TWI732320B - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

A substrate processing apparatus (1) includes a substrate holder (5), a substrate rotating section (7), a shielding section (19), a shielding section operating mechanism (21), a processing liquid supply section (9), and a cap (11). The substrate holder (5) holds a substrate (W) horizontally. The substrate rotating section (7) rotates the substrate (W) together with the substrate holder (5) about a central axis (AX) extending in an up-and-down direction. The shielding section (19) is located opposite to an upper surface (Wa) of the substrate (W). The shielding section operating mechanism (21) causes the shielding section (19) to operate. The processing liquid supply section (9) supplies a processing liquid to the substrate (W). The cap (11) is disposed around the substrate holder (5) to receive the processing liquid. The shielding section (19) has an air outlet (191) through which air (AR) toward an inner wall surface (110) of the cap (11) flows out.

Description

Substrate processing device and substrate processing method

The present invention relates to a substrate processing device and a substrate processing method.

The substrate processing apparatus described in Patent Document 1 performs chemical solution processing on a substrate. The substrate processing apparatus includes a liquid receiving part. The liquid receiving part is equipped with a cup part. When the substrate is processed with a chemical solution, the cup body part rises and the periphery of the substrate held by the spin chuck is surrounded by the guide part of the cup body part. Then, the substrate rotates together with the spin chuck, and the chemical solution is supplied from the discharge head toward the upper surface of the substrate. The chemical liquid flows along the upper surface of the substrate by the centrifugal force caused by the rotation of the substrate and is scattered from the edge of the substrate toward the side. The liquid medicine scattered from the edge of the substrate flows down along the inner wall surface of the guide portion of the cup body and is discharged from the waste groove.

In particular, the liquid receiving part is further equipped with a liquid collecting part. The liquid collecting part is arranged on the inner side of the guiding part of the cup body part. The inner peripheral surface of the liquid collecting part has a plurality of grooves. Each groove extends in the vertical direction. Therefore, the droplets of the processing liquid scattered from the edge portion of the substrate first adhere to the inner peripheral surface of the liquid collecting portion. Most of the liquid droplets attached to the inner peripheral surface flow along the semicircular curved surface in each groove and merge with other attached droplets. The droplets after the confluence flow down along the extending direction of the groove with a relatively larger weight than the droplets before the confluence.

Therefore, it is possible to prevent liquid droplets from staying on the inner wall surface of the cup body. As a result, it is possible to reduce the contamination of the substrate caused by the state in which the liquid droplets have been left on the inner wall surface of the cup body portion.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2018-56151.

However, in recent years, there has been a desire to further suppress the retention of liquid droplets on the inner wall surface of the cup body.

The present invention has been developed in view of the above-mentioned problems, and its object is to provide a substrate processing apparatus and a substrate processing method that can effectively prevent liquid droplets from staying on the inner wall surface of the cup portion.

According to one aspect of the present invention, a substrate processing apparatus includes a substrate holding portion, a substrate rotating portion, a shielding portion, a shielding portion operating mechanism, a processing liquid supply portion, and a cup portion. The substrate holding portion holds the substrate horizontally. The substrate rotating portion integrally rotates the substrate and the substrate holding portion around a central axis extending in the up-down direction. The shielding portion is opposite to the upper surface of the aforementioned substrate. The shielding part operation mechanism operates the aforementioned shielding part. The processing liquid supply unit supplies the processing liquid to the aforementioned substrate. The cup portion is arranged around the substrate holding portion to receive the processing liquid. The shielding portion has a gas outflow port, and the gas outflow port is for outflow of the gas toward the inner wall surface of the cup portion.

In the substrate processing apparatus of the present invention, the gas outflow port is preferably located at the peripheral edge of the shielding portion.

In the substrate processing apparatus of the present invention, the cup portion preferably has an upper end portion of the cup body, and the upper end portion of the cup body is located above the substrate. The aforementioned gas outlet is better It is adjacent to the upper end of the aforementioned cup.

In the substrate processing apparatus of the present invention, the shielding portion preferably covers the entire upper surface of the substrate and shields the upper side of the substrate. The gas outflow port preferably faces the inner wall surface of the cup portion.

In the substrate processing apparatus of the present invention, the shielding portion preferably has a shielding plate, and the shielding plate is opposed to the upper surface of the substrate. Preferably, the shielding plate has an opposite wall surface, and the opposite wall surface faces the inner wall of the cup portion. The gas outflow port is preferably provided on the opposing wall surface.

In the substrate processing apparatus of the present invention, the shielding plate preferably has: the gas outlet; the gas inlet for the gas to flow in; and a gas flow path. The gas flow path preferably connects the gas inflow port and the gas outflow port.

In the substrate processing apparatus of the present invention, the inner wall surface of the cup portion preferably has a cup inclined surface, and the cup inclined surface is inclined downward from the central axis toward the radially outward direction. The inner surface constituting the gas flow path preferably has a flow path inclined surface, and the flow path inclined surface is inclined downward as it goes outward in the radial direction. The inclination angle of the inclined surface of the flow path with respect to the horizontal direction is preferably equal to or less than the inclination angle of the inclined surface of the cup body with respect to the horizontal direction.

In the substrate processing apparatus of the present invention, it is preferable to further include a gas supply unit, and the gas supply unit supplies the gas. The gas supplied from the gas supply unit preferably flows into the gas inflow port.

In the substrate processing apparatus of the present invention, the gas inflow port is preferably located on the upper surface of the shielding plate. The gas flow path preferably communicates the gas inflow port and the gas outflow port. The gas supply unit preferably has a fan, and the fan sends the gas to the gas inlet. The aforementioned fan is preferably arranged on the upper surface of the aforementioned shielding plate unit.

In the substrate processing apparatus of the present invention, the shielding portion preferably further has a shaft portion, and the shaft portion is fixed to the shielding plate. It is preferable that the said shaft part rotates with the said shielding board centering on the said central axis. The fan is preferably inserted into the shaft portion and blows the gas sucked from above the shielding plate in a radial direction with respect to the central axis.

In the substrate processing apparatus of the present invention, the gas supply unit preferably further has a nozzle, and the nozzle is opposed to the fan. The nozzle preferably blows the gas from the upper surface side of the shielding plate toward the fan.

In the substrate processing apparatus of the present invention, the shielding portion preferably further has a shaft portion, and the shaft portion is fixed to the shielding plate. It is preferable that the said shaft part rotates with the said shielding board centering on the said center axis|shaft. The shielding portion preferably has a hole portion, and the hole portion penetrates the shaft portion and the shielding plate and extends along the central axis. The processing liquid supply part preferably has a flow part, and the flow part is for the flow of the treatment liquid; the flow part is preferably arranged in the hole. The gas supply part preferably supplies the gas to the gap between the outer surface of the flow part and the wall surface constituting the hole part. The gas inflow port is preferably provided on the wall surface constituting the hole.

In the substrate processing apparatus of the present invention, the gas supply unit preferably has a fan filter unit. The fan filter unit is preferably arranged on the top plate of the aforementioned substrate processing apparatus. The fan filter unit preferably generates a downflow from above the shielding plate toward the substrate holding portion.

In the substrate processing apparatus of the present invention, the shielding portion preferably has a shielding plate and a nozzle. The shielding plate is preferably opposite to the upper surface of the aforementioned substrate. The nozzle is preferably arranged on the upper surface of the shielding plate. The opening of the aforementioned nozzle is preferably the aforementioned gas outlet, and the front The opening of the nozzle is preferably facing the inner wall of the cup body.

