JP2014192461A - Patterning method of substrate and patterning processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a patterning method capable of appropriately forming a processing groove according to a mechanical technique, and a patterning processing device for implementing the patterning method.SOLUTION: A method of patterning a substrate by forming a linear processing groove by removing a part of a membrane layer provided on the substrate while using a scribe tool provided with an edge in its tip includes: a first scribe step of forming a first processing groove at a processing groove formation target position on the substrate while using a first scribe tool capable of forming a processing groove of a processing width narrower than a desired processing width; and a second scribe step of forming a second processing groove, while overlapping the first processing groove, at the processing groove formation target position on the substrate where the first processing groove has been formed, while using a second scribe tool capable of forming a processing groove of the desired processing width.

Description

  The present invention relates to a patterning method and a processing apparatus for removing a part of a thin film layer provided on a substrate such as a chalcopyrite-based thin film solar cell substrate, and a processing apparatus therefor, and in particular, a processing groove is formed by a mechanical technique. It relates to a method and apparatus for forming.

Chalcopyrite thin film solar cells such as CIS (CuInSe ₂ ) and CIGS (Cu (In _1-x Ga _x ) Se ₂ ), for example, sputter a molybdenum (Mo) film serving as a back electrode on a glass substrate such as soda glass. A p-type light absorption layer made of CIS or CIGS, a high-resistance buffer layer made of CdS, an n-type oxide transparent conductive film (TCO) layer made of ITO, etc. It is produced by sequentially forming a film by a film forming method suitable for each.

  However, in the middle of the manufacturing process, in order to ensure insulation between the plurality of solar cells formed on the substrate, a part of the previously formed thin film layer is linearly cut and removed (scribed). Patterning processing for forming a processing groove (processing trace) for insulation (for cell separation) is performed. In the patterning process, the P1 step of patterning the Mo layer formed on the glass substrate, the P2 step of patterning the CIGS light absorption layer formed on the Mo layer after the P1 step, and the P2 step, There is a P3 process for patterning the TCO layer formed on the CIGS light absorption layer.

  Among these, the P1 process is performed by laser light, but the P2 and P3 processes are generally performed mechanically by a groove processing tool also called a patterning tool or a scribe tool. A groove processing tool suitable for the formation of such a processing groove for insulation and a processing apparatus including the same are already known (for example, see Patent Document 1).

JP 2011-142235 A

  When the above patterning is mechanically performed by a groove processing tool, the processing groove should be formed in a desired size and shape in a desired location, and the shape of the processing groove may be uneven depending on the location, It is not preferable that removal of the thin film layer at the side and bottom of the processed groove is insufficient, or film peeling occurs around the processed groove. When such a malfunction occurs, a defective product may occur in the manufactured solar cell.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a patterning method and a patterning apparatus for performing the patterning method that can suitably form a processing groove by a mechanical method.

  In order to solve the above-mentioned problems, the invention of claim 1 is directed to a substrate by scribing to form a linear processing groove by removing a part of a thin film layer provided on a substrate by a scribing tool having a cutting edge at the tip. The first processing groove is formed at the processing groove formation target position of the substrate by using a first scribe tool capable of forming a processing groove having a processing width narrower than a desired processing width. The first scribing step and the second scribing tool capable of forming a processing groove having the desired processing width are used to form the first processing groove at the processing groove forming target position of the substrate on which the first processing groove is formed. And a second scribing step for forming a second processed groove in a superimposed manner on the processed groove.

  A second aspect of the present invention is the substrate patterning method according to the first aspect, wherein, in the first scribing step, a plurality of the first scribing tools are used to form a plurality of the processing groove forming target positions. 1 machining groove is formed, and in the second scribing step, each of the plurality of machining groove formation target positions where the first machining groove is formed respectively by the plurality of second scribing tools. A second machining groove is formed so as to overlap with the first machining groove.

  A third aspect of the present invention is the substrate patterning method according to the first or second aspect, wherein the first scribe tool and the second scribe tool are placed on one scribe head, the first scribe tool. When the scribe head is moved, the respective processing grooves can be formed simultaneously or selectively so that the first scribe tool and the second scribe tool can be formed simultaneously. In the state, the first scribe step at the first processing groove formation target position, and the second scribe step at the second processing groove formation target position in which the first processing groove is formed first. It is characterized by being performed at the same time.

  The invention of claim 4 is a patterning processing apparatus capable of forming a linear processing groove by removing a part of a thin film layer provided on a substrate by scribe processing, and a table for supporting the substrate, First and second scribing tools which have a cutting edge at the tip and can form a processing groove at a processing groove forming target position of the substrate by moving the cutting edge while contacting the substrate supported by the table. The first scribe tool can form a first processing groove having a processing width smaller than a desired processing width, and the second scribe tool can form a second processing groove having the desired processing width. The second machining groove is formed on the machining groove formation target position where the first machining groove is formed by the first scribe tool so as to overlap the first machining groove. To, characterized in that.

