TWI727317B - Processing liquid discharging method and processing liquid discharging device - Google Patents

Processing liquid discharging method and processing liquid discharging device Download PDF

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TWI727317B
TWI727317B TW108116117A TW108116117A TWI727317B TW I727317 B TWI727317 B TW I727317B TW 108116117 A TW108116117 A TW 108116117A TW 108116117 A TW108116117 A TW 108116117A TW I727317 B TWI727317 B TW I727317B
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valve
speed
processing liquid
nozzle
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TW202004845A (en
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井上正史
深津英司
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日商斯庫林集團股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/40Distributing applied liquids or other fluent materials by members moving relatively to surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Abstract

提供一種處理液噴出方法,係能適當地停止從噴嘴噴出處理液,並可調整閥的動作期間。處理液噴出方法係具備有第一步驟以及第二步驟。第一步驟係從噴嘴噴出經由配管被供給至噴嘴的處理液。第二步驟係在停止從噴嘴噴出處理液時,使設置於配管的至少一個閥的閥體的移動速度或者變形速度之動作速度在閥的動作期間中變化。A method for discharging treatment liquid is provided, which can appropriately stop discharging treatment liquid from a nozzle and adjust the operation period of a valve. The processing liquid ejection method includes a first step and a second step. The first step is to eject the processing liquid supplied to the nozzle via the pipe from the nozzle. The second step is to change the movement speed of the valve body or the deformation speed of at least one valve provided in the piping during the operation period of the valve when the treatment liquid is stopped from the nozzle.

Description

處理液噴出方法以及處理液噴出裝置Treatment liquid spraying method and treatment liquid spraying device

本發明係有關於一種處理液噴出方法以及處理液噴出裝置。 The invention relates to a treatment liquid spraying method and a treatment liquid spraying device.

於專利文獻1係揭示有一種塗布液供給裝置,係從噴嘴將光阻(photoresist)液等塗布液供給至基板,並於基板上形成塗布被膜。該塗布液供給裝置係進行設置於與噴嘴連接的塗布液供給配管之開閉閥(在此為氣體作動閥)的開啟與閉鎖,藉此進行從噴嘴供給塗布液以及停止從噴嘴供給塗布液。在塗布液的塗布處理中,當於基板上產生塗布液的塗布不均時,膜厚會變成不均勻而對後續的步驟造成不良影響。 Patent Document 1 discloses a coating liquid supply device that supplies a coating liquid such as a photoresist liquid to a substrate from a nozzle, and forms a coating film on the substrate. The coating liquid supply device opens and closes an opening and closing valve (here, a gas-operated valve) provided in a coating liquid supply pipe connected to a nozzle, thereby performing supply of coating liquid from the nozzle and stopping the supply of coating liquid from the nozzle. In the coating process of the coating liquid, when uneven coating of the coating liquid occurs on the substrate, the film thickness becomes uneven, which adversely affects the subsequent steps.

在該塗布液供給裝置中,當從噴嘴正在進行塗布液的供給之狀態下以某種閉鎖速度將開閉閥閉鎖時,塗布液的噴出寬度係因應開閉閥的閉鎖速度而緩緩地變細,最後塗布液係在噴嘴前端與基板之間的某個位置斷絕。液體斷絕位置係因應開閉閥的閉鎖速度而變位。 In this coating liquid supply device, when the opening and closing valve is closed at a certain closing speed while the coating liquid is being supplied from the nozzle, the spray width of the coating liquid is gradually narrowed in accordance with the closing speed of the opening and closing valve. Finally, the coating liquid is cut off at a certain position between the tip of the nozzle and the substrate. The liquid cut-off position is changed according to the closing speed of the opening and closing valve.

該塗布液供給裝置係設置有吸回閥,並藉由吸回閥的動作進行倒吸(suck back),將比液體斷絕位置還上方的塗布液吸回至噴嘴。比液體斷絕位置還下方的塗布液係朝向基板的表面且成為細線狀並落下。此外,於塗布液的斷絕部分產生複數滴液滴,且比細線狀的塗布液還慢落下至基板。 The coating liquid supply device is provided with a suction valve, and sucks back by the action of the suction valve, sucking the coating liquid higher than the liquid shutoff position back to the nozzle. The coating liquid below the liquid shutoff position faces the surface of the substrate, becomes a thin line, and drops. In addition, a plurality of droplets are generated in the interrupted portion of the coating liquid, and they fall to the substrate more slowly than the thin linear coating liquid.

該塗布液供給裝置係以照相機拍攝並檢測噴嘴前端與基板之間的液體斷絕位置,並以在不會產生塗布不均的範圍存在液體斷絕位置 之方式調節開閉閥的閉鎖速度,藉此謀求防止塗布不均。 The coating liquid supply device uses a camera to photograph and detect the liquid cutoff position between the nozzle tip and the substrate, and the liquid cutoff position exists in a range where coating unevenness does not occur. In this way, the closing speed of the opening and closing valve is adjusted to prevent uneven coating.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

專利文獻1:日本特開2000-82646號公報。 Patent Document 1: Japanese Patent Application Laid-Open No. 2000-82646.

然而,在開閉閥的閉鎖期間中以略固定之方式控制開閉閥的閉鎖速度之情形中,該控制不一定最佳。具體而言,當將閉鎖速度決定成不會產生塗布不均的值時,由於因應閉鎖速度來決定閉鎖期間,因此無法以其他方式調整閉鎖期間。 However, in the case where the closing speed of the opening and closing valve is controlled in a slightly fixed manner during the closing period of the opening and closing valve, the control is not necessarily optimal. Specifically, when the blocking speed is determined to be a value that does not cause uneven coating, the blocking period is determined in accordance with the blocking speed, and therefore the blocking period cannot be adjusted in other ways.

因為各種原因而期望能調整閉鎖期間。作為一例,只要能縮短閉鎖期間,即能提升開閉閥的響應性。此外,原本就不一定期望閉鎖速度為固定。 It is expected that the lockout period can be adjusted for various reasons. As an example, as long as the lock period can be shortened, the responsiveness of the on-off valve can be improved. In addition, it is not necessarily expected that the locking speed is fixed.

因此,本發明的目的在於提供一種處理液噴出方法以及處理液噴出裝置,係能適當地停止從噴嘴噴出處理液,並可調整閥的動作期間。 Therefore, an object of the present invention is to provide a processing liquid ejection method and processing liquid ejection device, which can appropriately stop the ejection of the processing liquid from the nozzle and adjust the operation period of the valve.

處理液噴出方法的第一態樣為一種處理液噴出方法,係具備有:第一步驟,係從噴嘴噴出經由配管被供給至前述噴嘴的處理液;以及第二步驟,係在停止從前述噴嘴噴出處理液時,使設置於前述配管的至少一個閥的閥體的移動速度或者變形速度之動作速度在前述閥的動作期間中變化。 The first aspect of the processing liquid ejection method is a processing liquid ejection method, which includes: a first step of ejecting from a nozzle the processing liquid supplied to the nozzle via a pipe; and a second step of stopping the ejection from the nozzle When the treatment liquid is discharged, the movement speed or the deformation speed of the valve body of at least one valve provided in the pipe is changed during the operation period of the valve.

處理液噴出方法的第二態樣為在第一態樣的處理液噴出方法中,前述至少一個閥係包含有:開閉閥,係切換前述配管內的流路的開閉;當將關閉前述開閉閥時的前述動作速度定義成閉鎖速度時,在前述第 二步驟中,以將前述動作期間內的第一期間中的前述閉鎖速度設定成比前述動作期間內的前述第一期間還後面的第二期間中的前述閉鎖速度還高之方式控制前述開閉閥。 The second aspect of the process liquid ejection method is that in the process liquid ejection method of the first aspect, the aforementioned at least one valve system includes: an on-off valve that switches the opening and closing of the flow path in the pipe; when the on-off valve is to be closed When the aforementioned operating speed at the time is defined as the blocking speed, in the aforementioned first In the second step, the opening and closing valve is controlled so that the closing speed in the first period in the operation period is set to be higher than the closing speed in the second period after the first period in the operation period. .

處理液噴出方法的第三態樣為在第二態樣的處理液噴出方法中,前述開閉閥係氣體作動閥,用以因應從驅動機構所供給的氣體的壓力進行開閉;在前述第二步驟中,使與前述氣體的壓力對應之指示值在前述動作期間中階段性地更新,並依據前述指示值控制前述驅動機構,且在前述動作期間中使前述開閉閥的前述閉鎖速度變化。 The third aspect of the process liquid ejection method is that in the second aspect of the process liquid ejection method, the opening and closing valve is a gas-actuated valve for opening and closing in response to the pressure of the gas supplied from the drive mechanism; in the second step In this case, the indicator value corresponding to the pressure of the gas is updated step by step during the operation period, the drive mechanism is controlled based on the indicator value, and the closing speed of the on-off valve is changed during the operation period.

處理液噴出方法的第四態樣為在第三態樣的處理液噴出方法中,前述第二期間中的前述指示值的更新次數係比前述第一期間中的更新次數還多。 The fourth aspect of the processing liquid ejection method is that in the third aspect of the processing liquid ejection method, the number of updates of the indicator value in the second period is greater than the number of updates in the first period.

處理液噴出方法的第五態樣為在第一態樣至第四態樣的任一態樣的處理液噴出方法中,前述至少一個閥係包含有:氣體作動閥,係因應從驅動機構所供給的氣體的壓力進行開閉;在前述第二步驟中,針對前述氣體的壓力之屬於目標值的壓力指示值與前述氣體的壓力的測量值之間的差進行比例控制、比例積分控制或者比例積分微分控制並控制前述驅動機構,藉此控制前述動作速度。 The fifth aspect of the process liquid ejection method is that in the process liquid ejection method of any one of the first aspect to the fourth aspect, the aforementioned at least one valve system includes: a gas-actuated valve, which responds to the drive mechanism The pressure of the supplied gas is opened and closed; in the foregoing second step, proportional control, proportional integral control, or proportional integral control is performed on the difference between the pressure indicator value belonging to the target value of the gas pressure and the measured value of the gas pressure Derivative control and control of the aforementioned drive mechanism, thereby controlling the aforementioned movement speed.

處理液噴出方法的第六態樣為在第一態樣至第五態樣的任一態樣的處理液噴出方法中,前述至少一個閥係包含有:吸回閥,係在停止噴出處理液時吸回前述噴嘴內的處理液。 The sixth aspect of the processing liquid ejection method is that in the processing liquid ejection method of any one of the first aspect to the fifth aspect, the aforementioned at least one valve system includes: a suction valve, which stops the ejection of the processing liquid When sucking back the treatment liquid in the aforementioned nozzle.

處理液噴出方法的第七態樣為在第一態樣至第六態樣的任一態樣的處理液噴出方法中,前述至少一個閥係包含有:氣體作動閥,係因應從驅動機構所供給的氣體的壓力而動作;在前述第二步驟中,以直至前述氣體作動閥的前述閥體開始移動或者開始變形為止的非動作期間中的 前述氣體的壓力的變化速度變成比前述動作期間中的前述氣體的壓力的變化速度還高之方式控制前述驅動機構。 The seventh aspect of the process liquid ejection method is that in the process liquid ejection method of any one of the first aspect to the sixth aspect, the aforementioned at least one valve system includes: a gas-actuated valve, which responds to the drive mechanism The pressure of the supplied gas; in the second step, in the non-operating period until the valve body of the gas actuated valve starts to move or start to deform The driving mechanism is controlled so that the rate of change of the pressure of the gas becomes higher than the rate of change of the pressure of the gas during the operation period.

處理液噴出方法的第八態樣為在第一態樣至第七態樣的任一態樣的處理液噴出方法中,具備有:第三步驟,係在停止從前述噴嘴噴出處理液時,拍攝部從與前述噴嘴的噴出方向不同的方向拍攝前述噴嘴的前端部的流路;以及第四步驟,係依據在前述第三步驟中前述拍攝部所拍攝的原始影像進行預定的判定處理,藉此判定前述至少一個閥的前述動作速度是否適當。 The eighth aspect of the processing liquid ejection method is that the processing liquid ejection method of any one of the first aspect to the seventh aspect includes: the third step is when the ejection of the processing liquid from the aforementioned nozzle is stopped, The imaging section photographs the flow path of the tip portion of the nozzle from a direction different from the ejection direction of the nozzle; and the fourth step is to perform a predetermined determination process based on the original image captured by the imaging section in the third step, by This determines whether the aforementioned operating speed of the aforementioned at least one valve is appropriate.

處理液噴出方法的第九態樣為在第八態樣的處理液噴出方法中,前述至少一個閥係包含有:開閉閥,係切換前述配管內的流路的開閉;當將關閉前述開閉閥時的前述動作速度定義為閉鎖速度時,前述第四步驟係具備有下述步驟:針對前述原始影像中之與前述噴嘴的前端部的流路對應之第一影像區域的第一影像以及與從前述噴嘴的前端沿著處理液的噴出方向朝前方延伸之前述處理液的噴出路徑對應之第二影像區域的第二影像各者的影像,算出已與前述第一影像以及前述第二影像各者的影像中的前述處理液的影像的面積相應之預定的第一特徵量;以及將預定的第一判定規則應用於前述第一影像的前述第一特徵量與前述第二影像的前述第一特徵量,藉此判定前述閉鎖速度為以下何種區分:前述閉鎖速度為適當、或者是前述閉鎖速度為比適當的速度還高、或者是前述閉鎖速度為比適當的速度還低。 The ninth aspect of the processing liquid ejection method is that in the eighth aspect of the processing liquid ejection method, the aforementioned at least one valve system includes: an on-off valve that switches the opening and closing of the flow path in the piping; when the on-off valve is to be closed When the operating speed at the time is defined as the blocking speed, the fourth step includes the following steps: for the first image in the first image area corresponding to the flow path of the nozzle tip in the original image, and the slave The tip of the nozzle extends forward along the ejection direction of the processing liquid and corresponds to the second image of the second image area corresponding to the ejection path of the processing liquid, and calculates the image of each of the second image and the first image and the second image. The area of the image of the processing liquid in the image corresponds to a predetermined first feature amount; and applying a predetermined first determination rule to the first feature amount of the first image and the first feature amount of the second image Therefore, it is determined which of the following is the lock speed: the lock speed is appropriate, or the lock speed is higher than the appropriate speed, or the lock speed is lower than the appropriate speed.

處理液噴出方法的第十態樣為在第九態樣的處理液噴出方法中,前述第一判定規則係下述規則:當前述噴嘴的前端部的流路非為液密狀態時,判定成前述開閉閥的前述閉鎖速度比前述適當的速度還高;當前述噴嘴的前端部的流路為液密狀態且於前述噴出路徑存在有前述處理液 時,判定成前述閉鎖速度比前述適當的速度還低。 The tenth aspect of the process liquid ejection method is that in the ninth aspect of the process liquid ejection method, the first determination rule is the following rule: when the flow path at the tip of the nozzle is not in a liquid-tight state, it is determined The closing speed of the opening and closing valve is higher than the appropriate speed; when the flow path at the tip of the nozzle is in a liquid-tight state and the treatment liquid is present in the ejection path At this time, it is determined that the aforementioned locking speed is lower than the aforementioned appropriate speed.

處理液噴出方法的第十一態樣為在第八態樣的處理液噴出方法中,前述至少一個閥係包含有:開閉閥,係切換前述配管內的流路的開閉;當將關閉前述開閉閥時的前述動作速度定義為閉鎖速度時,在前述第四步驟中,依據前述原始影像中之前述噴嘴的前端部的流路以及從前述噴嘴的前端沿著處理液的噴出方向朝前方延伸之前述處理液的噴出路徑的影像,藉由分類器判定前述閉鎖速度的區分,前述分類器係判定前述閉鎖速度為以下何種區分:前述閉鎖速度為適當、或者是前述閉鎖速度為比適當的速度還高、或者是前述閉鎖速度為比適當的速度還低;前述分類器係使用前述原始影像中之前述噴嘴的前端部的流路以及前述噴出路徑的影像的取樣影像並預先藉由機械學習而生成。 The eleventh aspect of the processing liquid ejection method is that in the eighth aspect of the processing liquid ejection method, the at least one valve system includes: an on-off valve that switches the opening and closing of the flow path in the pipe; when the opening and closing are closed When the valve operation speed is defined as the lock speed, in the fourth step, the flow path of the nozzle tip in the original image and the flow path extending forward from the nozzle tip along the ejection direction of the processing liquid For the image of the ejection path of the treatment liquid, the classifier judges the distinction of the lock speed, and the classifier judges which of the following is the lock speed: the lock speed is appropriate, or the lock speed is faster than the appropriate speed It is still high, or the aforementioned blocking speed is lower than the appropriate speed; the aforementioned classifier uses the sampled image of the image of the flow path at the tip of the nozzle and the aforementioned ejection path in the original image, and is pre-built by mechanical learning generate.

處理液噴出方法的第十二態樣為在第十一態樣的處理液噴出方法中,在前述第四步驟中,依據前述原始影像中之與前述噴嘴的前端部的流路對應之第一影像區域的第一影像以及與前述噴出路徑對應之第二影像區域的第二影像各者的影像判定前述開閉閥的前述閉鎖速度的前述區分;前述分類器係使用前述第一影像與前述第二影像各者的取樣影像並預先藉由機械學習而生成。 The twelfth aspect of the processing liquid ejection method is that in the eleventh aspect of the processing liquid ejection method, in the foregoing fourth step, the flow path corresponding to the tip of the nozzle in the original image is based on the first The first image of the image area and the second image of the second image area corresponding to the ejection path determine the distinction of the locking speed of the opening and closing valve; the classifier uses the first image and the second image Sampling images of each image are generated in advance by mechanical learning.

處理液噴出方法的第十三態樣為在第九態樣、第十態樣或者第十二態樣的處理液噴出方法中,前述處理液的噴出方向的下游側中的前述第一影像區域的端部係從前述噴嘴的前端離開至前述處理液的噴出方向的上游側。 The thirteenth aspect of the processing liquid ejection method is that in the processing liquid ejection method of the ninth, tenth, or twelfth aspect, the first image area in the downstream side of the ejection direction of the processing liquid The end of is separated from the tip of the nozzle to the upstream side in the ejection direction of the processing liquid.

處理液噴出方法的第十四態樣為在第八態樣至第十三態樣的任一態樣的處理液噴出方法中,前述至少一個閥係包含有:吸回閥,係在停止噴出處理液時吸回前述噴嘴內的處理液,使前述處理液的端面位置 從前述噴嘴的前端遠離;前述第四步驟係具備有下述步驟:針對前述原始影像中之與前述處理液的前述端面位置與前述噴嘴的前端之間的流路的至少一部分對應之第三影像區域的第三影像,算出已與前述處理液的影像的面積相應之預定的第二特徵量;以及將預定的第二判定規則應用於前述第三影像的前述第二特徵量,藉此判定前述吸回閥的前述動作速度為以下何種區分:前述吸回閥的前述動作速度為適當、或者是前述吸回閥的前述動作速度為比適當的速度還高。 The fourteenth aspect of the processing liquid ejection method is the processing liquid ejection method of any one of the eighth aspect to the thirteenth aspect, and the aforementioned at least one valve system includes: a suction valve, which stops the ejection When processing liquid, suck back the processing liquid in the nozzle to make the end face position of the processing liquid Keep away from the tip of the nozzle; the fourth step includes the following step: for a third image corresponding to at least a part of the flow path between the end face position of the processing liquid and the tip of the nozzle in the original image For the third image of the region, a predetermined second feature quantity corresponding to the area of the image of the processing liquid is calculated; and a predetermined second determination rule is applied to the second feature quantity of the third image, thereby determining the aforementioned The operation speed of the suction valve is divided into the following: the operation speed of the suction valve is appropriate, or the operation speed of the suction valve is higher than the appropriate speed.

處理液噴出方法的第十五態樣為在第十四態樣的處理液噴出方法中,前述第二判定規則係於前述處理液的前述端面位置與前述噴嘴的前端之間的流路的至少一部分殘存有處理液時,判定成前述吸回閥的前述動作速度比前述適當的速度還高。 The fifteenth aspect of the processing liquid ejection method is that in the fourteenth aspect of the processing liquid ejection method, the second determination rule is based on at least the flow path between the end face position of the processing liquid and the tip of the nozzle When a part of the treatment liquid remains, it is determined that the operating speed of the suction valve is higher than the appropriate speed.

處理液噴出方法的第十六態樣為在第八態樣至第十三態樣的任一態樣的處理液噴出方法中,前述至少一個閥係包含有:吸回閥,係在停止噴出處理液時吸回前述噴嘴內的處理液,使前述處理液的端面位置從前述噴嘴的前端遠離;在前述第四步驟中,依據前述原始影像中之與前述處理液的前述端面位置與前述噴嘴的前端之間的流路的至少一部分對應之第三影像區域的第三影像,藉由分類器判定前述吸回閥的動作速度的區分,前述分類器係判定前述吸回閥的前述動作速度為以下何種區分:前述吸回閥的前述動作速度為適當、或者是前述吸回閥的前述動作速度為比適當的速度還高;前述分類器係使用前述第三影像的取樣影像並預先藉由機械學習而生成。 The sixteenth aspect of the processing liquid ejection method is in the processing liquid ejection method of any one of the eighth aspect to the thirteenth aspect, the aforementioned at least one valve system includes: a suction valve, which stops the ejection When processing the liquid, suck back the processing liquid in the nozzle to make the position of the end surface of the processing liquid away from the tip of the nozzle; in the fourth step, according to the original image and the position of the end surface of the processing liquid and the nozzle At least a part of the flow path between the front ends of the corresponding to the third image of the third image area, the classification of the operation speed of the suction valve is determined by the classifier, and the classifier determines that the operation speed of the suction valve is Which one of the following distinctions is made: the aforementioned movement speed of the aforementioned suction valve is appropriate, or the aforementioned movement speed of the aforementioned suction valve is higher than the proper speed; the aforementioned classifier uses the sampling image of the aforementioned third image and preliminarily Generated by mechanical learning.

處理液噴出方法的第十七態樣為在第八態樣至第十六態樣的任一態樣的處理液噴出方法中,在前述第三步驟中,停止從前述噴嘴噴出處理液後,前述拍攝部係時間性地依序拍攝前述噴嘴的前端部的流路; 前述第四步驟係具備有下述步驟:將前述拍攝部所拍攝的複數個原始影像予以平均或者積算並生成派生影像;以及依據前述派生影像判定前述至少一個閥的前述動作速度是否適當。 The seventeenth aspect of the processing liquid ejection method is the processing liquid ejection method of any one of the eighth aspect to the sixteenth aspect. In the third step, after stopping the ejection of the processing liquid from the nozzle, The photographing unit photographs the flow path of the tip of the nozzle sequentially in time; The fourth step includes the following steps: averaging or accumulating a plurality of original images shot by the shooting unit to generate a derivative image; and determining whether the operating speed of the at least one valve is appropriate based on the derivative image.

處理液噴出方法的第十八態樣為在第八態樣至第十七態樣的任一態樣的處理液噴出方法中,進一步具備有:第五步驟,係依據在前述第四步驟中所判定的前述至少一個閥的前述動作速度是否適當,以前述動作速度變成前述適當的速度之方式調整前述第一步驟中的前述至少一個閥的動作。 The eighteenth aspect of the process liquid ejection method is the process liquid ejection method of any one of the eighth aspect to the seventeenth aspect, and further includes: a fifth step, based on the foregoing fourth step It is determined whether the operation speed of the at least one valve is appropriate, and the operation of the at least one valve in the first step is adjusted so that the operation speed becomes the appropriate speed.

處理液噴出裝置的態樣為一種處理液噴出裝置,係具備有:噴嘴,係噴出處理液;配管,係連接前述噴嘴與處理液供給源,將來自前述處理液供給源的處理液導引至前述噴嘴;至少一個閥,係設置於前述配管;以及控制部,係在停止從前述噴嘴噴出處理液時,使前述至少一個閥的閥體的移動速度或者變形速度之動作速度在前述至少一個閥的動作期間中變化。 The aspect of the processing liquid ejection device is a processing liquid ejection device, which is provided with: a nozzle for ejecting the processing liquid; a pipe connecting the nozzle and the processing liquid supply source to guide the processing liquid from the processing liquid supply source to The nozzle; at least one valve provided in the piping; and a control unit for making the movement speed or deformation speed of the valve body of the at least one valve at the operating speed of the at least one valve when the processing liquid is stopped from the nozzle The action period changes.

依據處理液噴出方法的第一態樣以及處理液噴出裝置的態樣,能良好地設定停止噴出時的噴嘴前端狀態,並能獨立地調整動作期間。 According to the first aspect of the process liquid ejection method and the aspect of the process liquid ejection device, the nozzle tip state when the ejection is stopped can be set well, and the operation period can be independently adjusted.

依據處理液噴出方法的第二態樣,能以停止噴出時的噴嘴前端狀態變成良好之方式設定容易對停止噴出時的噴嘴前端狀態造成影響的第二期間的閉鎖速度。此外,由於將第一期間中的閉鎖速度設定成比第二期間還高,因此能縮短動作期間。換言之,能良好地設定噴嘴前端狀態並能提升開閉閥的響應性。 According to the second aspect of the process liquid ejection method, the blocking speed of the second period that is likely to affect the nozzle end state when the ejection is stopped can be set so that the state of the nozzle tip when the ejection is stopped becomes good. In addition, since the locking speed in the first period is set to be higher than that in the second period, the operation period can be shortened. In other words, the nozzle tip state can be set well and the responsiveness of the on-off valve can be improved.

依據處理液噴出方法的第三樣態,能簡單地控制動作速度。 According to the third aspect of the processing liquid ejection method, the operation speed can be easily controlled.

依據處理液噴出方法的第四態樣以及第五態樣,在容易對停 止噴出時的噴嘴前端狀態造成影響的第二期間中,能更精細地調整氣體的壓力的變化速度,從而能調整開閉閥的閉鎖速度。 According to the fourth aspect and the fifth aspect of the treatment liquid ejection method, it is easy to stop In the second period in which the nozzle tip state at the time of stopping ejection affects, the change speed of the gas pressure can be adjusted more finely, and the closing speed of the on-off valve can be adjusted.

依據處理液噴出方法的第六態樣,使動作速度變化,藉此有助於實現良好的噴嘴前端狀態。 According to the sixth aspect of the processing liquid ejection method, the operation speed is changed, thereby contributing to achieving a good nozzle tip state.

依據處理液噴出方法的第七態樣,能縮短從閥的控制開始至閥的動作結束為止的閥控制期間。換言之,能提升閥的響應性。 According to the seventh aspect of the process liquid ejection method, the valve control period from the start of valve control to the end of valve operation can be shortened. In other words, the responsiveness of the valve can be improved.

依據處理液噴出方法的第八態樣,於原始影像反映有已與閥的動作速度相應之噴嘴前端狀態的變動。由於依據此種原始影像判定動作速度是否適當,因此能以高的判定精度判定動作速度是否適當。 According to the eighth aspect of the process liquid ejection method, the original image reflects the change in the state of the nozzle tip corresponding to the valve operating speed. Since it is determined whether the motion speed is appropriate based on such original images, it is possible to determine whether the motion speed is appropriate with high determination accuracy.

依據處理液噴出方法的第九態樣以及第十態樣,於第一影像以及第二影像反映有已與開閉閥的閉鎖速度相應之噴嘴前端狀態的變動。 由於針對此種第一影像與第二影像個別地檢測處理液的影像的存在並判定開閉閥的閉鎖速度的區分,因此能以高的判定精度判定閉鎖速度的區分。 According to the ninth aspect and the tenth aspect of the process liquid ejection method, the first image and the second image reflect the change of the nozzle tip state corresponding to the closing speed of the opening and closing valve. Since the presence of the image of the treatment liquid is individually detected for the first image and the second image and the distinction of the closing speed of the on-off valve is determined, the distinction of the closing speed can be determined with high determination accuracy.

依據處理液噴出方法的第十一態樣,於噴嘴的前端部的流路以及噴出路徑的影像反映有已與開閉閥的閉鎖速度相應之噴嘴前端狀態的變動。由於藉由使用了此種影像之學習判定閉鎖速度的區分,因此判定的精度高。 According to the eleventh aspect of the process liquid ejection method, the image of the flow path and the ejection path at the tip of the nozzle reflects the change in the state of the nozzle tip corresponding to the closing speed of the opening and closing valve. Since the classification of the locking speed is determined by learning using this kind of image, the accuracy of the determination is high.

依據處理液噴出方法的第十二態樣,於第一影像以及第二影像反映有已與開閉閥的閉鎖速度相應之噴嘴前端狀態的變動。由於分類器係能針對此種第一影像與第二影像的每個影像學習影像與開閉閥的閉鎖速度的區分之間的關係,因此能提升分類器的判定精度。 According to the twelfth aspect of the processing liquid ejection method, the first image and the second image reflect the change of the nozzle tip state corresponding to the closing speed of the opening and closing valve. Since the classifier can learn the relationship between the distinction between the image and the locking speed of the opening and closing valve for each of the first image and the second image, the determination accuracy of the classifier can be improved.

依據處理液噴出方法的第十三態樣,不將噴出方向的下游側中之從第一影像區域的端部遍及至噴嘴的前端之影像區域的影像使用於開閉閥的閉鎖速度的區分的判定。該影像區域係難以特定處理液的存在與開 閉閥的閉鎖速度之間的關係之區域。因此,能進一步地提升判定的精度。 According to the thirteenth aspect of the processing liquid ejection method, the image of the image area from the end of the first image area to the tip of the nozzle in the downstream side of the ejection direction is not used for the discrimination of the closing speed of the opening and closing valve. . The image area is difficult to specify the existence and development of the processing liquid. The area of the relationship between the closing speed of the closing valve. Therefore, the accuracy of the determination can be further improved.

依據處理液噴出方法的第十四態樣,於第三影像反映有已與吸回閥的動作速度相應之噴嘴前端狀態的變動。由於依據此種第三影像內的處理液的存在判定吸回閥的動作速度的區分,因此能適當地判定動作速度的區分。 According to the fourteenth aspect of the process liquid ejection method, the third image reflects the change in the nozzle tip state corresponding to the operating speed of the suction valve. Since the classification of the operating speed of the suction valve is determined based on the presence of the processing liquid in the third image, the classification of the operating speed can be appropriately determined.

依據處理液噴出方法的第十五態樣,能適當地判定動作速度的區分。 According to the fifteenth aspect of the processing liquid ejection method, the distinction of the operating speed can be appropriately determined.

依據處理液噴出方法的第十六態樣,於第三影像反映有已與吸回閥的動作速度相應之噴嘴前端狀態的變動。由於藉由使用了此種第三影像的學習判定動作速度的區分,因此判定的精度高。 According to the sixteenth aspect of the process liquid ejection method, the third image reflects the change in the state of the nozzle tip corresponding to the operating speed of the suction valve. Since the classification of the movement speed is determined by learning using such a third image, the accuracy of the determination is high.

依據處理液噴出方法的第十七態樣,由於派生影像包含有處理液的存在態樣的時間性的變化,因此能提升判定精度。 According to the seventeenth aspect of the processing liquid ejection method, since the derivative image includes a temporal change in the state of the processing liquid, the determination accuracy can be improved.

依據處理液噴出方法的第十八態樣,能將閥的動作速度調整至適當的值。 According to the eighteenth aspect of the process liquid ejection method, the valve operating speed can be adjusted to an appropriate value.

1、1A、1B:基板處理單元(處理液噴出裝置) 1, 1A, 1B: substrate processing unit (processing liquid ejection device)

7、7A:處理液供給部 7, 7A: Treatment liquid supply part

10:基板處理裝置群 10: Substrate processing equipment group

11:CPU 11: CPU

12:壓力設定部 12: Pressure setting section

13:控制訊號生成部 13: Control signal generation part

14:判定部 14: Judgment Department

15:特徵量算出部 15: Feature calculation section

16:規定基礎判定部 16: Prescribed Basic Judgment Department

17:影像生成部 17: Image Generation Department

18:機械學習部 18: Mechanical Learning Department

21:通訊部 21: Ministry of Communications

22:網路 22: Internet

23:伺服器 23: server

29:匯流排線 29: Bus line

50:攝影對象區域 50: Photography subject area

51、53:內部區域 51, 53: internal area

52:前方區域 52: Front area

65:照相機(拍攝部) 65: Camera (Photography Department)

71、71A:開閉閥 71, 71A: On-off valve

71a、72a:驅動空間 71a, 72a: drive space

71a1、72a1:彈性空間 71a1, 72a1: flexible space

71a2、72a2:氣體供給空間 71a2, 72a2: gas supply space

71b、72b2:流路空間 71b, 72b2: Flow path space

72、72A:吸回閥 72, 72A: suction valve

72b:閥箱空間 72b: Valve box space

72b1:非流路空間 72b1: Non-flow path space

73、743、744、753、754:配管 73, 743, 744, 753, 754: piping

74、74A、75、75A:驅動機構 74, 74A, 75, 75A: drive mechanism

76:處理液供給源 76: Treatment liquid supply source

100:基板處理裝置 100: Substrate processing device

110:索引區 110: Index area

111:承載器台 111: Carrier table

120:處理區 120: Treatment area

121:腔室(框體) 121: Chamber (frame)

122:搬入搬出口 122: Moving in and out

130、130B、130C:控制部 130, 130B, 130C: control section

131:減法器 131: Subtractor

132:PID控制部 132: PID control unit

133:比較部 133: Comparison Department

140、141、142:控制板 140, 141, 142: control panel

151:顯示部 151: Display

152:輸入部 152: Input Department

161:磁碟 161: Disk

162:ROM 162: ROM

163:RAM 163: RAM

200:處理部 200: Processing Department

221:自轉夾具 221: Rotation Fixture

251:噴嘴 251: Nozzle

252:前端 252: front end

300:速度判定裝置(判定裝置) 300: Speed judging device (judging device)

710、720:閥本體 710, 720: valve body

711、721:閥體 711, 721: valve body

712、722:區隔板 712, 722: District divider

713、723:彈性體 713, 723: elastomer

714、724:連結部 714, 724: connecting part

716:閥座 716: Valve seat

717、727:馬達 717, 727: Motor

741、742、751、752:電磁閥 741, 742, 751, 752: solenoid valve

745、755:氣體供給源 745, 755: gas supply source

746、756:壓力感測器 746, 756: pressure sensor

A、B、C、D:區域 A, B, C, D: area

A1:假想線 A1: imaginary line

AR1:噴出方向 AR1: Spray direction

Bx1、Bx2:容器部 Bx1, Bx2: Container Department

C1:承載器 C1: Carrier

CR:搬運機器人 CR: Handling robot

D*:能率指示值 D*: Energy rate indication value

G0:影像(原始影像) G0: Image (original image)

G1:第一影像 G1: The first image

G2:第二影像 G2: Second image

G3:第三影像 G3: Third image

G10、G11、G12、G13:派生影像(影像) G10, G11, G12, G13: Derived images (images)

GI、Gk:影像 GI, Gk: image

H1、H2:氣體 H1, H2: gas

IR:基板搬運裝置(移載機器人) IR: substrate handling device (transfer robot)

K1:判定規則 K1: Judgment rules

K2:分類器 K2: classifier

L1:處理液 L1: Treatment liquid

L2:液滴 L2: droplet

NN1:類神經網路 NN1: Neural Network

P:基板授受位置 P: Substrate accepting position

P1*、P2*:壓力指示值(目標值) P1*, P2*: pressure indication value (target value)

p1、p2:預定值 p1, p2: predetermined value

P1[0]至P1[5]、P2[0]、P1[i]:值 P1[0] to P1[5], P2[0], P1[i]: Value

PL1、PL2、PH1、PH2:基準值 PL1, PL2, PH1, PH2: reference value

PG:程式 PG: Program

Pm1、Pm2:測量值 Pm1, Pm2: measured value

Px1、Px2:區隔部 Px1, Px2: compartment

t10至t13、t20至t22:時間點 t10 to t13, t20 to t22: time point

T1、T21:前期間 T1, T21: previous period

T2、T22:後期間 T2, T22: Later period

Ta1、Ta2:閥控制期間 Ta1, Ta2: During valve control

Tb1、Tb2:非動作期間 Tb1, Tb2: Non-operating period

Tc1:閉鎖期間 Tc1: during lockout

Tc2:動作期間 Tc2: During operation

TG1:流路 TG1: Flow path

TG2:噴出路徑 TG2: ejection path

Vx1、Vx2:閥箱部 Vx1, Vx2: Valve box part

W:基板 W: substrate

△t1、△t2、△t21、△t22:時間 △t1, △t2, △t21, △t22: time

△P:差 △P: Poor

圖1係用以概略性地顯示基板處理裝置的構成的一例之概略俯視圖。 FIG. 1 is a schematic plan view for schematically showing an example of the structure of a substrate processing apparatus.