In the substrate processing apparatus of the present invention, it is preferable that the shielding section operating mechanism includes a shielding section moving mechanism, and the shielding section moving mechanism raises or lowers the shielding section.

In the substrate processing apparatus of the present invention, it is preferable that the shielding section operating mechanism includes a shielding section rotating mechanism, and the shielding section rotating mechanism rotates the shielding section.

In the substrate processing apparatus of the present invention, the shielding portion preferably has a plurality of engaging portions, and the plurality of engaging portions are engaged with the substrate holding portion. It is preferable that the shielding part rotates integrally with the substrate holding part by the engagement of the plurality of engaging parts with the substrate holding part.

A substrate processing method of another aspect of the present invention includes: a holding step of holding the substrate by a substrate holding portion; a shielding portion approaching step of bringing the substrate holding portion and the shielding portion closer to each other; and a rotating step of making the aforementioned The substrate rotates with the substrate holding portion; the air flow generation step is to make the gas flow out of the gas outlet of the shielding portion to generate the air flow toward the inner wall surface of the cup portion; and the processing step is to process the substrate with a processing liquid .

In the substrate processing method of the present invention, in the gas flow generating step, the gas preferably flows out from the gas outflow port located at the peripheral edge of the shielding portion and flows along the inner wall surface of the cup portion.

In the substrate processing method of the present invention, the cup portion preferably has an upper end portion of the cup body, and the upper end portion of the cup body is located above the substrate. In the gas generating step, the gas preferably flows out from the gas outlet adjacent to the upper end of the cup toward the upper end of the cup.

According to the present invention, it is possible to provide a substrate processing apparatus and a substrate processing method that can effectively prevent liquid droplets from staying on the inner wall surface of the cup portion.

1,1A: Substrate processing equipment

3: chamber

3a: Top plate

5, 5A: Board holding part

7: Substrate rotating part

9: Treatment liquid supply part

11: Cup body

11a: Inclined part

11b: side wall

15: Cup moving mechanism

17: discharge port

19, 19A, 19B: shielding part

19a, 19x: shielding plate

19b: Shaft

19c: Peripheral part

19d: Flange

21: Shading part action mechanism

21a, 21X: moving mechanism for shielding part

21b: Shading part rotation mechanism

22, 35, 37: Gas supply mechanism (gas supply part)

24: Fan filter unit (gas supply part)

31: Fan (gas supply part)

33, 39: nozzle

41A, 41B: snap part

51: Rotating base

53: Clamping member

61: holding part

62: Lifting mechanism

71: Motor

73: Axis

91: Treatment liquid nozzle (circulation part)

91a: outer surface

93: Treatment liquid supply mechanism

100: Substrate processing system

110: inner wall

111: The upper end of the cup

113: Cup body inclined surface

190: Opposite Wall

191: Gas Outlet

192: Concave

193: Gas Inlet

195: Gas flow path

196: upper surface part

201: base member

203: Upper member

205: Pillar

371: Gas Path

371a: lower surface jet

371b: Side jet

390: open

611: Holder body

612: body support

613: Flange Support

614: Support part connection part

931: Treatment fluid flow path

931a: spit out

1951: inner surface

1951a: Inclined surface of flow path

AD: axial

AR: Gas

AX: central axis

C: substrate container

CD: circumferential direction

CR: Handling robot

RD: radial

GP: Gap

IR: Index Robot

LQ: droplets

PS: Grant and Acceptance Department

Sb: Hole

U1: Index unit

U2: Processing Unit

W: substrate

Wa: upper surface

WL: Wall surface

θ1, θ2: tilt angle

[Fig. 1] A schematic cross-sectional view showing a substrate processing system according to Embodiment 1 of the present invention.

[Fig. 2] A schematic cross-sectional view showing the substrate processing apparatus of Embodiment 1. [Fig.

[Fig. 3] (a) is a schematic cross-sectional view showing the shielding portion and cup portion of the substrate processing apparatus of Embodiment 1, and Fig. 3(b) is a schematic cross-sectional view showing the shielding portion of the substrate processing apparatus of Embodiment 1 Top view.

[Fig. 4] An enlarged schematic cross-sectional view showing a part of the shielding portion and the cup portion shown in (a) in Fig. 3.

[Fig. 5] A flow chart showing the substrate processing method of Embodiment 1. [Fig.

[FIG. 6] (a) is a schematic cross-sectional view showing the shielding portion, cup portion, and fan of the substrate processing apparatus of the first modification of Embodiment 1, and (b) of FIG. 6 shows the first modification A schematic plan view of the shielding part and the fan of the substrate processing apparatus.

[Fig. 7] A schematic cross-sectional view showing the shielding portion, the cup portion, and the gas supply mechanism of the substrate processing apparatus according to the second modification of Embodiment 1. [Fig.

[Fig. 8] A schematic cross-sectional view showing the shielding portion, the cup portion, and the gas supply mechanism of the substrate processing apparatus of the third modification of Embodiment 1. [Fig.

[Fig. 9] A schematic cross-sectional view showing the shielding portion and the cup portion of the substrate processing apparatus according to the fourth modification of Embodiment 1. [Fig.

[Fig. 10] A schematic cross-sectional view showing a substrate processing apparatus according to Embodiment 2 of the present invention.

Fig. 11 is a schematic side view showing the processing liquid supply part of the substrate processing apparatus of the second embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the figure, the same or equivalent parts are given the same reference symbols and the description is not repeated. Furthermore, in the embodiment of the present invention, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are parallel to the horizontal direction, and the Z axis is parallel to the vertical direction.

[Embodiment 1]

The substrate processing system 100 according to Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 5. The substrate processing system 100 processes the substrate W. The substrate W is, for example, a semiconductor wafer (wafer), a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (Field Emission Display: FED), a substrate for an optical disk, a substrate for a magnetic disk, and a magnetic disk. Substrates for optical discs, substrates for photomasks, ceramic substrates, or substrates for solar cells. The substrate W is, for example, substantially disc-shaped.

First, the substrate processing system 100 will be described with reference to FIG. 1. FIG. 1 is a schematic top view showing a substrate processing system 100. As shown in FIG. As shown in FIG. 1, the substrate processing system 100 has an indexer unit U1 and a processing unit U2. The index unit U1 includes a plurality of substrate storage containers C and an indexer robot IR. The processing unit U2 includes a plurality of substrate processing devices 1, a transfer robot CR, and a transfer unit PS.

In each substrate storage container C, a plurality of substrates W are stacked and stored. The index robot IR takes out the unprocessed substrate W from any one substrate container C among the plurality of substrate containers C and delivers the substrate W to the accepting part PS. Then, the substrate W that has been taken out from the substrate storage container C is placed on the receiving and receiving part PS. The transfer robot CR receives the unprocessed substrate W from the transfer unit PS and transfers the substrate W to any one of the plurality of substrate processing apparatuses 1.

Then, the substrate processing apparatus 1 processes the unprocessed substrate W. The substrate processing apparatus 1 is a blade type that processes substrates W one by one. In the embodiment, the substrate processing apparatus 1 uses a processing liquid to The substrate W is processed.

After the processing by the substrate processing apparatus 1 is performed, the transfer robot CR takes the processed substrate W from the substrate processing apparatus 1 and delivers the substrate W to the transfer unit PS. Then, the substrate W that has been processed by the substrate processing apparatus 1 is placed on the transfer section PS. The index robot IR receives the processed substrate W from the accepting part PS and stores the substrate W in any one of the plurality of substrate storage containers C.

