TWI730211B - Processing device - Google Patents
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- TWI730211B TWI730211B TW107100041A TW107100041A TWI730211B TW I730211 B TWI730211 B TW I730211B TW 107100041 A TW107100041 A TW 107100041A TW 107100041 A TW107100041 A TW 107100041A TW I730211 B TWI730211 B TW I730211B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
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- Dicing (AREA)
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Mechanical Engineering (AREA)
Abstract
使操作員能夠容易且確實地確認操作條件之設定 Enables the operator to easily and reliably confirm the setting of operating conditions
一種加工裝置,是以全自動動作方式依照一連串的處理順序,在實施各種處理的各構成要素中對被加工物進行加工,並形成下述構成:具備有在各構成要素中實施各種處理之加工組件、接收各構成要素的操作條件之操作面板、將對應於操作條件的處理動作形成畫面圖像來儲存之畫面圖像儲存部,並在全自動動作前將各處理動作的畫面圖像依照全自動動作之一連串的處理順序顯示於操作面板上。 A processing device that processes an object to be processed in various components in a fully automatic operation in accordance with a series of processing procedures, and forms the following structure: It is equipped with processing that performs various processing in each component. Components, the operation panel that receives the operating conditions of each constituent element, the screen image storage section that stores the processing actions corresponding to the operating conditions into a screen image, and the screen image of each processing action is in accordance with the full A series of processing sequence of the automatic action is displayed on the operation panel.
Description
本發明是有關一種對被加工物進行加工之加工裝置。 The present invention relates to a processing device for processing objects to be processed.
關於IC、LSI等形成有複數個裝置的晶圓,是經過由磨削裝置及研磨裝置進行的薄化、由雷射加工裝置及切割裝置進行的單片化、由洗淨裝置進行的洗淨等各種製程而形成一個個的元件(參照例如專利文獻1)。例如,於磨削研磨裝置上,會以全自動動作方式實施晶圓位置的檢測、粗精磨削、研磨、洗淨等各種製程,且按各個製程而設定有對被加工物最佳的操作條件。這些操作條件,是在裝置側面的操作面板所顯示的元件資料等設定畫面上個別地被設定。 Regarding ICs, LSIs, and other wafers formed with multiple devices, they are thinned by a grinding device and a polishing device, singulated by a laser processing device and a dicing device, and cleaned by a cleaning device. Various processes are performed to form individual elements (see, for example, Patent Document 1). For example, in a grinding and polishing device, various processes such as wafer position detection, rough and fine grinding, grinding, and cleaning are implemented in a fully automatic manner, and the optimal operation for the workpiece is set for each process. condition. These operating conditions are individually set on the setting screen such as component data displayed on the operation panel on the side of the device.
專利文獻1:日本專利特開平8-107095號公報 Patent Document 1: Japanese Patent Laid-Open No. 8-107095
然而,在全自動動作中,因為製程有涵蓋諸多方面,所以如果按每個製程來詳細地設定操作條件的話,會有下述問題:元件資料的設定畫面的設定項目增加,操作員在確認全部設定時需要非常多的時間。又,若因為操作員確認疏失而導致元件資料出現設定錯誤時,會在全自動動作的起動後才發現元件資料的設定錯誤。因此,需要花時間在中止全自動動作並讓被加工物回到原來的位置等的回復作業上,導致生產在中途被迫停止而不符經濟效益。 However, in a fully automatic operation, because the process covers many aspects, if the operating conditions are set in detail for each process, there will be the following problems: The setting items of the component data setting screen increase, and the operator is confirming all It takes a lot of time to set up. In addition, if the component data is set incorrectly due to the operator's misconfirmation, the component data setting error will be discovered after the automatic operation is started. Therefore, it is necessary to spend time on restoring operations such as suspending the fully automatic operation and returning the processed object to its original position, which results in the production being forced to stop in the middle, which is not economical.
本發明是有鑒於所述問題點而作成的發明,其目的之一為提供一種能夠讓操作員容易且確實地確認操作條件之設定的加工裝置。 The present invention is an invention made in view of the above-mentioned problems, and one of its objects is to provide a processing device that allows an operator to easily and surely confirm the setting of operating conditions.