  The invention of claim 5 is the patterning processing apparatus according to claim 4, further comprising a scribe head movable in a first direction, wherein the first scribe tool and the second scribe tool are provided. The scribe heads are arranged in a second direction orthogonal to the first direction.

  The invention of claim 6 is the patterning processing apparatus according to claim 5, wherein the one scribe head includes a plurality of the first scribe tools and a plurality of the second scribe tools at an equal pitch, Each of the first machining grooves by the plurality of second scribe tools at the plurality of machining groove formation target positions where the first machining grooves are respectively formed by the plurality of first scribe tools. The second machining groove is formed in a superimposed manner.

The invention of claim 7 is the patterning processing apparatus according to claim 5 or 6,
The first scribe tool and the second scribe tool are provided in the scribe head so as to form a processing groove simultaneously or selectively, and the one scribe head is moved in the first direction. Thus, the first machining groove is formed by the first scribe tool at the first machining groove formation target position, and the second machining groove is formed by first forming the first machining groove. The second machining groove can be formed simultaneously with the second scribe tool at a target position.

  According to invention of Claim 1 thru | or 7, when forming a linear process groove | channel by scribe process, the scribe process using the 1st scribe tool which forms a process groove narrower than desired width | variety is processed groove By performing the scribing process using the second scribing tool for forming a processing groove having a desired width after the formation of the formation target position, a processing groove having a good shape can be formed.

1 is a perspective view of a patterning apparatus 1. FIG. 4 is an enlarged perspective view of the vicinity of a head holding unit 5. FIG. 1 is an external perspective view of a scribe head 10. FIG. 3 is a block diagram showing a functional configuration of a controller 8. FIG. It is a figure which shows typically the kind and arrangement | positioning of the scribe tool 11 hold | maintained at the scribe head 10. FIG. 3 is a block diagram showing a functional configuration of a controller 8. FIG. It is a figure which shows the mode of a two-stage process typically. It is an observation image of the processing groove L formed by the two-step processing. It is an observation image of the processing groove L ′ formed using only the second scribe tool 112.

<Schematic configuration of patterning apparatus>
FIG. 1 is a perspective view of a patterning apparatus 1 according to an embodiment of the present invention. The patterning apparatus 1 is an apparatus that performs a scribing process for forming a processing groove (scribing groove) by linearly scribing (cutting and removing) the surface of the substrate W, which is a flat plate-shaped workpiece, and particularly a solar cell. The apparatus is preferably used when patterning is performed to form a processing groove along each of a plurality of grooves formed in advance on one main surface of a solar cell substrate for forming a panel. In this embodiment, the substrate W including such a solar cell substrate includes a substrate in which a thin film layer such as a molybdenum (Mo) film is formed on a base substrate such as a glass substrate. Moreover, in the board | substrate W in which such a thin film layer was formed, suppose that the side in which this thin film layer was formed is the surface.

  The patterning processing apparatus 1 according to the present embodiment includes, as mechanical components, two transport mechanisms 2 (an upstream transport mechanism 2A and a downstream transport mechanism 2B) that transport the substrate W in one direction in a horizontal plane, and 1 A pair of table bases 3 (3a, 3b), a table 4 that supports the substrate W during processing, and a head holding unit 5 to which a scribe head 10 (see FIGS. 2 and 3) that performs scribing processing of the substrate W is attached A bridge 6 that guides the head holding unit 5 and a base 7 that supports the transport mechanism 2, the table base 3, and the bridge 6 from below are mainly provided. In FIG. 1, the right-handed XYZ coordinates are given, in which the moving direction of the head holding unit 5 is the X-axis direction, the transport direction of the substrate W is the Y-axis direction, and the vertical direction is the Z-axis direction. In FIG. 1, the detailed illustration of the head holding unit 5 including the scribe head 10 is omitted.

  Furthermore, although not shown in FIG. 1, the patterning apparatus 1 is accompanied by a controller 8 that controls the operation of each part (see FIG. 6). Details of the controller 8 will be described later.