Next, the substrate processing apparatus 1 will be described with reference to FIG. 2. FIG. 2 shows a schematic cross section of the substrate processing apparatus 1. As shown in FIG. 2, the substrate processing apparatus 1 has a chamber 3, a substrate holding portion 5, a substrate rotating portion 7, a processing liquid supply portion 9, a plurality of cup portions 11, and a plurality of cup moving mechanisms 15, A discharge port 17, a shielding portion 19, and a shielding portion operating mechanism 21.

The chamber 3 has a substantially box shape. The chamber 3 has a top plate part 3a. The chamber 3 accommodates the substrate holding portion 5, the substrate rotating portion 7, the processing liquid supply portion 9, the plurality of cup portions 11, the shielding portion 19, and the shielding portion operating mechanism 21.

The substrate holding portion 5 holds the substrate W horizontally. Specifically, the substrate holding portion 5 has a spin base 51 and a plurality of chuck members 53. A plurality of clamping members 53 are provided on the rotating base 51. The plurality of clamping members 53 hold the substrate W in a horizontal posture. The rotating base 51 has a substantially disc shape, and supports a plurality of clamping members 53 in a horizontal posture.

The substrate rotating portion 7 integrally rotates the substrate W and the substrate holding portion 5 with the center axis AX as the center. The central axis AX extends toward the upper and lower directions of the substrate W. Specifically, the substrate rotating unit 7 includes a motor 71 and a shaft 73. The shaft 73 is coupled to the rotating base 51. The motor 71 passes through the shaft 73 and rotates the rotating base 51 around the central axis AX. As a result, the substrate W that has been held by the plurality of clamping members 53 rotates around the central axis AX.

The processing liquid supply unit 9 supplies the processing liquid to the substrate W. The composition system of the processing liquid is not particularly limited as long as it is within the range capable of processing the substrate W. For example, the treatment liquid can be either a chemical liquid or It is rinse liquid. The chemical liquid is, for example, a polymer removal liquid or an etching liquid. The rinsing liquid is, for example, pure water or carbonated water. Specifically, the processing liquid supply unit 9 includes a processing liquid nozzle 91 and a processing liquid supply mechanism 93. The processing liquid supply mechanism 93 is connected to the processing liquid nozzle 91 and supplies the processing liquid to the processing liquid nozzle 91. The processing liquid supply mechanism 93 has, for example, a valve and a pipe. The processing liquid system circulates through the processing liquid nozzle 91. Then, the processing liquid nozzle 91 discharges the processing liquid toward the upper surface Wa of the substrate W while the substrate W is rotating. The processing liquid nozzle 91 corresponds to an example of the "circulation part".

The respective cup portions 11 of the plurality of cup portions 11 receive the processing liquid scattered from the substrate W. The plurality of cup portions 11 are arranged around the substrate holding portion 5 and have a shape that is rotationally symmetric with respect to the central axis AX. For example, each of the plurality of cup portions 11 has a substantially cylindrical shape.

Each cup part 11 of the plurality of cup parts 11 is raised or lowered between the receiving position and the retreating position. The liquid receiving position indicates the position where the cup portion 11 and the substrate W are opposed to the radial direction RD. The cup portion 11 receives the processing liquid scattered from the substrate W when it is located at the liquid receiving position. The radial direction RD indicates the radial direction with respect to the central axis AX, and is orthogonal to the central axis AX. On the other hand, the retreat position shows a position below the liquid receiving position.

Specifically, when the substrate W is processed with the processing liquid, at least one cup portion 11 is located at the liquid receiving position. Then, the substrate W is rotated integrally with the substrate holding portion 5, and the processing liquid is supplied from the processing liquid nozzle 91 to the upper surface Wa of the substrate W. The processing liquid flows along the upper surface Wa of the substrate W by the centrifugal force caused by the rotation of the substrate W, and scatters outward from the edge of the substrate W toward the radial direction RD. The cup portion 11 receives the processing liquid scattered from the edge portion of the substrate W. Then, the treatment liquid flows down along the inner wall surface 110 of the cup portion 11 and is discharged from the discharge port 17.

The plurality of cup moving mechanisms 15 are respectively arranged corresponding to the plurality of cup parts 11. The cup moving mechanism 15 raises or lowers the corresponding cup part 11 between the liquid receiving position and the retracted position. The cup moving mechanism 15 includes, for example, an electric motor and a ball screw.

The shielding portion 19 is opposed to the axial direction AD with respect to the upper surface Wa of the substrate W. Then, the shielding portion 19 covers the entire upper surface Wa of the substrate W and shields the upper side of the substrate W. The axial direction AD shows the direction parallel to the central axis AX.

Specifically, the shielding portion 19 has a shielding plate 19a, a shaft portion 19b, and a hole portion Sb. The shielding plate 19a expands outward in the radial direction RD with the center axis AX as the center. The shielding plate 19a has a substantially disc shape. The shielding plate 19a is opposed to the axial direction AD with respect to the upper surface Wa of the substrate W. Then, the shielding plate 19a covers the entire upper surface Wa of the substrate W and shields the upper side of the substrate W. The shaft portion 19b is fixed to the shielding plate 19a. The shaft portion 19b rotates together with the shielding plate 19a centered on the central axis AX. The shaft portion 19b has a substantially cylindrical shape, for example. The hole Sb penetrates the shaft portion 19b and the shielding plate 19a and extends along the central axis AX. The processing liquid nozzle 91 is arranged in the hole Sb.

The shielding portion operating mechanism 21 operates the shielding portion 19. Specifically, the shielding unit operating mechanism 21 includes a shielding unit moving mechanism 21a and a shielding unit rotating mechanism 21b.

The shielding part moving mechanism 21a raises or lowers the shielding part 19 in the axial direction AD. Specifically, the shielding part moving mechanism 21a raises or lowers the shielding part 19 between the adjacent position and the retracted position. The adjacent position is a position where the display shielding portion 19 descends and is adjacent to the upper surface Wa of the substrate W with a predetermined interval. In Fig. 2, the shielding portion 19 is located in an adjacent position. The retreat position is above the adjacent position, and the position where the shielding portion 19 rises and is separated from the substrate W is displayed. When the substrate W is processed with the processing liquid, the shielding part moving mechanism 21a moves the shielding part 19 to an adjacent position. The shield moving mechanism 21a includes, for example, an electric motor and a ball screw.

The shielding part rotation mechanism 21b rotates the shielding part 19 centering on the central axis AX. Specifically, the shielding portion rotation mechanism 21b rotates the shielding portion 19 and the substrate holding portion 5 in synchronization. The synchronous rotation system means rotating in the same direction as the substrate holding portion 5 at the same rotation speed. The shield rotation mechanism 21b includes, for example, an electric motor.

The substrate processing apparatus 1 may further have a gas supply mechanism 22 and a fan filter unit twenty four. The chamber 3 contains a gas supply mechanism 22.

The gas supply mechanism 22 supplies gas to the hole Sb. The gas is, for example, an inert gas such as nitrogen. The gas supply mechanism 22 includes, for example, a valve and a pipe.

The fan filter unit 24 supplies gas to the inside of the chamber 3. Specifically, the fan filter unit 24 is arranged on the top plate portion 3a of the substrate processing apparatus 1. Then, the fan filter unit 24 generates a downward flow from above the shielding plate 19a toward the substrate holding portion 5. More specifically, the fan filter unit 24 has a fan and a filter. Then, the fan filter unit 24 takes in the external air of the substrate processing apparatus 1 by a fan, and supplies the external air to the inside of the chamber 3 through the filter. The outside air is clean air. Furthermore, the substrate processing apparatus 1 is installed in a clean room. The fan filter unit 24 is equivalent to an example of the "gas supply unit".

