WO2018205554A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2018205554A1
WO2018205554A1 PCT/CN2017/112820 CN2017112820W WO2018205554A1 WO 2018205554 A1 WO2018205554 A1 WO 2018205554A1 CN 2017112820 W CN2017112820 W CN 2017112820W WO 2018205554 A1 WO2018205554 A1 WO 2018205554A1
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WIPO (PCT)
Prior art keywords
black matrix
display panel
sealant
connecting portion
array substrate
Prior art date
Application number
PCT/CN2017/112820
Other languages
English (en)
French (fr)
Inventor
廖燕平
邵喜斌
钱学强
Original Assignee
京东方科技集团股份有限公司
北京京东方显示技术有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方显示技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/062,762 priority Critical patent/US20200264483A1/en
Publication of WO2018205554A1 publication Critical patent/WO2018205554A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133334—Electromagnetic shields
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Definitions

  • At least one embodiment of the present disclosure relates to the field of display technologies, and in particular, to a display panel, a method of fabricating the same, and a display device.
  • liquid crystal display devices have been widely used in the display field due to their advantages of being ultra-thin, light in weight, and low in power consumption.
  • the liquid crystal display device can appropriately apply a voltage to the liquid crystal layer by the electrodes, and can control the alignment direction of the liquid crystal molecules in the liquid crystal layer, thereby enabling liquid crystal display.
  • the display panel in order to avoid interference of the external circuit on the liquid crystal orientation, it is usually necessary to provide a shielding structure to shield the external electric field and avoid interference of the liquid crystal display.
  • At least one embodiment of the present disclosure provides a display panel including: an opposite substrate, one side of the opposite substrate is provided with a black matrix; an array substrate, the array substrate and the opposite substrate are set to a box Wherein the black matrix is configured to be electrically connected to an external circuit.
  • the black matrix has a resistivity of 3000 to 10 5 ⁇ cm.
  • the black matrix is an oxide of a resin or molybdenum.
  • the external circuit is configured to be grounded.
  • the display panel provided by at least one embodiment of the present disclosure further includes: an electromagnetic shielding structure including the black matrix, a bonding portion, and a connecting portion, the bonding portion electrically connecting the black matrix and The connecting portion is configured to connect the external circuit.
  • the display panel of the display panel provided by at least one embodiment of the present disclosure further includes: a sealant portion, the sealant portion is disposed between the opposite substrate and the array substrate, and is opposite to the opposite The substrate and the array substrate form a sealed space.
  • the black matrix extends to a side of the sealant portion away from the sealed space, and the bonding portion and the connecting portion are disposed at the The sealant portion is away from the side of the sealed space.
  • the bonding portion is connected to a portion of the black matrix that extends to the sealant portion and away from the side of the sealed space.
  • the connecting portion is disposed on a side of the bonding portion away from the sealant portion.
  • the connecting portion and the bonding portion are located between the black matrix and the array substrate, and the connecting portion is disposed at the bonding portion Keep away from one side of the black matrix.
  • the sealant is configured as a conductive sealant
  • the conductive sealant constitutes the bond portion
  • one end of the conductive sealant is The black matrix is connected, and the other end is connected to the connecting portion.
  • the array substrate further includes a lead terminal extending to a side of the sealant portion away from the sealed space, and the lead terminal constitutes The connecting portion.
  • the bonding portion is a conductive paste
  • the connecting portion is a conductive foam
  • At least one embodiment of the present disclosure provides a display device including the display panel of any of the preceding embodiments.
  • the display device further includes: a conductive bezel, the conductive bezel is disposed around the display panel, and the connecting portion is electrically connected to the conductive bezel.
  • At least one embodiment of the present disclosure provides a method of fabricating a display panel, including: providing an array substrate and a counter substrate disposed on a cartridge; forming a conductive black matrix on one side of the opposite substrate; wherein the black matrix It is formed to be electrically connected to an external circuit.
  • the method for fabricating a display panel provided by at least one embodiment of the present disclosure further includes: forming an electromagnetic shielding structure including the black matrix, a bonding portion, and a connecting portion; wherein the bonding portion is formed to connect the black matrix And the connecting portion, the connecting portion is formed to connect the external electric road.
  • the method for fabricating a display panel according to at least one embodiment of the present disclosure further includes: forming a sealant on the array substrate and the opposite substrate; wherein the sealant and the opposite substrate and The array substrate forms a sealed space.
  • forming the electromagnetic shielding structure includes: the black matrix is formed to extend to a side of the sealant portion away from the sealed space; Forming the bonding portion on a side of the sealant that is away from the sealing space, the bonding portion is connected to the black matrix; and forming a side of the connecting portion away from the sealant portion The connecting portion.
  • FIG. 1 shows a schematic structural view of a display panel according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural view of a display panel according to another embodiment of the present disclosure.
  • FIG. 3 is a schematic structural view of a display panel according to another embodiment of the present disclosure.
  • FIG. 4 shows a schematic structural view of a display device according to an embodiment of the present disclosure
  • FIG. 5 shows a schematic structural view of a display device according to another embodiment of the present disclosure
  • 6A-6D are process diagrams of a method of fabricating a display panel according to an embodiment of the present disclosure.
  • electromagnetic shielding can have problems such as high cost and complicated process.
  • the display panel is mainly formed by depositing a layer of ITO (indium tin oxide) on the outer side of the opposite substrate glass, connecting it to an external circuit through a conductive foam or the like, and grounding.
  • ITO indium tin oxide
  • the cost of ITO is high, and the deposition of a layer of ITO increases the production process.
  • the structure of the display panel can be improved, for example, the design of the related structure for the electromagnetic barrier can be simplified, the problems of high production cost and complicated production process of the display panel can be improved.
  • At least one embodiment of the present disclosure provides a display panel including: an opposite substrate, one side of the opposite substrate is provided with a black matrix; the array substrate, the array substrate and the opposite substrate are disposed on the box; wherein the black matrix is configured to be external The circuit is electrically connected.
  • the display panel relies on a black matrix with a certain conductivity to achieve electromagnetic shielding, which can reduce production costs and simplify the production process.
  • the type of the display panel is not limited.
  • the display panel may be a liquid crystal display panel, and accordingly, the opposite substrate may be a color film substrate.
  • the display panel may be an organic light emitting diode display panel, and correspondingly, the opposite substrate may be a package cover or the like.
  • the technical solution in the following embodiments of the present disclosure will be described by taking a display panel as a liquid crystal display panel as an example.
  • FIG. 1 shows a schematic structural view of a display panel according to an embodiment of the present disclosure.
  • the display panel includes a counter substrate 100 and an array substrate 300 disposed on the counter, and one side of the counter substrate 100 is provided with a conductive black matrix 200, and the black matrix is configured to be electrically connected to an external circuit.
  • the black matrix 200 is disposed on one side of the opposite substrate 100 to prevent light leakage from the display panel.
