TWI728522B - Heat sink structure - Google Patents

Abstract

The present invention discloses a heat sink structure, comprising a metal base and a plurality of fins, wherein the plurality of fins are vertically connected to a top surface of the metal base. Particularly, the top surface of the metal base is provided with a plurality of vortex generating members, such that the plurality of vortex generating members are located between the fins are and the metal base. In the present invention, the vortex generating members are configured for breaking a boundary that is formed at a connection interface between the fins and the metal base in the case of the heat sink structure being applied to carry out heat dissipation. It is worth explaining that, a vortex would be produced as long as the boundary is broken by the vortex generating members. Moreover, experimental data have proved that, compared to the conventional heat sink structure that is not particularly designed to have the said vortex generating members, this novel heat sink structure exhibits better heat dissipation efficiency than that of the conventional heat sink structure.

Description

Radiator structure

The present invention relates to the related technical field of heat sinks, and particularly refers to a heat sink structure that can show excellent heat dissipation effects.

Computer engineers know that there are several main heating elements on the computer motherboard, which are the central processing unit (CPU), the south bridge chipset, the north bridge chipset, and the graphics chip (GPU). The radiator is used to dissipate heat and reduce the temperature of these heating elements, so as to maintain the overall working performance of the computer. Please refer to FIG. 1, which shows a perspective view of a conventional heat sink. As shown in FIG. 1, the conventional heat sink 1'usually includes a heat dissipation base 11' and a plurality of heat dissipation fins 12', wherein the heat dissipation base 11' is used to attach a heat source, such as a CPU. On the other hand, the plurality of heat dissipation fins 12' are usually formed on a top surface of the heat dissipation base 11' through a stamping process.

It must be particularly noted that, in the structure of the conventional heat sink 1', the top surface of the heat dissipation base 11' is usually a flat surface. In this case, as shown by the arrowed line as shown in FIG. 1, after the airflow flows into the airflow channel between any two of the heat dissipation fins 12', each of the heat dissipation fins 12' A so-called boundary layer is formed between the top surface of the heat dissipation base 11'. Research has found that the heat at the junction of the heat dissipation fin 12' and the heat dissipation base 11' will not be effectively and quickly removed because of the boundary layer coating, resulting in the conventional heat sink 1'being unable to display The best heat dissipation performance.

It can be seen from the above description that it is actually necessary to improve or redesign the structure of the conventional heat sink 1'in order to improve its heat dissipation efficiency. In view of this, the inventor of this case tried his best to research and invent, and finally developed a heat sink structure of the present invention.

The main purpose of the present invention is to provide a heat sink structure, which includes: a heat dissipation base and a plurality of heat dissipation fins, wherein the plurality of heat dissipation fins stand on a top surface of the heat dissipation base. In particular, in the present invention, a plurality of eddy current generating structures are formed on the top surface of the heat dissipation base, and the plurality of eddy current generating structures are located between the plurality of heat dissipation fins and the heat dissipation base for the When the heat sink structure performs a heat dissipation operation, a boundary layer formed at the connection between each of the heat dissipation fins and the heat dissipation base is destroyed, and eddy currents are generated. In addition, the experimental data shows that the heat sink structure of the present invention shows better heat dissipation performance than the conventional heat sink without the so-called eddy current generating structure.

Therefore, in order to achieve the above-mentioned main purpose of the present invention, the inventor of this case provides an embodiment of the heat sink structure, which includes: A heat sink base; and A plurality of heat dissipation fins stand on a top surface of the heat dissipation base; Wherein, a plurality of grooves are formed on the top surface of the heat dissipation base, and the plurality of grooves are located between the plurality of heat dissipation fins and the heat dissipation base for the heat sink structure In the process of performing a heat dissipation work, a boundary layer formed at the connection between each of the heat dissipation fins and the heat dissipation base is destroyed.

In the aforementioned embodiment of the heat sink structure of the present invention, the shape of a side cross-sectional surface of the groove can be any of the following: triangle, quadrangle, sector, or triangle with at least one arc side.

In an embodiment of the heat sink structure of the present invention, a plurality of microstructures are formed on at least one surface of the heat dissipation fin, and the microstructures can be any of the following: semi-cylindrical, quadrangular pyramid, Or triangular pyramidal column.