Next, the shielding portion 19 will be described with reference to (a) in FIG. 3 and (b) in FIG. 3. (A) in FIG. 3 is a schematic cross-sectional view showing the shielding portion 19 and the cup portion 11. In (a) of FIG. 3, the shielding portion 19 is located in an adjacent position. (B) in FIG. 3 is a schematic plan view showing the shielding portion 19. In (b) of FIG. 3, the shielding portion 19 is viewed from above. In this specification, the plan view shows that the object is viewed from the axial direction AD.

As shown in (a) of FIG. 3, the shielding portion 19 has a gas outlet 191. Then, the gas AR toward the inner wall surface 110 of the cup portion 11 flows out from the gas outlet 191. Therefore, in the inner wall surface 110 of the cup portion 11, the airflow flowing from the upper part to the lower part can be generated by the gas AR.

As a result, according to the first embodiment, the liquid droplets LQ that have adhered to the inner wall surface 110 of the cup portion 11 can be made to flow down smoothly by the air flow. In other words, it is possible to effectively prevent the droplets LQ from staying on the inner wall surface 110 of the cup portion 11. Therefore, compared with the case where the gas outlet 191 is not provided, the generation of particles on the inner wall surface 110 of the cup portion 11 and the contamination of the substrate W due to the splashback phenomenon can be more effectively suppressed. The so-called fine particles refer to substances produced by solidification of liquid droplets LQ that have adhered to the inner wall surface 110 of the cup portion 11. The so-called splash phenomenon refers to the new processing liquid scattered from the substrate W toward the cup portion 11 and the droplets LQ composed of the old processing liquid that has adhered to the inner wall surface 110 of the cup portion 11 A phenomenon in which the processing liquid bounces back toward the substrate W due to collision.

In particular, in the first embodiment, the gas outlet 191 is located at the peripheral edge portion 19c of the shielding portion 19. Therefore, the gas AR flowing out from the gas outlet 191 easily faces the inner wall surface 110 of the cup portion 11. As a result, in the inner wall surface 110, the gas AR can effectively generate the airflow flowing from the upper part to the lower part, and the liquid droplets LQ attached to the inner wall surface 110 can flow down more smoothly by the airflow.

In addition, in the first embodiment, the gas outlet 191 faces the inner wall surface 110 of the cup portion 11. Therefore, in the inner wall surface 110, the airflow flowing from the upper part to the lower part can be more effectively generated by the gas AR. As a result, it is possible to make the droplets LQ attached to the inner wall surface 110 flow down more smoothly by the airflow.

In particular, in the first embodiment, the shielding portion 19 can be easily arranged by the shielding portion moving mechanism 21a so that the gas outlet 191 faces the inner wall surface 110 of the cup portion 11.

Moreover, in Embodiment 1, the shielding part 19 is rotated by the shielding part rotation mechanism 21b centering on the central axis AX. Therefore, the airflow of the gas AR flowing out from the gas outlet 191 can be efficiently generated by the rotation of the shielding portion 19. As a result, the gas AR can make the liquid droplets LQ attached to the inner wall surface 110 of the cup portion 11 flow down more smoothly.

As shown in (a) in FIG. 3 and (b) in FIG. 3, the shielding plate 19 a of the shielding portion 19 has a base member 201, an upper member 203 and a plurality of pillars 205. Furthermore, the pillar 205 is not shown in (a) of FIG. 3.

The base member 201 and the upper member 203 are opposed to each other with an interval in the axial direction AD. Each pillar 205 of the plurality of pillars 205 protrudes upward from the base member 201. The plurality of pillars 205 are arranged on the base member 201 along the circumferential direction CD with respect to the center axis AX. A plurality of pillars 205 support the upper member 203. In other words, a plurality of pillars 205 connect the base member 201 and the upper member 203 together. In Embodiment 1, in a plan view, the base member 201 has a substantially disc shape, and the upper member 203 has a substantially circular belt shape.

The shielding plate 19a has a gas outlet 191, a gas inlet 193, and a gas flow path 195. In the first embodiment, each of the gas outlet 191 and the gas inlet 193 has a substantially annular shape in a plan view. The gas inlet 193 is located on the upper surface portion 196 of the shielding plate 19a. Gas flows into the gas inlet 193. For example, the gas flows in from the gas inlet 193 by the rotation of the shielding plate 19a.

For example, the fan filter unit 24 (FIG. 2) supplies gas to the gas inlet 193. Therefore, the gas supplied from the fan filter unit 24 flows into the gas inflow port 193. In other words, even the downward flow generated by the fan filter unit 24 can still generate the air flow of the air AR flowing out from the air outlet 191. As a result, the gas AR can make the liquid droplets LQ attached to the inner wall surface 110 of the cup portion 11 flow down more smoothly.

The gas flow path 195 is formed by the space between the base member 201 and the upper member 203. The gas flow path 195 connects the gas inflow port 193 and the gas outflow port 191. Therefore, according to the first embodiment, it is possible to take in gas from the gas inlet 193 and flow the gas to the gas flow path 195, and to make the gas AR flow out from the gas outlet 191 toward the inner wall surface 110 of the cup portion 11.

In particular, in the first embodiment, the gas outlet 191 is opened to the outside of the central axis AX in all directions in the radial direction RD. Therefore, the gas AR can be blown uniformly to the inner wall surface 110 of the cup portion 11 in the circumferential direction CD. As a result, the gas AR can make the liquid droplets LQ attached to the inner wall surface 110 flow down more smoothly.

Next, the shielding portion 19 will be described in detail with reference to FIG. 4. 4 is an enlarged schematic cross-sectional view showing a part of the shielding portion 19 and the cup portion 11 shown in (a) of FIG. 3. As shown in FIG. 4, the shielding plate 19 a of the shielding portion 19 has an opposing wall surface 190. The opposed wall surface 190 is opposed to the inner wall surface 110 of the cup portion 11 in the radial direction RD. The facing wall surface 190 is the surface of the peripheral edge portion 19c. The gas outlet 191 is provided on the opposite wall 190. Therefore, according to the first embodiment, the gas AR flowing out from the gas outlet 191 is easily directed toward the inner wall surface 110 of the cup portion 11 and the liquid droplet LQ can be smoothly flowed down by the gas AR.

In addition, the inner surface 1951 of the gas flow path 195 constituting the shielding plate 19a has a flow path inclined surface 1951a. The flow path inclined surface 1951a is inclined downward as it goes outward in the radial direction RD.

On the other hand, the cup portion 11 has an inclined portion 11a and a side wall portion 11b. The inclined portion 11a is inclined upward on the side of the central axis AX with respect to the side wall portion 11b. The inclined portion 11a has a substantially truncated cone shape with a hollow opening up and down. The side wall portion 11b extends along the central axis AX. The side wall portion 11b has a substantially cylindrical shape.

The cup body 11 has a cup upper end 111. The upper end 111 of the cup body is the upper end of the inclined portion 11a. The upper end 111 of the cup body is located above the substrate W. Then, the gas outlet 191 is adjacent to the upper end 111 of the cup body at intervals. Therefore, according to the first embodiment, in the inner wall surface 110, a strong airflow flowing from the upper part to the lower part can be generated by the gas AR. As a result, it is possible to make the droplet LQ flow down more smoothly by the air flow.

In addition, the inner wall surface 110 of the cup portion 11 has a cup inclined surface 113. The cup inclined surface 113 is the inner wall surface of the inclined portion 11 a of the inner wall surface 110 of the cup portion 11. The cup inclined surface 113 is inclined downward from the center axis AX toward the outside of the radial direction RD.