  • the counter substrate 100 and the array substrate 300 are disposed to the cartridge, and a sealed space for accommodating liquid crystal molecules is formed between the counter substrate 100 and the array substrate 300.
  • the black matrix 200 is disposed on the surface of the display panel and connected to an external circuit if a high level is generated on the black matrix 200
  • the voltage can discharge the electric charge generating the high level into the external circuit, and thus, the black matrix 200 can function as an electromagnetic shield for the internal structure of the display panel.
  • the specific setting position of the black matrix 200 is not limited.
  • the black matrix 200 may be disposed on a side of the opposite substrate 100 facing the array substrate 300, or may be disposed on a side of the opposite substrate 100 facing away from the array substrate 300.
  • the material of the black matrix 200 is not limited.
  • the black matrix 200 may be disposed to have a certain electrical conductivity and may serve as an electromagnetic shielding electrode structure.
  • the black matrix 200 according to an embodiment of the present disclosure may be formed using a medium and low resistance black matrix.
  • the black matrix 200 may have a resistivity of about 3000 to 10 5 ⁇ cm.
  • the black matrix 200 when the resistivity of the black matrix is within the above range, the black matrix 200 can be made to have a certain conductivity. Thereby, the black matrix 200 can be made to function as a shield electrode instead of the ITO layer which is usually provided on the opposite substrate, thereby achieving electromagnetic shielding.
  • the resistivity of the black matrix when the resistivity of the black matrix is within the above range, it can ensure that it has sufficient conductivity, can be used to achieve electromagnetic shielding, and can avoid excessive pursuit of conductivity, resulting in an increase in material cost.
  • the resistivity of the black matrix 200 may not be limited to the above numerical range, as long as the resistivity of the black matrix 200 can satisfy the requirement of realizing electromagnetic shielding.
  • the specific preparation materials of the black matrix 200 are not limited.
  • the black matrix 200 may be prepared from a material having a low resistivity, or may be formed by adding a conductive material such as a resin, as long as the resistivity of the black matrix 200 satisfies the requirements, and the embodiment of the present disclosure is directed to the black matrix 200.
  • the specific preparation materials are not limited.
  • the preparation material of the black matrix 200 may include an oxide of molybdenum, for example, an oxide of the molybdenum may be added to the resin material.
  • the oxide of molybdenum in the black matrix 200 may be molybdenum trioxide (MoO 3 ) or molybdenum dioxide (MoO 2 ) or the like.
  • MoO 3 molybdenum trioxide
  • MoO 2 molybdenum dioxide
  • the black matrix 200 when the electromagnetic shielding is realized by using the black matrix 200 instead of the ITO layer, not only the production cost can be saved (due to the relatively high cost of the ITO material), but also the production process can be simplified. Specifically, in order to prevent light leakage, current display panels require a black matrix to be disposed on the opposite substrate. Therefore, the black matrix 200 is used for electromagnetic shielding, and the production process is not increased first. Secondly, those skilled in the art can understand that in the display panel, each pixel unit corresponds to a part of the black matrix structure, so as to cover the circuit. The line shields the uncontrolled portion of the liquid crystal molecules to prevent light leakage. Therefore, the black matrix 200 does not cover the opposite substrate 100 The entire surface, but the distribution of the black matrix 200 on the opposite substrate 100 is relatively uniform. Therefore, the black matrix 200 can ensure a good electromagnetic shielding effect on the display panel.
  • the display panel according to an embodiment of the present disclosure does not introduce a new structure (ITO layer) as compared with the current display panel in which an ITO layer is separately deposited to form an electromagnetic shielding structure.
  • ITO layer a new structure
  • the introduction of an additional ITO layer obviously reduces the light transmittance of the display panel. Therefore, in order to enable the display panel to have sufficient display brightness, it is necessary to increase the light intensity of the backlight, thereby causing an increase in power consumption of the display panel.
  • the use of the black matrix 200 to achieve electromagnetic shielding can have at least one of the following advantages: low cost, no expensive raw materials involved; simple preparation process, production can be realized by using an existing opposite substrate production line, It involves additional processing procedures; it does not affect the display function of the display panel, and can shield the external electric field without increasing the power consumption of the display panel.
  • the external circuit is configured to be grounded.
  • the ground connection for example, electrical connection
  • the accumulated charges in the black matrix or even the display panel can be released, thereby protecting the entire display panel.
  • the specific manner of electrically connecting the black matrix 200 and the external circuit is not limited.
  • the display panel may include an electromagnetic shielding structure 400, which may include a black matrix 200, a bonding portion 410, and a connecting portion 420, and the bonding portion 410 is electrically
  • the black matrix 200 and the connection portion 420 are connected, and the connection portion 420 is used to connect an external circuit.
  • the black matrix 200 can be electrically connected to an external circuit, so that the black matrix 200 can protect the display panel from electromagnetic shielding.
  • the electromagnetic shielding structure 400 needs to be grounded to shield the external circuit.
  • the specific manner in which the electromagnetic shielding structure 400 is grounded is not limited, and those skilled in the art may select according to actual conditions.
  • the black matrix 200 can be electrically connected to an external circuit by using an adhesive having a certain conductivity, such as a conductive adhesive or the like, or the black matrix 200 can be directly connected to the metal structure, thereby grounding the black matrix 200.
  • the black matrix 200 may be electrically connected to the connection portion 420 by the bonding portion 410, and then electrically connected to an external ground circuit or other ground structure through the connection portion 420 to easily achieve grounding.
  • FIG. 2 shows a schematic structural view of a display panel according to another embodiment of the present disclosure.
  • the connecting portion 420 and the bonding may be provided on the end surface of the display panel (ie, the position corresponding to the liquid crystal accommodating space between the opposite substrate 100 and the array substrate 300 in the side of the display panel).
  • the portion 410 is grounded by the end faces to realize the grounding of the black matrix 200.
  • the display panel further includes: a frame sealant portion disposed between the opposite substrate and the array substrate, and forming a seal with the opposite substrate and the array substrate space.
  • the display panel may further include a sealant portion 500.
  • the sealant portion 500 is disposed between the counter substrate 100 and the array substrate 300 and forms a sealed space with the counter substrate 100 and the array substrate 300.
  • the upper and lower opposing substrates 100 and the array substrate 300 can be closely adhered by applying a sealant on the edges of the opposite substrate 100 and the array substrate 300 (the sealant coating application region).
  • the liquid crystal molecules filled in the two substrates are blocked from the outside. That is to say, the sealant portion 500 surrounds the periphery of the display panel to define liquid crystal molecules within the display panel.
  • the black matrix extends to a side of the sealant portion away from the sealed space, and the bonding portion and the connecting portion are disposed on a side of the sealant portion away from the sealed space.
  • the black matrix 200 may be extended to the outside of the sealant portion 500, that is, to a side away from the sealed space in which the liquid crystal molecules are accommodated.