  The upstream side transport mechanism 2A and the downstream side transport mechanism 2B are provided on the base 7 with the table 4 sandwiched between them. Responsible for carrying the substrate W (W2). Each of the upstream side transport mechanism 2A and the downstream side transport mechanism 2B has a rectangular shape parallel to the YZ plane, and a plurality of transport plates 21 having a longitudinal direction in the Y-axis direction are spaced apart at equal intervals in the X-axis direction. It is configured by arranging them. In FIG. 1, an example in which each transport mechanism 2 includes four transport plates 21 is illustrated. On the side surface 21a parallel to the YZ plane of each transport plate 21, a plurality of transport rollers 22 that can be moved up and down in the Z-axis direction are spaced apart at equal intervals along the Y-axis direction. A plurality of air ejection portions 23 are arranged on the upper end surface 21b of the transport plate 21 at regular intervals in the Y-axis direction.

  The table bases 3 (3a, 3b) are arranged to face each other with the transport mechanism 2 sandwiched in a horizontal plane, and the table 4 is installed between them so as to be orthogonal to the transport direction by the transport mechanism 2. It becomes.

  The bridge 6 spans between a pair of struts 61 (61a, 61b) extending in the positive direction of the Z-axis on the outermost side (both ends) of the base 7 in the X-axis direction and the pair of struts 61. Thus, a beam 62 having a longitudinal direction in the X-axis direction and a hollow prism having a frame portion at both ends and the beam 62 are inserted and driven by a linear motor mechanism (not shown). Thus, a linear slider 63 that is movable in the X-axis direction is provided.

  Further, the head holding portion 5 is attached to the side surface on the −Y side of the linear slider 63 in a manner that it can be raised and lowered by an elevating mechanism 64 driven by a motor (not shown). That is, the head holding unit 5 is movable in the X-axis direction when the linear slider 63 moves along the beam 62 and can be moved up and down in the Z-axis direction by the lifting and lowering operation of the lifting mechanism 64. . Detailed configurations of the head holding unit 5 and the scribe head 10 will be described later.

  In the patterning apparatus 1 having such a configuration, when transporting the substrate W, each transport roller 22 of the transport mechanism 2 raises its upper end portion so as to protrude from the upper end surface 21 b of the transport plate 21. Thus, the rotation state is established. When the substrate W is placed on the transport roller 22 in such a state, the transport roller 22 rotates while supporting the substrate W from below. Thereby, the conveyance of the substrate W is realized.

  On the other hand, when processing the substrate W, the conveyance roller 22 stops rotating and descends while supporting the substrate W when the processing target portion of the substrate W reaches just below the head holding unit 5. To do. As a result, the portion of the substrate W positioned above the table 4 is supported and supported from below by the table 4, and the other portions are supplied from a supply source (not shown), and the air ejection portion 23. Is supported in a non-contact manner from below by the air jetted vertically upward.

<Configuration of head holding unit>
FIG. 2 is an enlarged perspective view of the vicinity of the head holding unit 5 provided in the patterning apparatus 1. The head holding part 5 is a part where a processing groove is formed in the substrate W by the scribe head 10 attached to the lowermost end part. The scribe head 10 includes a plurality of scribe tools 11 whose tips are cutting edges 11a arranged in a Y-axis direction at predetermined intervals. The patterning apparatus 1 moves the linear slider 63 in the X-axis direction in a state where the blade edge 11a is in contact with the substrate W, thereby scribing (cutting off) the contact portion of the substrate W with the blade edge 11a. A plurality of processed grooves can be formed at equal intervals. FIG. 2 illustrates a case where ten scribe tools 11 are provided in the head portion (the same applies to FIG. 3).

  The head holding unit 5 includes a frame 51 attached to the linear slider 63, a horizontal position adjusting mechanism 52 provided on the bottom 51a of the frame 51, and an attitude adjusting mechanism 53 that adjusts the attitude of the scribe head 10 while supporting it. And a connecting portion 54 for connecting the horizontal position adjusting mechanism 52 and the posture adjusting mechanism 53.

  The frame 51 is erected in the Z-axis positive direction with respect to the bottom 51a parallel to the XY plane, the two side parts 51b and 51c that are spaced apart from the bottom 51a in the Z-axis positive direction, and spaced apart in the X-axis direction. And is integrally formed by four rectangular plate-like members having a back part 51d which is orthogonal to the side parts 51b and 51c. Of these, the above-described lifting mechanism 64 is attached to the surface of the back portion 51d facing the linear slider 63. The elevating mechanism 64 is guided along a pair of guide rails 64 a and 64 b provided on the linear slider 63 and having a longitudinal direction in the Z-axis direction and spaced apart in the Y-axis direction. The entire head holding portion 5 including the head 10 is moved up and down with respect to the linear slider 63.

  The horizontal position adjusting mechanism 52 is driven by a motor (not shown) and is guided by a pair of guide rails 52a and 52b that are spaced apart from each other in the X-axis direction on the bottom 51a of the frame 51. This is a part that is movable in the Y-axis direction.