圖2係用以概略性地顯示基板處理單元的構成的一例之圖。 FIG. 2 is a diagram for schematically showing an example of the structure of the substrate processing unit.

圖3係概略性地顯示開閉閥的構成的一例之剖視圖。 Fig. 3 is a cross-sectional view schematically showing an example of the structure of the on-off valve.

圖4係概略性地顯示吸回閥的構成的一例之剖視圖。 Fig. 4 is a cross-sectional view schematically showing an example of the structure of the suction valve.

圖5係用以顯示停止噴出時的噴嘴前端狀態與閉鎖速度之間的關係的一例之圖。 Fig. 5 is a diagram showing an example of the relationship between the nozzle tip state and the closing speed when the ejection is stopped.

圖6係用以顯示壓力指示值與壓力的測量值的一例之圖表。 Fig. 6 is a graph showing an example of pressure indication value and pressure measurement value.

圖7係用以顯示壓力設定部的動作的一例之流程圖。 Fig. 7 is a flowchart showing an example of the operation of the pressure setting unit.

圖8係用以顯示壓力指示值與壓力的測量值的一例之圖表。 Fig. 8 is a graph showing an example of the pressure indication value and the pressure measurement value.

圖9係用以顯示壓力指示值與壓力的測量值的一例之圖表。 Fig. 9 is a graph showing an example of the pressure indication value and the pressure measurement value.

圖10係用以顯示壓力設定部的動作的一例之流程圖。 Fig. 10 is a flowchart showing an example of the operation of the pressure setting unit.

圖11係用以顯示壓力指示值與壓力的測量值的一例之圖表。 Fig. 11 is a graph showing an example of pressure indication value and pressure measurement value.

圖12係用以概略性地顯示控制部的內部構成的一例之功能方塊圖。 Fig. 12 is a functional block diagram for schematically showing an example of the internal structure of the control unit.

圖13係用以顯示壓力指示值與壓力的測量值的一例之圖表。 Fig. 13 is a graph showing an example of the pressure indication value and the pressure measurement value.

圖14係用以顯示壓力指示值與壓力的測量值的一例之圖表。 Fig. 14 is a graph showing an example of the pressure indication value and the pressure measurement value.

圖15係用以顯示壓力指示值與壓力的測量值的一例之圖表。 Fig. 15 is a graph showing an example of the pressure indication value and the pressure measurement value.

圖16係用以顯示壓力指示值與壓力的測量值的一例之圖表。 Fig. 16 is a graph showing an example of pressure indication value and pressure measurement value.

圖17係用以顯示壓力指示值與壓力的測量值的一例之圖表。 Fig. 17 is a graph showing an example of pressure indication value and pressure measurement value.

圖18係用以概略性地顯示基板處理單元的構成的一例之圖。 FIG. 18 is a diagram for schematically showing an example of the configuration of the substrate processing unit.

圖19係用以概略性地顯示基板處理單元的構成的一例之圖。 FIG. 19 is a diagram for schematically showing an example of the configuration of the substrate processing unit.

圖20係用以概略性地顯示控制部的內部構成的一例之圖。 FIG. 20 is a diagram for schematically showing an example of the internal structure of the control unit.

圖21係用以顯示基板處理單元的動作的一例之流程圖。 FIG. 21 is a flowchart for showing an example of the operation of the substrate processing unit.

圖22係用以以圖表形式顯示停止噴出時的噴嘴前端狀態與開閉閥的閉鎖速度的區分之間的關係的一例之圖。 FIG. 22 is a diagram for graphically showing an example of the relationship between the nozzle tip state when the ejection is stopped and the closing speed of the on-off valve.

圖23係用以概略性地顯示控制部的內部構成的一例之圖。 FIG. 23 is a diagram for schematically showing an example of the internal structure of the control unit.

圖24係用以顯示基板處理單元的動作的一例之流程圖。 FIG. 24 is a flowchart for showing an example of the operation of the substrate processing unit.

圖25係用以以圖表形式顯示停止噴出時的噴嘴前端狀態與開閉閥的閉鎖速度的區分之間的關係的一例之圖。 FIG. 25 is a diagram for graphically showing an example of the relationship between the nozzle tip state when the ejection is stopped and the division of the closing speed of the opening and closing valve.

圖26係用以顯示類神經網路(neural network)的模型(model)的一例之示意圖。 FIG. 26 is a schematic diagram showing an example of a model of a neural network.

圖27係用以以圖表形式顯示停止噴出時的噴嘴前端狀態與吸回閥的動作速度的區分之間的關係的一例之圖。 FIG. 27 is a diagram for graphically showing an example of the relationship between the state of the nozzle tip when the ejection is stopped and the operation speed of the suction valve.

圖28係用以顯示基板處理單元的動作的一例之流程圖。 FIG. 28 is a flowchart for showing an example of the operation of the substrate processing unit.

圖29係用以示意性地顯示控制部的其他實施形態的構成例之圖。 Fig. 29 is a diagram schematically showing a configuration example of another embodiment of the control unit.

圖30係用以示意性地顯示控制部的另一個其他實施形態的構成例之圖。 Fig. 30 is a diagram schematically showing a configuration example of another embodiment of the control unit.

以下,一邊參照圖式一邊說明實施形態。以下的實施形態係基板處理裝置的一例,並非是用以限定基板處理裝置的技術性範圍之事例。此外,在以下所參照的各圖中,為了容易理解,會有將各個部位的尺寸以及數量誇張化或簡略化地描繪之情形。此外,在各圖中,於具有同樣的構成以及功能的部分附上相同的元件符號,且在以下說明中省略重複的說明。上下方向係鉛直方向,且相對於自轉夾具(spin chuck)之基板側為上方。 Hereinafter, the embodiment will be described with reference to the drawings. The following embodiment is an example of a substrate processing apparatus, and is not an example for limiting the technical scope of the substrate processing apparatus. In addition, in the drawings referred to below, for ease of understanding, the size and number of each part may be exaggerated or simplified. In addition, in each figure, the same reference number is attached|subjected to the part which has the same structure and function, and the overlapping description is abbreviate|omitted in the following description. The up-down direction is the vertical direction, and is upward with respect to the substrate side of the spin chuck.

(第一實施形態) (First Embodiment)

(1)基板處理裝置100的構成 (1) Configuration of substrate processing apparatus 100

參照圖1說明基板處理裝置100的構成。圖1係用以概略性地顯示基板處理裝置100的構成的一例之俯視圖。基板處理裝置100係具備有基板處理單元1。 The configuration of the substrate processing apparatus 100 will be described with reference to FIG. 1. FIG. 1 is a plan view for schematically showing an example of the structure of a substrate processing apparatus 100. As shown in FIG. The substrate processing apparatus 100 includes a substrate processing unit 1.

基板處理裝置100係用以處理半導體晶圓等複數片基板W之系統。基板W的表面形狀係略圓形。基板處理裝置100係具備有複數個基板處理單元1。基板處理裝置100係能在各個基板處理單元1中逐片且連續地處理基板W,並能藉由複數個基板處理單元1並行地處理複數個基板W。 The substrate processing apparatus 100 is a system for processing a plurality of substrates W such as semiconductor wafers. The surface shape of the substrate W is slightly circular. The substrate processing apparatus 100 includes a plurality of substrate processing units 1. The substrate processing apparatus 100 can process the substrates W piece by piece and continuously in each substrate processing unit 1, and can process a plurality of substrates W in parallel by the plurality of substrate processing units 1.

基板處理裝置100係具備有並排設置的複數個複數個區(處理區塊),具體而言具備有索引區(indexer cell)110、處理區120以及控制部130,控制部130係控制索引區110以及處理區120所具備的各個動作機構等。 The substrate processing apparatus 100 is provided with a plurality of areas (processing blocks) arranged side by side, and specifically includes an indexer cell 110, a processing area 120, and a control unit 130. The control unit 130 controls the index area 110 And various action mechanisms included in the processing area 120 and so on.

<索引區110> <Index area 110>

索引區110係下述區:用以將從裝置外部接取之未處理的基板W傳遞至處理區120,並將從處理區120接取之未處理的基板W搬出至裝置外部。索引區110係具備有:承載器台(carrier stage)111,係載置複數個承載器(carrier)C1;以及基板搬運裝置(亦即移載機器人)IR,係進行基板W相對於各個承載器C1之搬入以及搬出。 The index area 110 is an area for transferring the unprocessed substrate W received from the outside of the device to the processing area 120, and transporting the unprocessed substrate W received from the processing area 120 to the outside of the device. The index area 110 is provided with: a carrier stage 111 for placing a plurality of carriers (carrier) C1; and a substrate transport device (ie, transfer robot) IR for performing the substrate W relative to each carrier Move in and move out of C1.

藉由OHT(Overhead Hoist Transfer;懸吊式輸送裝置)等從裝置外部搬入已收容了複數個未處裡的基板W之承載器C1並載置於承載器台111。未處理的基板W係從承載器C1被逐片地取出並在裝置內部進行處理,且已結束裝置內部的處理之處理完畢的基板W係再次被收容至承載器C1。收容有處理完畢的基板W之承載器C1係被OHT等搬出至裝置外部。如此,承載器台111係作為用以層疊未處理的基板W以及處理完畢的基板W之基板層疊部而發揮作用。此外,作為承載器C1的形態,可為用以將基板W收容至密閉空間之FOUP(Front Opening Unified Pod;前開式晶圓傳送盒),亦可為SMIF(Standard Mechanical Inter Face;標準製造介面)盒,或亦可為已收容的基板W與外氣接觸之OC(Open Cassette;開啟式晶圓匣)。 The carrier C1 that has accommodated a plurality of substrates W is carried in from the outside of the apparatus by OHT (Overhead Hoist Transfer) or the like, and is placed on the carrier table 111. Unprocessed substrates W are taken out piece by piece from the carrier C1 and processed inside the device, and the processed substrates W that have finished processing inside the device are again housed in the carrier C1. The carrier C1 accommodating the processed substrate W is carried out to the outside of the device by OHT or the like. In this way, the carrier stage 111 functions as a substrate stacking section for stacking the unprocessed substrate W and the processed substrate W. In addition, as the form of the carrier C1, it can be a FOUP (Front Opening Unified Pod; front opening wafer transfer box) for storing the substrate W in a closed space, or it can be a SMIF (Standard Mechanical Inter Face; standard manufacturing interface) The box may also be an OC (Open Cassette) in which the contained substrate W is in contact with the outside air.

移載機器人IR係具備有:複數個手部(例如四個),係從下方支撐基板W,藉此可以水平姿勢(基板W的主表面為水平的姿勢)保持基板W;以及複數個臂部,係分別移動複數個手部。移載機器人IR係從已載置於承載器台111之承載器C1取出未處理的基板W,並在基板授受位置P中將取出的基板W傳遞至搬運機器人CR(容後述)。此外,移載機器人IR係在基板授受位置P中從搬運機器人CR接取處理完畢的基板W,並將接取的基板W收容於已載置在承載器台111上的承載器C1。移載機器人IR係能同時使用複數個手部並進行基板W的授受。 The transfer robot IR system is equipped with: a plurality of hands (for example, four), which support the substrate W from below, whereby the substrate W can be held in a horizontal posture (the main surface of the substrate W is a horizontal posture); and a plurality of arms , Department of moving multiple hands respectively. The transfer robot IR takes out the unprocessed substrate W from the carrier C1 that has been placed on the carrier table 111, and transfers the taken out substrate W to the transfer robot CR (described later) in the substrate transfer position P. In addition, the transfer robot IR receives the processed substrate W from the transfer robot CR in the substrate transfer position P, and stores the received substrate W in the carrier C1 that has been placed on the carrier table 111. The IR system of the transfer robot can simultaneously use multiple hands and transfer substrates W.

<處理區120> <Processing area 120>

處理區120係用以對基板W進行處理之區。處理區120係具備有:複數個基板處理單元1;以及搬運機器人CR,係對複數個基板處理單元1進行基板W的搬入以及搬出。搬運機器人CR與控制部130係基板搬運裝置。在此,複數個(例如為三個)基板處理單元1係於鉛直方向被層疊,並構成一個基板處理裝置群10。而且,複數個(在圖式的例子中為四個)基板處理裝置群10係以圍繞搬運機器人CR之方式設置成群組(cluster)狀(房狀)。因此,複數個基板處理單元1係分別配置於搬運機器人CR的周圍。基板處理單元1係藉由自轉夾具以可接觸以及解除接觸之方式保持已配置於未圖示的自轉夾具的上側(鉛直方向的上側)之基板,並一邊以預定的旋轉軸為中心使自轉夾具旋轉,一邊對基板進行預定的處理(例如藥液處理、清洗(rinse)處理或者乾燥處理等)。 The processing area 120 is an area for processing the substrate W. The processing area 120 is provided with a plurality of substrate processing units 1 and a transfer robot CR, which carries in and unloads the substrates W to and from the plurality of substrate processing units 1. The transfer robot CR and the control unit 130 are substrate transfer devices. Here, a plurality of (for example, three) substrate processing units 1 are stacked in the vertical direction, and constitute one substrate processing apparatus group 10. In addition, a plurality of (four in the example of the drawing) substrate processing apparatus group 10 is arranged in a cluster shape (house shape) so as to surround the transfer robot CR. Therefore, a plurality of substrate processing units 1 are respectively arranged around the transfer robot CR. The substrate processing unit 1 holds the substrate arranged on the upper side (upper side in the vertical direction) of the unshown autorotating jig in a contactable and contact-releasable manner by the autorotating jig, and the autorotating jig is centered on a predetermined rotation axis. While rotating, the substrate is subjected to predetermined processing (for example, chemical solution processing, rinse processing, or drying processing, etc.).

搬運機器人CR係用以一邊單邊地支撐基板W一邊搬運基板W之機器人。搬運機器人CR係從指定的基板處理單元1取出處理完畢的基板W,並在基板授受位置P中將取出的基板W傳遞至移載機器人IR。此外,搬運機器人CR係在基板授受位置P中從移載機器人IR接取未處理的基板W,並將接取的基板W搬運至指定的基板處理單元1。與移載機器人IR同樣地,搬運機器人CR亦具備有:複數個(例如四個)手部;以及複數個臂部,係分別移動複數個手部。搬運機器人CR係能同時使用複數個手部進行基板W的搬運。 The conveying robot CR is a robot for conveying the substrate W while supporting the substrate W unilaterally. The transfer robot CR takes out the processed substrate W from the designated substrate processing unit 1 and transfers the taken-out substrate W to the transfer robot IR in the substrate transfer position P. In addition, the transfer robot CR receives the unprocessed substrate W from the transfer robot IR in the substrate transfer position P, and transfers the received substrate W to the designated substrate processing unit 1. Similar to the transfer robot IR, the transfer robot CR also has a plurality of (for example, four) hands; and a plurality of arms, which move the plurality of hands, respectively. The transfer robot CR system can simultaneously use a plurality of hands to transfer the substrate W.

各個基板處理單元1係具備有腔室(chamber)121(亦即框體121),腔室121係於內部形成處理空間。於框體121形成有搬入搬出口122,搬入搬出口122係用以使搬運機器人將搬運機器人的手部插入至框體121的內部。於搬入搬出口122設置有擋門(shutter)(未圖示),該擋門係可依據控制部130的控制而開閉。擋門係在基板W被搬入至框體121內以及從框體121內搬出時被開啟,而在基板W的處理中被關閉。基板處理單元1係以使搬出搬入口122對向之方式配置於配置有搬運機器人CR之空間。關於基板處理單元1的具體 性的構成係容後述。 Each substrate processing unit 1 is provided with a chamber 121 (that is, a frame 121), and the chamber 121 forms a processing space inside. The housing 121 is formed with a carry-in/outlet 122, and the carry-in/outlet 122 is used for the transfer robot to insert the hand of the transfer robot into the inside of the frame 121. A shutter (not shown) is provided at the carry-in and carry-out exit 122, and the shutter can be opened and closed according to the control of the control unit 130. The shutter is opened when the substrate W is carried into and out of the housing 121, and is closed when the substrate W is processed. The substrate processing unit 1 is arranged in the space where the transfer robot CR is arranged so that the carry-out and carry-out entrance 122 is opposed to each other. About the specifics of the substrate processing unit 1 The composition of sex is described later.

<控制部130> <Control Unit 130>

控制部130係控制移載機器人IR、搬運機器人CR以及一群基板處理單元1各者的動作。作為控制部130的硬體之構成,能採用與一般的電腦同樣的電腦。亦即,控制部130係例如將CPU(Central Processing Unit;中央處理器)11、屬於讀出專用的記憶體之ROM(Read Only Memory;唯讀記憶體)162、屬於可自由讀寫的記憶體之RAM(Random Access Memory;隨機存取記憶體)163以及磁碟161電性地連接至匯流排線(bus line)29而構成,CPU11係進行各種運算處理,ROM162係記憶基本程式,RAM163係記憶各種資訊,磁碟161係預先記憶程式PG以及資料等。液晶面板等顯示部151以及鍵盤等輸入部152亦電性地連接至匯流排線29。磁碟161亦記憶有程式庫(recipe)(未圖示)等,程式庫係用以規定基板W的處理內容以及處理順序。 The control unit 130 controls the actions of each of the transfer robot IR, the transfer robot CR, and the group of substrate processing units 1. As the configuration of the hardware of the control unit 130, a computer similar to a general computer can be used. That is, the control unit 130 combines, for example, a CPU (Central Processing Unit; central processing unit) 11, a ROM (Read Only Memory) 162 that belongs to a memory dedicated for reading, and a memory that can be read and written freely. The RAM (Random Access Memory; random access memory) 163 and the disk 161 are electrically connected to the bus line 29 to form a structure. The CPU 11 performs various calculations, the ROM 162 stores the basic programs, and the RAM 163 memory Various information, disk 161 is pre-stored program PG and data. The display portion 151 such as the liquid crystal panel and the input portion 152 such as the keyboard are also electrically connected to the bus line 29. The disk 161 also stores a recipe (not shown), etc., which are used to specify the processing content and processing sequence of the substrate W.

在控制部130中,作為主控制部的CPU11係依循撰寫於程式PG的順序進行運算處理,藉此實現用以控制基板處理裝置100的各部之各種功能部。具體而言,CPU11係例如作為後述的壓力設定部12以及控制訊號生成部13等各種功能部而動作。此外,在控制部130中所實現的一部分或者全部的功能部亦可藉由專用的邏輯電路等而以硬體之方式實現。 In the control section 130, the CPU 11 as the main control section performs arithmetic processing in accordance with the sequence written in the program PG, thereby realizing various functional sections for controlling each section of the substrate processing apparatus 100. Specifically, the CPU 11 operates as various functional units such as the pressure setting unit 12 and the control signal generating unit 13 described later. In addition, part or all of the functional units implemented in the control unit 130 may also be implemented in hardware by a dedicated logic circuit or the like.

(2)基板處理單元1的構成 (2) Configuration of substrate processing unit 1

圖2係用以概略性地顯示基板處理單元(亦即處理液噴出裝置)1的一例之圖。基板處理單元1係例如能對正在平面內旋轉的基板W的一主表面(亦稱為上表面)上供給處理液L1,藉此對基板W的上表面施予各種處理。作為處理液L1,例如能使用純水。此外,處理液L1並未限定於純水,亦可為碳酸水、離子水、臭氧水或者還原水(氫水)等功能水。或者,處理液L1亦可為氨水、氨水與過氧化氫水的混合液、鹽酸與過氧化氫水的混合液、氟酸、硫酸與過氧 化氫水的混合液、昇華性物質與溶劑的混合液、或者異丙醇(isopropyl alcohol)等藥液。 FIG. 2 is a diagram for schematically showing an example of the substrate processing unit (that is, the processing liquid ejection device) 1. The substrate processing unit 1 can, for example, supply a processing liquid L1 to a main surface (also referred to as an upper surface) of a substrate W that is rotating in a plane, thereby applying various treatments to the upper surface of the substrate W. As the treatment liquid L1, for example, pure water can be used. In addition, the treatment liquid L1 is not limited to pure water, and may be functional water such as carbonated water, ionized water, ozone water, or reduced water (hydrogen water). Alternatively, the treatment liquid L1 can also be ammonia water, a mixed liquid of ammonia water and hydrogen peroxide water, a mixed liquid of hydrochloric acid and hydrogen peroxide water, hydrofluoric acid, sulfuric acid and peroxygen. A mixture of hydrogen water, a mixture of sublimable substances and solvents, or a chemical solution such as isopropyl alcohol.

如圖2所示,基板處理單元1係例如具備有:處理部200,係一邊使已保持的基板W旋轉一邊使用處理液L1對基板W進行處理;處理液供給部7,係對處理部200供給處理液L1;以及控制部130。 As shown in FIG. 2, the substrate processing unit 1 includes, for example, a processing unit 200 for processing the substrate W with a processing liquid L1 while rotating the held substrate W; and a processing liquid supply unit 7 for processing the processing unit 200 Supply the processing liquid L1; and the control unit 130.

(2-1)處理部200 (2-1) Processing part 200

處理部200係於框體121內具備有自轉夾具221以及噴嘴251。處理部200係一邊藉由自轉夾具(亦即旋轉保持機構)221從下方保持基板W,一邊使基板W以預定的旋轉軸作為中心旋轉。處理部200係從噴嘴251對基板W的上表面供給處理液L1並對基板W進行處理。 The processing unit 200 is provided with a rotation jig 221 and a nozzle 251 in the housing 121. The processing unit 200 rotates the substrate W with a predetermined rotation axis as the center while holding the substrate W from below by the rotation jig (that is, the rotation holding mechanism) 221. The processing unit 200 supplies the processing liquid L1 to the upper surface of the substrate W from the nozzle 251 and processes the substrate W.

自轉夾具221係具備有:圓板狀的自轉基座(spin base),係具有略水平的主表面;以及旋轉機構,係通過自轉基座的中心,並使自轉基座以於鉛直方向延伸的旋轉軸作為中心旋轉。於自轉基座的周緣部立設有複數個保持銷,複數個保持銷係以可接觸以及解除接觸之方式保持基板W的周緣部。自轉夾具221係以複數個保持銷保持基板W的周緣部,藉此以自轉基座的上表面與基板W的下表面對向之方式以略水平姿勢保持基板W。被保持的基板W的中心係位於自轉基座的旋轉軸上。自轉夾具221係在此狀態下使自轉基座以旋轉軸作為中心旋轉,藉此使基板W以旋轉軸作為中心旋轉。 The rotation jig 221 is provided with: a disc-shaped spin base with a slightly horizontal main surface; and a rotation mechanism that passes through the center of the rotation base and extends the rotation base in the vertical direction. The rotation axis rotates as the center. A plurality of holding pins are erected on the peripheral edge of the rotation base, and the plurality of holding pins hold the peripheral edge of the substrate W in a contactable and contact-releasable manner. The rotation jig 221 holds the peripheral edge portion of the substrate W with a plurality of holding pins, thereby holding the substrate W in a slightly horizontal posture such that the upper surface of the rotation base and the lower surface of the substrate W face each other. The center of the held substrate W is located on the rotation axis of the rotation base. The rotation jig 221 rotates the rotation base with the rotation axis as the center in this state, thereby rotating the substrate W with the rotation axis as the center.

噴嘴251係配置於被自轉夾具221保持之基板W的上方,且從處理液供給部7對噴嘴251供給處理液L1。噴嘴251係對藉由自轉夾具221而旋轉之基板W的上表面噴出被供給的處理液L1。基板W的上表面係被處理液L1處理。 The nozzle 251 is arranged above the substrate W held by the rotation jig 221, and the processing liquid L1 is supplied from the processing liquid supply unit 7 to the nozzle 251. The nozzle 251 ejects the supplied processing liquid L1 to the upper surface of the substrate W rotated by the rotation jig 221. The upper surface of the substrate W is processed by the processing liquid L1.

噴嘴251係藉由預定的移動機構(未圖示)在處理位置與退避位置之間往復移動。如圖2所例示般,處理位置係噴嘴251在鉛直方向與被自轉 夾具221保持的基板W對向之位置,退避位置係噴嘴251未在鉛直方向與被自轉夾具221保持的基板W對向之位置。朝處理部200搬入基板W以及從處理部200搬出基板W之動作係在噴嘴251已在退避位置停止之狀態下藉由搬運機器人CR進行。被搬入至處理部200的基板W係被自轉夾具221以可接觸以及解除接觸之方式保持。 The nozzle 251 is moved back and forth between the processing position and the retracted position by a predetermined moving mechanism (not shown). As illustrated in Figure 2, the processing position is that the nozzle 251 is rotated in the vertical direction and The position where the substrate W held by the jig 221 faces, and the retracted position is a position where the nozzle 251 does not face the substrate W held by the rotation jig 221 in the vertical direction. The operations of loading the substrate W into the processing unit 200 and unloading the substrate W from the processing unit 200 are performed by the transfer robot CR in a state where the nozzle 251 has stopped at the retracted position. The substrate W carried into the processing unit 200 is held by the rotation jig 221 in a contactable and contact-releasable manner.

(2-2)處理液供給部7 (2-2) Treatment liquid supply part 7

處理液供給部7係具備有開閉閥71、吸回閥72、配管73以及驅動機構74、75。配管73係連接處理液供給源76與噴嘴251,並將處理液供給源76所供給的處理液L1導引至噴嘴251。 The processing liquid supply unit 7 includes an on-off valve 71, a suction valve 72, a pipe 73, and drive mechanisms 74 and 75. The pipe 73 connects the processing liquid supply source 76 and the nozzle 251, and guides the processing liquid L1 supplied from the processing liquid supply source 76 to the nozzle 251.

開閉閥71係設置於配管73的路徑中途,用以切換配管73內的流路的開閉。在圖2的例子中,開閉閥71係氣體作動閥,用以因應從驅動機構74所供給的預定的氣體H1的壓力進行開閉動作。例如,開閉閥71係常閉型(normally close type)的氣體作動閥,用以在已被供給氣體H1的狀態下開啟配管73內的流路,並在已排出氣體H1的狀態下關閉配管73內的流路。 The on-off valve 71 is provided in the middle of the path of the pipe 73 to switch the opening and closing of the flow path in the pipe 73. In the example of FIG. 2, the opening and closing valve 71 is a gas-actuated valve for opening and closing in response to the pressure of the predetermined gas H1 supplied from the driving mechanism 74. For example, the on-off valve 71 is a normally closed type gas-actuated valve that opens the flow path in the pipe 73 when the gas H1 is supplied, and closes the pipe 73 when the gas H1 is discharged. The flow path within.

圖3係用以概略性地顯示開閉閥71的構成的一例之剖視圖。開閉閥71係具有容器部Bx1、閥箱部Vx1以及區隔部Px1,容器部Bx1以及區隔部Px1係形成驅動空間71a,閥箱部Vx1以及區隔部Px1係形成流路空間71b。區隔部Px1係用以區隔驅動空間71a以及流路空間71b之構件。 FIG. 3 is a cross-sectional view for schematically showing an example of the structure of the on-off valve 71. The on-off valve 71 has a container part Bx1, a valve box part Vx1, and a partition part Px1. The container part Bx1 and the partition part Px1 form a drive space 71a, and the valve box part Vx1 and the partition part Px1 form a flow path space 71b. The partition Px1 is a member for partitioning the drive space 71a and the flow path space 71b.

於容器部Bx1內設置有區隔板712,區隔板712係將驅動空間71a區隔成彈性空間71a1以及氣體供給空間71a2。於彈性空間71a1內設置有彈性體713,彈性體713係將區隔板712按壓至流路空間71b側。彈性體713係例如為板彈簧。此外,區隔板712係設置成可在彈性體713的按壓方向中滑動。 A partition 712 is provided in the container portion Bx1, and the partition 712 partitions the driving space 71a into an elastic space 71a1 and a gas supply space 71a2. An elastic body 713 is arranged in the elastic space 71a1, and the elastic body 713 presses the partition plate 712 to the side of the flow path space 71b. The elastic body 713 is, for example, a leaf spring. In addition, the partition 712 is arranged to be slidable in the pressing direction of the elastic body 713.

區隔板712係連結至連結部714的一端。連結部714係具有例如棒狀的形狀,且可滑動地貫通區隔部Px1。連結部714的另一端係在流路空間 71b中連結至閥體711。流路空間71b係連通至配管73的流路之空間,且形成配管73的流路的一部分。 The partition 712 is connected to one end of the connecting portion 714. The connecting portion 714 has, for example, a rod-like shape, and slidably penetrates the partition portion Px1. The other end of the connecting portion 714 is tied to the flow path space 71b is connected to the valve body 711. The flow path space 71 b is a space that communicates with the flow path of the pipe 73 and forms a part of the flow path of the pipe 73.

氣體供給空間71a2係被後述的驅動機構74供給氣體H1。當氣體供給空間71a2內的氣體H1的壓力(以下稱為供給壓力)變成比基準值PL1還高時,區隔板712開始朝彈性體713側移動。區隔板712係隨著氣體H1的供給壓力的增大進一步朝彈性體713側移動,並在已與供給壓力相應之位置停止。然而,當氣體H1的供給壓力變成比基準值PH1還高時,彈性體713實質性地不會再進一步地彈性變形,且區隔板712不會進一步地移動。或者,在彈性空間71a內設置有止動件(stopper)之情形中,在氣體H1的供給壓力與基準值PH1一致時,區隔板712係抵接至該止動件。當然,基準值PH1係比基準值PL1還高。 The gas supply space 71a2 is supplied with gas H1 by the drive mechanism 74 mentioned later. When the pressure of the gas H1 in the gas supply space 71a2 (hereinafter referred to as the supply pressure) becomes higher than the reference value PL1, the partition 712 starts to move toward the elastic body 713 side. The partition 712 further moves toward the elastic body 713 as the supply pressure of the gas H1 increases, and stops at a position corresponding to the supply pressure. However, when the supply pressure of the gas H1 becomes higher than the reference value PH1, the elastic body 713 does not substantially elastically deform any further, and the partition 712 does not move further. Alternatively, in the case where a stopper is provided in the elastic space 71a, when the supply pressure of the gas H1 coincides with the reference value PH1, the partition plate 712 abuts against the stopper. Of course, the reference value PH1 is higher than the reference value PL1.

由於閥體711係經由連結部714連結至區隔板712,因此因應區隔板712的移動而朝驅動空間71a側移動。藉由該移動,在流路空間71b中開啟貫通開閉閥71之流路。亦即,開啟形成於閥箱部Vx1之閥座716的開口部。在此,當供給壓力變成比基準值PH1還高時,閥體711係充分地開啟流路。 Since the valve body 711 is connected to the partition 712 via the connecting portion 714, it moves toward the driving space 71a in response to the movement of the partition 712. By this movement, the flow path through the on-off valve 71 is opened in the flow path space 71b. That is, the opening of the valve seat 716 formed in the valve box portion Vx1 is opened. Here, when the supply pressure becomes higher than the reference value PH1, the valve body 711 opens the flow path sufficiently.

反之,當藉由驅動機構74排出氣體供給空間71a2內的氣體H1且供給壓力低於基準值PH1時,區隔板712以及閥體711係開始朝關閉開閉閥71之方向移動。並且,當供給壓力低於基準值PL1時,閥體711返回至原本的位置並將閥座716的開口部封閉。亦即,關閉開閉閥71。 Conversely, when the gas H1 in the gas supply space 71a2 is discharged by the driving mechanism 74 and the supply pressure is lower than the reference value PH1, the partition 712 and the valve body 711 start to move in the direction of closing the on-off valve 71. When the supply pressure is lower than the reference value PL1, the valve body 711 returns to its original position and closes the opening of the valve seat 716. That is, the on-off valve 71 is closed.

驅動機構74係驅動開閉閥71。驅動機構74係例如為電動氣動調節器(electric pneumatic regulator),並具有供氣用的電磁閥741以及排氣用的電磁閥742。電磁閥741係設置於配管743的路徑中途,用以切換配管743內的流路的開閉。配管743係用以將氣體供給源745與開閉閥71的氣體供給空間71a2連接之配管。藉由開啟電磁閥741,來自氣體供給源745的氣體H1係被供給至開閉閥71的氣體供給空間71a2。藉此,氣體供給空間71a2內的氣體H1的供給 壓力增大。氣體供給源745係例如具有:瓶體(bottle),係儲留高壓的氣體H1;以及閥(亦稱為壓力調節器),係將從瓶體導出的高壓的氣體H1的壓力下降至一定值。氣體供給源745亦可設置於基板處理裝置100的外部。 The driving mechanism 74 drives the on-off valve 71. The driving mechanism 74 is, for example, an electric pneumatic regulator, and includes a solenoid valve 741 for air supply and a solenoid valve 742 for exhaust. The solenoid valve 741 is provided in the middle of the path of the pipe 743 to switch the opening and closing of the flow path in the pipe 743. The pipe 743 is a pipe for connecting the gas supply source 745 and the gas supply space 71 a 2 of the on-off valve 71. By opening the solenoid valve 741, the gas H1 from the gas supply source 745 is supplied to the gas supply space 71a2 of the on-off valve 71. Thereby, the gas H1 in the gas supply space 71a2 is supplied The pressure increases. The gas supply source 745 has, for example, a bottle, which stores high-pressure gas H1; and a valve (also called a pressure regulator), which reduces the pressure of the high-pressure gas H1 derived from the bottle to a certain value. . The gas supply source 745 may also be provided outside the substrate processing apparatus 100.