  • the external circuit can be connected and grounded outside the sealed space.
  • the bonding portion is connected to a portion of the black matrix that extends to the sealant portion and away from the side of the sealed space.
  • the bonding portion 410 may be in direct contact with a portion of the protruding sealant portion 500 of the black matrix 200 to facilitate bonding of the bonding portion 410 to the black matrix 200.
  • the bonding portion 410 and the connecting portion 420 are disposed outside the sealing frame portion 500 (away from the sealing space), and can realize the connection between the electromagnetic shielding structure and the external circuit without affecting the pair of the array substrate and the opposite substrate. Realize the grounding of the electromagnetic shielding structure. As such, for example, a ground connection of the black matrix 200 can be achieved at the end face of the liquid crystal cell without increasing the volume of the display panel.
  • the connecting portion may be disposed on a side of the bonding portion away from the sealant portion.
  • the bonding portion 410 may be disposed on a portion of the black matrix 200 that extends to the outside of the sealing frame portion 500 (the side away from the sealing space), for example, the bonding portion 410 is disposed at the sealing portion.
  • the sealant portion 500 is away from the side of the sealed space.
  • the bonding portion 410 is disposed outside the sealing frame portion 500, and grounding can be realized on the end surface of the display panel.
  • the connection mode has a simple structure and simplifies the manufacturing process of the display panel.
  • the bonding portion 410 is located in the package.
  • a side of the glue portion 500 away from the sealed space may be disposed to fill a gap between the array substrate 300 and the opposite substrate 100.
  • the contact area of the bonding portion 410 with the black matrix 200 can be increased to ensure electrical connection between the bonding portion 410 and the black matrix 200.
  • the display panel is usually assembled and fixed with a structure such as a backlight module in a later assembly process. Therefore, a frame for assembling a fixed frame, such as a metal of a backlight module, is disposed at an end surface of the display panel. Boxes such as iron boxes and so on.
  • the connection portion 420 can be disposed between the bonding portion 410 and the conductive bezel (such as a metal frame), so that the grounding of the black matrix 200 can be realized, and the ground circuit can be eliminated.
  • the specific material forming the bonding portion 410 and the connecting portion 420 is not limited.
  • the bond portion 410 can include a conductive paste (eg, a conductive silver paste, etc.) and the connection portion 420 can include a conductive foam.
  • the conductive adhesive can be grounded through the conductive foam attached to the outside thereof, thereby shielding the electric field of the external circuit.
  • the materials constituting the electromagnetic shielding structure described above are widely available and easily available, thereby saving production costs.
  • the specific positions of the bonding portion and the connecting portion are not limited to those shown in FIG. 2, and the embodiment of the present disclosure does not perform the specific positional relationship between the bonding portion and the connecting portion. Restriction, as long as the two can electrically connect the black matrix to an external circuit.
  • connection portion and the bonding portion are located between the black matrix and the array substrate, and the connection portion is disposed on a side of the bonding portion away from the black matrix.
  • FIG. 3 shows a schematic structural view of a display panel according to another embodiment of the present disclosure.
  • the ground of the electromagnetic shielding structure 400 can be realized on the side of the array substrate 300 by means of surface connection.
  • connection portion 420 and the bonding portion 410 are located between the black matrix 200 and the array substrate 300, and the connection portion 420 is disposed on a side of the bonding portion 410 away from the black matrix 200.
  • the connecting portion 420 and the bonding portion 410 can be disposed between the opposite substrate 100 and the array substrate 300 without increasing the width of the frame region of the display panel, thereby facilitating the extremely narrow design of the frame of the display panel, and connecting The portion 420 and the bonding portion 410 are protected by the opposing substrate 100 and the array substrate 300, are not damaged by external members or external forces, and ensure the reliability of the connection between the black matrix 200, the bonding portion 410, and the connecting portion 420.
  • the sealant is configured as a conductive sealant
  • the conductive sealant constitutes a bond
  • one end of the conductive sealant is connected to the black matrix, and the other end is connected to the joint.
  • the sealing frame portion may be doped with conductive particles (such as conductive silver glue, etc.), and one end of the encapsulating portion may be electrically connected to the connecting portion, so that in the process of pairing the array substrate and the opposite substrate,
  • the frame seal rubber part can directly connect the black matrix to the external circuit to simplify the preparation of the display panel. art.
  • the array substrate further includes a lead terminal extending to a side of the sealant portion away from the sealed space, and the lead terminal constitutes a connection portion.
  • the lead terminal constitutes a connection portion.
  • a plurality of thin film transistors (TFTs) for controlling liquid crystal molecules are generally disposed on the array substrate 300. Therefore, a portion corresponding to the outer side of the frame sealant portion 500 on the array substrate 300 may be A plurality of lead terminals are reserved for realizing connection of an electrical component such as a thin film transistor on the array substrate 300 with an external circuit such as a flexible circuit board and a control IC or the like. Therefore, the grounding of the black matrix 200 can be realized by the above-described inherent structure (lead terminal) of the array substrate 300.
  • the connecting portion 420 is formed by a lead terminal, and the lead terminal extends to the side of the sealant portion 500 away from the sealed space.
  • the black matrix 200 also extends to the side of the sealant portion 500 away from the sealed space.
  • the conductive paste is applied to the black matrix 200 at a position corresponding to the lead terminal to be connected, and the electrical connection between the black matrix 200 and the lead terminal can be realized after the counter substrate 100 and the array substrate 300 are paired with the lead.
  • the electromagnetic shielding structure 400 can be shielded from the external circuit.
  • the frame sealant may be coated or the frame sealant may be applied, and the opposite substrate 100 is placed on the sealant.
  • a conductive paste is dropped on the black matrix 200 on the outer side of the portion 500 (the side of the sealant portion 500 away from the sealed space).
  • the black matrix 200 and the lead terminals can be connected by the conductive paste while the case is being placed, and the external circuit is connected to the ground terminal by the lead terminals and grounded to form an electromagnetic shielding structure.
  • At least one embodiment of the present disclosure provides a display device including the display panel of any of the previous embodiments. Thereby, the production cost of the display device can be reduced, and the production process can be simplified.
  • FIG. 4 shows a schematic structural view of a display device according to an embodiment of the present disclosure.
  • the display device 1000 includes a display panel 1100.
  • the display panel 1100 can be the display panel in any of the foregoing embodiments. Therefore, the display device 1000 has all the features and advantages of the display panel described above, and details are not described herein.
  • the display device has at least one of the following advantages: low cost, no expensive raw materials involved; simple preparation process, production can be realized by using an existing production line, no additional processing procedures are involved;
  • the display function can shield the external electric field without increasing the power consumption of the display device.
  • FIG. 5 shows A schematic structural view of a display device of another embodiment is disclosed.
  • the display device 1000 may further include: a metal frame 600, which may be disposed, for example, around the display panel, and the connecting portion 420 is connected to the metal frame 600.
