TWI731760B - Circuit board warpage detection device - Google Patents
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Abstract
一種電路板翹曲檢測裝置,主要係於一基座上設置一第一檢測組及一第二檢測組安裝在該基座、一升降台以及一位置切換台上,配合一第一移載單元以及一第二移載單元來移載待測電路板。在該升降台位於使用位置且該位置切換台位於第二位置時,該第二發射器係對準該第二接收器,且該第一接收器係對準該第一發射器,而可在對準狀態下接收信號。在該升降台位於不使用位置且該位置切換台位於第一位置時,該第一發射器對準該第二接收器,且該第一接收器不對準該第一發射器,且該第二發射器不對準該第二接收器。A circuit board warpage detection device is mainly provided with a first detection group and a second detection group on a base, installed on the base, a lifting platform and a position switching platform, and cooperates with a first transfer unit And a second transfer unit to transfer the circuit board to be tested. When the lifting platform is in the use position and the position switching platform is in the second position, the second transmitter is aligned with the second receiver, and the first receiver is aligned with the first transmitter. Receive signals in the aligned state. When the lifting platform is in the unused position and the position switching platform is in the first position, the first transmitter is aligned with the second receiver, and the first receiver is not aligned with the first transmitter, and the second transmitter is not aligned with the first transmitter. The transmitter is not aimed at the second receiver.
Description
本發明係與電路板的檢測技術有關,特別是指一種電路板翹曲檢測裝置。The invention is related to the detection technology of the circuit board, in particular to a circuit board warpage detection device.
我國第483617號新型專利,揭露了一種電路板板翹檢查機,該案主要是在輸送帶上放置電路板,再藉由輸送帶上方的雷射檢查機進行電路板翹曲的檢查。my country's new patent No. 483617 discloses a circuit board warpage inspection machine. The case is mainly to place the circuit board on the conveyor belt, and then use the laser inspection machine above the conveyor belt to check the circuit board warpage.
前述的先前技術,其僅揭露了使用一條輸送帶來移載電路板的技術,其僅能檢測比該輸送帶寬度更小的電路板,對於大於該輸送帶寬度的電路板就無法進行檢測,如此一來,在客戶端的待檢測電路板較寬時,就需要更大尺寸的電路板翹曲檢查機了。這種僅能檢測有限尺寸電路板的裝置,沒有尺寸上的彈性,適用性較差。此外,前述先前技術僅使用一條輸送帶,因此,一次只能檢測一片,就算是小尺寸的電路板也是一次一片,若是有兩個流道,這樣小尺寸的電路板就能同時檢測兩片,可以提升效率。The aforementioned prior art only discloses the technology of using a conveyor belt to transfer circuit boards, which can only detect circuit boards smaller than the width of the conveyor belt, and cannot detect circuit boards larger than the width of the conveyor belt. As a result, when the circuit board to be inspected on the client is wider, a larger-size circuit board warpage inspection machine is required. This kind of device that can only detect limited-size circuit boards has no size flexibility and poor applicability. In addition, the aforementioned prior art only uses one conveyor belt, so it can only inspect one piece at a time, even a small-sized circuit board is one piece at a time. If there are two runners, the small-sized circuit board can detect two pieces at the same time. Can improve efficiency.
本發明之主要目的在於解決前述先前技術的問題,因此提出一種電路板翹曲檢測裝置,其具有二個輸送用的移載單元,可以檢測比一個輸送用的移載單元寬度更大的電路板,或是分別檢測比一個輸送用的移載單元寬度相同或更小的二個電路板。The main purpose of the present invention is to solve the aforementioned problems of the prior art. Therefore, a circuit board warpage detection device is provided, which has two transfer units for conveying and can detect a circuit board with a larger width than one transfer unit for conveying. , Or separately detect two circuit boards with the same width or smaller width than a transfer unit for conveying.
