CN112698704A - Heat sink structure - Google Patents
Heat sink structure Download PDFInfo
- Publication number
- CN112698704A CN112698704A CN201911011404.XA CN201911011404A CN112698704A CN 112698704 A CN112698704 A CN 112698704A CN 201911011404 A CN201911011404 A CN 201911011404A CN 112698704 A CN112698704 A CN 112698704A
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- China
- Prior art keywords
- heat sink
- heat
- heat dissipation
- base
- sink structure
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 72
- 238000000034 method Methods 0.000 claims abstract description 10
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses a radiator structure, which comprises: the heat sink comprises a heat sink base and a plurality of heat dissipation fins, wherein the plurality of heat dissipation fins rise on the top surface of the heat sink base. In particular, the present invention forms a plurality of eddy current generating structures on the top surface of the heat sink base, and the eddy current generating structures are located between the plurality of heat dissipating fins and the heat sink base, so as to destroy a boundary layer formed at a connection between each of the heat dissipating fins and the heat sink base and generate eddy currents in a process of the heat sink structure performing a heat dissipating operation. Also, experimental data show that the heat sink structure of the present invention exhibits superior heat dissipation performance compared to a conventional heat sink without a so-called vortex generating structure.
Description
Technical Field
The present invention relates to the field of heat dissipation technology, and more particularly, to a heat dissipation structure with excellent heat dissipation performance.
Background
Computer engineers know that there are several main heating elements on the motherboard of a computer, which are a Central Processing Unit (CPU), a south bridge chipset, a north bridge chipset, and a Graphics Processing Unit (GPU). The heat radiator is used for radiating and cooling the heating elements so as to keep the overall working efficiency of the computer. Referring to fig. 1, a perspective view of a conventional heat sink is shown. As shown in fig. 1, a conventional heat sink 1 'generally includes a heat sink base 11' and a plurality of heat dissipating fins 12 ', wherein the heat sink base 11' is used for attaching a heat source, such as a CPU. On the other hand, the plurality of heat dissipation fins 12 'are typically formed on a top surface of the heat dissipation base 11' by a stamping process.
It should be noted that, in the structure of the conventional heat sink 1 ', the top surface of the heat sink base 11' is generally a plane (plane surface). In this case, as shown by the line with arrows in fig. 1, after the air flow enters the air flow channel between any two of the radiator fins 12 ', a so-called boundary layer is formed between each of the radiator fins 12 ' and the top surface of the heat sink base 11 '. It has been found that the heat at the junction of the heat sink fins 12 ' and the heat sink base 11 ' cannot be effectively and rapidly dissipated because of the boundary layer, and the conventional heat sink 1 ' cannot exhibit the best heat dissipation performance.
From the above description, it can be seen that there is a need for a heat sink 1' with improved or redesigned structure to improve the heat dissipation performance. In view of the above, the inventors of the present invention have made extensive studies and finally developed a heat sink structure according to the present invention.
Disclosure of Invention
The main objective of the present invention is to provide a heat sink structure, which includes: the heat sink comprises a heat sink base and a plurality of heat dissipation fins, wherein the plurality of heat dissipation fins rise above a top surface of the heat sink base. In particular, the present invention forms a plurality of eddy current generating structures on the top surface of the heat sink base, and the eddy current generating structures are located between the plurality of heat dissipating fins and the heat sink base, so as to destroy a boundary layer formed at a connection between each of the heat dissipating fins and the heat sink base and generate eddy currents in a process of the heat sink structure performing a heat dissipating operation. Also, experimental data show that the heat sink structure of the present invention exhibits superior heat dissipation performance compared to a conventional heat sink without a so-called vortex generating structure.
Therefore, to achieve the above-mentioned objectives, the present inventors provide an embodiment of the heat sink structure, which includes:
a heat dissipation base; and
a plurality of heat dissipation fins erected on a top surface of the heat dissipation base;
the heat sink structure comprises a heat sink base, a plurality of heat dissipation fins and a plurality of grooves, wherein the heat sink base is provided with a plurality of grooves on the top surface, and the grooves are positioned between the heat dissipation fins and the heat sink base and used for destroying a boundary layer formed at the connection part of each heat dissipation fin and the heat sink base in the process of executing a heat dissipation work by the heat sink structure.