  • the metal frame can be easily used to realize the grounding of the black matrix 200, thereby shielding the external electric field.
  • the metal frame 600 can also be replaced by other conductive frames, which is not limited by the embodiments of the present disclosure.
  • the display device may be any product or component having a display function such as a television, a digital camera, a mobile phone, a watch, a tablet, a notebook, a navigator, or the like.
  • At least one embodiment of the present disclosure provides a method of fabricating a display panel, the method comprising: providing an array substrate and a counter substrate disposed on a cartridge; forming a conductive black matrix on one side of the opposite substrate; wherein the black matrix is formed as Electrically connected to an external circuit.
  • the obtained display panel is electromagnetically shielded by a black matrix having a certain conductivity, which can reduce the production cost and simplify the production process.
  • the method for fabricating a display panel further includes: forming an electromagnetic shielding structure including a black matrix, a bonding portion, and a connecting portion; wherein the bonding portion is formed to connect the black matrix and the connecting portion, the connecting portion Formed to connect an external circuit.
  • the electromagnetic barrier structure can electrically connect the black matrix to the external circuit to realize the electromagnetic shielding function of the black matrix.
  • the method for fabricating a display panel provided by at least one embodiment of the present disclosure further includes: forming a sealant on the array substrate and the opposite substrate; wherein the sealant portion forms a sealed space with the opposite substrate and the array substrate.
  • the array substrate and the opposite substrate are set by the package rubber portion, and the internal structure of the display panel is protected.
  • forming the electromagnetic shielding structure includes: forming a black matrix to extend to a side of the sealant portion away from the sealed space; and away from the sealed space of the sealant A bonding portion is formed on one side, and the bonding portion is connected to the black matrix; and a connecting portion is formed on a side of the connecting portion away from the sealing frame rubber portion.
  • the black matrix and the external circuit can be electrically connected without affecting the arrangement of the opposing substrate and the array substrate.
  • the specific structure of the display panel obtained by the above-mentioned preparation method can be referred to the related content in the foregoing embodiment (for the embodiment of the display panel), and the embodiments of the present disclosure are not described herein.
  • the method for preparing the display panel can also be adjusted accordingly, and the embodiments of the present disclosure are not described herein.
  • FIGS. 6A-6D are process diagrams of a method of fabricating a display panel according to an embodiment of the present disclosure.
  • FIGS. 6A to 6D a process of preparing a display panel will be described by taking a display panel as shown in FIG. 2 as an example.
  • a counter substrate 100 is provided, and a black matrix 200 is formed on one side of the counter substrate 100.
  • the array substrate 300 is provided, and the encapsulant portion 500 is formed on the array substrate.