電磁閥742係設置於配管744的路徑中途,用以切換配管744內的流路的開閉。配管744的一端係在電磁閥741與開閉閥71之間連接至配管743,配管744的另一端係連接至未圖示的排氣部。藉由電磁閥742開啟,開閉閥71的氣體供給空間71a2內的氣體H1係於配管743的一部分以及配管744流動並排出至排氣部。藉此,氣體供給空間71a2內的氣體H1的供給壓力係降低。 The solenoid valve 742 is provided in the middle of the path of the pipe 744 to switch the opening and closing of the flow path in the pipe 744. One end of the pipe 744 is connected to the pipe 743 between the solenoid valve 741 and the on-off valve 71, and the other end of the pipe 744 is connected to an exhaust part (not shown). When the solenoid valve 742 is opened, the gas H1 in the gas supply space 71a2 of the on-off valve 71 flows through a part of the pipe 743 and the pipe 744 and is discharged to the exhaust part. Thereby, the supply pressure of the gas H1 in the gas supply space 71a2 is reduced.

電磁閥741、742的開閉係被控制部130控制。在圖2的例子中,於基板處理單元1設置有控制板140。控制板140係具有用以驅動電磁閥741之驅動電路以及用以驅動電磁閥742之驅動電路。控制部130係將用以以適當的能率(duty)控制電磁閥741、742的開閉之控制訊號輸出至控制板140。控制板140係依據該控制訊號使驅動電流流動至電磁閥741、742。電磁閥741、742係分別以適當的能率開閉,藉此驅動機構74係能以期望的供給壓力將氣體H1供給至開閉閥71的氣體供給空間71a2。 The opening and closing of the solenoid valves 741 and 742 is controlled by the control unit 130. In the example of FIG. 2, a control board 140 is provided in the substrate processing unit 1. The control board 140 has a driving circuit for driving the solenoid valve 741 and a driving circuit for driving the solenoid valve 742. The control unit 130 outputs a control signal for controlling the opening and closing of the solenoid valves 741 and 742 at an appropriate duty to the control board 140. The control board 140 makes the driving current flow to the solenoid valves 741 and 742 according to the control signal. The solenoid valves 741 and 742 are each opened and closed at an appropriate energy rate, whereby the drive mechanism 74 can supply the gas H1 to the gas supply space 71a2 of the opening and closing valve 71 at a desired supply pressure.

在圖2的例子中,於基板處理單元1設置有壓力感測器746。壓力感測器746係在電磁閥741與開閉閥71之間測量配管743內的氣體H1的壓力,並將測量值Pm1輸出至控制部130。例如,壓力感測器746係具有膜片(diaphragm)以及感壓元件,藉由感壓元件檢測已與氣體H1的壓力相應之膜片的變形來測量氣體H1的壓力。由於電磁閥741與開閉閥71之間的配管743內的氣體H1的壓力係理想性地與氣體供給空間71a2內的氣體H1的供給壓力相等,因此測量值Pm1可謂是顯示氣體H1的供給壓力。控制部130係以測量值Pm1接近目標值之方式控制電磁閥741、742的開閉。 In the example of FIG. 2, a pressure sensor 746 is provided in the substrate processing unit 1. The pressure sensor 746 measures the pressure of the gas H1 in the pipe 743 between the solenoid valve 741 and the on-off valve 71 and outputs the measured value Pm1 to the control unit 130. For example, the pressure sensor 746 has a diaphragm and a pressure-sensitive element, and the pressure of the gas H1 is measured by detecting the deformation of the diaphragm corresponding to the pressure of the gas H1 by the pressure-sensitive element. Since the pressure of the gas H1 in the pipe 743 between the solenoid valve 741 and the on-off valve 71 is ideally equal to the supply pressure of the gas H1 in the gas supply space 71a2, the measured value Pm1 can be said to indicate the supply pressure of the gas H1. The control unit 130 controls the opening and closing of the solenoid valves 741 and 742 so that the measured value Pm1 approaches the target value.

如上所述,由於開閉閥71的閥體711的位置係取決於氣體H1的 供給壓力的大小,因此控制部130係控制氣體H1的供給壓力的變化速度,藉此能控制開閉閥71的動作速度(亦稱為開閉速度)。 As mentioned above, since the position of the valve body 711 of the on-off valve 71 depends on the gas H1 Because of the magnitude of the supply pressure, the control unit 130 controls the rate of change of the supply pressure of the gas H1, thereby controlling the operating speed of the on-off valve 71 (also referred to as the opening and closing speed).

吸回閥72係設置於開閉閥71與噴嘴251之間的配管73的路徑中途。吸回閥72係在停止噴出處理液L1時使噴嘴251內的處理液L1移動(吸回)至吸回閥72側。藉此,噴嘴251內的處理液L1的端面位置係遠離噴嘴251的前端252。在圖2的例子中,吸回閥72係氣體作動閥,用以因應從驅動機構75所供給的預定的氣體H2的壓力進行吸回動作。例如,吸回閥72係下述形式的氣體作動閥:在已排出氣體H2的狀態下變成正在吸回處理液L1的狀態。此外,氣體H2亦可與氣體H1相同。 The suction valve 72 is provided in the middle of the path of the pipe 73 between the on-off valve 71 and the nozzle 251. The suction valve 72 moves (suctions) the processing liquid L1 in the nozzle 251 to the suction valve 72 side when the discharge of the processing liquid L1 is stopped. Thereby, the position of the end surface of the processing liquid L1 in the nozzle 251 is away from the front end 252 of the nozzle 251. In the example of FIG. 2, the suction valve 72 is a gas-actuated valve for performing a suction operation in response to the pressure of the predetermined gas H2 supplied from the driving mechanism 75. For example, the suck-back valve 72 is a gas-actuated valve of a form in which the processing liquid L1 is sucked back in a state where the gas H2 has been discharged. In addition, the gas H2 may be the same as the gas H1.

圖4係用以概略性地顯示吸回閥72的構成的一例之剖視圖。吸回閥72係具有容器部Bx2、閥箱部Vx2以及區隔部Px2,容器部Bx2以及區隔部Px2係形成驅動空間72a,閥箱部Vx2以及區隔部Px2係形成閥箱空間72b。區隔部Px2係用以將驅動空間72a以及閥箱空間72b區隔之構件。 FIG. 4 is a cross-sectional view for schematically showing an example of the structure of the suction valve 72. The suction valve 72 has a container part Bx2, a valve box part Vx2, and a partition part Px2. The container part Bx2 and the partition part Px2 form a drive space 72a, and the valve box part Vx2 and the partition part Px2 form a valve box space 72b. The partition Px2 is a member used to partition the drive space 72a and the valve box space 72b.

於容器部Bx2內設置有區隔板722,區隔板722係將驅動空間72a區隔成彈性空間72a1以及氣體供給空間72a2。於彈性空間72a1內設置有彈性體723,彈性體723係將區隔板722按壓至氣體供給空間72a2側。彈性體723係例如為板彈簧。此外,區隔板722係設置成可在彈性體723的按壓方向中滑動。 A partition 722 is provided in the container portion Bx2, and the partition 722 partitions the driving space 72a into an elastic space 72a1 and a gas supply space 72a2. An elastic body 723 is provided in the elastic space 72a1, and the elastic body 723 presses the partition plate 722 to the side of the gas supply space 72a2. The elastic body 723 is, for example, a leaf spring. In addition, the partition plate 722 is arranged to be slidable in the pressing direction of the elastic body 723.

區隔板722係連結至連結部724的一端。連結部724係具有例如棒狀的形狀,並可滑動地貫通區隔部Px2。連結部724的另一端係在閥箱空間72b中連結至閥體721。閥體721亦作為用以將閥箱空間72b區隔成非流路空間72b1以及流路空間72b2之區隔板而發揮作用。流路空間72b2係連通至配管73的流路,並作為配管73的流路的一部分而發揮作用。此外,閥體721係可隨著區隔板722的移動而變形,且流路空間72b2的體積係因應閥體721的變形而變化。 The partition 722 is connected to one end of the connecting portion 724. The connecting portion 724 has, for example, a rod-like shape, and slidably penetrates the partition portion Px2. The other end of the connecting portion 724 is connected to the valve body 721 in the valve box space 72b. The valve body 721 also functions as a partition for partitioning the valve box space 72b into a non-flow path space 72b1 and a flow path space 72b2. The flow path space 72 b 2 is connected to the flow path of the pipe 73 and functions as a part of the flow path of the pipe 73. In addition, the valve body 721 can be deformed along with the movement of the partition 722, and the volume of the flow path space 72b2 changes in response to the deformation of the valve body 721.

氣體供給空間72a2係被後述的驅動機構75供給氣體H2。當氣體供給空間72a2內的氣體H2的壓力(以下稱為供給壓力)變成比基準值PL2還高時,區隔板722開始朝彈性體723側移動。區隔板722係隨著氣體H2的供給壓力的增大進一步朝彈性體723側移動,並在已與供給壓力相應之位置停止。然而,當氣體H2的供給壓力變成比基準值PH2還高時,彈性體723實質性地不會再進一步地彈性變形,且區隔板722不會進一步地移動。或者,在彈性空間72a1內設置有止動件之情形中,在氣體H2的供給壓力與基準值PH2一致時,區隔板722係抵接至該止動件。當然,基準值PH2係比基準值PL2還高。 The gas supply space 72a2 is supplied with gas H2 by the drive mechanism 75 mentioned later. When the pressure of the gas H2 in the gas supply space 72a2 (hereinafter referred to as the supply pressure) becomes higher than the reference value PL2, the partition plate 722 starts to move toward the elastic body 723 side. The partition 722 further moves toward the elastic body 723 as the supply pressure of the gas H2 increases, and stops at a position corresponding to the supply pressure. However, when the supply pressure of the gas H2 becomes higher than the reference value PH2, the elastic body 723 will not substantially be further elastically deformed, and the partition 722 will not move further. Alternatively, in the case where a stopper is provided in the elastic space 72a1, when the supply pressure of the gas H2 coincides with the reference value PH2, the partition plate 722 abuts against the stopper. Of course, the reference value PH2 is higher than the reference value PL2.

由於閥體721係經由連結部724連結至區隔板722,因此隨著區隔板722的移動而變形。更具體而言,閥體721係以減少流路空間72b2的體積之方式變形。在此,當氣體H2的供給壓力超過基準值PH2時,實質性地結束閥體721的變形。 Since the valve body 721 is connected to the partition 722 via the connecting portion 724, it deforms as the partition 722 moves. More specifically, the valve body 721 is deformed to reduce the volume of the flow path space 72b2. Here, when the supply pressure of the gas H2 exceeds the reference value PH2, the deformation of the valve body 721 is substantially ended.

反之,當藉由驅動機構75排出氣體供給空間72a2內的氣體H2且供給壓力低於基準值PH2時,區隔板722係開始朝氣體供給空間72a2側移動。伴隨於此,閥體721朝著流路空間72b2的體積增大之方向開始變形。藉此,增大吸回閥72內的流路的體積。並且,當氣體H2的供給壓力低於基準值PL2時,閥體721返回至原本的形狀。藉由流路體積的增大,吸回閥72與噴嘴251之間的處理液L1係被吸回至吸回閥72側(吸回動作)。 Conversely, when the gas H2 in the gas supply space 72a2 is discharged by the driving mechanism 75 and the supply pressure is lower than the reference value PH2, the partition 722 starts to move toward the gas supply space 72a2 side. Along with this, the valve body 721 starts to deform in a direction in which the volume of the flow path space 72b2 increases. Thereby, the volume of the flow path in the suction valve 72 is increased. In addition, when the supply pressure of the gas H2 is lower than the reference value PL2, the valve body 721 returns to its original shape. Due to the increase in the volume of the flow path, the processing liquid L1 between the suction valve 72 and the nozzle 251 is sucked back to the suction valve 72 side (suction operation).

驅動機構75係驅動吸回閥72。驅動機構75係例如為電動氣動調節器,並具有供氣用的電磁閥751以及排氣用的電磁閥752。電磁閥751係設置於配管753的路徑中途,用以切換配管753內的流路的開閉。配管753係用以將氣體供給源755與吸回閥72的氣體供給空間72a2連接之配管。藉由開啟電磁閥751,來自氣體供給源755的氣體H2係被供給至吸回閥72的氣體供給空間72a2。藉此,氣體供給空間72a2內的氣體H2的供給壓力增大。氣體供給源755 係例如具有:瓶體,係儲留高壓的氣體H2;以及閥(亦稱為壓力調節器),係將從瓶體導出的高壓的氣體H2的壓力下降至一定值。氣體供給源755亦可設置於基板處理裝置100的外部。 The driving mechanism 75 drives the suction valve 72. The drive mechanism 75 is, for example, an electro-pneumatic regulator, and has a solenoid valve 751 for air supply and a solenoid valve 752 for exhaust. The solenoid valve 751 is provided in the middle of the path of the pipe 753 to switch the opening and closing of the flow path in the pipe 753. The pipe 753 is a pipe for connecting the gas supply source 755 and the gas supply space 72 a 2 of the suction valve 72. By opening the solenoid valve 751, the gas H2 from the gas supply source 755 is supplied to the gas supply space 72a2 of the suction valve 72. Thereby, the supply pressure of the gas H2 in the gas supply space 72a2 increases. Gas supply source 755 The system has, for example, a bottle body that stores high-pressure gas H2; and a valve (also referred to as a pressure regulator) that reduces the pressure of the high-pressure gas H2 derived from the bottle body to a certain value. The gas supply source 755 may also be provided outside the substrate processing apparatus 100.

電磁閥752係設置於配管754的路徑中途,用以切換配管754內的流路的開閉。配管754的一端係在電磁閥751與吸回閥72之間連接至配管753,配管754的另一端係連接至未圖示的排氣部。藉由電磁閥752開啟,吸回閥72的氣體供給空間72a2內的氣體H2係於配管753的一部分以及配管754流動並排出至排氣部。藉此,氣體供給空間72a2內的氣體H2的供給壓力係降低。 The solenoid valve 752 is provided in the middle of the path of the pipe 754 to switch the opening and closing of the flow path in the pipe 754. One end of the pipe 754 is connected to the pipe 753 between the solenoid valve 751 and the suction valve 72, and the other end of the pipe 754 is connected to an unshown exhaust part. When the solenoid valve 752 is opened, the gas H2 in the gas supply space 72a2 of the suction valve 72 flows through a part of the pipe 753 and the pipe 754 and is discharged to the exhaust part. Thereby, the supply pressure of the gas H2 in the gas supply space 72a2 is reduced.

電磁閥751、752的開閉係被控制部130控制。具體而言,控制板140係具有用以驅動電磁閥751之驅動電路以及用以驅動電磁閥752之驅動電路。控制部130係將用以以適當的能率控制電磁閥751、752的開閉之控制訊號輸出至控制板140。控制板140係依據該控制訊號使驅動電流流動至電磁閥751、752。電磁閥751、752係分別以適當的能率開閉,藉此驅動機構75係能以期望的供給壓力將氣體H2供給至吸回閥72的氣體供給空間72a2。 The opening and closing of the solenoid valves 751 and 752 is controlled by the control unit 130. Specifically, the control board 140 has a driving circuit for driving the solenoid valve 751 and a driving circuit for driving the solenoid valve 752. The control unit 130 outputs a control signal for controlling the opening and closing of the solenoid valves 751 and 752 at an appropriate energy rate to the control board 140. The control board 140 makes the driving current flow to the solenoid valves 751 and 752 according to the control signal. The solenoid valves 751 and 752 are each opened and closed at an appropriate energy rate, whereby the drive mechanism 75 can supply the gas H2 to the gas supply space 72a2 of the suction valve 72 at a desired supply pressure.

在圖2的例子中,於基板處理單元1設置有壓力感測器756。壓力感測器756係在電磁閥751與吸回閥72之間測量配管753內的氣體H2的壓力,並將測量值Pm2輸出至控制部130。壓力感測器756的構成的一例係與壓力感測器746同樣。由於電磁閥751與吸回閥72之間的配管753內的氣體H2的壓力係理想性地與氣體供給空間72a2內的氣體H2的供給壓力相等,因此測量值Pm2可謂是顯示氣體H2的供給壓力。控制部130係以測量值Pm2接近目標值之方式控制電磁閥751、752的開閉。 In the example of FIG. 2, a pressure sensor 756 is provided in the substrate processing unit 1. The pressure sensor 756 measures the pressure of the gas H2 in the pipe 753 between the solenoid valve 751 and the suction valve 72, and outputs the measured value Pm2 to the control unit 130. An example of the structure of the pressure sensor 756 is the same as that of the pressure sensor 746. Since the pressure of the gas H2 in the pipe 753 between the solenoid valve 751 and the suction valve 72 is ideally equal to the supply pressure of the gas H2 in the gas supply space 72a2, the measured value Pm2 can be said to indicate the supply pressure of the gas H2 . The control unit 130 controls the opening and closing of the solenoid valves 751 and 752 so that the measured value Pm2 approaches the target value.

如上所述,由於吸回閥72的閥體721的變形的程度係取決於氣體H2的供給壓力的大小,因此控制部130係控制氣體H2的供給壓力的變化速度,藉此能控制吸回閥72的動作速度。例如控制部130係控制氣體H2的供給 壓力的降低速度,藉此能控制吸回動作中的吸回閥72的動作速度。 As described above, since the degree of deformation of the valve body 721 of the suction valve 72 depends on the supply pressure of the gas H2, the control unit 130 controls the rate of change of the supply pressure of the gas H2, thereby controlling the suction valve 72 action speed. For example, the control unit 130 controls the supply of gas H2 The speed of pressure reduction can thereby control the operating speed of the suction valve 72 during the suction operation.

(3)基板處理單元的動作的概要 (3) Outline of the operation of the substrate processing unit

接著,簡單地說明基板處理單元1的整體性的動作的一例。首先,控制部130係開啟框體121的擋門(未圖示),控制搬運機器人CR將基板W搬入至框體121的內部,並將基板W載置於自轉夾具221上。接著,控制部130係控制搬運機器人CR使搬運機器人CR的手部從框體121的內部抽出並關閉擋門。藉此,結束基板W的搬入動作。 Next, an example of the overall operation of the substrate processing unit 1 will be briefly described. First, the control unit 130 opens the shutter (not shown) of the housing 121, controls the transfer robot CR to carry the substrate W into the housing 121, and places the substrate W on the rotation jig 221. Next, the control unit 130 controls the transfer robot CR to draw the hand of the transfer robot CR from the inside of the housing 121 and close the shutter. This completes the loading operation of the substrate W.

接著,控制部130係使自轉夾具221旋轉,並控制驅動機構74開啟開閉閥71。藉此,處理液L1從處理液供給源76於配管73的內部流動,並從噴嘴251朝基板W的上表面噴出。已著液至基板W的上表面之處理液L1係接受旋轉所致使之離心力而在基板W的上表面擴展並從基板W的周緣飛散。處理液L1作用於基板W的上表面,藉此對基板W進行處理。 Next, the control unit 130 rotates the autorotating jig 221 and controls the drive mechanism 74 to open the on-off valve 71. Thereby, the processing liquid L1 flows from the processing liquid supply source 76 inside the pipe 73 and is ejected from the nozzle 251 toward the upper surface of the substrate W. The processing liquid L1 deposited on the upper surface of the substrate W receives the centrifugal force caused by the rotation to spread on the upper surface of the substrate W and scatter from the periphery of the substrate W. The processing liquid L1 acts on the upper surface of the substrate W, thereby processing the substrate W.

當經過充分的處理時間時,控制部130係控制驅動機構74關閉開閉閥71,並控制驅動機構75使吸回閥72進行吸回動作。藉此,停止從噴嘴251噴出處理液L1。此外,進行吸回動作,藉此處理液L1在噴嘴251的內部中朝吸回閥72側移動。藉此,能降低產生處理液L1的垂液(液滴的落下)的可能性。藉由停止噴出處理液L1,實質性地結束對於基板W的處理。之後,亦可適當地進行其他的處理,例如亦可適當地進行乾燥處理等。例如,亦可增大基板W的旋轉速度,使基板W的上表面中的處理液朝外側飛散,藉此使基板W乾燥。 When a sufficient processing time has elapsed, the control unit 130 controls the drive mechanism 74 to close the on-off valve 71, and controls the drive mechanism 75 to cause the suction valve 72 to perform a suction operation. Thereby, the ejection of the processing liquid L1 from the nozzle 251 is stopped. In addition, by performing a sucking-back operation, the processing liquid L1 moves to the sucking-back valve 72 side in the interior of the nozzle 251. Thereby, it is possible to reduce the possibility of the occurrence of sagging (falling of droplets) of the treatment liquid L1. By stopping the ejection of the processing liquid L1, the processing of the substrate W is substantially completed. After that, other treatments may be appropriately performed, for example, drying treatment may be appropriately performed. For example, the rotation speed of the substrate W may be increased, and the processing liquid on the upper surface of the substrate W may be scattered to the outside, thereby drying the substrate W.

(3.1)閥的動作速度與噴嘴的前端部的處理液的狀態 (3.1) The operating speed of the valve and the state of the processing liquid at the tip of the nozzle

此外,在停止噴出處理液L1時的開閉閥71以及吸回閥72的動作速度不適當之情形中,未適當地停止噴出處理液L1。會有例如處理液L1在滴液狀態下從噴嘴251的前端252落下之情形。在此情形中,難謂停止噴出時的噴嘴251 的前端部的處理液L1的狀態(以下稱為噴嘴前端狀態)良好。此外,此處所謂的動作速度係能掌握閥體711的移動速度或者閥體721的變形速度。此外,以下中亦將停止噴出處理液L1時的開閉閥71的動作速度稱為閉鎖速度。 In addition, when the operating speeds of the on-off valve 71 and the suction valve 72 at the time of stopping the discharge of the processing liquid L1 are not appropriate, the discharge of the processing liquid L1 is not properly stopped. For example, the processing liquid L1 may drop from the tip 252 of the nozzle 251 in a dripping state. In this case, it is difficult to say that the nozzle 251 when the spray is stopped The state of the processing liquid L1 (hereinafter referred to as the nozzle tip state) of the tip portion is good. In addition, the so-called operating speed here can grasp the moving speed of the valve body 711 or the deformation speed of the valve body 721. In addition, in the following, the operating speed of the on-off valve 71 when the discharge of the processing liquid L1 is stopped is also referred to as the closing speed.

停止噴出時的噴嘴前端狀態係取決於開閉閥71的閉鎖速度以及吸回閥72的動作速度,但當開閉閥71的閉鎖速度不適當時,即使調整吸回閥72的動作速度亦會有無法良好地設定成噴嘴前端狀態之情形。因此,以下首先說明開閉閥71的閉鎖速度。 The state of the nozzle tip when the ejection is stopped depends on the closing speed of the on-off valve 71 and the operating speed of the suction valve 72. However, when the closing speed of the on-off valve 71 is not appropriate, even if the operating speed of the suction valve 72 is adjusted, the operation speed of the suction valve 72 may not be satisfactory. The ground is set to the state of the nozzle tip. Therefore, first, the closing speed of the on-off valve 71 will be described below.

圖5係用以以圖表形式顯示噴嘴前端狀態與開閉閥71的閉鎖速度之間的關係的一例之圖。在圖5的圖表的最上段顯示有三種形式的噴嘴前端狀態。於從上方起的第二段記載有最上段所顯示的三個噴嘴前端狀態是否良好。於最下段顯示有最上段所顯示的三個噴嘴前端狀態與開閉閥71的閉鎖速度之間的對應關係。如後面詳述般,開閉閥71的閉鎖速度係被驅動機構74調節。 FIG. 5 is a diagram for graphically showing an example of the relationship between the nozzle tip state and the closing speed of the on-off valve 71. There are three types of nozzle tip states shown in the uppermost part of the graph in FIG. 5. In the second paragraph from the top, whether the tip of the three nozzles shown in the top stage is in good condition is described. The correspondence relationship between the tip states of the three nozzles displayed on the uppermost stage and the closing speed of the on-off valve 71 is displayed in the lowermost stage. As described in detail later, the closing speed of the on-off valve 71 is adjusted by the drive mechanism 74.

如圖5所示,停止噴出時的噴嘴前端狀態係根據開閉閥71的閉鎖速度而變動。當開閉閥71的閉鎖速度過低時,在噴嘴251停止噴出處理液L1後,處理液L1的液滴L2暫時持續落下(斷續地滴落)。亦即,噴嘴前端狀態變成不佳的狀態。 As shown in FIG. 5, the state of the nozzle tip when the ejection is stopped varies according to the closing speed of the on-off valve 71. When the closing speed of the on-off valve 71 is too low, after the nozzle 251 stops discharging the processing liquid L1, the liquid droplets L2 of the processing liquid L1 temporarily continue to fall (drop intermittently). That is, the state of the tip of the nozzle becomes a poor state.

當開閉閥71的閉鎖速度過高時,藉由所謂的水敲擊(water hammer),於噴嘴251的內部的前端部以液滴L2的狀態殘留有處理液L1。亦即,液滴L2係從沿著噴嘴251的內部以液密狀態存在的處理液L1離開並附著至噴嘴251的前端側的內表面。此種液滴L2會在之後落下至基板W上。亦即,噴嘴前端狀態變成不佳的狀態。 When the closing speed of the on-off valve 71 is too high, the processing liquid L1 remains in the state of the droplet L2 at the tip of the nozzle 251 by a so-called water hammer. That is, the liquid droplet L2 is separated from the processing liquid L1 existing in a liquid-tight state along the inside of the nozzle 251 and adheres to the inner surface of the nozzle 251 on the front end side. Such droplets L2 will fall onto the substrate W later. That is, the state of the tip of the nozzle becomes a poor state.

當開閉閥71的閉鎖速度適當時,噴嘴251的前端部係變成大致藉由處理液L1所致使之液密狀態,且停止後液滴L2不會暫時持續滴落。亦 即,噴嘴前端狀態係變成較佳的狀態。 When the closing speed of the on-off valve 71 is appropriate, the tip of the nozzle 251 becomes a liquid-tight state substantially caused by the processing liquid L1, and the liquid droplet L2 will not temporarily continue dripping after stopping. also That is, the state of the nozzle tip becomes a better state.

此外,發明人係探索出相較於開閉閥71的閉鎖期間中之最初時的閉鎖速度,噴嘴前端狀態更容易取決於開閉閥71的閉鎖期間中之最後的閉鎖速度。此外,此處所謂的閉鎖期間係指開閉閥71的閥體711朝著閥座716開始移動直至停止為止的期間。 In addition, the inventors discovered that the nozzle tip state is more likely to depend on the closing speed of the opening and closing valve 71 at the end of the closing period of the opening and closing valve 71 than the closing speed at the beginning of the closing period of the opening and closing valve 71. In addition, the locked period referred to here refers to a period during which the valve body 711 of the on-off valve 71 starts to move toward the valve seat 716 until it stops.

(3-2)開閉閥的閉鎖控制 (3-2) Locking control of on-off valve

此外,控制部130係使開閉閥71的閉鎖速度在開閉閥71的閉鎖期間中變化。亦即,在本例的基板處理單元1中並非是以裝置固有的閉鎖速度關閉開閉閥71。作為更具體性的一例,控制部130係將最初的閉鎖速度設定成比最後的閉鎖速度還高,最初的閉鎖速度係不容易對停止噴出時的噴嘴前端狀態造成影響,最後的閉鎖速度係容易對停止噴出時的噴嘴前端狀態造成影響。在圖2的例子中,由於開閉閥71為氣體作動閥,因此控制部130係使供給至開閉閥71之氣體H1的供給壓力的變化速度於閉鎖期間中變化,藉此使閉鎖速度如上述般地變化。以下,說明更具體性的控制部130的一例。 In addition, the control unit 130 changes the closing speed of the opening and closing valve 71 during the closing period of the opening and closing valve 71. That is, in the substrate processing unit 1 of this example, the on-off valve 71 is not closed at the device-specific closing speed. As a more specific example, the control unit 130 sets the initial closing speed to be higher than the final closing speed. The initial closing speed is less likely to affect the nozzle tip state when the ejection is stopped, and the final closing speed is easy. Affects the state of the nozzle tip when spraying is stopped. In the example of FIG. 2, since the on-off valve 71 is a gas-actuated valve, the control unit 130 changes the rate of change of the supply pressure of the gas H1 supplied to the on-off valve 71 during the lock period, thereby making the lock rate as described above地变。 Land changes. Hereinafter, a more specific example of the control unit 130 will be described.

如圖1所示,控制部130係具備有壓力設定部12以及控制訊號生成部13。壓力設定部12係設定針對供給至開閉閥71之氣體H1的供給壓力之目標值(以下稱為壓力指示值)P1*,並將該壓力指示值P1*輸出至控制訊號生成部13。控制訊號生成部13係以氣體H1的供給壓力接近壓力指示值P1*之方式依據該壓力指示值P1*生成電磁閥741、742用的控制訊號。電磁閥741、742係依據各自的控制訊號進行開閉動作。 As shown in FIG. 1, the control unit 130 includes a pressure setting unit 12 and a control signal generating unit 13. The pressure setting unit 12 sets a target value (hereinafter referred to as a pressure instruction value) P1* for the supply pressure of the gas H1 supplied to the on-off valve 71, and outputs the pressure instruction value P1* to the control signal generation unit 13. The control signal generating unit 13 generates control signals for the solenoid valves 741 and 742 according to the pressure instruction value P1* in such a way that the supply pressure of the gas H1 approaches the pressure instruction value P1*. The solenoid valves 741 and 742 are opened and closed according to their respective control signals.

壓力設定部12係在將開閉閥71從開狀態切換至閉狀態時,使壓力指示值P1*從比基準值PH1還高的值緩緩地降低至比基準值PL1還低的值。圖6係用以顯示壓力指示值P1*以及氣體H1的供給壓力的測量值Pm1的一例之圖表。在此,將從用以使壓力指示值P1*開始降低之時間點t10至用以使測 量值Pm1低於基準值PL1之時間點t13為止的期間稱為閥控制期間Ta1,將從時間點t10至用以使壓力指示值P1*低於基準值PH1之時間點t11為止的期間稱為非動作期間Tb1,將從時間點t11至時間點t13為止的期間稱為閉鎖期間Tc1。 The pressure setting unit 12 gradually decreases the pressure instruction value P1* from a value higher than the reference value PH1 to a value lower than the reference value PL1 when the on-off valve 71 is switched from the open state to the closed state. Fig. 6 is a graph showing an example of the pressure indication value P1* and the measured value Pm1 of the supply pressure of the gas H1. Here, from the time point t10 at which the pressure indication value P1* starts to decrease to the time point t10 at which the pressure indication value P1* starts to decrease The period from the time point t13 when the quantity Pm1 is lower than the reference value PL1 is called the valve control period Ta1, and the period from the time point t10 to the time point t11 at which the pressure indication value P1* is lower than the reference value PH1 is called the valve control period Ta1. The non-operation period Tb1 is the period from the time point t11 to the time point t13 as a blocking period Tc1.

在圖6的例子中,壓力指示值P1*以及測量值Pm1係在初始時比基準值PH1還高且大致一致。此原因在於:以壓力指示值P1*設定成初始時比基準值PH1還高的值且測量值Pm1接近壓力指示值P1*之方式控制電磁閥741、742。由於測量值Pm1比基準值PH1還高,因此開閉閥71係在初始時開啟,從噴嘴251朝基板W的上表面噴出處理液L1。 In the example of FIG. 6, the pressure indication value P1* and the measurement value Pm1 are initially higher than the reference value PH1 and are substantially the same. The reason for this is that the solenoid valves 741 and 742 are controlled in such a way that the pressure indication value P1* is set to a value higher than the reference value PH1 at the initial time and the measured value Pm1 is close to the pressure indication value P1*. Since the measured value Pm1 is higher than the reference value PH1, the on-off valve 71 is initially opened, and the processing liquid L1 is ejected from the nozzle 251 toward the upper surface of the substrate W.

在圖6的例子中,在時間點t10中,壓力設定部12係將壓力指示值P1*更新成值P1[0]。值P1[0]係比基準值PL1還高且比基準值PH1還低的值。更具體而言,值P1[0]係比基準值PL1與基準值PH1的平均值還小的值。當壓力指示值P1*被更新成值P1[0]時,由於以氣體H1的供給壓力接近值P1[0]之方式控制電磁閥741、742,因此氣體H1的供給壓力係隨著時間的經過而降低。因此,在圖6中,測量值Pm1係在時間點t10以後隨著時間的經過而降低。接著,當測量值Pm1低於基準值PH1時,開閉閥71的閥體711開始移動。亦即,開閉閥71開始閉鎖動作。 In the example of FIG. 6, at time t10, the pressure setting unit 12 updates the pressure instruction value P1* to the value P1[0]. The value P1[0] is a value higher than the reference value PL1 and lower than the reference value PH1. More specifically, the value P1[0] is a value smaller than the average value of the reference value PL1 and the reference value PH1. When the pressure indication value P1* is updated to the value P1[0], the solenoid valves 741 and 742 are controlled so that the supply pressure of the gas H1 approaches the value P1[0], so the supply pressure of the gas H1 is over time And reduce. Therefore, in FIG. 6, the measured value Pm1 decreases with the passage of time after the time point t10. Next, when the measured value Pm1 is lower than the reference value PH1, the valve body 711 of the on-off valve 71 starts to move. In other words, the on-off valve 71 starts the closing operation.

非動作期間Tb1係使壓力指示值P1*降低後直至開閉閥71的閥體711開始移動為止的期間,期望該非動作期間Tb1短。在圖6的例子中,值P1[0]係被設定成接近基準值PL1之值。而且,壓力設定部12並非是在非動作期間Tb1中使壓力指示值P1*隨著時間的經過緩緩地降低至值P1[0],而是在非動作期間Tb1的開始時間點(時間點t10)中使壓力指示值P1*降低至值P1[0]。因此,能更有效地縮短非動作期間Tb1。 The non-operation period Tb1 is a period after the pressure instruction value P1* is lowered until the valve body 711 of the on-off valve 71 starts to move, and it is desirable that the non-operation period Tb1 be short. In the example of FIG. 6, the value P1[0] is set to a value close to the reference value PL1. In addition, the pressure setting unit 12 does not gradually decrease the pressure instruction value P1* to the value P1[0] over time during the non-operating period Tb1, but at the start time point (time point of the non-operating period Tb1). In t10), the pressure indication value P1* is reduced to the value P1[0]. Therefore, the non-operation period Tb1 can be shortened more effectively.