In an embodiment of the heat sink structure of the present invention, a cross-sectional shape of one side of the groove may be any one of the following shapes: triangular, tetragonal, fan-shaped, or triangular with at least one curved side.
In an embodiment of the heat sink structure of the present invention, a plurality of microstructures are formed on at least one surface of the heat sink fin, and the microstructures may be any one of the following: a semi-cylinder, a quadrangular pyramid or a triangular pyramid.
Therefore, in order to achieve the above-mentioned main object of the present invention, the inventor of the present invention provides another embodiment of the heat sink structure, which comprises:
a heat dissipation base; and
a plurality of heat dissipation fins erected on a top surface of the heat dissipation base;
the heat sink structure comprises a heat sink base, a plurality of heat dissipation fins and a plurality of grooves, wherein the heat sink base is provided with a plurality of grooves on the top surface, and the grooves are positioned between the heat dissipation fins and the heat sink base and used for damaging a boundary layer formed at the connection part of each heat dissipation fin and the heat sink base in the process of executing a heat dissipation work by the heat sink structure.
In another embodiment of the heat sink structure of the present invention, a cross-sectional shape of one side of the groove may be any one of the following shapes: triangular, tetragonal, fan-shaped, or triangular with at least one curved side.
Drawings
FIG. 1 is a perspective view of a conventional heat sink;
FIG. 2 is a perspective view of a first embodiment of a heat sink structure of the present invention;
FIG. 3 shows an exploded perspective view of a first embodiment of the heat sink structure of the present invention;
FIG. 4 is a perspective view of another embodiment of a heat sink base of the heat sink structure of the present invention;
FIG. 5 is a perspective view of another embodiment of a plurality of cooling fins of the heat sink structure of the present invention;
FIG. 6 is a perspective view of a second embodiment of a heat sink structure of the present invention;
FIG. 7 shows an exploded perspective view of a second embodiment of the heat sink structure of the present invention;
FIG. 8 shows a perspective view of a third embodiment of a heat sink structure of the present invention;
FIG. 9 shows an exploded perspective view of a third embodiment of the heat sink structure of the present invention; and
fig. 10 is a perspective view of another embodiment of the heat dissipation base of the heat sink structure of the present invention.
Wherein, the reference numbers:
1 Heat sink structure
11 Heat dissipation base
111 trench
112 engaging groove
114 groove
12 heat dissipation fin
121 microstructure
122 perforation
13 radiating pipe
131 first section
132 second segment
133 connecting segment
1' radiator
11' heat dissipation base
12' heat dissipation fin
Detailed Description
In order to more clearly describe the structure of the heat sink of the present invention, the following description will be made in detail with reference to the accompanying drawings.
First embodiment
Fig. 2 shows a perspective view of a first embodiment of a heat sink structure of the present invention, and fig. 3 shows an exploded perspective view of the first embodiment of the heat sink structure of the present invention. As shown in fig. 2 and 3, the heat sink structure 1 of the present invention includes: a heat sink base 11 and a plurality of heat dissipation fins 12, wherein the plurality of heat dissipation fins 12 rise above a top surface of the heat sink base 11. In particular, the present invention forms a plurality of grooves 111 on the top surface of the heat sink base 11, and the grooves 111 are located between the heat dissipation fins 12 and the heat sink base 11, so as to damage a boundary layer formed at a connection position between each of the heat dissipation fins 12 and the heat sink base 11 in a process of performing a heat dissipation operation by the heat sink structure 1.
In more detail, the plurality of grooves 111 formed on the top surface of the heat sink base 11 of the present invention mainly serve as Vortex generators. As shown by the lines with arrows in fig. 2, when the air flow enters the air flow channel between any two of the radiator fins 12, even if a so-called boundary layer is formed between each of the radiator fins 12 and the top surface of the heat sink base 11, the boundary layer is broken by the plurality of grooves 111, so that the air flow is converted into a vortex (vortex) at the broken boundary layer. For this reason, the plurality of grooves 111 may be regarded as a so-called vortex generating structure.