  • the encapsulant portion 500 is not limited to be formed on the array substrate 300, and may be formed on the counter substrate 100. The embodiments of the present disclosure are not described herein.
  • the opposite substrate 100 and the array substrate 300 are disposed on the cartridge, and the encapsulant portion 500 is positioned between the opposite substrate 100 and the array substrate 300 to fix the opposite substrate 100 and the array substrate 300.
  • the specific location of the black matrix 200 is not limited.
  • the black matrix 200 is formed on a side of the opposite substrate 100 facing the array substrate 300, or the black matrix 200 may be formed on a side of the opposite substrate 100 away from the array substrate 300.
  • the black matrix 200 shown in FIG. 6C is formed on the side of the counter substrate 100 facing the array substrate 300, and the technical solutions in the following embodiments of the present disclosure will be described.
  • the black matrix 200 is formed to extend to the side of the sealant portion 500 away from the sealed space.
  • a bonding portion 410 is formed on a side of the sealant portion 500 that is away from the sealed space.
  • the bonding portion 410 is electrically connected to the black matrix 200.
  • a connecting portion 420 is formed on a side of the bonding portion 410 away from the sealant portion 500, and the connecting portion 420 may be connected to an external circuit such that the black matrix 200 can be electrically connected to an external circuit.
  • the bonding as shown in FIG. 3 may be formed on the outside of the sealant portion 500 of the array substrate, for example.
  • the portion 410 is away from one side of the black matrix 200.
  • the sealant is configured as a conductive sealant, the conductive sealant constitutes a bond, and one end of the conductive sealant is connected to the black matrix, and the other end is connected to the joint.
  • the sealing frame portion may be doped with conductive particles (for example, conductive silver glue, etc.), and one end of the encapsulating portion may be electrically connected to the connecting portion, so that in the process of aligning the array substrate and the opposite substrate, the sealing frame portion
  • the black matrix can be directly connected to an external circuit to simplify the preparation process of the display panel.

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Abstract

一种显示面板(1100)及其制备方法、显示装置。该显示面板(1100)包括：对盒设置的对置基板(100)和阵列基板(300)，对置基板(100)的一侧设置有导电的黑矩阵(200)对置基板，黑矩阵(200)配置为与外部电路电连接并接地。由此，显示面板(1100)依靠黑矩阵(200)实现电磁屏蔽，可以降低生产成本，简化生产流程。

Description

显示面板及其制备方法、显示装置
本申请要求于2017年5月12日递交的中国专利申请第201720538622.9号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开至少一个实施例涉及显示技术领域，具体地，涉及一种显示面板及其制备方法、显示装置。
背景技术
目前，液晶显示装置由于其超薄、重量轻以及耗电低等优点，从而在显示领域中有着广泛的运用。液晶显示装置通过电极对液晶层适当加电压，可控制液晶层中的液晶分子的取向方向，从而能够进行液晶显示。在显示面板中，为了避免外电路对液晶取向造成干扰，通常需要设置屏蔽结构，从而起到对外电场的屏蔽作用，避免液晶显示出现干扰。
然而，目前显示面板以及显示装置仍有待改进。
发明内容
本公开至少一个实施例提供一种显示面板，该显示面板包括：对置基板，所述对置基板的一侧设置有黑矩阵；阵列基板，所述阵列基板与所述对置基板对盒设置；其中，所述黑矩阵配置为与外部电路电连接。
例如，在本公开至少一个实施例提供的显示面板中，所述黑矩阵的电阻率为3000～105Ω·cm。
例如，在本公开至少一个实施例提供的显示面板中，所述黑矩阵为树脂或钼的氧化物。
例如，在本公开至少一个实施例提供的显示面板中，所述外部电路配置为接地。
例如，本公开至少一个实施例提供的显示面板中还包括：电磁屏蔽结构，所述电磁屏蔽结构包括所述黑矩阵、粘结部以及连接部，所述粘结部电连接所述黑矩阵以及所述连接部，所述连接部用于连接所述外部电路。
例如，本公开至少一个实施例提供的显示面板中显示面板还包括：封框胶部，所述封框胶部设置在所述对置基板以及所述阵列基板之间，且与所述对置基板和所述阵列基板形成密封空间。
例如，在本公开至少一个实施例提供的显示面板中，所述黑矩阵延伸至所述封框胶部远离所述密封空间的一侧，所述粘结部以及所述连接部设置在所述封框胶部远离所述密封空间的一侧。
例如，在本公开至少一个实施例提供的显示面板中，所述粘结部与所述黑矩阵延伸至所述封框胶部且远离所述密封空间一侧的部分相连。
例如，在本公开至少一个实施例提供的显示面板中，所述连接部设置在所述粘结部远离所述封框胶部的一侧。