基於上述,本發明提出的一種電路板翹曲檢測裝置,包含有:一基座;一第一移載單元,設於該基座,且具有一第一移載面,該第一移載面係將其所承載之電路板由該基座之一側移至另一側;一第二移載單元,設於該基座,且具有一第二移載面,該第二移載面實質上與該第一移載面同高,該第二移載面係將其所承載之電路板由該基座之一側移至另一側,該第二移載單元的移載方向係實質上平行於該第一移載單元的移載方向,該第二移載單元與該第一移載單元相隔預定距離而於兩者之間形成一中間區域;一升降單元,設於該基座且對應於該中間區域,且具有一升降台可受驅動來於一使用位置及一不使用位置之間升降移動;一位置切換單元,設於該基座且位於該第二移載單元的一側,具有一位置切換台可受驅動來在一第一位置及一第二位置之間切換;一第一檢測組,具有一第一發射器以及一第一接收器,該第一發射器設於該基座,該第一接收器設於該升降台;以及一第二檢測組,具有一第二發射器以及一第二接收器,該第二發射器設於該升降台,該第二接收器設於該位置切換台,在該升降台位於該使用位置且該位置切換台位於該第二位置時,該第二發射器係對準該第二接收器,該第二接收器即用以在對準狀態下接收該第二發射器所發出之信號,且該第一接收器係對準該第一發射器而用以在對準狀態下接收該第一發射器所發出之信號;其中,在該升降台位於該不使用位置且該位置切換台位於該第一位置時,該第一發射器對準該第二接收器,且該第一接收器不對準該第一發射器,且該第二發射器不對準該第二接收器;其中,在該升降台位於該使用位置時,該第一發射器、該第一接收器、該第二發射器與該第二接收器係部分低於該第一移載面及該第二移載面,且有部分高於該第一移載面及該第二移載面。Based on the above, a circuit board warpage detection device provided by the present invention includes: a base; a first transfer unit, which is provided on the base, and has a first transfer surface, the first transfer surface The circuit board carried by it is moved from one side of the base to the other side; a second transfer unit is arranged on the base and has a second transfer surface, which is essentially The upper part is the same height as the first transfer surface, the second transfer surface moves the circuit board it carries from one side of the base to the other side, and the transfer direction of the second transfer unit is essentially The upper part is parallel to the transfer direction of the first transfer unit, the second transfer unit and the first transfer unit are separated by a predetermined distance to form an intermediate area therebetween; a lifting unit is provided on the base And it corresponds to the middle area, and has a lifting platform that can be driven to move up and down between a used position and an unused position; a position switching unit is provided on the base and located at a side of the second transfer unit On the side, there is a position switching platform that can be driven to switch between a first position and a second position; a first detection group has a first transmitter and a first receiver, the first transmitter is set On the base, the first receiver is provided on the lifting platform; and a second detection group has a second transmitter and a second receiver, the second emitter is provided on the lifting platform, and the second The receiver is set in the position switcher. When the elevator is in the use position and the position switcher is in the second position, the second transmitter is aligned with the second receiver, and the second receiver is ready to use To receive the signal from the second transmitter in the aligned state, and the first receiver is aligned with the first transmitter to receive the signal from the first transmitter in the aligned state; Wherein, when the lifting platform is in the unused position and the position switching platform is in the first position, the first transmitter is aligned with the second receiver, and the first receiver is not aligned with the first transmitter, And the second transmitter is not aligned with the second receiver; wherein, when the lifting platform is in the use position, the first transmitter, the first receiver, the second transmitter and the second receiver are A part is lower than the first transfer surface and the second transfer surface, and a part is higher than the first transfer surface and the second transfer surface.
藉此,本發明具有二個輸送用的移載單元,可以聯合起來移載比一個輸送用的移載單元寬度更大的電路板而供檢測,或是分別檢測比一個輸送用的移載單元寬度相同或更小的二個電路板,而具有較佳的適用性。Thereby, the present invention has two transfer units for conveying, which can be combined to transfer a circuit board with a larger width than one transfer unit for conveying for inspection, or to test separately than one transfer unit for conveying. Two circuit boards with the same or smaller width have better applicability.
