TWI731655B - 電子紙封裝結構 - Google Patents

電子紙封裝結構 Download PDF

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TWI731655B
TWI731655B TW109113229A TW109113229A TWI731655B TW I731655 B TWI731655 B TW I731655B TW 109113229 A TW109113229 A TW 109113229A TW 109113229 A TW109113229 A TW 109113229A TW I731655 B TWI731655 B TW I731655B
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黃振勛
沈煌凱
涂克帆
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元太科技工業股份有限公司
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Abstract

一種電子紙封裝結構，包括一基板、一電子墨水層、一蓋板、一水氣阻隔膜以及一黏著層。電子墨水層設置於基板上。蓋板覆蓋電子墨水層。水氣阻隔膜包覆基板與電子墨水層。黏著層直接接合於蓋板與水氣阻隔膜之間，以密封基板與電子墨水層，且黏著層未接合於蓋板與電子墨水層之間。

Description

電子紙封裝結構
本發明是有關於一種電子元件封裝結構，且特別是有關於一種電子紙封裝結構。
隨著平面顯示技術的進步，愈來愈多的電子產品皆搭載有顯示裝置，尤其是可攜式電子產品，如行動電話、電子書、數位相機等。由於可攜式電子產品是朝向重量輕、體積小且厚度薄的趨勢發展，所以應用在可攜式電子產品的顯示裝置也需具備重量輕、體積小且厚度薄的優點。
為了推廣無紙化，電子看板例如電泳式顯示裝置(electrophoretic display,EPD)或電子紙顯示裝置(electronic paper displays,EPD)等可取代傳統的印刷看板，電子看板不但重量輕且厚度薄，還可設計成具有可撓曲性。
然而，目前電泳式顯示裝置或電子紙顯示裝置的封裝結構必須進行兩次阻隔膜貼合步驟，成本較高，且水氣阻隔能力較弱。
本發明係有關於一種電子紙封裝結構，其可節省成本，並提高水氣阻隔能力。
根據本發明之一方面，提出一種電子紙封裝結構，包括一基板、一電子墨水層、一蓋板、一水氣阻隔膜以及一黏著層。電子墨水層設置於基板上。蓋板覆蓋電子墨水層。水氣阻隔膜包覆基板與電子墨水層。黏著層直接接合於蓋板與水氣阻隔膜之間，以密封基板與電子墨水層，且黏著層未接合於蓋板與電子墨水層之間。
根據本發明之一方面，提出一種電子紙封裝結構，包括一基板、一電子墨水層、一蓋板、一水氣阻隔膜、一黏著層以及一封膠。基板包括一出線部。電子墨水層設置於基板上。蓋板覆蓋電子墨水層。水氣阻隔膜包覆基板與電子墨水層。黏著層直接接合於蓋板與水氣阻隔膜之間，其中出線部延伸出蓋板之外，電子墨水層位於基板與蓋板之間，且蓋板的一下表面、電子墨水層的一側表面以及出線部的一上表面定義出一凹槽。封膠填入於凹槽中。
為了對本發明之上述及其他方面有更佳的瞭解，下文特舉實施例，並配合所附圖式詳細說明如下：
100:電子紙封裝結構
110:基板
1101:側表面
1102:上表面
1103:出線部
111:凹槽
112:電子墨水層
1121:側表面
113:透明電極層
114:蓋板
114a:透明基材
114b:透光性水氣阻隔層
1141:側表面
1142:下表面
116:水氣阻隔膜
117:黏著層
118:封膠
D1:顯示區
D2:非顯示區
第1圖繪示依照本發明一實施例的電子紙封裝結構的俯視示意圖；第2圖繪示依照本發明一實施例的電子紙封裝結構於A-A剖面的示意圖；及第3圖繪示依照本發明一實施例的電子紙封裝結構於B-B剖面的示意圖。
以下係提出實施例進行詳細說明，實施例僅用以作為範例說明，並非用以限縮本發明欲保護之範圍。以下是以相同/類似的符號表示相同/類似的元件做說明。以下實施例中所提到的方向用語，例如：上、下、左、右、前或後等，僅是參考所附圖式的方向。因此，使用的方向用語是用來說明並非用來限制本發明。
根據本發明之一實施例，提出一種電子紙封裝結構，包括以單一黏著層接合蓋板的水氣阻隔膜，以增加電子紙封裝結構的水氣阻隔能力，並減少成本。在一實施例中，水氣阻隔能力以水氣穿透率(Water Vapor Transmission Rate,WVTR)的數值大小來區別。在溫度60℃及濕度90%條件下，WVTR較佳為小於2~5g/m2/天，或者，小於1g/m2/天，或者，小於0.5g/m2/天，或者，小於0.1g/m2/天，或者，甚至小於0.01g/m2/天。
請參照第1至3圖，其中第1圖繪示依照本發明一實施例的電子紙封裝結構100的俯視示意圖，第2圖繪示依照本發明一實施例的電子紙封裝結構100於A-A剖面的示意圖，第3圖繪示依照本發明一實施例的電子紙封裝結構100於B-B剖面的示意圖。