Therefore, in order to achieve the above-mentioned main purpose of the present invention, the inventor of this case provides another embodiment of the heat sink structure, which includes: A heat sink base; and A plurality of heat dissipation fins stand on a top surface of the heat dissipation base; Wherein, a plurality of grooves are formed on the top surface of the heat dissipation base, and the plurality of grooves are located between the plurality of heat dissipation fins and the heat dissipation base for use in the heat sink structure In the process of performing a heat dissipation work, a boundary layer formed at the connection between each of the heat dissipation fins and the heat dissipation base is destroyed.

In another embodiment of the heat sink structure of the present invention, the shape of a side cross-sectional surface of the groove can be any of the following: triangle, quadrilateral, sector, or triangle with at least one arc side.

In order to more clearly describe the structure of a heat sink proposed by the present invention, the preferred embodiments of the present invention will be described in detail below in conjunction with the drawings.

The first embodiment

FIG. 2 shows a perspective view of a first embodiment of a heat sink structure of the present invention, and FIG. 3 shows a perspective exploded view of the first embodiment of a heat sink structure of the present invention. As shown in FIGS. 2 and 3, the heat sink structure 1 of the present invention includes: a heat dissipation base 11 and a plurality of heat dissipation fins 12, wherein the plurality of heat dissipation fins 12 stand on a top of the heat dissipation base 11 Above the surface. In particular, in the present invention, a plurality of grooves 111 are formed on the top surface of the heat dissipation base 11, and the plurality of grooves 111 are located between the plurality of heat dissipation fins 12 and the heat dissipation base 11, In order to destroy a boundary layer formed at the connection between each of the heat dissipation fins 12 and the heat dissipation base 11 in the process of the heat sink structure 1 performing a heat dissipation work.

In more detail, the plurality of grooves 111 formed on the top surface of the heat dissipation base 11 of the present invention are mainly used as vortex generators. As shown by the line with arrows as shown in FIG. 2, when the airflow flows into the airflow channel between any two heat dissipation fins 12, even if the top of each heat dissipation fin 12 and the heat dissipation base 11 A so-called boundary layer will be formed between the surfaces, but the boundary layer will be destroyed by the plurality of grooves 111, so that the airflow will be transformed into a vortex at the damaged boundary layer. For this reason, the plurality of grooves 111 can be regarded as a so-called vortex generating structure.

The following table (1) records the measurement results of the heat dissipation efficiency of two heat sink samples. Among them, the sample A listed in table (1) is a conventional heat sink 1'(as shown in Figure 1), and its heat sink base The top surface of 11' is a flat surface (Plat surface). On the other hand, the sample B listed in Table (2) is the heat sink structure 1 of the present invention. Table 1) sample Maximum temperature (T _max ,℃) The lowest temperature (T _min ,℃) Average temperature (T _avg ,℃) Pressure difference (△p,Pa) A 84.6 65.4 76.0 115.1 B 84.4 65.0 75.6 114.4

It can be seen from Table (1) that, compared with the conventional heat sink (ie, sample A), the pressure difference between an air flow inflow side and an air flow out side of the heat sink structure 1 of the present invention is not significantly increased. At the same time, through the measurement data of the highest temperature, the lowest temperature and the average temperature, it can be further known that the heat sink structure 1 of the present invention shows a comparatively better display than the conventional heat sink 1'(as shown in FIG. 1). Excellent heat dissipation performance.

Continue to refer to FIG. 3 and also refer to FIG. 4, which shows a perspective view of another embodiment of the heat dissipation base 11 of the heat sink structure 1 of the present invention. If you look closely at FIG. 3, it can be found that FIG. 3 shows that the shape of a side cross-sectional surface of the groove 111 is a triangle. However, in an achievable embodiment, the present invention does not particularly limit the shape of the side cross-sectional surface of the groove 111, which may be a triangle, a quadrangle, a sector, or a triangle with at least one arc side. For example, FIG. 4 shows that the shape of the side cross-sectional surface of the groove 111 is a triangle with an arc side.