為了詳細說明本發明之技術特點所在,茲舉以下之較佳實施例並配合圖式說明如後,其中:In order to describe the technical features of the present invention in detail, the following preferred embodiments are described in conjunction with the drawings, in which:
如圖1至圖6所示,本發明一較佳實施例所提出之一種電路板翹曲檢測裝置10,主要由一基座11、一第一移載單元21、一第二移載單元31、一升降單元41、一位置切換單元51、一第一檢測組61以及一第二檢測組71所組成,其中:As shown in FIGS. 1 to 6, a circuit board
該基座11,具有一空橋12。The
該第一移載單元21,設於該基座11,且具有一第一移載面22,該第一移載面22係將其所承載之電路板99(示於圖5)由該基座11之一側移至另一側。於本實施例中,該第一移載單元21係以一輸送帶為例,而以其輸送帶表面做為該第一移載面22,由於輸送帶其結構及驅動方式均甚為習知,且非本案之技術重點,容不對其贅述。The
該第二移載單元31,設於該基座11,且具有一第二移載面32,該第二移載面32實質上與該第一移載面22同高,該第二移載面32係將其所承載之電路板99由該基座11之一側移至另一側。該第二移載單元31的移載方向係實質上平行於該第一移載單元21的移載方向,該第二移載單元31與該第一移載單元21相隔預定距離而於兩者之間形成一中間區域14。於本實施例中,該第二移載單元31係為一輸送帶為例,而以其輸送帶表面做為該第二移載面32,至於該中間區域14,如圖1至圖2所示,係為一空間而覆蓋金屬板,且使該金屬板的表面低於該第一移載面22及該第二移載面32,這樣一來,可以使得該中間區域14沒有任何物件阻擋待測的較大張的電路板99’(示於圖9)通過。The
該空橋12橫跨該第一移載面22及該第二移載面32上方。The
該升降單元41,設於該基座11的該空橋12且對應於該中間區域14,且具有一升降台42可受驅動來於一使用位置UP及一不使用位置NUP之間升降移動,該升降台42位於該中間區域14上方,該不使用位置NUP係高於該使用位置UP。於本實施例中,該升降單元41係以一驅動螺桿組為例,由於驅動螺桿組即為由滑塊、螺桿與馬達之組成,其結構甚為習知且非本案之技術重點,容不對其贅述。此外,該升降單元41也可以是空壓缸或皮帶式滑台這類的習知構件,可視需求選用。The
該位置切換單元51,設於該基座11且位於該第二移載單元31的一側,具有一位置切換台52可受驅動來在一第一位置P1以及一第二位置P2之間切換,且該第一位置P1與該第二位置P2之間的虛擬連線方向係與該第二移載單元31的移載方向平行。於本實施例中,該位置切換單元51係以一驅動螺桿組為例,但也可以是空壓缸或皮帶式滑台這類的習知構件,可視需求選用。。The
該第一檢測組61,具有一第一發射器62以及一第一接收器64,該第一發射器62設於該基座11,該第一接收器64設於該升降台42。在實際實施時,該第一發射器62係為一雷射光發射器,該第一接收器64為一雷射光接收器,該第一發射器62發射信號的方向係實質上垂直於該第一移載單元21的移載方向,這個垂直的關係有助於使信號的發射及接收處於最短距離,可以達到最有效的接收效果。The
該第二檢測組71,具有一第二發射器72以及一第二接收器74,該第二發射器72設於該升降台42,該第二接收器74設於該位置切換台52。在該升降台42位於該使用位置UP且該位置切換台52位於該第二位置P2時,該第二發射器72係對準該第二接收器74,該第二接收器74即用以在對準狀態下接收該第二發射器72所發出之信號,且該第一接收器64係對準該第一發射器62而用以在對準狀態下接收該第一發射器62所發出之信號,此外,該第一接收器64及該第二發射器72係位於該空橋12下方。在實際實施時,該第二發射器72係為一雷射光發射器,該第二接收器74為一雷射光接收器,該第二發射器72發射信號的方向係實質上垂直於該第二移載單元31的移載方向,該第一發射器62及該第二發射器72所發射之信號係為上下排列之多條平行雷射光束。如圖7A至圖7C所示,沒有翹曲的正常電路板99或有翹曲的電路板99在經過多條平行雷射光束時,可以由被擋住的雷射光束多寡來判斷翹曲程度。The
如圖4配合其他圖式所示,在設置時,係設置成:在該升降台42位於該使用位置UP時,該第一發射器62、該第一接收器64、該第二發射器72與該第二接收器74係部分低於該第一移載面22及該第二移載面32,且有部分高於該第一移載面22及該第二移載面32,如此一來,該第一發射器62及該第二發射器72所發射之信號係有部分高於該第一移載面22及該第二移載面32,且有部分低於該第一移載面22及該第二移載面32。在電路板99被移載而經過該第一發射器62或該第二發射器72時,就會擋住其部分信號而使得該第一接收器64及該第二接收器74有部分的信號無法接收到,進而判斷有電路板99經過。而若是電路板99有翹曲,則在該電路板99被移載而經過該第一發射器62或該第二發射器72時,就會擋住更多的信號,進而可以判斷出有該電路板99經過,且該電路板99翹曲,此外,還可以依據被擋住的信號多寡來判斷該電路板99翹曲的程度。As shown in FIG. 4 in conjunction with other figures, when the setting is set, the system is set to: when the
其中,在該升降台42位於該不使用位置NUP且該位置切換台52位於第一位置P1時,該第一發射器62對準該第二接收器74,且該第一接收器64不對準該第一發射器62,且該第二發射器72不對準該第二接收器74。此外,該第一接收器64及該第二發射器72即因為由原來較低的該使用位置UP移動至較高的該不使用位置NUP,因此在垂直高度上係高於該第一移載面22及該第二移載面32而相隔預定距離,該中間區域14在與該第一移載面22及該第二移載面32的表面同高度的位置上,即沒有任何物件阻擋而可供較大張的電路板99’通過。Wherein, when the