在一實施例中，電子紙封裝結構100可包括一基板110、一電子墨水層112、一蓋板114、一水氣阻隔膜116、一黏著層117以及一封膠118。
基板110例如為一透明玻璃或塑膠基板或不透明基板，基板110的上表面1102配置有薄膜電晶體陣列(TFT array)或導電石墨，以做為下電極板。蓋板114可包括一透明基材114a以及一透光性水氣阻隔層114b，透明基材114a例如為塑膠或玻璃，其材質可包括聚對苯二甲酸乙二酯(PET)、聚苯乙烯(PS)、聚碳酸酯(PC)等聚合可塑性塑膠材料。透光性水氣阻隔層114b的材質可為氧化鋁(AlOx)、氧化矽、氮化矽、氧化鈦、氧化鋯、氮氧化鋁、氮氧化矽、非晶碳中的至少一種材質。透光性水氣阻隔層114b的水氣阻隔能力大於透明基材114a的水氣阻隔能力。此外，蓋板114的下表面1142配置有透明電極層113，例如銦錫氧化物(ITO)等，以做為一上電極板。
電子墨水層112設置於基板110上，且電子墨水層112位於基板110與蓋板114之間。電子墨水層112可以例如是包括數百萬個微膠囊(microcapsules)，每個微膠囊內含有電泳粒子，其中電泳粒子為帶負電荷的白色以及帶正電荷的黑色粒子，懸浮於透明液體中。當基板110與蓋板114之間的電場接通時，電泳粒子利用正、負電荷相吸的原理，移動至微膠囊的頂端，使用者在對應的區塊上，就能看見白色或黑色粒子，進而顯示一畫素圖案。此外，電子墨水層112亦可為三色或多色電子墨水層，以實現全色域顯示效果，但本發明對此不加以限制。次外，電子墨水層112可以是上述微膠囊(microcapsules)式電子墨水層或是微杯式(microcup)電子墨水層。
在一實施例中，水氣阻隔膜116用以包覆基板110與電子墨水層112，使基板110與電子墨水層112密封於蓋板114與水氣 阻隔膜116之間。此外，黏著層117直接接合於蓋板114與水氣阻隔膜116之間，以減少外部環境的水氣量經由黏著層117進入，進而增加電子紙封裝結構100的水氣阻隔能力。在一實施例中，黏著層117的厚度約為25微米，相對於傳統以雙黏著層接合兩個阻隔膜的方式，使得雙黏著層的厚度增加為2倍(約50微米)，故外部環境的較多水氣量可經由雙黏著層進入。因此，本實施例以單一黏著層117直接接合於蓋板114與水氣阻隔膜116之間，可節省成本，並增加電子紙封裝結構100的水氣阻隔能力。
此外，由於本實施例以單一黏著層117直接接合於蓋板114與水氣阻隔膜116之間，故黏著層117未接合於蓋板114與電子墨水層112之間。
水氣阻隔膜116包括環氧樹脂、聚氨酯(PU)、矽膠等高分子聚合物、鋁箔、或是選自氧化鋁(AlOx)、氧化矽、氮化矽、氧化鈦、氧化鋯、氮氧化鋁、氮氧化矽、非晶碳中的至少一種材質。在一實施例中，水氣阻隔膜116包覆於基板110與電子墨水層112的周圍，其中電子墨水層112對應顯示於蓋板114的一顯示區D1中，而黏著層117對應接合蓋板114的一非顯示區D2。
此外，請參照第2圖，電子墨水層112的側表面1121大致上與基板110的側表面1101切齊或基板110的側表面1101相對於電子墨水層112的側表面1121突出一第一距離，而電子墨水層112的側表面1121相對於蓋板114的側表面1141相隔一第二距離(即非顯示區D2的寬度，例如2mm)，其中第二距離大於第一距離，以使 電子墨水層112內藏於基板110與蓋板114之間，以增加水氣阻隔距離，避免電子墨水層112受到外部環境的水氣穿透的影響。
請參照第1及3圖，基板110可包括一出線部1103，用以輸入/輸出一訊號。出線部1103延伸出蓋板114之外，且蓋板114的一下表面1142、電子墨水層112的一側表面1121以及出線部1103的一上表面1102定義出一凹槽111。在本實施例中，封膠118可填入於凹槽111中，以避免電子墨水層112受到外部環境的水氣穿透的影響。封膠118可為熱塑型、熱固型、紫外線固化型或室溫固化型高分子硬化膠，但本發明不以此為限。
此外，由於封膠118已密封於基板110的出線部1103與蓋板114之間，故不需再以黏著層117接合於基板110與蓋板114之間，以減少黏著層117的用量。
根據本發明上述實施例的電子紙封裝結構，僅需進行一次水氣阻隔膜貼合步驟，簡化製程，且成本較低。此外，由於黏著層的厚度較薄(例如小於25微米)且蓋板與水氣阻隔膜之間的間隙變小(例如小於25微米)，故外部環境的水氣更不容易經由黏著層進入，進而增加電子紙封裝結構的水氣阻隔能力。
綜上所述，雖然本發明已以實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。
100:電子紙封裝結構
110:基板
1101:側表面
112:電子墨水層
1121:側表面
113:透明電極層
114:蓋板
114a:透明基材
114b:透光性水氣阻隔層
1141:側表面
116:水氣阻隔膜
117:黏著層
D1:顯示區
D2:非顯示區