  The posture adjusting mechanism 53 includes a rotation shaft 53a, two auxiliary shafts 53b and 53c, a pair of head support shafts 53d (only one is shown in FIG. 2), and first to fourth rods 53e to 53h. With. The rotation shaft 53a, the auxiliary shafts 53b and 53c, and the head support shaft 53d are all shaft members that extend in the Y-axis direction. On the other hand, the first to fourth rods 53e to 53h have the first rod 53e and the third rod 53g as short sides and the second rod 53f and the fourth rod 53h as long when viewed from the side in the Y-axis direction. It is arranged to form a parallelogram with sides. The second rod 53f and the fourth rod 53h pass through a through hole 51h provided in the bottom 51a of the frame 51.

  More specifically, the rotation shaft 53a extends from the connecting portion 54 to the Y axis direction negative side, and is fixed to one end portion (X axis direction positive side) of the first rod 53e. The connecting portion 54 is provided with a rotation driving portion (not shown), and the first rod 53e is rotatable about the rotation shaft 53a by the action of the rotation driving portion.

  The auxiliary shaft 53b is fixed to the other end (X-axis direction negative side) of the first rod 53e in a manner extending in the Y-axis negative direction, and the auxiliary shaft 53b is attached to the upper end of the second rod 53f. It is supported.

  The auxiliary shaft 53c is fixed to one end portion (X-axis direction negative side) of the third rod 53g so as to extend in the Y-axis negative direction, and is attached to the lower end portion of the second rod 53f. It is supported.

  Each of the support shafts 53d is fixed to a support shaft attachment portion 12 which is a hole provided in the upper end portion 10b of the scribe head 10 in a manner extending in the Y-axis direction, and a pair of fourth rods It is pivotally supported by 53h. However, on the Y axis direction negative side, the support shaft 53d penetrates the fourth rod 53h, and its tip is fixed to the other end (X axis direction positive side) of the third rod 53g. Thereby, the scribe head 10 and the third rod 53g are rotatable about the head support shaft 53d supported by the fourth rod 53h.

  In the head holding portion 5 having the above configuration, when the first rod 53e is rotated about the rotation shaft 53a, the second rod 53f is moved in the Z-axis direction in conjunction with the rotation operation. The third rod 53g supported by the fourth rod 53h and the scribing head 10 rotate about the head support shaft 53d as a rotation axis in conjunction with the vertical movement. Therefore, by adjusting the rotation angle of the first rod 53e, the posture of the scribe head 10 can be adjusted, that is, the angle formed between the substrate W and the scribe tool 11 can be adjusted. Preferably, during the scribing process, the attitude of the scribing head 10 is determined so that the scribing tool 11 tilts forward with respect to the processing direction.

  Further, the horizontal position adjusting mechanism 52 connected by the connecting portion 54 and the posture adjusting mechanism 53 that supports the scribe head 10 is moved along the guide rails 52a and 52b, whereby the scribe head 10 is moved in the Y-axis direction. Can be finely adjusted (offset of the scribe tool 11).

<Configuration of scribe head>
FIG. 3 is an external perspective view of the scribe head 10. As described above, since the scribe head 10 is rotatable with respect to the head holding unit 5, the posture of the scribe head 10 is not necessarily constant, but the scribe head 10 is arranged in a row of a plurality of scribe tools 11. Since the direction is held by the head holding unit 5 so as to coincide with the Y-axis direction in the XYZ coordinate system shown in FIGS. 1 and 2, XYZ in which the arrangement direction is the Y-axis direction in FIG. 3 for convenience. A coordinate system is assigned. FIG. 4 is a ZX sectional view of the scribe head 10. FIG. 5 is a diagram schematically showing the type and arrangement of the scribe tool 11 held by the scribe head 10.

  The scribe head 10 includes a plurality of tool holders 13 each holding a scribe tool 11, and a head main body portion 14 including a support shaft attachment portion 12. More specifically, in the scribe head 10, the plurality of tool holders 13 are configured in such a manner that a part on the negative side in the X-axis direction and the negative side in the Z-axis direction of the head main body 14 is cut out by the slit 15. Become. However, the head main body 14 and each tool holder 13 are connected by two connecting portions 16a and 16b whose both ends are thinned. Thereby, each tool holder 13 has elasticity.

  The scribe tool 11 is detachably attached to the attachment hole 13h provided in the bottom portion on the Z axis direction negative side of each tool holder 13 in a posture in which the blade edge 11a becomes the end portion on the Z axis direction negative side. It becomes. More specifically, the scribe tool 11 is made of a magnetic material, and a magnet 13m is provided in the inner part of the mounting hole 13h. The scribe tool 11 is held by the tool holder 13 on the side opposite to the blade edge 11a by magnetic force. It has come to be.