由於值P1[0]比基準值PH1還小,因此測量值Pm1係在已低於基準值PH1的時間點t11以後亦隨著時間的經過而降低。 Since the value P1[0] is smaller than the reference value PH1, the measured value Pm1 decreases with the passage of time after the time point t11, which is already lower than the reference value PH1.

壓力設定部12係在開閉閥71的閥控制期間Ta1中使壓力指示值P1*的降低速度變化,俾使開閉閥71的閉鎖速度在閉鎖期間Tc1中變化。在此,考慮將閉鎖期間Tc1分割成兩個前期間T1以及後期間T2。時間點t12係顯示前期間T1與後期間T2之間的交界,且為時間點t11、t13之間的時間點。後期間T2係比前期間T1還後面的期間,後期間T2的長度係例如預先設定。 The pressure setting unit 12 changes the rate of decrease of the pressure instruction value P1* during the valve control period Ta1 of the on-off valve 71 so that the closing speed of the on-off valve 71 changes in the closing period Tc1. Here, consider dividing the blocking period Tc1 into two front periods T1 and a rear period T2. The time point t12 shows the boundary between the pre-period T1 and the post-period T2, and is the time point between the time points t11 and t13. The latter period T2 is a period later than the former period T1, and the length of the latter period T2 is set in advance, for example.

例如,壓力設定部12係以壓力指示值P1*的降低速度的平均在非動作期間Tb1以及前期間T1變成比在後期間T2還高之方式,在閉鎖期間Tc1中使壓力指示值P1*變化。更具體而言,在圖6的例子中,壓力設定部12係在從時間點t11至時間點t12為止的前期間T1中將壓力指示值P1*維持在值P1[0],在時間點t12至時間點t13為止的後期間T2中使壓力指示值P1*從值P1[0]起隨著時間的經過而降低。亦即,壓力設定部12係將壓力指示值P1*的後期間T2中的降低速度的平均{=(P[0]-PL1/T2)}設定成比非動作期間Tb1以及前期間T1中的壓力指示值P1*的降低速度的平均{=(PH1-P[0]/T1)}還低。藉此,測量值Pm1係在後期間T2中比前期間T1還緩緩地降低。後期間T2中的壓力指示值P1*的降低速度係以停止噴出時的噴嘴前端狀態變成良好之方式設定。 For example, the pressure setting unit 12 changes the pressure instruction value P1* during the blocking period Tc1 so that the average of the decreasing speed of the pressure instruction value P1* becomes higher during the non-operating period Tb1 and the front period T1 than the latter period T2. . More specifically, in the example of FIG. 6, the pressure setting unit 12 maintains the pressure instruction value P1* at the value P1[0] during the previous period T1 from the time point t11 to the time point t12, and at the time point t12 In the latter period T2 until the time point t13, the pressure instruction value P1* is reduced from the value P1[0] with the passage of time. That is, the pressure setting unit 12 sets the average of the decreasing speed {=(P[0]-PL1/T2)} in the post-period T2 of the pressure instruction value P1* to be higher than that in the non-operating period Tb1 and the pre-period T1 The average reduction speed of the pressure indication value P1*{=(PH1-P[0]/T1)} is still low. As a result, the measured value Pm1 gradually decreases in the latter period T2 than in the former period T1. The decreasing speed of the pressure instruction value P1* in the latter period T2 is set so that the state of the nozzle tip becomes good when the ejection is stopped.

圖7係用以顯示壓力設定部12的上述動作的更具體性的一例之流程圖,圖8係用以顯示後期間T2中的壓力指示值P1*以及測量值Pm1的更具體性的一例之圖表。如圖8所例示般,在此,壓力設定部12係在後期間T2中使壓力指示值P1*階段性地降低。在圖8的例子中,壓力設定部12係使壓力指示值P1*從值P1[0]朝值P1[5]五階段性地降低。在此,值P1[1]至值P[4]係分別將從值P1[0]至值P1[5]的區域等分地分割成五個時的值。亦即,值P1[0]至值P[5]的相互間的差係彼此相等。此外,值P1[4]係比基準值PL1還高的值,值P1[5]係基準值PL1以下的值(例如為零)。此外,值P1[5]亦可為接近零的值, 例如值P1[5]亦可為0.05MPa左右。 FIG. 7 is a flowchart showing a more specific example of the above-mentioned operation of the pressure setting unit 12, and FIG. 8 is a flowchart showing a more specific example of the pressure indication value P1* and the measured value Pm1 in the post period T2 chart. As illustrated in FIG. 8, here, the pressure setting unit 12 gradually decreases the pressure instruction value P1* in the latter period T2. In the example of FIG. 8, the pressure setting unit 12 decreases the pressure instruction value P1* in five stages from the value P1[0] to the value P1[5]. Here, the value P1[1] to the value P[4] are the values when the area from the value P1[0] to the value P1[5] is equally divided into five, respectively. That is, the differences between the values P1[0] to P[5] are equal to each other. In addition, the value P1[4] is a value higher than the reference value PL1, and the value P1[5] is a value below the reference value PL1 (for example, zero). In addition, the value P1[5] can also be a value close to zero, For example, the value P1[5] may also be about 0.05 MPa.

參照圖7,首先在步驟S1中,壓力設定部12係將壓力指示值P1*從比基準值PH1還高的值更新成值P1[0](參照圖6的時間點t10)。隨著壓力指示值P1*的更新,由於測量值Pm1係變成比壓力指示值P1*(=P1[0])還高,因此會隨著時間的經過而降低。接著,在步驟S2中,壓力設定部12係更新氣體H1的供給壓力的測量值Pm1。更具體而言,壓力設定部12係將從壓力感測器746輸入的測量值Pm1覆寫至記憶媒體。接著,在步驟S3中,壓力設定部12係判定更新後的測量值Pm1是否為壓力指示值P1*(=值P1[0])以下。在測量值Pm1比壓力指示值P1*還高時,壓力設定部12係在判定成測量值Pm1尚未與壓力指示值P1*一致時,再次執行步驟S2。另一方面,在測量值Pm1為壓力指示值P1*以下時,壓力設定部12係判定成測量值Pm1大致與壓力指示值P1*一致,在步驟S4中將計時值初始化成零。控制部130係具有計時電路,該計時值係被該計時電路輸出。 Referring to Fig. 7, first, in step S1, the pressure setting unit 12 updates the pressure instruction value P1* from a value higher than the reference value PH1 to a value P1[0] (refer to the time point t10 in Fig. 6). As the pressure indication value P1* is updated, the measured value Pm1 becomes higher than the pressure indication value P1*(=P1[0]), so it will decrease with the passage of time. Next, in step S2, the pressure setting unit 12 updates the measured value Pm1 of the supply pressure of the gas H1. More specifically, the pressure setting unit 12 overwrites the measurement value Pm1 input from the pressure sensor 746 to the storage medium. Next, in step S3, the pressure setting unit 12 determines whether or not the updated measurement value Pm1 is the pressure instruction value P1* (=value P1[0]) or less. When the measured value Pm1 is higher than the pressure instruction value P1*, the pressure setting unit 12 executes step S2 again when it is determined that the measured value Pm1 does not match the pressure instruction value P1*. On the other hand, when the measured value Pm1 is less than or equal to the pressure instruction value P1*, the pressure setting unit 12 determines that the measured value Pm1 substantially matches the pressure instruction value P1*, and initializes the timer value to zero in step S4. The control unit 130 has a timing circuit, and the timing value is output by the timing circuit.

接著,在步驟S5中,壓力設定部12係判定計時值是否為時間△t1以上。時間△t1係例如預先設定。在計時值未滿時間△t1時,壓力設定部12係再次執行步驟S5。亦即,在從測量值Pm1非常地接近壓力指示值P1*之時間點直至經過時間△t1為止的期間中,將壓力指示值P1*維持在值P1[0]。藉此,在直至經過時間△t1為止的期間中,測量值Pm1係大致與壓力指示值P1*相等,且與時間的經過無關地變成大致一定(參照圖8)。 Next, in step S5, the pressure setting unit 12 determines whether the timer value is equal to or greater than the time Δt1. The time Δt1 is set in advance, for example. When the counted value is less than the time Δt1, the pressure setting unit 12 executes step S5 again. That is, the pressure instruction value P1* is maintained at the value P1[0] during the period from the time point when the measurement value Pm1 is very close to the pressure instruction value P1* until the time Δt1 elapses. Thereby, in the period until the elapsed time Δt1, the measured value Pm1 is substantially equal to the pressure instruction value P1*, and becomes substantially constant regardless of the elapse of time (see FIG. 8).

另一方面,在計時值為時間△t1以上時,壓力設定部12係在步驟S6中將值i初始化成1,在步驟S7中將壓力指示值P1*更新成值P1[i]。值P1[i]係比值P1[i-1]還低的值。藉由壓力指示值P1*的更新,由於測量值Pm1再次變成比壓力指示值P1*還高,因此測量值Pm1再次隨著時間的經過而降低(參照圖8)。 On the other hand, when the timer value is the time Δt1 or more, the pressure setting unit 12 initializes the value i to 1 in step S6, and updates the pressure instruction value P1* to the value P1[i] in step S7. The value P1[i] is a value lower than the value P1[i-1]. With the update of the pressure indication value P1*, since the measurement value Pm1 becomes higher than the pressure indication value P1* again, the measurement value Pm1 again decreases with the passage of time (refer to FIG. 8).

接著,在步驟S8中,壓力設定部12係判定值i是否未滿n(在此為5)。在值i為n以上時,壓力設定部12係結束動作。亦即,當壓力指示值P1*被更新成值P1[n](在此為P1[5])時,由於壓力指示值P1*無須進一步更新,因此結束動作。 Next, in step S8, the pressure setting unit 12 determines whether the value i is less than n (here, 5). When the value i is n or more, the pressure setting unit 12 ends the operation. That is, when the pressure indication value P1* is updated to the value P1[n] (here, P1[5]), since the pressure indication value P1* does not need to be updated further, the operation ends.

另一方面,當值i未滿n時,由於壓力指示值P1*尚未達至值P1[n],因此壓力設定部12係在步驟S9中更新測量值Pm1,在步驟S10中判定測量值Pm1是否為壓力指示值P1*(=值P1[i])以下。在測量值Pm1比壓力指示值P1*還高時,壓力設定部12係判定成測量值Pm1尚未與壓力指示值P1*一致,再次執行步驟S9。在測量值Pm1為壓力指示值P1*以下時,壓力設定部12係判定成測量值Pm1大致與壓力指示值P1*一致,在步驟S11中將計時值初始化成零。 On the other hand, when the value i is less than n, since the pressure instruction value P1* has not reached the value P1[n], the pressure setting unit 12 updates the measured value Pm1 in step S9, and determines the measured value Pm1 in step S10 Is the pressure indication value P1* (=value P1[i]) or less? When the measured value Pm1 is higher than the pressure instruction value P1*, the pressure setting unit 12 determines that the measured value Pm1 has not yet coincided with the pressure instruction value P1*, and performs step S9 again. When the measured value Pm1 is less than or equal to the pressure instruction value P1*, the pressure setting unit 12 determines that the measured value Pm1 substantially matches the pressure instruction value P1*, and initializes the timer value to zero in step S11.

接著,在步驟S12中,壓力設定部12係判定計時值是否為時間△t2以上。時間△t2係例如預先設定,可與時間△t1相同亦可與時間△t1不同。在計時值未滿時間△t2時,壓力設定部12係再次執行步驟S12。亦即,從在測量值Pm1大致與壓力指示值P1*一致的時間點起直至經過時間△t2為止的期間中,將壓力指示值P1*維持在值P1[i]。藉此,在直至經過時間△t2為止的期間中,測量值Pm1係與時間的經過無關地變成大致一定(參照圖8)。 Next, in step S12, the pressure setting unit 12 determines whether the timer value is equal to or greater than the time Δt2. The time Δt2 is preset, for example, and may be the same as the time Δt1 or different from the time Δt1. When the counted value is less than the time Δt2, the pressure setting unit 12 executes step S12 again. That is, the pressure instruction value P1* is maintained at the value P1[i] from the time point when the measurement value Pm1 approximately matches the pressure instruction value P1* until the time Δt2 has elapsed. Thereby, in the period until the elapsed time Δt2, the measured value Pm1 becomes substantially constant regardless of the elapse of time (see FIG. 8).

在計時值為時間△t2以上時,壓力設定部12係在步驟S13中將值i遞增(increment),接著執行步驟S7。藉此,隨著時間△t2的經過,壓力指示值P1*係被更新成下一個值P1[i]。亦即,在每次從測量值Pm1大致與壓力指示值P1*(=P[i])一致的時間點經過時間△t2時,壓力指示值P1*係被更新(參照圖8)。換言之,由於在測量值Pm1非常地接近壓力指示值P1*後直至經過時間△t2為止的期間壓力指示值P1*亦為一定,因此測量值Pm1維持在大致一定。 When the count value is the time Δt2 or more, the pressure setting unit 12 increments the value i in step S13, and then executes step S7. Thereby, as the time Δt2 elapses, the pressure indication value P1* is updated to the next value P1[i]. That is, the pressure instruction value P1* is updated every time the time Δt2 elapses from a point in time when the measured value Pm1 approximately matches the pressure instruction value P1* (=P[i]) (refer to FIG. 8). In other words, since the pressure instruction value P1* is constant after the measured value Pm1 is very close to the pressure instruction value P1* until the time Δt2 elapses, the measured value Pm1 is maintained substantially constant.

如上所述,由於在後期間T2中存在壓力指示值P1*未大致與測 量值Pm1一致且未被更新的期間(時間△t1、時間△t2),因此測量值Pm1在此期間中變成大致一定;相對於此,由於在前期間T1中未存在此種期間,因此測量值Pm1隨著時間的經過持續地降低(亦參照圖6)。因此,前期間T1中的測量值Pm1的降低速度的平均係比後期間T2還高。換言之,前期間T1中的開閉閥71的閉鎖速度的平均係比後期間T2還高。 As mentioned above, due to the presence of the pressure indication value P1* in the latter period T2, it is not roughly consistent with the measured value. During the period (time △t1, time △t2) during which the magnitude Pm1 is consistent and has not been updated, the measured value Pm1 becomes approximately constant during this period; in contrast, since there is no such period in the previous period T1, the measurement The value Pm1 continuously decreases with the passage of time (see also FIG. 6). Therefore, the average rate of decrease of the measured value Pm1 in the previous period T1 is higher than that in the latter period T2. In other words, the average value of the closing speed of the on-off valve 71 in the previous period T1 is higher than that in the latter period T2.

後期間T2中的開閉閥71的閉鎖速度甚至是後期間T2中的壓力指示值P1*的降低速度係以噴嘴前端狀態變成良好之方式被設定。在此,作為一例,以連結壓力指示值P1*的階段波形的突狀的各頂點之假想線A1的傾斜的絕對值來評價後期間T2中的壓力指示值P1*的降低速度。能以下述式子表示後期間T2中的壓力指示值P1*的降低速度β 1。 The closing speed of the on-off valve 71 in the latter period T2 and the rate of decrease of the pressure instruction value P1* in the latter period T2 are set so that the nozzle tip state becomes good. Here, as an example, the rate of decrease of the pressure instruction value P1* in the post period T2 is evaluated by the absolute value of the inclination of the virtual line A1 connecting the protruding apexes of the step waveform of the pressure instruction value P1*. The decrease speed β 1 of the pressure instruction value P1* in the subsequent period T2 can be expressed by the following equation.

式子(1) β 1=P1[0]/(n.△t2) Equation (1) β 1=P1[0]/(n.△t2)

將式子(1)變化時,能以下述式子表示時間△t2。 When the equation (1) is changed, the time Δt2 can be expressed by the following equation.

式子(2) △t2=P1[0]/(n.β 1) Equation (2) △t2=P1[0]/(n.β 1)

由於後期間T2的長度、值P1[0]、值n以及降低速度β 1係以停止噴出時的噴嘴前端狀態變成良好之方式藉由例如模擬或者實驗等而設定,因此能依據式子(2)來決定時間△t2。 Since the length of the post-period T2, the value P1[0], the value n, and the reduced speed β 1 are set by simulations or experiments in such a way that the state of the nozzle tip at the time of stopping ejection becomes good, for example, it can be set according to the formula (2 ) To determine the time △t2.

如上所述,以停止噴出時的噴嘴前端狀態變成良好之方式控制容易對停止噴出時的噴嘴前端狀態造成影響之後期間T2中的開閉閥71的閉鎖速度,且不容易對停止噴出時的噴嘴前端狀態造成影響之前期間T1中的閉鎖速度係被控制成較高。藉此,能適當地停止噴出處理液L1(亦即良好地設定停止噴出時的噴嘴前端狀態),並能縮短閉鎖期間Tc1。亦即,能以更高的響應性關閉開閉閥71。 As described above, it is easy to control the closing speed of the on-off valve 71 in the subsequent period T2 in such a way that the state of the nozzle tip when the spray is stopped becomes good, and it is not easy to control the nozzle tip when the spray is stopped. The blocking speed in T1 during the period before the state affects is controlled to be higher. Thereby, the ejection of the processing liquid L1 can be appropriately stopped (that is, the nozzle tip state when the ejection is stopped is set well), and the lock period Tc1 can be shortened. That is, the on-off valve 71 can be closed with higher responsiveness.

此外,在上述例子中,使壓力指示值P1*在閉鎖期間Tc1中階段性地更新,藉此在閉鎖期間Tc1中使閉鎖速度變化。藉此,能簡單地控制閉鎖速度。 In addition, in the above example, the pressure instruction value P1* is updated stepwise during the lock period Tc1, thereby changing the lock speed during the lock period Tc1. In this way, the locking speed can be easily controlled.

此外,在上述例子中,後期間T2中的壓力指示值P1*的更新次數係比前期間T1中的壓力指示值P1*的更新次數還多。藉此,在容易對停止噴出時的噴嘴前端狀態造成影響之後期間T2中,能更精細地控制氣體H1的供給壓力的降低速度甚至是開閉閥71的閉鎖速度。藉此,由於能將後期間T2中的閉鎖速度控制成期望的速度,因此容易良好地設定噴嘴前端狀態。 In addition, in the above example, the number of times of updating the pressure instruction value P1* in the latter period T2 is more than the number of times of updating the pressure instruction value P1* in the preceding period T1. Thereby, in the period T2 after the nozzle tip state at the time of stopping ejection is likely to be affected, the rate of decrease in the supply pressure of the gas H1 and even the closing rate of the on-off valve 71 can be more finely controlled. Thereby, since the closing speed in the subsequent period T2 can be controlled to a desired speed, it is easy to set the nozzle tip state well.

(3-2-1)壓力指示值P1*的降低速度的變化 (3-2-1) Change in the decreasing speed of the pressure indicating value P1*

(3-2-1-1)值P[i] (3-2-1-1) value P(i)

在圖6以及圖8的例子中,雖然在閉鎖期間Tc1的後期間T2中壓力指示值P1*的降低速度β 1為一定,但並未限定於此。圖9係用以顯示後期間T2中的壓力指示值P1*與測量值Pm1的一例之圖表。在圖9的例子中,值P1[0]至值P[5]相互間的差非為一定。具體而言,值P1[0]至值P[2]相互間的第一差係彼此一定,值P1[2]至值P1[5]相互間的第二差彼此為一定,但第一差設定成比第二差還大。藉此,壓力指示值P1*的降低速度β 1係在後期間T2的初始中獲取高的值β 11後,變成獲取低的值β 12。亦即,能在後期間T2中使壓力指示值P1*的降低速度β 1變化。降低速度β 1係以以下兩個式子表示。 In the examples of FIGS. 6 and 8, although the rate of decrease of the pressure instruction value P1* is constant in the latter period T2 of the lock period Tc1, it is not limited to this. FIG. 9 is a graph showing an example of the pressure indication value P1* and the measured value Pm1 in the post period T2. In the example of FIG. 9, the difference between the value P1[0] and the value P[5] is not constant. Specifically, the first difference between the value P1[0] to the value P[2] is constant with each other, and the second difference between the value P1[2] to the value P1[5] is constant with each other, but the first difference Set to be larger than the second difference. Thereby, the decrease speed β 1 of the pressure instruction value P1* becomes a low value β 12 after obtaining a high value β 11 in the initial stage of the subsequent period T2. That is, in the latter period T2, the rate of decrease of the pressure instruction value P1* can be changed. Decrease speed β 1 is expressed by the following two formulas.

式子(3) β 11=(P1[0]-P1[2])/(2.△t2) Equation (3) β 11=(P1[0]-P1[2])/(2.△t2)

式子(4) β 12=(P1[2]-P1[5])/(3.△t2) Equation (4) β 12=(P1[2]-P1[5])/(3.△t2)

(3-2-1-2)時間△t2 (3-2-1-2) Time△t2

亦可使時間△t2適當地變化,藉此使降低速度β 1變化。圖10係用以顯示 壓力設定部12的動作的一例之流程圖,圖11係用以顯示後期間T2中的壓力指示值P1*與測量值Pm1的一例之圖表。與圖7相比,在圖10的流程圖中,設置有步驟S121至步驟S123以取代步驟S12。步驟S121係在步驟S11之後被執行。在步驟S121中,壓力設定部12係判定值i是否為n1(比n低,在此為2)以下。在值i為n1以下時,在步驟S122中,壓力設定部12係判定計時值是否為時間△t21以上。時間△t21係例如預先設定。在計時值未滿時間△t21時,壓力設定部12係再次執行步驟S122。在計時值為時間△t21以上時,壓力設定部12係依序執行步驟S13、步驟S7。亦即,在值i為n1以下時,在從測量值Pm1大致與壓力指示值P1*一致之時間點起經過時間△t21時,更新壓力指示值P1*(步驟S13、步驟S7)。 It is also possible to appropriately change the time Δt2, thereby changing the reduction speed β1. Figure 10 is used to show The flowchart of an example of the operation of the pressure setting unit 12 is a graph showing an example of the pressure instruction value P1* and the measured value Pm1 in the subsequent period T2. Compared with FIG. 7, in the flowchart of FIG. 10, steps S121 to S123 are provided instead of step S12. Step S121 is executed after step S11. In step S121, the pressure setting unit 12 determines whether or not the value i is n1 (lower than n, here, 2) or less. When the value i is equal to or less than n1, in step S122, the pressure setting unit 12 determines whether or not the timer value is equal to or greater than the time Δt21. The time Δt21 is set in advance, for example. When the counted value is less than the time Δt21, the pressure setting unit 12 executes step S122 again. When the count value is equal to or greater than the time Δt21, the pressure setting unit 12 sequentially executes step S13 and step S7. That is, when the value i is equal to or less than n1, the pressure instruction value P1* is updated when the time Δt21 has elapsed from the time point when the measured value Pm1 approximately matches the pressure instruction value P1* (step S13, step S7).

在圖11的例子中,在從測量值Pm1大致與壓力指示值P1*(=P1[1])一致之時間點起經過時間△t21之時間點中,壓力指示值P1*被更新成值P1[1];在從測量值Pm1大致與更新後的壓力指示值P1*(=P[2])一致之時間點起經過時間△t21之時間點中,壓力指示值P1*被更新成值P1[3]。 In the example of FIG. 11, at the time point when the time Δt21 has elapsed since the measured value Pm1 approximately coincides with the pressure indication value P1*(=P1[1]), the pressure indication value P1* is updated to the value P1 [1]; At the time point when the measured value Pm1 approximately coincides with the updated pressure indication value P1*(=P[2]), the pressure indication value P1* is updated to the value P1 [3].

在步驟S121中於值i比n1還高時,在步驟S123中壓力設定部12係判定計時值是否為時間△t22以上。時間△t22係與時間△t21不同,例如設定成比時間△t21還長的值。在計時值未滿時間△t22時,壓力設定部12係再次執行步驟S123。在計時值為時間△t22以上時,壓力設定部12係依序執行步驟S13、步驟S7。亦即,在值i比n1還高時,在從測量值Pm1大致與壓力指示值P1*一致之時間點起經過時間△t22時,更新壓力指示值P1*(步驟S13、步驟S7)。 When the value i is higher than n1 in step S121, the pressure setting unit 12 determines whether the timer value is equal to or greater than the time Δt22 in step S123. The time Δt22 is different from the time Δt21. For example, it is set to a value longer than the time Δt21. When the counted value is less than the time Δt22, the pressure setting unit 12 executes step S123 again. When the count value is equal to or greater than the time Δt22, the pressure setting unit 12 sequentially executes step S13 and step S7. That is, when the value i is higher than n1, the pressure instruction value P1* is updated when the time Δt22 has elapsed from the time point when the measured value Pm1 approximately coincides with the pressure instruction value P1* (step S13, step S7).

在圖11的例子中,在從測量值Pm1大致與壓力指示值P1*(=P1[3])一致之時間點起經過時間△t22之時間點中,壓力指示值P1*被更新成值P1[4];在從測量值Pm1大致與更新後的壓力指示值P1*(=P[4])一致之時間點 起經過時間△t22之時間點中,壓力指示值P1*被更新成值P1[5]。 In the example of FIG. 11, at the time point when the time Δt22 elapses from the time point when the measured value Pm1 approximately coincides with the pressure indication value P1*(=P1[3]), the pressure indication value P1* is updated to the value P1 [4]; At the point in time when the measured value Pm1 is roughly consistent with the updated pressure indication value P1*(=P[4]) At the time point after the elapsed time Δt22, the pressure indication value P1* is updated to the value P1[5].

藉此,壓力指示值P1*的降低速度β 1係在採取高的值β 13後,變成採取低的值β 14。亦即,能在後期間T2中使壓力指示值P1*的降低速度β 1變化。降低速度β 1(β 13、β 14)係用以下兩個式子來表示。 Thereby, the decreasing speed β 1 of the pressure instruction value P1* takes a high value β 13 and then takes a low value β 14. That is, in the latter period T2, the rate of decrease of the pressure instruction value P1* can be changed. Decrease speed β 1 (β 13, β 14) is expressed by the following two formulas.

式子(5) β 13=(P1[0]-P1[2])/(2.△t21) Equation (5) β 13=(P1[0]-P1[2])/(2.△t21)

式子(6) β 14=(P1[2]-P1[5])/(3.△t22) Equation (6) β 14=(P1[2]-P1[5])/(3.△t22)

在圖9以及圖11的例子中,時間愈經過則愈使後期間T2中的壓力指示值P1*的降低速度β 1降低。藉此,降低速度β 1係在閉鎖期間Tc1中緩緩地降低。因此,能避免開閉閥71的閉鎖速度的急遽的變化。藉此,能降低處理液L1產生吝亂的可能性。 In the example of FIG. 9 and FIG. 11, the decreasing speed β 1 of the pressure instruction value P1* in the subsequent period T2 decreases as the time elapses. Thereby, the reduction speed β 1 is gradually reduced during the lock-up period Tc1. Therefore, a sudden change in the closing speed of the on-off valve 71 can be avoided. Thereby, it is possible to reduce the possibility of stinginess in the treatment liquid L1.

此外,在圖9以及圖11的例子中,雖然在後期間T2中僅使降低速度β 1變化一次,但亦可更精細地變化。 In addition, in the example of FIG. 9 and FIG. 11, although the reduction speed β1 is changed only once in the subsequent period T2, it may be changed more finely.

(3-2-2)PID(Proportional-Integral-Derivative;比例-積分-微分)控制 (3-2-2) PID (Proportional-Integral-Derivative; proportional-integral-derivative) control

(3-2-2-1)增益 (3-2-2-1) gain

在上述例子中,在閉鎖期間Tc1中使壓力指示值P1*階段性地緩緩地降低,藉此使測量值Pm1的降低速度甚至是開閉閥71的閉鎖速度變化。然而,並未限定於此。例如在採用P(proportional;比例)控制、PI(Proportional-Integral;比例積分)控制或者PID(比例積分微分)控制的回授(feedback)控制之情形中,測量值Pm1的降低速度係取決於在該回授控制中所使用的增益(比例增益、積分增益以及微分增益)。因此,亦可適當地設定該增益,藉此調整測量值Pm1的降低速度甚至是開閉閥71的閉鎖速度。 In the above example, the pressure indication value P1* is gradually decreased in the lock period Tc1, thereby changing the rate of decrease of the measured value Pm1 and even the closing rate of the on-off valve 71. However, it is not limited to this. For example, in the case of P (proportional; proportional) control, PI (Proportional-Integral) control, or PID (proportional-integral-derivative) control feedback control, the decrease speed of the measured value Pm1 depends on the The gains used in this feedback control (proportional gain, integral gain, and derivative gain). Therefore, the gain can also be appropriately set to adjust the decrease speed of the measured value Pm1 and even the closing speed of the on-off valve 71.

圖12係用以概略性地顯示控制部130的內部構成的一例之功能方塊圖。例如,控制訊號生成部13係具有減法器131、PID控制部132以及比較部133。於減法器131係被輸入有來自壓力設定部12的壓力指示值P1*以及來自壓力感測器746的測量值Pm1。減法器131係算出壓力指示值P1*與測量值Pm1之間的差△P(=Pm1-P*),並將差△P輸出至PID控制部132。 FIG. 12 is a functional block diagram for schematically showing an example of the internal structure of the control unit 130. For example, the control signal generation unit 13 has a subtractor 131, a PID control unit 132, and a comparison unit 133. The pressure instruction value P1* from the pressure setting unit 12 and the measurement value Pm1 from the pressure sensor 746 are input to the subtractor 131. The subtractor 131 calculates the difference ΔP (=Pm1-P*) between the pressure instruction value P1* and the measured value Pm1, and outputs the difference ΔP to the PID control unit 132.

PID控制部132係對差△P進行P控制、PI控制或者PID控制,生成能率指示值D*並將該能率指示值D*輸出至比較部133。能率指示值D*係針對電磁閥741、742的開閉的能率之目標值。此外,由於在停止噴出時使用以關閉開閉閥71之氣體H1的供給壓力降低,因此電磁閥741的能率亦可在閉鎖動作中恆常地設定成零。在此,作為一例,能率指示值D*係作為電磁閥742的能率之指示值。在此,所謂能率係指例如在一周期中電磁閥742開啟的期間的比例。電磁閥742的能率愈高則氣體H1的供給壓力的降低速度愈高。亦即,能率指示值D*亦可說是與氣體H1的供給壓力對應之指示值。 The PID control unit 132 performs P control, PI control, or PID control on the difference ΔP, generates an energy rate instruction value D*, and outputs the energy rate instruction value D* to the comparison unit 133. The energy rate indicator value D* is a target value of the energy rate for the opening and closing of the solenoid valves 741 and 742. In addition, since the supply pressure of the gas H1 used to close the on-off valve 71 when the ejection is stopped decreases, the energy rate of the solenoid valve 741 can also be constantly set to zero during the closing operation. Here, as an example, the energy rate indicator value D* is used as an indicator value of the energy rate of the solenoid valve 742. Here, the energy rate refers to, for example, the ratio of the period during which the solenoid valve 742 is opened in one cycle. The higher the energy rate of the solenoid valve 742, the higher the rate of decrease of the supply pressure of the gas H1. That is, the energy rate indicator value D* can be said to be an indicator value corresponding to the supply pressure of the gas H1.

比較部133係比較能率指示值D*與載波(例如三角波),依據該比較生成電磁閥742用的控制訊號,並將該控制訊號輸出至控制板140。控制板140係依據該控制訊號控制電磁閥742。 The comparison unit 133 compares the energy rate indication value D* with a carrier wave (for example, a triangular wave), generates a control signal for the solenoid valve 742 based on the comparison, and outputs the control signal to the control board 140. The control board 140 controls the solenoid valve 742 according to the control signal.

藉由該控制,測量值Pm1係接近壓力指示值P1*。圖13係用以概略性地顯示壓力指示值P1*與測量值Pm1的一例之圖表。在圖13的例子中,壓力設定部12係在時間點t10中將壓力指示值P1*更新成值P1[0]。隨著該壓力指示值P1*的降低,測量值Pm1係在時間點t10以後隨著時間的經過而降低。具體而言,壓力測量值Pm1係在從壓力指示值P1*離開時以較高的降低速度降低,而愈接近壓力指示值P1*時則愈以低的降低速度降低。測量值Pm1係逐漸接近壓力指示值P1*。 With this control, the measured value Pm1 is close to the pressure indicating value P1*. FIG. 13 is a graph for schematically showing an example of the pressure indicating value P1* and the measured value Pm1. In the example of FIG. 13, the pressure setting unit 12 updates the pressure instruction value P1* to the value P1[0] at the time point t10. As the pressure indication value P1* decreases, the measured value Pm1 decreases with the passage of time after the time point t10. Specifically, the pressure measurement value Pm1 decreases at a higher rate of decrease when it leaves the pressure indicating value P1*, and decreases at a lower rate of decrease as it approaches the pressure indicating value P1*. The measured value Pm1 is gradually approaching the pressure indication value P1*.

接著,在測量值Pm1與壓力指示值P1*(=P1[0])之間的差變成 比預定值還小之時間點t12中,壓力設定部12係將壓力指示值P1*從值P1[0]更新成值P1[5](例如為零)。隨著此更新,由於在時間點t12中測量值Pm1變成比壓力指示值P1*(=P[5])還高,因此測量值Pm1雖然再次以高的降低速度降低,但是隨著愈接近壓力指示值P1*則降低速度愈變小。 Then, the difference between the measured value Pm1 and the pressure indication value P1*(=P1[0]) becomes At the time t12 which is smaller than the predetermined value, the pressure setting unit 12 updates the pressure instruction value P1* from the value P1[0] to the value P1[5] (for example, zero). With this update, since the measured value Pm1 becomes higher than the pressure indication value P1*(=P[5]) at the time point t12, the measured value Pm1 decreases again at a high rate of decrease, but as it approaches the pressure The indicating value P1* decreases the speed of decrease.

測量值Pm1的降低速度係取決於PID控制部132中所使用的增益(比例增益、積分增益以及微分增益)。例如,當將比例增益設定成愈大,則測量值Pm1係尤其在從壓力指示值P1*離開時愈以更高的降低速度降低。因此,亦可依據這些增益來控制測量值Pm1的降低速度。 The decrease speed of the measured value Pm1 depends on the gain (proportional gain, integral gain, and derivative gain) used in the PID control unit 132. For example, when the proportional gain is set to be larger, the measured value Pm1 decreases at a higher rate of decrease, especially when it departs from the pressure indicating value P1*. Therefore, the rate of decrease of the measured value Pm1 can also be controlled based on these gains.