Then, the inclination angle θ1 of the flow path inclined surface 1951a of the shielding portion 19a with respect to the horizontal direction is equal to or less than the inclination angle θ2 of the cup inclined surface 113 of the cup portion 11 with respect to the horizontal direction. Therefore, according to the first embodiment, the gas AR flowing out along the inclined surface 1951a of the flow path can be effectively blown to the inclined surface 113 of the cup, and the airflow from the inclined surface 113 of the cup can be effectively generated downward. As a result, it is possible to make the droplet LQ flow down more smoothly by the air flow.

Next, the substrate processing method of Embodiment 1 will be described with reference to FIGS. 2 and 5. The substrate processing method can be executed by the substrate processing apparatus 1. Fig. 5 is a flowchart showing the substrate processing method of the first embodiment. As shown in FIG. 5, the substrate processing method includes steps S1 to S5.

As shown in FIGS. 2 and 5, in step S1, the substrate processing apparatus 1 holds the substrate W by the substrate holding portion 5. Step S1 is equivalent to an example of "holding step".

In step S2, the substrate processing apparatus 1 brings the substrate holding portion 5 and the shielding portion 19 close to each other. Step S2 is equivalent to an example of "a step of approaching a shielding part".

In step S3, the substrate processing apparatus 1 rotates the substrate W together with the substrate holding portion 5. Step S3 is equivalent to an example of the "rotating step".

In step S4, the substrate processing apparatus 1 causes the gas to flow out from the gas outlet 191 of the shielding portion 19 and generates a gas flow toward the inner wall surface 110 of the cup portion 11. Step S5 is equivalent to an example of "air flow generation step".

In step S5, the substrate processing apparatus 1 processes the substrate W with a processing liquid. Step S5 is equivalent to an example of "processing step".

As described above with reference to FIGS. 2 and 5, according to the substrate processing method of Embodiment 1, in step S4, the gas flow generated based on the gas AR from the gas outlet 191 flows from the upper portion of the inner wall surface 110 toward the lower portion. It flows along the inner wall surface 110. Therefore, the droplets LQ that have adhered to the inner wall surface 110 of the cup portion 11 can be smoothly flowed down. In other words, it is possible to effectively prevent the droplets LQ from staying on the inner wall surface 110 of the cup portion 11.

Particularly in the first embodiment, in step S4, the gas AR flows out from the gas outlet 191 located at the peripheral edge portion 19c of the shielding portion 19 and flows along the inner wall surface 110 of the cup portion 11. Specifically, in step S4, the gas AR flows out from the gas outlet 191 adjacent to the upper end 111 of the cup toward the upper end 111 of the cup. Therefore, the liquid droplets LQ that have adhered to the inner wall surface 110 of the cup portion 11 can flow down more smoothly by the airflow generated by the gas AR.

In addition, in the first embodiment, in parallel with the supply of the processing liquid to the substrate W in step S5, the gas AR can flow out from the gas outlet 191. Therefore, the liquid droplets LQ caused by the scattered processing liquid during the processing of the substrate W can be effectively caused to flow down the inner wall surface 110 of the cup portion 11 by the airflow generated by the gas AR.

Furthermore, as long as step S4 can be executed before step S5, steps S2 to The execution order of step S4 can be appropriately changed, and some or all of the steps from step S2 to step S4 can also be executed in parallel.

[First modification example]

The substrate processing apparatus 1 of the first modification of Embodiment 1 will be described with reference to (a) in FIG. 6 and (b) in FIG. 6. The main difference between the first modification example and the first embodiment described with reference to FIGS. 1 to 5 is that the substrate processing apparatus 1 has a fan 31 for generating airflow. Hereinafter, the difference between the first modification example and the first embodiment will be mainly explained.

(A) in FIG. 6 is a schematic cross-sectional view showing the shielding portion 19, the cup portion 11, and the fan 31 of the substrate processing apparatus 1 of the first modification. In Fig. 6(a), the shielding portion 19 is located in an adjacent position. (B) of FIG. 6 is a schematic plan view showing the shielding portion 19 and the fan 31 of the substrate processing apparatus 1 of the first modification. In (b) of FIG. 6, the shielding portion 19 and the fan 31 are seen in a plan view.

As shown in Fig. 6(a) and Fig. 6(b), the substrate processing apparatus 1 has a fan 31 in addition to the structure of the substrate processing apparatus 1 shown in Fig. 2. The fan 31 is arranged on the upper surface portion 196 of the shielding plate 19 a of the shielding portion 19. The fan 31 supplies gas to the gas inlet 193. Therefore, the gas supplied from the fan 31 flows into the gas inlet 193. As a result, according to the first modified example, compared with the case where the fan 31 is not provided, a stronger air flow can be generated by the gas AR flowing out from the gas outlet 191, and the cup body 11 can be The droplets LQ on the inner wall surface 110 flow down more smoothly. The fan 31 corresponds to an example of the "gas supply unit".

Especially in the first modification example, the shielding plate 19a further has a recess 192. The recessed part 192 is formed in the upper surface part 196 of the shielding board 19a. The fan 31 is arranged in the recess 192. Then, the fan 31 sends the gas to the gas inlet 193 located on the upper surface portion 196 of the shielding plate 19a. Specifically, the fan 31 sends out the gas to the gas inlet 193 located in the recess 192 of the shielding plate 19a.

More specifically, the fan 31 is inserted into the shaft portion 19b so as to blow the air sucked from above the shielding plate 19a toward the radial direction RD with respect to the central axis AX. Therefore, according to the first modification example, gas with a relatively strong gas flow can be flowed into the gas inlet 193, and gas AR with a relatively strong gas flow can be ejected from the gas outlet 191. As a result, in the inner wall surface 110, the gas AR can generate a relatively strong air current flowing from the upper part to the lower part, and the liquid droplets LQ on the inner wall surface 110 can flow down more smoothly. The fan 31 is, for example, a Sirocco fan.

[Second modification example]

The substrate processing apparatus 1 according to the second modification of the first embodiment will be described with reference to FIG. 7. The main difference between the second modification and the first modification is that the substrate processing apparatus 1 has a nozzle 33 for generating airflow. Hereinafter, the difference between the second modification example and the first modification example will be mainly explained.

FIG. 7 is a schematic cross-sectional view showing the shielding portion 19, the cup portion 11, and the gas supply mechanism 35 of the substrate processing apparatus 1 of the second modification. In Fig. 7, the shielding portion 19 is located in an adjacent position. As shown in FIG. 7, the substrate processing apparatus 1 has a gas supply mechanism 35 in addition to the structure of the substrate processing apparatus 1 shown in FIG. 2. The gas supply mechanism 35 supplies gas to the gas inlet 193. Then, the gas supplied from the gas supply mechanism 35 flows into the gas inflow port 193. The gas supply mechanism 35 corresponds to an example of the "gas supply unit".

Specifically, the gas supply mechanism 35 has a fan 31 and a nozzle 33. The fan 31 is the same as the fan 31 of the first modification. The nozzle 33 is opposed to the axial direction AD with respect to the fan 31. The nozzle 33 ejects gas toward the fan 31 from the upper surface side of the shielding plate 19a. Furthermore, the fan 31 sends out the gas from the nozzle 33 to the gas inlet 193. Therefore, compared with the case where the nozzle 33 is not provided, it is possible to inject gas with a stronger gas flow into the gas inlet 193 and to eject the gas AR with a stronger gas flow from the gas outlet 191. As a result, in the inner wall surface 110, the gas AR can be A stronger air flow is generated from the upper part to the lower part, and the liquid droplets LQ on the inner wall surface 110 can flow down more smoothly. Furthermore, in the second modification example, the nozzle 33 blows an inert gas such as nitrogen toward the fan 31.