本發明之一態樣的加工裝置,是以全自動動作方式依照一連串的處理順序在各構成要素中對被加工物進行加工,且至少具備保持被加工物之工作夾台、對已保持在該工作夾台上的被加工物進行加工之加工組件、收容複數個被加工物之片匣、載置該片匣之片匣載置台、將被加工物朝載置於該片匣載置台的該片匣、及該工作夾台搬入、搬出的搬送組件、控制各構成要素之控制組件、及對各構成要素的操作條件進行輸入設定之操作面板,該加工裝置的特徵在於:該控制組件具備畫面圖像儲存部,該畫面圖像儲存部是將在各構成要素中對應於可以設定的複數個操作條件之處理動作各自形成畫面圖像來儲存,在該操作面板上,是將因應於所設定的該操作條件而相符的該畫 面圖像依照全自動動作之一連串的處理順序顯示,而能夠在全自動動作前確認該各構成要素之該操作條件的設定是否正確。 The processing device of one aspect of the present invention is a fully automatic operation method to process the workpiece in each component in a series of processing sequences, and at least has a work clamp table for holding the workpiece, and the workpiece is held in the The processing assembly for processing the processed object on the work clamp table, the cassette containing multiple processed objects, the cassette mounting table where the cassette is placed, and the processed object facing the cassette mounted on the cassette mounting table. The film cassette, and the conveying components that are carried in and out of the work clamp table, the control components that control each component, and the operation panel for inputting and setting the operating conditions of each component, the processing device is characterized in that: the control component has a screen Image storage unit, the screen image storage unit is to form a screen image and store each processing action corresponding to a plurality of operating conditions that can be set in each component element. On the operation panel, it will respond to the setting The painting that matches the operating conditions The surface image is displayed according to a series of processing sequence of a fully automatic operation, and it is possible to confirm whether the setting of the operating conditions of each component element is correct or not before the fully automatic operation.
根據此構成,可根據在操作面板上所設定輸入之各構成要素的操作條件,讀取在畫面圖像儲存部所儲存之處理動作的畫面圖像。由於依照全自動動作的一連串的處理順序將畫面圖像形成預覽來顯示,因此能夠讓操作員藉由預覽而在全自動動作前容易且確實地確認在各構成要素之操作條件的設定上有無錯誤。 According to this configuration, the screen image of the processing operation stored in the screen image storage unit can be read based on the operating conditions of each component element set and input on the operation panel. Since the screen image is displayed as a preview according to a series of processing procedures of fully automatic operation, the operator can easily and surely confirm whether there are any errors in the setting of the operating conditions of each component through the preview before fully automatic operation. .
根據本發明,由於可因應於操作面板之設定輸入,依全自動動作之處理順序將畫面圖像形成預覽來顯示,因此能夠讓操作員容易且確實地確認操作條件的設定。 According to the present invention, since the screen image can be previewed and displayed in accordance with the processing sequence of the fully automatic operation in response to the setting input of the operation panel, the operator can easily and surely confirm the setting of the operating conditions.
1:加工裝置 1: Processing device
11:基台 11: Abutment
12:前面 12: front
13、14:片匣載台(片匣載置台) 13, 14: Cassette mounting table (cassette mounting table)
17:開口部 17: Opening
18:防水蓋 18: Waterproof cover
21:多關節型機器人(搬送組件) 21: Multi-joint robot (transport unit)
22:機器手臂 22: Robotic arm
23:手部 23: hands
24、62、68:移動機構 24, 62, 68: mobile mechanism
25:定位機構(構成要素) 25: Positioning mechanism (components)
26:定位工作台 26: Positioning workbench
27、73:載置銷(加工組件) 27, 73: Mounting pins (processing components)
28:光學感測器 28: Optical sensor
31:工作夾台 31: work clamp
32:保持面 32: keep noodles
41:切割機構(構成要素) 41: Cutting mechanism (components)
42:刀片單元 42: Blade unit
43:柱部 43: Column
44:刀片單元移動機構 44: Blade unit moving mechanism
45:Y軸工作台 45: Y-axis table
46:Z軸工作台 46: Z-axis table
47:主軸 47: Spindle
48:切割刀(加工組件) 48: Cutting knife (processing component)
51:攝像機構 51: Camera mechanism
52:高度感測器 52: height sensor
55:工作夾台洗淨機構(構成要素) 55: Cleaning mechanism of work clamp table (components)
56:洗淨噴嘴(加工組件) 56: Cleaning nozzle (processing component)
57:乾燥噴嘴(加工組件) 57: Drying nozzle (processing component)
58:雙流體噴嘴(加工組件) 58: Two-fluid nozzle (processing component)
61、64、67:搬送組件 61, 64, 67: conveying components
70:旋轉工作台 70: Rotating table
71:背面洗淨機構(構成要素) 71: Backside cleaning mechanism (components)
72:正面洗淨機構(構成要素) 72: Front washing mechanism (components)
74:旋轉刷 74: Rotating brush
75:控制組件 75: control components
76:顯示控制部 76: Display control section
77:畫面圖像儲存部 77: Screen image storage section
78:夾具部 78: Fixture Department
79:操作面板 79: Operation panel
80:圖解畫面 80: Graphical screen
81:符號圖像 81: Symbolic image
82:被加工物圖像 82: Image of processed object
83:搬入用片匣圖像 83: Image of cassette for moving in
84:搬出用片匣圖像 84: Image of cassette for moving out
85:多關節型機器人圖像 85: Multi-joint robot image
86:定位工作台圖像 86: Positioning workbench image
87:搬送組件圖像 87: Conveying component image
88:工作夾台圖像 88: Image of work clamp
90:設定畫面 90: Setting screen
91:核取方塊 91: check box
92:輸入方塊 92: input box
A1:搬入區 A1: Move in area
A2:加工區 A2: Processing area
A3:洗淨區 A3: Washing area
C1:搬入用片匣(片匣) C1: Film cassette for loading (film cassette)
C2:搬出用片匣(片匣) C2: Cassette for moving out (cassette)
IM、IM11、IM12、IM21、IM22、IM23、IM24、IM25、IM31、IM32:畫面圖像 IM, IM11, IM12, IM21, IM22, IM23, IM24, IM25, IM31, IM32: screen image
N:凹口 N: Notch
W:被加工物 W: to be processed
X、Y、Z:方向 X, Y, Z: direction
圖1是本實施形態之加工裝置的上表面示意圖。 Fig. 1 is a schematic view of the upper surface of the processing device of this embodiment.