PID控制部132中的各種增益係以下述方式設定:停止噴出時的噴嘴前端狀態變成良好,且前期間T1中的測量值Pm1的降低速度的平均變成比後期間T2還高。 The various gains in the PID control unit 132 are set in such a way that the nozzle tip state at the time of stopping ejection becomes good, and the average rate of decrease of the measured value Pm1 in the preceding period T1 becomes higher than the latter period T2.

此外,在圖13的例子中,雖然在時間點t10中將壓力指示值P1*暫時更新成值P1[0]並在時間點t12中從值P1[0]更新成值P1[5](例如為零),但是亦可在時間點t10中更新成值P1[5]。然而,只要階段性地降低壓力指示值P1*,即能更精細地控制測量值Pm1的降低速度。更詳細的例子係容後述。 In addition, in the example of FIG. 13, although the pressure indication value P1* is temporarily updated to the value P1[0] at the time point t10, and the value P1[0] is updated to the value P1[5] at the time point t12 (for example, Is zero), but it can also be updated to the value P1[5] at time t10. However, as long as the pressure indication value P1* is gradually decreased, the rate of decrease of the measured value Pm1 can be controlled more finely. A more detailed example will be described later.

(3-2-2-2)壓力指示值 (3-2-2-2) Pressure indication value

亦可使用上述P控制、PI控制或者PID控制並使壓力指示值P1*階段性地降低,藉此更精細地控制閉鎖期間Tc1中的測量值Pm1的降低速度。圖14係用以概略性地顯示後期間T2中的壓力指示值P1*與測量值Pm1的一例之圖。在參照圖7以及圖8所說明的例子中,從測量值Pm1變成壓力指示值P1*以下的時間點起經過時間△t1或者時間△t2時,更新了壓力指示值P1*。然而,在圖14的例子中,由於測量值Pm1係藉由回授控制而逐漸地接近壓力指示值P1*,因此測量值Pm1難以變成壓力指示值P1*以下。亦即,在圖7的步驟S13、步驟S10的判定中,難以檢測時間△t1、△t2的開始時序。 It is also possible to use the above-mentioned P control, PI control, or PID control to gradually reduce the pressure indication value P1*, thereby more finely controlling the rate of decrease of the measured value Pm1 in the blocking period Tc1. FIG. 14 is a diagram for schematically showing an example of the pressure indication value P1* and the measurement value Pm1 in the post period T2. In the example described with reference to FIGS. 7 and 8, the pressure instruction value P1* is updated when the time Δt1 or the time Δt2 elapses from the time point when the measured value Pm1 becomes the pressure instruction value P1* or less. However, in the example of FIG. 14, since the measured value Pm1 gradually approaches the pressure indicating value P1* by feedback control, it is difficult for the measured value Pm1 to become the pressure indicating value P1* or less. That is, in the determination of step S13 and step S10 in FIG. 7, it is difficult to detect the start timing of time Δt1 and Δt2.

因此,在圖14的例子中,壓力設定部12係在從測量值Pm1變成壓力指示值P1*(=P1[0])與預定值p1的和以下之時間點t12起經過時間△t1後,將壓力指示值P1*更新成值P1[1]。同樣地,壓力設定部12係在從測量值Pm1變成壓力指示值P1*(=P1[i]:i=1至5)與預定值p2的和以下之時間點起經過時間△t2後,將壓力指示值P1*更新成值P1[i+1]。 Therefore, in the example of FIG. 14, the pressure setting unit 12 is after the time Δt1 has elapsed from the time point t12 when the measured value Pm1 becomes the pressure instruction value P1*(=P1[0]) and the predetermined value p1 or less. Update the pressure indication value P1* to the value P1[1]. Similarly, the pressure setting unit 12 changes the time Δt2 after the measured value Pm1 becomes the pressure instruction value P1*(=P1[i]: i=1 to 5) and the predetermined value p2 after the time Δt2 has elapsed. The pressure indication value P1* is updated to the value P1[i+1].

亦即,壓力設定部12的動作的一例係除了步驟S3、步驟S10之外,與圖7的流程圖同樣。亦即,在步驟S3中,壓力設定部12係判定測量值Pm1是否為壓力指示值P1*(=P1[0])與預定值p1的和以下;在步驟S10中,壓力設定部12係判定測量值Pm1是否為壓力指示值P1*(=P1[i])與預定值p2的和以下。此外,預定值p1係可與預定值p2相同亦可與預定值p2不同。 That is, an example of the operation of the pressure setting unit 12 is the same as the flowchart of FIG. 7 except for step S3 and step S10. That is, in step S3, the pressure setting unit 12 determines whether the measured value Pm1 is the sum of the pressure instruction value P1*(=P1[0]) and the predetermined value p1 or less; in step S10, the pressure setting unit 12 determines Whether the measured value Pm1 is the sum of the pressure indication value P1*(=P1[i]) and the predetermined value p2 or less. In addition, the predetermined value p1 may be the same as the predetermined value p2 or may be different from the predetermined value p2.

此外,在上述全部的圖表中,在閉鎖期間Tc1中測量值Pm1的降低速度係以緩緩地變低之方式變化。然而,並未限定於此。只要滿足停止噴出時的噴嘴前端狀態變成良好的條件,則亦可使測量值Pm1的降低速度在閉鎖期間Tc1中任意地變化。例如,只要以後期間T2中的測量值Pm1的時間系列變化採取更適合良好地設定噴嘴前端狀態的波形之方式適當地設定壓力指示值P1*或者各種增益即可。例如,亦可以在後期間T2中測量值Pm1的降低速度緩緩地增大之方式設定壓力指示值P1*。 In addition, in all of the above-mentioned graphs, the rate of decrease of the measured value Pm1 in the lock-up period Tc1 changes so as to gradually decrease. However, it is not limited to this. As long as the condition that the state of the nozzle tip at the time of stopping ejection becomes good is satisfied, the rate of decrease of the measured value Pm1 may be changed arbitrarily during the lock period Tc1. For example, as long as the time series change of the measurement value Pm1 in the subsequent period T2 is more suitable for setting the waveform of the nozzle tip state, the pressure instruction value P1* or various gains may be appropriately set. For example, the pressure indication value P1* may be set in such a way that the decreasing speed of the measured value Pm1 in the subsequent period T2 gradually increases.

此外,在無須縮短閉鎖期間Tc1之情形中,亦可將前期間T1中的閉鎖速度設定成比後期間T2還低。總之,亦可獨立地設定前期間T1中的閉鎖速度與後期間T2中的閉鎖速度。藉此,能以停止噴出時的噴嘴前端狀態變成良好之方式控制後期間T2中的閉鎖速度,並獨立地調整閉鎖期間Tc1。 In addition, in the case where it is not necessary to shorten the lock-up period Tc1, the lock-up speed in the front period T1 may be set to be lower than the latter period T2. In short, it is also possible to independently set the blocking speed in the front period T1 and the blocking speed in the rear period T2. Thereby, it is possible to control the closing speed in the subsequent period T2 so that the state of the nozzle tip at the time of stopping ejection becomes good, and to independently adjust the closing period Tc1.

(3-2-3)非動作期間Tb1 (3-2-3) Tb1 during non-operation

接著,說明非動作期間Tb1中的測量值Pm1的降低速度。非動作期間Tb1係氣體H1的供給壓力開始降低後直至閥體711開始移動為止的期間。亦即, 非動作期間Tb1係開閉閥71的閥體711尚未移動之期間。因此,非動作期間Tb1較佳為短。這是由於能縮短閥控制期間Ta1且能提升開閉閥71的響應性之故。 Next, the rate of decrease of the measured value Pm1 in the non-operation period Tb1 will be described. The non-operation period Tb1 is the period after the supply pressure of the gas H1 starts to decrease until the valve body 711 starts to move. that is, The non-operation period Tb1 is a period during which the valve body 711 of the on-off valve 71 has not moved. Therefore, the non-operation period Tb1 is preferably short. This is because the valve control period Ta1 can be shortened and the responsiveness of the on-off valve 71 can be improved.

因此,控制部130亦可以非動作期間Tb1中的測量值Pm1的降低速度的平均變成閉鎖期間Tc1(更具體而言為前期間T1)中的測量值Pm1的降低速度的平均以上之方式控制電磁閥741、742。 Therefore, the control unit 130 may also control the solenoid so that the average of the decrease speed of the measured value Pm1 in the non-operation period Tb1 becomes more than the average of the decrease speed of the measured value Pm1 in the lock-up period Tc1 (more specifically, the previous period T1). Valves 741, 742.

在圖6的例子中,壓力指示值P1*係在非動作期間Tb1以及前期間T1中在值P[0]為一定,並在後期間T2中緩緩地降低。在圖6的例子中,測量值Pm1的降低速度係在非動作期間Tb1以及前期間T1中為相同,並以後期間T2還高。藉此,與測量值Pm1的非動作期間Tb1中的降低速度比前期間T1還低之情形相比,能縮短非動作期間Tb1。此外,雖然亦可在前期間T1中使壓力指示值P1*階段性地降低,但只要設定成降低速度比非動作期間Tb1中的降低速度還低且比後期間T2還高即可。 In the example of FIG. 6, the pressure instruction value P1* is constant in the value P[0] during the non-operation period Tb1 and the preceding period T1, and gradually decreases in the latter period T2. In the example of FIG. 6, the decrease speed of the measured value Pm1 is the same in the non-operation period Tb1 and the previous period T1, and is higher in the subsequent period T2. Thereby, the non-operation period Tb1 can be shortened compared with the case where the rate of decrease in the non-operation period Tb1 of the measured value Pm1 is lower than the previous period T1. In addition, although the pressure instruction value P1* may be gradually decreased in the preceding period T1, it is only necessary to set the decrease speed to be lower than the decrease speed in the non-operation period Tb1 and higher than the latter period T2.

在圖13的例子中,壓力指示值P1*係在非動作期間Tb1以及前期間T1中在值P1[0]為一定,而在後期間T2中採取更低的值P1[5]。在圖14的例子中,由於進行P控制、PI控制或者PID控制,因此測量值Pm1比壓力指示值P1*還遠離之非動作期間Tb1中的降低速度的平均係比測量值Pm1更接近壓力指示值P1*之前期間T1中的降低速度的平均還高,且比後期間T2中的降低速度的平均又更高。藉此,與測量值Pm1的非動作期間Tb1中的降低速度比前期間T1還低之情形相比,能縮短非動作期間Tb1。 In the example of FIG. 13, the pressure instruction value P1* is constant at the value P1[0] in the non-operation period Tb1 and the preceding period T1, and takes a lower value P1[5] in the latter period T2. In the example of FIG. 14, due to the P control, PI control, or PID control, the measured value Pm1 is farther from the pressure instruction value P1*. The average of the decrease speed in the non-operation period Tb1 is closer to the pressure instruction than the measured value Pm1 The value P1* has a higher average rate of decrease in the previous period T1, and is higher than the average rate of decrease in the subsequent period T2. Thereby, the non-operation period Tb1 can be shortened compared with the case where the rate of decrease in the non-operation period Tb1 of the measured value Pm1 is lower than the previous period T1.

縮短非動作期間Tb1,藉此能縮短閥控制期間Ta1。亦即,能提升開閉閥71的響應性。此外,在開閉閥71的響應性提升之點中,雖然亦可縮短前期間T1,然而前期間T1中的閉鎖速度的增大係可能產生處理液L1的吝亂。相對於此,由於非動作期間Tb1係閥體711未移動的期間,因此即使使非動作期間Tb1中的測量值Pm1的降低速度增大亦不會產生處理液L1的吝亂。因 此,相比於縮短前期間T1,期望優先地縮短非動作期間Tb1。 By shortening the non-operation period Tb1, the valve control period Ta1 can be shortened. That is, the responsiveness of the on-off valve 71 can be improved. In addition, at the point where the responsiveness of the on-off valve 71 is improved, although the pre-period T1 can be shortened, the increase in the closing speed in the pre-period T1 may cause the processing liquid L1 to become stingy. In contrast, since the non-operating period Tb1 is a period during which the valve body 711 is not moving, even if the rate of decrease of the measured value Pm1 in the non-operating period Tb1 is increased, the processing liquid L1 does not become stingy. because Therefore, it is desirable to shorten the non-operation period Tb1 preferentially over the shortening of the previous period T1.

此外,控制訊號生成部13亦可以在非動作期間Tb1中恆常地關閉供氣用的電磁閥741並恆常地開啟排氣用的電磁閥742之方式生成電磁閥741、742用的控制訊號。藉此,在非動作期間Tb1中,氣體H1的供給壓力係以最大的降低速度降低。因此,最能縮短非動作期間Tb1。 In addition, the control signal generating unit 13 can also generate control signals for the solenoid valves 741 and 742 by constantly closing the solenoid valve 741 for air supply and opening the solenoid valve 742 for exhaust constantly during the non-operation period Tb1. . Thereby, in the non-operation period Tb1, the supply pressure of the gas H1 is reduced at the maximum reduction rate. Therefore, the non-operation period Tb1 can be shortened the most.

(3-3)吸回閥72的動作速度 (3-3) Action speed of suction valve 72

停止噴出時的吸回閥72的動作速度亦會影響停止噴出時的噴嘴前端狀態。此處所謂的動作速度係相當於吸回閥72的閥體721的變形速度。當吸回閥72的動作速度過高時,於停止噴出時處理液L1會作為液滴從噴嘴251的前端252落下(亦參照圖5以及圖26)。亦即,噴嘴前端狀態變成不佳的狀態。因此,在此,期望將停止噴出時的吸回閥72的動作速度在動作期間Tc2中設定成適當的值。在此,由於吸回閥72係氣體作動閥,因此控制部130係控制供給至吸回閥72之氣體H2的供給壓力的降低速度,藉此控制動作速度。以下,更具體性地說明。 The operating speed of the suction valve 72 when the discharge is stopped also affects the state of the nozzle tip when the discharge is stopped. The operating speed referred to here corresponds to the deformation speed of the valve body 721 of the suction valve 72. When the operating speed of the suction valve 72 is too high, the treatment liquid L1 will fall as a drop from the tip 252 of the nozzle 251 when the ejection is stopped (see also FIGS. 5 and 26). That is, the state of the tip of the nozzle becomes a poor state. Therefore, here, it is desirable to set the operating speed of the suction valve 72 when the discharge is stopped to an appropriate value in the operating period Tc2. Here, since the suction valve 72 is a gas-actuated valve, the control unit 130 controls the rate of decrease of the supply pressure of the gas H2 supplied to the suction valve 72, thereby controlling the operating speed. Hereinafter, it will be explained more specifically.

壓力設定部12係設定針對供給至吸回閥72之氣體H2的供給壓力之目標值(以下稱為壓力指示值)P2*,並將該壓力指示值P2*輸出至控制訊號生成部13。控制訊號生成部13係以氣體H2的供給壓力接近壓力指示值P2*之方式依據壓力指示值P2*生成電磁閥751、752用的控制訊號,並將該控制訊號輸出至控制板140。控制板140係依據該控制訊號控制電磁閥751、752。 The pressure setting unit 12 sets a target value (hereinafter referred to as a pressure instruction value) P2* for the supply pressure of the gas H2 supplied to the suction valve 72, and outputs the pressure instruction value P2* to the control signal generation unit 13. The control signal generating unit 13 generates control signals for the solenoid valves 751 and 752 according to the pressure instruction value P2* in such a way that the supply pressure of the gas H2 approaches the pressure instruction value P2*, and outputs the control signal to the control board 140. The control board 140 controls the solenoid valves 751 and 752 according to the control signal.

如上述般,吸回閥72的閥體721(圖4)係在氣體H2的供給壓力高的狀態下將流路空間72b2的體積維持在小的狀態,降低氣體H2的供給壓力藉此使流路空間72b2的體積增大,從而進行吸回動作。 As described above, the valve body 721 (FIG. 4) of the suction valve 72 keeps the volume of the flow path space 72b2 small when the supply pressure of the gas H2 is high, and reduces the supply pressure of the gas H2 to make the flow The volume of the path space 72b2 increases, so that the suck-in operation is performed.

因此,壓力設定部12係在進行吸回動作時使壓力指示值P2*從比基準值PH2還高的值緩緩地降低至比基準值PL2還低的值。圖15係用以顯示 壓力指示值P2*以及氣體H2的供給壓力的測量值Pm2的一例之圖表。在此,將從使壓力指示值P2*開始降低之時間點t20起至測量值Pm2低於基準值PL2為止之時間點t22為止的期間稱為閥控制期間Ta2,將從時間點t20起至壓力指示值P2*低於基準值PH2之時間點t21為止的期間稱為非動作期間Tb2,將從時間點t21至時間點t22為止的期間稱為動作期間Tc2。 Therefore, the pressure setting unit 12 gradually decreases the pressure instruction value P2* from a value higher than the reference value PH2 to a value lower than the reference value PL2 during the suction operation. Figure 15 is used to show A graph showing an example of the pressure indication value P2* and the measured value Pm2 of the supply pressure of the gas H2. Here, the period from the time point t20 when the pressure instruction value P2* starts to decrease to the time point t22 when the measured value Pm2 is lower than the reference value PL2 is called the valve control period Ta2, and it starts from the time point t20 to the pressure The period from time t21 when the instruction value P2* is lower than the reference value PH2 is referred to as a non-operating period Tb2, and the period from time t21 to time t22 is referred to as an operating period Tc2.

在圖15的例子中,壓力指示值P2*以及測量值Pm2係初始時比基準值PH2還高且大致一致。原因在於:以壓力指示值P2*在初始時採取比基準值PH2還高的值且測量值Pm2接近壓力指示值P2*之方式控制電磁閥751、752。由於測量值Pm2比基準值PH2還高,因此吸回閥72係在初始時將流路空間72b2的體積維持在小的值。此外,初始時開閉閥71開啟,從噴嘴251朝基板W的上表面噴出處理液L1。 In the example of FIG. 15, the pressure indication value P2* and the measurement value Pm2 are initially higher than the reference value PH2 and approximately the same. The reason is that the solenoid valves 751 and 752 are controlled in such a way that the pressure indication value P2* is initially higher than the reference value PH2 and the measured value Pm2 is close to the pressure indication value P2*. Since the measured value Pm2 is higher than the reference value PH2, the suction valve 72 initially maintains the volume of the flow path space 72b2 at a small value. In addition, the on-off valve 71 is opened initially, and the processing liquid L1 is ejected from the nozzle 251 toward the upper surface of the substrate W.

壓力設定部12係隨著開閉閥71的閉鎖將壓力指示值P2*更新成值P2[0](參照時間點t20)。值P2[0]係比基準值PL2還高且為基準值PH2以下之值。在此,值P2[0]係與基準值PH2相等。當壓力指示值P2*被更新成值P2[0]時,由於以氣體H2的供給壓力接近值P2[0]之方式控制電磁閥751、752,因此氣體H2的供給壓力係隨著時間的經過而降低。因此,在圖15中,測量值Pm2係在時間點t20以後隨著時間的經過而降低。接著,當測量值Pm2低於基準值PH2時,吸回閥72的閥體721開始變形。亦即,吸回閥72開始吸回動作。 The pressure setting unit 12 updates the pressure instruction value P2* to the value P2[0] in accordance with the closing of the on-off valve 71 (refer to the time point t20). The value P2[0] is higher than the reference value PL2 and is a value less than the reference value PH2. Here, the value P2[0] is equal to the reference value PH2. When the pressure indication value P2* is updated to the value P2[0], the solenoid valves 751 and 752 are controlled so that the supply pressure of the gas H2 approaches the value P2[0], so the supply pressure of the gas H2 is over time. And reduce. Therefore, in FIG. 15, the measured value Pm2 decreases with the passage of time after the time point t20. Next, when the measured value Pm2 is lower than the reference value PH2, the valve body 721 of the suction valve 72 starts to deform. That is, the suction valve 72 starts the suction operation.

非動作期間Tb2係使壓力指示值P2*降低後直至吸回閥72的閥體721開始變形為止的期間,非動作期間Tb2期望短。在圖15的例子中,並非是在非動作期間Tb2中使壓力指示值P2*隨著時間的經過緩緩地降低至值P2[0],而是在非動作期間Tb2的開始時間點(時間點t20)中降低至值P2[0]。此適合於非動作期間Tb1的縮短。 The non-operation period Tb2 is a period after the pressure instruction value P2* is lowered until the valve body 721 of the suction valve 72 starts to deform, and the non-operation period Tb2 is desirably short. In the example of FIG. 15, the pressure indication value P2* is not gradually reduced to the value P2[0] with the passage of time in the non-operation period Tb2, but at the start time point of the non-operation period Tb2 (time At point t20), it decreases to the value P2[0]. This is suitable for shortening the non-operation period Tb1.

壓力設定部12係在測量值Pm2大致與壓力指示值P2*(=P2[0]) 一致之時間點t21中,使壓力指示值P2*隨著時間的經過從值P2[0]緩緩地降低。亦即,壓力設定部12係將壓力指示值P2*的動作期間Tc2中的降低速度的平均{=(P2[0]-PL2)/Tc2}設定成比非動作期間Tb2中的壓力指示值P2*的降低速度的平均{=(PH2-P2[0]/Tb2)}還低。藉此,氣體H2的供給壓力(測量值Pm2)係在動作期間Tc2中比非動作期間Tb2還緩慢地降低。動作期間Tc2中的壓力指示值P2*的降低速度係以停止噴出時的噴嘴前端狀態變成良好之方式設定。該降低速度係例如藉由模擬或者實驗等所設定。 The pressure setting part 12 is approximately equal to the measured value Pm2 and the pressure indication value P2*(=P2[0]) At the coincident time point t21, the pressure indicating value P2* is gradually reduced from the value P2[0] as time passes. That is, the pressure setting unit 12 sets the average of the decreasing speed {=(P2[0]-PL2)/Tc2} during the operation period Tc2 of the pressure instruction value P2* to be higher than the pressure instruction value P2 in the non-operation period Tb2 The average reduction rate of *{=(PH2-P2[0]/Tb2)} is still low. Thereby, the supply pressure of the gas H2 (measured value Pm2) decreases more slowly in the operating period Tc2 than in the non-operating period Tb2. The decrease speed of the pressure instruction value P2* in the operation period Tc2 is set so that the state of the nozzle tip becomes good when the ejection is stopped. The rate of decrease is set by simulation or experiment, for example.

壓力設定部12的動作的具體性的一例係與圖7的流程圖同樣。具體而言,圖7中,只要將P1*、Pm1、P1[0]以及P1[i]分別置換成P2*、Pm2、P2[0]以及P2[i]即可。因此,在此省略重複的說明。 An example of the specificity of the operation of the pressure setting unit 12 is the same as the flowchart of FIG. 7. Specifically, in FIG. 7, it is sufficient to replace P1*, Pm1, P1[0], and P1[i] with P2*, Pm2, P2[0], and P2[i], respectively. Therefore, repeated descriptions are omitted here.

藉此,由於能將非動作期間Tb2中的測量值Pm2的降低速度設定成比動作期間Tc2還高,因此能良好地設定停止噴出時的噴嘴前端狀態,並能縮短閥控制期間Ta2。換言之,能提升吸回閥72的響應性。 Thereby, since the decrease speed of the measured value Pm2 in the non-operating period Tb2 can be set higher than the operating period Tc2, the nozzle tip state when the ejection is stopped can be set well, and the valve control period Ta2 can be shortened. In other words, the responsiveness of the suction valve 72 can be improved.

(3-3-1)動作期間中的動作速度的變化 (3-3-1) Changes in operating speed during the operating period

(3-3-1-1)壓力指示值 (3-3-1-1) Pressure indication value

在圖15中,雖然在動作期間Tc2中壓力指示值P2*的降低速度大略一定,但並未限定於此。圖16係用以顯示壓力指示值P2*與測量值Pm2的一例之圖。在圖16的例子中,動作期間Tc2係被分割成兩個前期間T21以及後期間T22,前期間T21中的壓力指示值P2*的降低速度係與後期間T22中的降低速度不同,例如較高。此種降低速度的變化係與參照圖8以及圖9所說明同樣地,藉由使值P2[i]的相互間的差以及時間△t2的至少一者變化而實現。 In FIG. 15, although the decreasing speed of the pressure instruction value P2* in the operation period Tc2 is approximately constant, it is not limited to this. Fig. 16 is a diagram for showing an example of the pressure indication value P2* and the measurement value Pm2. In the example of FIG. 16, the operation period Tc2 is divided into two front period T21 and a rear period T22. The pressure indicator value P2* in the front period T21 decreases at a different speed from the decrease speed in the rear period T22. high. Such a change in the reduction speed is achieved by changing at least one of the mutual difference of the value P2[i] and the time Δt2 as described with reference to FIGS. 8 and 9.

(3-3-1-2)PID控制部 (3-3-1-2) PID control part

與開閉閥71同樣地,控制部130係使用P控制、PI控制或者PID控制的回授控制來控制吸回閥72。圖17係用以顯示壓力指示值P2*與測量值Pm2的一例 之圖。在圖17中,壓力設定部12係在時間點t20中將壓力指示值P2*更新成值P2[0],在測量值Pm2大致與壓力指示值P2*(=P2[0])一致之時間點t21中將壓力指示值P2*更新成基準值PL1以下的值(在此為零)。 As with the on-off valve 71, the control unit 130 controls the suction valve 72 using feedback control of P control, PI control, or PID control. Figure 17 shows an example of the pressure indication value P2* and the measured value Pm2 之图. In Fig. 17, the pressure setting unit 12 updates the pressure indication value P2* to the value P2[0] at the time point t20, at the time when the measured value Pm2 roughly coincides with the pressure indication value P2*(=P2[0]) At point t21, the pressure instruction value P2* is updated to a value below the reference value PL1 (here, it is zero).

測量值Pm2係以取決於在回授控制中所使用的各種增益之降低速度降低。在圖17的例子中,測量值Pm2的降低速度係測量值Pm2愈接近壓力指示值P2*則愈變低。在回授控制中所使用的各種增益係以停止噴出時的噴嘴前端狀態變成良好之方式設定。 The measured value Pm2 is decreased at a rate of decrease depending on the various gains used in the feedback control. In the example of FIG. 17, the rate of decrease of the measured value Pm2 is that the closer the measured value Pm2 is to the pressure indicating value P2*, the lower it becomes. The various gains used in the feedback control are set in such a way that the state of the nozzle tip at the time of stopping ejection becomes good.

(4)驅動機構以及閥 (4) Drive mechanism and valve

(4-1)針閥(needle valve) (4-1) Needle valve

在上述例子中,驅動機構74係具備有電磁閥741、742,驅動機構75係具備有電磁閥751、752,但並未限定於此。例如,驅動機構74亦可具備有供氣用的針閥以及排氣用的針閥來取代電磁閥741、742,供氣用的針閥係設置於配管743的路徑中途,排氣用的針閥係設置於配管744的路徑中途。各個針閥係被馬達驅動,且針閥的開放度為可變。例如,排氣用的針閥愈使配管744的開放度增大,則氣體H1的供給壓力的降低速度愈變高。因此,驅動機構74係使排氣用的針閥的開放度在閉鎖期間Tc1中變化,藉此使氣體H1的供給壓力的降低速度如上述般變化。驅動機構75亦同樣。 In the above example, the drive mechanism 74 is provided with solenoid valves 741 and 742, and the drive mechanism 75 is provided with solenoid valves 751 and 752, but it is not limited to this. For example, the drive mechanism 74 may be provided with a needle valve for air supply and a needle valve for exhaust gas instead of the solenoid valves 741 and 742. The needle valve for air supply is provided in the middle of the path of the pipe 743, and the exhaust needle valve The valve system is provided in the middle of the path of the pipe 744. Each needle valve is driven by a motor, and the opening degree of the needle valve is variable. For example, the more the opening degree of the pipe 744 is increased by the needle valve for exhaust, the lower the speed of the supply pressure of the gas H1 becomes higher. Therefore, the drive mechanism 74 changes the opening degree of the needle valve for exhaust during the lock period Tc1, thereby changing the rate of decrease of the supply pressure of the gas H1 as described above. The same is true for the drive mechanism 75.

(4-2)電動閥 (4-2) Electric valve

在上述例子中,開閉閥71以及吸回閥72係氣體作動閥。然而,並未限定於此。開閉閥71以及吸回閥72亦可為電動閥。圖18係用以概略性地顯示基板處理單元1的另一例的基板處理單元1A的構成的一例之圖。 In the above example, the on-off valve 71 and the suction valve 72 are gas-actuated valves. However, it is not limited to this. The on-off valve 71 and the suction valve 72 may also be electric valves. FIG. 18 is a diagram schematically showing an example of the configuration of the substrate processing unit 1A as another example of the substrate processing unit 1.

基板處理單元(亦即處理液噴出裝置)1A係除了具備有處理液供給部7A以取代基板處理單元1的處理液供給部7之外,構成為與基板處理單元1同樣。與基板處理單元1同樣地,基板處理單元1A係能對基板W噴出處理 液L1並逐片地處理基板W。基板處理裝置100係能藉由複數個基板處理單元1A並行地處理複數個基板W。 The substrate processing unit (that is, the processing liquid ejection device) 1A has the same configuration as the substrate processing unit 1 except that the processing liquid supply unit 7A is provided instead of the processing liquid supply unit 7 of the substrate processing unit 1. Like the substrate processing unit 1, the substrate processing unit 1A is capable of ejecting and processing the substrate W Liquid L1 processes the substrate W piece by piece. The substrate processing apparatus 100 can process a plurality of substrates W in parallel by a plurality of substrate processing units 1A.

基板處理單元1A的處理液供給部7A係除了具備有開閉閥(亦即電動閥)71A、吸回閥(亦即電動閥)72A以及驅動機構74A、75A以取代處理液供給部7的開閉閥71、吸回閥72以及驅動機構74、75之外,具有與處理液供給部7同樣的構成。 The processing liquid supply section 7A of the substrate processing unit 1A is provided with an on-off valve (i.e., electric valve) 71A, a suction valve (i.e., electric valve) 72A, and drive mechanisms 74A, 75A instead of the on-off valve of the processing liquid supply section 7 71. Except for the suction valve 72 and the drive mechanisms 74 and 75, it has the same configuration as the processing liquid supply unit 7.

開閉閥71A係具備有閥本體710以及馬達(亦即電動馬達)717,馬達717係驅動閥本體710的開閉機構,藉此將開閉閥71A予以開閉。閥本體710係設置於配管73的路徑中途。於閥本體710內設置有例如未圖示的棒狀體(閥體),該棒狀體係藉由於橫切配管73的內部之方向進退而可將閥體體710予以開閉,亦即該棒狀體係藉由於橫切配管73的內部之方向進退而可將配管73的流路予以開閉。該棒狀體係例如連結至未圖示的滾珠螺桿機構,該滾珠螺桿機構係連結至馬達717的旋轉軸。當馬達717旋轉時,該棒狀體係以已與馬達717的旋轉速度相應之速度於已與旋轉方向相應之方向進退。藉此,閥本體710的開放度與開閉速度係被任意地調整。控制部130係將已與作為目標之開閉速度相應之控制訊號供給至控制板141。控制板141係具有用以驅動馬達717之驅動電路,並將已與該控制訊號相應之驅動電流供給至馬達717。開閉閥71A係以已與馬達717的旋轉數(旋轉速度)相應之速度進行開閉動作。換言之,開閉閥71A係以已與控制板141所供給的驅動電流(在馬達717為例如DC(direct current;直流)馬達時則為驅動電流的電流值;在馬達717為例如步進馬達(stepping motor)時則為驅動電流的脈波的頻率)相應之速度進行開閉。亦即,驅動機構74A係可謂具備有控制板141以及開閉閥71A的馬達717。 The on-off valve 71A includes a valve body 710 and a motor (that is, an electric motor) 717, and the motor 717 drives the opening and closing mechanism of the valve body 710, thereby opening and closing the on-off valve 71A. The valve body 710 is provided in the middle of the path of the pipe 73. The valve body 710 is provided with, for example, a rod-shaped body (valve body) not shown in the figure. The rod-shaped system can open and close the valve body 710 by advancing and retreating in a direction transverse to the inside of the pipe 73, that is, the rod-shaped system The system can open and close the flow path of the pipe 73 by advancing and retreating in a direction transverse to the inside of the pipe 73. The rod-shaped system is connected to a ball screw mechanism not shown, for example, and the ball screw mechanism is connected to the rotation shaft of the motor 717. When the motor 717 rotates, the rod-shaped system advances and retreats in a direction corresponding to the rotation speed at a speed corresponding to the rotation speed of the motor 717. Thereby, the opening degree and the opening and closing speed of the valve body 710 are arbitrarily adjusted. The control unit 130 supplies a control signal corresponding to the target opening and closing speed to the control board 141. The control board 141 has a driving circuit for driving the motor 717, and supplies the driving current corresponding to the control signal to the motor 717. The opening and closing valve 71A performs opening and closing operations at a speed corresponding to the number of rotations (rotation speed) of the motor 717. In other words, the on-off valve 71A is connected to the drive current supplied by the control board 141 (when the motor 717 is, for example, a DC (direct current) motor, it is the current value of the drive current; when the motor 717 is, for example, a stepping motor When motor) is the frequency of the pulse wave of the driving current) the opening and closing are performed at the corresponding speed. That is, the drive mechanism 74A can be said to be a motor 717 provided with a control board 141 and an on-off valve 71A.

即使是在該基板處理單元1A中,亦與開閉閥71同樣地使開閉閥71A的閉鎖速度在閉鎖期間中變化。然而,由於開閉閥71A的閉鎖速度係取 決於馬達717的旋轉速度,因此控制部130係使馬達717的旋轉速度在閉鎖期間中變化。例如,控制部130係以下述方式設定針對旋轉速度之指示值。亦即,以停止噴出時的噴嘴前端狀態變成良好之方式設定後期間中的旋轉速度的指示值,且前期間中的旋轉速度的指示值的平均係以變成比後期間還高之方式設定。 Even in this substrate processing unit 1A, similar to the on-off valve 71, the closing speed of the on-off valve 71A is changed during the closing period. However, since the closing speed of the on-off valve 71A is taken Depending on the rotation speed of the motor 717, the control unit 130 changes the rotation speed of the motor 717 during the lock period. For example, the control unit 130 sets the instruction value for the rotation speed in the following manner. That is, the instruction value of the rotation speed in the subsequent period is set so that the nozzle tip state at the time of stopping ejection becomes good, and the average of the instruction value of the rotation speed in the previous period is set so that it becomes higher than the subsequent period.