  The shape of the blade edge 11a may be appropriately selected depending on the material of the substrate W, the size of the processed groove to be formed, and the like. For example, it may be a rectangular shape that makes line contact with the substrate W during processing, an arch shape that makes contact with two points, or other shapes.

  On the other hand, an air supply path 14a is provided in the head main body 14 so as to correspond to each tool holder 13, and a piston 14b is provided in the air supply path 14a. The lower end (end on the negative side in the Z-axis direction) of the piston 14b is in contact with the tool holder 13. Further, a plurality of supply ports 17 are provided on the negative side in the X-axis direction of the head main body 14 so as to correspond to the respective tool holders 13. Compressed air can be fed into each air supply path 14a from a compressed air supply mechanism 18 (not shown in FIG. 3) via a supply port 17. Thus, by controlling the amount of compressed air sent from the corresponding supply port 17 (the pressure applied to the piston 14b by the compressed air), each tool holder 13 is moved up and down in the air supply path 14a. The height position of the held scribe tool 11 or the force applied to the substrate W when the scribe tool 11 contacts the substrate W during processing can be finely adjusted.

  The slits 15 between the respective tool holders 13 and the head main body 14 are partially provided in a substantially triangular shape, so that the respective tool holders 13 are lateral to the notch head main body 14. A triangular protrusion 13a that protrudes further is provided. By providing the protrusion 13a, the movable range of each scribe tool 11 and the force applied to the substrate W by the front end are restricted.

  In FIG. 3, for the sake of simplicity of illustration, all the scribe tools 11 are shown without distinction. However, in the patterning apparatus 1 according to the present embodiment, as shown in FIG. Two types of scribe tools 11 having different widths of the processing grooves to be formed are attached to the scribe head 10. This is a configuration for realizing the two-stage machining described later. Hereinafter, the scribe tool 11 having a relatively small machining groove width is particularly referred to as a first scribe tool 111, and the scribe tool 11 having a relatively large machining groove width is particularly referred to as a second scribe tool 112. More specifically, as the second scribe tool 112, a tool capable of forming a processing groove having a desired width is used, and as the first scribe tool 111, a tool forming a processing groove having a narrower width than that is used. In the case shown in FIG. 5, the case where the scribe head 10 is provided with five first scribe tools 111 and five second scribe tools 112 is illustrated. For example, if it is desired to form a processed groove having a width of about 30 μm to 200 μm, it is preferable to use a tool capable of forming a processed groove having a width of about 20 μm to 130 μm as the first scribe tool 111. It is.

  The first scribe tool 111 and the second scribe tool 112 are located closer to the substrate W transported by the upstream transport mechanism 2A than the latter (the negative side in the Y-axis direction of the scribe head 10). Is provided. All the scribe tools 11 are arranged at the same pitch p regardless of the type.

  In addition, each scribe tool 11 can be raised and lowered by raising and lowering the piston 14b. In the present embodiment, the first scribe tool 111 and the second scribe tool 112 as shown in FIG. All the scribe tools 11 are lowered to form machining grooves simultaneously with all the scribe tools 11 and only the first scribe tool 111 is lowered and the machining grooves are formed only with the first scribe tool 111 as shown in FIG. On the contrary, a mode in which only the second scribe tool 112 is lowered and a processing groove is formed only by the second scribe tool 112 as shown in FIG. It is possible to switch while performing.

<Controller>
FIG. 6 is a block diagram showing a functional configuration of the controller 8. The controller 8 controls the operation of each part of the patterning apparatus 1, input / output operations by the operator, display of their contents, generation of processing position data, and the like. The controller 8 includes a main control unit 80 that controls the overall operation of the apparatus, a transport control unit 81 that controls the operation of the transport mechanism 2, a slider control unit 82 that controls the operation of the linear slider 63, and a head holding unit. 5 and the operation of each part related to the scribe head 10, that is, the head control unit 83 that controls the operation of the elevating mechanism 64, the horizontal position adjusting mechanism 52, the posture adjusting mechanism 53, and the compressed air supply mechanism 18; An operation unit 84 that is an interface (such as a keyboard, a mouse, and a touch panel) that enables input operation of the display, a display for displaying a processing menu when the patterning processing apparatus 1 is operated, an actual operation content, and the like so as to be visible to the operator Display unit 85, the operation program of the patterning processing apparatus 1, various processing conditions, etc. A storage unit 86 such as a hard disk to be stored, a memory 87 such as a RAM in which data temporarily generated in accordance with the operation of each unit is stored, and a processing target position when processing the substrate W are described. A machining position data generation unit 88 that generates machining position data is provided.