圖2是顯示操作面板的畫面顯示之一例的圖。 Fig. 2 is a diagram showing an example of a screen display of an operation panel.
圖3是顯示本實施形態之預覽圖像的顯示功能之功能方塊圖。 Fig. 3 is a functional block diagram showing the display function of the preview image of this embodiment.
圖4是顯示本實施形態之定位處理的畫面圖像的顯示例之圖。 Fig. 4 is a diagram showing a display example of a screen image of the positioning process of the present embodiment.
圖5是顯示本實施形態之修整處理的畫面圖像的顯示例之圖。 Fig. 5 is a diagram showing a display example of a screen image of the trimming process of the present embodiment.
圖6是顯示本實施形態之工作夾台洗淨處理的顯示例 之圖。 Figure 6 is a display example showing the cleaning process of the work clamp table of this embodiment 之图.
圖7是顯示本實施形態的設定畫面的一例之圖。 Fig. 7 is a diagram showing an example of a setting screen of the present embodiment.
以下,參照附圖,針對本實施形態之具備預覽圖像的顯示功能之加工裝置進行說明。圖1是本實施形態之加工裝置的上表面示意圖。圖2是顯示操作面板的畫面顯示之一例的圖。再者,在以下的說明中,雖然是針對將預覽圖像的顯示功能適用於對晶圓的外周部進行修整加工的加工裝置之構成來進行說明,但本發明並不限定於此構成。又,預覽圖像的顯示功能亦可用於其他的加工裝置。 Hereinafter, with reference to the drawings, a processing device with a preview image display function of this embodiment will be described. Fig. 1 is a schematic view of the upper surface of the processing device of this embodiment. Fig. 2 is a diagram showing an example of a screen display of an operation panel. In addition, in the following description, although the display function of the preview image is applied to the structure of the processing apparatus for trimming the outer peripheral portion of the wafer, the present invention is not limited to this structure. In addition, the preview image display function can also be used in other processing devices.
如圖1所示,加工裝置1是全自動型的加工裝置,且構成為以全自動方式實施由對圓板狀之被加工物W的搬入處理、切割處理、洗淨處理、搬出處理所構成之一連串的作業。在被加工物W之外周邊緣,形成有用於防止製造步驟中的破裂或灰塵產生的倒角部(圖未示)。又,在被加工物W的外周部形成有顯示結晶方位之凹口N。再者,被加工物W亦可為在半導體基板上形成有半導體元件的半導體晶圓,亦可為在藍寶石基板上形成有光元件的光元件晶圓。
As shown in Fig. 1, the
在加工裝置1中,是於裝置前方設定有搬入區A1,於裝置後方設定有加工區A2,且與搬入區A1及加工區A2相鄰而設定有洗淨區A3。又,於加工裝置1的前面12中,以由搬入區A1朝前方突出的方式,設有一對片匣載
台(片匣載置台)13、14。於片匣載台13上載置有已收容有加工前的被加工物W之搬入用片匣C1。於片匣載台14上載置有收容加工後的被加工物W之搬出用片匣C2。片匣載台13是作為加工裝置1之搬入口而發揮功能,片匣載台14是作為加工裝置1之搬出口而發揮功能。
In the
於搬入區A1設有相對於搬入用片匣C1及搬出用片匣C2將被加工物W搬出搬入之多關節型機器人(搬送組件)21。多關節型機器人21是在線性馬達式之移動機構24的滑動頭上安裝機器手臂22,並且在機器手臂22的前端裝設手部23而構成。多關節型機器人21是藉由移動機構24而在X軸方向上移動,並且以伺服馬達等控制機器手臂22的各關節之旋轉,藉此可相對於搬入用片匣C1及搬出用片匣C2而將手部23調整成所期望的位置或姿勢。