吸回閥72A係具備有閥本體720以及馬達(亦即電動馬達)727,馬達727係驅動閥本體720的閥機構,藉此控制吸回閥72A。閥本體720係設置於配管73的路徑中途。於閥本體720內例如設置有閥體,該閥體係形成有作為配管73的內部的流路的一部分而發揮作用之流路空間,且該閥體係可改變流路空間的體積。該閥體係例如連結至未圖示的滾珠螺桿機構,該滾珠螺桿機構係連結至馬達727的旋轉軸。當馬達727旋轉時,該閥體係以已與馬達727的旋轉速度相應之速度變形或者移動並使該流路空間的體積變化。吸回閥72A的動作速度係被任意地調整。控制部130係將已與作為目標之動作速度相應之控制訊號供給至控制板142。控制板142係具有用以驅動馬達727之驅動電路,並將已與該控制訊號相應之驅動電流供給至馬達727。吸回閥72A係以已與馬達727的旋轉數(旋轉速度)相應之速度進行吸回動作。換言之,吸回閥72A係以已與控制板142所供給的驅動電流(在馬達727為例如DC馬達時則為驅動電流的電流值;在馬達727為例如步進馬達時則為驅動電流的脈波的頻率)相應之速度進行吸回動作。亦即,驅動機構75A係可謂具備有控制板142以及吸回閥72A的馬達727。 The suction valve 72A is provided with a valve body 720 and a motor (that is, an electric motor) 727, and the motor 727 is a valve mechanism that drives the valve body 720, thereby controlling the suction valve 72A. The valve body 720 is provided in the middle of the path of the pipe 73. For example, a valve body is provided in the valve body 720, and the valve system is formed with a flow path space that functions as a part of the flow path inside the pipe 73, and the valve system can change the volume of the flow path space. The valve system is connected to a ball screw mechanism not shown, for example, and the ball screw mechanism is connected to the rotating shaft of the motor 727. When the motor 727 rotates, the valve system deforms or moves at a speed corresponding to the rotation speed of the motor 727 and changes the volume of the flow path space. The operating speed of the suction valve 72A is arbitrarily adjusted. The control unit 130 supplies the control signal corresponding to the target movement speed to the control board 142. The control board 142 has a driving circuit for driving the motor 727, and supplies the driving current corresponding to the control signal to the motor 727. The suction valve 72A performs a suction operation at a speed corresponding to the number of rotations (rotation speed) of the motor 727. In other words, the suction valve 72A is based on the driving current supplied by the control board 142 (when the motor 727 is a DC motor, for example, it is the current value of the driving current; when the motor 727 is a stepping motor, it is the pulse of the driving current. The frequency of the wave) corresponding to the speed of the suction action. That is, the drive mechanism 75A can be said to be a motor 727 provided with a control board 142 and a suction valve 72A.

即使是在該基板處理單元1A中,亦與吸回閥72同樣地控制吸回閥72A的動作速度。然而,由於吸回閥72A的動作速度係取決於馬達727的旋轉速度,因此控制部130係設定馬達727的旋轉速度。例如,控制部130係以下述方式設定針對旋轉速度之指示值。亦即,以停止噴出時的噴嘴前端狀態 變成良好之方式設定動作期間中的旋轉速度的指示值。 Even in this substrate processing unit 1A, the operation speed of the suction valve 72A is controlled in the same manner as the suction valve 72. However, since the operating speed of the suction valve 72A depends on the rotation speed of the motor 727, the control unit 130 sets the rotation speed of the motor 727. For example, the control unit 130 sets the instruction value for the rotation speed in the following manner. That is, in the state of the nozzle tip when the spray is stopped It becomes a good way to set the instruction value of the rotation speed during the operation period.

(4-3)閥的形式 (4-3) The form of the valve

在上述例子中,開閉閥71係常閉型的閥。然而,亦可為常開型的氣體作動閥。在此情形中,在閉鎖期間Tc1中控制氣體H1的供給壓力的增大速度,藉此能控制閉鎖速度。同樣地,吸回閥72亦可為下述型式的氣體作動閥:在已將氣體H2排氣的狀態下將流路空間72b2的體積維持在小的值,在已供給有氣體H2的狀態下使流路空間72b2的體積增大。在此情形中,在動作期間Tc2中控制氣體H2的供給壓力的增大速度,藉此能控制吸回動作中的吸回閥72的動作速度。 In the above example, the on-off valve 71 is a normally closed valve. However, it may also be a normally open type gas actuated valve. In this case, the increase speed of the supply pressure of the gas H1 is controlled during the lock period Tc1, thereby controlling the lock speed. Similarly, the suction valve 72 may also be a gas-actuated valve of the following type: in the state where the gas H2 is exhausted, the volume of the flow path space 72b2 is maintained at a small value, and in the state where the gas H2 has been supplied The volume of the flow path space 72b2 is increased. In this case, by controlling the increase speed of the supply pressure of the gas H2 during the operation period Tc2, the operation speed of the suction valve 72 during the suction operation can be controlled.

(5)指示值的種類 (5) Type of indication value

在上述例子中,雖然為了調整開閉閥71以及吸回閥72的動作速度而設定壓力指示值P1*、P2*,但亦可設定能率指示值D*。此原因如下:電磁閥742的能率愈大則氣體H1的供給壓力的降低速度愈高,電磁閥752的能率愈大則氣體H2的供給壓力的降低速度愈高。例如,亦可使針對電磁閥742之能率指示值D*在閉鎖期間Tc1中依序降低,藉此使氣體H1的供給壓力的降低速度在閉鎖期間Tc1中依序降低。針對電磁閥752亦同樣。 In the above example, in order to adjust the operating speed of the on-off valve 71 and the suction valve 72, the pressure instruction values P1* and P2* are set, but the energy rate instruction value D* may be set. The reason for this is as follows: the greater the energy rate of the solenoid valve 742, the higher the rate of decrease of the supply pressure of the gas H1, and the greater the energy rate of the electromagnetic valve 752, the higher the rate of decrease of the supply pressure of the gas H2. For example, the energy rate indication value D* for the solenoid valve 742 may be sequentially decreased during the lock period Tc1, thereby reducing the rate of decrease of the supply pressure of the gas H1 sequentially during the lock period Tc1. The same applies to the solenoid valve 752.

在驅動機構74、75各者具有供氣用的針閥與排氣用的針閥之情形中,由於這些針閥的開放度被控制,因此亦可設定開放度指示值。例如,使針對驅動機構74的排氣用的針閥之開放度指示值在閉鎖期間Tc1中依序降低,藉此能使氣體H1的供給壓力的降低速度在閉鎖期間Tc1中依序降低。該開放度指示值亦能說是已與氣體H1的壓力對應之指示值。 When each of the drive mechanisms 74 and 75 has a needle valve for air supply and a needle valve for exhaust gas, since the opening degree of these needle valves is controlled, the opening degree indication value can also be set. For example, by sequentially decreasing the opening degree indication value of the needle valve for exhaust of the drive mechanism 74 during the lock period Tc1, the rate of decrease in the supply pressure of the gas H1 can be sequentially decreased during the lock period Tc1. The openness indicator value can also be said to be an indicator value corresponding to the pressure of the gas H1.

(第二實施形態) (Second Embodiment)

在第二實施形態中,期望下述事項:以照相機拍攝停止噴出時的噴嘴前端狀態,以使噴嘴前端狀態變成良好之方式依據拍攝影像調整停止噴出時的 開閉閥71的閉鎖速度以及吸回閥72的動作速度的至少任一者。 In the second embodiment, it is desirable to use the camera to photograph the state of the nozzle tip when the ejection is stopped, and adjust the state of the nozzle tip when the ejection is stopped according to the captured image so that the state of the nozzle tip becomes good. At least one of the closing speed of the on-off valve 71 and the operating speed of the suction valve 72.

(1)基板處理單元 (1) Substrate processing unit

圖19係用以概略性地顯示基板處理單元1B的構成的一例之圖。與第一實施形態相比,基板處理單元1B係進一步具備有速度判定裝置(亦稱為判定裝置)300。此外,噴嘴251中的至少前端部係具有透明的材質。作為具有該透明的材質之材料,例如能採用PFA(tetrafluoroethylene-par fluoro alkyl vinyl ether copolymer;四氟乙烯共聚物)或者石英等。因此,存在於噴嘴251的前端部內的流路TG1之處理液L1係被後述的照相機65拍攝。此外,被供給至噴嘴251之處理液L1係通過噴嘴251的流路TG1從噴嘴251的前端252沿著噴出方向AR1噴出至基板W側。以下,亦將處理液L1從噴嘴251的前端252沿著噴出方向AR1流動之區域稱為噴出路徑TG2。 FIG. 19 is a diagram for schematically showing an example of the configuration of the substrate processing unit 1B. Compared with the first embodiment, the substrate processing unit 1B is further provided with a speed determination device (also referred to as a determination device) 300. In addition, at least the tip of the nozzle 251 has a transparent material. As the material with the transparent material, for example, PFA (tetrafluoroethylene-par fluoro alkyl vinyl ether copolymer; tetrafluoroethylene copolymer) or quartz can be used. Therefore, the processing liquid L1 of the flow path TG1 existing in the tip portion of the nozzle 251 is captured by the camera 65 described later. In addition, the processing liquid L1 supplied to the nozzle 251 is ejected from the tip 252 of the nozzle 251 to the substrate W side in the ejection direction AR1 through the flow path TG1 of the nozzle 251. Hereinafter, the area where the processing liquid L1 flows from the tip 252 of the nozzle 251 along the ejection direction AR1 is also referred to as the ejection path TG2.

判定裝置300係判定開閉閥71的閉鎖速度是否適當以及吸回閥72的動作速度是否適當的至少任一者。以下,首先說明閉鎖速度的判定。 The determination device 300 determines at least one of whether the closing speed of the opening and closing valve 71 is appropriate and whether the operation speed of the suction valve 72 is appropriate. Hereinafter, first, the determination of the locking speed will be explained.

(1-1)判定裝置 (1-1) Judging device

判定裝置300係具備有控制部130(亦請參照圖20,更詳細而言為後述的判定部14)以及設置於框體121內之照相機(亦即拍攝部)65。照相機65係與控制部130電性地連接。 The determination device 300 is provided with a control unit 130 (also refer to FIG. 20, more specifically, the determination unit 14 described later) and a camera (that is, an imaging unit) 65 installed in the housing 121. The camera 65 is electrically connected to the control unit 130.

(1-1-1)照相機 (1-1-1) Camera

照相機65係具備有透鏡、拍攝元件以及控制處理電路(皆未圖示)。透鏡係將被拍攝體的光學影像成像至拍攝元件。拍攝元件係將被拍攝體的光學影像轉換成電性訊號並供給至控制處理電路。控制處理電路係與控制部130電性連接,依循控制部130所供給的控制訊號使拍攝元件進行拍攝動作,處理從拍攝元件所供給的各種電性訊號並轉換成多值的數位影像,藉此生成用以表示已與拍攝元件的有效像素數相應之影像之影像訊號並供給至控制部 130。 The camera 65 is equipped with a lens, an imaging element, and a control processing circuit (none of which is shown). The lens system images the optical image of the subject to the imaging element. The imaging element converts the optical image of the object into an electrical signal and supplies it to the control processing circuit. The control processing circuit is electrically connected to the control unit 130, and follows the control signal supplied by the control unit 130 to make the imaging element perform shooting operations, process various electrical signals supplied from the imaging element and convert it into a multi-value digital image, thereby Generate an image signal to indicate an image corresponding to the effective pixel number of the imaging element and supply it to the control unit 130.

亦即,照相機65係處理拍攝元件所供給的各種電性訊號並轉換成數位影像,藉此生成已與拍攝元件的有效像素數相應之影像之影像訊號並輸出至控制部130。控制部130係將該影像訊號(影像)記憶至例如磁碟161。 That is, the camera 65 processes various electrical signals supplied by the imaging element and converts them into digital images, thereby generating image signals corresponding to the effective pixel number of the imaging element and outputting the image signals to the control unit 130. The control unit 130 stores the image signal (image) to, for example, the magnetic disk 161.

具體而言,照相機65係在開閉閥71將流路閉鎖並停止從噴嘴251噴出處理液L1時,依循控制部130的控制拍攝規定在框體121內的攝影對象區域50並獲得影像G0。以下,亦將影像G0稱為原始影像G0。攝影對象區域50係包含有噴嘴251的前端部的流路以及處理液L1的噴出路徑,處理液L1的噴出路徑係從該噴嘴251的前端(噴出口)252沿著處理液L1的噴出方向AR1朝前方延伸。照相機65係從與噴出方向AR1不同的方向進行拍攝。在圖19中,於噴嘴251的前端部包含有內部區域51,於從噴嘴251的前端252朝噴出方向AR1的前方延伸之處理液L1的噴出路徑包含有前方區域52。並且,攝影對象區域50係包含有內部區域51以及前方區域52。內部區域51的下端係位於比噴嘴251的前端252還上方,例如前方區域52的上端係大致與噴嘴251的前端252一致。內部區域51的下端係從前方區域52的上端離開。 Specifically, when the on-off valve 71 closes the flow path and stops ejecting the treatment liquid L1 from the nozzle 251, the camera 65 follows the control of the control unit 130 to photograph the imaging target area 50 specified in the housing 121 and obtain the image G0. Hereinafter, the image G0 is also referred to as the original image G0. The imaging target area 50 includes the flow path of the tip portion of the nozzle 251 and the ejection path of the processing liquid L1. The ejection path of the processing liquid L1 is from the tip (ejection port) 252 of the nozzle 251 along the ejection direction AR1 of the processing liquid L1. Extend to the front. The camera 65 photographs from a direction different from the ejection direction AR1. In FIG. 19, the tip portion of the nozzle 251 includes an internal region 51, and the tip 252 of the nozzle 251 includes a front region 52 in the ejection path of the processing liquid L1 extending forward in the ejection direction AR1. In addition, the imaging target area 50 includes an inner area 51 and a front area 52. The lower end of the inner area 51 is located above the front end 252 of the nozzle 251, for example, the upper end of the front area 52 is substantially coincident with the front end 252 of the nozzle 251. The lower end of the inner area 51 is separated from the upper end of the front area 52.

亦參照圖5,內部區域51以及前方區域52係可視覺辨識噴嘴前端狀態之區域。亦即,內部區域51以及前方區域52係可視覺辨識已與開閉閥71的閉鎖速度相應之噴嘴前端狀態的變動之區域。因此,照相機65拍攝包含有內部區域51以及前方區域52之攝影對象區域50,藉此能在原始影像G0中包含有已與閉鎖速度相應之噴嘴前端狀態。 Referring also to FIG. 5, the inner area 51 and the front area 52 are areas where the state of the nozzle tip can be visually recognized. That is, the inner area 51 and the front area 52 are areas where the change in the nozzle tip state corresponding to the closing speed of the opening and closing valve 71 can be visually recognized. Therefore, the camera 65 photographs the photographic target area 50 including the inner area 51 and the front area 52, so that the nozzle tip state corresponding to the locking speed can be included in the original image G0.

照相機65係依循控制部130的控制,在開閉閥71將流路閉鎖並停止從噴嘴251噴出處理液L1後,時間性地依序拍攝包含有噴嘴251的前端部的內部區域51以及前方區域52之攝影對象區域50,前方區域52係從該噴嘴251的前端252沿著處理液L1的噴出方向AR1朝前方延伸。 The camera 65 follows the control of the control unit 130, and after the on-off valve 71 closes the flow path and stops ejecting the processing liquid L1 from the nozzle 251, it sequentially photographs the internal area 51 and the front area 52 including the tip of the nozzle 251 in time. In the imaging target area 50, the front area 52 extends forward from the tip 252 of the nozzle 251 along the ejection direction AR1 of the processing liquid L1.

(1-1-2)控制部 (1-1-2) Control Department

圖20係用以概略性地顯示控制部130的內部構成的一例之功能方塊圖。控制部130係除了具備有壓力設定部12以及控制訊號生成部13之外,還具備有判定部14以及影像生成部17。由於判定部14以及影像生成部17係進行已依據了照相機65所拍攝的原始影像G0之動作,因此亦可說是屬於判定裝置300。 FIG. 20 is a functional block diagram for schematically showing an example of the internal structure of the control unit 130. The control unit 130 includes a determination unit 14 and an image generation unit 17 in addition to the pressure setting unit 12 and the control signal generation unit 13. Since the determination unit 14 and the image generation unit 17 perform operations based on the original image G0 captured by the camera 65, they can also be said to belong to the determination device 300.

(1-1-2-1)判定部 (1-1-2-1) Judgment Department

判定部14係依據照相機65所拍攝的攝影對象區域50之原始影像G0中之噴嘴251的前端部的內部區域51以及噴嘴251的前方區域52的影像進行預定的判定處理,藉此判定開閉閥71的閉鎖速度為以下何種區分:開閉閥71的閉鎖速度為適當、或者是開閉閥71的閉鎖速度為比預先設定的適當的速度(亦即目標速度或者目標閉鎖速度)還高、或者是開閉閥71的閉鎖速度為比預先設定的適當的速度還低。亦即,判定部14係判定停止從噴嘴251噴出處理液L1的停止狀態(停止噴出時的噴嘴前端狀態)。 The judging unit 14 performs predetermined judging processing based on the image of the internal area 51 of the tip of the nozzle 251 and the image of the area 52 in front of the nozzle 251 in the original image G0 of the photographic target area 50 captured by the camera 65, thereby judging the opening and closing valve 71 Which of the following distinctions is the locking speed of the opening and closing valve 71 is appropriate, or the closing speed of the opening and closing valve 71 is higher than the preset appropriate speed (that is, the target speed or the target locking speed), or the opening and closing The closing speed of the valve 71 is lower than an appropriate speed set in advance. In other words, the determination unit 14 determines the stop state of the treatment liquid L1 from the nozzle 251 (the nozzle tip state when the discharge is stopped).

判定部14係具備有特徵量算出部15以及規定基礎判定部16。 The determination unit 14 includes a feature quantity calculation unit 15 and a predetermined basic determination unit 16.

特徵量算出部15係針對照相機65所拍攝的攝影對象區域50之原始影像G0中之與內部區域51對應之區域A(亦即第一影像區域)的第一影像G1以及與前方區域52對應之區域B(亦即第二影像區域)的第二影像G2各者的影像,算出已與處理液L1的影像的面積相應之預定的特徵量。作為特徵量,採用例如在第一影像G1以及第二影像G2各者的區域內的各個像素的灰階中的像素值的總和、亮度的總和、灰階中的像素值的標準偏差或者亮度的標準偏差等。 The feature amount calculation unit 15 is for the first image G1 of the area A (that is, the first image area) corresponding to the inner area 51 in the original image G0 of the photographic target area 50 captured by the camera 65 and the first image G1 corresponding to the front area 52 For each image of the second image G2 in the area B (that is, the second image area), a predetermined feature amount corresponding to the area of the image of the treatment liquid L1 is calculated. As the feature quantity, for example, the sum of the pixel values in the gray scale, the sum of the brightness, the standard deviation of the pixel value in the gray scale, or the brightness of each pixel in the region of the first image G1 and the second image G2 is used. Standard deviation, etc.

規定基礎判定部16係將預定的判定規則K1應用於第一影像G1的特徵量與第二影像G2的特徵量,藉此判定開閉閥71的閉鎖速度的區分。 The predetermined basic determination unit 16 applies a predetermined determination rule K1 to the feature amount of the first image G1 and the feature amount of the second image G2, thereby determining the distinction between the closing speed of the on-off valve 71.

採用例如下述規則作為判定規則K1:當內部區域51非為液密狀態時,判定成開閉閥71的閉鎖速度過高;當內部區域51為液密狀態且於前方區域52存在有處理液L1時,判定成開閉閥71的閉鎖速度過低。該判定規則K1係記憶於例如磁碟161。在此種判定中,由於依據反映有已與開閉閥71的閉鎖速度相應之噴嘴前端狀態的變動之原始影像G0判定閉鎖速度是否適當,因此能以高的判定精度判定動作速度是否適當。 For example, the following rule is adopted as the determination rule K1: when the internal area 51 is not in a liquid-tight state, it is determined that the closing speed of the on-off valve 71 is too high; when the internal area 51 is in a liquid-tight state and the treatment liquid L1 exists in the front area 52 At this time, it is determined that the closing speed of the on-off valve 71 is too low. The determination rule K1 is memorized on the disk 161, for example. In this determination, since the original image G0 reflecting the change in the nozzle tip state corresponding to the closing speed of the on-off valve 71 is used to determine whether the closing speed is appropriate, it is possible to determine whether the operating speed is appropriate with high determination accuracy.

(1-1-2-2)影像生成部 (1-1-2-2) Image generation department

如參照圖5所說明般,在開閉閥71的閉鎖速度過低之情形中,在停止噴出時從噴嘴251落下液滴L2。由於該液滴L2的落下的時間點並不固定,因此難以在一次的拍攝中將液滴L2收錄於原始影像G0內。因此,在停止噴出時的一定時間內照相機65連續地進行拍攝,藉此謀求拍攝液滴L2。藉此,能於藉由拍攝所獲得的複數個原始影像G0(時間系列影像)中的任一個原始影像G0中包含有液滴L2。 As described with reference to FIG. 5, in a case where the closing speed of the on-off valve 71 is too low, the droplet L2 is dropped from the nozzle 251 when the ejection is stopped. Since the time when the droplet L2 falls is not fixed, it is difficult to include the droplet L2 in the original image G0 in one shot. Therefore, the camera 65 continuously images for a certain period of time when the ejection is stopped, thereby attempting to image the droplet L2. Thereby, the droplet L2 can be included in any one of the original images G0 (time series images) obtained by shooting.

雖然判定部14亦可將判定規則K1應用於複數個原始影像G0的全部的原始影像G0,但在此為了更簡易地進行處理,依據複數個原始影像G0生成成為判定規則K1的應用對象之影像(亦即派生影像)G10。 Although the judging unit 14 can also apply the judging rule K1 to all the original images G0 of the plurality of original images G0, here, in order to make the processing easier, an image that becomes the application target of the judgment rule K1 is generated based on the plurality of original images G0. (That is, derived image) G10.

例如,影像生成部17係依據時間系列影像(複數個原始影像G0)生成派生影像G10,該時間系列影像係從噴嘴251停止噴出處理液L1後直至經過一定時間為止的期間所拍攝。該一定時間係例如為三秒。作為用以規定該一定時間的開始時序之停止噴出時序係例如可採用壓力指示值P1*已低於基準值PL1之時間點或者從該時間點延遲達至預定時間之時間點。或者,亦可於基板處理單元1B設置用以檢測開閉閥71的開閉之開閉感測器,並採用已藉由該開閉感測器檢測到閉狀態之時間點。 For example, the image generation unit 17 generates a derivative image G10 based on a time series image (a plurality of original images G0), which is taken during the period after the nozzle 251 stops spraying the treatment liquid L1 until a certain time elapses. The certain period of time is, for example, three seconds. The discharge stop sequence for specifying the start sequence for the predetermined time may be, for example, a point in time when the pressure indication value P1* has fallen below the reference value PL1 or a point in time delayed from this point in time to a predetermined time. Alternatively, an opening and closing sensor for detecting the opening and closing of the opening and closing valve 71 may be provided in the substrate processing unit 1B, and the time point at which the closed state has been detected by the opening and closing sensor may be used.

影像生成部17係將複數個原始影像G0的相同座標的各個像素 的像素值予以平均或者積算並生成派生影像G10。於該派生影像G10包含有處理液的存在態樣的時間變化。因此,由於在派生影像G10包含有已反映有噴嘴前端狀態之原始影像G0的資訊,因此將判定規則K1應用於該派生影像G10,藉此能判定噴嘴前端狀態,從而能判定開閉閥71的閉鎖速度的區分。 The image generation unit 17 combines the pixels of the same coordinates of the plural original images G0 The pixel values of are averaged or integrated and a derivative image G10 is generated. The derivative image G10 includes a temporal change in the state of the treatment liquid. Therefore, since the derivative image G10 contains the information of the original image G0 that has reflected the nozzle tip state, the determination rule K1 is applied to the derivative image G10, whereby the nozzle tip state can be determined, and the closing of the opening and closing valve 71 can be determined Speed distinction.

更具體而言,例如在因為開閉閥71的閉鎖速度低而導致液滴L2落下之情形中(亦參照圖5),認為派生影像G10的前方區域52中的像素值(或者亮度值)係變大達至液滴L2的分量。亦即,派生影像G10中之與前方區域52對應之派生影像G12的特徵量(灰階的中像素值、亮度值的總和、灰階中的像素值的標準偏差或者亮度的標準偏差)係相比於閉鎖速度適當的情形中的特徵量還變大。在此情形中,判定部14係比較派生影像G12的特徵量與預定的基準量(空白基準值)之間的大小,在該特徵量比該基準值還大時,判定開閉速度比適當的速度還低(亦即過低)。 More specifically, for example, in the case where the droplet L2 falls due to the low closing speed of the opening and closing valve 71 (see also FIG. 5), it is considered that the pixel value (or brightness value) in the front area 52 of the derivative image G10 is changed. As large as the droplet L2. That is, the feature quantity of the derived image G12 corresponding to the front area 52 in the derived image G10 (the median pixel value of the gray scale, the sum of the brightness values, the standard deviation of the pixel values in the gray scale, or the standard deviation of the brightness) corresponds to The feature quantity becomes larger than that in the case where the locking speed is appropriate. In this case, the determination unit 14 compares the feature amount of the derivative image G12 with a predetermined reference amount (blank reference value), and when the feature amount is greater than the reference value, determines that the opening and closing speed is faster than the appropriate speed. Still low (that is, too low).

此外,在因為開閉閥71的閉鎖速度高導致於噴嘴251的前端部產生氣柱之情形中(亦參照圖5),認為派生影像G10的內部區域51中的像素值(或者亮度值)係變小達至該氣柱的分量。亦即,派生影像G10中之與內部區域51對應之派生影像G11的特徵量係相比於閉鎖速度適當的情形中的特徵量還變小。在此情形中,判定部14係比較派生影像G11的特徵量與預定的基準量(液密基準值)之間的大小,在該特徵量比該基準值還小時,判定開閉速度比適當的速度還高(亦即過高)。 In addition, in the case where an air column is generated at the tip of the nozzle 251 due to the high closing speed of the opening and closing valve 71 (see also FIG. 5), it is considered that the pixel value (or brightness value) in the inner region 51 of the derivative image G10 is changed. As small as the weight of the air column. That is, the feature amount of the derivative image G11 corresponding to the inner region 51 in the derivative image G10 is smaller than the feature amount in the case where the locking speed is appropriate. In this case, the determining unit 14 compares the characteristic amount of the derivative image G11 with a predetermined reference amount (liquid-tightness reference value). When the characteristic amount is smaller than the reference value, it is determined that the opening and closing speed is faster than the appropriate speed. Still high (that is, too high).

(1-2)閉鎖速度的調整 (1-2) Adjustment of blocking speed

控制部130係依據判定裝置300所判定的開閉閥71的閉鎖速度的區分,以該閉鎖速度(更具體而言為後期間T2中的閉鎖速度)變成適當的速度之方式決定控制參數(壓力指示值P1*的降低速度β 1、能率指示值D*、開放度指示值或者各種增益等)。 The control unit 130 determines the control parameter (pressure indicator) based on the classification of the closing speed of the on-off valve 71 determined by the determination device 300, and determines the control parameter (pressure indicator) so that the closing speed (more specifically, the closing speed in the later period T2) becomes an appropriate speed. Decrease speed β of value P1* 1, energy rate indication value D*, openness indication value or various gains, etc.).

例如,壓力設定部12係依據判定裝置300所判定的開閉閥71的閉鎖速度的區分,決定後期間T2中的壓力指示值P1*的降低速度β 1。具體而言,壓力設定部12係在閉鎖速度過高之情形中,在使後期間T2中的降低速度β 1降低;在開閉速度過低之情形中,使後期間T2中的降低速度β 1增大。藉此,能將閉鎖速度設定成適當的速度,且能更確實且良好地設定停止噴出時的噴嘴前端狀態。 For example, the pressure setting unit 12 determines the decrease speed β1 of the pressure instruction value P1* in the post period T2 based on the classification of the closing speed of the on-off valve 71 determined by the determination device 300. Specifically, the pressure setting unit 12 reduces the reduction speed β 1 in the subsequent period T2 when the locking speed is too high; and when the opening and closing speed is too low, reduces the reduction speed β 1 in the subsequent period T2. Increase. Thereby, the lock speed can be set to an appropriate speed, and the nozzle tip state when the ejection is stopped can be set more reliably and well.

或者,在控制訊號生成部13具有PID控制部132之情形中,PID控制部132亦可以閉鎖速度(尤其是後期間T2中的閉鎖速度)變成適當的速度之方式決定各種增益(比例增益、積分增益以及微分增益)。PID控制部132係在閉鎖速度過高之情形中,例如使比例增益降低。此外,PID控制部132係在閉鎖速度過高之情形中,例如使比例增益增大。藉此,能將後期間T2中的閉鎖速度設定成適當的速度,並能更確實且良好地設定停止噴出時的噴嘴前端狀態。 Alternatively, in the case where the control signal generating unit 13 has a PID control unit 132, the PID control unit 132 can also determine various gains (proportional gain, integral gain, etc.) such that the blocking speed (especially the blocking speed in the later period T2) becomes an appropriate speed. Gain and derivative gain). The PID control unit 132 reduces the proportional gain when the blocking speed is too high, for example. In addition, the PID control unit 132 increases the proportional gain when the blocking speed is too high, for example. Thereby, the closing speed in the subsequent period T2 can be set to an appropriate speed, and the nozzle tip state when the ejection is stopped can be set more reliably and well.

(2)基板處理單元1B的動作 (2) Operation of substrate processing unit 1B

圖21係用以顯示基板處理單元1B的動作的一例之流程圖,圖22係用以以圖表形式顯示噴嘴前端狀態與開閉閥71的閉鎖速度的區分之間的關係的一例之圖。 FIG. 21 is a flowchart showing an example of the operation of the substrate processing unit 1B, and FIG. 22 is a diagram showing an example of the relationship between the nozzle tip state and the closing speed of the opening and closing valve 71 in a graph form.

在圖22中,相對於開閉閥71的閉鎖速度為「適當」、「過高」、「過低」這三個狀態各者,例示有「停止後狀態一」與「停止後狀態二」這兩個狀態作為停止噴出時的噴嘴前端狀態。這兩個狀態係藉由照相機65拍攝了攝影對象區域50之原始影像G0而分別示意性地顯示。於圖22的各個原始影像G0顯示有區域A、B。此外,在此為了方便說明,無視吸回閥72的吸回動作。 In FIG. 22, each of the three states of "appropriate", "too high", and "too low" with respect to the closing speed of the on-off valve 71 is illustrated as "state 1 after stop" and "state 2 after stop". The two states are regarded as the nozzle tip state when the ejection is stopped. These two states are shown schematically by the camera 65 capturing the original image G0 of the photographic target area 50. In each original image G0 in FIG. 22, regions A and B are displayed. In addition, for the convenience of description, the suction action of the suction valve 72 is ignored here.

在開閉閥71的閉鎖速度適當之情形中,在剛停止噴出後,處理 液L1的下端係與噴嘴251的前端252一致或者是在比前端252的稍微上方處停止。停止噴出後,液滴L2不會從噴嘴251的前端252落下。亦即,噴嘴前端狀態變成良好的狀態。 In the case where the closing speed of the opening and closing valve 71 is appropriate, immediately after stopping the ejection, process The lower end of the liquid L1 coincides with the front end 252 of the nozzle 251 or stops slightly above the front end 252. After the ejection is stopped, the droplet L2 does not fall from the tip 252 of the nozzle 251. That is, the state of the tip of the nozzle becomes a good state.

在開閉閥71的閉鎖速度過低之情形中,在停止後狀態一中,液滴L2不會落下,且處理液L1的下端面係從噴嘴251的前端252朝向下方並具有凸形狀。此外,在停止後狀態二中,液滴L2落下,處理液L1的下端係與噴嘴251的前端252一致。此外,即使在液滴L2落下之情形中,處理液L1的下端亦不一定要與噴嘴251的前端252一致,處理液L1的下端亦有保持凸形狀之情形。在此情形中,同時發生液滴L2的落下以及處理液L1的下端面具有與停止後狀態一同樣的凸形狀之情形。 In the case where the closing speed of the opening and closing valve 71 is too low, the liquid droplet L2 does not fall in the stopped state 1, and the lower end surface of the processing liquid L1 faces downward from the front end 252 of the nozzle 251 and has a convex shape. In addition, in the second state after the stop, the droplet L2 falls, and the lower end of the processing liquid L1 coincides with the tip 252 of the nozzle 251. In addition, even when the droplet L2 falls, the lower end of the treatment liquid L1 does not necessarily have to coincide with the front end 252 of the nozzle 251, and the lower end of the treatment liquid L1 may maintain a convex shape. In this case, the drop of the liquid drop L2 and the lower end surface of the treatment liquid L1 have the same convex shape as the state after the stop at the same time.

當開閉閥71的閉鎖速度過高時,在停止後狀態一中,藉由所謂的水敲擊,於噴嘴的前端部分產生除了附著於內壁面的液滴L2以及滯留於噴嘴251的前端252的液滴L2之外不存在處理液L1之區域。處理液L1的下端面係位於遠比噴嘴251的前端252還上方。此外,在停止後狀態二中,產生將噴嘴251的前端252閉鎖之大小的液體滯留狀的液滴L2。此外,與停止後狀態一同樣地,於噴嘴251的前端部分產生未存在處理液L1之區域,且處理液L1的下端面係位於遠比噴嘴251的前端252還上方。在停止後狀態一以及停止後狀態二中,殘存於噴嘴251的前端部分之液滴L2係在乾燥時會有變成微粒(particle)之虞。 When the closing speed of the on-off valve 71 is too high, in the state after the stop, so-called water tapping is generated at the tip of the nozzle except for the droplets L2 adhering to the inner wall surface and remaining on the tip 252 of the nozzle 251. There is no area of the treatment liquid L1 outside the droplet L2. The lower end surface of the processing liquid L1 is located far above the front end 252 of the nozzle 251. In addition, in the second state after the stop, a liquid droplet L2 of a size that closes the tip 252 of the nozzle 251 is generated. In addition, as in the stopped state, a region where the processing liquid L1 is not present is generated at the tip portion of the nozzle 251, and the lower end surface of the processing liquid L1 is located far above the tip 252 of the nozzle 251. In the post-stop state 1 and the post-stop state 2, the droplets L2 remaining at the tip of the nozzle 251 may become particles during drying.

以下,適當地參照圖22並依據圖21的流程圖,說明基板處理單元1B(判定裝置300)的動作。 Hereinafter, the operation of the substrate processing unit 1B (determination device 300) will be described with reference to FIG. 22 as appropriate and based on the flowchart of FIG. 21.