例如，在本公开至少一个实施例提供的显示面板中，所述连接部和所述粘结部位于所述黑矩阵和所述阵列基板之间，并且所述连接部设置在所述粘结部远离所述黑矩阵的一侧。
例如，在本公开至少一个实施例提供的显示面板中，所述封框胶部配置为导电封框胶，所述导电封框胶构成所述粘结部并且所述导电封框胶的一端与所述黑矩阵连接，另一端与所述连接部连接。
例如，在本公开至少一个实施例提供的显示面板中，所述阵列基板进一步包括引线端子，所述引线端子延伸至所述封框胶部远离所述密封空间的一侧，所述引线端子构成所述连接部。
例如，在本公开至少一个实施例提供的显示面板中，所述粘结部为导电胶，所述连接部为导电泡棉。
本公开至少一个实施例提供一种显示装置，该显示装置包括前面任一实施例所述的显示面板。
例如，在本公开至少一个实施例提供的液晶显示装置中，该显示装置进一步包括：导电边框，所述导电边框环绕所述显示面板设置，所述连接部与所述导电边框电连接。
本公开至少一个实施例提供一种显示面板的制备方法，包括：提供对盒设置的阵列基板和对置基板；在所述对置基板的一侧形成导电的黑矩阵；其中，所述黑矩阵形成为与外部电路电连接。
例如，本公开至少一个实施例提供的显示面板的制备方法还包括：形成电磁屏蔽结构，包括所述黑矩阵、粘结部以及连接部；其中，所述粘结部形成为连接所述黑矩阵以及所述连接部，所述连接部形成为连接所述外部电 路。
例如，本公开至少一个实施例提供的显示面板的制备方法还包括：在所述阵列基板和所述对置基板形成封框胶部；其中，所述封框胶部与所述对置基板和所述阵列基板形成密封空间。
例如，在本公开至少一个实施例提供的显示面板的制备方法中，形成所述电磁屏蔽结构包括：所述黑矩阵形成为延伸至所述封框胶部远离所述密封空间的一侧；在所述封框胶的远离所述封空间的一侧形成所述粘结部，所述粘结部与所述黑矩阵连接；在所述连接部的远离所述封框胶部的一侧形成所述连接部。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1显示了根据本公开一个实施例的显示面板的结构示意图；
图2显示了根据本公开另一个实施例的显示面板的结构示意图；
图3显示了根据本公开另一个实施例的显示面板的结构示意图；
图4显示了根据本公开一个实施例的显示装置的结构示意图；
图5显示了根据本公开另一个实施例的显示装置的结构示意图；以及
图6A～图6D为本公开一个实施例提供的显示面板的制备方法的过程图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用 来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
对于当前结构的显示面板，实现电磁屏蔽会存在成本高，工艺复杂等问题。通常，显示面板主要是依靠在对置基板玻璃外侧沉积一层ITO(氧化铟锡)，通过导电泡棉等方式与外电路连接并接地而构成的。而ITO成本较高，且沉积一层ITO增加了生产工序。由此，如果可以对显示面板的结构进行改进，例如简化用于电磁屏障的相关结构的设计，则显示面板生产成本高、生产工艺复杂的问题均会得到改善。
本公开至少一个实施例提供一种显示面板，包括：对置基板，对置基板的一侧设置有黑矩阵；阵列基板，阵列基板与对置基板对盒设置；其中，黑矩阵配置为与外部电路电连接。显示面板依靠具有一定导电能力的黑矩阵实现电磁屏蔽，可以降低生产成本，简化生产流程。
需要说明的是，在本公开的实施例中，对显示面板的类型不做限制。例如，显示面板可以为液晶显示面板，相应地，对置基板可以为彩膜基板。例如，显示面板可以为有机发光二极管显示面板，相应地，对置基板可以为封装盖板等。下面，以显示面板为液晶显示面板为例对本公开下述实施例中的技术方案进行说明。
下面，结合附图对根据本公开至少一个实施例中的显示面板及其制备方法、显示装置进行说明。
在本公开至少一个实施例中，图1显示了根据本公开一个实施例的显示面板的结构示意图。例如，如图1所示，显示面板包括对盒设置的对置基板100和阵列基板300，对置基板100的一侧设置有导电的黑矩阵200，黑矩阵配置为与外部电路电连接。黑矩阵200设置在对置基板100的一侧，防止该显示面板发生漏光。对置基板100和阵列基板300对盒设置，并在对置基板100和阵列基板300之间，形成用于容纳液晶分子的密封空间。本领域技术人员能够理解的是，在对置基板100和阵列基板300进行对盒之前，需要首先在阵列基板300上滴入液晶，以实现该显示面板的使用功能。黑矩阵200设置在显示面板的表面并且连接至外部电路，如果黑矩阵200上产生高电平 电压，可以将产生该高电平的电荷释放至外部电路中，如此，黑矩阵200可以对显示面板的内部结构起到电磁屏蔽的作用。如此，相对于当前技术，不需要设置例如ITO等来实现电磁屏蔽的作用，可以降低生产成本，简化生产流程。
在本公开的实施例中，对黑矩阵200的具体设置位置不做限制。例如，黑矩阵200可以设置在对置基板100的面向阵列基板300的一侧，也可以设置在对置基板100的背离阵列基板300的一侧。
显示面板在本公开的实施例中，对黑矩阵200的材料不做限制，例如，黑矩阵200可以设置为具有一定的导电能力，可以充当电磁屏蔽的电极结构。例如，可以采用中低阻黑矩阵形成根据本公开实施例的黑矩阵200。
例如，在本公开至少一个实施例中，黑矩阵200的电阻率可以为约3000～105Ω·cm。根据本公开的实施例，当黑矩阵的电阻率在上述范围内时，可以使得黑矩阵200具有一定的导电能力。由此，可以使得黑矩阵200充当屏蔽电极，替代通常在对置基板上设置的ITO层，从而实现电磁屏蔽。当黑矩阵的电阻率在上述范围内时，既可以保证其具有足够的导电能力，可以用于实现电磁屏蔽，又可以避免过度追求电导率，而导致材料成本的提高。需要说明的是，黑矩阵200的电阻率也可以不限于上述数值范围，只要黑矩阵200的电阻率可以满足实现电磁屏蔽的需求即可。
在本公开的实施例中，对黑矩阵200的具体制备材料不做限制。例如，黑矩阵200可以由低电阻率的材料制备而成，也可以通过在例如树脂等中添加导电材料形成，只要黑矩阵200的电阻率满足要求即可，本公开的实施例对黑矩阵200的具体制备材料不做限制。例如，黑矩阵200的制备材料可以包括钼的氧化物，例如可以在树脂材料中添加该钼的氧化物。例如，黑矩阵200中的钼的氧化物可为三氧化钼(MoO3)或者二氧化钼(MoO2)等。由此，采用成本较低的材料便可实现电磁屏蔽。
根据本公开的实施例，当采用黑矩阵200替代ITO层实现电磁屏蔽时，不仅可以节约生产成本(由于ITO材料的成本相对高昂)，并且，可以简化生产工艺。具体地，出于防止漏光的考虑，目前的显示面板均需要在对置基板上设置黑矩阵。因此，采用黑矩阵200用于电磁屏蔽，首先不会增加生产工艺；其次，本领域技术人员能够理解的是，在显示面板中，每一个像素单元均对应有一部分的黑矩阵结构，以便遮盖电路线，并对液晶分子不受控制的部分进行遮挡，从而防止漏光。因此，黑矩阵200虽然不覆盖对置基板100 的全部表面，但黑矩阵200在对置基板100上的分布是较为均匀的。因此，黑矩阵200可以保证对显示面板起到良好的电磁屏蔽效果。
在本公开的实施例中，由于设置黑矩阵200的位置，本身即为不需要背光通过的部分，因此，利用黑矩阵200进行电磁屏蔽，不会导致该显示面板背光利用率的浪费。与当前的采用单独沉积ITO层形成电磁屏蔽结构的显示面板相比，根据本公开实施例的显示面板并未引入新的结构(ITO层)。虽然ITO材料具有良好的透光率，但引入额外的ITO层，显然会降低该显示面板的透光率。因此，为了使得该显示面板能够具有足够的显示亮度，势必要提高背光的光强，从而造成该显示面板的功耗增加。总的来说，采用黑矩阵200来实现电磁屏蔽，可以具有以下优点的至少之一：成本低廉，不涉及昂贵的原料；制备工艺简单，利用现有的对置基板生产线即可实现生产，不涉及额外的加工程序；不影响显示面板的显示功能，能够在不提高该显示面板的功耗的前提下，实现对外电场的屏蔽。
例如，在本公开至少一个实施例提供的显示面板中，外部电路配置为接地。如此，利用外部电路可以实现黑矩阵的接地连接(例如电连接)，可以将黑矩阵乃至显示面板中聚集的电荷释放出去，从而对整个显示面板进行保护。下面，以外部电路配置为接地为例，对本公开下述至少一个实施例中的方案进行说明。