[Third Variation Example]

The substrate processing apparatus 1 according to the third modification of the first embodiment will be described with reference to FIG. 8. In the substrate processing apparatus 1, the main difference between the third modification example and the first embodiment described with reference to FIGS. 1 to 5 is that the gas inflow port 193 is located in the hole Sb of the shielding portion 19. Hereinafter, the difference between the third modification example and the first embodiment will be mainly explained.

FIG. 8 is a schematic cross-sectional view showing the shielding portion 19, the cup portion 11, and the gas supply mechanism 22 of the substrate processing apparatus 1 of the third modification. In Fig. 8, the shielding portion 19 is located in an adjacent position. As shown in FIG. 8, the gas supply mechanism 22 supplies gas to the gas inlet 193. Then, the gas supplied from the gas supply mechanism 22 flows into the gas inflow port 193. The gas supply mechanism 22 is equivalent to an example of the "gas supply unit".

Specifically, the gas supply mechanism 22 supplies gas to the gap GP between the outer surface 91a of the processing liquid nozzle 91 and the wall surface WL constituting the hole Sb. The gas system is supplied to the substrate W before the substrate W is processed with the processing liquid, and the space above the substrate W is formed into a predetermined atmosphere. In addition, after the space above the substrate W becomes a predetermined atmosphere, the gas is filled in the gap GP. In the third modification example, the gas inflow port 193 is provided on the wall surface WL constituting the hole Sb. Therefore, the gas supplied by the gas supply mechanism 22 also flows into the gas inlet 193. Then, the gas inlet 193 communicates with the gas outlet 191 through the gas flow path 195. Therefore, the gas supplied to the gap GP can be taken in from the gas inlet 193 and the gas can be flowed to the gas flow path 195, and the gas AR can be flowed out from the gas outlet 191 toward the inner wall surface 110 of the cup portion 11. As a result, the gas AR can generate gas flowing from the upper part to the lower part in the inner wall surface 110, and can borrow The air flow causes the droplets LQ that have adhered to the inner wall surface 110 to flow down smoothly.

In particular, in the third modification example, the gas is supplied to the gas inlet 193 by the gas supply mechanism 22. In other words, the gas supplied to the substrate W or the gas filled in the gap GP is used to take the gas into the gas inlet 193. Therefore, a dedicated gas supply mechanism for supplying gas to the gas inflow port 193 may not be provided, and the manufacturing cost of the substrate processing apparatus 1 can be reduced.

[Fourth modification example]

The substrate processing apparatus 1 according to the fourth modification of the first embodiment will be described with reference to FIG. 9. In the substrate processing apparatus 1, the main difference between the fourth modification example and the first embodiment described with reference to FIGS. 1 to 5 is that the opening of the nozzle 39 is a gas outlet 191. Hereinafter, the difference between the fourth modification example and the first embodiment will be mainly explained.

FIG. 9 is a schematic cross-sectional view showing the shielding portion 19A and the cup portion 11 of the substrate processing apparatus 1 of the fourth modification. In FIG. 9, the shielding portion 19A is located in an adjacent position. As shown in FIG. 9, the substrate processing apparatus 1 has a shielding part 19A instead of the shielding part 19 of the substrate processing apparatus 1 shown in FIG. 2. The shielding portion 19A has a shielding plate 19x, a shaft portion 19b, and a nozzle 39. The shielding plate 19x has the same structure as the shielding plate 19a shown in FIG. 4. However, the shielding plate 19x does not have the gas outlet 191, the gas inlet 193, and the gas flow path 195 shown in FIG. 4. The shielding plate 19x has a substantially disc shape.

The nozzle 39 is arranged on the upper surface portion 196 of the shielding plate 19x. Then, the opening 390 of the nozzle 39 is a gas outlet 191 and is opposite to the inner wall surface 110 of the cup portion 11. Therefore, the nozzle 39 ejects the gas AR toward the inner wall surface 110. In the fourth modification example, the nozzle 39 ejects an inert gas such as nitrogen toward the inner wall surface 110.

According to the fourth modification example, the gas AR with a stronger airflow can be ejected toward the inner wall surface 110 through the nozzle 39. Therefore, in the inner wall surface 110, the gas AR can generate Stronger air flow to the lower part. As a result, the droplets LQ on the inner wall surface 110 can be smoothly flowed down. In addition, regarding FIG. 9 of the fourth modification, it is more effective that the nozzle 39 is also rotated by the rotation of the shielding plate 19x of the upper surface portion 196. The upper surface portion 196 and the nozzle 39 are more preferably the same structure.

[Embodiment 2]

The substrate processing apparatus 1A according to Embodiment 2 of the present invention will be described with reference to FIGS. 10 and 11. The main difference between the second embodiment and the first embodiment is that the substrate processing apparatus 1A rotates the shielding portion 19B by the substrate rotating portion 7. Hereinafter, the difference between the second embodiment and the first embodiment will be mainly described.

Fig. 10 is a schematic cross-sectional view showing a substrate processing apparatus 1A according to the second embodiment. As shown in FIG. 10, the substrate processing apparatus 1A includes a gas supply mechanism 37 instead of the gas supply mechanism 22 of the substrate processing apparatus 1 shown in FIG. 2. The gas supply mechanism 37 will be described later.

The substrate holding portion 5A of the substrate processing apparatus 1A has a plurality of engaging portions 41B in addition to the structure of the substrate holding portion 5 shown in FIG. 2. The plurality of engaging portions 41B are arranged on the outer peripheral portion of the upper surface of the rotating base 51 with the center axis AX as the center and at substantially equal angular intervals toward the circumferential direction CD. The plurality of engaging portions 41B are arranged outside of the radial direction RD than the plurality of clamping members 53. Each of the engaging portions 41B of the plurality of engaging portions 41B protrudes upward from the upper surface of the rotating base 51 to be substantially perpendicular.

The shielding portion 19B of the substrate processing apparatus 1A has the same gas outlet 191 as the shielding portion 19 (FIG. 4) of the first embodiment. Therefore, according to the second embodiment, the liquid droplets LQ attached to the inner wall surface 110 of the cup portion 11 can be made to flow down smoothly by the air flow, similarly to the first embodiment. In other words, it is possible to effectively prevent the droplets LQ from staying on the inner wall surface 110 of the cup portion 11. Otherwise, the second embodiment has the same effect as the first embodiment.

In addition, the shielding portion 19B has a plurality of engaging portions 41A and flange portions 19d in addition to the structure of the shielding portion 19 shown in FIG. 2.

The plurality of engagement portions 41A are arranged on the outer peripheral portion of the lower surface of the shielding plate 19a with the center axis AX as the center and at substantially equal angular intervals toward the circumferential direction CD. The plurality of engaging portions 41A respectively oppose the plurality of engaging portions 41B in the axial direction AD. Each of the engaging portions 41A of the plurality of engaging portions 41A protrudes downward from the lower surface of the shielding plate 19a to be substantially perpendicular. Each of the engaging portions 41A of the plurality of engaging portions 41A has a concave portion (not shown) that is recessed upward.