在圖21的步驟S210中,照相機65係在開閉閥71將流路閉鎖且在噴嘴251停止噴出處理液L1後拍攝攝影對象區域50,攝影對象區域50係包含有噴嘴251的前端部的內部區域51(圖22)以及噴嘴251的前端252的前方區域 52(圖22)。所拍攝的影像(亦即原始影像)G0係被供給至控制部130。 In step S210 of FIG. 21, the camera 65 captures the imaging target area 50 after the opening and closing valve 71 closes the flow path and the nozzle 251 stops spraying the treatment liquid L1. The imaging target area 50 is the internal area including the tip of the nozzle 251 51 (Figure 22) and the area in front of the tip 252 of the nozzle 251 52 (Figure 22). The captured image (that is, the original image) G0 is supplied to the control unit 130.

接著,在步驟S220中,特徵量算出部15係針對區域A(圖22)的第一影像G1以及區域B(圖22)的第二影像G2算出特徵量,區域A係與噴嘴251的前端部的流路中的內部區域51對應,區域B係與噴嘴251的前端部中的處理液L1的噴出路徑上的前方區域52對應。此外,特徵量算出部15亦可算出派生影像G11、G12的特徵量以取代第一影像G1以及第二影像G2。 Next, in step S220, the feature amount calculation unit 15 calculates the feature amount for the first image G1 of the area A (FIG. 22) and the second image G2 of the area B (FIG. 22), and the area A is related to the tip of the nozzle 251 The internal area 51 in the flow path of φ corresponds to the area B corresponds to the front area 52 on the ejection path of the processing liquid L1 in the tip portion of the nozzle 251. In addition, the feature amount calculation unit 15 may also calculate the feature amount of the derivative images G11 and G12 to replace the first image G1 and the second image G2.

此外,區域A、B係具有噴嘴251的前端(噴出口)252的寬度,且於處理液L1的噴出方向AR1設定成細長狀。 In addition, the regions A and B have the width of the tip (discharge port) 252 of the nozzle 251, and are set to be elongated in the discharge direction AR1 of the processing liquid L1.

接著,在步驟S230中,規定基礎判定部16係依據第一影像G1(或者派生影像G11)的特徵量判定區域A是否為處理液L1所致使之液密狀態。該特徵量係例如為第一影像G1(或者派生影像G11)中的灰階中的像素值的總和、亮度值的總和、灰階中的像素值的標準偏差或者亮度的標準偏差。例如,規定基礎判定部16係在該特徵量比液密基準值還大時判定成區域A為液密狀態,在該特徵量比液密基準值還小時判定成區域A並非是液密狀態。 Next, in step S230, the predetermined basic determination unit 16 determines whether the region A is in the liquid-tight state caused by the processing liquid L1 based on the feature amount of the first image G1 (or the derivative image G11). The feature quantity is, for example, the sum of the pixel values in the gray scale, the sum of the brightness values, the standard deviation of the pixel values in the gray scale, or the standard deviation of the brightness in the first image G1 (or the derivative image G11). For example, the predetermined basic determination unit 16 determines that the area A is in the liquid-tight state when the characteristic amount is greater than the liquid-tightness reference value, and determines that the area A is not in the liquid-tight state when the characteristic amount is less than the liquid-tightness reference value.

當該判定的結果為區域A並非是液密狀態時,在步驟S240中規定基礎判定部16係判定成開閉閥71的閉鎖速度過高。 When the result of this determination is that the area A is not in a liquid-tight state, the predetermined basic determination unit 16 determines in step S240 that the closing speed of the on-off valve 71 is too high.

接著,在步驟S250中,壓力設定部12係以後期間T2中的開閉閥71的閉鎖速度變低之方式決定後期間T2中的壓力指示值P1*的降低速度β 1,且處理係移行至步驟S290。例如,壓力設定部12亦可對降低速度β 1減去預定量△β 1並算出新的降低速度β 1。或者,PID控制部132亦可以後期間T2中的閉鎖速度變低之方式將各種增益變更達至預定量。總之,控制部130係以後期間T2中的閉鎖速度變低之方式將與後期間T2中的氣體H1的供給壓力的降低速度有關連之控制參數變更達至預定量。 Next, in step S250, the pressure setting unit 12 determines the decrease speed β1 of the pressure instruction value P1* in the subsequent period T2 in such a way that the closing speed of the on-off valve 71 in the subsequent period T2 is lowered, and the processing proceeds to step S290. For example, the pressure setting unit 12 may subtract a predetermined amount Δβ1 from the reduction speed β1 and calculate a new reduction speed β1. Alternatively, the PID control unit 132 may change the various gains to a predetermined amount so that the locking speed in the subsequent period T2 becomes lower. In short, the control unit 130 changes the control parameter related to the rate of decrease of the supply pressure of the gas H1 in the subsequent period T2 to a predetermined amount in such a way that the blocking speed in the subsequent period T2 is lowered.

當步驟S230的判定的結果為區域A為液密狀態時,處理係移行 至步驟S260。 When the result of the determination in step S230 is that the area A is in a liquid-tight state, the processing system is shifted Go to step S260.

在步驟S260中,規定基礎判定部16係依據第二影像G2(或者派生影像G12)的特徵量判定區域B是否為幾乎不存在處理液L1之狀態(以下稱為空白狀態)。該特徵量係例如為第二影像G2(或者派生影像G12)中的灰階中的像素值的總和、亮度值的總和、灰階中的像素值的標準偏差或者亮度的標準偏差。例如,規定基礎判定部16係在該特徵量比空白基準值還小時判定成區域B為空白狀態,在該特徵量比空白基準值還大時判定成區域B並非是空白狀態。 In step S260, the predetermined basic determination unit 16 determines whether or not the region B is in a state in which there is almost no processing liquid L1 (hereinafter referred to as a blank state) based on the feature amount of the second image G2 (or the derivative image G12). The feature quantity is, for example, the sum of the pixel values in the gray scale, the sum of the brightness values, the standard deviation of the pixel values in the gray scale, or the standard deviation of the brightness in the second image G2 (or the derivative image G12). For example, the predetermined basic determination unit 16 determines that the area B is in the blank state when the feature amount is smaller than the blank reference value, and determines that the area B is not in the blank state when the feature amount is greater than the blank reference value.

當該判定的結果為於區域B存在有處理液L1時(亦即非為空白狀態時),處理係移行至步驟S270。 When the result of this determination is that the processing liquid L1 exists in the area B (that is, when it is not in a blank state), the processing system moves to step S270.

在步驟S270中,規定基礎判定部16係判定成開閉閥71的閉鎖速度過低。 In step S270, the predetermined basic determination unit 16 determines that the closing speed of the on-off valve 71 is too low.

接著,在步驟S280中,壓力設定部12係以後期間T2中的開閉閥71的閉鎖速度變高之方式設定後期間T2中的壓力指示值P1*的降低速度β 1。例如,壓力設定部12亦可對降低速度β 1加上預定量△β 1並算出新的降低速度β 1。或者,PID控制部132亦可以後期間T2中的閉鎖速度變高之方式將各種增益變更達至預定量。總之,控制部130係以後期間T2中的閉鎖速度變高之方式將與後期間T2中的氣體H1的供給壓力的降低速度有關連之控制參數變更達至預定量。 Next, in step S280, the pressure setting unit 12 sets the decreasing speed β1 of the pressure instruction value P1* in the subsequent period T2 so that the closing speed of the on-off valve 71 in the subsequent period T2 becomes higher. For example, the pressure setting unit 12 may add a predetermined amount Δβ 1 to the reduction speed β 1 and calculate a new reduction speed β 1. Alternatively, the PID control unit 132 may change the various gains to a predetermined amount so that the locking speed in the subsequent period T2 becomes higher. In short, the control unit 130 changes the control parameter related to the rate of decrease in the supply pressure of the gas H1 in the subsequent period T2 to a predetermined amount in a manner that the blocking speed in the subsequent period T2 is increased.

在步驟S250或者步驟S280之後,在步驟S290中,為了以設定的控制參數停止噴出處理液L1,基板處理單元1B係從噴嘴251暫時噴出處理液L1後,再次停止噴出。之後,處理係返回至步驟S210,基板處理單元1B係進行步驟S210以下的各個處理。 After step S250 or step S280, in step S290, in order to stop ejecting the processing liquid L1 with the set control parameter, the substrate processing unit 1B temporarily ejects the processing liquid L1 from the nozzle 251, and then stops the ejection again. After that, the processing system returns to step S210, and the substrate processing unit 1B performs each processing after step S210.

當步驟S260中的判定的結果為區域B是幾乎未存在有處理液 L1之狀態(空白狀態)時,基板處理單元1B係結束圖21的動作。 When the result of the determination in step S260 is that there is almost no treatment liquid in area B In the state of L1 (blank state), the substrate processing unit 1B ends the operation of FIG. 21.

在圖21的動作中,規定基礎判定部16係使用判定規則K1作為下述規則:當內部區域51非為液密狀態時,判定成開閉閥71的閉鎖速度過高;當內部區域51為液密狀態且於前方區域52存在有處理液L1時,判定成開閉閥71的閉鎖速度過低。此外,規定基礎判定部16係將判定規則K1應用於第一影像G1(或者派生影像G11,以下亦同樣)的特徵量與第二影像G2(或者派生影像G12,以下亦同樣)的特徵量,藉此判定開閉閥71的閉鎖速度的區分。由於針對反映有已與開閉閥71的閉鎖速度相應之噴嘴前端狀態的變動之第一影像G1以及第二影像G2個別地檢測處理液的影像的存在並判定開閉閥71的閉鎖速度的區分,因此能以高的判定精度判定閉鎖速度的區分。 In the operation of FIG. 21, the basic determination unit 16 is prescribed to use the determination rule K1 as the following rule: when the internal region 51 is not in a liquid-tight state, it is determined that the closing speed of the on-off valve 71 is too high; when the internal region 51 is liquid When the closed state and the processing liquid L1 exists in the front area 52, it is determined that the closing speed of the on-off valve 71 is too low. In addition, the predetermined basic determination unit 16 applies the determination rule K1 to the feature amount of the first image G1 (or the derivative image G11, the same applies hereafter) and the feature amount of the second image G2 (or the derivative image G12, the same applies hereafter), In this way, the distinction of the closing speed of the on-off valve 71 is determined. Since the first image G1 and the second image G2, which reflect the change in the nozzle tip state corresponding to the closing speed of the opening and closing valve 71, individually detect the presence of the image of the processing liquid and determine the classification of the closing speed of the opening and closing valve 71, The classification of the locking speed can be judged with high judgment accuracy.

如圖22所示,處理液L1的噴出方向AR1的下游側中的區域A的端部係從噴嘴251的前端252朝處理液L1的噴出方向AR1的上游側離開。因此,判定部14係不將噴出方向AR1的下游側中之從第一影像G1(內部區域51)的端部遍及至噴嘴251的前端252之影像區域的影像使用於開閉閥71的閉鎖速度的區分的判定。該影像區域係難以特定處理液L1的存在與開閉閥71的閉鎖速度之間的關係之區域(參照圖22的上段的停止後狀態一以及停止後狀態二)。亦即,即使噴嘴前端狀態良好,由於處理液L1的下端位置係在噴嘴251的前端部參差不齊,因此內部區域51與前方區域52之間的影像區域的狀態(是否為液密狀態)係參差不齊。因此,即使該影像區域不論為液密狀態或者為空白狀態,皆難以將該狀態作為根據判定噴嘴前端狀態是否良好。因此,在該影像區域未被使用於判定之情形中,能提升判定的精度。 As shown in FIG. 22, the end of the area A on the downstream side in the ejection direction AR1 of the processing liquid L1 is separated from the tip 252 of the nozzle 251 toward the upstream side of the ejection direction AR1 of the processing liquid L1. Therefore, the determination unit 14 does not use the image of the image region from the end of the first image G1 (inner region 51) to the tip 252 of the nozzle 251 in the downstream side of the ejection direction AR1 for the closing speed of the opening and closing valve 71 Judgment of distinction. This image area is an area where it is difficult to identify the relationship between the presence of the processing liquid L1 and the closing speed of the on-off valve 71 (refer to the post-stop state 1 and post-stop state 2 in the upper part of FIG. 22). That is, even if the tip of the nozzle is in good condition, since the lower end position of the processing liquid L1 is uneven at the tip of the nozzle 251, the state of the image area between the inner area 51 and the front area 52 (whether it is in a liquid-tight state) is Jagged. Therefore, even if the image area is in a liquid-tight state or a blank state, it is difficult to use this state as a basis to determine whether the nozzle tip state is good. Therefore, in the case where the image area is not used for determination, the accuracy of determination can be improved.

(3)機械學習 (3) Mechanical learning

在上述例子中,判定部14係依據判定規則K1判定開閉閥71的閉鎖速度的區分。然而,並未限定於此。例如,判定部14亦可藉由機械學習判定開閉閥 71的閉鎖速度的區分。 In the above example, the determination unit 14 determines the division of the closing speed of the on-off valve 71 in accordance with the determination rule K1. However, it is not limited to this. For example, the judging unit 14 can also judge the opening and closing valve by mechanical learning. 71 to distinguish the locking speed.

圖23係用以概略性地顯示控制部130的內部構成的一例之功能方塊圖。在圖23的例子中,判定部14係具備有分類器K2。分類器K2係依據照相機65所拍攝的拍攝對象區域50之原始影像G0中之噴嘴251的前端部的內部區域51以及噴嘴251的前方區域52的影像,判定開閉閥71的閉鎖速度為以下何種區分:開閉閥71的閉鎖速度為適當、或者是開閉閥71的閉鎖速度為比適當的速度還高、或者是開閉閥71的閉鎖速度為比適當的速度還低。亦即,判定部14係藉由分類器K2判定開閉閥71的閉鎖速度的區分。 FIG. 23 is a functional block diagram for schematically showing an example of the internal structure of the control unit 130. In the example of FIG. 23, the determination unit 14 includes a classifier K2. The classifier K2 is based on the image of the internal area 51 of the tip of the nozzle 251 and the image of the area 52 in front of the nozzle 251 in the original image G0 of the object area 50 captured by the camera 65 to determine which of the following is the closing speed of the on-off valve 71 Classification: the closing speed of the opening and closing valve 71 is appropriate, or the closing speed of the opening and closing valve 71 is higher than the appropriate speed, or the closing speed of the opening and closing valve 71 is lower than the appropriate speed. That is, the determination unit 14 determines the division of the closing speed of the on-off valve 71 by the classifier K2.

控制部130係具備有機械學習部18。分類器K2係使用照相機65所拍攝的攝影對象區域50之原始影像G0中之噴嘴251的前端部的內部區域51以及噴嘴251的前方區域52的取樣影像並預先藉由機械學習部18所進行之機械學習而生成。 The control unit 130 is provided with a machine learning unit 18. The classifier K2 uses the sampling images of the internal area 51 of the tip of the nozzle 251 and the area 52 in front of the nozzle 251 in the original image G0 of the photographic target area 50 taken by the camera 65 and is performed by the machine learning unit 18 in advance. Generated by mechanical learning.

機械學習部18係將所生成的分類器K2記憶至磁碟161。分類器K2係例如作為用以實現分類器K2的功能之程式或者參數等而被記憶。機械學習部18係使用例如鄰近法(neighbourhood method)、支援向量機(support vector machine)、隨機森林分類器(random forest)、類神經網路等作為機械學習的運算法。 The machine learning unit 18 stores the generated classifier K2 on the disk 161. The classifier K2 is memorized, for example, as a program or parameter for realizing the function of the classifier K2. The machine learning unit 18 uses, for example, a neighborhood method, a support vector machine, a random forest classifier (random forest), a neural network, etc. as an algorithm for machine learning.

此外,亦可以離線(off line)之方式定期性或者不定期性地更新機械學習部18。此外,亦可進一步地對已預先進行機械學習的機械學習部18追加取樣影像(教師資料),並進行線上(on line)學習且進行更新。 In addition, the machine learning unit 18 may also be updated periodically or irregularly in an off-line manner. In addition, it is also possible to further sample images (teacher data) for the machine learning unit 18 that has previously performed machine learning, and perform on-line learning and update.

此外,雖然基板處理裝置100具備有複數個基板處理單元1B,但亦可將藉由機械學習對一個基板處理單元1B生成的分類器K2使用於其他的基板處理單元1B中的開閉閥71的控制。 In addition, although the substrate processing apparatus 100 includes a plurality of substrate processing units 1B, the classifier K2 generated for one substrate processing unit 1B by mechanical learning can also be used to control the on-off valve 71 in the other substrate processing unit 1B. .

圖24係用以顯示基板處理單元1B的上述動作的一例之流程 圖,圖25係用以以圖表形式顯示停止噴出時的噴嘴前端狀態與開閉閥71的閉鎖速度的區分之間的關係的一例之圖。 FIG. 24 is a flow chart for showing an example of the above-mentioned operation of the substrate processing unit 1B Fig. 25 is a diagram for graphically showing an example of the relationship between the nozzle tip state when the ejection is stopped and the division of the closing speed of the on-off valve 71.

在圖24的步驟S310中,機械學習部18係以將包含有噴嘴251的前端部的內部(流路)以及噴嘴251的前端部的前方的處理液L1的噴出路徑之區域C(圖25)的影像分類成開閉閥的閉鎖速度為「適當」、「過高」、「過低」的各個群組之方式進行機械學習。機械學習部18係將藉由機械學習所生成的分類器K2記憶至磁碟161。 In step S310 of FIG. 24, the machine learning unit 18 sets the area C (FIG. 25) including the inside (flow path) of the tip portion of the nozzle 251 and the ejection path of the processing liquid L1 in front of the tip portion of the nozzle 251 The images are classified into groups with the closing speed of the on-off valve as "appropriate", "too high", and "too low" for mechanical learning. The machine learning unit 18 stores the classifier K2 generated by machine learning on the disk 161.

此外,針對圖22的例子,在判定部14應用分類器K2之情形中,分類器K2係依據照相機65所拍攝的攝影對象區域50之原始影像G0中之與內部區域51(圖22)對應之區域A的第一影像G1以及與前方區域52(圖22)對應之區域B的第二影像G2各者的影像,判定開閉閥71的閉鎖速度的區分。分類器K2係使用第一影像G1與第二影像G2各者的取樣影像並預先藉由機械學習而生成。 In addition, for the example of FIG. 22, in the case where the determination unit 14 applies the classifier K2, the classifier K2 is based on the original image G0 of the photographic subject area 50 captured by the camera 65 corresponding to the inner area 51 (FIG. 22) The image of each of the first image G1 of the area A and the second image G2 of the area B corresponding to the front area 52 (FIG. 22) determines the division of the closing speed of the on-off valve 71. The classifier K2 uses the sampled images of each of the first image G1 and the second image G2 and is generated by mechanical learning in advance.

在步驟S320中,照相機65係在開閉閥71將流路閉鎖並停止從噴嘴251噴出處理液L1時拍攝攝影對象區域50,攝影對象區域50係包含有噴嘴251的前端部的內部(流路)以及比噴嘴251的前端部還前方的處理液L1的噴出路徑。 In step S320, the camera 65 captures the imaging target area 50 when the on-off valve 71 closes the flow path and stops ejecting the treatment liquid L1 from the nozzle 251. The imaging target area 50 includes the interior (flow path) of the tip of the nozzle 251 And the ejection path of the processing liquid L1 ahead of the tip of the nozzle 251.

接著,在步驟S330中,判定部14係藉由分類器K2將所拍攝的影像(原始影像)G0中的區域C的影像(或者第一影像G1以及第二影像G2)分類,並判定開閉閥71的閉鎖速度所屬的區分。 Next, in step S330, the determining unit 14 uses the classifier K2 to classify the image of the region C (or the first image G1 and the second image G2) in the captured image (original image) G0, and determine the opening and closing valve The division to which the locking speed of 71 belongs.

此外,區域C係具有噴嘴251的前端(噴出口)252的寬度,且於處理液L1的噴出方向AR1設定成細長狀。圖25的區域C係變成比合併圖22的區域A、B後的範圍還稍微長的區域。這是由於區域A、B彼此分離地設置之故。 In addition, the area C has the width of the tip (discharge port) 252 of the nozzle 251, and is set to be elongated in the discharge direction AR1 of the processing liquid L1. The area C in FIG. 25 becomes a slightly longer area than the area after the areas A and B in FIG. 22 are merged. This is because the areas A and B are separated from each other.

在步驟S340中,判定部14係判定閉鎖速度是否已被分類(判定)成「過高」。 In step S340, the determination unit 14 determines whether the locking speed has been classified (determined) as "too high".

當該判定的結果為該閉鎖速度已被分類成「過高」時,處理係移行至步驟S350。 When the result of the determination is that the locking speed has been classified as "too high", the processing system moves to step S350.

在步驟S350中,壓力設定部12係以後期間T2中的開閉閥71的閉鎖速度變低之方式決定後期間T2中的壓力指示值P1*的降低速度β 1,且處理係移行至步驟S380。例如,壓力設定部12亦可對降低速度β 1減去預定量△β 1並算出新的降低速度β 1。總之,以後期間T2中的閉鎖速度變低之方式將控制參數變更達至預定量。 In step S350, the pressure setting unit 12 determines the decrease speed β1 of the pressure instruction value P1* in the subsequent period T2 so that the closing speed of the on-off valve 71 in the subsequent period T2 decreases, and the processing proceeds to step S380. For example, the pressure setting unit 12 may subtract a predetermined amount Δβ1 from the reduction speed β1 and calculate a new reduction speed β1. In short, the control parameter is changed to a predetermined amount by the way that the blocking speed in the subsequent period T2 becomes lower.

當步驟S340的判定的結果為開閉閥71的閉鎖速度未被分類成「過高」時,處理係移行至步驟S360。 When the result of the determination in step S340 is that the closing speed of the on-off valve 71 is not classified as "too high", the processing system proceeds to step S360.

在步驟S360中,判定部14係判定開閉閥71的閉鎖速度是否已被分類成「過低」。 In step S360, the determination unit 14 determines whether the closing speed of the on-off valve 71 has been classified as "too low".

當該判定的結果為該閉鎖速度已被分類成「過低」時,處理係移行至步驟S370。 When the result of the determination is that the locking speed has been classified as "too low", the processing system moves to step S370.

在步驟S370中,壓力設定部12係以後期間T2中的開閉閥71的閉鎖速度變高之方式決定後期間T2中的壓力指示值P1*的降低速度β 1。例如,壓力設定部12亦可對降低速度β 1加上預定量△β 1並算出新的降低速度β 1。總之,以後期間T2中的閉鎖速度變高之方式將控制參數變更達至預定量。 In step S370, the pressure setting unit 12 determines the decrease speed β1 of the pressure instruction value P1* in the subsequent period T2 in such a way that the closing speed of the on-off valve 71 in the subsequent period T2 becomes higher. For example, the pressure setting unit 12 may add a predetermined amount Δβ 1 to the reduction speed β 1 and calculate a new reduction speed β 1. In short, the control parameter is changed to a predetermined amount by the way that the blocking speed in the subsequent period T2 becomes higher.

在步驟S350或者步驟S370之後,在步驟S380中,為了以設定的控制參數停止噴出處理液L1,基板處理單元1B係從噴嘴251暫時噴出處理液L1後,再次停止噴出。之後,處理係返回至步驟S320,基板處理單元1B係進行步驟S320以下的各個處理。 After step S350 or step S370, in step S380, in order to stop ejecting the processing liquid L1 with the set control parameter, the substrate processing unit 1B temporarily ejects the processing liquid L1 from the nozzle 251, and then stops the ejection again. After that, the processing system returns to step S320, and the substrate processing unit 1B performs each processing after step S320.

在步驟S360中的判定的結果為開閉閥71的閉鎖速度未被分類成「過低」之情形中,基板處理單元1B係結束圖24的動作。 In the case where the result of the determination in step S360 is that the closing speed of the on-off valve 71 is not classified as "too low", the substrate processing unit 1B ends the operation of FIG. 24.

如上所述,即使使用機械學習,亦能因應噴嘴前端狀態調整閉鎖速度。此外,由於藉由使用了反映有已與開閉閥71的閉鎖速度相應之噴嘴前端狀態的變動之原始影像G0(第一影像G1以及第二影像G2)之學習判定閉鎖速度的區分,因此判定的精度高。此外,在將分類器K2應用於第一影像G1以及第二影像G2之情形中,由於未將內部區域51與前方區域52之間的區域採用於判定,因此能提升判定的精度。 As mentioned above, even if mechanical learning is used, the locking speed can be adjusted according to the state of the nozzle tip. In addition, since the original image G0 (the first image G1 and the second image G2) that reflects the change in the nozzle tip state corresponding to the closing speed of the opening and closing valve 71 is used to determine the lock speed distinction, the High precision. In addition, in the case where the classifier K2 is applied to the first image G1 and the second image G2, since the area between the inner area 51 and the front area 52 is not used for the determination, the accuracy of the determination can be improved.

圖26係用以顯示機械學習的模型的一例之示意圖。在圖26的例子中顯示類神經網路(包含有深度捲積神經網路(deep learning))NN1的模型。該模型係儲存於分類器K2。於該模型設置有具備有輸入層、中間層(隱藏層)以及輸出層。各個層係具有複數個節點(人工神經細胞),於各個節點輸入有前段的層的節點的輸出資料。各個節點係輸出例如公知的函數的結果。中間層的層數並未限定於一層,可任意地設定。 Fig. 26 is a schematic diagram showing an example of a model for machine learning. In the example of FIG. 26, a model of NN1 like neural network (including deep learning) NN1 is shown. The model is stored in the classifier K2. The model is provided with an input layer, an intermediate layer (hidden layer), and an output layer. Each layer system has a plurality of nodes (artificial nerve cells), and the output data of the node of the previous layer is input to each node. Each node system outputs, for example, the result of a well-known function. The number of intermediate layers is not limited to one layer, and can be set arbitrarily.

判定部14係使用分類器K2從輸入層經由中間層進行輸出層的運算處理,藉此能進行針對噴嘴前端狀態之匹配。更具體而言,例如判定部14係將所拍攝的影像中的噴嘴前端狀態匹配至複數個群組(圖22所示的六個噴嘴前端狀態)中的任一個群組。在圖26的例子中,各個群組係藉由對應的各個影像Gk示意性地顯示。各個群組的特徵係使用了與上述取樣影像(與前端252附近部分中的剛停止的處理液L1的各個狀態對應之各個取樣影像(更詳細而言為各個取樣影像的像素值或者亮度的總和、或像素值或者亮度的標準偏差))之學習預先生成。 The judging unit 14 uses the classifier K2 to perform arithmetic processing on the output layer from the input layer through the intermediate layer, thereby enabling matching with respect to the nozzle tip state. More specifically, for example, the determination unit 14 matches the nozzle tip state in the captured image to any one of a plurality of groups (the six nozzle tip states shown in FIG. 22). In the example of FIG. 26, each group is schematically displayed by the corresponding image Gk. The characteristics of each group use each sampled image corresponding to each state of the above-mentioned sampled image (corresponding to each state of the processing liquid L1 just stopped in the part near the front end 252 (more specifically, the sum of the pixel value or brightness of each sampled image) , Or pixel value or standard deviation of brightness)) learning in advance.

於輸入層輸入有拍攝了噴嘴251的前端252附近之影像GI(原始影像G0(第一影像G1以及第二影像G2))。所拍攝的影像GI係藉由判定部14所 執行的類神經網路NN1所為之影像辨識,而被匹配至具有最類似的特徵之群組。此外,亦能認為是判定部14輸出影像GI的噴嘴前端狀態被分類至圖22的六個噴嘴前端狀態的任一者之分類結果。 The image GI (original image G0 (first image G1 and second image G2)) near the tip 252 of the nozzle 251 is input into the input layer. The captured image GI is determined by the determination unit 14 The image recognition performed by the executed neural network NN1 is matched to the group with the most similar characteristics. In addition, it can also be considered that the nozzle tip state of the image GI output by the determination unit 14 is classified into any one of the six nozzle tip states in FIG. 22.

接著,判定部14係依據該分類結果將開閉閥71的閉鎖速度分類。例如,判定部14係在影像GI中的噴嘴前端狀態被分類至圖26的紙面上側的兩個噴嘴前端狀態的任一者時,將開閉閥71的閉鎖速度分類至「適當」的群組;在影像GI中的噴嘴前端狀態被分類至圖26的紙面中間的兩個噴嘴前端狀態的任一者時,將開閉閥71的閉鎖速度分類至「過低」的群組;在影像GI中的噴嘴前端狀態被分類至圖26的紙面下側的兩個噴嘴前端狀態時,將開閉閥71的閉鎖速度分類至「過高」的群組。圖26所示的動作係與上述步驟S340、步驟S360的處理對應。 Next, the determination unit 14 classifies the closing speed of the on-off valve 71 based on the classification result. For example, when the nozzle tip state in the image GI is classified into any one of the two nozzle tip states on the upper side of the paper in FIG. 26, the determination unit 14 classifies the closing speed of the on-off valve 71 into the "appropriate" group; When the nozzle tip state in the image GI is classified into either of the two nozzle tip states in the middle of the paper in FIG. 26, the closing speed of the on-off valve 71 is classified into the "too low" group; in the image GI When the nozzle tip state is classified into the two nozzle tip states on the lower side of the paper in FIG. 26, the closing speed of the on-off valve 71 is classified into the "too high" group. The operation shown in FIG. 26 corresponds to the processing of step S340 and step S360 described above.

此外,在上述例子中,判定部14係使用類神經網路將影像GI的噴嘴前端狀態分類成六個噴嘴前端狀態,並依據分類結果將閉鎖速度分類,但並未限定於此。判定部14亦可使用類神經網路直接將閉鎖速度分類。亦即,輸出層亦可將開閉閥71的閉鎖速度分類成「過高」、「適當」以及「過低」這三種群組。 In addition, in the above example, the determination unit 14 uses a neural network to classify the nozzle tip state of the image GI into six nozzle tip states, and classifies the locking speed according to the classification result, but it is not limited to this. The judging unit 14 can also directly classify the locking speed using a neural network. That is, the output layer may also classify the closing speed of the on-off valve 71 into three groups of "too high", "appropriate", and "too low".

此外,圖26的影像GI、Gk係顯示拍攝了噴嘴251的前端252附近之影像,但並非一定是僅抽出噴嘴251的前端252的附近之影像,亦可使拍攝元件所拍攝的整體影像作為特徵向量學習。在此情形中,認為機械學習部19係著眼於結果性地在複數個整體影像中所產生的噴嘴前端狀態的差分並進行學習。 In addition, the images GI and Gk in FIG. 26 show that the image near the tip 252 of the nozzle 251 is taken, but it is not necessarily only the image near the tip 252 of the nozzle 251. The overall image captured by the imaging element can also be used as a feature. Vector learning. In this case, it is considered that the machine learning unit 19 pays attention to the difference of the nozzle tip state that is generated in the plural overall images and performs learning.

(3-1)派生影像 (3-1) Derived image

判定部14亦可依據派生影像G10來進行判定,以取代依據原始影像G0來進行判定。具體而言,判定部14亦可依據派生影像G10中之噴嘴251的前端部 的內部區域51以及噴嘴251的前方區域52的影像判定開閉閥71的閉鎖速度的區分。在此情形中,分類器K2係使用派生影像G10中之噴嘴251的前端部的內部區域51以及噴嘴251的前方區域52的取樣影像並預先藉由機械學習部18所進行的機械學習而生成。 The judging unit 14 can also make a judgment based on the derived image G10 instead of making a judgment based on the original image G0. Specifically, the determination unit 14 may also be based on the tip of the nozzle 251 in the derived image G10 The images of the inner area 51 and the area 52 in front of the nozzle 251 determine the division of the closing speed of the on-off valve 71. In this case, the classifier K2 is generated by the machine learning performed by the machine learning unit 18 using the sample images of the internal area 51 of the front end of the nozzle 251 and the front area 52 of the nozzle 251 in the derivative image G10.

(4)吸回閥 (4) Suction valve

控制部130的判定部14亦可依據照相機65所拍攝的原始影像G0(或者派生影像G10)判定吸回閥72的動作速度的區分。 The determination unit 14 of the control unit 130 may also determine the distinction of the operating speed of the suction valve 72 based on the original image G0 (or the derivative image G10) captured by the camera 65.

圖27係用以以圖表形式顯示噴嘴前端狀態與吸回閥27的動作速度的區分之間的關係的一例之圖。在圖27中,針對吸回閥72的動作速度為「適當」的狀態例示有「停止後狀態一」作為停止噴出時的噴嘴前端狀態;針對吸回閥72動作速度為「過高」的狀態例示有「停止後狀態一」以及「停止後狀態二」這兩個狀態作為停止噴出時的噴嘴前端狀態。這兩個狀態係分別藉由照相機65拍攝了攝影對象區域50之影像G0示意性地顯示。於圖27的各個影像G0顯示有區域D。區域D係與吸回動作後的處理液的端面位置與噴嘴251的前端252之間的流路的至少一部分對應之區域。 FIG. 27 is a diagram showing an example of the relationship between the nozzle tip state and the division of the operating speed of the suction valve 27 in a graph form. In FIG. 27, the state where the operating speed of the suction valve 72 is "appropriate" is illustrated as "state 1 after stop" as the nozzle tip state when the ejection is stopped; for the state where the operating speed of the suction valve 72 is "too high" The two states of "state 1 after stopping" and "state 2 after stopping" are exemplified as the nozzle tip state when ejection is stopped. These two states are schematically displayed by the image G0 of the photographic target area 50 taken by the camera 65 respectively. In each image G0 in FIG. 27, a region D is displayed. The area D is an area corresponding to at least a part of the flow path between the end face position of the processing liquid after the suction operation and the tip 252 of the nozzle 251.

在吸回閥72的動作速度為適當之情形中,剛停止噴出後,處理液L1的下端係在比噴嘴251的前端252還上方停止。在停止噴出後,液滴L2不會從噴嘴251的前端252落下。亦即,噴嘴前端狀態為良好的狀態。 When the operating speed of the suction valve 72 is appropriate, immediately after the discharge is stopped, the lower end of the processing liquid L1 is stopped above the front end 252 of the nozzle 251. After the ejection is stopped, the droplet L2 does not fall from the tip 252 of the nozzle 251. That is, the state of the nozzle tip is in a good state.

在吸回閥72的動作速度過高之情形中,噴嘴前端狀態係變成停止後狀態一或者停止後狀態二。在停止後狀態一中,因為急遽的流路的體積變化,於噴嘴251的前端部的內壁面附著有液滴L2。此外,在停止後狀態二中,於噴嘴251的前端部的內壁面附著有液滴L2,且產生將噴嘴251的前端252閉鎖之大小的液體滯留狀的液滴L2。在停止後狀態一以及停止後狀態二中,殘存於噴嘴251的前端部之液滴L2係在乾燥時會有變成微粒之虞。 In the case where the operating speed of the suction valve 72 is too high, the state of the tip of the nozzle becomes the state after stopping or state two after stopping. In the first state after the stop, the droplet L2 adheres to the inner wall surface of the tip portion of the nozzle 251 due to the rapid change in the volume of the flow path. In addition, in the second state after the stop, a droplet L2 adheres to the inner wall surface of the tip of the nozzle 251, and a liquid droplet L2 of a size that closes the tip 252 of the nozzle 251 is generated. In the post-stop state 1 and the post-stop state 2, the droplets L2 remaining at the tip of the nozzle 251 may become fine particles during drying.