Continue to refer to FIG. 5, which shows a perspective view of another embodiment of the plurality of heat dissipation fins 12 of the heat sink structure 1 of the present invention. As shown in FIG. 5, in an achievable embodiment, a plurality of microstructures 121 can be further formed on the two surfaces of each heat dissipation fin 12 to increase the heat dissipation efficiency of each heat dissipation fin 12. FIG. 5 shows that each of the microstructures 121 is a half-cylinder. However, in an achievable embodiment, the present invention does not particularly limit the aspect of the microstructure 121, which may be a semi-cylindrical, quadrangular pyramid, or triangular pyramid.

Second embodiment

FIG. 6 shows a perspective view of a second embodiment of a heat sink structure of the present invention, and FIG. 7 shows a perspective exploded view of a second embodiment of the heat sink structure of the present invention. Similar to the aforementioned first embodiment, the basic structure of the second embodiment of the heat sink structure 1 includes: a heat dissipation base 11 and a plurality of heat dissipation fins 12. It is worth noting that in the second embodiment, at least one insertion groove 112 is formed on a bottom surface of the heat dissipation base 11, and each of the heat dissipation fins 12 has at least one through hole 122. With this design, at least one heat dissipation pipe 13 can be added to the structure of the heat sink structure 1 and connect the heat dissipation base 11 and the plurality of heat dissipation fins 12 at the same time. As shown in FIGS. 6 and 7, the heat pipe 13 includes: a first section 131, a second section 132, and a connecting section 133; wherein, the first section 131 is embedded in the fitting groove 112 The second section 132 passes through the perforation 122 of each of the heat dissipation fins 12, and the connecting section 133 connects the first section 131 and the second section 132.

The third embodiment

FIG. 8 shows a perspective view of a third embodiment of a heat sink structure of the present invention, and FIG. 9 shows a perspective exploded view of the third embodiment of a heat sink structure of the present invention. As shown in FIGS. 8 and 9, the heat sink structure 1 of the present invention includes: a heat dissipation base 11 and a plurality of heat dissipation fins 12, wherein the plurality of heat dissipation fins 12 stand on a top of the heat dissipation base 11 Above the surface. In particular, in the present invention, a plurality of recesses 114 are formed on the top surface of the heat dissipation base 11, and the plurality of recesses 114 are located between the plurality of heat dissipation fins 12 and the heat dissipation base 11 In the meantime, it is used to destroy a boundary layer formed at the connection between each of the heat dissipation fins 12 and the heat dissipation base 11 during the process of performing a heat dissipation operation on the heat sink structure 1.

In more detail, the plurality of grooves 114 made on the top surface of the heat dissipation base 11 of the present invention are mainly used as vortex generators. As shown by the arrowed line as shown in FIG. 8, when the airflow flows into the airflow channel between any two heat dissipation fins 12, even if the top of each heat dissipation fin 12 and the heat dissipation base 11 A so-called boundary layer will be formed between the surfaces, but the boundary layer will be destroyed by the plurality of grooves 114, so that the airflow will be transformed into a vortex at the damaged boundary layer. For this reason, the plurality of grooves 114 can be regarded as a so-called vortex generating structure.

Continue to refer to FIG. 9 and also refer to FIG. 10, which shows a perspective view of another embodiment of the heat dissipation base 11 of the heat sink structure 1 of the present invention. If you look closely at FIG. 9, you can find that, FIG. 9 shows that the shape of a side cross-sectional surface of the recess 114 is a triangle. However, in an achievable embodiment, the present invention does not particularly limit the shape of the side cross-sectional surface of the groove 114, which may be a triangle, a quadrangle, a sector, or a triangle with at least one arc side. For example, FIG. 10 shows that the shape of the side cross-sectional surface of the groove 114 is a triangle with an arc side.

It must be emphasized that the above detailed description is a specific description of the possible embodiments of the present invention, but the embodiment is not intended to limit the scope of the present invention. Any equivalent implementation or modification that does not deviate from the technical spirit of the present invention, All should be included in the patent scope of this case.

