TWI733020B - Work clamp - Google Patents
Work clamp Download PDFInfo
- Publication number
- TWI733020B TWI733020B TW107114471A TW107114471A TWI733020B TW I733020 B TWI733020 B TW I733020B TW 107114471 A TW107114471 A TW 107114471A TW 107114471 A TW107114471 A TW 107114471A TW I733020 B TWI733020 B TW I733020B
- Authority
- TW
- Taiwan
- Prior art keywords
- plate
- holding
- holding surface
- shaped
- shaped workpiece
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Jigs For Machine Tools (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Abstract
[課題]設成避免發生下述之事態:由於在吸引保持板狀工件的工作台上於保持時將密封構件朝向保持面側擠壓來接觸於工件的被保持面,因而產生吸引力的洩漏。 [解決手段]一種工作夾台,是設置於對具有翹曲之板狀工件進行加工的加工裝置上,且具備:基台;板狀保持部,具備有吸引路,該吸引路是使配設於該基台上且面積比工件的面積稍小的保持面連通至吸引源;及環狀密封部,圍繞保持部且上端比保持面更突出,環狀密封部是在吸引源連通至保持面而使吸引力作用於保持面時接觸於工件的下表面的外周部分,且上端朝保持面方向上之從保持面的中心遠離的方向移動,而以保持面與上端成為相同高度並接觸於工件下表面的狀態來吸引保持工件。[Problem] It is designed to prevent the occurrence of the following situation: the sealing member is pressed toward the holding surface side when holding the plate-shaped workpiece on the table for holding the plate-shaped workpiece to contact the held surface of the workpiece, thereby causing the leakage of the attraction force. . [Solution] A work chuck is installed on a processing device for processing a warped plate-shaped workpiece, and is provided with: a base; a plate-shaped holding part with a suction path, which is equipped with A holding surface on the base with an area slightly smaller than the area of the workpiece is connected to the suction source; and a ring-shaped sealing part that surrounds the holding part and the upper end is more protruding than the holding surface. The ring-shaped sealing part is connected to the holding surface at the suction source When the attraction force acts on the holding surface, it contacts the outer peripheral part of the lower surface of the workpiece, and the upper end moves away from the center of the holding surface in the direction of the holding surface, so that the holding surface and the upper end become the same height and contact the workpiece The state of the lower surface attracts and holds the workpiece.
Description
發明領域 本發明是有關於一種吸引保持板狀工件的工作夾台。FIELD OF THE INVENTION The present invention relates to a work chuck table for attracting and holding plate-shaped workpieces.
發明背景 以工作夾台的保持面吸引保持外周部分已向上翹曲之板狀工件的下表面,且在以磨石對已吸引保持在工作夾台上的板狀工件的上表面進行磨削的磨削裝置中,會由於板狀工件的翹曲,而導致在板狀工件的下表面的外周部分與工作夾台的保持面之間出現間隙。並且,會有工作夾台的吸引力從該間隙洩漏而變得無法吸引保持板狀工件的問題。為了處理這個問題,有設成將該間隙堵塞以使吸引力不洩漏的工作夾台(參照例如專利文獻1)。 先前技術文獻 專利文獻BACKGROUND OF THE INVENTION The holding surface of the work chuck is used to attract and hold the lower surface of a plate-shaped workpiece whose outer peripheral portion has been warped upward, and the upper surface of the plate-shaped work that has been sucked and held on the work chuck is ground with a grindstone. In the grinding device, due to the warpage of the plate-shaped workpiece, a gap may appear between the outer peripheral portion of the lower surface of the plate-shaped workpiece and the holding surface of the work clamp table. In addition, there is a problem that the suction force of the work chuck table leaks from the gap and it becomes impossible to attract and hold the plate-shaped workpiece. In order to deal with this problem, there is a work chuck that closes the gap so that the suction force does not leak (see, for example, Patent Document 1). Prior Art Documents Patent Documents