The following table (1) records the measurement results of the heat dissipation performance of two heat sink samples, wherein the sample a listed in table (1) is a conventional heat sink 1 '(as shown in fig. 1), and the top surface of the heat dissipation base 11' is a plane (flat surface). On the other hand, sample B listed in table (2) is the heat sink structure 1 of the present invention.
Watch (1)
As can be seen from table (1), the pressure difference between an airflow inflow side and an airflow outflow side of the heat sink structure 1 of the present invention is not significantly increased compared to the conventional heat sink (i.e., sample a). Meanwhile, it can be further known from the measured data of the maximum temperature, the minimum temperature and the average temperature that the heat sink structure 1 of the present invention shows better heat dissipation performance than the conventional heat sink 1' (as shown in fig. 1).
With continuing reference to fig. 3 and with simultaneous reference to fig. 4, a perspective view of another embodiment of the heat sink base 11 of the heat sink structure 1 of the present invention is shown. As can be seen from a close examination of fig. 3, fig. 3 shows that the cross-sectional shape of one side of the trench 111 is triangular. However, in practical embodiments, the present invention is not particularly limited to the shape of the side cross-section of the groove 111, and may be triangular, quadrangular, fan-shaped, or triangular with at least one arc side. For example, fig. 4 shows that the cross-sectional side view of the trench 111 is triangular with an arc side.
Continuing to refer to fig. 5, a perspective view of another embodiment of the plurality of cooling fins 12 of the heat sink structure 1 of the present invention is shown. As shown in fig. 5, in an implementation embodiment, a plurality of microstructures 121 may be further formed on both surfaces of each of the heat dissipation fins 12 for increasing the heat dissipation performance of each of the heat dissipation fins 12. Fig. 5 shows that each microstructure 121 is a half cylinder. However, in practical embodiments, the invention is not particularly limited to the aspect of the microstructure 121, which may be a semi-cylinder, a quadrangular prism or a triangular prism.
Second embodiment
Fig. 6 shows a perspective view of a second embodiment of a heat sink structure of the present invention, and fig. 7 shows an exploded perspective view of the second embodiment of the heat sink structure of the present invention. As in the first embodiment described above, the basic configuration of the second embodiment of the heat sink structure 1 includes: a heat sink base 11 and a plurality of heat sink fins 12. It should be noted that, in the second embodiment, at least one engaging groove 112 is formed on a bottom surface of the heat sink base 11, and each of the heat dissipating fins 12 has at least one through hole 122. So designed, at least one heat dissipation tube 13 can be added to the structure of the heat sink structure 1 and connect the heat dissipation base 11 and the plurality of heat dissipation fins 12 at the same time. As shown in fig. 6 and 7, the heat dissipation pipe 13 includes: a first section 131, a second section 132 and a connecting section 133; the first segment 131 is embedded in the embedding groove 112, the second segment 132 passes through the through hole 122 of each heat sink fin 12, and the connecting segment 133 connects the first segment 131 and the second segment 132.
Third embodiment
Fig. 8 shows a perspective view of a third embodiment of a heat sink structure of the present invention, and fig. 9 shows an exploded perspective view of the third embodiment of the heat sink structure of the present invention. As shown in fig. 8 and 9, the heat sink structure 1 of the present invention includes: a heat sink base 11 and a plurality of heat dissipation fins 12, wherein the plurality of heat dissipation fins 12 rise above a top surface of the heat sink base 11. Particularly, the present invention forms a plurality of recesses (processes) 114 on the top surface of the heat sink base 11, and the recesses 114 are located between the heat dissipation fins 12 and the heat sink base 11, so as to break a boundary layer formed at a connection position between each of the heat dissipation fins 12 and the heat sink base 11 during a heat dissipation process performed by the heat sink structure 1.
In more detail, the grooves 114 formed on the top surface of the heat sink base 11 of the present invention mainly serve as Vortex generators. As shown by the lines with arrows in fig. 8, when the air flow enters the air flow channel between any two of the radiator fins 12, even if a so-called boundary layer is formed between each of the radiator fins 12 and the top surface of the heat sink base 11, the boundary layer is broken by the plurality of grooves 114, so that the air flow is converted into a vortex (vortex) at the broken boundary layer. For this reason, the plurality of grooves 114 may be regarded as a so-called vortex generating structure.