以上說明了本實施例的架構,接下來說明本實施例的操作狀態,本實施例在操作時,可分為兩種狀態,第一種狀態為該第一移載單元21與該第二移載單元31上各自對一電路板99來進行檢測,這個狀態中,各個電路板99係小於或等於該第一移載面22或該第二移載面32的寬度;第二種狀態為一較大張的電路板99’置放在該第一移載單元21與該第二移載單元31上,並且橫跨該中間區域14,藉以進行檢測。The architecture of this embodiment is explained above, and then the operation state of this embodiment is explained. When this embodiment is in operation, it can be divided into two states. The first state is the
如圖5至圖6所示,在第一種狀態下,係操作該升降單元41的該升降台42位於該使用位置UP,且操作該位置切換台52位於該第二位置P2。此時,該第二接收器74即對準該第二發射器72而可以接收該第二發射器72所發出之信號,且該第一接收器64係對準該第一發射器62而可以接收該第一發射器62所發出之信號。在此狀況下,若欲進行檢測,則是在該第一移載面22以及該第二移載面32上分別置放待檢測電路板99並進行移載,藉由電路板99在通過該第一發射器62及該第二發射器72所發射的信號時,以阻擋信號的多寡來判斷電路板99是否有翹曲及其翹曲程度。在這個狀態下,係為該第一檢測組61獨立運作來完成檢測,而該第二檢測組71亦為獨立運作來完成檢測。As shown in FIGS. 5 to 6, in the first state, the
如圖8至圖9所示,在第二種狀態下,係操作該升降單元41的該升降台42位於該不使用位置NUP,且操作該位置切換台52位於該第一位置P1。此時,該第一接收器64及該第二發射器72即升高而離開原來的位置,而該第二接收器74即對準該第一發射器62而可以接收該第一發射器62所發出的信號。在此狀況下,欲進行檢測時,即可把較大張的電路板99’橫跨該中間區域14而置於該第一移載面22及該第二移載面32上,並操作該第一移載單元21及該第二移載單元31同步驅動移載,藉由該較大張的電路板99’通過該第一發射器62的信號時,依阻擋住信號的多寡來判斷該較大張的電路板99’是否有翹曲及其翹曲程度。在這個狀態下,係為該第一發射器62與該第二接收器74聯合形成一個檢測的機制來進行檢測,而不同於前述第一種狀態。As shown in FIGS. 8 to 9, in the second state, the
由上可知,本發明具有二個輸送用的移載單元21,31,可以檢測比一個輸送用的移載單元寬度更大的電路板99’,或是分別檢測比一個輸送用的移載單元21,31寬度相同或更小的二個電路板99,而具有較廣泛的適用性。It can be seen from the above that the present invention has two
值得一提的是,前述的空橋12,係適用於該升降單元41設於該基座11而位於該第一移載面22及該第二移載面32上方的狀態,而為一種實施態樣。若是欲將該升降單元41設於該基座11而位於該第一移載面22及該第二移載面32下方,則需在該中間區域14保留空間供該升降單元41下降用,只是這樣的結構乃可以直接由本說明來直接理解,應無再以圖式表示的必要。It is worth mentioning that the aforementioned
前述的該第一檢測組61及該第二檢測組71均以一發射器配合一接收器來做為信號的發射及接收作用,然而,亦有其他種方式可產生類似的功能,例如發射及接收的元件整合為一個元件並設置在前述的移載單元一側,而對側則以反射鏡來反射信號,如此一來,就可以由一側發射信號至對側的反射鏡,並再反射回該發射及接收元件,藉以接收信號。其具體實施方式係如圖10及圖11所示,與前揭實施例所揭之技術不同的是,該第一檢測組61’,具有一第一發射及接收器62’以及一第一反射器64’,該第一發射及接收器62’設於該基座11’,該第一反射器64’設於該升降台42’;該第二檢測組71’,具有一第二發射及接收器72’以及一第二反射器74’,該第二發射及接收器72’設於該升降台42’,該第二反射器74’設於該位置切換台52’,在該升降台42’位於該使用位置UP且該位置切換台52’位於該第二位置P2時,該第二發射及接收器72’係對準該第二反射器74’,該第二反射器74’即用以在對準狀態下反射該第二發射及接收器72’所發出之信號並讓該第二發射及接收器72’接收該信號,且該第一反射器64’係對準該第一發射及接收器62’而用以在對準狀態下反射該第一發射及接收器62’所發出之信號並讓該第一發射及接收器62’接收該信號。在該升降台42’位於該不使用位置NUP且該位置切換台52’位於該第一位置P1時(參考圖8),該第一發射及接收器62’對準該第二反射器74’,且該第一反射器64’不對準該第一發射及接收器62’,且該第二發射及接收器72’不對準該第二反射器74’,藉此該第二反射器74’係反射該第一發射及接收器62’所發出之信號並讓該第一發射及接收器62’接收該信號。這樣的結構同樣能達到發射及接收信號的效果,進而同樣能偵測到電路板的翹曲。The aforementioned
就等效結構而言,前述的移載單元21,31雖以輸送帶為例,但並不以輸送帶為限制,其他類似結構例如可移動的移載平台,亦可做為移載單元而為本案專利範圍所涵蓋。As far as the equivalent structure is concerned, although the