專利文獻1:日本專利特開2014-072510號公報Patent Document 1: Japanese Patent Laid-Open No. 2014-072510
發明概要 發明欲解決之課題 在上述的專利文獻1中所記載的工作夾台,是設成以形成為環狀的密封構件將上述間隙堵塞,以使吸引力不洩漏。這是因為藉由設成使比板狀工件的翹曲力更大的吸引力作用至板狀工件並使密封構件變形成被擠壓,並使密封構件的上端與保持面成為齊平面,因而形成密封構件之作為密封的功能可被發揮。SUMMARY OF THE INVENTION Problems to be Solved by the Invention The work chuck described in
但是,藉由例如將密封構件朝向工作夾台的保持面側擠壓,會有下述情況:密封構件變得未充分發揮作為密封的功能,亦即有變得容易產生吸引力的洩漏。雖然作為對策而使密封構件具有一定程度的彈力,但是具有這種一定程度的彈力的密封構件,會由於在吸引保持時被擠壓而蓄積有讓板狀工件從保持面遠離的方向的反彈力。因此,在吸引保持中作用於板狀工件之吸引力必須設得比反彈力更大。However, for example, by pressing the sealing member toward the holding surface side of the work chuck, there are cases where the sealing member does not sufficiently perform its function as a seal, that is, there is a leakage that tends to generate attractive force. Although the sealing member has a certain degree of elasticity as a countermeasure, the sealing member with such a certain degree of elasticity will accumulate the rebound force in the direction that causes the plate-shaped workpiece to move away from the holding surface due to being squeezed during suction and holding. . Therefore, the attractive force acting on the plate-shaped workpiece in the attracting and holding must be set larger than the rebound force.
據此,有防止產生下述事態之課題:在吸引保持板狀工件的工作夾台上,由於在吸引保持時將密封構件朝向保持面側擠壓來接觸於板狀工件的被保持面(下表面),而產生吸引力的洩漏。 用以解決課題之手段Accordingly, there is a problem of preventing the occurrence of the following situation: in the work chuck table that sucks and holds the plate-shaped workpiece, the sealing member is pressed toward the holding surface side during suction and holding, and contacts the held surface of the plate-shaped workpiece (below Surface), and produce attractive leakage. Means to solve the problem
用以解決上述課題之本發明是一種工作夾台,其是設置在藉由裝設有加工具之加工機構來對具有翹曲之板狀工件進行加工的加工裝置上,並具有吸引保持板狀工件之保持面,該工作夾台具備:基台;板狀的保持部,具備有吸引路,該吸引路是使配設於該基台之上且面積比板狀工件的面積稍小的該保持面連通至吸引源;及環狀密封部,圍繞該保持部且上端比該保持面更突出,該環狀密封部是在吸引源連通至該保持面而使吸引力作用於該保持面時接觸於板狀工件的下表面的外周部分,且該上端朝該保持面方向上之從該保持面的中心遠離的方向移動,而以該保持面與該上端成為相同高度並接觸於板狀工件的下表面的狀態,來防止該吸引力的洩漏並吸引保持板狀工件。 發明效果The present invention to solve the above-mentioned problems is a work chuck table, which is installed on a processing device for processing a warped plate-shaped workpiece by a processing mechanism equipped with a tool, and has a suction and holding plate shape The holding surface of the workpiece, the work chuck is equipped with: a base; a plate-shaped holding part is provided with a suction path that is arranged on the base and has an area slightly smaller than the area of the plate-shaped workpiece The holding surface communicates with the suction source; and a ring-shaped sealing portion that surrounds the holding portion and the upper end is more protruding than the holding surface, the ring-shaped sealing portion is when the suction source is connected to the holding surface and attracting force acts on the holding surface Contact with the outer peripheral portion of the lower surface of the plate-shaped workpiece, and the upper end moves away from the center of the holding surface in the direction of the holding surface, and the holding surface and the upper end become the same height and contact the plate-shaped workpiece The state of the lower surface to prevent the leakage of the attraction force and to attract and hold the plate-shaped workpiece. Invention effect
