TWI724429B - 基板處理方法及基板處理裝置 - Google Patents

基板處理方法及基板處理裝置 Download PDF

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Publication number
TWI724429B
TWI724429B TW108118198A TW108118198A TWI724429B TW I724429 B TWI724429 B TW I724429B TW 108118198 A TW108118198 A TW 108118198A TW 108118198 A TW108118198 A TW 108118198A TW I724429 B TWI724429 B TW I724429B
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TW
Taiwan
Prior art keywords
clamping
substrate
unit
state
spin drying
Prior art date
Application number
TW108118198A
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English (en)
Chinese (zh)
Other versions
TW202004983A (zh
Inventor
遠藤亨
林昌之
柴山宣之
菅原雄二
東克栄
阿野誠士
Original Assignee
日商斯庫林集團股份有限公司
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Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202004983A publication Critical patent/TW202004983A/zh
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Publication of TWI724429B publication Critical patent/TWI724429B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW108118198A 2018-05-29 2019-05-27 基板處理方法及基板處理裝置 TWI724429B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018102558A JP7144193B2 (ja) 2018-05-29 2018-05-29 基板処理方法および基板処理装置
JP2018-102558 2018-05-29

Publications (2)

Publication Number Publication Date
TW202004983A TW202004983A (zh) 2020-01-16
TWI724429B true TWI724429B (zh) 2021-04-11

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ID=68698843

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108118198A TWI724429B (zh) 2018-05-29 2019-05-27 基板處理方法及基板處理裝置

Country Status (3)

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JP (1) JP7144193B2 (ja)
TW (1) TWI724429B (ja)
WO (1) WO2019230564A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7508296B2 (ja) 2020-07-14 2024-07-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7391450B2 (ja) * 2021-03-30 2023-12-05 ▲騰▼▲訊▼科技（深▲セン▼）有限公司 フォトレジスト除去方法及びフォトレジスト除去システム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09107023A (ja) * 1995-10-13 1997-04-22 Toshiba Microelectron Corp 被処理物の回転保持装置
JP2015084450A (ja) * 2015-01-08 2015-04-30 東京エレクトロン株式会社 基板処理装置、基板処理方法及びその基板処理方法を実行させるためのプログラムを記録した記憶媒体
JP2018046062A (ja) * 2016-09-12 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09107023A (ja) * 1995-10-13 1997-04-22 Toshiba Microelectron Corp 被処理物の回転保持装置
JP2015084450A (ja) * 2015-01-08 2015-04-30 東京エレクトロン株式会社 基板処理装置、基板処理方法及びその基板処理方法を実行させるためのプログラムを記録した記憶媒体
JP2018046062A (ja) * 2016-09-12 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
JP2019207948A (ja) 2019-12-05
TW202004983A (zh) 2020-01-16
WO2019230564A1 (ja) 2019-12-05
JP7144193B2 (ja) 2022-09-29

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