In the carry-in area A1, an articulated robot (transport unit) 21 for carrying in and out of the workpiece W with respect to the carrying-in cassette C1 and the carrying-out cassette C2 is provided. The articulated
在加工區A2中,設有定位機構25及切割機構(加工組件)41,該定位機構25是在定位工作台26上以定位狀態暫置加工前的被加工物W,該切割機構41是在工作夾台31上切割被加工物W正面的外周部。在定位機構25中,是藉由於定位工作台26上突設有複數個載置銷27,並且從下方將晶圓W的外周部支撐於複數個載置銷27上,而可在從工作台浮起的狀態下將晶圓W定位。又,在定位工作台26的附近設有用於檢測凹口N之光學感測器28(參照圖4A)。在定位工作台26的後方,設有可在被加工物W的搬入位置與切割位置之間朝X軸方向來回移動的工作夾台31。在基台11上,形成有沿著此工作夾台31的移動軌跡而
朝X軸方向延伸之開口部17。
In the processing area A2, a
開口部17是被蛇腹狀的防水蓋18所覆蓋,並且在防水蓋18的下方設有使工作夾台31朝X軸方向來回移動的進給螺桿式的工作夾台移動機構(圖未示)。在工作夾台31的表面,是藉由多孔質材而形成有吸附被加工物W的保持面32。保持面32是通過工作夾台31內的流路而與吸引源(圖未示)連接,且藉由於保持面32上產生的負壓而吸引保持被加工物W。又,工作夾台31是構成為藉由旋轉機構(圖未示)而可繞著Z軸旋轉。
The
切割機構41是構成為交替地使用一對刀片單元42,以切割工作夾台31上的被加工物W之外周部。切割機構41具有以橫跨開口部17的方式豎立設置於基台11上的門型的柱部43。在柱部43的表面,設有使一對刀片單元42移動之進給螺桿式的刀片單元移動機構44。刀片單元移動機構44具有在Y軸方向上移動的一對Y軸工作台45、及相對於各Y軸工作台45而在Z軸方向上移動的Z軸工作台46。刀片單元42是藉由Y軸工作台45及Z軸工作台46而可在Y軸方向及Z軸方向上移動。
The
刀片單元42是在主軸47的前端裝設圓板狀的切割刀48而構成。藉由在以高速旋轉的切割刀48切入工作夾台31上的被加工物W之倒角部的狀態下,使工作夾台31旋轉,可將被加工物W之倒角部涵蓋全周來進行修整加工。藉由從被加工物W的外周部去除正面側的倒角部,即使在後段的磨削步驟中將被加工物W從背面側磨削到成品
厚度也不會有殘留倒角部之情形,且不會有被加工物W之外周部形成為刀緣狀之情形。
The
又,在刀片單元42中設有校準用之攝像機構51(參照圖5A)。攝像機構51的攝像圖像是在切割刀48與被加工物W的校準處理上利用。又,刀片單元42的附近設有以非接觸方式測定被加工物W的上表面高度之高度感測器52(參照圖5B)。作為高度感測器52可使用例如NSD(非接觸式表面探測器,Non Contact Surface Detector),以檢測從噴嘴排出氣體時的背壓值,並檢測被加工物W的上表面位置。藉由使用高度感測器52,能夠精度良好地調整被加工物W的切入量。
In addition, an
又,在基台11上,相鄰於切割機構41而設有將被加工物W的搬送後之工作夾台31洗淨的工作夾台洗淨機構55。在工作夾台洗淨機構55中,設置有於基台11的上方朝Y軸方向平行地延伸之洗淨噴嘴56與乾燥噴嘴57。可藉由來自洗淨噴嘴56的洗淨水形成水幕,且藉由來自乾燥噴嘴57的氣體形成氣簾。藉由讓工作夾台31鑽過水幕及氣簾,可將工作夾台31的保持面32洗淨及乾燥。此外,在工作夾台洗淨機構55中,設有洗淨保持面32的外緣附近之雙流體噴嘴58(參照圖6B)。
In addition, on the
在加工區A2中,是藉由夾邊(edge clamp)式的搬送組件61將被加工物W搬入至工作夾台31上,並且藉由夾邊式的搬送組件64將被加工物W從工作夾台31搬出。這種情形下,藉由搬送組件61從定位工作台26拾取加
工前的被加工物W,並藉由線性馬達式的移動機構62將被加工物W搬送至工作夾台31。又,藉由搬送組件64從工作夾台31拾取加工後的被加工物W,並藉由以搬送組件64之基端部為中心的旋轉移動來將被加工物W搬送至洗淨區A3。
In the processing area A2, the workpiece W is transported to the work clamp table 31 by the edge clamp
在洗淨區A3設有洗淨被加工物W之背面的背面洗淨機構71、以及洗淨被加工物W之正面的正面洗淨機構72。在背面洗淨機構71中,是在已將晶圓W的外周部支撐於複數個載置銷73上的狀態下,朝被加工物W的背面噴射洗淨水並藉由旋轉刷74來進行背面洗淨。背面洗淨後的被加工物W,是藉由夾邊式的搬送組件67而從背面洗淨機構71被拾取,並且藉由線性馬達式的移動機構68搬送至正面洗淨機構72。在正面洗淨機構72中,是在以旋轉工作台70的複數個夾具部78保持晶圓W的外周部的狀態下,朝被加工物W噴射洗淨水來進行正面洗淨後,噴附乾燥空氣來進行乾燥。
The washing area A3 is provided with a
又,在加工裝置1中,設有對實施定位處理、修整處理、正面洗淨處理、背面洗淨處理等的各構成要素進行統合控制的控制組件75。控制組件75是藉由使加工裝置1動作的處理器或記憶體等所構成。記憶體是因應用途而由ROM(唯讀記憶體(Read Only Memory))、RAM(隨機存取記憶體(Random Access Memory))等的一個或複數個儲存媒體所構成。又,在加工裝置1的裝置側面,設有對各構成要素的操作條件進行輸入設定之操作面板