本發明之工作夾台,因為具備基台;板狀的保持部,具備有吸引路,該吸引路是使配設於該基台之上且面積比板狀工件的面積稍小的保持面連通至吸引源;及環狀密封部,圍繞保持部且上端比保持面更突出,環狀密封部是在吸引源連通至保持面而使吸引力作用於保持面時接觸於板狀工件的下表面的外周部分,且上端朝保持面方向上之從保持面的中心遠離的方向移動,而以保持面與上端成為相同高度並接觸於板狀工件的下表面的狀態來吸引保持板狀工件,所以可以在不產生吸引力的洩漏的情形下,吸引保持板狀工件。又,吸引保持時的板狀工件,雖然具有源自翹曲之從保持面反彈之力,但由於不存在環狀密封部的反彈力(欲從已變形的狀態回復為原本的狀態之力)進一步施加於板狀工件之情形,因此變得可更確實地吸引保持板狀工件。The work chuck of the present invention has a base; a plate-shaped holding part is provided with a suction path that communicates with a holding surface arranged on the base and having an area slightly smaller than the area of the plate-shaped workpiece To the suction source; and the ring-shaped sealing part, which surrounds the holding part and the upper end is more protruding than the holding surface. The ring-shaped sealing part is in contact with the lower surface of the plate-shaped workpiece when the suction source is connected to the holding surface so that the attractive force acts on the holding surface The upper end moves away from the center of the holding surface in the direction of the holding surface, and the holding surface and the upper end are at the same height and are in contact with the lower surface of the plate-shaped workpiece to attract and hold the plate-shaped workpiece, so It is possible to attract and hold a plate-shaped workpiece without causing a leakage of attraction. In addition, although the plate-shaped workpiece during suction and holding has the force of rebounding from the holding surface due to warpage, there is no rebound force of the ring-shaped seal part (the force to return from the deformed state to the original state) If it is further applied to the plate-shaped workpiece, it becomes possible to attract and hold the plate-shaped workpiece more reliably.
用以實施發明之形態 圖1是顯示具有吸引保持板狀工件W的保持面310之工作夾台3的分解立體圖,圖2是顯示已組裝的狀態之工作夾台3的立體圖。工作夾台3具備有基台30、板狀的保持部31與環狀密封部32,該板狀的保持部31具備有使配設於基台30之上且面積比板狀工件W的面積稍小的保持面310連通至吸引源7的吸引路311(在圖1中未圖示),該環狀密封部32是圍繞保持部31。 雖然工作夾台3是配設在例如藉由裝設有磨削輪作為加工具的加工機構來對具有翹曲的板狀工件W進行磨削加工的手動式的磨削裝置上,但是所配設的加工裝置並非限定於此的加工裝置。Mode for Carrying Out the Invention Fig. 1 is an exploded perspective view showing a work chuck table 3 having a
板狀工件W是例如於加工後成為電路板(PCB)等的工件,並具備縱橫之長度各自為數十公分的矩形狀的外形,且是形成為其上表面Wa尚未組裝有器件或配線等的狀態。在圖1所示的例子中,雖然板狀工件W是Y軸方向兩側的外周部分朝向上方翹曲,但亦可為四邊的外周部分全部朝向上方翹曲。The plate-shaped workpiece W is, for example, a workpiece that becomes a circuit board (PCB) after processing, and has a rectangular outer shape with a length of tens of centimeters each, and is formed such that the upper surface Wa has not yet been assembled with devices or wiring, etc. status. In the example shown in FIG. 1, although the outer peripheral portion of the plate-shaped workpiece W on both sides in the Y-axis direction is warped upward, all the outer peripheral portions of the four sides may be warped upward.