此外,前述移載單元21,31雖以二個為例,但實際實施時可以視需求而設置更多的移載單元,只要在兩兩移載單元之間都保留一個中間區域即可用來置放發射器或接收器或反射器,如此一來,可以同時檢測更多的電路板,也可以檢測更大的電路板。In addition, although two
10:電路板翹曲檢測裝置 11:基座 12:空橋 14:中間區域 21:第一移載單元 22:第一移載面 31:第二移載單元 32:第二移載面 41:升降單元 42:升降台 51:位置切換單元 52:位置切換台 61:第一檢測組 62:第一發射器 64:第一接收器 71:第二檢測組 72:第二發射器 74:第二接收器 99:電路板 11’:基座 42’:升降台 52’:位置切換台 61’:第一檢測組 62’:第一發射及接收器 64’:第一反射器 71’:第二檢測組 72’:第二發射及接收器 74’:第二反射器 99’:較大張的電路板 P1:第一位置 P2:第二位置 UP:使用位置 NUP:不使用位置 10: Circuit board warpage detection device 11: Pedestal 12: Sky Bridge 14: Middle area 21: The first transfer unit 22: The first transfer surface 31: The second transfer unit 32: The second transfer surface 41: Lifting unit 42: Lifting platform 51: Position switching unit 52: position switcher 61: The first detection group 62: First Launcher 64: first receiver 71: The second detection group 72: second transmitter 74: second receiver 99: circuit board 11’: Pedestal 42’: Lifting platform 52’: Position switcher 61’: First detection group 62’: First transmitter and receiver 64’: First reflector 71’: The second inspection group 72’: Second transmitter and receiver 74’: Second reflector 99’: Larger circuit board P1: first position P2: second position UP: Use location NUP: Do not use location
圖1係本發明一較佳實施例之組合立體圖。 圖2係本發明一較佳實施例之俯視圖,顯示移除空橋及部分的升降裝置後的狀態。 圖3係本發明一較佳實施例之前視圖。 圖4係沿圖3中之4-4剖線之剖視圖。 圖5係本發明一較佳實施例之操作狀態圖。 圖6係圖5之右側視圖。 圖7A係本發明一較佳實施例之動作示意圖,顯示檢測正常未翹曲的電路板的狀態。 圖7B係本發明一較佳實施例之動作示意圖,顯示檢測翹曲程度較低的電路板的狀態。 圖7C係本發明一較佳實施例之動作示意圖,顯示檢測翹曲程度較高的電路板的狀態。 圖8係本發明一較佳實施例之另一操作狀態圖,顯示升降台上升後的狀態。 圖9係圖8之俯視圖,顯示移除空橋及升降裝置後的狀態。 圖10類似圖2,為本發明一較佳實施例之俯視圖,顯示第一反射器與第二反射器的位置及形態。 圖11類似圖3,為本發明一較佳實施例之前視圖,顯示顯示第一反射器與第二反射器的位置。 Figure 1 is a combined perspective view of a preferred embodiment of the present invention. FIG. 2 is a top view of a preferred embodiment of the present invention, showing the state after the empty bridge and part of the lifting device are removed. Figure 3 is a front view of a preferred embodiment of the present invention. Fig. 4 is a cross-sectional view taken along the line 4-4 in Fig. 3; Figure 5 is a diagram of the operating state of a preferred embodiment of the present invention. Fig. 6 is a right side view of Fig. 5. FIG. 7A is a schematic diagram of the operation of a preferred embodiment of the present invention, showing the state of detecting a normal unwarped circuit board. FIG. 7B is a schematic diagram of the operation of a preferred embodiment of the present invention, showing the state of detecting a circuit board with a low degree of warpage. FIG. 7C is a schematic