79。在加工裝置1中,是根據操作條件而以全自動動作方式依照一連串的處理順序在各構成要素中對被加工物W進行加工。
In addition, the
如圖2A所示,在操作面板79(參照圖1)中顯示有用於監控被加工物W的處理狀況的圖解畫面80。在圖解畫面80中,顯示有可表示一連串的處理的各構成要素之符號圖像81,能夠藉由於這些符號圖像81上移動被加工物圖像82來確認對被加工物W的處理狀況。然而,在圖解畫面80中,雖然能夠確認對被加工物W的一連串的處理狀況,卻無法確認是否有實施正確的處理。例如,雖然可以在磨削加工中指定校準等選項,但卻無法確認到實際上是否有實施校準。
As shown in FIG. 2A, an
因此在通常情況下,是如圖2B所示地在操作面板79(參照圖1)所顯示的每項處理的元件資料等的設定畫面90中,於全自動動作開始前確認是否為附加校準等選項的處理。具體來說,在設定畫面90中,顯示有接受操作條件的輸入之各種輸入方塊或核取方塊等,而可確認這些輸入方塊的參數或核取方塊的核取(check)。然而,在全自動型的加工裝置1中會因設定畫面90變多而成為操作員的負擔。又,若操作員看漏設定畫面90的設定錯誤的話,就必須在全自動動作的開始後中止動作並進行回復作業。
Therefore, under normal circumstances, as shown in FIG. 2B, in the
於是,在本實施形態的加工裝置1中,是形成為根據輸入至設定畫面90的操作條件,在全自動動作的開始前依照對被加工物W的處理順序將各處理的畫面圖像
形成預覽來顯示於操作面板79。由於在全自動動作前將實際的處理動作形成預覽來顯示,所以操作員不需要確認大量的設定畫面90的設定項目,而能夠直接地讓操作員掌握實際的處理動作。據此,能夠讓操作員容易且確實地確認在設定畫面90所設定的操作條件是否有誤。
Therefore, in the
以下參照圖3至圖7,針對預覽圖像的顯示處理加以說明。圖3是顯示本實施形態之預覽圖像的顯示功能之功能方塊圖。圖4是顯示本實施形態之定位處理的畫面圖像的顯示例之圖。圖5是顯示本實施形態之修整處理的畫面圖像的顯示例之圖。圖6是顯示本實施形態之工作夾台洗淨處理的顯示例之圖。圖7是顯示本實施形態的設定畫面的一例之圖。 Hereinafter, the display processing of the preview image will be described with reference to FIGS. 3 to 7. Fig. 3 is a functional block diagram showing the display function of the preview image of this embodiment. Fig. 4 is a diagram showing a display example of a screen image of the positioning process of the present embodiment. Fig. 5 is a diagram showing a display example of a screen image of the trimming process of the present embodiment. Fig. 6 is a diagram showing a display example of the cleaning process of the work clamp table of the present embodiment. Fig. 7 is a diagram showing an example of a setting screen of the present embodiment.
如圖3所示,在操作面板79上連接有控制組件75,且可由在操作面板79所顯示的元件資料等的設定畫面90將操作條件輸入至控制組件75。又,藉由控制組件75可將根據操作條件之各構成要素的處理動作之畫面圖像和圖解畫面80一起形成預覽而顯示在操作面板79上。在控制組件75中設有顯示控制部76及畫面圖像儲存部77,該顯示控制部76是對操作面板79的設定畫面90以及圖解畫面80等進行顯示控制,該畫面圖像儲存部77是將對應於可設定於各構成要素的複數個操作條件之處理動作各自形成畫面圖像IM來儲存。
As shown in FIG. 3, a
在畫面圖像儲存部77中,是按每個構成要素的處理,而將操作條件與畫面圖像建立關連來儲存。例如,
在定位處理中,作為操作條件可用選項方式設定有無凹口檢測等,並按每個選項來儲存定位處理的畫面圖像IM11、IM12(參照圖4)。在修整處理中,作為操作條件可用選項方式設定切割(cut)的有無、校準(alignment)的有無、NSD(上表面高度測定)的有無、空氣切割的有無等,並按每個選項來儲存修整處理的畫面圖像IM21~IM25(參照圖5)。
In the screen
再者,所謂空氣切割,是指在讓切割刀48接近於被加工物W時,在被加工物W的近前將切割刀48的接近速度減速而進行空切(參照圖5C)。藉此,不會有切割刀48對被加工物W強力衝撞的情況,而可防止被加工物W與切割刀48的破損。在工作夾台洗淨處理中,可以設定水幕的有無、氣簾的有無、雙流體洗淨的有無等,並按每個選項來儲存工作夾台洗淨處理的畫面圖像IM31、IM32(參照圖6)。又,在畫面圖像儲存部77中除了上述選項以外,亦可儲存有對應於切割刀48的自動設定等其他的選項之畫面圖像IM。