Specifically, the plurality of engaging portions 41A of the shielding portion 19B are engaged with the substrate holding portion 5A. The shielding portion 19B is integrated with the substrate holding portion 5A and rotates by engaging the plurality of engaging portions 41A with the substrate holding portion 5A. Therefore, by the rotation of the shielding portion 19B, the flow of the gas AR flowing out from the gas outlet 191 can be effectively generated. As a result, the gas AR can make the liquid droplets LQ attached to the inner wall surface 110 of the cup portion 11 flow down more smoothly.

More specifically, the plurality of engaging portions 41B of the substrate holding portion 5A are respectively fitted into the recesses of the plurality of engaging portions 41A of the shielding portion 19B. As a result, the shielding portion 19B rotates in synchronization with the substrate holding portion 5 in accordance with the rotation of the substrate holding portion 5.

The flange portion 19d expands in a ring shape from the upper end portion of the shaft portion 19b toward the radial direction RD outward. The flange portion 19d has, for example, a substantially annular plate shape centered on the central axis AX.

The shielding section moving mechanism 21 of the substrate processing apparatus 1A has a shielding section moving mechanism 21X instead of the shielding section moving mechanism 21a shown in FIG. 2. In addition, the shielding unit operating mechanism 21 of the substrate processing apparatus 1A does not have the shielding unit rotating mechanism 21b shown in FIG. 2.

The shielding part moving mechanism 21X raises or lowers the shielding part 19B in the axial direction AD. Specifically, the shielding part moving mechanism 21X raises or lowers the shielding part 19B between the adjacent position and the retracted position. The proximity position and the evacuation position are the same as the proximity position and the evacuation position of the first embodiment, respectively. In FIG. 10, the shielding portion 19B is located in an adjacent position. When the shielding portion 19B is located in the adjacent position, the plurality of engaging portions 41A are respectively engaged with the plurality of engaging portions 41B. On the other hand, when the shielding portion 19B is located at the retracted position, the plurality of engaging portions 41A are separated from the plurality of engaging portions 41B. Separate. When the substrate W is processed with the processing liquid, the shielding part moving mechanism 21X moves the shielding part 19B to an adjacent position.

Specifically, the shielding part moving mechanism 21X has a holding part 61 and an elevating mechanism 62. The raising and lowering mechanism 62 raises or lowers the shielding portion 19B together with the holding portion 61. The lifting mechanism 62 includes, for example, an electric motor and a ball screw.

The holding portion 61 holds the shielding portion 19B. The holding part 61 has a holding part body 611, a body supporting part 612, a flange supporting part 613 and a supporting part connecting part 614. The holding portion body 611 covers the upper portion of the flange portion 19d of the shielding portion 19B. The main body support portion 612 is a rod-shaped arm extending substantially horizontally. One end of the main body supporting portion 612 is connected to the holding portion main body 611, and the other end is connected to the lifting mechanism 62. The supporting portion connecting portion 614 connects the flange supporting portion 613 and the holding portion body portion 611 around the flange portion 19d. The flange support portion 613 is in contact with and supports the flange portion 19d of the shielding portion 19B from the lower side when the shielding portion 19B is in the retracted position. On the other hand, as shown in FIG. 10, the flange supporting portion 613 is separated from the flange portion 19d of the shielding portion 19B when the shielding portion 19B is located in an adjacent position. As a result, the shielding portion 19B can be rotated.

Next, the processing liquid supply unit 9 will be described with reference to FIG. 11. FIG. 11 is a schematic side view showing the processing liquid supply unit 9. As shown in FIG. 11, in the second embodiment, the processing liquid nozzle 91 of the processing liquid supply unit 9 has a processing liquid flow path 931 and two gas flow paths 371. The processing liquid flow path 931 is connected to the processing liquid supply mechanism 93. The two gas flow paths 371 are connected to the gas supply mechanism 37.

The processing liquid supply mechanism 93 supplies the processing liquid to the processing liquid nozzle 91. Specifically, the processing liquid supply mechanism 93 supplies the processing liquid to the processing liquid flow path 931. The processing liquid system that has been supplied to the processing liquid flow path 931 is discharged downward from the discharge port 931 a provided on the lower end surface of the processing liquid nozzle 91.

The gas supply mechanism 37 supplies gas to the processing liquid nozzle 91. Specifically, the gas supply mechanism 37 supplies gas to the two gas flow paths 371. The gas supply mechanism 37, for example, Inert gas such as the same is supplied to the two gas flow paths 371. The gas supply mechanism 37 includes, for example, a valve and a pipe.

The gas system supplied to the gas flow path 371 at the center of the processing liquid nozzle 91 is sprayed downward from the lower surface injection port 371 a provided on the lower end surface of the processing liquid nozzle 91. On the other hand, the gas system that has been supplied to the gas flow path 371 on the outer periphery of the processing liquid nozzle 91 is sprayed toward the surroundings from a plurality of side injection ports 371 b provided on the side surface of the processing liquid nozzle 91. Therefore, according to the second embodiment, gas can be efficiently supplied to the substrate W. In addition, it is possible to efficiently fill the gap GP between the outer surface 91a of the processing liquid nozzle 91 and the wall surface WL constituting the hole Sb with gas.

Above, the embodiments of the present invention have been described with reference to the drawings. However, the present invention is not limited to the above-mentioned embodiment, but can be implemented in various aspects without departing from the gist. In addition, the plural constituent elements disclosed in the above-mentioned embodiments can be appropriately changed. For example, a certain component among all the components shown in a certain embodiment may be added to the components of another embodiment, or several components among all the components shown in a certain embodiment may be changed from Deleted in the implementation form.

In addition, the drawings schematically show the respective constituent elements in the main body in order to facilitate the understanding of the invention. In some cases, the thickness, length, number, interval, etc. of the respective constituent elements shown in the drawings are considered from the perspective of drawing. It will be different from reality. In addition, the structure of each component shown in the above-mentioned embodiment is an example, and is not particularly limited, and of course various changes can be made within a range that does not substantially deviate from the effect of the present invention.

(1) In Embodiment 1 (including the first modification to the fourth modification) and Embodiment 2 described with reference to FIGS. 2 to 10, as long as the gas can flow out from the gas outlet 191 toward the inner wall surface of the cup portion 11 The shape, number, and arrangement of the gas AR of 110, the gas outlet 191, the gas inlet 193, and the gas flow path 195 are not particularly limited. For example, in a plan view, the gas inflow port 193 and the gas channel 195 may be formed such that a plurality of gas channels 195 extend radially outward in the radial direction RD. E.g The gas flow path port 193 and the gas flow path 195 may be formed such that one gas flow path 195 extends outward in the radial direction RD in a plan view. The number of each of the gas outlet 191, the gas inlet 193, and the gas flow path 195 may be one or plural. In addition, the shielding portion 19 may have a plurality of gas outlets 191 having different injection angles corresponding to the shapes of the plurality of cup portions 11. Furthermore, the number of gas outlets 191 can also be changed corresponding to the number of cup parts 11.

(2) In the second modification of the first embodiment described with reference to FIG. 7, as long as the gas AR can flow out from the gas outlet 191 toward the inner wall surface 110 of the cup portion 11, the gas supply mechanism 35 may not have the fan 31 .

(3) In the second embodiment described with reference to FIG. 10, the shielding portion 19B may have the shielding plate 19a and the shaft portion 19b of the shielding portion 19 described with reference to FIG. 8. In this case, the gas injected from the plurality of side injection ports 371b of the processing liquid nozzle 91 shown in FIG. 11 flows into the gas inflow port 193 shown in FIG. 8. In this case, the gas supply mechanism 37 is equivalent to an example of the "gas supply unit".