基台30是例如將規定的合金等形成為圓盤狀而成的基台,且在其上表面30a是將複數個(在圖1所示的例子中為10個)螺孔300隔著規定的間隔而形成為大致四角環狀。The
板狀的保持部31是例如由不銹鋼(SUS)等金屬材料所構成的矩形狀的平板,且能夠以其上表面即保持面310吸引保持板狀工件W,且保持面310的面積是形成為比板狀工件W的面積稍小的面積。保持部31是以圖未示的螺栓固定在基台30的上表面30a的中央、或是以接著劑來固接。在保持面310上是將複數個吸引孔310c縱橫地隔著規定的間隔來形成。如圖5所示,各吸引孔310c是連通於形成在板狀的保持部31的內部的吸引路311,且在開口於保持部31的下表面的吸引路311的一端,是透過基台30而連通有由真空產生裝置及壓縮機等所構成的吸引源7。The plate-
具備四角環狀的外形之圖1所示的環狀密封部32,是以例如橡膠或海綿等具備適度的彈性的構件所形成,且具備有例如嵌合保持部31的開口320、圍繞已嵌合於開口320的保持部31的變形部321、及從變形部321的下端朝向開口320的外側水平地延伸的矩形狀的外延部322。The ring-
由側面視角下矩形狀的4片側壁所構成的變形部321,因為在各側壁的接合部分(角落部分)形成有縱方向(Z軸方向)的凹口,所以各側壁變得可朝向開口320的外側彎曲。In the
環狀密封部32,是例如藉由圖1所示的四個固定板35而形成為圍繞保持部31並固定於基台30的上表面30a。固定板35具備例如縱截面成為大致L字形的外形,且具備有平板部350及支撐部351,該平板部350是將螺栓插通孔350c朝向厚度方向(Z軸方向)貫通形成,該支撐部351是在平板部350豎立設置且從側邊支撐環狀密封部32的變形部321的下側部分。再者,亦可將4個固定板35一體地形成為四角環狀,又,亦可將固定板35與環狀密封部32一體地形成。 此外,亦可將由4片側壁所構成的變形部321一體地形成為四角環狀。再者,在將變形部321一體形成的情況下,側壁的角落部分宜為比中央部分更容易變形的材質或形狀。 作為變形部321的側壁的角落部分形成為比中央部分更容易變形的材質的情況之一例,是如圖3所示,將側壁的中央部分以橡膠板G形成,且將相接於橡膠板G的角落部分以海綿P來形成,而將以海綿P所形成的角落部分做成容易變形。 作為變形部321的側壁的角落部分形成為比中央部分更容易變形的形狀的情況之一例,是如圖4所示,相較於整體以橡膠板或海綿所形成的變形部321的中央部分的厚度,將角落部分的厚度形成得較薄來做成容易變形。The ring-
將基台30上的保持部31嵌入環狀密封部32的開口320,而將環狀密封部32載置於基台30的上表面30a。接著,將4個固定板35各自在環狀密封部32的外延部322上以沿著變形部321的方式載置,此外,讓基台30的螺孔300與各固定板35的螺栓插通孔350c重合。並且,使10支固定螺栓36(在圖1中,僅顯示一支)於各螺栓插通孔350c穿過並螺合於各螺孔300,藉此,成為在固定板35的平板部350的下表面與基台30的上表面30a之間將環狀密封部32的外延部322夾入的狀態,並如圖2所示,成為將環狀密封部32固定在基台30上的狀態。 如圖2所示,當將環狀密封部32以圍繞保持部31的狀態固定在基台30上時,環狀密封部32的變形部321的上端321a是成為位於比保持部31的保持面310更朝上方規定距離的狀態,即成為比保持面310更朝向上方突出的狀態。The
以下,說明關於在圖5所示之吸引保持板狀工件W之時的工作夾台3的動作。首先,將板狀工件W搬送到工作夾台3上,並定位成板狀工件W的中心大致位於工作夾台3的保持面310的中心。接著,將板狀工件W以將下表面Wb朝向下側的狀態來載置於保持面310上。Hereinafter, the operation of the work chuck table 3 when the plate-shaped workpiece W shown in FIG. 5 is sucked and held is described. First, the plate-shaped workpiece W is transferred to the work chuck table 3 and positioned so that the center of the plate-shaped work W is approximately at the center of the
藉由作動吸引源7,將吸引源7所產生的吸引力透過吸引路311傳達至吸引孔310c,而使吸引力作用於保持面310。藉由已傳達至保持面310之吸引力,將板狀工件W一面矯正翹曲一面藉由保持面310從下表面Wb的中央側來進行吸引保持,以進一步使環狀密封部32的變形部321的上端321a接觸於板狀工件W的下表面Wb的外周部分。By actuating the
因為板狀工件W的下表面Wb的外周部分的翹曲一面被矯正一面朝變形部321的上端321a進行接觸,所以會使變形部321的上端321a朝保持面方向上之從保持面310的中心遠離的方向移動,而使變形部321的上端321a如圖6所示地朝向外側彎曲,並使保持面310與上端321a成為相同高度。其結果,成為環狀密封部32無間隙地接觸於板狀工件W的下表面Wb的外周部分而充分發揮作為密封的功能的狀態,而可讓適當的吸引力作用在板狀工件W的下表面Wb。 再者,無論是在如圖3所示地將變形部321的側壁的角落部分以比中央部分更容易變形的材質來形成的情況下、或是如圖4所示地將變形部321的側壁的角落部分形成為比中央部分更容易變形的形狀的情況下,都是藉由吸引保持板狀工件W,而使上端321a隨著變形部321的角落部分的變形一起朝向外彎曲,且讓保持面310與上端321a成為相同高度,而成為環狀密封部32充分發揮作為密封的功能之狀態。Because the warpage of the outer peripheral portion of the lower surface Wb of the plate-shaped workpiece W is corrected, the
