TWI729361B - 溫度感測器元件及其輸送系統和生產方法 - Google Patents

溫度感測器元件及其輸送系統和生產方法 Download PDF

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Publication number
TWI729361B
TWI729361B TW108107722A TW108107722A TWI729361B TW I729361 B TWI729361 B TW I729361B TW 108107722 A TW108107722 A TW 108107722A TW 108107722 A TW108107722 A TW 108107722A TW I729361 B TWI729361 B TW I729361B
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TW
Taiwan
Prior art keywords
temperature sensor
coated
electrically insulating
insulating substrate
adhesive
Prior art date
Application number
TW108107722A
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English (en)
Chinese (zh)
Other versions
TW201939003A (zh
Inventor
馬汀 布雷弗
史蒂芬 爾福
安德雷亞斯 辛雷契
Original Assignee
德商賀利氏先進傳感器技術有限公司
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Publication date
Priority claimed from DE202018001393.5U external-priority patent/DE202018001393U1/de
Priority claimed from DE102018203971.2A external-priority patent/DE102018203971A1/de
Application filed by 德商賀利氏先進傳感器技術有限公司 filed Critical 德商賀利氏先進傳感器技術有限公司
Publication of TW201939003A publication Critical patent/TW201939003A/zh
Application granted granted Critical
Publication of TWI729361B publication Critical patent/TWI729361B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
TW108107722A 2018-03-15 2019-03-08 溫度感測器元件及其輸送系統和生產方法 TWI729361B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE202018001393.5U DE202018001393U1 (de) 2018-03-15 2018-03-15 Temperatursensorelement
DE202018001393.5 2018-03-15
DE102018203971.2A DE102018203971A1 (de) 2018-03-15 2018-03-15 Temperatursensorelement
DE102018203971.2 2018-03-15

Publications (2)

Publication Number Publication Date
TW201939003A TW201939003A (zh) 2019-10-01
TWI729361B true TWI729361B (zh) 2021-06-01

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ID=65717991

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108107722A TWI729361B (zh) 2018-03-15 2019-03-08 溫度感測器元件及其輸送系統和生產方法

Country Status (4)

Country Link
EP (1) EP3765827A1 (fr)
CN (1) CN111742203B (fr)
TW (1) TWI729361B (fr)
WO (1) WO2019174968A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW429306B (en) * 1999-09-03 2001-04-11 Hayashi Denko Kk Wafer sensor for measuring temperature distribution
TW200741934A (en) * 2006-03-16 2007-11-01 Tokyo Electron Ltd Wafer-shaped measuring apparatus and method for manufacturing the same
CN103403862A (zh) * 2010-11-05 2013-11-20 丹福斯矽电有限责任公司 功率半导体模块和用于制造与温度传感器一起烧结的功率半导体模块的方法
CN207095727U (zh) * 2017-07-31 2018-03-13 天津大学 一种基于柔性可延展叶面传感器的无线监测系统

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100504326C (zh) * 2007-03-14 2009-06-24 哈尔滨理工大学 微型铂热电阻温度传感器的镶嵌式电极引出方法
CN100568022C (zh) * 2007-03-28 2009-12-09 哈尔滨理工大学 阵列式多参数风传感器芯片基板
DE102010044329A1 (de) 2010-09-03 2012-03-08 Heraeus Materials Technology Gmbh & Co. Kg Kontaktierungsmittel und Verfahren zur Kontaktierung elektrischer Bauteile

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW429306B (en) * 1999-09-03 2001-04-11 Hayashi Denko Kk Wafer sensor for measuring temperature distribution
TW200741934A (en) * 2006-03-16 2007-11-01 Tokyo Electron Ltd Wafer-shaped measuring apparatus and method for manufacturing the same
CN103403862A (zh) * 2010-11-05 2013-11-20 丹福斯矽电有限责任公司 功率半导体模块和用于制造与温度传感器一起烧结的功率半导体模块的方法
CN207095727U (zh) * 2017-07-31 2018-03-13 天津大学 一种基于柔性可延展叶面传感器的无线监测系统

Also Published As

Publication number Publication date
WO2019174968A1 (fr) 2019-09-19
EP3765827A1 (fr) 2021-01-20
CN111742203B (zh) 2023-03-10
TW201939003A (zh) 2019-10-01
CN111742203A (zh) 2020-10-02

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