In addition, the so-called air cutting means that when the
顯示控制部76於輸入來自操作面板79的操作條件時,會從包含於操作條件的各種資訊中選擇相符處理的選項,並由畫面圖像儲存部77讀取對應於此選項之畫面圖像IM。並且,顯示控制部76會在操作面板79顯示圖解畫面80,並且依照圖解畫面80上的全自動動作的一連串的處理順序將畫面圖像形成預覽來顯示。藉此,變得可在加工裝置1的全自動動作前,讓操作員確認實施各種處理
的各構成要素之操作條件的設定正確與否。
When the
再者,在畫面圖像儲存部77中,亦可儲存有由操作條件所推定的錯誤處理的畫面圖像。例如,作為定位處理的操作條件,而對無凹口的被加工物設定了凹口檢測的選項的情況下,會將錯誤處理的畫面圖像形成預覽來顯示。又,作為修整處理的操作條件,而將要以切割刀48(參照圖5A)切入的數值設定為被加工物W的厚度以上的情況下,會將錯誤處理的畫面圖像形成預覽來顯示。畫面圖像可在操作面板79上以動畫圖像來進行顯示,亦可在操作面板79上以拍攝實際的動作之攝像圖像來顯示。
In addition, the screen
又,操作條件並不限於藉由操作員所輸入的條件,亦可為裝置內的感測器等所檢測的條件。例如,亦可在片匣載台設置檢測片匣的有無的感測器,並將此感測器的檢測結果作為操作條件輸入到控制組件75。在片匣載台未檢測到片匣的情況下,是視為在加工裝置1中並未實施對被加工物W的各種處理,並在全部的處理中將錯誤處理的畫面圖像形成預覽來顯示。如此在操作條件中,除了藉由操作員所設定的操作條件以外,亦可包含裝置本身自動地設定的操作條件。
In addition, the operating condition is not limited to the condition input by the operator, and may be a condition detected by a sensor in the device or the like. For example, a sensor for detecting the presence or absence of a cassette may be provided on the cassette stage, and the detection result of this sensor may be input to the
如圖4A所示,在操作面板79(參照圖3)的圖解畫面80中,顯示有表示實施各種處理之構成要素的符號圖像。例如,在圖4中作為符號圖像而顯示的是:搬入用片匣圖像83、搬出用片匣圖像84、多關節型機器人圖像85、定位工作台圖像86、搬送組件圖像87、工作夾台圖像
88。又,在圖解畫面80中,是顯示成被加工物圖像82於這些構成要素的符號圖像上移動。並且,配合被加工物圖像82的移動,而可依照一連串的處理順序顯示各構成要素的處理動作之畫面圖像。
As shown in FIG. 4A, on the
如圖4A所示,當被加工物圖像82移動至定位工作台圖像86時,會將定位處理的畫面圖像與定位工作台圖像86建立關連來顯示。例如,在有凹口檢測的設定中,可由畫面圖像儲存部77(參照圖3)讀取出包含定位工作台26及光學感測器28之畫面圖像IM11,而顯示其為有對被加工物W之凹口檢測的定位處理。又,如圖4B所示,在無凹口檢測的設定中,可由畫面圖像儲存部77讀取出包含定位工作台26之畫面圖像IM12,而顯示其為沒有對被加工物W之凹口檢測的定位處理。
As shown in FIG. 4A, when the processed
如圖5A所示,當被加工物圖像82移動至工作夾台圖像88時,會將修整處理的畫面圖像與工作夾台圖像88建立關連來顯示。例如,在有切割且有校準的設定中,可由畫面圖像儲存部77(參照圖3)讀取出包含工作夾台31、切割刀48,攝像機構51之畫面圖像IM21,而顯示其為有對被加工物W的校準之修整處理。如圖5B所示,在有切割且有NSD的設定中,可由畫面圖像儲存部77讀取出包含工作夾台31、切割刀48,高度感測器52之畫面圖像IM22,而顯示其為有對被加工物W的NSD之修整處理。
As shown in FIG. 5A, when the processed
如圖5C所示,在有空氣切割的設定中,可由畫面圖像儲存部77(參照圖3)讀取出包含工作夾台31及切
割刀48之畫面圖像IM23,而顯示其為有對被加工物W的空氣切割之修整處理。如圖5D所示,在無切割且有NSD的設定中,可由畫面圖像儲存部77讀取出包含工作夾台31及高度感測器52之畫面圖像IM24,而顯示其為沒有對被加工物W的修整之NSD處理。如圖5E所示,在無切割且有校準的設定中,可由畫面圖像儲存部77讀取出包含工作夾台31及攝像機構51之畫面圖像IM25,而顯示其為沒有對被加工物W的修整之校準處理。
As shown in FIG. 5C, in the setting with air cutting, the screen image storage unit 77 (refer to FIG. 3) can read out the work clamp table 31 and the cutting table.