本發明之工作夾台3,因為具備基台30;板狀的保持部31,具備有吸引路311,該吸引路311是使配設於基台30之上且面積比板狀工件W的面積稍小的保持面310連通至吸引源7;及環狀密封部32,圍繞保持部31且上端321a比保持面310更突出,環狀密封部32是在吸引源7連通至保持面310而使吸引力作用於保持面310時接觸於板狀工件W的下表面Wb的外周部分,且上端321a朝保持面310方向上之從保持面的中心遠離的方向移動,而以保持面310與上端321a成為相同高度並接觸於板狀工件W的下表面Wb的狀態來吸引保持板狀工件W,所以可以在不產生吸引力的洩漏的情形下,吸引保持板狀工件W。又,在吸引保持時,作業人員變得毋須從上方將板狀工件W朝向保持面310來按壓。 吸引保持時的板狀工件W,因為具有源自翹曲之從保持面310反彈之力(欲將板狀工件W的外周部分朝上方舉起之力),且環狀密封部32所具有之欲從已變形的狀態回復為原本的狀態之力的方向,相對於藉由保持面310而被吸引保持的板狀工件W並非是垂直的+Z方向,而是成為朝保持面310的中心接近的方向,所以不會有環狀密封部32的回復力進一步施加至源自板狀工件W的翹曲之從保持面310反彈之力上的情形。因此,變得可更確實地吸引保持板狀工件W。The work clamp table 3 of the present invention is provided with a
本發明之工作夾台並非受限於上述記載的例子之工作夾台,又,關於圖示於附加圖式之工作夾台3的各構成等,也不受限於此,且可在能夠發揮本發明之效果的範圍內適當變更。The work chuck table of the present invention is not limited to the work chuck table of the example described above, and the various configurations of the work chuck table 3 shown in the attached drawings are not limited to this, and can be used Change as appropriate within the scope of the effects of the present invention.
3‧‧‧工作夾台30‧‧‧基台30a‧‧‧基台的上表面300‧‧‧螺孔31‧‧‧保持部310‧‧‧保持面310c‧‧‧吸引孔311‧‧‧吸引路32‧‧‧環狀密封部320‧‧‧開口321‧‧‧變形部321a‧‧‧上端322‧‧‧外延部35‧‧‧固定板350‧‧‧平板部350c‧‧‧螺栓插通孔351‧‧‧支撐部36‧‧‧固定螺栓7‧‧‧吸引源G‧‧‧橡膠板P‧‧‧海綿W‧‧‧板狀工件Wa‧‧‧板狀工件的上表面Wb‧‧‧板狀工件的下表面X、+X、-X、+Y、-Y、+Z、-Z‧‧‧方向3‧‧‧Working clamp table 30‧‧‧
圖1是顯示工作夾台的構造之一例的分解立體圖。 圖2是顯示工作夾台之一例的立體圖。 圖3是局部地顯示使環狀密封部的變形部的角落部分形成為容易變形之材質的情況之一例的立體圖。 圖4是局部地顯示使環狀密封部的變形部的角落部分形成為容易變形之形狀的情況之一例的立體圖。 圖5是顯示將板狀工件載置於工作夾台之狀態的截面圖。 圖6是顯示以工作夾台吸引保持板狀工件之狀態的截面圖。Fig. 1 is an exploded perspective view showing an example of the structure of a work clamp table. Fig. 2 is a perspective view showing an example of a work clamp table. Fig. 3 is a perspective view partially showing an example of a case where the corner portion of the deformed portion of the ring-shaped seal is formed of a material that is easily deformed. 4 is a perspective view partially showing an example of a case where the corner portion of the deformed portion of the ring-shaped seal portion is formed into a shape that is easily deformed. Fig. 5 is a cross-sectional view showing a state in which a plate-shaped workpiece is placed on a work chuck. Fig. 6 is a cross-sectional view showing a state in which a plate-shaped workpiece is sucked and held by a work clamp.