With continuing reference to fig. 9 and with concurrent reference to fig. 10, a perspective view of another embodiment of the heat sink base 11 of the heat sink structure 1 of the present invention is shown. As can be seen from a close examination of FIG. 9, FIG. 9 shows that the cross-sectional shape of one side of the groove (Recess)114 is triangular. However, in practical embodiments, the present invention is not particularly limited to the shape of the side cross-sectional surface of the groove 114, and may be triangular, quadrangular, fan-shaped, or triangular with at least one curved side. For example, FIG. 10 illustrates the groove 114 as having a triangular cross-sectional side view with a curved side.
It should be emphasized that the above detailed description is specific to possible embodiments of the invention, but this is not to be taken as limiting the scope of the invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the invention are intended to be included within the scope of the invention.
Claims (10)
1. A heat sink structure, comprising:
a heat dissipation base; and
a plurality of heat dissipation fins erected on a top surface of the heat dissipation base;
the heat sink structure comprises a heat sink base, a plurality of heat dissipation fins and a plurality of grooves, wherein the heat sink base is provided with a plurality of grooves on the top surface, and the grooves are positioned between the heat dissipation fins and the heat sink base and used for destroying a boundary layer formed at the connection part of each heat dissipation fin and the heat sink base in the process of executing a heat dissipation work by the heat sink structure.
2. The heat sink structure as claimed in claim 1, wherein the groove has a cross-sectional shape of one side thereof selected from the group consisting of: triangular, tetragonal, fan-shaped, or triangular with at least one curved side.
3. The heat sink structure of claim 1, wherein a plurality of microstructures are formed on at least one surface of the heat sink fin, and the microstructures can be any one of the following: a semi-cylinder, a quadrangular prism, or a triangular prism.
4. The heat sink structure as claimed in claim 1, wherein a bottom surface of the heat sink base is formed with at least one engaging groove, and each of the heat dissipating fins has at least one through hole.
5. The heat sink structure as claimed in claim 4, further comprising at least one heat dissipation tube, wherein the heat dissipation tube comprises:
a first section embedded in the embedding groove;
a second section passing through the through hole of each heat dissipation fin; and
a connecting section connecting the first section and the second section.
6. A heat sink structure, comprising:
a heat dissipation base; and
a plurality of heat dissipation fins erected on a top surface of the heat dissipation base;
the heat sink structure comprises a heat sink base, a plurality of heat dissipation fins and a plurality of grooves, wherein the heat sink base is provided with a plurality of grooves on the top surface, and the grooves are positioned between the heat dissipation fins and the heat sink base and used for damaging a boundary layer formed at the connection part of each heat dissipation fin and the heat sink base in the process of executing a heat dissipation work by the heat sink structure.
7. The heat sink structure as claimed in claim 6, wherein the groove has a cross-sectional shape of any one of the following: triangular, tetragonal, fan-shaped, or triangular with at least one curved side.
8. The heat sink structure of claim 6, wherein a plurality of microstructures are formed on at least one surface of the heat sink fin, and the microstructures can be any one of the following: a semi-cylinder, a quadrangular prism, or a triangular prism.
9. The heat sink structure as claimed in claim 6, wherein a bottom surface of the heat sink base is formed with at least one engaging groove, and each of the heat dissipating fins has at least one through hole.
10. The heat sink structure as claimed in claim 9, further comprising at least one heat dissipation tube, wherein the heat dissipation tube comprises:
a first section embedded in the embedding groove;
a second section passing through the through hole of each heat dissipation fin; and
a connecting section connecting the first section and the second section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911011404.XA CN112698704A (en) | 2019-10-23 | 2019-10-23 | Heat sink structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911011404.XA CN112698704A (en) | 2019-10-23 | 2019-10-23 | Heat sink structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112698704A true CN112698704A (en) | 2021-04-23 |
Family
ID=75505037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911011404.XA Pending CN112698704A (en) | 2019-10-23 | 2019-10-23 | Heat sink structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112698704A (en) |
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2019
- 2019-10-23 CN CN201911011404.XA patent/CN112698704A/en active Pending
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