The screen image IM23 of the
如圖6A所示,當將被加工物圖像82從工作夾台圖像88搬出時,可顯示工作夾台洗淨處理的畫面圖像。例如,在有水幕及氣簾的設定中,可由畫面圖像儲存部77(參照圖3)讀取出包含工作夾台31、洗淨噴嘴56,乾燥噴嘴57之畫面圖像IM31,並顯示工作夾台洗淨處理。如圖6B所示,在有水幕及氣簾且具有雙流體洗淨之設定中,可由畫面圖像儲存部77讀取出包含工作夾台31、洗淨噴嘴56、乾燥噴嘴57、雙流體噴嘴58之畫面圖像IM32,並顯示其為具有雙流體洗淨之工作夾台洗淨處理。
As shown in FIG. 6A, when the to-
再者,如圖7所示,對設定畫面90的操作條件,亦可為不是對核取方塊91之核取,而是藉由對輸入方塊92的數值輸入來設定。例如,在工作夾台洗淨處理的設定畫面90中,於氣簾通過速度的輸入方塊92中輸入0(mm/s)時,會判斷為無氣簾。又,於氣簾通過速度的輸入方塊92中輸入60[mm/s]時,會判斷為有氣簾。又,在對輸入方塊輸入無效的數值時,亦可顯示錯誤處理。
Furthermore, as shown in FIG. 7, the operating conditions of the
如上述,根據本實施形態之加工裝置1,根據在操作面板79所設定輸入之各構成要素的操作條件,可讀取已儲存在畫面圖像儲存部77的處理動作之畫面圖像。由於依全自動動作的一連串的處理順序將畫面圖像形成預覽來顯示,因此能夠讓操作員藉由預覽而在全自動動作前容易且確實地確認在各構成要素之操作條件的設定上有無錯誤。
As described above, according to the
再者,在本實施型態中,雖然是設成在修整裝置中將全自動動作的一連串的處理形成預覽來顯示之構成,但並不限定於此構成。本發明的對位裝置,可適用於全自動型的加工裝置。例如,只要是全自動型的加工裝置,亦可將切割裝置、磨削裝置、研磨裝置、雷射加工裝置、電漿蝕刻裝置、擴張裝置、制動裝置、及組合這些而成之群集(cluster)裝置等之其他的加工裝置的全自動動作之一連串的處理,形成預覽來顯示。 In addition, in the present embodiment, although a series of fully automatic processes is formed into a preview and displayed in the dressing device, it is not limited to this configuration. The alignment device of the present invention can be applied to a fully automatic processing device. For example, as long as it is a fully automatic processing device, a cutting device, a grinding device, a polishing device, a laser processing device, a plasma etching device, an expansion device, a braking device, and a combination of these can also be combined (cluster) A series of processes of fully automatic operations of other processing devices, such as devices, are displayed as a preview.
又,在本實施形態中,因為如上述地並未將加工裝置限定於修整裝置,因此可使用因應於加工裝置的種類的加工組件。例如,作為加工組件,若為切割裝置則可使用晶圓分割用的切割刀,若為切割裝置則可使用磨削輪,若為研磨裝置則可使用研磨墊。如此,加工組件只要是可對保持在工作夾台上的被加工物進行加工的組件即可。 In addition, in the present embodiment, since the processing device is not limited to the dressing device as described above, it is possible to use a processing unit according to the type of processing device. For example, as the processing component, if it is a dicing device, a dicing blade for wafer separation can be used, if it is a dicing device, a grinding wheel can be used, and if it is a polishing device, a polishing pad can be used. In this way, the processing module may be any module capable of processing the workpiece held on the work clamp table.
又,作為被加工物,亦可因應於加工的種類,而使用例如半導體元件晶圓、光元件晶圓、封裝基板、 半導體基板、無機材料基板、氧化物晶圓、未燒結陶瓷基板、壓電基板等各種工件。作為半導體元件晶圓,亦可使用元件形成後之矽晶圓或化合物半導體晶圓。作為光元件晶圓,亦可使用元件形成後之藍寶石晶圓或碳化矽晶圓。又,作為封裝基板亦可使用CSP(晶片尺寸封裝,Chip Size Package)基板,且亦可使用矽或砷化鎵等作為半導體基板,亦可使用藍寶石、陶瓷、玻璃等作為無機材料基板。此外,亦可使用元件形成後或元件形成前的鉭酸鋰、鈮酸鋰作為氧化物晶圓。 In addition, as the object to be processed, depending on the type of processing, for example, semiconductor element wafers, optical element wafers, packaging substrates, Various workpieces such as semiconductor substrates, inorganic material substrates, oxide wafers, unsintered ceramic substrates, and piezoelectric substrates. As semiconductor device wafers, silicon wafers or compound semiconductor wafers after device formation can also be used. As the optical element wafer, a sapphire wafer or silicon carbide wafer after element formation can also be used. In addition, a CSP (Chip Size Package) substrate can also be used as a package substrate, and silicon or gallium arsenide can also be used as a semiconductor substrate, and sapphire, ceramic, glass, etc. can also be used as an inorganic material substrate. In addition, lithium tantalate or lithium niobate after element formation or before element formation can also be used as an oxide wafer.