3‧‧‧工作夾台 3‧‧‧Working clamp table
30‧‧‧基台 30‧‧‧Abutment
30a‧‧‧基台的上表面 30a‧‧‧The upper surface of the abutment
31‧‧‧保持部 31‧‧‧Retention Department
32‧‧‧環狀密封部 32‧‧‧Annular seal
36‧‧‧固定螺栓 36‧‧‧Fixed bolt
310‧‧‧保持面 310‧‧‧Keep the noodles
310c‧‧‧吸引孔 310c‧‧‧Suction hole
311‧‧‧吸引路 311‧‧‧Attraction Road
321‧‧‧變形部 321‧‧‧Deformation Department
321a‧‧‧上端 321a‧‧‧Upper
322‧‧‧外延部 322‧‧‧Extension Department
7‧‧‧吸引源 7‧‧‧Attraction source
W‧‧‧板狀工件 W‧‧‧Plate workpiece
Wa‧‧‧板狀工件的上表面 Wa‧‧‧The upper surface of the plate-shaped workpiece
Wb‧‧‧板狀工件的下表面 Wb‧‧‧The bottom surface of the plate-shaped workpiece
X、+Y、-Y、+Z、-Z‧‧‧方向 X, +Y, -Y, +Z, -Z‧‧‧direction
Claims (1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017113376A JP7007816B2 (en) | 2017-06-08 | 2017-06-08 | Chuck table |
JP2017-113376 | 2017-06-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201903878A TW201903878A (en) | 2019-01-16 |
TWI733020B true TWI733020B (en) | 2021-07-11 |
Family
ID=64820283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107114471A TWI733020B (en) | 2017-06-08 | 2018-04-27 | Work clamp |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7007816B2 (en) |
KR (1) | KR102515856B1 (en) |
CN (1) | CN109048655B (en) |
TW (1) | TWI733020B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6880112B2 (en) * | 2019-07-08 | 2021-06-02 | 株式会社日本ピスコ | Adsorption mechanism of mobile device |
CN112792711B (en) * | 2020-12-31 | 2022-05-17 | 武汉风帆电化科技股份有限公司 | Crystal silicon wafer alkali polishing device and polishing process |
JP2023061565A (en) | 2021-10-20 | 2023-05-02 | 株式会社ディスコ | Wafer grinding method and grinding apparatus |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0584682A (en) * | 1991-03-29 | 1993-04-06 | Hitachi Ltd | Vacuum chuck device |
TW200303593A (en) * | 2002-02-19 | 2003-09-01 | Olympus Optical Co | Substrate sucking apparatus |
TW201203446A (en) * | 2010-03-17 | 2012-01-16 | Tokyo Electron Ltd | Substrate attachment and detachment method |
JP2016031979A (en) * | 2014-07-28 | 2016-03-07 | 株式会社日本セラテック | Vacuum chuck |
TW201701991A (en) * | 2015-05-20 | 2017-01-16 | Disco Corp | Cutting apparatus |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2520977A (en) * | 1947-05-08 | 1950-09-05 | Lens Block Corp | Vacuum lens block |
JPH03289154A (en) * | 1990-04-05 | 1991-12-19 | Toshiba Corp | Chucking device of semiconductor wafer |
JP5446662B2 (en) * | 2008-09-26 | 2014-03-19 | Nok株式会社 | Sealing structure |
JP2014072510A (en) * | 2012-10-02 | 2014-04-21 | Disco Abrasive Syst Ltd | Chuck table |
CN203529438U (en) * | 2013-07-22 | 2014-04-09 | 温州阿尔贝斯气动有限公司 | Vacuum chuck |
CN105161449A (en) * | 2014-05-30 | 2015-12-16 | 盛美半导体设备(上海)有限公司 | Wafer fixing device |
JP6732429B2 (en) * | 2014-11-28 | 2020-07-29 | キヤノン株式会社 | Substrate holding apparatus, lithographic apparatus, and article manufacturing method |
CN107004574B (en) * | 2014-12-12 | 2020-06-30 | 佳能株式会社 | Substrate holding device, lithographic apparatus and article manufacturing method |
