
- 230000001681 protective effect Effects 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 101000582320 Homo sapiens Neurogenic differentiation factor 6 Proteins 0.000 description 1
- 102100030589 Neurogenic differentiation factor 6 Human genes 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
- G01B9/02012—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal intensity variation
- G01B9/02014—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal intensity variation by using pulsed light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-171392 | 2016-09-02 | ||
JP2016171392A JP6802012B2 (ja) | 2016-09-02 | 2016-09-02 | 計測装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201812248A TW201812248A (zh) | 2018-04-01 |
TWI734817B true TWI734817B (zh) | 2021-08-01 |
Family
ID=61531559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106125669A TWI734817B (zh) | 2016-09-02 | 2017-07-31 | 測量裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6802012B2 (ja) |
KR (1) | KR102254616B1 (ja) |
CN (1) | CN107796314B (ja) |
TW (1) | TWI734817B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108527144B (zh) * | 2018-03-28 | 2019-11-15 | 昆山国显光电有限公司 | 基板研磨装置及其研磨方法 |
JP2020106277A (ja) * | 2018-12-26 | 2020-07-09 | 株式会社ディスコ | 厚み計測装置、及び厚み計測装置を備えた加工装置 |
JP7210367B2 (ja) * | 2019-04-23 | 2023-01-23 | 株式会社ディスコ | 厚み計測装置、及び厚み計測装置を備えた加工装置 |
DE102019205847A1 (de) | 2019-04-24 | 2020-10-29 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Erzeugung mindestens einer Modifikation in einem Festkörper |
TWI711009B (zh) * | 2019-10-31 | 2020-11-21 | 佳陞科技有限公司 | 非破壞性光學檢測系統 |
JP7355637B2 (ja) | 2019-12-16 | 2023-10-03 | 株式会社ディスコ | 検出装置 |
CN111156904B (zh) * | 2019-12-30 | 2020-10-30 | 浙江大学 | 基于柔性光电传感阵列的非接触式桥梁位移感知方法 |
US20230288272A1 (en) * | 2020-07-06 | 2023-09-14 | Laser Institute of Shandong Academy of Science | Multi-wavelength laser for synchronously monitoring temperature and pressure of ocean |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07306018A (ja) * | 1994-05-13 | 1995-11-21 | Nippondenso Co Ltd | 半導体厚非接触測定装置およびその測定方法 |
JP2006064852A (ja) * | 2004-08-25 | 2006-03-09 | Kansai Electric Power Co Inc:The | 分散補償器 |
JP2007166268A (ja) * | 2005-12-14 | 2007-06-28 | Oki Electric Ind Co Ltd | 光変調回路及び光変調方法 |
JP2010158686A (ja) * | 2009-01-06 | 2010-07-22 | Disco Abrasive Syst Ltd | レーザ加工用光学装置、レーザ加工装置およびレーザ加工方法 |
JP2012189507A (ja) * | 2011-03-11 | 2012-10-04 | Disco Abrasive Syst Ltd | 計測装置 |
TW201303259A (zh) * | 2011-03-21 | 2013-01-16 | Asml Netherlands Bv | 判斷微結構的結構參數之裝置及方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003307458A (ja) * | 2002-04-15 | 2003-10-31 | Akifumi Ito | 基材の温度測定方法および温度測定装置 |
JP2009050944A (ja) * | 2007-08-24 | 2009-03-12 | Disco Abrasive Syst Ltd | 基板の厚さ測定方法および基板の加工装置 |
JP5443180B2 (ja) | 2010-01-13 | 2014-03-19 | 株式会社ディスコ | 厚み検出装置および研削機 |
CN102661755A (zh) * | 2012-04-27 | 2012-09-12 | 天津奇谱光电技术有限公司 | 基于光纤布拉格光栅的可扩展分布式传感系统 |
CN104535000A (zh) * | 2014-12-18 | 2015-04-22 | 陕西科技大学 | 一种基于fbg传感器的皮革厚度测量装置 |
-
2016
- 2016-09-02 JP JP2016171392A patent/JP6802012B2/ja active Active
-
2017
- 2017-07-31 TW TW106125669A patent/TWI734817B/zh active
- 2017-08-28 CN CN201710749731.XA patent/CN107796314B/zh active Active
- 2017-08-31 KR KR1020170111214A patent/KR102254616B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07306018A (ja) * | 1994-05-13 | 1995-11-21 | Nippondenso Co Ltd | 半導体厚非接触測定装置およびその測定方法 |
JP2006064852A (ja) * | 2004-08-25 | 2006-03-09 | Kansai Electric Power Co Inc:The | 分散補償器 |
JP2007166268A (ja) * | 2005-12-14 | 2007-06-28 | Oki Electric Ind Co Ltd | 光変調回路及び光変調方法 |
JP2010158686A (ja) * | 2009-01-06 | 2010-07-22 | Disco Abrasive Syst Ltd | レーザ加工用光学装置、レーザ加工装置およびレーザ加工方法 |
JP2012189507A (ja) * | 2011-03-11 | 2012-10-04 | Disco Abrasive Syst Ltd | 計測装置 |
TW201303259A (zh) * | 2011-03-21 | 2013-01-16 | Asml Netherlands Bv | 判斷微結構的結構參數之裝置及方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201812248A (zh) | 2018-04-01 |
KR102254616B1 (ko) | 2021-05-20 |
CN107796314A (zh) | 2018-03-13 |
JP2018036213A (ja) | 2018-03-08 |
KR20180026345A (ko) | 2018-03-12 |
JP6802012B2 (ja) | 2020-12-16 |
CN107796314B (zh) | 2021-03-05 |
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