  The controller 8 having the above configuration is preferably realized by, for example, a general-purpose computer (such as a personal computer).

<Basic operation of patterning device>
In the patterning processing apparatus 1 having the above-described configuration, an operation program (not shown) stored in the storage unit 86 is executed in the controller 8 and given through the operation unit 84 (or stored in advance in the storage unit 86). The main control unit 80 controls the operation of each part of the apparatus through the transport control unit 81, the slider control unit 82, and the head control unit 83 in accordance with the processing conditions and the processing position data generated in the processing position data generation unit 88. Thus, the scribing process can be performed on the substrate W as the processing object.

  In the patterning processing apparatus 1 according to the present embodiment, it is possible to perform scribing using only one or both of the first scribe tool 111 and the second scribe tool 112, but here, These will be described without distinction, and the two-stage machining, which is a machining with a different scribe tool 11 to be used, will be described later.

  Specifically, when the substrate W, which is the object to be processed, is placed on the transport roller 22 of the upstream transport mechanism 2A, the upstream transport mechanism 2A causes the substrate W to be processed in a predetermined position on the surface thereof. Is placed on the table 4.

  On the other hand, the scribe tool 11 is placed on standby above the processing start position until the placement of the substrate W is completed in this mode.

  When the transfer of the substrate W is completed, the elevation mechanism 64 and the compressed air supply mechanism 18 adjust the height positions of the cutting edges 11a of all the scribe tools 11 to the height positions where the machining grooves are formed, and the scribe tool The posture adjusting mechanism 53 sets the scribe head 10 in a tilted posture so that 11 is tilted forward with respect to the machining progress direction.

  When the linear slider 63 to which the head holding unit 5 is attached moves in the X-axis direction, each blade edge 11a comes into contact with the substrate W, so that the contact portion of the substrate W with the blade edge 11a is scribed (cut off). A plurality of processed grooves extending in the X-axis direction are formed at equal intervals on the surface of the substrate W. At this time, if the position of the scribe tool 11 in the Y-axis direction is changed by operating the horizontal position adjusting mechanism 52 in synchronization with the movement of the linear slider 63, a plurality of curves that are equally spaced in the Y-axis direction. A shaped processing groove is formed.

  More specifically, in this case, the position (Y coordinate value) in the Y-axis direction of the scribe tool 11 is defined as a function with respect to the position (X coordinate value) in the X-axis direction and is described as machining position data. By operating the horizontal position adjusting mechanism 62 in accordance with the description of the processing position data, the position of the scribe tool 11 in the Y-axis direction can be changed.

  The processing position data does not necessarily have to be described so that the relationship between the Y coordinate value and the X coordinate value of the processing target position is a continuous function, and for a plurality of X coordinate values that are different at predetermined intervals. In other words, each Y coordinate value may be described. That is, the processing position data may be described as a set of coordinates of a representative processing target position (hereinafter, representative processing target position). When forming a plurality of machining grooves, it is preferable that the X coordinates of the respective representative machining target positions are the same.

  When the processing position data is given as a set of coordinates of representative processing target positions, the scribe tool 11 performs processing while moving the shortest distance linearly between adjacent representative processing target positions. Alternatively, the processing may be performed while moving according to a predetermined rule. For example, when the movement distance of the linear slider 63 during machining is 1000 mm to 1500 mm and a machining groove having a width of about several μm to several tens of μm is formed, the interval between the X coordinate values of the representative machining target positions. Even if the thickness is set to about several mm to several tens of mm, it is possible to form the processing groove with accuracy with no practical problem.

  When the scribe tool 11 reaches the processing end position, the linear slider 63 stops and the cutting edge 11a of the scribe tool 11 and the substrate W are brought into a non-contact state. Thereby, formation of the processing groove for one unit is completed. When a large number of processing grooves are repeatedly formed, the upstream transport mechanism 2A and the downstream transport mechanism 2B transport the substrate W by pitch feed so that a new processing position is positioned on the table 4. The above-described series of processing operations are repeated. Note that when the machining is repeated, the linear slider 63 may reciprocate, or the operation in one direction may be repeated. In the former case, every time the moving direction of the linear slider 63 is reversed, the posture of the scribe tool 11 is also changed.

  When the formation of all the processing grooves is completed, the substrate W is transported to a predetermined unloading position by the downstream transport mechanism 2B.