CN204584958U (en) * | 2015-01-26 | 2015-08-26 | 青海青玻实业有限公司 | A kind of glass handling Acetabula device |
CN207795254U (en) * | 2018-01-15 | 2018-08-31 | 廊坊市建科汇峰科技有限公司 | Shield machine sealing ring |
-
2017
- 2017-06-08 JP JP2017113376A patent/JP7007816B2/en active Active
-
2018
- 2018-04-27 TW TW107114471A patent/TWI733020B/en active
- 2018-06-04 CN CN201810562010.2A patent/CN109048655B/en active Active
- 2018-06-04 KR KR1020180064232A patent/KR102515856B1/en active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0584682A (en) * | 1991-03-29 | 1993-04-06 | Hitachi Ltd | Vacuum chuck device |
TW200303593A (en) * | 2002-02-19 | 2003-09-01 | Olympus Optical Co | Substrate sucking apparatus |
TW201203446A (en) * | 2010-03-17 | 2012-01-16 | Tokyo Electron Ltd | Substrate attachment and detachment method |
JP2016031979A (en) * | 2014-07-28 | 2016-03-07 | 株式会社日本セラテック | Vacuum chuck |
TW201701991A (en) * | 2015-05-20 | 2017-01-16 | Disco Corp | Cutting apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN109048655B (en) | 2022-06-28 |
TW201903878A (en) | 2019-01-16 |
JP7007816B2 (en) | 2022-01-25 |
JP2018207033A (en) | 2018-12-27 |
CN109048655A (en) | 2018-12-21 |
KR102515856B1 (en) | 2023-03-29 |
KR20180134292A (en) | 2018-12-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI733020B (en) | Work clamp | |
JP2691299B2 (en) | Board holder | |
US11309209B2 (en) | Wafer holder and wafer transfer apparatus, system and method | |
JP6627243B2 (en) | Substrate processing method and substrate film forming method | |
JP2018079545A (en) | Loading table having adsorption function | |
TWI637461B (en) | Support for flexible workpieces | |
KR20210025343A (en) | Sealed housing | |
TWI576954B (en) | Workpiece Adhesive Chuck Device and Workpiece Clamping Machine | |
KR101604555B1 (en) | Vacuum chuck apparatus | |
JP3954405B2 (en) | Suction nozzle | |
TW201802014A (en) | Conveying unit by reducing weight of a suction pad exerting onto a plate-like workpiece to prevent damages of the workpiece | |
JP7295366B2 (en) | Suction jig | |
JP2014184502A (en) | Suction pad and workpiece processing device | |
KR102170518B1 (en) | Transport tool, transport method and transport unit | |
JP2501449B2 (en) | Adsorption arm | |
JP2002317810A (en) | Suction structure for printed circuit board material | |
TW201917807A (en) | Leveling device | |
TWI630059B (en) | Substrate adsorption device and workbench | |
JPH04112789U (en) | Adsorption device | |
US20140291942A1 (en) | Chuck structure for substrate cleansing equipment | |
TWM503066U (en) | Jig for substrate fixing | |
KR20170133784A (en) | Apparatus for transferring a substrate | |
JP2004220023A (en) | Device and method for bonding substrate | |
KR101773556B1 (en) | The position alignment device and the method using the same | |
TW202319763A (en) | Sheet and inspection socket wherein the sheet includes an insulating member and a conductive contact member |