CN107796314B - 测量装置 - Google Patents

测量装置 Download PDF

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Publication number
CN107796314B
CN107796314B CN201710749731.XA CN201710749731A CN107796314B CN 107796314 B CN107796314 B CN 107796314B CN 201710749731 A CN201710749731 A CN 201710749731A CN 107796314 B CN107796314 B CN 107796314B
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CN
China
Prior art keywords
light
optical fiber
pulse
plate
wafer
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Active
Application number
CN201710749731.XA
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English (en)
Chinese (zh)
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CN107796314A (zh
Inventor
能丸圭司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication date
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Publication of CN107796314A publication Critical patent/CN107796314A/zh
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Publication of CN107796314B publication Critical patent/CN107796314B/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
    • G01B9/02012—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal intensity variation
    • G01B9/02014—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal intensity variation by using pulsed light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201710749731.XA 2016-09-02 2017-08-28 测量装置 Active CN107796314B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-171392 2016-09-02
JP2016171392A JP6802012B2 (ja) 2016-09-02 2016-09-02 計測装置

Publications (2)

Publication Number Publication Date
CN107796314A CN107796314A (zh) 2018-03-13
CN107796314B true CN107796314B (zh) 2021-03-05

Family

ID=61531559

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710749731.XA Active CN107796314B (zh) 2016-09-02 2017-08-28 测量装置

Country Status (4)

Country Link
JP (1) JP6802012B2 (ja)
KR (1) KR102254616B1 (ja)
CN (1) CN107796314B (ja)
TW (1) TWI734817B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108527144B (zh) * 2018-03-28 2019-11-15 昆山国显光电有限公司 基板研磨装置及其研磨方法
JP2020106277A (ja) * 2018-12-26 2020-07-09 株式会社ディスコ 厚み計測装置、及び厚み計測装置を備えた加工装置
JP7210367B2 (ja) * 2019-04-23 2023-01-23 株式会社ディスコ 厚み計測装置、及び厚み計測装置を備えた加工装置
DE102019205847A1 (de) 2019-04-24 2020-10-29 Infineon Technologies Ag Verfahren und Vorrichtung zur Erzeugung mindestens einer Modifikation in einem Festkörper
TWI711009B (zh) * 2019-10-31 2020-11-21 佳陞科技有限公司 非破壞性光學檢測系統
JP7355637B2 (ja) 2019-12-16 2023-10-03 株式会社ディスコ 検出装置
CN111156904B (zh) * 2019-12-30 2020-10-30 浙江大学 基于柔性光电传感阵列的非接触式桥梁位移感知方法
US20230288272A1 (en) * 2020-07-06 2023-09-14 Laser Institute of Shandong Academy of Science Multi-wavelength laser for synchronously monitoring temperature and pressure of ocean

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07306018A (ja) * 1994-05-13 1995-11-21 Nippondenso Co Ltd 半導体厚非接触測定装置およびその測定方法
JP2006064852A (ja) * 2004-08-25 2006-03-09 Kansai Electric Power Co Inc:The 分散補償器
JP2007166268A (ja) * 2005-12-14 2007-06-28 Oki Electric Ind Co Ltd 光変調回路及び光変調方法
CN101372090A (zh) * 2007-08-24 2009-02-25 株式会社迪思科 基板的厚度测量方法及基板的加工装置
JP2010158686A (ja) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd レーザ加工用光学装置、レーザ加工装置およびレーザ加工方法
CN102661755A (zh) * 2012-04-27 2012-09-12 天津奇谱光电技术有限公司 基于光纤布拉格光栅的可扩展分布式传感系统
JP2012189507A (ja) * 2011-03-11 2012-10-04 Disco Abrasive Syst Ltd 計測装置
CN104535000A (zh) * 2014-12-18 2015-04-22 陕西科技大学 一种基于fbg传感器的皮革厚度测量装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003307458A (ja) * 2002-04-15 2003-10-31 Akifumi Ito 基材の温度測定方法および温度測定装置
JP5443180B2 (ja) 2010-01-13 2014-03-19 株式会社ディスコ 厚み検出装置および研削機
WO2012126718A1 (en) * 2011-03-21 2012-09-27 Asml Netherlands B.V. Method and apparatus for determining structure parameters of microstructures

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07306018A (ja) * 1994-05-13 1995-11-21 Nippondenso Co Ltd 半導体厚非接触測定装置およびその測定方法
JP2006064852A (ja) * 2004-08-25 2006-03-09 Kansai Electric Power Co Inc:The 分散補償器
JP2007166268A (ja) * 2005-12-14 2007-06-28 Oki Electric Ind Co Ltd 光変調回路及び光変調方法
CN101372090A (zh) * 2007-08-24 2009-02-25 株式会社迪思科 基板的厚度测量方法及基板的加工装置
JP2010158686A (ja) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd レーザ加工用光学装置、レーザ加工装置およびレーザ加工方法
JP2012189507A (ja) * 2011-03-11 2012-10-04 Disco Abrasive Syst Ltd 計測装置
CN102661755A (zh) * 2012-04-27 2012-09-12 天津奇谱光电技术有限公司 基于光纤布拉格光栅的可扩展分布式传感系统
CN104535000A (zh) * 2014-12-18 2015-04-22 陕西科技大学 一种基于fbg传感器的皮革厚度测量装置

Also Published As

Publication number Publication date
KR20180026345A (ko) 2018-03-12
TW201812248A (zh) 2018-04-01
TWI734817B (zh) 2021-08-01
CN107796314A (zh) 2018-03-13
JP6802012B2 (ja) 2020-12-16
KR102254616B1 (ko) 2021-05-20
JP2018036213A (ja) 2018-03-08

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