<Two-stage processing>
Next, two-stage processing realized in the patterning processing apparatus 1 according to the present embodiment will be described. FIG. 7 is a diagram schematically showing the state of the two-stage processing. However, for the sake of simplicity, FIG. 7 exemplifies the two-stage processing when the scribe head 10 is provided with three first scribe tools 111 and three second scribe tools 112. FIG. 7 illustrates the case where the machining groove L (the same applies to the primary machining groove L1 and the secondary machining groove L2) is formed in a straight line. This also applies when formed.

  The two-stage machining performed in the present embodiment is, roughly speaking, scribe machining using the first scribe tool 111 and scribe machining using the second scribe tool 112 for the same machining target position. This is a processing mode in which the steps are sequentially performed.

  First, at the start of machining, the scribe head 10 is in a state where only the first scribe tool 111 as shown in FIG. 5B is lowered. Then, as shown in FIG. 7 (a), the first scribe head 10 is moved in the direction indicated by the arrow AR1 in a state where the first processing target position is arranged on the movement path of the first scribe tool 111. A machining groove (primary machining groove) L1 is formed by the tool 111. The primary processing groove L1 is formed with a width smaller than the width of the processing groove L that is desired to be formed on the substrate W.

  Note that the moving direction of the scribe head 10 in such a case indicated by the arrow AR1 may be either the X-axis positive direction or the negative direction. In any case, the posture of the scribe head 10 is determined so that the scribe tool 11 is tilted forward with respect to the traveling direction.

  When the formation of the primary machining groove L1 is completed, the scribe head 10 is brought into a state where all the scribe tools 11 as shown in FIG. Further, the pitch of the substrate W is set so that the primary processing groove L1 (L1a) formed immediately before by the transport mechanism 2 coincides with the movement path of the second scribe tool 112 when the scribe head 10 is moved next. Feeding is performed. Generally speaking, when there are k (k is a natural number) first scribe tools 111 and second scribe tools 112, the substrate W is pitch-fed by a distance k · p.

  When these states are realized, as shown in FIG. 7B, the scribe head 10 is moved in the direction indicated by the arrow AR2 opposite to the latest movement direction indicated by the arrow AR1. Then, the secondary machining groove L2 having the same formation position in the Y-axis direction as the primary machining groove L1a is superimposed by the second scribe tool 112 at the location where the primary machining groove L1 (L1a) has been previously formed. Will be formed. In this way, the secondary processing groove L2 overlapped with the primary processing groove L1a is the processing groove L desired to be formed.

  At this time, the first scribe tool 111 newly forms a primary processing groove L1 (L1b). These primary machining grooves L1b and secondary machining grooves L2 are all formed at an equal pitch.

  Thereafter, the same reciprocating operation of the scribe head and the pitch feed of the substrate W are repeated to form the primary processing groove L1 and the secondary processing groove L2 overlapping therewith, that is, the desired processing. The formation of the groove L is repeated.

  As a result of such repetition, when the primary processing grooves L1 are formed at the formation target positions of all the primary processing grooves L1, the scribe head 10 is moved to the second scribe tool 112 as shown in FIG. Only the position is lowered, and is moved as indicated by an arrow AR3 in FIG. When the movement is completed, the formation of all the processing grooves L is completed.

  FIG. 8 is an observation image of the processing groove L formed by the two-step processing. 8A is a planar observation image, and FIG. 8B is a cross-sectional observation image perpendicular to the processing direction. On the other hand, FIG. 9 is an observation image of the processing groove L ′ formed using only the second scribe tool 112 shown for comparison. FIG. 9A is a planar observation image, and FIG. 9B is a cross-sectional observation image perpendicular to the processing direction.

  8 and FIG. 9 is compared, the processed groove L ′ shown in FIG. 9 is protruded, for example, as in the E1 ′ portion, or has convex portions or inclined portions on the side portions as in the E2 ′ portion. 8 or the thin film layer remains without being removed at the bottom, the processed groove L shown in FIG. 8 has a substantially constant width and a side edge as shown in portions E1 and E2. Is sharp. This difference means that the two-stage machining according to the present embodiment is effective in forming a machined groove having a good shape.

  In addition, the patterning apparatus 1 according to the present embodiment includes a first scribe tool and a second scribe tool that are provided at an equal pitch on one scribe head, so that only two stages of movement of the scribe head are required. It can be said that the present invention has an excellent effect in that it can be processed.

  The reason why the above-described two-stage processing is effective in forming a processing groove having a good shape is that the first scribing tool 112 is used to form the processing groove having the originally desired width. By forming the narrow primary processing groove L1 in advance at the formation target position by the scribe tool 111, the second scribe tool 112 acts on the thin film layer on the surface of the substrate W during the scribe processing by the second scribe tool 112. It is considered that the stress is relaxed by the presence of the primary processing groove L1, and the thin film layer is easily removed without applying an excessive force.