又,在本實施形態中,雖然作為搬送組件而以多關節型機器人、夾邊式的搬送組件來例示說明,但並不限定於此構成。搬送組件只要是可將被加工物對工作夾台搬入、搬出的構成即可,亦可為例如推拉式的搬送機器人、真空夾具式的搬送組件。 In addition, in this embodiment, although the articulated robot and the clamp-type conveying unit are exemplified as the conveying unit, it is not limited to this configuration. The conveying unit may be any structure that can carry the workpiece into and out of the work clamp table, and it may be, for example, a push-pull type conveying robot or a vacuum clamp type conveying unit.
又,在本實施形態中,雖然是設成在畫面圖像儲存部中儲存處理動作的畫面圖像之構成,但並不限定於此構成。在畫面圖像儲存部中,亦可儲存有工作夾台或切割刀等各構成零件的畫面圖像。在此情況下,形成為具備圖像生成部,該圖像生成部是因應於操作條件而將由畫面圖像儲存部讀取出之構成零件的畫面圖像組合來生成各處理動作的畫面圖像。又,在畫面圖像儲存部中,以可由外部登錄畫面圖像的方式來構成亦可,例如以外部儲存媒體、或以有線或無線方式將畫面圖像登錄於畫面圖像儲存部亦可。 In addition, in the present embodiment, although it is a configuration in which the screen image of the processing operation is stored in the screen image storage unit, it is not limited to this configuration. In the screen image storage section, screen images of various components such as work clamps or cutting knives can also be stored. In this case, it is formed with an image generation unit that combines the screen images of the component parts read by the screen image storage unit in accordance with the operating conditions to generate screen images for each processing action . In addition, the screen image storage unit may be configured so that the screen image can be externally registered, for example, the screen image may be registered in the screen image storage unit with an external storage medium, or wired or wireless.
又,在本實施形態中,亦可設成具備預覽顯示按鈕,該預覽顯示按鈕是在操作面板上於全自動動作前依照一連串的處理順序顯示全自動動作的處理動作之按鈕。 In addition, in this embodiment, it is also possible to provide a preview display button, which is a button that displays the processing operations of the fully automatic operation in a series of processing sequences before the fully automatic operation on the operation panel.
又,在本實施形態中,工作夾台不限於吸引夾頭式的工作台,亦可為靜電夾頭式的工作台。 In addition, in this embodiment, the work chuck table is not limited to a suction chuck type work table, and may be an electrostatic chuck type work table.
又,雖然說明了本實施形態及變形例,但是作為本發明的其他實施形態,亦可為將上述實施形態及變形例整體或部分地組合而成的形態。 In addition, although the present embodiment and modification examples have been described, as other embodiments of the present invention, the above-mentioned embodiment and modification examples may be combined in whole or in part.
又,本發明之實施形態並不限定於上述之實施形態,且亦可在不脫離本發明之技術思想的主旨的範圍內進行各種變更、置換、變形。此外,若能經由技術之進步或衍生之其他技術而以其他的方式來實現本發明之技術思想的話,亦可使用該方法來實施。因此,申請專利範圍涵蓋了可包含在本發明之技術思想範圍內的所有的實施形態。 In addition, the embodiment of the present invention is not limited to the above-mentioned embodiment, and various changes, substitutions, and modifications may be made within the scope not departing from the technical idea of the present invention. In addition, if the technical idea of the present invention can be realized in other ways through technological progress or other derived technologies, this method can also be used to implement it. Therefore, the scope of patent application covers all embodiments that can be included in the scope of the technical idea of the present invention.
又,在本實施形態中,雖然是針對適用於被加工物的加工裝置之構成來說明本發明,但亦可適用於可因應操作面板的設定輸入,而依照處理順序將畫面圖像形成預覽來顯示之其他的裝置。 In addition, in this embodiment, although the present invention is described with respect to the configuration of a processing device suitable for a workpiece, it can also be applied to a screen image that can be previewed in accordance with the processing sequence according to the setting input of the operation panel. Display other devices.
如以上所說明,本發明具有下述效果:能夠讓操作員容易且確實地確認操作條件之設定,特別是對以全自動方式實施由對被加工物的搬入處理、切割處理、洗 淨處理、搬出處理所構成的一連串的作業之加工裝置而言是有用的。 As explained above, the present invention has the following effects: it is possible for the operator to easily and surely confirm the setting of the operating conditions, especially for carrying in processing, cutting, and washing of the workpiece in a fully automatic manner. It is useful as a processing device for a series of operations consisting of clean processing and unloading processing.
75:控制組件 75: control components
76:顯示控制部 76: Display control section
77:畫面圖像儲存部 77: Screen image storage section
79:操作面板 79: Operation panel
80:圖解畫面 80: Graphical screen
90:設定畫面 90: Setting screen
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