diagram of the operation of a preferred embodiment of the present invention, showing the state of detecting a circuit board with a higher degree of warpage. Fig. 8 is another operation state diagram of a preferred embodiment of the present invention, showing the state of the lifting platform after it is raised. Fig. 9 is a top view of Fig. 8, showing the state after the empty bridge and the lifting device are removed. Fig. 10 is similar to Fig. 2 and is a top view of a preferred embodiment of the present invention, showing the position and form of the first reflector and the second reflector. Fig. 11 is similar to Fig. 3 and is a front view of a preferred embodiment of the present invention, showing the positions of the first reflector and the second reflector.
11:基座 11: Pedestal
14:中間區域 14: Middle area
21:第一移載單元 21: The first transfer unit
22:第一移載面 22: The first transfer surface
31:第二移載單元 31: The second transfer unit
32:第二移載面 32: The second transfer surface
52:位置切換台 52: position switcher
61:第一檢測組 61: The first detection group
62:第一發射器 62: First Launcher
64:第一接收器 64: first receiver
71:第二檢測組 71: The second detection group
72:第二發射器 72: second transmitter
74:第二接收器 74: second receiver
99:電路板 99: circuit board
P2:第二位置 P2: second position
Claims (10)
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Citations (4)
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TW201702552A (en) * | 2015-04-06 | 2017-01-16 | 克萊譚克公司 | Method and system for determining in-plane distortions in a substrate |
TWI586958B (en) * | 2012-07-24 | 2017-06-11 | 日本電氣硝子股份有限公司 | Warpage inspection device for plate body and warpage inspection method for the same |
CN108981600A (en) * | 2018-04-20 | 2018-12-11 | 盐城工学院 | A kind of pcb board warpage on-line checking self-checking device and adjusting method |
CN109425323A (en) * | 2017-09-02 | 2019-03-05 | 湖南北斗星空自动化科技有限公司 | A kind of warpage automatic tester |
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TWI586958B (en) * | 2012-07-24 | 2017-06-11 | 日本電氣硝子股份有限公司 | Warpage inspection device for plate body and warpage inspection method for the same |
TW201702552A (en) * | 2015-04-06 | 2017-01-16 | 克萊譚克公司 | Method and system for determining in-plane distortions in a substrate |
CN109425323A (en) * | 2017-09-02 | 2019-03-05 | 湖南北斗星空自动化科技有限公司 | A kind of warpage automatic tester |
CN108981600A (en) * | 2018-04-20 | 2018-12-11 | 盐城工学院 | A kind of pcb board warpage on-line checking self-checking device and adjusting method |
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