TWI732320B - 基板處理裝置以及基板處理方法 - Google Patents

基板處理裝置以及基板處理方法 Download PDF

Info

Publication number
TWI732320B
TWI732320B TW108137597A TW108137597A TWI732320B TW I732320 B TWI732320 B TW I732320B TW 108137597 A TW108137597 A TW 108137597A TW 108137597 A TW108137597 A TW 108137597A TW I732320 B TWI732320 B TW I732320B
Authority
TW
Taiwan
Prior art keywords
gas
substrate
shielding
processing apparatus
cup
Prior art date
Application number
TW108137597A
Other languages
English (en)
Chinese (zh)
Other versions
TW202025360A (zh
Inventor
奥谷洋介
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202025360A publication Critical patent/TW202025360A/zh
Application granted granted Critical
Publication of TWI732320B publication Critical patent/TWI732320B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
TW108137597A 2018-11-02 2019-10-18 基板處理裝置以及基板處理方法 TWI732320B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018207248A JP7187268B2 (ja) 2018-11-02 2018-11-02 基板処理装置及び基板処理方法
JP2018-207248 2018-11-02

Publications (2)

Publication Number Publication Date
TW202025360A TW202025360A (zh) 2020-07-01
TWI732320B true TWI732320B (zh) 2021-07-01

Family

ID=70463964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108137597A TWI732320B (zh) 2018-11-02 2019-10-18 基板處理裝置以及基板處理方法

Country Status (3)

Country Link
JP (1) JP7187268B2 (ja)
TW (1) TWI732320B (ja)
WO (1) WO2020090399A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI799866B (zh) * 2021-01-26 2023-04-21 巨臣科技股份有限公司 半導體製程裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120298147A1 (en) * 2011-05-24 2012-11-29 Satoshi Kaneko Liquid processing apparatus and liquid processing method
TW201836002A (zh) * 2017-03-27 2018-10-01 日商斯庫林集團股份有限公司 基板處理裝置以及基板處理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5676362B2 (ja) * 2011-05-24 2015-02-25 東京エレクトロン株式会社 液処理装置および液処理装置の洗浄方法
JP5996381B2 (ja) * 2011-12-28 2016-09-21 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6017262B2 (ja) * 2012-10-25 2016-10-26 東京エレクトロン株式会社 基板処理装置および基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120298147A1 (en) * 2011-05-24 2012-11-29 Satoshi Kaneko Liquid processing apparatus and liquid processing method
TW201836002A (zh) * 2017-03-27 2018-10-01 日商斯庫林集團股份有限公司 基板處理裝置以及基板處理方法

Also Published As

Publication number Publication date
TW202025360A (zh) 2020-07-01
JP7187268B2 (ja) 2022-12-12
WO2020090399A1 (ja) 2020-05-07
JP2020072228A (ja) 2020-05-07

Similar Documents

Publication Publication Date Title
TWI556876B (zh) 基板處理裝置及基板處理方法
KR101905289B1 (ko) 기판 처리 장치 및 기판 처리 방법
US9508567B2 (en) Cleaning jig and cleaning method for cleaning substrate processing apparatus, and substrate processing system
JP5536009B2 (ja) 基板加工装置
TWI543822B (zh) 基板處理裝置及基板處理方法
TWI687971B (zh) 基板處理裝置及基板處理方法
KR101867748B1 (ko) 기판 처리 장치
KR101975143B1 (ko) 기판 처리 방법 및 기판 처리 장치
TWI732320B (zh) 基板處理裝置以及基板處理方法
KR101770535B1 (ko) 기판 처리 장치
JP2018056166A (ja) 基板処理方法および基板処理装置
US20170287743A1 (en) Substrate treating device and substrate treating method
JP6280789B2 (ja) 基板処理装置および基板処理方法
JP2018093133A (ja) 基板処理装置