(4) In Embodiment 1 (including the first modification to the fourth modification) and Embodiment 2 described with reference to FIGS. 2 to 10, the shielding plate 19a may also be configured to correspond to the shape of the cup body portion 11. The direction of the gas outlet 191 is changed. In addition, the cup moving mechanism 15 may also swing the cup part 11 up and down. In this case, the droplets LQ that have adhered to the inner wall surface 110 of the cup portion 11 can be made to flow down more effectively.

[Industry Availability]

The present invention relates to a substrate processing apparatus and a substrate processing method, and has industrial applicability.

1: Substrate processing equipment

3: chamber

3a: Top plate

5: Board holding part

7: Substrate rotating part

9: Treatment liquid supply part

11: Cup body

15: Cup moving mechanism

17: discharge port

19: Shading part

19a: shielding plate

19b: Shaft

21: Shading part action mechanism

21a: Moving mechanism of shielding part

21b: Shading part rotation mechanism

22: Gas supply mechanism (gas supply part)

24: Fan filter unit

51: Rotating base

53: Clamping member

71: Motor

73: Axis

91: Treatment liquid nozzle (circulation part)

93: Treatment liquid supply mechanism

110: inner wall

191: Gas Outlet

AD: axial

AX: central axis

GP: Gap

RD: radial

Sb: Hole

W: substrate

Wa: upper surface

Claims (19)

A substrate processing apparatus is provided with a substrate holding part which holds the substrate horizontally; a substrate rotation part which integrally rotates the substrate and the substrate holding part around a central axis extending in the vertical direction; and a shielding part Opposite to the upper surface of the substrate; the shielding part action mechanism to actuate the shielding part; the processing liquid supply part to supply the processing liquid to the substrate; and the cup body part to be arranged around the substrate holding part Receiving the processing liquid; when the shielding portion moves to an adjacent position opposite to the upper surface of the substrate, the shielding portion covers the upper surface of the substrate and shields the upper side of the substrate; the shielding portion has a gas outlet, The gas outflow port is for the gas to flow out toward the inner wall surface of the cup body; the gas outflow port is located at the periphery of the shielding portion; the gas outflow port is for taking in the gas to the gas flow path toward the The inner wall of the cup body flows out. The substrate processing apparatus according to claim 1, wherein the cup portion has an upper end portion of the cup body, and the upper end portion of the cup body is located above the substrate; and the gas outlet is adjacent to the upper end portion of the cup body. The substrate processing apparatus according to claim 1 or 2, wherein the shielding portion covers the entire upper surface of the substrate and shields the upper side of the substrate; the gas outlet faces the inner wall surface of the cup portion. The substrate processing apparatus according to claim 1 or 2, wherein the shielding portion has a shielding plate, the shielding plate is opposed to the upper surface of the substrate; the shielding plate has an opposed wall surface, and the opposed wall surface is opposed to The inner wall of the cup body faces facing; the gas outlet is arranged on the opposite wall. The substrate processing apparatus according to claim 4, wherein the shielding plate has: the gas outflow port; the gas inflow port for the gas to flow in; and the gas flow path for the gas inflow port and the gas outflow port Connected. The substrate processing apparatus according to claim 5, wherein the inner wall surface of the cup portion has an inclined surface of the cup, and the inclined surface of the cup is inclined downward from the center axis toward the radially outward direction; The inner surface of the gas flow path has a flow path inclined surface, the flow path inclined surface is inclined downward as it goes outward in the radial direction; the inclination angle of the flow path inclined surface with respect to the horizontal direction is the cup The inclination angle of the inclined surface of the body with respect to the horizontal direction is below. The substrate processing apparatus according to claim 5, further comprising: a gas supply unit that supplies the gas; and the gas system supplied from the gas supply unit flows into the gas inflow port. The substrate processing apparatus according to claim 7, wherein the gas inlet is located on the upper surface of the shielding plate; the gas flow path connects the gas inlet and the gas outlet; the gas supply part has a fan, The fan sends out the gas to the gas inlet; the fan is arranged on the upper surface of the shielding plate. The substrate processing apparatus according to claim 8, wherein the shielding portion further has a shaft portion, and the shaft portion is fixed to the shielding plate; the shaft portion rotates with the shielding plate centered on the central axis; The fan is inserted into the shaft portion and blows the air sucked from above the shielding plate in a radial direction with respect to the central axis. The substrate processing apparatus described in claim 8, wherein the aforementioned gas is supplied The feeding section further has a nozzle, and the nozzle is opposed to the fan; the nozzle is to spray the gas toward the fan from the upper surface side of the shield plate. The substrate processing apparatus according to claim 7, wherein the shielding portion further has a shaft portion, and the shaft portion is fixed to the shielding plate; the shaft portion rotates with the shielding plate around the central axis; The shielding portion has a hole, which penetrates the shaft and the shielding plate and extends along the central axis; the processing liquid supply portion has a flow portion, and the flow portion is for the flow of the processing liquid; the flow portion Is arranged in the hole; the gas supply portion supplies the gas to the gap between the outer surface of the flow portion and the wall surface constituting the hole; the gas inflow port is provided on the wall surface constituting the hole. The substrate processing apparatus according to claim 7, wherein the gas supply part has a fan filter unit, the fan filter unit is arranged on the top plate of the substrate processing apparatus; the fan filter unit is arranged from the shielding plate The upward flow is generated toward the downward flow of the aforementioned substrate holding portion. The substrate processing apparatus according to claim 1 or 2, wherein the shielding portion has: a shielding plate opposed to the upper surface of the substrate; and a nozzle arranged on the upper surface of the shielding plate; The opening is the gas outlet and faces the inner wall of the cup body. The substrate processing apparatus according to claim 1 or 2, wherein the shielding section operation mechanism includes a shielding section moving mechanism, and the shielding section moving mechanism raises or lowers the shielding section. The substrate processing apparatus according to claim 1 or 2, wherein the shielding portion operating mechanism includes a shielding portion rotating mechanism, and the shielding portion rotating mechanism makes the shielding portion rotating mechanism. The cover rotates. The substrate processing apparatus according to claim 1 or 2, wherein the shielding portion has a plurality of engaging portions, and the plurality of engaging portions are engaged with the substrate holding portion; and the shielding portion is provided by the plurality of cards The engaging portion is engaged with the substrate holding portion to rotate integrally with the substrate holding portion. A substrate processing method includes: a holding step of holding a substrate by a substrate holding portion; a shielding portion approaching step of bringing the substrate holding portion closer to the shielding portion; and a rotating step of bringing the substrate and the substrate holding portion together Rotating; air flow generation step, which is to make the gas flow out of the gas outlet of the shielding portion to generate the air flow toward the inner wall surface of the cup body; and the processing step, which is to process the substrate with the processing liquid; approach the step at the shielding portion Wherein, when the shielding portion moves to an adjacent position opposite to the upper surface of the substrate, the shielding portion covers the upper surface of the substrate and shields the upper side of the substrate; the gas outlet is located at the peripheral portion of the shielding portion ; In the gas flow generating step, the gas outlet is to flow the gas that has been taken in through the gas flow path toward the inner wall surface of the cup portion. The substrate processing method according to claim 17, wherein in the gas flow generating step, the gas system flows out from the gas outflow port located at the periphery of the shielding portion and flows along the inner wall surface of the cup portion. The substrate processing method according to claim 18, wherein the cup portion has an upper end portion of the cup body, and the upper end portion of the cup body is located above the substrate; in the gas generation step, the gas system is separated from the cup body. The gas outlet adjacent to the upper end of the body flows out toward the upper end of the cup.

Images