  As described above, according to the present embodiment, when a linear processing groove is formed by scribing, scribing using the first scribe tool that forms a processing groove narrower than a desired width is performed. By performing the scribing process using the second scribing tool for forming a processing groove having a desired width after being performed on the processing target position, a processing groove having a good shape can be formed.

  Further, by providing both the first scribe tool and the second scribe tool at an equal pitch on one scribe head, two-stage processing can be performed only by moving the scribe head.

DESCRIPTION OF SYMBOLS 1 Patterning apparatus 2 Conveyance mechanism 2A Upstream conveyance mechanism 2B Downstream conveyance mechanism 3 Table base 4 Table 5 Head holding part 6 Bridge 7 Base 8 Controller 10 Scribe head 11 Scribe tool 11a (Scribe tool) blade edge 12 Support shaft attachment Part 13 Tool holder 13m Magnet 14 Head body part 14a Air supply path 14b Piston 21 Conveying plate 22 Conveying roller 23 Air ejection part 51 Frame 51h Through hole 52 Horizontal position adjusting mechanism 53 Attitude adjusting mechanism 53a Rotating shaft 53b, 53c Auxiliary shaft 53d Head support shaft 53e to 53h Rod 62 Beam 63 Linear slider 64 Lifting mechanism 111 First scribe tool 112 Second scribe tool L Machining groove L1 (L1a, L1b) Primary machining groove L2 Secondary addition Groove W board

Claims (7)

A method of patterning a substrate by scribing to remove a part of a thin film layer provided on the substrate by a scribing tool having a cutting edge at the tip to form a linear processing groove,
A first scribing step of forming a first processing groove at a processing groove forming target position of the substrate using a first scribing tool capable of forming a processing groove having a processing width narrower than a desired processing width;
Using a second scribe tool capable of forming a processing groove having the desired processing width, the first processing groove is superimposed on the first processing groove at the processing groove formation target position of the substrate on which the first processing groove is formed. A second scribing step for forming a second processed groove,
A patterning method for a substrate, comprising: A substrate patterning method according to claim 1,
In the first scribe step, a plurality of the first processing grooves are formed at a plurality of processing groove formation target positions by the plurality of first scribe tools,
In the second scribe process, the plurality of second scribe tools respectively apply the first machining grooves to the first machining grooves at the plurality of machining groove formation target positions. Forming a second processed groove in a superimposed manner;
A method for patterning a substrate. A method for patterning a substrate according to claim 1 or 2,
The first scribe tool and the second scribe tool are provided on one scribe head so that when the one scribe head is moved, formation of a processing groove can be performed simultaneously or selectively. In addition, the first scribe tool and the second scribe tool can be formed simultaneously with the first scribe process at the first groove forming target position, and the first scribe tool and the second scribe tool can be formed at the same time. Simultaneously performing the second scribing step at the second processing groove formation target position formed by forming the processing grooves.
A method for patterning a substrate. A patterning processing apparatus capable of forming a linear processing groove by removing a part of a thin film layer provided on a substrate by scribe processing,
A table that supports the substrate;
First and second scribes each having a cutting edge at the tip and capable of forming a processing groove at a processing groove forming target position of the substrate by moving the cutting edge in contact with the substrate supported by the table Tools and
With
The first scribe tool can form a first processing groove having a processing width narrower than a desired processing width;
The second scribe tool can form a second machining groove of the desired machining width;
Forming the second machining groove on the machining groove formation target position where the first machining groove is formed by the first scribe tool so as to overlap the first machining groove;
A patterning apparatus characterized by that. The patterning apparatus according to claim 4,
A scribing head movable in a first direction,
Further comprising
The first scribe tool and the second scribe tool are arranged in a second direction orthogonal to the first direction in the scribe head.
A patterning apparatus characterized by that. The patterning apparatus according to claim 5,
The one scribe head is provided with a plurality of the first scribe tools and a plurality of the second scribe tools at an equal pitch,
Each of the first machining grooves by the plurality of second scribe tools at the plurality of machining groove formation target positions where the first machining grooves are respectively formed by the plurality of first scribe tools. Forming the second machining groove in a superimposed manner,
A patterning apparatus characterized by that. The patterning apparatus according to claim 5 or 6,
The first scribe tool and the second scribe tool are provided in the scribe head so as to form a processing groove simultaneously or selectively, and the one scribe head is moved in the first direction. Thus, the first machining groove is formed by the first scribe tool at the first machining groove formation target position, and the second machining groove is formed by first forming the first machining groove. The second machining groove can be formed simultaneously with the second scribe tool at a target position.
A patterning apparatus characterized by that.