>The invention> 1 Radiator structure 11 Cooling base 111 Groove 112 Mating groove 114 Groove 12 Cooling fins 121 microstructure 122 perforation 13 Heat pipe 131 First paragraph 132 Second paragraph 133 Connection segment

>Learning> 1' heat sink 11' Cooling base 12' Cooling fins

Figure 1 shows a perspective view of a conventional heat sink; 2 shows a perspective view of a first embodiment of a heat sink structure of the present invention; Figure 3 shows a perspective exploded view of the first embodiment of the heat sink structure of the present invention; 4 shows a perspective view of another embodiment of the heat dissipation base of the heat sink structure of the present invention; 5 shows a perspective view of another embodiment of a plurality of heat dissipation fins of the heat sink structure of the present invention; Fig. 6 shows a perspective view of a second embodiment of a heat sink structure of the present invention; Figure 7 shows a perspective exploded view of the second embodiment of the heat sink structure of the present invention; Fig. 8 shows a perspective view of a third embodiment of a heat sink structure of the present invention; Figure 9 shows a three-dimensional exploded view of the third embodiment of the heat sink structure of the present invention; and FIG. 10 shows a perspective view of another embodiment of the heat dissipation base of the heat sink structure of the present invention.

1 Radiator structure 11 Cooling base 111 Groove 12 Cooling fins

Claims (8)

A heat sink structure, comprising: a heat dissipation base; a plurality of heat dissipation fins, towering on a top surface of the heat dissipation base, and any two of the heat dissipation fins are parallel to each other and separated by a distance; and a plurality of heat dissipation fins Grooves are formed on the top surface of the heat dissipation base so as to be located between the plurality of heat dissipation fins and the top surface of the heat dissipation base, and the heat is dissipated between any two of the grooves The top surface of the base is separated; wherein, in the process of the heat sink structure performing a heat dissipation work, a boundary layer is formed between the top surface of the heat dissipation base and the plurality of heat dissipation fins; wherein Each of the grooves includes a vertical side and an arc-shaped bottom side, and the plurality of grooves are used to destroy the heat dissipation fins and the heat dissipation when the heat sink structure performs the heat dissipation work. A boundary layer at the junction of the pedestals. According to the radiator structure described in claim 1, wherein a plurality of microstructures are formed on at least one surface of the heat dissipation fin, and the microstructures can be any of the following: semi-cylindrical body, four Pyramid cylinder, or triangular pyramid cylinder. According to the radiator structure described in claim 1, wherein at least one fitting groove is formed on a bottom surface of the heat dissipating base, and each of the heat dissipating fins has at least one through hole. For example, the radiator structure described in item 3 of the scope of patent application further includes at least one heat dissipation pipe, and the heat dissipation pipe includes: a first section, which is embedded in the fitting groove; and a second section, which is The perforation passing through each of the radiating fins; and a connecting section connecting the first section and the second section. A radiator structure includes: a heat dissipation base; a plurality of heat dissipation fins towering above a top surface of the heat dissipation base so as to be located between the plurality of heat dissipation fins and the top surface of the heat dissipation base And any two of the heat dissipation fins are parallel to each other and separated by a distance; and a plurality of grooves are formed on the top surface of the heat dissipation base, and the heat dissipation between any two of the grooves The top surface of the base is separated; wherein, in the process of the heat sink structure performing a heat dissipation work, a boundary layer is formed between the top surface of the heat dissipation base and the plurality of heat dissipation fins; wherein , Each of the grooves includes four vertical sides and an arc-shaped bottom side, and the plurality of grooves are used to destroy the heat dissipation fins and the heat dissipation fins formed during the heat dissipation process of the heat sink structure. A boundary layer at the junction of the heat dissipation base. According to the heat sink structure described in item 5 of the scope of patent application, a plurality of microstructures are formed on at least one surface of the heat dissipation fin, and the microstructures can be any of the following: semi-cylinder, quad Pyramid cylinder, or triangular pyramid cylinder. According to the radiator structure described in claim 5, at least one fitting groove is formed on a bottom surface of the heat dissipation base, and each of the heat dissipation fins has at least one through hole. For example, the radiator structure described in item 7 of the scope of patent application further includes at least one heat dissipation pipe, and the heat dissipation pipe includes: a first section, which is embedded in the fitting groove; and a second section, which is The perforation passing through each of the radiating fins; and a connecting section connecting the first section and the second section.

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