在本公开的实施例中，对黑矩阵200和外部电路电连接的具体方式不做限制。例如，在本公开至少一个实施例中，如图1所示，显示面板可以包括电磁屏蔽结构400，电磁屏蔽结构400可以包括黑矩阵200、粘结部410以及连接部420，粘结部410电连接黑矩阵200以及连接部420，连接部420用于连接外部电路。如此，可以实现黑矩阵200与外部电路电连接，使得黑矩阵200可以对显示面板进行电磁屏蔽的保护。
本领域技术人员能够理解的是，根据本公开实施例的电磁屏蔽结构400，需要进行接地处理，以便实现对外电路的屏蔽。在本公开的实施例中，对该电磁屏蔽结构400实现接地的具体方式不做限制，本领域技术人员可以根据实际情况进行选择。例如，可以利用具有一定导电能力的粘结剂，如导电胶等等，将黑矩阵200与外部电路进行电连接，或是将黑矩阵200直接与金属结构相连，从而可以实现黑矩阵200的接地。根据本公开的具体实施例，可以利用粘结部410，将黑矩阵200与连接部420电连接，然后通过连接部420与外部接地电路或者其它的接地结构电连接，简便地实现接地。
图2显示了根据本公开另一个实施例的显示面板的结构示意图。例如图2所示，可以在该显示面板的端面(即显示面板的侧边中，与对置基板100以及阵列基板300之间的液晶容纳空间相对应的位置)，设置连接部420以及粘结部410，通过端面连接，实现黑矩阵200的接地。
例如，在本公开至少一个实施例提供的显示面板中，显示面板还包括：封框胶部，封框胶部设置在对置基板以及阵列基板之间，且与对置基板和阵列基板形成密封空间。示例性的，如图2所示，显示面板还可以包括封框胶部500。封框胶部500设置在对置基板100以及阵列基板300之间，且与对置基板100和阵列基板300形成密封空间。具体的，在制备该显示面板时，通过分别在对置基板100和阵列基板300的边缘(封框胶涂布区域)涂布封框胶，使上下对置基板100和阵列基板300能够紧密黏住，并且将填充在两个基板(对置基板100和阵列基板300)中的液晶分子与外界阻隔。也即是说，封框胶部500围绕于显示面板四周，将液晶分子限定在显示面板之内。
例如，在本公开至少一个实施例提供的显示面板中，黑矩阵延伸至封框胶部远离密封空间的一侧，粘结部以及连接部设置在封框胶部远离密封空间的一侧。示例性的，如图2所示，可以将黑矩阵200延伸至封框胶部500外部，即延伸至远离容纳液晶分子的密封空间的一侧。由此，可以在密封空间外侧，进行外电路的连接并实现接地。例如，在本公开至少一个实施例提供的显示面板中，粘结部与黑矩阵延伸至封框胶部且远离密封空间一侧的部分相连。如此，粘结部410可以与黑矩阵200的突出封框胶部500的部分直接接触，便于粘结部410与黑矩阵200连接。粘结部410以及连接部420设置在封框胶部500外部(远离密封空间)，可以在不影响阵列基板和对置基板的对盒的前提下，实现电磁屏蔽结构与外部电路的连接，进一步实现电磁屏蔽结构的接地。如此，可以在液晶盒的端面实现黑矩阵200的例如接地连接，且不增加显示面板的体积。
例如，在本公开至少一个实施例提供的显示面板中，连接部可以设置在粘结部远离所述封框胶部的一侧。示例性的，如图2所示，粘结部410可以设置在黑矩阵200的延伸至封框胶部500外部(远离密封空间的一侧)的部分上，例如，粘结部410设置在封框胶部500远离所述密封空间的一侧。将粘结部410设置在封框胶部500的外部，可以在该显示面板的端面实现接地，该连接方式的结构简单，简化显示面板的制备工艺。
例如，在本公开至少一个实施例中，如图2所示，粘结部410位于封装 胶部500的远离密封空间的一侧并且可以设置为填充阵列基板300和对置基板100之间的间隙。如此，可以加大粘结部410与黑矩阵200的接触面积，保证粘结部410和黑矩阵200之间的电连接。
在实际工艺中，显示面板在后期的组装过程中，通常需要与诸如背光模组等结构进行组装固定，因此在该显示面板的端面处会设置用于组装固定的边框，例如背光模组的金属框例如铁框等等。此时，可以在粘结部410以及上述导电边框(如金属边框)之间，设置连接部420，即可实现黑矩阵200的接地，可以不需要额外设置接地电路。
在本公开的实施例中，对形成粘结部410以及连接部420的具体材料不做限制。例如，在本公开至少一个实施例中，粘结部410可以包括导电胶(例如导电银胶等)，连接部420可以包括导电泡棉。由此，导电胶可以通过其外侧贴的导电泡棉，实现接地，从而起到对外电路电场的屏蔽作用。并且上述构成电磁屏蔽结构的材料来源广泛、容易获得，从而可以节约生产成本。
需要说明的是，在本公开的实施例中，对粘结部和连接部的具体位置不限于图2所示，本公开的实施例在此对粘结部和连接部的具体位置关系不做限制，只要两者可以将黑矩阵与外部电路电连接即可。
例如，在本公开至少一个实施例中，连接部和粘结部位于黑矩阵和阵列基板之间，并且连接部设置在粘结部远离黑矩阵的一侧。图3显示了根据本公开另一个实施例的显示面板的结构示意图。例如图3所示，可以在阵列基板300一侧，通过面上连接的方式，实现该电磁屏蔽结构400的接地。示例性的，连接部420和粘结部410位于黑矩阵200和阵列基板300之间，并且连接部420设置在粘结部410远离黑矩阵200的一侧。如此，连接部420和粘结部410可以都设置于对置基板100和阵列基板300之间，不会增加显示面板的边框区域的宽度，有利于显示面板的边框的极窄化设计，而且连接部420和粘结部410受到对置基板100和阵列基板300的保护，不会受到外部构件或者外力干扰而损坏，保证黑矩阵200、粘结部410和连接部420之间连接的可靠性。
例如，在本公开至少一个实施例中，封框胶部配置为导电封框胶，导电封框胶构成粘结部并且导电封框胶的一端与黑矩阵连接，另一端与连接部连接。示例性的，封框胶部中可以掺杂导电粒子(例如导电银胶等)，封装胶部的一端可以与连接部电连接，如此，在将阵列基板和对置基板的对盒过程中，封框胶部可以直接将黑矩阵与外部电路电连接，简化显示面板的制备工 艺。
例如，在本公开至少一个实施例中，阵列基板进一步包括引线端子，引线端子延伸至封框胶部远离密封空间的一侧，引线端子构成连接部。如此，可以不需要额外设置导电泡棉，从而简化了显示面板的结构。
示例性的，如图3所示，阵列基板300上通常设置有多个用于控制液晶分子的薄膜晶体管(TFT)，因此，在阵列基板300上与封框胶部500外侧对应的部分，可以预留有多个引线端子，用于实现阵列基板300上诸如薄膜晶体管等电学元件与外电路(例如柔性电路板以及控制IC等等)的连接。因此，可以利用阵列基板300的上述固有结构(引线端子)，实现黑矩阵200的接地。例如图3所示，采用引线端子构成连接部420，并且引线端子延伸至封框胶部500远离密封空间的一侧。同时，黑矩阵200也延伸至封框胶部500远离密封空间的一侧。在黑矩阵200与需要连接的引线端子相对应的位置上，涂覆导电胶，既可以在对置基板100和阵列基板300对盒之后，实现黑矩阵200与引线端子之间的电连接。此时，仅需要利用引线端子，连接外接的接地电路，既可以实现该电磁屏蔽结构400对外电路的屏蔽。例如，根据本公开的实施例中，可以在对置基板100和阵列基板300对盒之前，涂覆封框胶的同时或是涂覆封框胶之后，在对置基板100的位于封框胶部500的外侧(封框胶部500的远离密闭空间的一侧)的黑矩阵200上滴导电胶。由此，可以在对盒的同时，利用导电胶将黑矩阵200和引线端子进行连接，再由引线端子连接外电路并接地，形成电磁屏蔽结构。由此，可以不用额外设置导电泡棉，从而简化了显示面板的结构。
本公开至少一个实施例提供一种显示装置，该显示装置包括前面任一实施例中的显示面板。由此，可以降低该显示装置的生产成本，简化生产流程。
例如，在本公开至少一个实施例提供的显示装置中，图4显示了根据本公开一个实施例的显示装置的结构示意图。例如图4所示，该显示装置1000包括显示面板1100。其中，该显示面板1100可以为前面任一实施例中的显示面板，因此，该显示装置1000具有前面描述的显示面板所具有的全部特征以及优点，在此不再赘述。总的来说，该显示装置具有以下优点的至少之一：成本低廉，不涉及昂贵的原料；制备工艺简单，利用现有的生产线即可实现生产，不涉及额外的加工程序；不影响显示装置的显示功能，能够在不提高该显示装置的功耗的前提下，实现对外电场的屏蔽。