與區域D對應之內部區域53的上端係例如位於比吸回閥72的動作速度適當之情形的處理液L1的下端位置還下側,且內部區域53的下端係大致與噴嘴251的前端252一致。在吸回閥72的動作速度為適當之情形中,幾乎不會於內部區域53內殘存處理液L1;在吸回閥72的動作速度過高之情形中,於內部區域53內殘存有處理液L1作為液滴L2。亦即,內部區域53係可視覺辨識已與吸回閥72的動作速度相應之噴嘴前端狀態的變動之區域。 The upper end of the inner area 53 corresponding to the area D is located, for example, lower than the lower end position of the processing liquid L1 when the operating speed of the suction valve 72 is appropriate, and the lower end of the inner area 53 approximately coincides with the tip 252 of the nozzle 251 . When the operating speed of the suction valve 72 is appropriate, the treatment liquid L1 hardly remains in the internal region 53; when the operation speed of the suction valve 72 is too high, the treatment liquid L1 remains in the internal region 53 L1 serves as droplet L2. That is, the internal area 53 is an area where the change in the nozzle tip state corresponding to the operating speed of the suction valve 72 can be visually recognized.

因此,判定部14係著眼於原始影像G0中之與區域D對應之內部區域53,並判定吸回閥72的動作速度的區分。 Therefore, the determination unit 14 focuses on the internal region 53 corresponding to the region D in the original image G0, and determines the distinction of the operating speed of the suction valve 72.

(4-1)規定基礎 (4-1) Provisional basis

判定部14的特徵量算出部15係針對原始影像G0中之與內部區域53對應之第三影像G3,算出已與處理液L1的影像的面積相應之預定的特徵量。作為特徵量,例如採用第三影像G3的區域內的各個像素的灰階中的像素值的總和、亮度的總和、灰階中的像素值的標準偏差或者亮度的標準偏差等。 The feature amount calculation unit 15 of the determination unit 14 calculates a predetermined feature amount corresponding to the area of the image of the processing liquid L1 for the third image G3 corresponding to the inner region 53 in the original image G0. As the feature quantity, for example, the sum of the pixel values in the gray scale, the sum of the brightness, the standard deviation of the pixel values in the gray scale, or the standard deviation of the brightness of each pixel in the area of the third video G3 is used.

判定部14的規定基礎判定部16係將預定的判定規則應用於第三影像G3的特徵量,藉此判定吸回閥72的動作速度的區分。作為該判定規則,例如只要內部區域53非為空白狀態則判定成吸回閥72的動作速度過高。在此,所謂的空白狀態係指幾乎不會於內部區域53殘存處理液L1之狀態。 The predetermined basic determination unit 16 of the determination unit 14 applies a predetermined determination rule to the feature amount of the third image G3, thereby determining the division of the operating speed of the suction valve 72. As this determination rule, for example, as long as the internal region 53 is not in a blank state, it is determined that the operating speed of the suction valve 72 is too high. Here, the so-called blank state refers to a state in which the processing liquid L1 hardly remains in the inner region 53.

此外,與開閉閥71中的判定處理同樣地,判定部14亦可對派生影像G10進行判定處理。判定部14係針對派生影像G10中之與內部區域53對應之派生影像G13,算出已與處理液L1的影像的面積相應之預定的特徵量。作為特徵量,例如採用派生影像G13的區域內的各個像素的灰階中的像素值的總和、亮度的總和、灰階中的像素值的標準偏差或者亮度的標準偏差等。 In addition, similarly to the determination processing in the on-off valve 71, the determination unit 14 may perform determination processing on the derivative image G10. The determination unit 14 calculates a predetermined feature amount corresponding to the area of the image of the processing liquid L1 for the derivative image G13 corresponding to the inner region 53 in the derivative image G10. As the feature quantity, for example, the sum of the pixel values in the gray scale of each pixel in the region of the derivative image G13, the sum of the brightness, the standard deviation of the pixel value in the gray scale, or the standard deviation of the brightness, etc. are used.

圖28係用以顯示基板處理單元1B的動作的一例之流程圖。在步驟S410中,照相機65係在吸回閥72結束吸回動作後,拍攝包含有噴嘴251 的前端部的內部區域53(圖27)之攝影對象區域50。所拍攝的影像(亦即原始影像)G0係被供給至控制部130。 FIG. 28 is a flowchart for showing an example of the operation of the substrate processing unit 1B. In step S410, the camera 65 captures the nozzle 251 after the suction valve 72 ends the suction operation. The imaging target area 50 is the internal area 53 (FIG. 27) of the front end portion. The captured image (that is, the original image) G0 is supplied to the control unit 130.

在步驟S420中,特徵量算出部15係針對噴嘴251的前端部的流路中之與內部區域53對應之區域D(圖27)的第三影像G3(或者派生影像G13)之特徵量。此外,區域D係具有噴嘴251的前端(噴出口)252的寬度,且於處理液L1的噴出方向AR1設定成細長狀。 In step S420, the feature amount calculation unit 15 is the feature amount of the third image G3 (or the derivative image G13) of the region D (FIG. 27) corresponding to the inner region 53 in the flow path of the tip portion of the nozzle 251. In addition, the area D has the width of the tip (discharge port) 252 of the nozzle 251, and is set to be elongated in the discharge direction AR1 of the processing liquid L1.

接著,在步驟S430中,規定基礎判定部16係依據該特徵量判定區域D是否為空白狀態。該特徵量係例如為第三影像G3(或者派生影像G13)中的灰階的像素值的總和、亮度值的總和、灰階中的像素值的標準偏差或者亮度的標準偏差。例如,規定基礎判定部16係在該特徵量比空白基準值還小時判定成區域D為空白狀態,在該特徵量比空白基準值還大時判定成區域D非為空白狀態。該判定的結果係只要區域D為空白狀態則吸回閥72的動作速度即為適當,故結束處理。 Next, in step S430, the predetermined basic determination unit 16 determines whether or not the area D is in a blank state based on the feature amount. The feature quantity is, for example, the sum of grayscale pixel values, the sum of brightness values, the standard deviation of pixel values in grayscale, or the standard deviation of brightness in the third image G3 (or the derivative image G13). For example, the predetermined basic determination unit 16 determines that the area D is in the blank state when the feature amount is smaller than the blank reference value, and determines that the area D is not in the blank state when the feature amount is greater than the blank reference value. As a result of this determination, as long as the area D is in a blank state, the operating speed of the suction valve 72 is appropriate, and the processing is terminated.

另一方面,該判定的結果係只要區域D非為空白狀態,則在步驟S440中規定基礎判定部16係判定成吸回閥72的動作速度過高。 On the other hand, as a result of this determination, as long as the area D is not in a blank state, the predetermined basic determination unit 16 determines in step S440 that the operating speed of the suction valve 72 is too high.

接著,在步驟S450中,壓力設定部12係以吸回閥72的動作速度變低之方式決定壓力指示值P2*的降低速度β 2(更具體而言為動作期間Tc2中的降低速度β 2)。例如,壓力設定部12係對降低速度β 2減去預定值△β 2並算出新的降低速度β 2。或者,PID控制部132亦可以動作期間Tc2中的動作速度變高之方式將各種增益變更達至預定量。總之,控制部130係以動作期間Tc2中的吸回閥72的動作速度變低之方式,將與動作期間Tc2中的氣體H2的供給壓力的降低速度有關連之控制參數變更達至預定量。 Next, in step S450, the pressure setting unit 12 determines the decrease speed β 2 of the pressure instruction value P2* (more specifically, the decrease speed β 2 during the operation period Tc2) such that the operating speed of the suction valve 72 becomes lower. ). For example, the pressure setting unit 12 subtracts a predetermined value Δβ 2 from the reduction speed β 2 and calculates a new reduction speed β 2. Alternatively, the PID control unit 132 may change various gains to a predetermined amount so that the operating speed during the operating period Tc2 becomes higher. In short, the control unit 130 changes the control parameter related to the decrease speed of the supply pressure of the gas H2 in the operation period Tc2 to a predetermined amount so that the operation speed of the suction valve 72 in the operation period Tc2 decreases.

接著,在步驟S460中,基板處理單元1B係以藉由設定的控制參數進行吸回動作之方式從噴嘴251暫時噴出處理液L1後再次停止噴出。之 後,處理係返回至步驟S410,基板處理單元1B係進行步驟S410以後的各個處理。 Next, in step S460, the substrate processing unit 1B temporarily ejects the processing liquid L1 from the nozzle 251 by performing a suck-back operation according to the set control parameter, and then stops the ejection again. Of After that, the processing system returns to step S410, and the substrate processing unit 1B performs each processing after step S410.

如上所述,依據基板處理單元1B,由於依據反映有已與吸回閥72的動作速度相應之噴嘴前端狀態的變動之第三影像G3(或者派生影像G13)判定吸回閥72的動作速度的區分,因此能適當地判定動作速度的區分。此外,能因應判定結果以噴嘴前端狀態變成良好之方式調整吸回閥72的動作速度。 As described above, according to the substrate processing unit 1B, the operation speed of the suction valve 72 is determined based on the third image G3 (or the derivative image G13) reflecting the change in the nozzle tip state corresponding to the operation speed of the suction valve 72 Therefore, it is possible to appropriately determine the division of the movement speed. In addition, the operating speed of the suction valve 72 can be adjusted in accordance with the determination result such that the state of the nozzle tip becomes good.

(4-2)機械學習 (4-2) Mechanical learning

在上述例子中,判定部14係依據判定規則判定吸回閥72的動作速度的區分。然而,並未限定於此。例如,與開閉閥71的判定處理同樣地,判定部14亦可藉由機械學習判定吸回閥72的動作速度的區分。亦即,機械學習部18係使用照相機65拍攝了攝影對象區域50之原始影像G0中之噴嘴251的前端部的內部區域53的取樣影像(或者派生影像G10中的噴嘴251的前端部的內部區域53的取樣影像),預先進行機械學習並生成分類器。該分類器係例如被記錄至磁碟161。判定部14係將被照相機65拍攝的原始影像G0中的第三影像G3(或者派生影像G13)輸入至分類器,藉此使用該分類器判定吸回閥72的動作速度。 In the above example, the determination unit 14 determines the division of the operating speed of the suction valve 72 in accordance with the determination rule. However, it is not limited to this. For example, similarly to the determination process of the opening and closing valve 71, the determination unit 14 may determine the division of the operating speed of the suction valve 72 by mechanical learning. That is, the machine learning unit 18 uses the camera 65 to take a sample image of the internal region 53 of the tip of the nozzle 251 in the original image G0 of the photographic target region 50 (or the internal region of the tip of the nozzle 251 in the derivative image G10). 53 sampled images), mechanical learning is performed in advance and a classifier is generated. The classifier is recorded on the magnetic disk 161, for example. The determining unit 14 inputs the third image G3 (or the derivative image G13) of the original image G0 captured by the camera 65 to the classifier, and thereby uses the classifier to determine the movement speed of the suction valve 72.

藉此,由於藉由使用了反映有已與吸回閥72的動作速度相應之噴嘴前端狀態的變動之第三影像G3(或者派生影像G13)之學習判定動作速度的區分,因此判定的精度高。 In this way, since the third image G3 (or the derivative image G13) that reflects the change in the nozzle tip state corresponding to the operating speed of the suction valve 72 is used to determine the operation speed distinction, the accuracy of the determination is high. .

圖29係用以示意性地顯示作為基板處理裝置100的控制部130的其他實施形態的構成例的控制部130B之圖。 FIG. 29 is a diagram schematically showing a control unit 130B as a configuration example of another embodiment of the control unit 130 of the substrate processing apparatus 100.

如圖29所示,機械學習部18係設置於伺服器23,伺服器23係設置於基板處理裝置100的外部。機械學習部18所為之機械學習係以離線方式進行。此外,判定部14以及分類器K2亦設置於伺服器23。控制部130B係經由通 訊部21而與網路22連接,外部的伺服器23係與網路22連接。 As shown in FIG. 29, the machine learning unit 18 is installed in the server 23, and the server 23 is installed outside the substrate processing apparatus 100. The machine learning department performed by the machine learning section 18 is performed offline. In addition, the determination unit 14 and the classifier K2 are also provided in the server 23. The control unit 130B The communication unit 21 is connected to the network 22, and the external server 23 is connected to the network 22.

控制部130B的CPU11係經由通訊部21以及網路22而與設置於伺服器23之判定部14、機械學習部18以及分類器K2進行資訊的傳達。控制部130B係除了未具備有控制部130的機械學習部18、判定部14以及分類器K2之外,構成為與控制部130同樣。控制部130B係將拍攝部65所拍攝的影像經由通訊部21發送至伺服器23,並經由通訊部21接收伺服器23所為的運算結果(分類結果)。壓力設定部12係因應分類結果決定壓力指示值P1*。 The CPU 11 of the control unit 130B communicates information with the determination unit 14, the machine learning unit 18, and the classifier K2 provided in the server 23 via the communication unit 21 and the network 22. The control unit 130B is configured to be the same as the control unit 130 except that the machine learning unit 18, the determination unit 14 and the classifier K2 are not provided with the control unit 130. The control unit 130B sends the image captured by the imaging unit 65 to the server 23 via the communication unit 21, and receives the calculation result (classification result) performed by the server 23 via the communication unit 21. The pressure setting unit 12 determines the pressure indicating value P1* in accordance with the classification result.

藉此,由於在伺服器23設置有判定功能(判定部14以及分類器K2),因此能對複數個基板處理單元1B進行共通的匹配(判定)。此外,在圖29中,影像生成部17亦可設置於伺服器23。此外,圖29的態樣亦可應用於圖20的態樣。亦即,亦可將圖20的判定部14(或者影像生成部17)設置於伺服器23。 With this, since the server 23 is provided with a determination function (the determination unit 14 and the classifier K2), it is possible to perform matching (determination) common to a plurality of substrate processing units 1B. In addition, in FIG. 29, the image generating unit 17 may also be provided in the server 23. In addition, the aspect of FIG. 29 can also be applied to the aspect of FIG. 20. That is, the determination unit 14 (or the image generation unit 17) of FIG. 20 may be provided in the server 23.

在此情形中,能將包含有基板處理裝置100以及伺服器23之整體的裝置視為處理液噴出裝置。 In this case, an apparatus including the entire substrate processing apparatus 100 and the server 23 can be regarded as a processing liquid ejection apparatus.

此外,亦可以離線方式定期性地或者不定期性地更新機械學習部18。此外,亦可對已經過機械學習的機械學習部18進一步地追加取樣影像(教師資料)並進行線上學習且更新。再者,亦可經由網路22使用其他的CPU,並在取樣影像(教師資料)進行線上學習。 In addition, the machine learning unit 18 may be updated periodically or irregularly in an offline manner. In addition, it is also possible to further sample images (teacher data) for the machine learning unit 18 that has undergone machine learning, and perform online learning and update. Furthermore, other CPUs can also be used via the network 22, and online learning can be performed on sampled images (teacher data).

圖30係用以示意性地顯示作為基板處理裝置100的控制部130的其他實施形態的構成例的控制部130C之圖。如圖30所示,控制部130C係除了將分類器K2記憶至ROM162而非是將分類器K2記憶至磁碟161之外,構成為與控制部130同樣,且進行同樣的動作。如此,亦可將分類器K2儲存至ROM162。 FIG. 30 is a diagram schematically showing a control unit 130C as a configuration example of another embodiment of the control unit 130 of the substrate processing apparatus 100. As shown in FIG. 30, the control unit 130C is configured to be the same as the control unit 130, and performs the same operation except that the classifier K2 is stored in the ROM 162 instead of the classifier K2 in the magnetic disk 161. In this way, the classifier K2 can also be stored in the ROM162.

(5)閥的種類 (5) Types of valves

在第二實施形態中,亦可使用開閉閥71A、吸回閥72A以及驅動機構 74A、75A以取代開閉閥71、吸回閥72以及驅動機構74、75。 In the second embodiment, the on-off valve 71A, the suction valve 72A, and the drive mechanism can also be used 74A and 75A replace the on-off valve 71, the suction valve 72, and the drive mechanisms 74 and 75.

雖然已詳細地例示並說明處理液噴出方法以及處理液噴出裝置,但上述說明在全部的態樣中皆為例示性而非限定性。因此,處理液噴出方法以及處理液噴出裝置係可適當地將實施形態變化或者省略。 Although the processing liquid ejection method and the processing liquid ejection device have been illustrated and described in detail, the foregoing description is illustrative and not restrictive in all aspects. Therefore, the processing liquid ejection method and processing liquid ejection device can be changed or omitted as appropriate in the embodiment.

P1*‧‧‧壓力指示值(目標值) P1*‧‧‧Pressure indication value (target value)

P1[0]‧‧‧值 P1[0]‧‧‧Value

PL1、PH1‧‧‧基準值 PL1, PH1‧‧‧reference value

Pm1‧‧‧測量值 Pm1‧‧‧Measured value

t10至t13‧‧‧時間點 t10 to t13‧‧‧time point

T1‧‧‧前期間 Before T1‧‧‧

T2‧‧‧後期間 Period after T2‧‧‧

Ta1‧‧‧閥控制期間 Ta1‧‧‧Valve control period

Tb1‧‧‧非動作期間 Tb1‧‧‧Non-operation period

Tc1‧‧‧閉鎖期間 Tc1‧‧‧During lockout

Claims (18)

一種處理液噴出方法,係具備有:第一步驟,係從噴嘴噴出經由配管被供給至前述噴嘴的處理液;以及第二步驟,係在停止從前述噴嘴噴出處理液時,使設置於前述配管的至少一個閥的閥體的移動速度或者變形速度之動作速度在前述閥的動作期間中變化;前述動作期間係前述閥體開始移動直至停止為止的期間;前述至少一個閥係包含有:氣體作動閥,係切換前述配管內的流路的開閉,因應從驅動機構所供給的氣體的壓力進行開閉;當將關閉前述氣體作動閥時的前述動作速度定義成閉鎖速度時,在前述第二步驟中,以將前述動作期間內的第一期間中的前述閉鎖速度設定成比前述動作期間內的前述第一期間還後面的第二期間中的前述閉鎖速度還高之方式控制前述氣體作動閥,且使與前述氣體的壓力對應之指示值在前述動作期間中階段性地更新,並依據前述指示值控制前述驅動機構,且在前述動作期間中使前述氣體作動閥的前述閉鎖速度變化。 A method of discharging a processing liquid includes: a first step of discharging from a nozzle the processing liquid supplied to the nozzle via a pipe; and a second step of discharging the processing liquid from the nozzle when stopping the treatment liquid from the nozzle and setting it in the pipe The movement speed or deformation speed of the valve body of at least one valve changes during the operation period of the valve; the operation period is the period during which the valve body starts to move until it stops; the at least one valve system includes: gas actuation The valve switches the opening and closing of the flow path in the piping and opens and closes in response to the pressure of the gas supplied from the driving mechanism; when the operating speed when the gas actuated valve is closed is defined as the closing speed, in the second step , Controlling the gas actuated valve so that the closing speed in the first period in the operation period is set to be higher than the closing speed in the second period after the first period in the operation period, and The instruction value corresponding to the pressure of the gas is updated stepwise during the operation period, the drive mechanism is controlled based on the instruction value, and the closing speed of the gas actuated valve is changed during the operation period. 如請求項1所記載之處理液噴出方法,其中前述氣體係經由氣體供給配管供給至前述氣體作動閥;藉由壓力感測器測量前述氣體供給配管內的壓力;在前述第二步驟中,因應前述壓力感測器所測量的測量值使與前述氣體的壓力對應之前述指示值在前述動作期間中階段性地更新。 The processing liquid ejection method described in claim 1, wherein the gas system is supplied to the gas actuating valve via a gas supply pipe; the pressure in the gas supply pipe is measured by a pressure sensor; and in the second step, The measurement value measured by the pressure sensor causes the indicator value corresponding to the pressure of the gas to be updated step by step during the operation period. 如請求項1或2所記載之處理液噴出方法,其中前述第二期間中 的前述指示值的更新次數係比前述第一期間中的更新次數還多。 The processing liquid ejection method described in claim 1 or 2, wherein during the aforementioned second period The number of updates of the aforementioned indicator value is more than the number of updates in the aforementioned first period. 如請求項2所記載之處理液噴出方法,其中在前述第二步驟中,針對前述指示值與前述測量值之間的差進行比例控制、比例積分控制或者比例積分微分控制並控制前述驅動機構,藉此控制前述動作速度。 The processing liquid ejection method described in claim 2, wherein in the second step, proportional control, proportional integral control, or proportional integral derivative control is performed for the difference between the indicated value and the measured value and the drive mechanism is controlled, In this way, the aforementioned motion speed is controlled. 如請求項1或2所記載之處理液噴出方法,其中前述至少一個閥係包含有:吸回閥,係在停止噴出處理液時吸回前述噴嘴內的處理液。 The processing liquid ejection method according to claim 1 or 2, wherein the at least one valve includes a suction valve that sucks the processing liquid back into the nozzle when the ejection of the processing liquid is stopped. 如請求項1或2所記載之處理液噴出方法,其中在前述第二步驟中,以直至前述氣體作動閥的前述閥體開始移動或者開始變形為止的非動作期間中的前述氣體的壓力的變化速度變成比前述動作期間中的前述氣體的壓力的變化速度還高之方式控制前述驅動機構。 The process liquid ejection method according to claim 1 or 2, wherein in the second step, the pressure of the gas changes during the non-operation period until the valve body of the gas actuated valve starts to move or start to deform The driving mechanism is controlled so that the speed becomes higher than the change speed of the pressure of the gas during the operation period. 如請求項1或2所記載之處理液噴出方法,其中具備有:第三步驟,係在停止從前述噴嘴噴出處理液時,拍攝部從與前述噴嘴的噴出方向不同的方向拍攝前述噴嘴的前端部的流路;以及第四步驟,係依據在前述第三步驟中前述拍攝部所拍攝的原始影像進行預定的判定處理,藉此判定前述至少一個閥的前述動作速度是否適當。 The processing liquid ejection method described in claim 1 or 2, which includes: a third step of photographing the tip of the nozzle from a direction different from the ejection direction of the nozzle when the ejection of the processing liquid from the nozzle is stopped. The flow path of the part; and the fourth step are to perform a predetermined determination process based on the original image captured by the imaging part in the third step, thereby determining whether the operating speed of the at least one valve is appropriate. 如請求項7所記載之處理液噴出方法,其中前述至少一個閥係包含有:開閉閥,係切換前述配管內的流路的開閉;當將關閉前述開閉閥時的前述動作速度定義為閉鎖速度時,前述第四步驟係具備有下述步驟:針對前述原始影像中之與前述噴嘴的前端部的流路對應之第一影像區域的第一影像以及與從前述噴嘴的前端沿著處理液的噴出 方向朝前方延伸之前述處理液的噴出路徑對應之第二影像區域的第二影像各者的影像,算出已與前述第一影像以及前述第二影像各者的影像中的前述處理液的影像的面積相應之預定的第一特徵量;以及將預定的第一判定規則應用於前述第一影像的前述第一特徵量與前述第二影像的前述第一特徵量,藉此判定前述閉鎖速度為以下何種區分:前述閉鎖速度為適當、或者是前述閉鎖速度為比適當的速度還高、或者是前述閉鎖速度為比適當的速度還低。 The processing liquid ejection method according to claim 7, wherein the at least one valve system includes: an opening and closing valve that switches the opening and closing of the flow path in the piping; when the opening and closing valve is closed, the operating speed when the opening and closing valve is closed is defined as the closing speed When the fourth step includes the following steps: the first image in the first image area corresponding to the flow path of the tip of the nozzle in the original image and the flow path along the processing liquid from the tip of the nozzle Squirting For each image of the second image in the second image area corresponding to the ejection path of the processing liquid extending in the forward direction, calculate the difference between the image of the processing liquid in the image of each of the first image and the second image A predetermined first characteristic amount corresponding to the area; and applying a predetermined first determination rule to the first characteristic amount of the first image and the first characteristic amount of the second image, thereby determining that the locking speed is below What kind of distinction: Is the aforementioned locking speed appropriate, or the aforementioned locking speed higher than the appropriate speed, or the aforementioned locking speed lower than the appropriate speed. 如請求項8所記載之處理液噴出方法,其中前述第一判定規則係下述規則:當前述噴嘴的前端部的流路非為液密狀態時,判定成前述開閉閥的前述閉鎖速度比前述適當的速度還高;當前述噴嘴的前端部的流路為液密狀態且於前述噴出路徑存在有前述處理液時,判定成前述閉鎖速度比前述適當的速度還低。 The processing liquid ejection method described in claim 8, wherein the first determination rule is the following rule: when the flow path at the tip of the nozzle is not in a liquid-tight state, it is determined that the closing speed of the on-off valve is higher than the foregoing The appropriate speed is also high; when the flow path at the tip of the nozzle is in a liquid-tight state and the processing liquid exists in the ejection path, it is determined that the blocking speed is lower than the appropriate speed. 如請求項7所記載之處理液噴出方法,其中前述至少一個閥係包含有:開閉閥,係切換前述配管內的流路的開閉;當將關閉前述開閉閥時的前述動作速度定義為閉鎖速度時,在前述第四步驟中,依據前述原始影像中之前述噴嘴的前端部的流路以及從前述噴嘴的前端沿著處理液的噴出方向朝前方延伸之前述處理液的噴出路徑的影像,藉由分類器判定前述閉鎖速度的區分,前述分類器係判定前述閉鎖速度為以下何種區分:前述閉鎖速度為適當、或者是前述閉鎖速度為比適當的速度還高、或者是前述閉鎖速度為比適當的速度還低;前述分類器係使用前述原始影像中之前述噴嘴的前端部的流路以及前述噴出路徑的影像的取樣影像並預先藉由機械學習而生成。 The processing liquid ejection method according to claim 7, wherein the at least one valve system includes: an opening and closing valve that switches the opening and closing of the flow path in the piping; when the opening and closing valve is closed, the operating speed when the opening and closing valve is closed is defined as the closing speed In the fourth step, based on the flow path of the tip of the nozzle in the original image and the image of the ejection path of the processing liquid extending forward from the tip of the nozzle along the ejection direction of the processing liquid, borrow The classifier determines the distinction of the aforementioned locking speed. The aforementioned classifier determines the aforementioned locking speed which is the following distinction: the aforementioned locking speed is appropriate, or the aforementioned locking speed is higher than the appropriate speed, or the aforementioned locking speed is greater than The appropriate speed is also low; the classifier is generated by mechanical learning in advance using the flow path of the nozzle tip and the sampling image of the ejection path in the original image. 如請求項10所記載之處理液噴出方法,其中在前述第四步驟中,依據前述原始影像中之與前述噴嘴的前端部的流路對應之第一影像區域的第一影像以及與前述噴出路徑對應之第二影像區域的第二影像各者的影像判定前述開閉閥的前述閉鎖速度的前述區分;前述分類器係使用前述第一影像與前述第二影像各者的取樣影像並預先藉由機械學習而生成。 The processing liquid ejection method described in claim 10, wherein in the fourth step, the first image in the first image area corresponding to the flow path of the tip of the nozzle in the original image and the ejection path The images of each of the second images corresponding to the second image area determine the distinction of the locking speed of the opening and closing valve; the classifier uses the sampled images of each of the first image and the second image and is pre-machined Generated by learning. 如請求項8所記載之處理液噴出方法,其中前述處理液的噴出方向的下游側中的前述第一影像區域的端部係從前述噴嘴的前端離開至前述處理液的噴出方向的上游側。 The processing liquid ejection method according to claim 8, wherein the end of the first image area in the downstream side of the ejection direction of the processing liquid is separated from the tip of the nozzle to the upstream side of the ejection direction of the processing liquid. 如請求項7所記載之處理液噴出方法,其中前述至少一個閥係包含有:吸回閥,係在停止噴出處理液時吸回前述噴嘴內的處理液,使前述處理液的端面位置從前述噴嘴的前端遠離;前述第四步驟係具備有下述步驟:針對前述原始影像中之與前述處理液的前述端面位置與前述噴嘴的前端之間的流路的至少一部分對應之第三影像區域的第三影像,算出已與前述處理液的影像的面積相應之預定的第二特徵量;以及將預定的第二判定規則應用於前述第三影像的前述第二特徵量,藉此判定前述吸回閥的前述動作速度為以下何種區分:前述吸回閥的前述動作速度為適當、或者是前述吸回閥的前述動作速度為比適當的速度還高。 The processing liquid ejection method described in claim 7, wherein the at least one valve system includes: a suction valve that sucks the processing liquid in the nozzle back when the processing liquid is stopped, so that the end face position of the processing liquid is changed from the foregoing The tip of the nozzle is far away; the fourth step includes the following step: for the third image area corresponding to at least a part of the flow path between the end face position of the processing liquid and the tip of the nozzle in the original image For the third image, a predetermined second characteristic amount corresponding to the area of the image of the treatment liquid is calculated; and a predetermined second determination rule is applied to the second characteristic amount of the third image, thereby determining the suction The aforementioned operating speed of the valve is classified as follows: the aforementioned operating speed of the suction valve is appropriate, or the aforementioned operating speed of the aforementioned suction valve is higher than the appropriate speed. 如請求項13所記載之處理液噴出方法,其中前述第二判定規則係於前述處理液的前述端面位置與前述噴嘴的前端之間的流路的至少一部分殘存有處理液時,判定成前述吸回閥的前述動作速度比前 述適當的速度還高。 The processing liquid ejection method described in claim 13, wherein the second determination rule is that when the processing liquid remains in at least a part of the flow path between the end face position of the processing liquid and the tip of the nozzle, it is determined that the suction The aforementioned movement speed of the return valve is faster than before The appropriate speed is still high. 如請求項7所記載之處理液噴出方法,其中前述至少一個閥係包含有:吸回閥,係在停止噴出處理液時吸回前述噴嘴內的處理液,使前述處理液的端面位置從前述噴嘴的前端遠離;在前述第四步驟中,依據前述原始影像中之與前述處理液的前述端面位置與前述噴嘴的前端之間的流路的至少一部分對應之第三影像區域的第三影像,藉由分類器判定前述吸回閥的動作速度的區分,前述分類器係判定前述吸回閥的動作速度為以下何種區分:前述吸回閥的動作速度為適當、或者是前述吸回閥的動作速度為比適當的速度還高;前述分類器係使用前述第三影像的取樣影像並預先藉由機械學習而生成。 The processing liquid ejection method described in claim 7, wherein the at least one valve system includes: a suction valve that sucks the processing liquid in the nozzle back when the processing liquid is stopped, so that the end face position of the processing liquid is changed from the foregoing The tip of the nozzle is far away; in the fourth step, based on the third image in the third image area corresponding to at least a part of the flow path between the end face position of the processing liquid and the tip of the nozzle in the original image, The classifier determines the operating speed of the suction valve, and the classifier determines which of the following is the operating speed of the suction valve: the operating speed of the suction valve is appropriate or the speed of the suction valve is The action speed is higher than the appropriate speed; the aforementioned classifier is generated by using the sampled image of the aforementioned third image and pre-generated by mechanical learning. 如請求項7所記載之處理液噴出方法,其中在前述第三步驟中,停止從前述噴嘴噴出處理液後,前述拍攝部係時間性地依序拍攝前述噴嘴的前端部的流路;前述第四步驟係具備有下述步驟:將前述拍攝部所拍攝的複數個原始影像予以平均或者積算並生成派生影像;以及依據前述派生影像判定前述至少一個閥的前述動作速度是否適當。 The processing liquid ejection method according to claim 7, wherein in the third step, after the ejection of the processing liquid from the nozzle is stopped, the imaging unit sequentially photographs the flow path of the tip of the nozzle in time; The four-step system includes the following steps: averaging or accumulating a plurality of original images shot by the shooting unit to generate a derivative image; and determining whether the operating speed of the at least one valve is appropriate based on the derivative image. 如請求項7所記載之處理液噴出方法,其中進一步具備有:第五步驟,係依據在前述第四步驟中所判定的前述至少一個閥的前述動作速度是否適當,以前述動作速度變成前述適當的速度之方式調整前述第一步驟中的前述至少一個閥的動作。 The processing liquid ejection method described in claim 7, further comprising: a fifth step, which is based on whether the operating speed of the at least one valve determined in the fourth step is appropriate, and the operating speed becomes the appropriate The speed is adjusted to adjust the action of the at least one valve in the first step. 一種處理液噴出裝置,係具備有:噴嘴,係噴出處理液;配管,係連接前述噴嘴與處理液供給源,將來自前述處理液供給源的處理液導引至前述噴嘴;至少一個閥,係設置於前述配管;以及控制部,係在停止從前述噴嘴噴出處理液時,使前述至少一個閥的閥體的移動速度或者變形速度之動作速度在前述至少一個閥的動作期間中變化;前述動作期間係前述閥體開始移動直至停止為止的期間;前述至少一個閥係包含有:氣體作動閥,係切換前述配管內的流路的開閉,因應從驅動機構所供給的氣體的壓力進行開閉;當將關閉前述氣體作動閥時的前述動作速度定義成閉鎖速度時,前述控制部以將前述動作期間內的第一期間中的前述閉鎖速度設定成比前述動作期間內的前述第一期間還後面的第二期間中的前述閉鎖速度還高之方式控制前述氣體作動閥,且使與前述氣體的壓力對應之指示值在前述動作期間中階段性地更新,並依據前述指示值控制前述驅動機構,且在前述動作期間中使前述氣體作動閥的前述閉鎖速度變化。 A processing liquid ejection device is provided with: a nozzle for ejecting the processing liquid; a pipe connecting the nozzle and the processing liquid supply source to guide the processing liquid from the processing liquid supply source to the nozzle; at least one valve, Provided in the piping; and a control unit that changes the movement speed or the deformation speed of the valve body of the at least one valve during the operation period of the at least one valve when the treatment liquid is stopped from the nozzle; The period is the period when the valve body starts to move until it stops; the at least one valve system includes: a gas-actuated valve that switches the opening and closing of the flow path in the piping, and opens and closes in response to the pressure of the gas supplied from the drive mechanism; when When the operation speed when the gas operating valve is closed is defined as the lock speed, the control unit sets the lock speed in the first period of the operation period to be later than the first period in the operation period. In the second period, the gas actuated valve is controlled so that the lock speed is still high, and the indicator value corresponding to the pressure of the gas is updated step by step during the operation period, and the drive mechanism is controlled according to the indicator value, and During the operation period, the closing speed of the gas actuated valve is changed.
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