Claims (11)

  1. 一種電子紙封裝結構，包括：一基板；一電子墨水層，設置於該基板上；一蓋板，覆蓋該電子墨水層；一水氣阻隔膜，包覆該基板與該電子墨水層；以及一黏著層，直接接合於該蓋板與該水氣阻隔膜之間，以密封該基板與該電子墨水層，且該黏著層未接合於該蓋板與該電子墨水層之間；一封膠，填入於該基板與該蓋板之間，該封膠與該水氣阻隔膜分別接合於該基板，且位於該基板的相對兩側。
  2. 如請求項1所述之電子紙封裝結構，其中該蓋板包括一透明基材以及一透光性水氣阻隔層。
  3. 如請求項1所述之電子紙封裝結構，其中該蓋板包括一顯示區以及一非顯示區，該顯示區對應顯示該電子墨水層，該非顯示區對應接合該黏著層。
  4. 如請求項1所述之電子紙封裝結構，其中該基板的一側表面相對於該電子墨水層的一側表面突出一第一距離，而該電子墨水層的該側表面相對於該蓋板的一側表面相隔一第二距離，其中該第二距離大於該第一距離。
  5. 如請求項1所述之電子紙封裝結構，其中該基板包括一出線部，延伸出該蓋板之外，該電子墨水層位於該基板與 該蓋板之間，且該蓋板的一下表面、該電子墨水層的一側表面以及該出線部的一上表面定義出一凹槽。
  6. 如請求項5所述之電子紙封裝結構，其中該黏著層未接合於該蓋板與該出線部之間。
  7. 一種電子紙封裝結構，包括：一基板，包括一出線部；一電子墨水層，設置於該基板上；一蓋板，覆蓋該電子墨水層；一水氣阻隔膜，包覆該基板與該電子墨水層；一黏著層，直接接合於該蓋板與該水氣阻隔膜之間，其中該出線部延伸出該蓋板之外，該電子墨水層位於該基板與該蓋板之間，且該蓋板的一下表面、該電子墨水層的一側表面以及該出線部的一上表面定義出一凹槽；以及一封膠，填入於該凹槽中，該封膠與該水氣阻隔膜分別接合於該基板，且位於該基板的相對兩側。
  8. 如請求項7所述之電子紙封裝結構，其中該黏著層未接合於該蓋板與該電子墨水層之間。
  9. 如請求項7所述之電子紙封裝結構，其中該黏著層未接合於該蓋板與該出線部之間。
  10. 如請求項7所述之電子紙封裝結構，其中該蓋板包括一透明基材以及一透光性水氣阻隔層。
  11. 如請求項7所述之電子紙封裝結構，其中該蓋板包括一顯示區以及一非顯示區，該顯示區對應顯示該電子墨水層，該非顯示區對應接合該黏著層。
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