例如，在本公开至少一个实施例提供的显示装置中，图5显示了根据本 公开另一个实施例的显示装置的结构示意图。例如图5所示，该显示装置1000可以进一步包括：金属边框600，金属边框600例如可以环绕显示面板设置，连接部420与金属边框600相连。由此，可以简便地利用该金属边框，实现该黑矩阵200的接地，从而对外电场起到屏蔽作用。需要说明的是，金属边框600也可以通过其他的导电边框代替，本公开的实施例对此不做限制。
例如，该显示装置可以为电视、数码相机、手机、手表、平板电脑、笔记本电脑、导航仪等任何具有显示功能的产品或者部件。
本公开至少一个实施例提供一种显示面板的制备方法，该方法包括：提供对盒设置的阵列基板和对置基板；在对置基板的一侧形成导电的黑矩阵；其中，黑矩阵形成为与外部电路电连接。在上述制备方法中，获得的显示面板依靠具有一定导电能力的黑矩阵实现电磁屏蔽，可以降低生产成本，简化生产流程。
例如，本公开至少一个实施例提供的显示面板的制备方法还包括：形成电磁屏蔽结构，包括黑矩阵、粘结部以及连接部；其中，粘结部形成为连接黑矩阵以及连接部，连接部形成为连接外部电路。电磁屏障结构可以将黑矩阵与外部电路电连接，以实现黑矩阵的电磁屏蔽功能。
例如，本公开至少一个实施例提供的显示面板的制备方法还包括：在阵列基板和对置基板形成封框胶部；其中，封框胶部与对置基板和阵列基板形成密封空间。利用封装胶部对阵列基板和对置基板进行对盒设置，并对显示面板的内部结构进行保护。
例如，在本公开至少一个实施例提供的显示面板的制备方法中，形成电磁屏蔽结构包括：黑矩阵形成为延伸至封框胶部远离密封空间的一侧；在封框胶的远离封空间的一侧形成粘结部，粘结部与黑矩阵连接；在连接部的远离封框胶部的一侧形成连接部。如此，可以在不影响对置基板和阵列基板对盒设置的前提下，将黑矩阵和外部电路电连接。
需要说明的是，利用上述制备方法获得的显示面板的具体化结构，可以参考前述实施例(关于显示面板的实施例)中的相关内容，本公开的实施例在此不做赘述。此外，对于前述实施例中的多种不同结构的显示面板，显示面板的制备方法也可以进行相应调整，本公开的实施例在此不做赘述。
图6A～图6D为本公开一个实施例提供的显示面板的制备方法的过程图。下面，在本公开至少一个实施例中，如图6A～图6D所示，以制备如图2所示的显示面板的为例，对显示面板的制备方法的过程进行说明。
如图6A所示，提供对置基板100，在对置基板100的一侧形成黑矩阵200。
如图6B所示，提供阵列基板300，并且在阵列基板上形成封装胶部500。
需要说明的是，封装胶部500不限于形成在阵列基板300上，也可以形成在对置基板100上，本公开的实施例在此不做赘述。
如图6C所示，将对置基板100和阵列基板300对盒设置，封装胶部500位于对置基板100和阵列基板300之间以固定对置基板100和阵列基板300。
需要说明的是，在本公开的实施例中，对黑矩阵200的具体位置不做限制。黑矩阵200形成在对置基板100的面向阵列基板300的一侧，或者黑矩阵200可以形成在对置基板100的远离阵列基板300的一侧。下面，以如图6C所示的黑矩阵200形成在对置基板100的面向阵列基板300的一侧为例，对本公开下述实施例中的技术方案进行说明。
例如，黑矩阵200形成为延伸至封框胶部500远离密封空间的一侧。
如图6D所示，在封框胶部500的远离密封空间的一侧形成粘结部410。粘结部410与和黑矩阵200电连接。
如图2所示，在粘结部410的远离封框胶部500的一侧形成连接部420，连接部420可以与外部电路连接，如此，使得黑矩阵200可以与外部电路电连接。
需要说明的是，在本公开的实施例中，在将对置基板100和阵列基板300对盒之前，可以在例如阵列基板的位于封框胶部500的外侧形成如图3所示的粘结部410和连接部420的叠层，然后将对置基板100和阵列基板300对盒，连接部420和粘结部410位于黑矩阵200和阵列基板300之间，并且连接部420设置在粘结部410远离黑矩阵200的一侧。
例如，封框胶部配置为导电封框胶，导电封框胶构成粘结部并且导电封框胶的一端与黑矩阵连接，另一端与连接部连接。封框胶部中可以掺杂导电粒子(例如导电银胶等)，封装胶部的一端可以与连接部电连接，如此，在将阵列基板和对置基板的对盒过程中，封框胶部可以直接将黑矩阵与外部电路电连接，简化显示面板的制备工艺。
对于本公开的实施例，还有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的 厚度被放大或缩小，即这些附图并非按照实际的比例绘制。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，本公开的保护范围应以权利要求的保护范围为准。

Claims (19)

  1. 一种显示面板，包括：
    对置基板，所述对置基板的一侧设置有导电的黑矩阵；
    阵列基板，所述阵列基板与所述对置基板对盒设置；
    其中，所述黑矩阵配置为与外部电路电连接。
  2. 根据权利要求1所述的显示面板，其中，所述黑矩阵的电阻率为3000～105Ω·cm。
  3. 根据权利要求1或2所述的显示面板，其中，所述黑矩阵包括钼的氧化物。
  4. 根据权利要求1-3任一项所述的显示面板，其中，
    所述外部电路配置为接地。
  5. 根据权利要求1-4任一项所述的显示面板，进一步包括：
    电磁屏蔽结构，包括所述黑矩阵、粘结部以及连接部；
    其中，所述粘结部电连接所述黑矩阵以及所述连接部，所述连接部用于连接所述外部电路。
  6. 根据权利要求5所述的显示面板，进一步包括：
    封框胶部，所述封框胶部设置在所述对置基板以及所述阵列基板之间，且与所述对置基板和所述阵列基板形成密封空间。
  7. 根据权利要求6所述的显示面板，其中，
    所述黑矩阵延伸至所述封框胶部远离所述密封空间的一侧，所述粘结部以及所述连接部设置在所述封框胶部远离所述密封空间的一侧。
  8. 根据权利要求7所述的显示面板，其中，
    所述粘结部与所述黑矩阵的延伸至所述封框胶部且远离所述密封空间一侧的部分相连。
  9. 根据权利要求7或8所述的显示面板，其中，
    所述连接部设置在所述粘结部远离所述封框胶部的一侧。
  10. 根据权利要求7或8所述的显示面板，其中，
    所述连接部和所述粘结部位于所述黑矩阵和所述阵列基板之间，并且所述连接部设置在所述粘结部远离所述黑矩阵的一侧。
  11. 根据权利要求6所述的显示面板，其中，
    所述封框胶部配置为导电封框胶，所述导电封框胶构成所述粘结部并且 所述导电封框胶的一端与所述黑矩阵连接，另一端与所述连接部连接。
  12. 根据权利要求6-11任一项所述的显示面板，其中，
    所述阵列基板进一步包括引线端子，所述引线端子延伸至所述封框胶部远离所述密封空间的一侧，所述引线端子构成所述连接部。
  13. 根据权利要求5-9任一项所述的显示面板，其中，
    所述粘结部包括导电胶，所述连接部包括导电泡棉。
  14. 一种显示装置，包括权利要求1-13任一项所述的显示面板。
  15. 根据权利要求14所述的显示装置，进一步包括：
    导电边框，所述导电边框环绕所述显示面板设置，所述黑矩阵配置为与所述导电边框电连接。
  16. 一种显示面板的制备方法，包括：
    提供对盒设置的阵列基板和对置基板；
    在所述对置基板的一侧形成导电的黑矩阵；
    其中，所述黑矩阵形成为与外部电路电连接。
  17. 根据权利要求16所述的制备方法，还包括：
    形成电磁屏蔽结构，包括所述黑矩阵、粘结部以及连接部；
    其中，所述粘结部形成为连接所述黑矩阵以及所述连接部，所述连接部形成为连接所述外部电路。
  18. 根据权利要求17所述的制备方法，还包括：
    在所述阵列基板和所述对置基板形成封框胶部；
    其中，所述封框胶部与所述对置基板和所述阵列基板形成密封空间。
  19. 根据权利要求18所述的制备方法，其中，形成所述电磁屏蔽结构包括：
    所述黑矩阵形成为延伸至所述封框胶部远离所述密封空间的一侧；
    在所述封框胶的远离所述封空间的一侧形成所述粘结部，所述粘结部与所述黑矩阵连接；以及
    在所述连接部的远离所述封框胶部的一侧形成所述连接部。
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